Housing element for electronic components and arrangement

Abstract

Housing element (1) for electronic components, comprising - a first structural part (2) formed from a first metal plate having a first main surface (15) and a second main surface (7), wherein the metal plate is shaped to cover electronic components (13) arranged on a substrate (14) and is folded around the components (13) to shield them from neighboring components (13); - a second structural part (3) formed from a second metal plate with a first main surface (16) and a second main surface (8), wherein the metal plate is also shaped to cover electronic components (13) arranged on the substrate (14) and is folded around the components (13) to shield them from neighboring components (13); - wherein the first structural part (2) and the second structural part (3) are aligned parallel and fluid-tightly connected at their edges (5) so that a fluid channel (12) for a coolant is formed between the second main surface (7) of the first structural part (2) and the first main surface (16) of the second structural part (3).

Description

[0001] The present invention relates to a housing element for electronic components arranged on at least one substrate. It further relates to an arrangement comprising a number of electronic components arranged on at least one substrate and the housing element.

[0002] German patent application DE 10 2020 111 085 A1 discloses a device for temperature control and EMC protection of a circuit arrangement. The device comprises an EMC protection film configured to enclose the circuit arrangement in a fluid-tight manner and to provide EMC protection for the circuit arrangement. Furthermore, the device comprises a housing configured to enclose the circuit arrangement covered by the EMC protection film and to allow the circuit arrangement to be cooled by a temperature control medium.

[0003] Documents US 2007 / 0 096 278 A1 and DE 603 ​​09 150 T2 reveal further disclosures of housing elements for electronic components.

[0004] Semiconductor modules, which incorporate a number of power semiconductor devices and other electronic components, traditionally face a trade-off between power electronics design, cooling, and electromagnetic interference (EMI) shielding. Manufacturers choose either to design the power electronics architecture based on available cooling areas or to add cooling areas to house hot components. This typically results in either a complex cooling circuit or a fragmented electronic circuit. EMI shielding and structural load support are further challenges in such designs.

[0005] Therefore, one object of the present invention is to provide a housing element for electronic components, such as power semiconductor modules, which solves the above-mentioned problems regarding cooling and shielding against electromagnetic interference while allowing a maximum degree of design freedom.

[0006] This problem is solved according to the independent claim. Advantageous embodiments and further developments are the subject of the dependent claims.

[0007] According to one aspect of the invention, a housing element for electronic components is provided, comprising a first structural part formed from a first metal plate having a first main surface and a second main surface, wherein the metal plate is shaped to cover electronic components arranged on a substrate and is folded (formed) around the components to shield them from adjacent components. The housing element further comprises a second structural part formed from a second metal plate having a first main surface and a second main surface, wherein the metal plate is also shaped to cover electronic components arranged on the substrate and is folded around the components to shield them from adjacent components.

[0008] Furthermore, in the housing element, the first structural part and the second structural part are aligned parallel and fluid-tightly connected at their edges, so that a fluid channel for a coolant is formed between the second main surface of the first structural part and the first main surface of the second structural part.

[0009] According to the invention, the two structural parts are identically designed so that they can be arranged parallel to each other, forming a space between them that can be used as a fluid channel for a coolant. The structural parts are formed from metal plates to ensure effective heat transfer from hot components to the coolant. Furthermore, the metal plates forming the structural parts are shaped so that they fold around electronic components. Thus, in these parts, the two metal plates are nested within each other so that they fold together around the electronic components.

[0010] The structural components are thus shaped to provide multiple compartments that are shielded from one another and receive effective cooling, so that components located in one compartment are effectively cooled by the very close cooling channel and are simultaneously shielded against electromagnetic interference from components in adjacent compartments. Furthermore, the housing element features structural components that are self-supporting and do not require any supporting elements.

[0011] The housing element has the advantage that it can be manufactured cheaply from metal plates to provide both cooling and shielding against electromagnetic interference for electronic components, especially power semiconductor modules.

[0012] According to one embodiment, the first structural part is designed to shield the electronic components from electromagnetic radiation from neighboring components when folded around. According to another embodiment, the second structural part is designed to shield the electronic components from electromagnetic radiation from neighboring components when folded around.

[0013] According to one embodiment, the first structural part and the second structural part are formed by stamping metal sheets. Alternatively, they can be formed by deep drawing metal sheets.

[0014] These manufacturing methods enable the provision of custom-made structural components at affordable costs.

[0015] The first and second structural parts can be joined at their edges by crimping, clinching, or a welding method, such as stud friction welding. A gasket or sealant can be placed between the edges of the first and second structural parts.

[0016] This has the advantage that a fluid-tight channel for a coolant can be formed cost-effectively between the first structural part and the second structural part.

[0017] According to one embodiment, the housing element further comprises an inlet and an outlet for a liquid coolant. The inlet and outlet are in flow communication with the fluid channel formed between the first and second structural parts. For maximum cooling performance, they can be arranged on two opposite sides of the housing element.

[0018] According to a further aspect of the invention, an arrangement is provided comprising a number of electronic components arranged on at least one substrate and the housing element as described above. The housing element covers the electronic components, such that the electronic components are arranged between the substrate and the housing element, with at least one region of the housing element being arranged between adjacent electronic components.

[0019] Thus, the enclosure element provides spaces that are cooled at their spatial boundaries and shielded against electromagnetic interference. The electronic components are arranged individually or in groups within these spaces. In particular, groups of hot components can be arranged in specific spaces, while noisy components can be located in separate spaces.

[0020] The arrangement therefore has the advantage of an effective cooling system that also provides shielding against electromagnetic interference and has low space requirements.

[0021] According to one embodiment, the arrangement has at least one further substrate that is arranged parallel to the at least one substrate, thereby forming a mounting space between the two substrates. Such an arrangement can be chosen when a large number of electronic components need to be mounted in a limited space.

[0022] Electronic components are mounted on at least one substrate and on at least one other substrate and arranged within the mounting space. The housing element is positioned within the mounting space between the components mounted on the at least one substrate and on the at least one other substrate.

[0023] According to this embodiment, electronic components are arranged on both sides of the housing element. This has the advantage that effective cooling and shielding against electromagnetic interference can be provided even when the assembly has a large number of electronic components arranged in a limited space. Thus, effective cooling and shielding against electromagnetic interference can be provided for very compact arrangements.

[0024] The arrangement can, in particular, be an on-board charging device of an electrically powered vehicle.

[0025] Embodiments of the invention are described with reference to schematic drawings. Fig. Figure 1 shows an expanded view of a housing element according to an embodiment of the invention, Fig. Figure 2 shows a perspective view of the housing element according to Fig. 1, Fig. Figure 3 shows an arrangement according to an embodiment of the invention with a housing element according to Fig. 1 and Fig. 2 and Fig. Figure 4 shows an arrangement according to a further embodiment of the invention.

[0026] Fig. Figure 1 shows an exploded view of a housing element 1 according to an embodiment of the invention. The housing element 1 has a first structural part 3 and a second structural part 3. The structural parts 2, 3 are formed from metal plates, which were shaped, for example, by deep drawing or stamping to provide spaces 4 for accommodating electronic components on a substrate. The structural parts 2, 3 have a first main surface, which is Fig. 1 is not visible, and a second main area 7, 8 appears.

[0027] Structural parts 2 and 3 are similarly shaped so that they fit together to form a housing element 1. To form the housing element 1, the first structural part 3 and the second structural part 3 are nested inside each other, such that the second main surface 7 of the first structural part 2 is adjacent to the first main surface of the second structural part 3, leaving only a small space between the second main surface 7 of the first structural part 2 and the first main surface of the second structural part 3.

[0028] The structural parts 2 and 3 can then be joined together at their edges 5. The dashed line 6 indicates a sealing contour where the housing element 1 is fluid-tightly sealed at its edges 5.

[0029] Fig. Figure 2 shows the housing element 1 in a perspective view. A fluid channel for a coolant is formed between the structural parts 2 and 3, which is Fig. 2 is not visible. The housing element 1 has an inlet 9 and an outlet 10 for a coolant that flows through the fluid channel between the first structural part 2 and the second structural part 3.

[0030] Fig. Figure 3 shows a sectional view of the housing element 1 along the plane AA of Fig. 2.

[0031] This view shows the first structural part 2 with its first main surface 15 and its second main surface 7 and the second structural part 3 with its first main surface 16 and its second main surface 8 nested inside each other to form the housing element 1 with a fluid channel 12 between the second main surface 7 of the first structural part 3 and the first main surface 16 of the second structural part 3.

[0032] The structural parts 2, 3 are joined at the edges 5, e.g., by welding, indentation, or clinching, with or without a gasket or sealant placed between the structural parts 2, 3. They have an inlet 9 and an outlet (in Fig. (3 not shown) of the fluid channel 12. A coolant is guided through the fluid channel 12 for electronic components as shown by arrows 11.

[0033] The housing element 1 is part of an arrangement 20 comprising a number of electronic components 13 mounted on a substrate 14 and the housing element 1.

[0034] The electronic components 13 are arranged individually or in groups on the substrate 14. A group may, in particular, include components that do not require shielding from each other, but do require shielding from adjacent components or groups. Each component or group is placed in a space 4 of the housing element 1. Areas 17 of the housing element 1 are positioned between adjacent groups of electronic components 13 and shield them from each other. The housing element 1 thus provides cooling, electromagnetic shielding, and enclosure simultaneously.

[0035] To achieve electromagnetic shielding and save available space, the housing element 1 is folded around the electronic components 13 to form the spaces 4. Thus, the volume of the spaces 4 is adapted to the volume of the electronic components 13 placed within them. Between groups of electronic components 13 and separate spaces 4, the housing element 1 extends to the substrate 14 to provide electromagnetic shielding.

[0036] Fig. Figure 4 shows an arrangement 20 according to a further embodiment of the invention. This embodiment differs from the one described in Figure 4. Fig. Figure 3 shows that it has a further substrate 21 which is arranged parallel to the substrate 14, wherein a mounting space 22 for electronic components 13 is formed between the substrates 14, 21.

[0037] Further electronic components 13 are attached to the additional substrate 21, so that the housing element 1 is also folded around these components 13, forming further spaces 4 which are shielded from adjacent spaces 4. Furthermore, the housing element 1 shields components 13 on substrate 14 from components 13 on the additional substrate 21, as it extends between them. Reference symbol list 1 housing element 2 first structural part 3 second structural part 4 rooms 5 Rand Line 6 7 second main area 8 second main area 9 Admission 10 Outlet 11 Arrow 12 Fluid channel 13 electronic components 14 Substrat 15 first main area 16 first main area Area 17 20 Arrangement 21 additional substrate 22 Mounting space

Claims

[1] Housing element (1) for electronic components, comprising - a first structural part (2) formed from a first metal plate having a first main surface (15) and a second main surface (7), wherein the metal plate is shaped to cover electronic components (13) arranged on a substrate (14) and is folded around the components (13) to shield them from neighboring components (13); - a second structural part (3) formed from a second metal plate with a first main surface (16) and a second main surface (8), wherein the metal plate is also shaped to cover electronic components (13) arranged on the substrate (14) and is folded around the components (13) to shield them from neighboring components (13); - wherein the first structural part (2) and the second structural part (3) are aligned parallel and fluid-tightly connected at their edges (5) so that a fluid channel (12) for a coolant is formed between the second main surface (7) of the first structural part (2) and the first main surface (16) of the second structural part (3). [2] Housing element (1) according to claim 1, wherein - the first structural part (2) is designed to shield the electronic components (13) from electromagnetic radiation from the neighboring components (13) by folding them around, and / or - the second structural part (3) is designed to shield the electronic components (13) by folding them around against electromagnetic radiation from the neighboring components (13). [3] Housing element (1) according to claim 1 or 2, wherein the first structural part (2) and the second structural part (3) are formed by stamping metal plates. [4] Housing element (1) according to claim 1 or 2, wherein the first structural part (2) and the second structural part (3) are formed by deep drawing of metal plates. [5] Housing element (1) according to any one of claims 1 to 4, wherein the first structural part (2) and the second structural part (3) are joined together at their edges (5) by crimping or clinching or welding. [6] Housing element (1) according to one of claims 1 to 5, wherein a seal is arranged between the edges (5) of the first structural part (2) and the second structural part (3). [7] Housing element (1) according to one of claims 1 to 5, wherein a sealing agent is arranged between the edges (5) of the first structural part (2) and the second structural part (3). [8] Housing element (1) according to one of claims 1 to 7, further comprising an inlet (9) and an outlet (10) for a liquid coolant. [9] arrangement (20) having - a number of electronic components (13) arranged on at least one substrate (14), - a housing element (1) according to any one of claims 1 to 8, wherein the housing element (1) covers the electronic components (13) such that the electronic components (13) are arranged between the substrate (14) and the housing component (1), wherein at least one region (17) of the housing element (1) is arranged between adjacent electronic components (13). [10] Arrangement (20) according to claim 9, comprising at least one further substrate (21) arranged parallel to the at least one substrate (14) such that a mounting space (22) is formed between them, wherein electronic components (13) are attached to the at least one substrate (14) and to the at least one further substrate (21) and are arranged in the mounting space (22), wherein the housing element (1) is arranged in the mounting space (22) between the components (13) attached to the at least one substrate (14) and to the at least one further substrate (21). [11] Arrangement (20) according to claim 10, wherein the arrangement is an on-board charging device of an electrically powered vehicle.

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