Communication between independent, monolithically integrated circuits

Abstract

The invention relates to a semiconductor device (10) comprising a monolithic semiconductor substrate (14) on which a first integrated circuit (12) and a separately implemented second integrated circuit (16) are arranged. Furthermore, a first communication interface (18) is provided as part of the first integrated circuit (12), and a second communication interface (20) is provided as part of the second integrated circuit (16). In addition, the semiconductor device (10) has a connecting line (22) arranged at least partially outside the monolithic semiconductor substrate (14), by means of which the first communication interface (18) and the second communication interface (20) are connected for the purpose of data transmission.

Description

The invention relates to a semiconductor device and a method for transferring data between two independent integrated circuits arranged separately on a monolithic semiconductor substrate.In the case of single-chip systems, a plurality of independent functional units are usually provided in the form of monolithically integrated but separate circuits on a monolithic semiconductor substrate. The functional units can be embodied, for example, as simple logic functions, as sensors, as memories or as data processing devices. A great advantage of single-chip systems is therefore that a plurality of functions can be integrated on the same semiconductor substrate. In the preferred application, a plurality of data processing devices independent of one another can be integrated on the same semiconductor substrate. In the case of a plurality of independent data processing devices, in the event of a fault in one of the plurality of data processing devices, other ones of the plurality of data processing devices can continue to be operated without reaction. Such system-on-chip systems may be used, among other things, to control processes for which high safety requirements regarding fail-safe and / or operational reliability exist. In particular for such applications, communication between the independent functional units is also required. As a rule, the mentioned communication takes place from a transmitter to one or more receivers. In this way, for example, deviations in instruction execution can be detected by different, independent data processing devices. This makes it possible to distribute different inputs and tasks on different data processing devices and / or to compare outputs and to derive (vote) a common response therefrom. When establishing a communication connection, in particular in safety-critical applications, there is a particular challenge in ensuring independence of the functional units of the system-on-chip during communication between these functional units. Up to now, communication connections between independent functional units have been integrated on the monolithic semiconductor substrate. This created a physical connection between the independent functional units, by means of which mutual physical influence was promoted. It has therefore not been possible to achieve the highest safety requirements up to now. For this purpose, a layout for a physical communication interface frequently had to be designed and implemented specifically. Compared to commercially available layouts for communication interfaces, which are also referred to as standard I-O cells, a high outlay and high costs are therefore incurred. In addition, a voltage resistance, a short circuit resistance and a load capacity of specifically designed communication interfaces are usually weaker compared to commercially available standard I-O cells. In addition, safety-relevant requirements, such as requirements for independence or reliability of the functional units, must generally be checked in each individual layout in the case of the specifically designed communication interfaces. Furthermore, the integrated communication interfaces have usually been connected to one another by means of metal lines integrated on the monolithic semiconductor substrate for the purpose of data transmission. In order to keep heat conduction and possible fault currents or overvoltage between the actually independent functional units as low as possible, frequently selected metallization layers and a special line guide were selected. Moreover, additional distances and / or devices were required for the purpose of thermal and / or electrical decoupling between the independent functional units. For the highest safety requirements, such as a safety requirement level 4 in the sense of one of the standards EN 50129, IEC 61508 or IEC 61511, for example, it has not been possible to achieve this up to now.The object of the invention is to provide an improved semiconductor device which is designed in particular as a system on chip.This object is achieved by a semiconductor device having the features of claim 1.It is a further object of the invention to provide an improved method for transferring data between two independent integrated circuits arranged separately on a monolithic semiconductor substrate.This object is achieved by a method having the features of the subordinate method claim.Advantageous refinements are the subject matter of dependent dependent claims in each case.The semiconductor device according to the invention has a monolithic semiconductor substrate on which a first integrated circuit and a second integrated circuit embodied separately therefrom are arranged. Preferably, the first integrated circuit and the second integrated circuit are designed independently in the sense of the standard EN 50129, IEC 61508 or IEC 61511. Furthermore, the semiconductor device according to the invention has a first communication interface and a second communication interface. In the present context, a communication interface is a physical interface which is assigned to layer 1 in accordance with the OSI standard model. The first communication interface is part of the first integrated circuit. The second communication interface is part of the second integrated circuit. Furthermore, according to the invention, a connecting line arranged at least in sections outside the monolithic semiconductor substrate is provided. In particular, this connection line arranged outside is arranged inside a package of a chip. The first communication interface and the second communication interface are connected to one another for the purpose of data transmission by means of the connecting line. This makes it possible to dispense with an integrated connecting line. A risk of a transfer of potentially damaging thermal or electrical energy between two integrated circuits can thereby be reduced. This makes it possible to achieve high safety requirements, such as a safety requirement level SIL 4 in the sense of one of the standards EN 50129, IEC 61508 or IEC 61511. Independence of the two integrated circuits can be maintained despite a communication connection.Preferably, the semiconductor device is implemented as a system on chip. The system on a chip is also known as a system-on-a-chip. Expediently, the first integrated circuit and the second integrated circuit are each part of a single-chip system.An advantageous refinement provides that the first communication interface and / or the second communication interface are designed as prefabricated standard I-O cells. A standard I-O cell is to be understood in connection with the present invention as meaning prefabricated and / or prefabricated sections of an integrated circuit in the sense of microelectronics. These standard I-O cells are a multiply usable, prefabricated layout which can be selected from a standard library according to predetermined functions and / or properties. In this way, a separate chip design can be produced cost-effectively and efficiently.Using standard I - O cells, communication interfaces may be selected as needed according to a predetermined voltage strength, short circuit strength, load capacity, and / or robustness. A complicated construction of its own layout for communication interfaces can thereby be avoided. Individual checking of separately developed layouts and integrated connecting lines can be dispensed with. In contrast, standard I-O cells can be selected and used at low cost. In addition, communication interfaces of different types can be combined, which are each supplied with a separate voltage source, for example.A further advantageous refinement provides that the connecting line has an electrical resistor for the purpose of power limiting. Advantageously, an electrical power that can be transmitted by means of the connecting line is limited by means of the electrical resistor. This makes it possible to reduce a risk of transmitting a fault current and / or an overvoltage. Damage to independent integrated circuits due to electrical power transmitted by means of the connection can therefore be effectively counteracted. In addition, in the event of an overvoltage, an excessive potential falls across the resistor. As a result, the voltage in a functional unit to be protected can remain limited.Furthermore, an advantageous refinement provides that the connecting line is arranged within a housing of the semiconductor device. Expediently, the semiconductor device is protected by means of the housing against external influences, such as moisture, UV radiation and / or dirt. Moreover, due to a short line length, electromagnetic interference from an environment can be minimized. In addition, metal shielding screens may be provided to reduce electromagnetic interference. Often, such packages are formed of a resin and / or a plastic which is molded around the semiconductor device. Moreover, distances between independent integrated circuits can be kept small. Furthermore, it is thereby possible to prevent integrated barriers, which separate independent integrated circuits from one another, from being broken through by the connecting line. This makes it possible to obtain a barrier with a high protective effect against overvoltage and / or thermal influences.The connecting line is preferably designed as a wire. This allows reliable communication between independent functional units to be realized. In addition, high data transmission rates can be achieved.Preferably, a metal is provided as material for the connecting line, such as copper, aluminum or gold. The wire itself can be designed, for example, as the aforementioned resistor. Furthermore, the wire can be embodied as a fuse, for example as a fusible wire. A design and selection of predetermined metallization layers and a special integrated line guide can be dispensed with. Instead, a connection line that is easy to handle can be used for the purpose of data transmission.In an advantageous embodiment variant, the first communication interface and the second communication interface are embodied in different ways. In this way, reliability can be increased. For example, failures due to a common cause can be avoided. This makes it possible to provide failure behavior of a first communication interface statistically independently of failure behavior of a second communication interface.In an advantageous alternative embodiment variant, it is provided that a part of the first communication interface provided for the purpose of transmitting data and a part of the second communication interface provided for the purpose of transmitting data are designed identically in a first manner. Alternatively or additionally, it is provided that a part of the first communication interface provided for the purpose of receiving data and a part of the second communication interface provided for the purpose of receiving data are designed identically in a second manner different from the first manner. In an alternative manner, a failure detection of the communication connection, for example in combination with a coding of the data or associated communication interfaces, can thereby be increased. Failures due to a common cause are thereby avoidable. Furthermore, a statistically independent failure behavior of the first communication interface and of the second communication interface can be achieved in an alternative manner.In a further advantageous refinement, it is provided that the first integrated circuit and the second integrated circuit are separated from one another by means of a barrier. In particular, the barrier is configured to physically separate the said integrated circuits from one another. Expediently, a section of the monolithic semiconductor substrate which has doped regions of the first integrated circuit is separated from a further section of the monolithic semiconductor substrate which has doped regions of the second integrated circuit by means of the barrier. The barrier between the doped regions of the first integrated circuit and the doped regions of the second integrated circuit preferably extends down to the monolithic, in particular undoped, semiconductor substrate. As a result, the two integrated circuits separated from one another can be shielded from one another thermally and / or electrically. Operating reliability and reliability of the semiconductor device, in particular of the system on a chip, can be increased in a cost-effective manner in this way.Furthermore, an advantageous development provides that the monolithic semiconductor substrate is free of an integrated connecting line for the purpose of communication between the first integrated circuit and the second integrated circuit. Safety distances between independent integrated circuits can thereby be kept small. Furthermore, in this way, a compact arrangement of a plurality of independent integrated circuits on the monolithic semiconductor substrate is possible. Moreover, a thermal and / or electrical risk emanating from an adjacent integrated circuit can be kept small.Preferably, the first integrated circuit and / or the second integrated circuit each comprise a data processing device. This makes it possible to realize a fail-safe control system based on a system-on-chip. High safety requirements can be met in a cost-effective and reliable manner. Single-chip systems with independent data processing devices can furthermore be provided at low cost and cost.The data processing device can be, for example, a microcontroller, a processor or another programmable hardware component. The data processing device is expediently configured to read in, receive, write, transmit and / or manage data. The data processing device is particularly preferably part of a computer having a storage device which is provided for storing and / or managing data.The invention further provides a method for transferring data between two independent integrated circuits separately arranged on a monolithic semiconductor substrate.The method according to the invention provides that data are transmitted at least in sections outside the monolithic semiconductor substrate. A connecting line integrated with the monolithic semiconductor substrate can thereby be dispensed with. Furthermore, it can be avoided that a barrier provided for the purpose of establishing independence of the two separately arranged integrated circuits is penetrated by the connecting line. Furthermore, a high level of safety requirement can be achieved in this way. A transmission of a harmful thermal and / or electrical energy by means of the connecting line can be counteracted. This enables high reliability and high operating reliability of the separately arranged integrated circuits. Furthermore, in particular a reliable and reliably operable single-chip system can be provided. Moreover, a communication connection between independent integrated circuits can be implemented in a cost-effective and cost-effective manner.An advantageous development of the method provides that the data are transmitted by means of a connecting line which runs within a housing surrounding the monolithic semiconductor substrate. The housing is in particular of the type described in the preceding context. Expediently, the semiconductor device is protected by means of the housing against external influences, such as moisture, UV radiation and / or dirt. Moreover, due to a short line length, electromagnetic interference from an environment can be minimized. In addition, metal shielding screens may be provided to reduce electromagnetic interference. This makes it possible to avoid corruption of data to be transmitted. This makes it possible to provide reliable and reliable communication.In a further advantageous development of the method, a reliability of a transmission of data is monitored by means of a computer-implemented algorithm, in particular by means of predetermined patterns. By way of example, the computer-implemented algorithm relates to a channel-saving coding method, a handshake method and / or a creation and a comparison of checksums. This enables rapid failure detection of a communication link. This makes it possible to make a substantial contribution to achieving a high safety requirement level.An advantageous embodiment variant provides that a memory shared by communication interfaces and / or a coded interface, by means of which the transmission of the data is realized, is monitored. The memory and the encoded interface are assigned to layer 2 in the present context according to the OSI standard model. For example, the shared memory may be subject to memory checking. In this way, failures in cross-channel connections can be determined in addition to memory errors. The monitoring of an encoded interface enables a rapid and reliable detection of this failure in the event of a failure of a communication interface or of a part of this communication interface. If it is determined during the monitoring of the encoded interface that an encoding does not correspond to a predetermined encoding, then a failure of a communication interface or a part thereof can be detected at low cost.The above-described characteristics, features and advantages of the invention and the manner in which these are achieved are explained in more detail in conjunction with the figures in the following description of the exemplary embodiment of the invention and its variations. Where appropriate, the same reference numerals are used in the figures to refer to the same or corresponding elements of the invention. The exemplary embodiment and its variations serve to explain the invention and do not restrict the invention to the combinations of features specified therein, nor with respect to functional features. In addition, all features indicated in the exemplary embodiment can be considered in isolation and combined in a suitable manner with the features of any claim. The figures described below are schematic drawings, not to scale.The following are shown: FIG. 1 shows an embodiment of a semiconductor device according to the invention; FIG. 2 shows an illustration of an example of a method according to the invention for transmitting data between two independent integrated circuits arranged separately on the exemplary embodiment of a semiconductor device described in more detail in connection with FIG. 1, on the basis of a schematic flow diagram.FIG. 1 shows a schematic illustration of an exemplary embodiment of a semiconductor device 10. On this semiconductor substrate 14, two independent integrated circuits 12, 16 are separately arranged.In the present exemplary embodiment, the two independent integrated circuits 12, 16 are physically separated from one another by means of a barrier 26. The barrier 26 expediently separates a section of the monolithic semiconductor substrate 14 with doped regions of a first integrated circuit 12 of the two integrated circuits 12, 16 from a further section of the monolithic semiconductor substrate 14 with doped regions of a second integrated circuit 16 of the two integrated circuits 12, 16. Silicon dioxide or an insulation material with comparable properties is provided as the material for the barrier 26. A reliable thermal barrier can thereby be achieved. Further, a barrier having high withstand voltage may be provided for the purpose of shielding from overvoltage.By way of example, the two integrated circuits 12, 16 are each provided for the purpose of controlling a process. For this purpose, the two integrated circuits 12, 16 in the exemplary embodiment described in the present case each have a data processing device 28 and a memory 30. Depending on the application, integrated sensors or other integrated logic circuits, not shown in more detail, can furthermore be provided.Furthermore, a first communication interface 18 is provided as part of the first integrated circuit 12. Furthermore, a second communication interface 20 is provided as part of the second integrated circuit 16. The first communication interface 18 and the second communication interface 20 are each configured to transmit data between the two independent integrated circuits 12, 16. For this purpose, a connecting line 22 is provided, which connects the first communication interface 18 to the second communication interface 20 for the purpose of data transmission. The connection line 22 is arranged outside the monolithic semiconductor substrate 14. In this manner, the monolithic semiconductor substrate 14 is free of an integrated interconnection line used for communication between the first integrated circuit 12 and the second integrated circuit 16. In the exemplary embodiment described here, the connecting line 22 is arranged in a housing 24. This housing 24 is provided to protect the semiconductor device 10 from external influences, such as moisture or UV radiation. Usually, the package is formed of 24 resin or resin, by which the semiconductor device 10 is completely molded. Preferably, the connecting line 22 is embodied as a wire made of metal, such as aluminum, gold or copper. This allows a reliable data transmission connection with high data transmission rates to be provided.In a preferred embodiment variant, the first communication interface 18 and the second communication interface 20 are each designed as a prefabricated standard I-O cell. In this way, robust communication interfaces 18, 20 can be selected from standard libraries of a chip manufacturer. As a result, a layout for a system on chip can be designed and realized cost-effectively and efficiently. Furthermore, a predetermined voltage resistance, short circuit resistance, load capacity and / or robustness of the communication interfaces 18, 20 can thereby be selected as required.In a further preferred embodiment variant, the first communication interface 18 has a layout which is designed to be diversified with respect to a layout of the second communication interface 20. This can relate to the layout of one of the communication interfaces 18, 20 itself and / or the layout of a binding of one of the communication interfaces 18, 20. As a result, a failure in a communication interface can be detected. Alternatively, for this purpose, it can be provided that a part of the first communication interface 18 provided for transmitting data and a part of the second communication interface 20 provided for transmitting data are designed identically in a first manner, and a part of the first communication interface 18 provided for receiving data and a part of the second communication interface 20 provided for receiving data are designed identically in a second manner different from the first manner.Preferably, the connecting line 22 has an electrical resistor 32, which is provided for the purpose of limiting a transmittable electrical power. This allows a high independence with regard to failure behavior of a transmitter and a receiver to be achieved. This electrical resistor 32 can be provided, for example, by a corresponding dimensioning of the connecting line 32. Alternatively or additionally, the connecting line 22 can be designed as a fuse, which interrupts a communication connection in the case of a predetermined electrical energy. As a result, a risk of a transfer of an overvoltage by means of the connecting line 22 can be reduced. In this way, the two integrated circuits 12, 16 can be reliably operated as functional units independent of one another despite a communication connection. As a result, high safety requirements can be fulfilled. In particular, a safety requirement level 4, for example in the sense of one of the standards EN 50129, IEC 61508 or IEC 61511, can be achieved. This makes it possible to provide a reliable system on chip, by means of which highly critical control processes can be realized. For example, this makes it possible to reliably and reliably control a railroad operation or a flight operation. With the present exemplary embodiment of the semiconductor device 10, therefore, high functional reliability and / or high availability can be provided in a situation-appropriate manner. In the preferred application, a functionally reliable single-chip system can thereby be provided, which meets the highest requirements.FIG. 2 illustrates an example of a method 100 for transferring data between the two independent integrated circuits 12, 16 arranged separately on the monolithic semiconductor substrate 14 on the basis of a schematic flow diagram. Expediently, the method 100 is carried out with the semiconductor device 10 described in more detail in connection with FIG. 1.In the example of the method 100, it is provided that the data are transmitted 102 at least in sections outside the semiconductor substrate 14 by means of the connecting line 22. Preferably, the data is transmitted 102 by means of the connecting line 22 in such a way that this data runs within the housing 24 surrounding the monolithic semiconductor substrate 14.Furthermore, in the example of method 100 described herein, a reliability of the transmission 102 of data is monitored 104 by means of a computer-implemented algorithm. This enables rapid failure detection and high reliability of the semiconductor device 10. Preferably, a reliability of the transmission 102 of the data is monitored 104 by means of predetermined patterns. As a result, a failure of a communication interface 18, 20 or a part thereof can be detected in a simple manner reliably and cost-effectively by means of known test mechanisms. This makes it possible to achieve a high safety requirement level for operation of the semiconductor device 10. In particular, semiconductor devices 10 designed as a single-chip system can be provided in a cost-effective and reliable manner for safety-critical applications. In the event of a failure of a communication connection, measures for preventing damage can furthermore be reliably taken.Although the invention has been illustrated and described in more detail by the preferred exemplary embodiment and its variations, the invention is not restricted by the disclosed examples and other variations can be derived therefrom by the person skilled in the art without departing from the scope of protection of the invention.Regardless of the grammatical sex of a certain term, individuals with male, female or other sex identity are included.

Claims

Semiconductor device (10) comprising: - a monolithic semiconductor substrate (14) on which a first integrated circuit (12) and a second integrated circuit (16) embodied separately therefrom are arranged; - a first communication interface (18), which is part of the first integrated circuit (12); - a second communication interface (20), which is part of the second integrated circuit (16); - a connecting line (22), which is arranged at least in sections outside the monolithic semiconductor substrate (14) and by means of which the first communication interface (18) and the second communication interface (20) are connected for the purpose of a data transmission.Semiconductor device (10) according to Claim 1, characterized in that the first communication interface (18) and / or the second communication interface (20) are designed as prefabricated standard I - O cells.Semiconductor device (10) according to Claim 1 or 2, characterized in that the connecting line (22) has an electrical resistor (32) for the purpose of power limiting.Semiconductor device (10) according to one of the preceding claims, characterized in that the connecting line (22) is arranged within a housing (24) of the semiconductor device (10).Semiconductor device (10) according to one of the preceding claims, characterized in that the connecting line (22) is designed as a wire.Semiconductor device (10) according to one of the preceding claims, characterized in that a metal, such as for example aluminium, copper or gold, is provided as material for the connecting line (22).Semiconductor device (10) according to one of the preceding claims, characterized in that the first communication interface (18) and the second communication interface (20) are of different design.Semiconductor device (10) according to one of Claims 1 to 6, characterized in that a part of the first communication interface (18) provided for the purpose of transmitting data and a part of the second communication interface (20) provided for the purpose of transmitting data are designed identically in a first manner, and / or a part of the first communication interface (18) provided for the purpose of receiving data and a part of the second communication interface (20) provided for the purpose of receiving data are designed identically in a second manner different from the first manner.Semiconductor device (10) according to one of the preceding claims, characterized in that the first integrated circuit (12) and the second integrated circuit (16) are separated from one another by means of a barrier (26).The semiconductor device (10) according to any one of the preceding claims, characterized in that the monolithic semiconductor substrate (14) is free of an integrated connection line for the purpose of communication between the first integrated circuit (12) and the second integrated circuit (16).Semiconductor device (10) according to one of the preceding claims, characterized in that the first integrated circuit (12) and / or the second integrated circuit (16) each have a data processing device (28).Method (100) for transmitting (102) data between two independent integrated circuits (12, 16) arranged separately on a monolithic semiconductor substrate (14), in which the data are transmitted (102) at least in sections outside the monolithic semiconductor substrate (14).Method (100) according to Claim 12, in which the data are transmitted (102) by means of a connecting line (22) which runs within a housing (24) surrounding the monolithic semiconductor substrate (14).Method (100) according to Claim 12 or 13, in which a reliability of the transmission (102) of data is monitored (104) by means of a computer-implemented algorithm, in particular by means of predetermined patterns.

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