Microelectromechanical sensor component and microelectromechanical inertial sensor

A microelectromechanical sensor component with a frame-like reference electrode compensates for mechanical stress, ensuring stable signal measurement and improved accuracy by adjusting the reference signal, addressing offset instability and noise issues.

DE102024207997A1Pending Publication Date: 2026-02-26ROBERT BOSCH GMBH
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Patent Information

Application Number
DE102024207997
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-08-22
Publication Date
2026-02-26

AI Technical Summary

Technical Problem

Existing microelectromechanical sensor components face challenges in maintaining accurate signal measurement due to mechanical stress, which causes fluctuations in the distance between the seismic mass and evaluation electrode, leading to offset instability and reduced signal-to-noise ratio.

Method used

The design incorporates a reference electrode surrounding the seismic mass, anchored to the substrate with multiple attachment points, forming a frame that compensates for mechanical stress-induced changes by providing a reference signal that adjusts accordingly, ensuring a stable differential evaluation.

Benefits of technology

This design achieves high offset stability and improved signal-to-noise ratio by effectively compensating for mechanical stress effects, allowing for precise measurement of physical quantities, particularly translational acceleration.

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Abstract

The invention relates to a microelectromechanical sensor component (1) comprising a substrate (2) with a substrate surface (2a), a seismic mass (4) connected to the substrate (2) and movable relative to the substrate (2) via a suspension spring (3), wherein the seismic mass (4) is deflectable in a deflection direction (A) perpendicular to the substrate surface (2a), and an evaluation electrode (5) arranged between the substrate (2) and the seismic mass (4) for capacitively detecting a deflection of the seismic mass (4) and providing a capacitive useful signal, wherein the microelectromechanical sensor component (1) further comprises a reference electrode (6) with several reference electrode sections (6a) forming a reference electrode frame (6b) that at least partially surrounds the seismic mass (4).wherein the reference electrode (6) is anchored to the substrate (2) by at least two attachment points (7) and a reference electrode section (6a) extends freely between each of the two attachment points (7), and comprises a reference counter electrode (9) arranged between the substrate (2) and the reference electrode (6) for providing a capacitive reference signal in conjunction with the reference electrode (6). The invention further relates to a microelectromechanical inertial sensor (20) with such a microelectromechanical sensor component (1).
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