PERFORMANCE MODULE AND METHOD FOR FORMING IT

Abstract

Power module comprising an electrical contact surface and a belt loop. The belt loop includes a first end, a second end, and a middle section between the first and second ends. The first and second ends of the belt loop are mounted on the electrical contact surface. The middle section of the belt loop is parallel to the electrical contact surface. A molded body encapsulates the electrical contact surface, the first end, and the second end of the belt loop. The middle section of the belt loop is exposed by the molded body and forms a first contact pad configured for mounting a first press-fit pin.

Description

TECHNICAL AREA

[0001] The present disclosure relates to a semiconductor module, in particular a semiconductor module comprising contact pads exposed from a shaped body. The present disclosure further relates to a method for forming such a semiconductor module. BACKGROUND

[0002] The demand for electronic modules for power applications, commonly referred to as power modules, continues to rise rapidly across a wide range of industries, including automotive, consumer electronics, and renewable energy. Some power modules for high-power-density applications, such as inverters for electric vehicle (EV) applications, can deliver power densities in the range of 100–200 kW or higher (e.g., > 300 kW).

[0003] In motor applications, three or more molded power modules are often mounted on a single heat sink. These modules may utilize press-fit pins for signal transmission, with the pins protruding from the molded body and inserted into a printed circuit board (PCB). Consequently, the pins require tight positional tolerances, as they must align with the PCB holes. However, the individual tolerances of different electrical contact surfaces and manufacturing processes can combine to create a tolerance chain. This means that the cumulative effect of these tolerances can lead to variations in the final assemblies, dimensions, performance, and reliability. Managing the tolerance chain of molded modules with press-fit pins mounted between a heat sink and a PCB is therefore a significant challenge.

[0004] The present disclosure provides a solution to address the problem described above. SUMMARY

[0005] The present disclosure relates to a power module comprising an electrical contact surface and a belt loop. The belt loop includes a first end, a second end, and a middle section between the first and second ends. The first and second ends of the belt loop are mounted on the electrical contact surface. The middle section of the belt loop is parallel to the electrical contact surface. A shaped body encapsulates the electrical contact surface, the first end, and the second end of the belt loop. The middle section of the belt loop is free from the shaped body and forms a first contact pad configured for mounting a first press-fit pin.

[0006] The present disclosure further relates to a method for manufacturing a power module, comprising: providing an electrical contact surface, bonding a first end and a second end of a tape loop to the electrical contact surface, wherein the tape loop has a middle section between the first end and the second end of the tape loop, encapsulating the electrical contact surface, the first end and the second end of the tape loop by a shaped body, wherein the middle section of the tape loop is exposed by the shaped body and forms a first contact pad.

[0007] The expert will recognize additional features and advantages upon reading the following detailed description and upon examining the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The present disclosure is illustrated by way of example and without limitation in the figures of the accompanying drawings, in which the same reference symbols refer to similar or identical elements. The elements of the drawings are not necessarily to scale relative to one another. The features of the various illustrated examples may be combined, provided they are not mutually exclusive. Fig. Figure 1 shows a cross-sectional view of a power module with a contact pad exposed by a molded body. Fig. Figures 2A-2D illustrate various steps of a process for forming a contact pad exposed from a shaped body of a power module for mounting press-fit pins. Fig. Figures 3A-3B illustrate an example of a power module before and after forming a molded body, where a belt loop is flattened within a mold cavity. Fig. Figures 4A-4C illustrate various steps of a procedure for mounting a power module assembly between a heat sink and a printed circuit board. Fig. Figures 5A-5C illustrate various steps of a further method for forming a contact pad exposed from a shaped body of a power module for mounting press-fit pins. Fig. Figure 6 illustrates an example of a power module with a first contact pad and a second contact pad for mounting press-fit pins exposed from a molded body. Fig. Figure 7 shows a top view of Fig. Figure 4A illustrates the effect of a power module slightly displaced from its nominal position. DETAILED DESCRIPTION

[0009] The examples described herein provide a power module comprising an electrical contact surface and a belt loop. A first end and a second end of the belt loop are mounted on the electrical contact surface. A middle section between the first and second ends of the belt loop is parallel to the electrical contact surface. The electrical contact surface, the first end, and the second end of the belt loop are encapsulated within a molded body. However, the middle section of the belt loop is exposed within the molded body, thus forming a contact pad. This contact pad is suitable for mounting a press-fit pin.

[0010] Fig. Figure 1 shows a cross-section of a power module. The power module has an electrical contact surface 102a, which can be electrically coupled to a semiconductor chip. A belt loop 106 is mounted on the electrical contact surface 102a. Specifically, a first end 106a and a second end 106b of the belt loop 106 are mounted on the electrical contact surface 102a. The belt loop 106 has a central section 106c between the first end 106a and the second end 106b, which is spaced perpendicular to the electrical contact surface 102a. Furthermore, the central section 106c of the belt loop 106 is parallel to the electrical contact surface 102a. The ends 106a, 106b of the belt loop 106 and the electrical contact surface 102a are encapsulated by a shaped body 108. The middle section 106c of the belt loop is at least partially free from the shaped body 108 on an upper surface 116 and thus forms a first contact pad 110.

[0011] Fig. Figures 2A-2D illustrate various steps of a method 100 for forming a contact pad 110 exposed by the shaped body 108 of a power module 101 for mounting press-fit pins. In one example, the electrical contact surface 102a is given by a substrate 102 of the power module 101, in particular by an upper surface 112a of the substrate 102. The substrate 102 can, for example, comprise two electrically conductive layers 112, 114 separated from each other by an electrically insulating layer 126. The surfaces 112a, 114a of the electrically conductive layers 112, 114, which face away from the electrically insulating layer 126, form the upper surface 112a and a lower surface 102b of the substrate 102, respectively. Examples of such a substrate include a direct copper bond (DCB), a direct aluminum bond (DAB), or an active metal braze substrate (AMB).However, the substrate 102 can also be any suitable type of substrate, such as a conductor frame, an insulated metal substrate (IMS), a printed circuit board (PCB), etc. Furthermore, the electrical contact area 102a can be provided by an upper metallization layer of a semiconductor chip, e.g., a load or control electrode.

[0012] Fig. Figure 2B shows the bonding 105 of the tape loop 106 to the electrical contact surface 102a. The tape loop 106 is formed from a bonding strip. The bonding strip is a thin, flat strip of metal, e.g., but not limited to, aluminum, gold, copper, or alloys thereof. Instead of being round like bonding wires, bonding strips have a rectangular or flat cross-section. The tape loop 106 can comprise an electrically conductive metal, such as copper, aluminum, or a copper / aluminum alloy. The ends 106a and 106b of the tape loop 106 can be bonded by ultrasonic bonding, laser bonding, or thermosonic bonding. In other examples, the ends 106a and 106b of the tape loop 106 can be wedge-bonded to the electrical contact surface 102a.

[0013] The first end 106a and the second end 106b of the belt loop 106 are bonded to the electrical contact surface 102a, and furthermore, the middle section 106c can be parallel to the electrical contact surface 102a, as described above. The belt loop 106 has a height that is measured between the electrical contact surface 102a and the belt loop 106 in a direction perpendicular to the electrical contact surface 102a. The middle section 106c of the belt loop 106 can have a maximum height h relative to the rest of the belt loop 106 in a range of 50 µm to 500 µm, particularly in the range of 100 µm to 300 µm. The thickness of the belt loop 106 can be in a range of 0.2 mm to 0.8 mm, measured in the direction perpendicular to the electrical contact surface 102a, if the belt loop 106 were flat.The width of the belt loop 106 can be at least three times the thickness of the belt loop 106, measured in a direction parallel to the electrical contact surface 102a of the substrate 102, if the belt loop 106 were flat.

[0014] In Fig. In 2B, both ends 106a and 106b of the belt loop 106 are mounted on the same section or island 128 of the electrical contact surface 102a. However, in some examples, the ends of the belt loop 106 may be mounted on different sections or islands 128 of the electrical contact surface 102a.

[0015] In a further step, the electrical contact surface 102a and the ends 106a and 106b of the belt loop 106 are encapsulated by an encapsulating agent 128, as shown in 107. Fig. Figure 2C shows that the substrate 102 can be placed within a mold cavity. The encapsulating agent 128 is dispensed into the mold cavity, which encapsulates the electrical contact surface 102a and the ends 106a and 106b of the belt loop 106, which is subsequently cured to form the molded body 108. The lower surface 102b of the substrate 102 may be exposed by the molded body 108. The mold cavity may have a projection that is in physical contact with the central section 106c of the belt 106, such that the central section 106c of the belt loop 106 is at least partially exposed by the molded body 108 after encapsulation 107. In particular, the central section 106c of the belt loop 106 is exposed by the upper surface 116 of the molded body 108. The exposed central section 106c of the molded body 108 forms a first contact pad 110, as shown by the dashed rectangle in Fig. 2C shown.

[0016] In some examples, a projection of the mold cavity can form a recess in the mold body 108 on the upper surface 116. The recess at least partially exposes the central section 106c of the belt loop 106 to form the first contact pad 110. The first contact pad 110 and the mold body 108 can form a trough-like structure. The mold body 108 can form side walls of a trough-like structure, and the first contact pad 110 can form a bottom of the trough-like structure.

[0017] In some examples, during encapsulation 107, the encapsulating agent 128 can smear and cover the central section 106c of the belt loop 106, i.e., the molded body 106 can encapsulate the belt loop 106. These smeared sections of the encapsulating agent can be removed by a deflashing process, e.g., mechanical deflashing, chemical deflashing, or laser deflashing, to at least partially expose the central section 106c of the belt loop 106. The exposed central section 106c of the belt loop 106 then forms the first contact pad 110.

[0018] The first contact pad 110 can be electrically coupled to a control electrode or a load electrode of a semiconductor chip within the power module (not shown). Therefore, the first contact pad 110 can be used for electrical testing of the semiconductor chip or the power module circuit before mounting a press-fit pin.

[0019] The first contact pad 110 is suitable for mounting 109 a first press-fit pin 120 on the first contact pad 110, so that the power module 101 can be electrically integrated into a device, as in Fig. The first press-fit pin 120 is shown in 2D. In particular, the first press-fit pin 120 is electrically and mechanically coupled to the first contact pad 110. A lower end 120b of the first press-fit pin 120 is mounted onto the first contact pad 110 by soldering, sintering, or welding. Optionally, an adhesive can be applied so that at least portions of the lower end 120b of the first press-fit pin 120 and the first contact pad 110 are covered by the adhesive. The adhesive can increase the mechanical coupling between the first press-fit pin 120 and the first contact pad 110. In some examples, a sleeve can be soldered, sintered, or welded to the first contact pad 110, and the lower end 120b of the first press-fit pin 120 can be inserted into the sleeve.

[0020] In some examples, the first press-fit pin 120 can be inserted into the first contact pad 110 by pressing instead of mounting 109.

[0021] Fig. 3A and Fig. Figure 3B illustrates another example of a power module 200 before and after the formation of the shaped body 108. The power module 200 can have some or all of the features of the power module 101. Fig. 2C-2D. After mounting the belt loop 106 onto the electrical contact surface 102a, the central section 106c of the belt loop 106 can be flattened. This can be achieved within the mold cavity when the mold cavity is closed and the central section 106c of the belt loop 106 is pressed downwards by the projection of the mold tool. The force exerted on the central section 106c must be less than the shear force of the substrate 102 and the shear force of the belt loop 106 to avoid cracking in the substrate 102 and delamination of the belt loop 106 from the substrate 102. The flattening can also be carried out in a separate process. Utilizing the mold cavity, which is required anyway for encapsulation 107, appears to be an efficient way to flatten at least parts of the central section 106c. Regardless of the process, the result is a flat section 202, as in . Fig. 3A shown.

[0022] The shear force of the substrate 102 is the minimum force exerted on the substrate 102 that can introduce cracks into it. The shear force for the substrate 102 can range from 500 N to 2000 N. The shear force of the belt loop 106 is the minimum force exerted on the belt loop 106 to delaminate it from the substrate 102. The exerted force depends on the maximum height h of the belt loop 106 before flattening and on the thickness of the substrate 102, measured perpendicularly between the upper surface 112a and the lower surface 114a of the substrate 102. For example, for a maximum height h = 100 µm and a substrate thickness of 1 mm, the exerted force may be less than 20 N.

[0023] In some examples, the middle section 106c of the belt loop 106 can be flattened so that the middle section 106c has the smallest height compared to the rest of the belt loop 106.

[0024] The shaped body 108 is formed as described above, wherein the flat section 202 of the belt loop 106 is exposed from the upper surface 116 of the shaped body 108 and thus forms a first contact pad 210, as shown in Fig. Figure 3B shows that the first contact pad 210 has a larger surface area for mounting the first press-fit pin 120 compared to the surface area of ​​the first contact pad 110. Fig. 2D. Therefore, the first contact pad 210 provides more flexibility for mounting the first press-fit pin 120 compared to the first contact pad 110. The surfaces of the first contact pads 110 and 210 are measured in the direction parallel to the electrical contact surface 102a.

[0025] Fig. Figures 4A-4C illustrate various steps of a method 300 for mounting a power module assembly 310 between a heat sink 302 and a printed circuit board 306 (PCB). In this example, the final power module assembly 310 has several power modules 101, e.g., three power modules, and can be configured as a three-phase converter. Fig. 4A-4C are the power modules 101 of Fig. 2C shown, however, it is understood that the power modules 200 of Fig. 3B can also be used in the power module assembly 310.

[0026] The power modules 101 are provided after the first contact pad 110 has been formed. The power modules 101 are attached to the heat sink 302 as shown in Fig. Figure 4A shows, in particular, that the lower surface 114b of the substrate 102 of each power module 101 is attached to a surface 304 of the heat sink 302. The power modules 101 can be sintered onto the surface 304 of the heat sink 302, or a thermally conductive adhesive can be applied between each power module 101 and the surface 304 of the heat sink 302. The first press-fit pins 120 are mounted on the respective first contact pad 110 of the power modules 101 after the power modules 101 have been attached to the heat sink 302, as shown in Figure 4A. Fig. 4B shown.

[0027] The power module assembly 310 is pressed onto the circuit board 306, such that an upper end 120t of each first press-fit pin 120 is inserted into a respective hole 308 of the circuit board 306 opposite the lower end 120b, as shown in Fig. 4C shown. Therefore, an electrical connection is established between the printed circuit board 306 and each power module 101. The holes 308 in the printed circuit board 306 are arranged such that the holes 308 must be aligned with the respective first press-fit pins 120 of each power module 101. The arrangement of the holes 308 in the printed circuit board 306 cannot be changed. Therefore, the printed circuit board 306 and the power modules 101 require strict positional thresholds when the power module assembly 310 is pressed into the printed circuit board 306. However, one or more power modules 101a may shift from their nominal position while being mounted on the heat sink 302, as shown in Fig. 7 shown, which is a top view of Fig. 4A is. A nominal position of the power module 101a is shown by a solid line 602 and a displaced position, which is not the same as the nominal position of the power module 101a, is shown by a dashed line 604.

[0028] The first press-fit pin 120 can be flexibly mounted on the respective first contact pad 110 of the offset power module 101a, such that each first press-fit pin 120 of the offset power module 101a is aligned with the respective hole 308 of the printed circuit board 306. For example, the offset power module 101a can be displaced by 10 µm in a first direction parallel to the surface 304 of the heat sink 302. During the mounting of the first press-fit pin 120 on the first contact pad 110 of the offset power module 101a, the position of the first press-fit pin 120 can be displaced by 10 µm in a second direction opposite to the first direction. As a result, the first press-fit pin 120 of the offset power module 101a is aligned with the respective hole 308 in the printed circuit board 306.

[0029] If, in the examples described above, the press-fit pin was mounted on the first contact pad by bonding or via a sleeve, another alternative mounting option is to insert the first press-fit pin into the first contact pad. A pressing force can be applied to the first press-fit pin to insert it into the first contact pad. For thick belt loops, e.g., greater than 0.6 mm in thickness, the pressing force may exceed the shear strength of the substrate, potentially causing it to crack. Therefore, more than one belt loop 106, 406 can be mounted on the substrate 102, as shown in the Fig. 4A- Fig. Shown in 4D.

[0030] In particular, the Fig. Figures 5A-5C describe various steps of another method 400 for manufacturing a power module 401, comprising an exposed contact pad for mounting a press-fit pin. The power module 401 can also be used in a power module assembly, as shown in the Fig. 3A- Fig. 3C shown. Method 400 includes the steps of providing 103 the electrical contact surface 102a and bonding 105 the belt loop 106 to the electrical contact surface 102a, as in Method 100 of the Fig. 2A- Fig. 2B is described. Therefore, the procedure will only be discussed in terms of differences.

[0031] Method 400 further includes mounting 403 another belt loop 406 on the electrical contact surface 102a, as shown in Fig. Figure 5A shows the belt loop 406 being mounted in front of the belt loop 106 403, and thus the belt loop 406 is located below the belt loop 106. A first end 406a and the second end 406b of the belt loop 406 are mounted on the electrical contact surface 102a. A middle section 406c of the belt loop 406, located between the first end 406a and the second end 406b of the belt loop 406, overlaps with the middle section 106c of the belt loop 106. The belt loop 406 has a further height, which is measured between the electrical contact surface 102a and the belt loop 406 in the direction perpendicular to the electrical contact surface 102a. The height of the belt loop 406 is less than the height of the belt loop 106.

[0032] Furthermore, the substrate 102 has a metal sheet 404 which is mounted on the electrical contact surface 102a by, for example, soldering, sintering, or welding. In particular, the metal sheet 404 is mounted under the central sections 106c and 406c of the belt loops 106, 406. The belt loops 106, 406 can be mounted in a similar manner as described with reference to Fig. 3A described below. After pressing, the belt loops 106 and 406 have the flat section 202 and a flat section 402, respectively, parallel to the electrical contact surface 102a. The metal sheet 404 can have a thickness similar to that of the belt loop 106 or 406. The thickness of the metal sheet 406 is measured in the direction perpendicular to the electrical contact surface 102a.

[0033] The ends 106a and 106b of the belt loop 106, the belt loop 406, the metal sheet 404 and the electrical contact surface 102 are encapsulated by the shaped body 106 405, as shown in Fig. 5B shown. The flat section 202 of the belt loop 106 is at least partially exposed on the upper surface 116 of the molded body 108 to form the first contact pad 210.

[0034] The first press-fit pin 120 can be inserted into the first contact pad 210 by mechanical drilling, screwing or pressing, etc., as shown in Fig. Figure 5C shows that the width of the first contact pad 210 is greater than the width of the first press-fit pin 120. Therefore, the first press-fit pin 120 can be flexibly pressed into the first contact pad 210 of the power module 401. The widths of the first contact pad 202 and the first press-fit pin 120 are measured in the direction parallel to the electrical contact surface 102a.

[0035] The thickness of each belt loop 106, 406 can be 0.3 mm, and the thickness of the metal sheet 404 can be 0.3 mm, which can provide an insertion thickness of 0.9 mm for the first press-fit pin 120. Thus, the first press-fit pin 120 can further be inserted into the flat section 402 of the second belt loop 406 and the metal sheet 404 to further increase the mechanical stability of the first press-fit pin 120 in the power module 401.

[0036] In some examples, the metal sheet 404 can be a flat strip.

[0037] In the Fig. Figures 5A-5C show two belt loops 106, 406 stacked on top of each other, but it is understood that more than two belt loops can be stacked on the substrate 102.

[0038] Fig. Figure 6 shows another example of a power module 500 with two types of vertical contact pads. The power module 500 is provided with a terminal 502, e.g., a load terminal of the power module, which can be electrically coupled to the electrical contact surface 102a, e.g., by a bond wire or bond tape. Furthermore, the terminal 502 projects from the molded body 108 on a lateral side, such that an upper surface 508 of the terminal 502 faces the upper surface 116 of the molded body 108. In some examples, the terminal 502 can form part of a conductor frame. The upper surface 508 of the terminal 502 and the middle section 106c of the ribbon loop 106 can be aligned in a first plane 504 parallel to the electrical contact surface 102a.The middle section 106c of the belt loop 106 and the upper surface 508 of the connector 502 are at least partially exposed within a circumference of the molded body 108 to form exposed islands within the molded body 108, which represent the first contact pad 110 and a second contact pad 510, respectively.

[0039] The first press-fit pin 120 is mounted on the first contact pad 110 as described above. A second press-fit pin 520 can be mounted on the second contact pad 510 in a similar manner to that described for the press-fit pin 120. In particular, a lower end 510b of the second press-fit pin 520 can be mounted on the second contact pad 510. The second press-fit pin 520 can be configured as a sensing terminal that is electrically coupled to the load electrode of the semiconductor chip.

[0040] In some examples, the power module 500 can be used in the power module assembly 310 of Fig.4A-4C are used. Since the upper surface 508 of the connector 502 and the middle section 106c of the ribbon loop 106 are aligned in the first plane 504, the contact pads 110 and 510 are consequently also aligned in the first plane 504. The upper end 120t of the first press-fit pin 120 and an upper end 520t of the second press-fit pin 520, opposite the lower end 520b, are aligned in a second plane 506 parallel to the first plane 504. Therefore, the first press-fit pin 120 and the second press-fit pin 520 can be inserted into the circuit board 306 simultaneously.

[0041] If the power module 500 is moved while being mounted on the heat sink 302, the first press-fit pin 120 and the second press-fit pin 520 can be flexibly mounted on their respective contact pads 110 and 510. As a result, the press-fit pins 120 and 520 are aligned with the respective holes 308 of the circuit board 306.

[0042] The power module described herein comprises one or more power semiconductor chips. More specifically, semiconductor chips can be configured, for example, as power MISFETs (Metal Insulator Semiconductor Field Effect Transistors), power MOSFETs (Metal Oxide Semiconductor Field Effect Transistors), IGBTs (Insulated Gate Bipolar Transistors), JFETs (Junction Gate Field Effect Transistors), HEMTs (High Electron Mobility Transistors), power bipolar transistors, or power diodes, such as PIN diodes or Schottky diodes. The chips can be electrically connected to form a single switch, a half-bridge, a full-bridge, or any other configuration used in applications such as motor control and drives, power supplies and DC-DC converters, renewable energy systems (e.g., solar, wind), uninterruptible power supplies (UPS), power factor correction (PFC), electric vehicles and charging infrastructure, etc.

[0043] Semiconductor chips can be made from a specific semiconductor material, such as Si, SiC, SiGe, GaAs, GaN, AlGaN, InGaAs, InAlAs, etc., and may also contain inorganic and / or organic materials that are not semiconductors. Semiconductor chips can be of different types and manufactured using different technologies.

[0044] The encapsulating material can comprise any suitable dielectric molding material, in particular a molding material with high temperature stability and / or good dielectric properties. For example, the encapsulating material can include filler particles, such as filler particles that comprise or consist of silicon dioxide or ceramics. The filler particles can be configured to enhance the thermal and / or dielectric properties of the encapsulating material. The filler particle content of the encapsulating material can be, for example, 70% or more, and can be as high as 95%. The filler particles can, for example, comprise or consist of silicon dioxide or a ceramic. Further examples: Example 1 is a power module comprising: an electrical contact surface, a belt loop comprising a first end, a second end and a middle section between the first end and the second end, the first end and the second end of the belt loop being mounted on the electrical contact surface, the middle section of the belt loop being parallel to the electrical contact surface, a shaped body encapsulating the electrical contact surface, the first end and the second end of the belt loop, and the middle section of the belt loop being exposed from the shaped body and forming a first contact pad configured to mount a first press-fit pin. Example 2 is the power module according to Example 1, wherein a first press-fit pin is mounted on the first contact pad or inserted into the first contact pad. Example 3 is the power module according to Example 1 or 2, wherein the belt loop is a first belt loop and the power module further comprises: a second belt loop, comprising a first end, a second end and a middle section between the first end and the second end of the second belt loop, wherein the first end and the second end of the second belt loop are mounted on the electrical contact surface and are encapsulated by the molded body, the middle section of the second belt loop overlapping the first contact pad in a direction perpendicular to the electrical contact surface. Example 4 is the power module according to Example 3, where the middle section of the second tape loop is below the first contact pad. Example 5 is the power module according to Example 3 or 4, wherein the power module further comprises a metal sheet mounted on the electrical contact surface, and wherein the metal sheet overlaps the first contact pad and the middle section of the second belt loop in the direction perpendicular to the electrical contact surface. Example 6 is the power module according to any one of Examples 1 to 5, further comprising: a connection extending from the molded body, wherein at least part of the connection is exposed from the molded body and forms a second contact pad configured to mount a second press-fit pin, wherein the second contact pad is within a circumference of the molded body, and wherein the first contact pad and the second contact pad are exposed from a first surface of the molded body. Example 7 is the power module according to Example 6, wherein the first contact pad and the second contact pad are aligned in a first plane parallel to the electrical contact surface. Example 8 is the power module according to Example 6 or 7, wherein a second press-fit pin is mounted on the second contact pad or inserted into the second contact pad. Example 9 is a method for manufacturing a power module, comprising: providing an electrical contact surface, bonding a first end and a second end of a belt loop to the electrical contact surface, wherein the belt loop has a middle section between the first end and the second end of the belt loop, encapsulating the electrical contact surface, the first end and the second end of the belt loop by a shaped body, wherein the middle section of the belt loop is exposed by the shaped body and forms a first contact pad. Example 10 is the method according to Example 9, wherein a forming press used to encapsulate the electrical contact surface flattens the middle section of the belt loop, thereby forming the first contact pad. Example 11 is the method according to Example 9 or 10, further comprising electrically and mechanically mounting a first press-fit pin to the first contact pad, wherein mounting the first press-fit pin comprises welding the first press-fit pin to the first contact pad or inserting the first press-fit pin into the first contact pad. Example 12 is the method according to Examples 9 to 11, wherein the tape loop is a first tape loop and the method further comprises: bonding a first end and a second end of a second tape loop to the electrical contact surface, wherein the second tape loop has a middle section between the first end and the second end of the second tape loop, wherein the middle section of the second tape loop overlaps with the first contact pad in a direction perpendicular to the electrical contact surface. Example 13 is the method according to Example 12, further comprising mounting a metal sheet onto the electrical contact surface, and wherein the metal sheet overlaps the first contact pad and the middle section of the second belt loop in the direction perpendicular to the electrical contact surface. Example 14 is the method according to any one of Examples 9 to 12, further comprising: providing an endpoint projecting from the molded body, wherein at least part of the connection is exposed from the molded body and forms a second contact pad suitable for mounting a second press-fit pin, wherein the second contact pad is within a circumference of the molded body, and wherein the first contact pad and the second contact pad are exposed from a first surface of the molded body. Example 15 is the method according to Examples 11 to 14, further comprising mounting a heat sink onto a lower metallic surface of a substrate which is exposed by a second surface of the molded body opposite the first surface before the first press-fit pin is mounted to the first contact pad or the second press-fit pin is mounted to the second contact pad, and wherein the lower metallic surface of the substrate is parallel to the electrical contact surface. Example 16 is the method according to Examples 12 to 15, wherein the forming press used to encapsulate the electrical contact surface flattens the middle section of the second belt loop.

Claims

[1] Power module (101, 200, 401, 500), comprising: an electrical contact surface (102a), a tape loop (106) comprising a first end (106a), a second end (106b) and a middle section (106c) between the first end (106a) and the second end (106b), wherein the first end (106a) and the second end (106b) of the belt loop (106) are mounted on the electrical contact surface (102a), wherein the middle section (106c) of the belt loop (106) is parallel to the electrical contact surface (102), a shaped body (108) that encapsulates the electrical contact surface (102a), the first end (106a) and the second end (106b) of the belt loop (106), and wherein the middle section (106c) of the belt loop (106) is exposed from the shaped body (108) and forms a first contact pad (110, 210) configured to mount a first press-fit pin (120). [2] Power module (101, 200, 401, 500) according to claim 1, wherein a first press-fit pin (120) is mounted on or inserted into the first contact pad (110). [3] Power module (401) according to claim 1 or 2, wherein the tape loop (106) is a first tape loop (106) and the power module (401) further comprises: a second tape loop (406), comprising a first end (406a), a second end (406b) and a middle section (406c) between the first end (406a) and the second end (406b) of the second tape loop (406), wherein the first end (406a) and the second end (406b) of the second belt loop (406) are mounted on the electrical contact surface (102a) and are encapsulated by the shaped body (108), wherein the middle section (406c) of the second belt loop (406) overlaps with the first contact pad (110, 210) in a direction perpendicular to the electrical contact surface (102a). [4] Power module (401) according to claim 3, wherein the middle section (406c) of the second belt loop (406) is located below the first contact pad (110). [5] Power module (401) according to claim 3 or 4, wherein the power module further comprises a metal sheet (404) mounted on the electrical contact surface (102a), and wherein the metal sheet (404) overlaps the first contact pad (110, 210) and the middle section (406c) of the second belt loop (406) in the direction perpendicular to the electrical contact surface (102a). [6] Power module (500) according to any one of claims 1 to 5, further comprising: a connection (502) that protrudes from the molded body (108), wherein at least part of the connection (502) is exposed from the molded body (108) and forms a second contact pad (510) configured for mounting a second press-fit pin (520), wherein the second contact pad (510) is within a circumference of the molded body (106), and wherein the first contact pad (110, 210) and the second contact pad (510) are exposed from a first surface (116) of the molded body (108). [7] Power module (500) according to claim 6, wherein the first contact pad (110, 210) and the second contact pad (510) are aligned in a first plane (504) parallel to the electrical contact surface (102a). [8] Power module (101, 200, 401, 500) according to claim 6 or 7, wherein a second press-fit pin (506) is mounted on the second contact pad (510) or inserted into the second contact pad (510). [9] Method (100, 300, 400) for manufacturing a power module (101, 200, 401, 500), comprising: Providing an electrical contact surface (102a), Bonding of a first end (106a) and a second end (106b) of a belt loop (106) to the electrical contact surface (102a), wherein the tape loop (106) has a middle section (106c) between the first end (106a) and the second end (106b) of the tape loop (106), Encapsulation of the electrical contact surface (102a), the first end (106a) and the second end (106b) of the belt loop (106) by a shaped body (108), wherein the middle section (106c) of the belt loop (106) is exposed by the shaped body (108) and forms a first contact pad (110, 210). [10] Method (100, 300, 400) according to claim 9, wherein a forming press used to encapsulate the electrical contact surface (102a) flattens the middle section (106c) of the belt loop (106), thereby forming the first contact pad (110, 210). [11] Method (100, 300, 400) according to claim 9 or 10, further comprising electrically and mechanically mounting a first press-fit pin (120) to the first contact pad (110, 210), wherein mounting the first press-fit pin (120) comprises welding the first press-fit pin (120) to the first contact pad (110, 210) or inserting the first press-fit pin (120) into the first contact pad (110, 210). [12] Method (400) according to claims 9 to 11, wherein the belt loop (106) is a first belt loop and the method (400) further comprises: Bonding a first end (406a) and a second end (406b) of a second belt loop (406) to the electrical contact surface (102a), wherein the second tape loop (406) has a middle section (406c) between the first end (406a) and the second end (406b) of the second tape loop (406), wherein the middle section (406c) of the second belt loop (406) overlaps with the first contact pad (110, 210) in a direction perpendicular to the electrical contact surface (102a). [13] Method (400) according to claim 12, further comprising mounting a metal sheet (404) onto the electrical contact surface (102a), wherein the metal sheet (404) overlaps the first contact pad (110, 210) and the middle section (406c) of the second belt loop (406) in the direction perpendicular to the electrical contact surface (102a). [14] Method according to any one of claims 9 to 12, further comprising: Providing a connection (502) that protrudes from the molded body (108), wherein at least part of the connection (502) is exposed from the molded body (108) and forms a second contact pad (510) suitable for mounting a second press-fit pin (520), wherein the second contact pad (510) is within a circumference of the molded body (106), and wherein the first contact pad (110, 210) and the second contact pad (510) are exposed from a first surface (116) of the molded body (108). [15] Method (300) according to claims 11 to 14, further comprising mounting a heat sink (302) to a lower metallic surface (102b) of a substrate (102) which is exposed by a second surface (118) of the molded body (108) opposite the first surface (116) before the first press-fit pin (120) is mounted to the first contact pad (110) or the second press-fit pin (520) is mounted to the second contact pad (510), and wherein the lower metallic surface (102b) of the substrate (102) is parallel to the electrical contact surface (102a). [16] Method (100, 300, 400) according to claims 12 to 15, wherein the molding press used to encapsulate the electrical contact surface (102a) flattens the middle section (406c) of the second belt loop (406).

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