Method for manufacturing a microelectromechanical component and microelectromechanical component

DE102025101220A1Undetermined Publication Date: 2026-07-16ROBERT BOSCH GMBH
View PDF 3 Cites 0 Cited by

Patent Information

Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
ROBERT BOSCH GMBH
Filing Date
2025-01-15
Publication Date
2026-07-16

Smart Images

  • Figure 00000000_0000_ABST
    Figure 00000000_0000_ABST
Patent Text Reader

Abstract

The invention relates to a method for manufacturing a microelectromechanical component. In this method, a first section (11a) of a first component (1), in particular a plate-shaped component, of the microelectromechanical component is separated from a second section (11b) of the first component (1) by means of a first trench (15). Furthermore, the first trench (15) is partially filled with a dielectric (13). In a further process step, the first trench (15) is completely filled with polysilicon (19).
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Mechanical stress decoupling in semiconductor devices

    DE102015208689A1

  • Method for manufacturing vertically separated electrically insulated micromechanical structures and micromechanical device

    DE102020215619A1

  • Methods for fabrication of MEMS device

    US20240327206A1