Method for manufacturing a composite component with a hollow structure, composite component and semiconductor technology equipment

Abstract

The invention relates to a method for producing a composite component (25), comprising: providing a first component (26), providing a second component (27), and producing the composite component (25) by joining the first component (26) to the second component (27) to form a joining surface (31). The first component (26) has a first surface (29) with a curved inner surface region (29a) and a flat outer surface region (29b), and the second component (27) has a second surface (30) with a curved inner surface region (30a) and a flat outer surface region (30b). During joining, the first component (26) and the second component (27) are joined together, at least in the flat surface regions (29b, 30b), to form the joining surface (31).When the two components (26, 27) are joined, a hollow structure (32) is formed which extends at least partially along the curved surface areas (29a, 30a). The invention also relates to a composite component (25).

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