Radiation detection device, radiation detection system and method for manufacturing the radiation detection device

Abstract

Radiation detection device (100) comprising: a plurality of sensor substrates (112) provided adjacent to each other, each sensor substrate having a first surface (112a) where a plurality of photoelectric conversion elements are arranged in an array, a second surface (112b) opposite to the first surface (112a), and a side surface connecting the first surface (112a) and the second surface (112b); a scintillator (120) provided on one side of the first surfaces of the plurality of sensor substrates (112); a sheet-like adhesive element (130) for adhering the plurality of sensor substrates (112) and the scintillator (120) to each other, a base supporting the plurality of sensor substrates (112); and a fastening element (113) for fastening the plurality of sensor substrates (112) to the base, wherein the sheet-like adhesive element (130) adheres between the plurality of sensor substrates (112) on the first surfaces (112a) and at least portions of the side surfaces such that the sheet-like adhesive element (130) extends from the first surfaces (112a) to at least portions of the side surfaces and adheres continuously, characterized in that a stiffness of the fastening element (113) is lower than a stiffness of the adhesive element (130).

Description

Technical area

[0001] The present invention relates to a radiation detection device that detects radiation, a radiation detection system using the radiation detection device, and a method for manufacturing the radiation detection device. State of the art

[0002] For a radiation detection device, a so-called indirect conversion type radiation detection device comprising a sensor substrate in which a plurality of photoelectric conversion elements are arranged in an array and a scintillator that converts radiation into light detectable by the photoelectric conversion elements may be used.

[0003] To provide a radiation detection device with a large area, PTL 1 discloses a radiation detection device in which a plurality of sensor substrates are provided adjacent to each other, and a scintillator is provided to extend over the plurality of sensor substrates. PTL 1 discloses a radiation detection device in which the plurality of sensor substrates and the scintillator are adhered to each other by an adhesive member. Citation listPatent literature

[0004] PTL 1: JP 2012 - 7 948 A Summary of the inventionTechnical problem

[0005] However, in the radiation detection device described in PTL 1, there is room to consider the adhesive strength of the adhesive member positioned between the plurality of sensor substrates. When the adhesive member positioned between the plurality of sensor substrates peels off from the plurality of sensor substrates due to, for example, temperature variations and vibrations, a gap may form between the adhesive member and end portions of the plurality of sensor substrates. Differences in the light propagation states from the scintillator to the sensor substrates may occur between the gap and the adhesive member. These differences may cause film defects to occur in images acquired from the plurality of sensor substrates. Solution to the problem

[0006] Accordingly, the present invention provides a radiation detection device in which faulty adhesion between an adhesive member and end portions of a plurality of sensor substrates is reduced.

[0007] A radiation detection device according to the present invention includes a plurality of sensor substrates provided adjacent to each other, each sensor substrate having a first surface on which a plurality of photoelectric conversion elements are arranged in an array, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface; a scintillator provided on one side of the first surfaces of the plurality of sensor substrates;and a sheet-like adhesive member for adhering the plurality of sensor substrates and the scintillator to each other, wherein between the plurality of sensor substrates, the sheet-like adhesive member adheres to the first surfaces and at least portions of the side surfaces such that the sheet-like adhesive member extends and adheres continuously from the first surfaces to at least portions of the side surfaces.;

[0008] A method for manufacturing a radiation detection device according to the present invention comprises providing a step of providing a scintillator on one side of first surfaces of a plurality of sensor substrates with a sheet-like adhesive member interposed therebetween, wherein the plurality of sensor substrates are provided adjacent to each other, and each sensor substrate has the first surface on which a plurality of photoelectric conversion elements are arranged in an array, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface to each other; and an adhesion step of causing the sheet-like adhesive member to extend from the first surfaces to at least portions of the side surfaces between the plurality of sensor substrates and to adhere continuously by pressing a region of the scintillator corresponding to a region between the plurality of sensor substrates from a side opposite to the plurality of sensor substrates. Short description of the drawings Fig. 1 is a schematic plan view, a schematic sectional view, and an enlarged schematic sectional view for describing a radiation detecting device. Fig. 2 is a schematic sectional view for describing a method of manufacturing the radiation detecting device. Fig. 3 is a schematic sectional view for describing a radiation detection device according to a different embodiment. Fig. 4 is a schematic sectional view and an enlarged schematic sectional view for describing a radiation detecting apparatus according to a different embodiment. Fig. 5 is a schematic sectional view of a radiation detection device according to a different embodiment. Fig. 6 is a conceptual view of an exemplary application to a radiation detection system using a radiation detection device. Description of embodiments

[0009] Embodiments according to the present invention are described in detail below with reference to the drawings. In the various embodiments, corresponding components are assigned the same reference numerals, and the same descriptions thereof will not be given. In the present invention, light means visible light and infrared light, and radiation means X-rays (X-rays), α-rays, β-rays, and γ-rays.

[0010] First, an exemplary general structure of a radiation detection device 100 according to an embodiment using Fig. 1(a) to 1(c). Fig. 1(a) is a schematic plan view for describing the radiation detection device 100. Fig. Fig. 1(b) is a schematic sectional view for describing a sectional structure at a section along AA' in Fig. 1(a). Fig. 1(c) is an enlarged schematic sectional view of a region B in Fig. 1(b).

[0011] As from Fig. As can be seen from FIGS. 1(a) to 1(c), the radiation detection device 100 according to the embodiment includes a plurality of sensor substrates 112, a scintillator 120, and an adhesive member 130. Each of the plurality of sensor substrates 112 has a first surface 112a on which a plurality of photoelectric conversion elements 115 are arranged in an array, a second surface 112b opposite the first surface 112a, and a side surface 112c connecting the first surface 112a and the second surface 112b. The plurality of sensor substrates 112 are provided adjacent to each other. The scintillator 120 is provided on one side of the first surfaces of the plurality of sensor substrates 112. The adhesive member 130 adheres the plurality of sensor substrates 112 and the scintillator 120 to each other on the side of the first surfaces of the plurality of sensor substrates 112.Here, between the plurality of sensor substrates 112, the sheet-like adhesive member 130 adheres to at least portions of the side surfaces 112c and the first surfaces 112a such that the sheet-like adhesive member 130 extends from the first surfaces 112a to at least portions of the side surfaces 112c and adheres continuously. Namely, the adhesive member 130 adheres the plurality of sensor substrates 112 and the scintillator 120 to each other and is provided to extend from the first surfaces 112a to at least portions of the side surfaces 112c of the sensor substrates 112. By such adhesion, even if changes occur in the adhesive element 130 due to temperature stresses and vibration stresses, faulty adhesion of the adhesive element 130 with respect to the plurality of sensor substrates 112 is reduced.In addition, the occurrence of gaps between the adhesive member 130 and the plurality of sensor substrates 112 is reduced, so that the occurrence of image film defects caused thereby is reduced.

[0012] On each sensor substrate 112, the plurality of photoelectric conversion elements 115 are arranged in an array on the first surface 112a. In the embodiment, a monocrystalline silicon substrate made from a monocrystalline silicon wafer is used for each sensor substrate 112, with a photodiode used as each photoelectric conversion element 115. A plurality of switching elements (not shown) corresponding to the plurality of photoelectric conversion elements 115 may be provided on each sensor substrate 112. The sensor substrates 112 according to the present invention are not limited to the substrates described above. Sensor substrates using TFT pixels and an MIS sensor or a PIN sensor, such as amorphous silicon deposited on an insulating plate, can be used. In addition, CCD or SOI (silicon-on-insulator) sensors can be used.Each sensor substrate 112 according to the embodiment further includes a monitor ring 118, a passivation film 116, and a protective layer 117. The monitor rings 118 are conductors provided to prevent electrostatic damage to the photoelectric conversion elements 115. Each monitor ring 118 is provided on at least a portion of the corresponding first surface 112a along edges of the plurality of photoelectric conversion elements 115. Each passivation film 116 is an insulating film covering the photoelectric conversion elements 115. For each passivation film 116, an inorganic insulating film such as a silicon oxide film or a silicon nitride film is suitably used. Each passivation film 116 covers a portion of the monitor ring 118 and the plurality of photoelectric conversion elements 115.Each protective layer 117 is a layer for protecting the photoelectric conversion elements 115 and their corresponding passivation films 116 from, for example, external shock. An inorganic insulating layer, such as a polyimide layer, is suitably used for each protective layer 117. Each protective layer 117 covers its corresponding passivation film 116 except for an end portion of its corresponding passivation film 116.

[0013] The scintillator 120 converts X-rays, which are radiant rays transmitted through a test object, into light having wavelengths detectable by the photoelectric conversion elements 115 of the sensor substrates 112. The scintillator 120 according to the embodiment includes a base material 121, a scintillator layer 122, and a scintillator protective layer 123. Although, for example, aC, Al, or a resin can be used for the base material 121, Al, which is less rigid than aC, can be suitably used. The scintillator layer 122 is a layer that converts X-rays into light having wavelengths detectable by the photoelectric conversion elements 115. GOS or CsI:TI can be used for the scintillator layer 122. GOS is Gd2O2S:Tb (terbium-doped gadolinium oxysulfide), and is a grain-shaped scintillator material.CsI:TI typifies alkali halide-based scintillators, and is thallium-doped cesium iodine, and has scintillator materials containing columnar crystals. The scintillator protective layer 123 is a layer that protects the scintillator layer 122 from external moisture and external shock. An organic resin such as polyparaxylylene resin or a hot-melt resin can be suitably used for the scintillator protective layer 123. For simplicity, . Fig. 1(b) the protective layer 123 is not shown.

[0014] The adhesive member 130 adheres the plurality of sensor substrates 112 and the scintillator 120 to each other on the side of the first surfaces of the plurality of sensor substrates 112. Here, the adhesive member 130 adheres between the plurality of sensor substrates 112 to at least portions of the side surfaces 112c and the first surfaces 112a such that the adhesive member 130 extends and adheres continuously from the first surfaces 112a to at least portions of the side surfaces 112c. In the embodiment, between the plurality of sensor substrates 112, the adhesive element 130 extends on and continuously adheres to the protective layers 117, the passivation films 116, the monitoring rings 118, the first surfaces 112a of the sensor substrates 112, and at least portions of the side surfaces 112c of the sensor substrates 112.In this way, by causing the sheet-like adhesive member 130 to extend and continuously adhere to a structure having a stepped surface, the adhesive member 130 adheres more appropriately to the sensor substrates 112. For the adhesive member 130, a material having high light transmittance with respect to the light converted by the scintillator 122 is suitably used. For example, a sheet-like member such as an acrylic resin sheet, a silicon-based resin sheet, or a hot-melt resin sheet can be suitably used. It is desirable that the adhesive member 130 contains an organic resin whose adhesion strength with respect to glass when the peeling angle is 180 degrees in accordance with JIS Z0237 is 10N / 25 mm or higher, whose transmission with respect to the maximum emission wavelength of the scintillator is 90% or higher, and whose thickness is from 1 μm to 50 μm.

[0015] A base 111 is a member that mechanically supports the plurality of sensor substrates 112. A base such as a glass substrate or an SUS substrate having a rigidity higher than that of the base material 121 and the scintillator layer 122 is suitably used for the base 111. A fixing member 113 is a member having adhesiveness for fixing the plurality of sensor substrates 112 to the base 111. A material the same as that used for the adhesive member 130 can be used for the fixing member 113. Circuit boards 114 are circuit boards for transmitting signals between an external circuit (not shown) and the sensor substrates 112. Flexible printed boards can be used for the circuit boards 114.

[0016] Next, a method of manufacturing the radiation detecting device 100 according to this embodiment using the Fig. 2(a) to 2(c). Fig. Fig. 2(a) is a schematic sectional view for describing a cut structure before an adhesion step to a portion corresponding to the portion along AA' in Fig. 1(a). Fig. 2(b) is a schematic sectional view describing an exemplary adhesion step. Fig. Fig. 2(c) is a schematic sectional view for describing another exemplary adhesion step. To simplify the Fig. 2(a) to 2(c), the protective layer 123 is not shown.

[0017] First, as shown in Fig. As can be seen from Fig. 2(a), by performing a fixing step of fixing the second surfaces 112b of the plurality of sensor substrates 112 to the base 111 using the fixing member 113, the plurality of sensor substrates 112 are provided on the base 111. By a providing step of providing the scintillator 120 with the scintillator layer 122 provided on the base material 121 on the side of the first surfaces of the plurality of sensor substrates 112 with the adhesive member 130 interposed therebetween, the scintillator layer 122 is provided on the surfaces 112a of the plurality of sensor substrates 112.

[0018] Next, as shown in Fig. 2(b), a region of the scintillator 120 corresponding to a region between the plurality of sensor substrates 112 is pressed from a side opposite to the plurality of sensor substrates 112. In the Fig. In the method shown in Figure 2(b), a rotatable roller 150 of the adhesive member 130 is linearly positioned along a side opposite the sensor substrates 112 from the side opposite the plurality of sensor substrates 112. In this way, by pressing the region of the scintillator 120 corresponding to the region between the plurality of sensor substrates 112, portions of the adhesive member 130 positioned between the plurality of sensor substrates 112 also adhere to portions of the side surfaces 112b of the sensor substrates 112. It is desirable that the pressure generated by the roller 150 be greater than or equal to 0.4 MPa.

[0019] As from Fig. As can be seen from Fig. 2(c), when a hot-melt resin is used as the adhesive member 130, the region of the scintillator 120 corresponding to the region between the plurality of sensor substrates 112 can be pressed from the side opposite to the plurality of sensor substrates 112 by employing a pressure structure 151 while adjusting the temperature. As the pressure structure 151 heats the hot-melt resin to a temperature greater than or equal to the melting temperature and presses it with a pressure greater than or equal to 0.4 MPa, the portions of the adhesive member 130 positioned between the plurality of sensor substrates 112 also adhere to the portions of the side surfaces 112b of the sensor substrates 112.

[0020] The side surfaces 112c of the plurality of sensor substrates 112 may have various structures for increasing the adhesion strength of the adhesive element 130. An exemplary structure for increasing the adhesion strength of the adhesive element 130 is shown in Fig. 3 shown. Fig. 3 is a schematic sectional view for describing the exemplary structure for increasing the adhesion strength of the adhesive member 130 in an enlarged sectional structure of a region B in Fig. 1(b). In the Fig. In the example shown in Figure 3, corners that the surfaces 112a and the side surfaces 112c of the sensor substrates 112 may form are removed, so that third surfaces 112d that are not parallel to the first surfaces 112a and the side surfaces 112c are provided between the first surfaces 112a and the side surfaces 112c of the sensor substrates 112. The adhesive member 130 extends to at least portions of the side surfaces 112c and the third surface 112d of the first surfaces 112a between the plurality of sensor substrates 112 and continuously adheres thereto. Due to such a structure, the adhesive member 130 is capable of suitably covering portions up to the side surfaces 112c. By increasing the adhesion area, the adhesion strength of the adhesive member 130 is also increased.

[0021] Fig. 4(a) and Fig. 4(b) each show a different exemplary structure for increasing the adhesion strength of the adhesive element 130. Fig. Fig. 4(a) is a schematic sectional view for describing a sectional structure of the different exemplary structure for increasing the adhesion strength of the adhesive member 130 at a portion along AA' in Fig. 1(a). Fig. 4(b) is an enlarged schematic sectional view of a region C in Fig. 4(a). To simplify the Fig. 4(a), the protective layer 123 is not shown. In the Fig. 4(a) and Fig. In the different exemplary structure shown in Figure 4(b), the side surface 112c of at least one of the plurality of sensor substrates 112 is inclined. The inclination extends to an inner side of the sensor substrate 112 at an angle D from the first surface 112a to the generated surface 112b with respect to a perpendicular line perpendicular to the first surface 112a. Between the plurality of sensor substrates 112, a structure is provided that is inclined at such an angle D such that this structure is one in which the adhesive element 130 is less likely to peel off from at least a portion of the side surface 112c when interacting with the structure in Fig. 1(c). It is desirable that the angle D be between 0.2 degrees and 5 degrees.

[0022] It is desirable that the stiffness of the fastening element 113 be lower than the stiffness of the adhesive element 130. Using the Fig. 5(a) and Fig. 5(b), a radiation detection device using a more desirable fixing element 113 is described. Fig. 5(a) is a schematic sectional view for describing a sectional structure of the radiation detecting device using the more desirable fixing member 113. Fig. 5(b) is a schematic sectional view for describing the desired fastening element 113. As Fig. 5(a), since the rigidity of the fastening element 113 is lower than the rigidity of the adhesive element 130, even if a stress caused by temperature variations and differences between thermal expansion coefficients occurs, the fastening element 113 absorbs this stress. Therefore, the stress applied to the adhesive element 130 is reduced, and the introduction of air bubbles into the adhesive element 130 due to peeling of the adhesive element 130 from the first surfaces 112a of the plurality of sensor substrates 112 is reduced. As the desired fastening element 113, as shown in Fig. As can be seen in Fig. 5(b), a sheet-like fastening member 113 having an expanding and contracting material 161 surrounded by an adhesive member 160 is available. A sheet-like polyolefin-based foam is used as the expanding and contracting material 161, and air bubbles 162 are contained in the expanding and contracting material 161. For example, a sheet-like acrylic adhesive member or a sheet-like silicon-based adhesive member is used as the adhesive member 160.

[0023] The radiation detection devices described above can be applied to a radiation detection system used in Fig. 6 is shown. Fig. 6 illustrates an exemplary application to the movable radiation detection system using the radiation detection device according to the above-described embodiments.

[0024] Fig. Figure 6 is a conceptual view of the radiation detection system using a transportable radiation detection device capable of capturing images of moving / still objects. Fig. 6, reference numeral 115 denotes a display capable of displaying an image signal acquired by the radiation detection device 100 according to the embodiment, and reference numeral 903 denotes a bed for placing a test object 904. Reference numeral 902 denotes a carriage consisting of a radiation generation device 110, the radiation detection device 100, and a C-type arm 901, which allows them to move; and reference numeral 905 denotes a movable control device having a structure that allows them to be controlled. The C-type arm 901 holds the radiation generation device 110 and the radiation detection device 100. The control device 905 has a control computer 108, a control panel 114, and a radiation controller 109. An image signal acquired by the radiation detection device 100 can be subjected to image processing, and, for example,to the display device 115. Image data generated by the image processing by the control device 905 can be sent to a remote location through a transmission means such as a telephone line. This makes it possible for a doctor at the remote location to diagnose an image based on the transmitted image data. It is possible to record the transmitted data image on a film or to store the transmitted data image on a storage means such as an optical disk. However, it is possible to configure the radiation detection device 100 so that it can be removed from the C-type arm 901 and use a radiation generation device different from the radiation generation device 110 on the C-type arm 901 to capture images.

[0025] Examples employing specific materials are described below. With respect to the examples, the results of lifetime tests described below were good. The lifetime tests are tests to confirm images by applying radiation to radiation detection devices after vibrating scintillators 120 at a predetermined frequency and a gravitational acceleration of 2G, designed to be directed downward. (EXAMPLE 1)

[0026] For each sensor substrate 112, a monocrystalline silicon substrate with a thickness of 500 µm and a plurality of photodiodes arranged in an array on a first surface 112a is used. The scintillator 120 has an Al base 121 with a thickness of 300 µm, a CsI:Tl scintillator layer 122 with a thickness of 800 µm, and a polyparaxylylene scintillator protective layer 123 with a thickness of 25 µm. Each sensor substrate 112 is attached to a base 11, which is a glass substrate with a thickness of 1.8 mm, by a fixing member 113 employing an expanding and contracting material 161, which is a polyolefin-based foam with a thickness of 1.5 mm. An adhesive member 130 having a thickness of 25 µm and using an acrylic resin is provided between the scintillator 120 and the first surfaces 112a of the plurality of sensor substrates 112. As shown in Fig. 2(b), by pressing the adhesive member 130 with a pressure of 1.4 MPa using the rotatable roller 150, the adhesive member 130 adheres to locations on side surfaces 112c of the sensor substrates 112 that are 5 µm away from the first surface 112a. (EXAMPLE 2)

[0027] Sensor substrates 112, the scintillator 120, and a fixing member 133 similar to those of Example 1 are used. An adhesive member having a thickness of 25 µm and using a hot-melt resin whose main component is ethylene-methacrylic acid ester copolymer is provided between the scintillator 120 and first surfaces 112a of the plurality of sensor substrates 112. As shown in Fig. 2(c), using the printing structure 151 heated to a temperature of 100 to 120°C, the adhesive member 130 is pressed at a pressure of 0.4 MPa so that the adhesive member 130 adheres to locations on side surfaces 112c of the sensor substrates 112 that are 50 µm away from the first surface 112a. (EXAMPLE 3)

[0028] The scintillator 120, an adhesive element 130 and a fixing element 113 similar to those of Example 1 are used. As can be seen from Fig. As can be seen from Fig. 3, the sensor substrates 112 are the same as the sensor substrates 112 according to Example 1, except that the sensor substrates 112 have a third surface 112d formed as a result of removing corners from a first surface by removing 5 μm from one end of the corresponding first surface. As in Example 1, by using the rotary roller 150, the adhesive member 130 is pressed with a pressure of 0.4 MPa, so that the adhesive member 130 adheres to locations on side surfaces 112c of the sensor substrates 112 that are 7 μm away from the first surfaces 112a. (EXAMPLE 4)

[0029] The scintillator 120, an adhesive element 130 and a fixing element 113 similar to those of Example 1 are used. As shown in Fig.As can be seen from Fig. 4(b), the sensor substrates 112 are the same as the sensor substrates 112 according to Example 1, except that the sensor substrates 112 are inclined to inner sides of the sensor substrates 112 at the angle D of 1 degree. As in Example 1, by using the rotatable roller 150, the adhesive member 130 is pressed at a pressure of 0.4 MPa so that the adhesive member 130 adheres to locations on side surfaces 112c of the sensor substrates 112 that are 4 µm away from the first surfaces 112a.

[0030] The present invention is not limited to the embodiments described above. Various changes and modifications are possible without departing from the spirit and scope of the present invention. Therefore, the following claims are appended to clarify the scope of the present invention.

[0031] This application is based on and claims priority from Japanese Patent Application No. 2013-258139, filed on December 13, 2013, which is hereby incorporated in its entirety.

Claims

[1] Radiation detection device (100) comprising: a plurality of sensor substrates (112) provided adjacent to each other, each sensor substrate having a first surface (112a) where a plurality of photoelectric conversion elements are arranged in an array, a second surface (112b) opposite to the first surface (112a), and a side surface connecting the first surface (112a) and the second surface (112b); a scintillator (120) provided on one side of the first surfaces of the plurality of sensor substrates (112); a sheet-like adhesive element (130) for adhering the plurality of sensor substrates (112) and the scintillator (120) to each other, a base supporting the plurality of sensor substrates (112); and a fastening element (113) for fastening the plurality of sensor substrates (112) to the base, wherein the sheet-like adhesive element (130) adheres between the plurality of sensor substrates (112) on the first surfaces (112a) and at least portions of the side surfaces such that the sheet-like adhesive element (130) extends from the first surfaces (112a) to at least portions of the side surfaces and adheres continuously, characterized by , that a stiffness of the fastening element (113) is lower than a stiffness of the adhesive element (130). [2] The radiation detection device (100) according to claim 1, wherein, among the plurality of sensor substrates (112), at least one of the plurality of sensor substrates (112) has a third surface that is not parallel to the first surface (112a) and the side surface and that is provided between the first surface (112a) and the side surface, and wherein, between the plurality of sensor substrates (112), the sheet-like adhesive member (130) extends and continuously adheres from the first surface (112a) to the third surface and the at least a portion of the side surface. [3] The radiation detecting device (100) according to either claim 1 or claim 2, wherein, among the plurality of sensor substrates (112), the side surface of at least one of the plurality of sensor substrates (112) is inclined toward an inner side of the at least one of the sensor substrates (112) from the first surface (112a) to the second surface (112b) with respect to a perpendicular line perpendicular to the first surface (112a). [4] The radiation detection device (100) according to any one of claims 1 to 3, wherein each of the plurality of sensor substrates (112) further has a monitor ring provided on at least a portion of the first surface (112a) along edges of the plurality of photoelectric conversion elements, a passivation film covering a portion of the monitor ring and the plurality of photoelectric conversion elements, and a protective layer covering the passivation film except for an end portion of the passivation film, and wherein, between the plurality of sensor substrates (112), the sheet-like adhesive member (130) extends on and continuously adheres to the protective layers, the passivation films, the monitor rings, the first surfaces (112a), and at least portions of the side surfaces. [5] Radiation detection system with: the radiation detection device (100) according to one of claims 1 to 4; and a display device that displays an image based on a signal obtained by the radiation detection device (100). [6] A method of manufacturing a radiation detection device (100), comprising: a fixing step of fixing a plurality of sensor substrates (112) to a base with a sheet-like fixing member (113), wherein the plurality of sensor substrates (112) are provided adjacent to each other, and each sensor substrate has a first surface (112a) where a plurality of photoelectric conversion elements are arranged in an array, a second surface (112b) opposite to the first surface (112a), and a side surface connecting the first surface (112a) and the second surface (112b) to each other; wherein the sheet-like fixing member (113) is provided between the second surfaces of the plurality of sensor substrates (112) and extends continuously from a second surface (112b) of a first sensor substrate of the plurality of sensor substrates (112) to a second surface (112b) of a second sensor substrate different from the first sensor substrate; a providing step of providing a scintillator (120) using a sheet-like adhesive member (130) on one side of the first surfaces (112a) of a plurality of the sensor substrates (112) attached to the base in the attaching step, wherein a stiffness of the sheet-like fastening element (113) is smaller than a stiffness of the sheet-like adhesive element (130); and an adhesion step of causing the sheet-like adhesive member (130) to extend from the first surfaces (112a) to at least portions of the side surfaces between the plurality of sensor substrates (112) and to continuously adhere thereto by pressing a region of the scintillator (120) corresponding to a region between the plurality of sensor substrates (112) from a side of the scintillator (120) opposite the plurality of sensor substrates (112). [7] A method of manufacturing the radiation detection device (100) according to claim 6, wherein the sheet-like fastening element (113) is formed by placing an elastic material (161) between adhesive materials, wherein between the plurality of sensor substrates (112), at least one of the plurality of sensor substrates (112) has a third surface which is not parallel to the first surface (112a) and to the side surface and which is provided between the first surface (112a) and the side surface, and wherein the adhering step comprises causing the sheet-like adhesive member (130) to extend from the first surface (112a) to the third surface and the at least a portion of the side surface between the plurality of sensor substrates (112) and to continuously adhere thereto. [8] A method of manufacturing the radiation detecting device (100) according to either claim 6 or claim 7, wherein, among the plurality of sensor substrates (112), the side surface of at least one of the plurality of sensor substrates (112) is inclined toward an inner side of the at least one of the sensor substrates (112) from the first surface (112a) to the second surface (112b) with respect to a perpendicular line perpendicular to the first surface (112a). [9] The method of manufacturing the radiation detection device (100) according to any one of claims 6 to 8, wherein each of the plurality of sensor substrates (112) further has a monitor ring provided on at least a portion of the first surface (112a) along edges of the plurality of photoelectric conversion elements, a passivation film covering a portion of the monitor ring and the plurality of photoelectric conversion elements, and a protective layer covering the passivation film except for the end portion of the passivation film, and wherein the adhering step comprises causing the sheet-like adhesive member (130) to extend to and continuously adhere to the protective layers, the passivation films, the monitor rings, the first surfaces (112a), and at least portions of the side surfaces between the plurality of sensor substrates (112). [10] A method of manufacturing the radiation detecting device (100) according to any one of claims 7 to 9, wherein the adhering step comprises pressing a region corresponding to a region between the plurality of sensor substrates (112) from the side opposite to the plurality of sensor substrates (112) using a roller. [11] Radiation detection device (100) comprising: a plurality of sensor substrates (112) provided adjacent to each other and fixed to a base with a sheet-like fixing member (113), each sensor substrate having a first surface (112a) where a plurality of photoelectric conversion elements are arranged in an array, a second surface (112b) opposite to the first surface (112a), and a side surface connecting the first surface (112a) and the second surface (112b) to each other; a scintillator (120) provided on one side of the first surfaces (112a) of the plurality of sensor substrates (112); a sheet-like adhesive element (130) for adhering the plurality of sensor substrates (112) and the scintillator (120) to each other, wherein each of the plurality of sensor substrates (112) further has a monitor ring provided on at least a portion of the first surface (112a) along edges of the plurality of photoelectric conversion elements, a passivation film covering a portion of the monitor ring and the plurality of photoelectric conversion elements, and a protective layer covering the passivation film except for an end portion of the passivation film, and wherein between the plurality of sensor substrates (112), the sheet-like adhesive element (130) extends on the protective layers, the passivation films, the monitoring rings, the first surfaces (112a) and the at least portions of the side surfaces and adheres continuously thereto, characterized by , that a stiffness of the sheet-like fastening element (113) is smaller than a stiffness of the sheet-like adhesive element (130). [12] Radiation detection device (100) according to claim 11, wherein the sheet-like fastening element (113) is formed by placing an elastic material between adhesive materials, wherein between the plurality of sensor substrates (112), at least one of the plurality of sensor substrates (112) has a third surface which is not parallel to the first surface (112a) and to the side surface and which is provided between the first surface (112a) and the side surface, and wherein the sheet-like adhesive element (130) extends from the first surface (112a) to the third surface and the at least a portion of the side surface between the plurality of sensor substrates (112) and adheres continuously. [13] The radiation detection device (100) according to claim 11, wherein, among the plurality of sensor substrates (112), the side surface of at least one of the plurality of sensor substrates (112) is inclined toward an inner side of the at least one of the sensor substrates (112) from the first surface (112a) to the second surface (112b) with respect to a perpendicular line perpendicular to the first surface (112a). [14] Radiation detection system with: the radiation detection device (100) according to claim 13; and a display device that displays an image based on a signal obtained by the radiation detection device (100). [15] A method of manufacturing a radiation detection device (100), comprising: a fixing step of fixing a plurality of sensor substrates (112) to a base with a sheet-like fixing member (113), wherein the plurality of sensor substrates (112) are provided adjacent to each other, and each sensor substrate has a first surface (112a) where a plurality of photoelectric conversion elements are arranged in an array, a second surface (112b) opposite to the first surface (112a), and a side surface connecting the first surface (112a) and the second surface (112b) to each other; wherein the sheet-like fixing member (113) is provided between the second surfaces (112b) of the plurality of sensor substrates (112) and extends continuously from a second surface of a first sensor substrate of the plurality of sensor substrates (112) to a second surface (112b) of a second sensor substrate different from the first sensor substrate; a providing step of providing a scintillator (120) using a sheet-like adhesive member (130) on one side of the first surfaces of a plurality of the sensor substrates (112) attached to the base in the attaching step, wherein a stiffness of the sheet-like fastening element (113) is smaller than a stiffness of the sheet-like adhesive element (130); and an adhesion step of causing the sheet-like adhesive element (130) to extend from the first surfaces (112a) to at least portions of the side surfaces between the plurality of sensor substrates (112) and to continuously adhere thereto by pressing a region of the scintillator (120) corresponding to a region between the plurality of sensor substrates (112) from a side of the scintillator (120) opposite the plurality of sensor substrates (112), wherein each of the plurality of sensor substrates (112) further has a monitor ring provided on at least a portion of the first surface (112a) along edges of the plurality of photoelectric conversion elements, a passivation film covering a portion of the monitor ring and the plurality of photoelectric conversion elements, and a protective layer covering the passivation film except for an end portion of the passivation film, and wherein the adhering step comprises causing the sheet-like adhesive member (130) to extend between and continuously adhere to the plurality of sensor substrates (112) on the protective layers, the passivation films, the monitoring rings, the first surfaces (112a), and the at least portions of the side surfaces. [16] A method of manufacturing a radiation detection device (100) according to claim 15, wherein between the plurality of sensor substrates (112), at least one of the plurality of sensor substrates (112) has a third surface which is not parallel to the first surface (112a) and to the side surface and which is provided between the first surface (112a) and the side surface, and wherein the adhering step comprises causing the sheet-like adhesive member (130) to extend from the first surface (112a) to the third surface and the at least a portion of the side surface between the plurality of sensor substrates (112) and to continuously adhere thereto. [17] A method for manufacturing a radiation detection device (100) according to claim 15, wherein, between the plurality of sensor substrates (112), the side surface of at least one of the plurality of sensor substrates (112) is inclined to an inner side of the at least one of the sensor substrates (112) from the first surface (112a) to the second surface (112b) with respect to a perpendicular line perpendicular to the first surface (112a). [18] A method of manufacturing a radiation detecting device (100) according to claim 15, wherein the adhering step comprises pressing a region corresponding to a region between the plurality of sensor substrates (112) from the side opposite to the plurality of sensor substrates (112) using a roller.

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