Apparatus and method for implementing the correction of predicted systematic errors in position-specific machining

Abstract

A method for modifying an upper layer of a workpiece (152, 252) using a gas cluster ion beam, GCIB, comprising the following steps: Acquiring parameter data relating to an upper layer of a workpiece (152, 252), the parameter data comprising an initial profile of a measured attribute of the upper layer and at least one n-th order derivative of a spatial change of the measured attribute, where n is an integer greater than zero; determining a predicted systematic error response for applying a GCIB (128, 128A) to the upper layer to change the initial profile of the measured attribute using the parameter data comprising the at least one n-th order derivative as input to a predetermined predictive model; Identifying a target profile of the measured attribute; Directing a gas cluster ion beam, GCIB (128, 128A), to the upper layer of the workpiece (152, 252) and spatially modulating an applied property of the GCIB (128, 128A) based, at least in part, on the predicted systematic error response and the parameter data as a function of position on the upper layer of the workpiece (152, 252) to achieve the target profile of the measured attribute.

Description

Field of the invention

[0001] The field of the invention relates generally to the fields of materials processing and fabrication of semiconductor integrated circuits and particularly, but not exclusively, to the correction of systematic errors or non-uniformities by position-specific processing using GCIB (gas cluster ion beam) technology. Background of the invention

[0002] Gas cluster ion beam (GCIB) technology has proven to be a convenient processing method for modifying, etching, cleaning, smoothing, and fabricating thin films on workpieces, including microelectronic components. For the purposes of this discussion, gas clusters are nanomaterial aggregates that are gaseous under normal temperature and pressure conditions. These gas clusters can form from the condensation of individual gas atoms (or molecules) during the adiabatic expansion of high-pressure gas from a nozzle into a vacuum. They can consist of aggregates ranging from a few to several thousand atoms / molecules or more, loosely bound together by weak interatomic forces known as van der Waals forces.The gas clusters can be ionized by electron bombardment, so that they can be accelerated by an electric field to produce directed beams with controllable beam energy.

[0003] Irradiating a workpiece with a directed GCIB with controllable energy can be used to process the workpiece with a dose specific to its position on the workpiece. This process is often referred to as location-specific processing (LSP), where the treatment dose or dwell time of the GCIB across the workpiece is varied by adjusting the scanning speed. Therefore, one position on the workpiece can be processed differently than another.

[0004] There are several emerging applications for industrial-scale GCIB processing of workpieces for the fabrication of semiconductor or microelectronic devices. Currently, with the continuous shrinkage of dimensions in advanced complementary metal oxide semiconductor (CMOS) logic, the requirements for controlling dimensional variability are increasing. For several technology nodes, sophisticated control using variable lithographic exposure across the wafer has been applied to facilitate the control of critical dimensions in the wafer plane. Up to the 22 nm node, the most critical dimensions in the vertical dimension were well controllable with only a single deposition or oxidation step.However, with the implementation of RMG (replacement metal gate) and FinFET (fin field-effect transistor) structures, some critical dimensions, such as fin and gate height, are influenced by a combination of deposition, CMP (chemical mechanical planarization), and etching steps, requiring a new strategy for precision control of feature height. Gas cluster ion beam (GCIB) technology enables precise correction of feature height non-uniformity using LSP algorithms.

[0005] In addition to correcting the non-uniformity present on the workpiece, the implementation of GCIB machining must also correct errors caused by system- and / or device-specific process anomalies that repeatedly affect the output process parameters of a GCIB device. To improve the LSP correction capability, the systematic error for the GCIB machining system must be determined using sacrificial workpieces, which is costly and time-consuming.

[0006] US 2009 / 0084759 A1 discloses a method and a system for site-specific processing of a substrate. The method comprises acquiring measurement data for a substrate and calculating correction data for adjusting a first region of the measurement data on the substrate. A first gas cluster ion beam (GCIB) is then configured to treat the high-gradient regions, and the first GCIB is applied to the substrate according to the correction data. The method optionally further comprises acquiring second measurement data after applying the first GCIB and calculating second correction data for adjusting a second region of the measurement data, or the second measurement data, or both, on the substrate. A second gas cluster ion beam (GCIB) is then configured to treat the second region, and the second GCIB is applied to the substrate according to the second correction data.Further prior art is known from US 2008 / 0237492 A1, WO 2009 / 145798 A2 and US 2002 / 0014407 A1. Brief description of the invention

[0007] The invention is defined in the claims. Embodiments of the invention generally relate to the fields of materials processing and the manufacture of semiconductor integrated circuits, and particularly, but not exclusively, relate to the correction of systematic errors or non-uniformities by position-specific machining using gas cluster ion beam (GCIB) technology. In particular, a prediction method is applied to account for the systematic error when performing position-specific GCIB machining.

[0008] In one embodiment, a method for modifying a top layer of a workpiece using a gas cluster ion beam (GCIB) is described. The method includes acquiring parameter data related to a top layer of a workpiece and determining a predicted bias response for applying a GCIB to the top layer to change an initial profile of a measured attribute using the parameter data. The method also includes identifying a target profile of the measured attribute, thereby directing the GCIB to the top layer of the workpiece, and spatially modulating an applied property of the GCIB—based at least in part on the predicted bias response and the parameter data—as a function of position on the top layer of the workpiece to achieve the target profile of the measured attribute. Short description of the drawings Fig. 1 is a flowchart illustrating a method for machining a workpiece according to an embodiment. Fig. 2 shows an exemplary profile of a measured attribute according to one embodiment. The Fig. 3A through 3C graphically depict example data associated with creating a predetermined predictive model for relating parameter data to a predicted systematic error response, according to one embodiment. Fig. 4 graphically illustrates example data for correcting a GCIB process using a predicted systematic error response according to one embodiment. Fig. Figure 5 is an illustration of a GCIB processing system. Fig. Figure 6 is another illustration of a GCIB processing system. Fig. Figure 7 is yet another illustration of a GCIB processing system. Fig. Figure 8 is an illustration of an ionization source for a GCIB processing system. Fig. Figure 9 is an illustration of another ionization source for a GCIB processing system. Detailed description of various embodiments

[0009] Methods and systems for performing position-specific machining (LSP) of a workpiece using GCIB technology are described below in various embodiments. One skilled in the art will recognize that the various embodiments may be practiced without one or more of the specific details, or with other substitute and / or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of various embodiments of the invention. Likewise, for purposes of explanation, specific numerals, materials, and configurations are set forth in order to provide a more thorough understanding of the invention. However, the invention may be practiced without specific details.Furthermore, it is clear that the various embodiments shown in the figures are only illustrative representations and are not necessarily drawn to scale.

[0010] Throughout the specification, reference to "one embodiment" or "an embodiment" means that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention, but does not imply that it will be present in every embodiment. Thus, the appearances of the phrase "in one embodiment" in various places throughout the specification are not necessarily referring to the same embodiment of the invention. Moreover, the specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments. Various other layers and / or structures may be included in other embodiments, and / or described features may be omitted from other embodiments.

[0011] The term "workpiece" as used herein generally refers to the object being machined. The workpiece may be a material part or a structure of a component, in particular a semiconductor or other electronic component, and may, for example, be a workpiece base structure, such as a semiconductor wafer, or a layer on or above a workpiece base structure, such as a thin film. The workpiece is therefore not intended to be limited to a specific base structure, underlying layer or overlying layer, structured or unstructured, but is intended to include such a layer or base structure and a combination of layers and / or base structures. The following description may reference specific types of workpieces, but this is for illustrative purposes only and is not intended to be limiting.

[0012] As partially explained above, when correcting the non-uniformity present on a workpiece through the implementation of GCIB machining, errors caused by system- and / or device-specific process anomalies that repeatedly affect the output process parameters of a GCIB device must also be corrected. To improve the LSP correction capability, various embodiments employ a predictive method to account for the systematic error in position-specific GCIB machining.

[0013] Therefore, various embodiments of methods for position-specific machining (LSP) of a workpiece using a gas cluster ion beam (GCIB) with enhanced correction capability are described. Turning now to the drawings, in which like reference symbols designate corresponding parts throughout the several views. Fig. 1 provides a flowchart 1 illustrating a method for modifying a top layer of a workpiece using GCIB processing according to one embodiment.

[0014] The method illustrated in flowchart 1 begins in step 10 with the acquisition of parameter data relating to a top layer of a workpiece. The parameter data includes an initial profile of a measured attribute of the top layer and at least one n-order derivative of the spatial variation of the measured attribute, where n is an integer greater than zero. The parameter data may be geometric, mechanical, electrical, and / or optical parameters associated with the workpiece, a layer or sublayer fabricated on the workpiece, and / or a portion of a device on the workpiece. For example, measurement data may include any parameter that can be measured using measurement systems described below.Furthermore, the measured attribute may be, for example, a layer thickness, a surface and / or interface roughness, a surface contamination, a structure depth, a trench depth, a via depth, a structure width, a trench width, a via width, a critical dimension (CD) or an electrical resistance, or a combination of two or more thereof.

[0015] As an example, Fig. 2 a spatial map of an exemplary profile of a measured attribute, where the calculated mean has been subtracted from the spatial map to create thicker layer regions (denoted by a "+" sign) and thinner layer regions (denoted by a "-" sign). The attribute to be measured is measured at various positions on the workpiece, and a spatial map of the layer thickness for the upper layer on the workpiece is created. In this example, which is shown in Fig. As shown in Figure 2, the spatial mapping of the film thickness was determined by spectroscopic ellipsometry using a commercially available thin film measuring instrument type UV-1280SE, manufactured by KLA-Tencor Corporation.

[0016] The parameter data, including the measured attribute, can be acquired in situ or ex situ using a metrology system connected to a GCIB machining system. The metrology system can include various workpiece diagnostic systems, including geometric, mechanical, optical, and / or electrical test / measurement systems. The metrology system can include, for example, digital optical profilometry (ODP), scatterometry, ellipsometry, reflectometry, interferometry, X-ray fluorescence spectroscopy, scanning electron microscopy (SEM), tunneling electron microscopy (TEM), atomic force microscopy (AFM), or four-point probe scanning, or a combination of two or more of these.

[0017] The measurement system can be, for example, an optical scattered radiation measurement system. The scattered radiation measurement system can be a scattered radiation meter that uses ray profile ellipsometry (ellipsometer) and ray profile reflectometry (reflectometer) and is available from Therma-Wave, Inc. (1250 Reliance Way, Fremont, CA 94539) or from Nanometrics, Inc. (1550 Buckeye Drive, Milpitas, CA 95035). In addition, the in-situ measurement system can have, for example, an iODP (integrated digital optical profilometry) scattered radiation measurement module configured to acquire measurement data on the workpiece.

[0018] The parameter data may be measured at two or more positions on the workpiece. Furthermore, this data may be acquired and collected for one or more workpieces. The one or more workpieces may, for example, comprise a workpiece cassette. The parameter data is measured at two or more positions on at least one of the one or more workpieces and may, for example, be acquired at a plurality of positions on each of the one or more workpieces. Subsequently, the plurality of positions on each of the plurality of workpieces may be extended from measured locations to unmeasured locations using a data fitting algorithm. The data fitting algorithm may, for example, comprise interpolation (linear or non-linear) or extrapolation (linear or non-linear), or a combination thereof.

[0019] After the parameter data for the one or more workpieces has been acquired using the measuring system, it is provided to a controller for calculating correction data. The parameter data can be transferred between the measuring system and the controller via a physical connection (e.g., a cable) or a wireless connection, or a combination thereof. Furthermore, the parameter data can also be transferred via an intranet or internet connection. Alternatively, the parameter data can be transferred between the measuring system and the controller via a machine-readable medium.

[0020] The at least one n-th-order derivative of a spatial change in the measured attribute may be a first derivative of a spatial change in the measured attribute on the workpiece. The first derivative, or spatial gradient, represents the rate of change or spatial change of the measured attribute across the workpiece. For example, the first derivative indicates whether the measured attribute changes only slightly or more significantly across the workpiece at a given position on the workpiece.

[0021] Furthermore, the at least one n-th-order derivative of a spatial change in the measured attribute may comprise a second derivative of a spatial change in the measured attribute on the workpiece. The second derivative, or spatial curvature, represents the rate of change or spatial change of the gradient of the measured attribute across the workpiece. For example, the second derivative indicates the degree of concavity or convexity of the measured attribute at a given location on the workpiece.

[0022] The at least one n-order derivative of a spatial change in the measured attribute may be measured and / or calculated at multiple positions on the workpiece, which may or may not correspond to positions where the attribute to be measured is measured. As an example, the at least one n-order derivative of a spatial change in the measured attribute is calculated at each position where the measured upper-layer attribute is acquired using an interpolation algorithm or a data fitting algorithm, or a combination thereof. For example, the at least one n-order derivative of a spatial change in the measured attribute may be determined using a finite difference scheme.

[0023] In step 11, a predicted systematic error response for applying a GCIB to the upper layer to change the initial profile of the measured attribute is determined using the parameter data, including the at least one n-order derivative, as input to a predetermined predictive model. The predetermined predictive model is established by performing the following steps: (I) measuring representative parameter data comprising a representative initial profile of a representative attribute of an upper layer on one or more representative workpieces and at least one n-order derivative of a spatial change of the representative attribute, where n is an integer greater than zero; (II) establishing a representative target profile; (III) calculating representative correction data using the representative initial profile and the representative target profile for the representative attribute;(IV) Using the representative correction data for the workpiece by spatially modulating an applied dose of a representative GCIB; (V) comparing an actual representative profile with the representative target profile to determine a representative systematic error; and (VI) correlating the representative systematic error with the representative parameter data.

[0024] Correlating the representative systematic error with the representative parameter data may involve using a least squares method for the representative parameter data and the representative systematic error, and formulating a functional relationship between the representative parameter data and the representative systematic error that minimizes the sum of the squared errors introduced by the functional relationship. The error approximation may involve a second-order model that correlates measured attribute data, first derivative data, and second derivative data with the error as follows: E^=A+B*Z+C*dZ / dx+D*d2Z / dx2+E*dZ / dy+F*d2Z / dy2+G*Z2+H*(dZ / dx)2+I*(dZ / dx)2+J*Z*dZ / dx+K*Z*dZ / dy+L*dZ / dx*dZ / dy, where Z represents the measured attribute data, dZ / dx and dZ / dy represent the first derivative (gradient) of the measured attribute in the X and Y directions (for example, perpendicular directions in the plane of the workpiece), d 2 Z / dx 2 and d 2 Z / dy 2 represent the second derivative (curvature) of the measured attribute in the X and Y directions, and A, B, C, D, E, F, G, H, I, J, K, and L are the coefficients determined for the error model using the least squares method. Alternatively, a simplified error approximation can include a first-order model that correlates measured attribute data and first derivative data with the error as follows: E^=A+B*Z+C*dZ / dx+E*dZ / dy.

[0025] As an example, the Fig. 3A to 3C graphically depict exemplary data associated with the construction of a predetermined predictive model for relating parameter data to a predicted systematic error response. Fig. Figure 3A plots the predicted bias using the predetermined forecast model versus the actual bias, i.e., target profile minus actual profile. If the data fit a linear approximation, including a least-squares fit, the slope is expected to be equal to one. Using the second-order error model [equation (1) using the first and second derivative data], the slope was found to be greater than 0.9, and using the first-order error model [equation (2) using the first derivative data], the slope was found to be approximately 0.9.

[0026] Fig. Figure 3B graphically illustrates the difference in actual systematic error versus predicted systematic error as a function of position on a representative workpiece. Fig. Figure 3C represents the error in error prediction, i.e., the difference between the actual and the predicted error, as a function of the predicted systematic error. The inventors have found that the error in error prediction can be represented within the limits set at approximately 25% of the predicted or actual error.

[0027] In step 12, a target profile of the measured attribute to be achieved is identified. The target profile may include an amount to be removed (e.g., etching amount) or an amount to be added (e.g., deposition, growth, or doping amount) to achieve the target profile from the initial profile.

[0028] In step 13, a gas cluster ion beam (GCIB) is directed to the upper layer of the workpiece. The GCIB can be used to perform an etching process, a deposition process, a growth process, a smoothing process, a doping process, a modification process, or a combination of two or more of these to achieve the target profile. The GCIB can be created by maintaining a reduced pressure environment around a workpiece holder for holding the workpiece in a GCIB processing system. The workpiece can be a microelectronic workpiece. The GCIB processing system can be one of the GCIB processing systems (50, 100, 100', or 100") described below in Fig. 5, Fig. 6, Fig. 7 or Fig. 8, or a combination thereof.

[0029] In step 14, an applied property of the GCIB is spatially adjusted—based at least in part on the predicted systematic error response and the parameter data—as a function of the position on the upper layer of the workpiece to achieve the target profile of the measured attribute. The applied property of the GCIB may be a beam dose. Alternatively, the applied property of the GCIB may be a beam dose, a beam area, a beam profile, a beam intensity, a beam scan speed, or a dwell time, or a combination of two or more thereof.

[0030] Subsequently, the steps of detecting, determining, identifying, steering, or spatially fitting, or a combination of two or more thereof, may be repeated to further reduce the difference between the target profile and an actual profile of the measured attribute. In addition, parameter data acquired from an upper layer of a workpiece that has been modified with a GCIB to achieve a target profile using a predictive error model may be applied to modify the existing (predetermined) predictive error model to adapt to changes in incoming workpieces. For example, parameters or coefficients of the predictive error model [ie, the coefficients determined for equation (1) or (2)] may require adjustment from workpiece to workpiece or from batch to batch if there are significant overall changes in the target profile, the difference between the actual and target profile, the uniformity of the actual profile, or the difference between the actual and target profile, etc. The adjustment of the parameters or coefficients may be weighted. For example, an updated parameter or coefficient may be the sum of an old value component and a new value component, e.g., BA updated = w · A new + (1 - w) · A old , where A is a coefficient being updated and w is a weight factor.

[0031] Correction data is calculated for position-specific machining of the workpiece. In particular, the correction data may be calculated using the initial profile and the target profile for the measured attribute. The correction data for a given workpiece may include a process condition for modulating a GCIB property, such as the GCIB dose, as a function of position on the workpiece to effect a change between the parameter data associated with the incoming initial profile and the target profile for the given workpiece. The correction data for a given workpiece may include, for example, specifying a process condition for using the GCIB to correct a non-uniformity in the parameter data for the given workpiece.Alternatively, the correction data for a given workpiece may include, for example, specifying a process condition for using the GCIB to produce a specifically intended non-uniformity in the parameter data for a given workpiece.

[0032] Using a specified relationship between the desired change in parameter data and the GCIB dose, and a specified relationship between the GCIB dose and a GCIB process condition that has a group of GCIB machining parameters, the controller determines correction data for each workpiece. For example, a mathematical algorithm can be applied to take parameter data associated with the incoming initial profile, calculate a difference between the incoming initial profile of the parameter data and the target profile of the parameter data, invert a GCIB machining pattern (i.e., an etch pattern, a layer fabrication / deposition pattern, etc.) to match this difference, and generate a beam dose contour to achieve the GCIB machining pattern using the relationship between the change in parameter data and the GCIB dose.Subsequently, for example, GCIB processing parameters can be set to influence the calculated beam dose contour using the relationship between the beam dose and the GCIB process condition. As described in more detail later, the GCIB processing parameters can be a beam dose, a beam area, a beam profile, a beam intensity, a beam scan speed, or an exposure time (or beam dwell time), or a combination of two or more of these.

[0033] In this embodiment, many different approaches to selecting the mathematical algorithm can be successfully applied. In another embodiment, the beam dose contour can be used to selectively deposit additional material to achieve the desired change in the parameter data.

[0034] The correction data can be combined with the predicted systematic error response to generate correction data with a corrected predicted systematic error. The correction data with the corrected predicted systematic error can then be applied to the workpiece using a GCIB and by spatially modulating, for example, the applied dose.

[0035] The correction data can be applied to the workpiece using a GCIB. During corrective processing, the GCIB can be configured to perform at least one of the following steps: smoothing, amorphizing, modifying, doping, etching, growing, or depositing, or a combination of two or more of these. By using the correction data for the workpiece, defects in the workpiece, the surface planarity of the workpiece, or the layer thickness can be more easily corrected, or layer adhesion can be improved. After processing to the GCIB specifications, the uniformity of the workpiece(s) or the distribution of the parameter data for the workpiece(s) can be checked either in situ or ex situ, and the process can be terminated or refined as necessary.

[0036] When performing an etching process, for example, the GCIB can be generated from a pressurized gas mixture containing at least one etching gas. The at least one etching gas can be a halogen element. The at least one etching gas can comprise a halogen element and one or more elements from the group C, H, N, and S. The at least one etching gas can comprise a halogen element and one or more elements from the group Si and Ge.

[0037] The at least one etching gas can be, for example, F2, Cl2, Br2, NF3, or SF6. Furthermore, the at least one etching gas can be, for example, a halide, such as HF, HCl, HBr, or HI. Furthermore, the at least one etching gas can be, for example, a halosilane or halogermane, such as a monosubstituted halosilane or halogermane (SiH3F, GeH3F, etc.), a disubstituted halosilane or halogermane (SiH2F2, GeH2F2, etc.), a trisubstituted halosilane or halogermane (SiHF3, GeHF3, etc.), or a tetrasubstituted halosilane or halogermane (SiF4, GeF4, SiCl4, GeCl4, SiBr4, or GeBr4). In addition, the at least one etching gas may be, for example, a halomethane, such as a monosubstituted halomethane (e.g. CH3F, CH3Cl, CH3Br, CH3I), a doubly substituted halomethane (e.g. CH2F2, CH2ClF, CH2BrF, CH2Fl, CH2Cl2, CH2BrCl, CH2ClI, CH2Br2, CH2BrI, CH2I2), a trisubstituted halomethane (e.g.CHF3, CHClF2, CHBrF2, CHF2I, CHCl2F, CHBrClF, CHClFI, CHBr2F, CHBrFI, CHFI2, CHCl3, CHBrCl2, CHCl2I, CHBr2Cl, CHBrClI, CHClI2, CHBr3, CHBr2I, CHBrI2, CHI3) or a four-substituted halomethane (e.g. CF4, CClF3, CBrF3, CF3I, CCl2F2, CBrClF2, CClF2I, CBr2F2, CBrF2I, CF2I2, CCl3F, CBrCl2F, CCl2FI, CBr2ClF, CBrClFI, CClFI2, CBr3F, CBr2FI, CBrFI2, CFI3, CCl4, CBrCl3, CCl3I, CBr2Cl2, CBrCl2I, CCl2I2, CBr3Cl, CBr2ClI, CBrClI2, CClI3, CBr4, CBr3I, CBr2I2, CBrI3, Cl4).

[0038] To generate the GCIB, the components of the etching gas should be selected so that they are present in a gas phase, either individually or in combination with a carrier gas (e.g., a noble gas element or nitrogen) at a relatively high pressure (e.g., a pressure of one atmosphere or more).

[0039] In one embodiment, when etching a Si- and / or Ge-containing material, the at least one etching gas comprises a halogen element from the group F, Cl, and Br. The at least one etching gas may further comprise Si, Ge, N, S, C, or H, or C and H. For example, the at least one etching gas may be a halide, halosilane, halogermane, or halomethane. Furthermore, the at least one etching gas may be, for example, SiF4, CHF3, SF6, NF3, F2, Cl2, Br2, HF, HCl, HBr, CClF3, CBrF3, CHClF2, or C2ClF5, or a combination of two or more thereof.

[0040] In another embodiment, when etching a Si- and / or Ge-containing material, the at least one etching gas comprises two different halogen elements. A first halogen element can be selected from the group consisting of Cl and Br, and the second halogen element can be F. The at least one etching gas can further comprise C or H, or C and H. For example, the at least one etching gas can be a halomethane. Furthermore, the at least one etching gas can be, for example, CClF3, CBrF3, CHClF2, or C2ClF5, or a combination of two or more thereof.

[0041] In a further embodiment, when etching a Si-containing material containing Si and one or more elements from the group O, C, N, and Ge, the at least one etching gas comprises a halogen element and one or more elements from the group Si, Ge, N, S, C, and H. The etching gas can be, for example, a halosilane or a halomethane. Furthermore, the etching gas can be, for example, SiF4, CH3F, CH3Cl, CH3Br, CHF3, CHClF2, CHBrF2, CH2F2, CH2ClF, CH2BrF, CHCl2F, CHBr2F, CHCl3, CHBrCl2, CHBr2Cl, or CHBr3, or a combination of two or more thereof.

[0042] In another embodiment, when etching a metal-containing material, the etching gas comprises a halogen element from the group consisting of F, Cl, and Br. The etching gas may, for example, further comprise Si, Ge, N, S, C, or H, or C and H. For example, the etching gas may be a halide, halosilane, halogermane, or halomethane. Furthermore, the etching gas may, for example, be SiF4, CHF3, SF6, NF3, F2, Cl2, Br2, HF, HCl, HBr, CClF3, CBrF3, CHClF2, or C2ClF5, or a combination of two or more thereof.

[0043] In another embodiment, when etching a metal-containing material, the etching gas comprises two different halogen elements. A first halogen element can be selected from the group consisting of Cl and Br, and the second halogen element can be F. The etching gas can further comprise C or H, or C and H. The etching gas can be, for example, a halomethane. Furthermore, the etching gas can be, for example, CClF3, CBrF3, CHClF2, or C2ClF5, or a combination of two or more thereof.

[0044] In yet another embodiment, when etching a chalcogenide material, the etching gas comprises a halogen element. The etching gas may be, for example, a halide, halosilane, halogermane, or halomethane. Furthermore, the etching gas may be, for example, F2, Cl2, Br2, HF, HCl, HBr, NF3, SF6, SiF4, CH3F, CH3Cl, CH3Br, CHF3, CHClF2, CHBrF2, CH2F2, CH2ClF, CH2BrF, CHCl2F, CHBr2F, CHCl3, CHBrCl2, CHBr2Cl, or CHBr3, or a combination of two or more thereof.

[0045] The at least one etching gas may comprise a first etching gas and a second etching gas. In one embodiment, the first etching gas contains Cl or Br, and the second etching gas contains F. For example, the first etching gas may contain Cl2, and the second etching gas may contain NF3. In another embodiment, the first etching gas contains a halomethane or halide, and the second etching gas contains F, Cl, or Br. In another embodiment, the first etching gas contains C, H, and a halogen element, and the second etching gas contains F, Cl, or Br. For example, the first etching gas may contain CHF3, CHCl3, or CHBr3, and the second etching gas may contain SiF4, SF6, NF3, or Cl2. The first etching gas and the second etching gas may be continuously introduced into the GCIB. Alternatively, the first etching gas and the second etching gas may be alternately and sequentially introduced into the GCIB.

[0046] The pressurized gas mixture may further comprise: a compound containing a halogen element; a compound containing F and C; a compound containing H and C; a compound containing C, H, and F; a compound containing Si and F; a compound containing Ge and F; or a combination of two or more thereof. In addition, the pressurized gas mixture may further comprise a chlorine-containing compound, a fluorine-containing compound, or a bromine-containing compound. In addition, the pressurized gas mixture may further comprise a compound containing one or more elements selected from the group consisting of S, N, Si, Ge, C, F, H, Cl, and Br.Furthermore, the pressurized gas mixture may further comprise a silicon-containing compound, a germanium-containing compound, a nitrogen-containing compound, an oxygen-containing compound, or a carbon-containing compound, or a combination of two or more thereof. Furthermore, the pressurized gas mixture may further comprise one or more elements from the group consisting of B, C, H, Si, Ge, N, P, As, O, S, F, Cl, and Br. Furthermore, the pressurized gas mixture may further comprise He, Ne, Ar, Kr, Xe, O2, CO, CO2, N2, NO, NO2, N2O, NH3, F2, HF, SF6, or NF3, or a combination of two or more thereof.

[0047] Furthermore, the GCIB can be generated from a pressurized gas mixture comprising at least one dopant or film-forming component for depositing or growing a thin film, or a combination of two or more thereof. For example, the doping, modification, etching, cleaning, growth, or deposition may include incorporating one or more elements from the group consisting of He, Ne, Ar, Xe, Kr, B, C, Se, Te, Si, Ge, N, P, As, O, S, F, Cl, and Br.

[0048] In a further embodiment, the GCIB can be generated by alternately and sequentially using a first pressurized gas mixture containing an etching gas and a second pressurized gas mixture containing a layer-forming gas. In further embodiments, a composition and / or a back pressure of the GCIB can be adjusted during etching.

[0049] As explained above, one or more GCIB properties of a GCIB process condition for the GCIB can be adjusted to achieve the target profile. To achieve the target profile, the GCIB can be generated by performing the following steps: selecting a beam acceleration potential, one or more beam focusing potentials, and a beam dose; accelerating the GCIB according to the beam acceleration potential; focusing the GCIB according to the one or more beam focusing potentials; and irradiating at least a portion of the workpiece with the accelerated GCIB according to the beam dose.

[0050] In addition to these GCIB properties, the following can be selected: beam energy, beam energy distribution, beam angle distribution, beam divergence angle, back pressure, back temperature, mass flow rate, cluster size, cluster size distribution, beam size, beam composition, beam electrode potential, or gas nozzle configuration (such as nozzle throat diameter, nozzle length, and / or nozzle turn-off half-angle). One or more of the aforementioned GCIB properties can be selected to achieve control of the etching process target dimensions, such as those mentioned above. Furthermore, one or more of the aforementioned GCIB properties can be modified to achieve control of the etching process target dimensions, such as those mentioned above.

[0051] The beam energy distribution function for the GCIB can be modified by directing the respective GCIB along a beam path through a region of increased pressure such that at least a portion of the GCIB traverses the region of increased pressure. The extent of the modification of the beam energy distribution can be characterized by a pressure-distance (d) integral along at least a portion of the beam path. As the value of the pressure-distance integral is increased (either by increasing the pressure and / or the length d of the beam path), the beam energy distribution becomes broader and the peak energy decreases. As the value of the pressure-distance integral is decreased (either by decreasing the pressure and / or the length d of the beam path), the beam energy distribution becomes narrower and the peak energy increases.For example, one can broaden the beam energy distribution to increase beam divergence, or one can narrow the beam energy distribution to decrease beam divergence.

[0052] The pressure-distance integral along at least a portion of the GCIB beam path may be equal to or greater than about 0.0001 Torr-cm. Alternatively, the pressure-distance integral along at least a portion of the GCIB beam path may be equal to or greater than about 0.001 Torr-cm. Further alternatively, the pressure-distance integral along at least a portion of the GCIB beam path may be equal to or greater than about 0.01 Torr-cm. As an example, the pressure-distance integral along at least a portion of the GCIB beam path may be in the range of 0.0001 Torr-cm to 0.01 Torr-cm. As another example, the pressure-distance integral along at least a portion of the GCIB beam path may be in the range of 0.001 Torr-cm to 0.01 Torr-cm.

[0053] Alternatively, the beam energy distribution function for the GCIB can be modified by modifying or changing a charge state of the respective GCIB. For example, the charge state can be modified by adjusting the electron flow, the electron energy, or the electron energy distribution for electrons used in electron impact-induced ionization of gas clusters.

[0054] In one embodiment, the one or more GCIB properties of the GCIB process condition may be the GCIB composition, the beam dose, the beam acceleration potential, the beam focusing potential, the beam energy, the beam energy distribution, the beam angle distribution, the beam divergence angle, the flow rate of the GCIB composition, the stagnation pressure, the stagnation temperature, the background gas pressure for an elevated pressure region through which the GCIB passes, or the background gas flow rate for an elevated pressure region through which the GCIB passes (e.g., a P-cell value, which will be discussed in more detail later).

[0055] In another embodiment, adjusting the one or more GCIB properties to achieve the target profile may include adjusting the GCIB composition, the jet acceleration potential, the flow rate of the GCIB composition, and the background gas flow rate for a region of elevated pressure through which the GCIB passes.

[0056] For the GCIB, the beam acceleration potential can be up to 100 kV, the beam energy can be up to 100 keV, the cluster size can be up to several tens of thousands of atoms, and the beam dose can be up to about 1 × 10 17 Clusters per cm 2For example, the beam acceleration potential of the GCIB may be in the range of about 1 kV to about 70 kV (i.e., the beam energy may be in the range of about 1 keV to about 70 keV, assuming a mean cluster charge state of one). In addition, the beam dose of the GCIB may, for example, be in the range of about 1 × 10 12 Clusters per cm 2 up to about 1 × 10 14 Clusters per cm 2 lay.

[0057] The GCIB can be generated to have an energy per atomic ratio in the range of about 0.25 eV per atom to about 100 eV per atom. Alternatively, the GCIB can be generated to have an energy per atomic ratio in the range of about 0.25 eV per atom to about 10 eV per atom. Alternatively, the GCIB can be generated to have an energy per atomic ratio in the range of about 1 eV per atom to about 10 eV per atom.

[0058] Generating the GCIB with a desired energy per atomic ratio may involve choosing the beam acceleration potential, the stagnation pressure for generating the GCIB, the gas flow rate, or a combination thereof. The beam acceleration potential can be used to increase or decrease the beam energy or the energy per ion cluster. For example, increasing the beam acceleration potential increases the maximum beam energy and thus increases the energy per atomic ratio for a given cluster size. Furthermore, the stagnation pressure can be used to increase or decrease the cluster size for a given cluster. For example, increasing the stagnation pressure during GCIB generation increases the cluster size (i.e., the number of atoms per cluster) and thus decreases the energy per atomic ratio for a given beam acceleration potential.

[0059] Here, the unit of blast dose is specified as the number of clusters per unit area. However, blast dose can also include blast current and / or blast time (e.g., GCIB dwell time). The blast current can be measured and kept constant while changing the time to change the blast dose. Alternatively, for example, the speed at which the clusters impact the workpiece surface per unit area (i.e., the number of clusters per unit area per unit time) can be kept constant while changing the time to change the blast dose.

[0060] The Fig. 1 may further comprise changing the target profile to create one or more new target profiles and adjusting one or more further GCIB properties of a further GCIB process condition such that the GCIB achieves the one or more new etch process target dimensions.

[0061] Now let’s come to Fig. 5, which illustrates a GCIB processing system 100 for processing a workpiece as described above, according to one embodiment. The GCIB processing system 100 includes a vacuum vessel 102, a workpiece holder 150 to which a workpiece 152 to be processed is attached, and vacuum pumping systems 170A, 170B, and 170C. The workpiece 152 may be a semiconductor workpiece, a wafer, a flat panel display (FPD), a liquid crystal display (LCD), or other workpiece. The GCIB processing system 100 is configured to create a GCIB for processing the workpiece 152.

[0062] In the GCIB processing system 100 of Fig. 5, the vacuum vessel 102 includes three interconnected chambers: a source chamber 104, an ionization / acceleration chamber 106, and a processing chamber 108, to provide a reduced-pressure enclosure. The three chambers are each evacuated to a suitable operating pressure using the vacuum pumping system 170A, 170B, and 170C, respectively. Regarding the interconnected chambers 104, 106, and 108, a gas cluster beam can be generated in the first chamber (the source chamber 104), while a GCIB can be generated in the second chamber (the ionization / acceleration chamber 106), where the gas cluster beam is ionized and accelerated. Then, in the third chamber (the processing chamber 108), the accelerated GCIB can be applied to treat the workpiece 152.

[0063] As in Fig. 5, the GCIB processing system 100 may include one or more gas sources configured to introduce one or more gases or gas mixtures into the vacuum vessel 102. For example, a first gas composition stored in a first gas source 111 is supplied via a first gas control valve 113A to one or more gas metering valves 113. In addition, for example, a second gas composition stored in a second gas source 112 is supplied via a second gas control valve 113B to the one or more gas metering valves 113. Furthermore, for example, the first gas composition or the second gas composition, or both, may include a condensable inert gas, carrier gas, or diluent gas. The inert gas, carrier gas, or diluent gas may be, for example, a noble gas, i.e., He, Ne, Ar, Kr, Xe, or Rn.

[0064] Furthermore, the first gas source 111 and the second gas source 112 can be used either individually or in combination to generate ionized gas clusters. The material composition can include the main atomic or molecular types of the elements that are intended to react with or be incorporated into the material layer.

[0065] The high-pressure condensable gas, having the first gas composition or the second gas composition, or both, is introduced into a stagnation chamber 116 via a gas supply tube 114 and is forced into the substantially lower-pressure vacuum via a correspondingly configured nozzle 110. Due to the expansion of the high-pressure condensable gas from the stagnation chamber 116 to the lower-pressure region in the source chamber 104, the gas is accelerated to supersonic speeds, and a gas cluster jet 118 is ejected from the nozzle 110.

[0066] The self-cooling of the jet during the exchange of static enthalpy for kinetic energy resulting from the expansion in the jet causes a portion of the gas jet to condense, creating the gas cluster jet 118 with clusters each consisting of several to several thousand weakly bound atoms or molecules. A gas stripper 120, arranged downstream of the exit of the nozzle 110 between the source chamber 104 and the ionization / acceleration chamber 106, partially separates the gas molecules at the peripheral edge of the gas cluster jet 118, which may not have condensed into a cluster, from the gas molecules in the core of the gas cluster jet 118, which may have formed clusters. Among other reasons, this selection of a portion of the gas cluster jet 118 can lead to a reduction in pressure in downstream regions where higher pressures may be detrimental (e.g.,in the ionizer 122 and the processing chamber 108). In addition, the gas scraper 120 defines an initial dimension for the gas cluster beam entering the ionization / acceleration chamber 106.

[0067] The GCIB processing system 100 may also include multiple nozzles with one or more wiping orifices. Further details regarding the configuration of a multiple gas cluster ion beam nozzle system can be found in the following documents, the contents of which are hereby incorporated by reference in their entirety: U.S. patent application US 2010 / 0 193 701 A1, entitled "Multiple Nozzle Gas Cluster Ion Beam System," filed on April 23, 2009, and U.S. patent application US 2010 / 0 193 472 A1, entitled "Multiple Nozzle Gas Cluster Ion Beam Processing System and Method of Operating," filed on March 26, 2010.

[0068] After the gas cluster beam 118 is generated in the source chamber 104, the constituent gas clusters in the gas cluster beam 118 are ionized with the ionizer 122 to create a GCIB 128. The ionizer 122 may be an electron impact ionizer that generates electrons from one or more filaments 124 that are accelerated and directed to collide with the gas clusters in the gas cluster beam 118 inside the ionization / acceleration chamber 106. Upon collision with the gas cluster, electrons with sufficient energy eject electrons from molecules in the gas clusters to form ionized molecules. The ionization of gas clusters can result in a population of charged gas cluster ions, which typically have a net positive charge.

[0069] As in Fig. As shown in Figure 5, the GCIB 128 can be ionized, extracted, accelerated, and focused with beam electronics 130. The beam electronics 130 includes a filament current source 136 that supplies a voltage V F for heating the ionizer filament 124.

[0070] In addition, the beam electronics 130 includes a set of appropriately biased high-voltage electrodes 126 in the ionization / acceleration chamber 106 that extract the cluster ions from the ionizer 122. The high-voltage electrodes 126 then accelerate the extracted cluster ions to a desired energy and focus them to define the GCIB 128. The kinetic energy of the cluster ions in the GCIB 128 typically ranges from approximately 1000 electron volts (1 keV) to several tens of keV. The GCIB 128 can be accelerated, for example, to 1 to 100 keV.

[0071] As in Fig. 5, the beam electronics 130 further comprises an anode current source 134 which supplies a voltage V A for an anode of the ionizer 122 for accelerating electrons emitted from the ionizer filament 124 and causing the electrons to bombard the gas clusters in the gas cluster beam 118, thereby producing cluster ions.

[0072] In addition, the beam electronics 130, as shown in Fig. 5, an extraction current source 138 which has a voltage V EE to bias at least one of the high-voltage electrodes 126 to extract ions from the ionization region of the ionizer 122 and generate the GCIB 128. The extraction current source 138 provides, for example, a voltage to a first electrode of the high-voltage electrodes 126 that is less than or equal to the anode voltage of the ionizer 122.

[0073] In addition, the beam electronics 130 may include an accelerator current source 140 that supplies a voltage V ACC for biasing one of the high voltage electrodes 126 with respect to the ionizer 122 to provide a total GCIB acceleration energy approximately equal to the number of electron volts of the voltage V ACC For example, the accelerator power source 140 provides a voltage to a second electrode of the high-voltage electrodes 126 that is less than or equal to the anode voltage of the ionizer 122 and the extraction voltage of the first electrode.

[0074] The beam electronics 130 may further include lens current sources 142 and 144 used to bias some of the high voltage electrodes 126 with potentials (e.g., V L1 and V L2) may be provided to focus the GCIB 128. For example, the lens power source 142 may provide a voltage to a third electrode of the high-voltage electrodes 126 that is less than or equal to the anode voltage of the ionizer 122, the extraction voltage of the first electrode, and the acceleration voltage of the second electrode, and the lens power source 144 may provide a voltage to a fourth electrode of the high-voltage electrodes 126 that is less than or equal to the anode voltage of the ionizer 122, the extraction voltage of the first electrode, the acceleration voltage of the second electrode, and the first lens voltage of the third electrode.

[0075] It should be noted that numerous variations of the ionization and extraction schemes can be applied. The scheme described here is illustrative, while another extraction scheme may have the ionizer and the first element of the extraction electrode(s) (or extraction optics) aligned to the V ACC This typically requires fiber-optic programming of the control voltages for the ionizer power source, but produces a simpler overall optical system. The invention described here is useful regardless of the details of the ionizer and extraction lens bias.

[0076] A beam filter 146 in the ionization / acceleration chamber 106 after the high-voltage electrodes 126 can be used to eliminate monomers, or monomers and light cluster ions, from the GCIB 128 to define a filtered process GCIB 128A entering the processing chamber 108. In one embodiment, the beam filter 146 significantly reduces the number of clusters that have 100 or fewer atoms or molecules, or both. The beam filter 146 can include a magnet assembly for applying a magnetic field across the GCIB 128 to assist in the filtering process.

[0077] In Fig. 5, a beam gate 148 is disposed in the beam path of the GCIB 128 in the ionization / acceleration chamber 106. The beam gate 148 has an open state in which the GCIB 128 can pass from the ionization / acceleration chamber 106 into the processing chamber 108 to define the process GCIB 128A, and a closed state in which the GCIB 128 is prevented from entering the processing chamber 108. A control cable carries control signals from a control system 190 to the beam gate 148. The control signals controllably switch the beam gate 148 between the open and closed states.

[0078] A workpiece 152, which may be a wafer or semiconductor wafer, a flat panel display (FPD), a liquid crystal display (LCD), or other workpiece to be processed by GCIB processing, is arranged in the beam path of the process GCIB 128A in the processing chamber 108. Since most applications involve processing large workpieces with spatially uniform results, a scanning system for uniformly scanning the process GCIB 128A over large areas may be useful to achieve spatially homogeneous results.

[0079] An X-scan actuator 160 enables linear movement of the workpiece holder 150 in the direction of the X-scan movement (into and out of the plane of the paper). A Y-scan actuator 162 enables linear movement of the workpiece holder 150 in the direction of a Y-scan movement 164, which is normally perpendicular to the X-scan movement. The combination of the X and Y scan movements moves the workpiece 152, held by the workpiece holder 150, in a raster-like scan motion through the process GCIB 128A to uniformly (or otherwise programmedly) expose a surface of the workpiece 152 to the process GCIB 128A for processing the workpiece 152.

[0080] The workpiece holder 150 positions the workpiece 152 at an angle to the axis of the process GCIB 128A such that the process GCIB 128A has a beam incidence angle 166 to a surface of the workpiece 152. The beam incidence angle 166 may be 90 degrees or another angle, but is typically 90 degrees or approximately 90 degrees. During Y-scanning, the workpiece 152 and the workpiece holder 150 move from the illustrated position to another position A, designated by the reference symbol 152A or 150A, respectively. It should be noted that when moving between the two positions, the workpiece 152 is scanned with the process GCIB 128A and, in both end positions, is moved completely out of the beam path of the process GCIB 128A (overscan). Although not explicitly stated in Fig. 5, but similar scanning and overscanning are performed in the (usually) perpendicular X-scan direction of travel (into and out of the plane of the paper).

[0081] A beam current sensor 180 may be positioned downstream of the workpiece holder 150 in the beam path of the process GCIB 128A to collect a sample from the process GCIB 128A when the workpiece holder 150 is scanned outside the beam path of the process GCIB 128A. The beam current sensor 180 is typically a Faraday cup or the like, closed except for a beam entrance opening, and is most often mounted to the wall of the vacuum vessel 102 with an electrically insulating mount 182.

[0082] As in Fig. 5, the control system 190 connects the X-scan actuator 160 and the Y-scan actuator 162 via an electrical cable and controls the X-scan actuator 160 and the Y-scan actuator 162 such that the workpiece 152 is placed into and out of the process GCIB 128A and is evenly scanned relative to the process GCIB 128A to achieve the desired processing of the workpiece 152 with the process GCIB 128A. The control system 190 receives the sensed beam current sensed by the beam current sensor 180 via an electrical cable and thereby monitors the GCIB and controls the GCIB dose received by the workpiece 152 by removing the workpiece 152 from the process GCIB 128A when a predetermined dose has been provided.

[0083] In the embodiment shown in Fig. 6, a GCIB processing system 100' may be similar to the GCIB processing system 100 of the embodiment of Fig. 5 and further include an XY positioning stage 253 operable to hold and move a workpiece 252 in two axes, effectively scanning the workpiece 252 relative to the process GCIB 128A. For example, the X movement may include movement into and out of the plane of the paper, and the Y movement may include movement along a direction 264.

[0084] The process GCIB 128A impacts the workpiece 252 at a planned impact area 286 on a surface of the workpiece 252 and at a beam impact angle 266 relative to the surface of the workpiece 252. Through the XY movement, the XY positioning stage 253 can position any portion of the surface of the workpiece 252 in the beam path of the process GCIB 128A so that each area of ​​the surface can be aligned with the planned impact area 286 for processing by the process GCIB 128A. An XY controller 262 provides electrical signals to the XY positioning stage 253 via an electrical cable for controlling the position and speed in the X-axis and Y-axis directions, respectively. The XY controller 262 receives control signals from the control system 190 via an electrical cable and can be controlled by the control system 190.The XY positioning stage 253 moves through continuous or incremental motion according to conventional XY positioning stage technology to position various portions of the workpiece 252 within the planned impact area 286. In one embodiment, the XY positioning stage 253 is programmably operable with the control system 190 to scan a portion of the workpiece 252 through the planned impact area 286 at a programmable speed for GCIB machining with the process GCIB 128A.

[0085] A workpiece support surface 254 of the positioning table 253 is electrically conductive and is connected to a dosimetry processor operated by the control system 190. An electrically insulating layer 255 of the positioning table 253 insulates the workpiece 252 and the workpiece support surface 254 from a base 260 of the positioning table 253. An electrical charge induced in the workpiece 252 by the impingement of the process GCIB 128A is conducted through the workpiece 252 and the workpiece support surface 254, and a signal is coupled via the positioning table 253 to the control system 190 for dosimetry measurement. For the dosimetry measurement, integration means are used to integrate the GCIB current to determine the GCIB processing dose.Under certain circumstances, a target neutralization source (not shown) of electrons, sometimes referred to as an electron flood, may be used to neutralize the process GCIB 128A. In this case, a Faraday cup (not shown) associated with the beam current sensor 180 of FIG. Fig. 5, can be used to ensure accurate dosimetry despite the additional electrical charge source, since in normal Faraday cups only high energy positive ions can enter and be measured.

[0086] In operation, the control system 190 signals the opening of the beam gate 148 to irradiate the workpiece 252 with the process GCIB 128A. The control system 190 monitors measurements of the GCIB current collected from the workpiece 252 to calculate the accumulated dose received by the workpiece 252. When the dose received by the workpiece 252 reaches a predetermined dose, the control system 190 closes the beam gate 148, and processing of the workpiece 252 is complete. Based on the measurements of the GCIB dose received by a given area of ​​the workpiece 252, the control system 190 can adjust the scan speed to achieve an appropriate beam dwell time for treating different regions of the workpiece 252.

[0087] Alternatively, the process GCIB 128A may be scanned at a constant speed in a fixed pattern across the surface of the workpiece 252, but the GCIB intensity is modulated (which may be referred to as two-axis modulation) to provide a deliberately non-uniform dose to the sample. The GCIB intensity may be modulated in the GCIB processing system 100' using one of several methods, including changing the gas flow from a GCIB source supply; modulating the ionizer 122 by changing the filament voltage V F or by changing the anode voltage V A ; Modulating the lens focus by changing the lens voltages V L1 and / or V L2or mechanically blocking part of the GCIB with a variable beam blocker, adjustable shutter, or variable aperture. The modulation changes can be continuous analog changes or can be time-modulated switching or beam blocking.

[0088] The processing chamber 108 may further include an in-situ measurement system. The in-situ measurement system may, for example, be an optical diagnostic system with an optical transmitter 280 and an optical receiver 282 configured to illuminate the workpiece 252 with a reflected light signal 284 and to receive a scattered light signal 288 from the workpiece 252, respectively. The optical diagnostic system includes optical windows to allow the reflected light signal 284 and the scattered light signal 288 to enter and exit the processing chamber 108. Furthermore, the optical transmitter 280 and the optical receiver 282 may have transmit and receive optics, respectively. The optical transmitter 280 receives and responds to electrical control signals from the control system 190. The optical receiver 282 sends measurement signals back to the control system 190.

[0089] The in-situ measurement system may include a device configured to monitor the progress of the GCIB processing. In one embodiment, the in-situ measurement system may be an optical scattered radiation measurement system. The scattered radiation measurement system may include a scattered radiation measurement device employing beam profiling ellipsometry (ellipsometer) and beam profiling reflectometry (reflectometer) and available from Therma-Wave, Inc. (1250 Reliance Way, Fremont, CA 94539) or from Nanometrics, Inc. (1550 Buckeye Drive, Milpitas, CA 95035).

[0090] The in-situ measurement system may, for example, include an iODP scattered radiation measurement module (iODP: integrated digital optical profilometry) configured to measure process performance data resulting from performing the treatment process in the GCIB processing system 100'. The measurement system may, for example, acquire and monitor measurement data resulting from the treatment process. The measurement data may, for example, be used to establish process performance data characterizing the treatment process, such as process speed, relative process speed, feature profile angle, critical dimensions, feature thickness or depth, feature shape, etc. For a process for directional deposition of material on a workpiece, the process performance data may, for example, include: a critical dimension (CD), such as a top, middle, or bottom CD in a feature (i.e., a via, line, etc.).); a structure depth; a material thickness; a sidewall angle; a sidewall shape; a deposition rate; a relative deposition rate; a spatial distribution of a parameter thereof; a parameter for characterizing the uniformity of a spatial distribution thereof; etc. By actuating the XY positioning stage 253 via control signals from the control system 190, the in-situ measurement system can image one or more properties of the workpiece 252.

[0091] In the embodiment shown in Fig. 7, a GCIB processing system 100'' of the embodiment of Fig. 5 and may further include a pressure cell chamber 350, for example, located in or near an outlet region of the ionization / acceleration chamber 106. The pressure cell chamber 350 includes an inert gas source 352 configured to provide a background gas to the pressure cell chamber 350 to increase the pressure in the pressure cell chamber 350, and a pressure sensor 354 configured to measure the increased pressure in the pressure cell chamber 350.

[0092] The pressure cell chamber 350 may be configured to modify the beam energy distribution of the GCIB 128 to create a modified process GCIB 128A'. This modification of the beam energy distribution is achieved by directing the GCIB 128 along a GCIB beam path through a region of increased pressure in the pressure cell chamber 350 such that at least a portion of the GCIB traverses the region of increased pressure. The extent of the modification of the beam energy distribution may be characterized by a pressure-distance integral along at least a portion of the GCIB beam path, where the distance (or length of the pressure cell chamber 350) is given by the beam path length d. As the value of the pressure-distance integral is increased (either by increasing the pressure and / or the beam path length d), the beam energy distribution broadens and the peak energy decreases.Conversely, if the value of the pressure-distance integral is reduced (either by reducing the pressure and / or the length d of the beam path), the beam energy distribution becomes narrower and the peak energy increases. Further details for the configuration of a pressure cell can be found in US Patent No. 7,060,989 B2, entitled "Method and apparatus for improved processing with a gas-cluster ion beam," the contents of which are hereby incorporated by reference in their entirety in this application.

[0093] The control system 190 includes: a microprocessor; a memory; and a digital I / O port capable of generating control voltages sufficient to transmit and enable input signals to the GCIB processing system 100 (or 100' or 100''); and monitor outputs from the GCIB processing system 100 (or 100' or 100''). In addition, the control system 190 may be connected to and exchange information with the vacuum pumping systems 170A, 170B, and 170C, the first gas source 111, the second gas source 112, the first gas control valve 113A, the second gas control valve 113B, the beam electronics 130, the beam filter 146, the beam gate 148, the X-scan actuator 160, the Y-scan actuator 162, and the beam current sensor 180.For example, a program stored in memory may be used to activate input signals for the aforementioned components of the GCIB machining system 100 according to a process concept to perform a GCIB process on the workpiece 152.

[0094] However, the control system 190 may also be implemented as a general-purpose computer system that performs some or all of the microprocessor-based processing steps of the invention in response to a processor executing one or more sequences of one or more instructions contained in a memory. These instructions may be read into the controller memory from another machine-readable medium, such as a hard disk or removable drive. One or more processors in a multi-processing arrangement may also be used as the controller microprocessor to execute the instruction sequences contained in the main memory. In alternative embodiments, hard-wired circuitry may be used instead of, or in combination with, software instructions. Thus, embodiments are not limited to any specific combination of hardware circuitry and software.

[0095] The control system 190 may be used to configure a number of processing elements, as set forth above, and may collect, provide, process, store, and display data from the processing elements. The control system 190 may include a number of applications and a number of controllers for controlling one or more of the processing elements. The control system 190 may, for example, be a GUI (graphical user interface) component (not shown) that may provide interfaces that allow a user to monitor and / or control one or more processing elements.

[0096] The control system 190 may be located near the GCIB processing system 100 (or 100' or 100"), or it may be located remotely from the GCIB processing system 100 (or 100' or 100"). For example, the control system 190 may exchange data with the GCIB processing system 100 using a direct connection, an intranet, and / or the Internet. For example, the control system 190 may be connected to an intranet at a customer's (e.g., an equipment manufacturer's) site, or may be connected to an intranet at a supplier's (e.g., an equipment manufacturer's) site. Alternatively or additionally, the control system 190 may be connected to the Internet. In addition, another computer (i.e., a controller, server, etc.) may access the control system 190 to exchange data via a direct connection, an intranet, and / or the Internet.

[0097] The workpiece 152 (or 252) may be secured to the workpiece holder 150 (or 250) using a clamping system (not shown), such as a mechanical clamping system or an electrical clamping system (e.g., an electrostatic clamping system). Furthermore, the workpiece holder 150 (or 250) may include a heating system (not shown) or a cooling system (not shown) configured to adjust and / or control the temperature of the workpiece holder 150 (or 250) and the workpiece 152 (or 252).

[0098] The vacuum pumping systems 170A, 170B, and 170C may include turbomolecular pumps (TMPs) capable of pumping speeds up to approximately 5,000 liters per second (or more) and a gate valve for throttling the chamber pressure. For conventional vacuum pumping devices, a TMP capable of 1,000 to 3,000 liters per second may be used. TMPs are suitable for low-pressure processing, typically less than approximately 50 mTorr. Although not shown, it should be understood that the pressure cell chamber 350 may also include a vacuum pumping system. Furthermore, a device for monitoring the chamber pressure (not shown) may be connected to the pressure vessel 102 or one of the three pressure chambers 104, 106, and 108. The pressure measuring device may be, for example, a capacitance gauge or an ionization gauge.

[0099] In Fig. 8 is a part 300 of an ionizer (122; Fig. 5, Fig. 6 and Fig. 7) for ionizing a gas cluster beam (gas cluster beam 118; Fig. 5, Fig. 6 and Fig. 7). Part 300 is perpendicular to the axis of the GCIB 128. For typical gas cluster sizes of 2000 to 15,000 atoms, clusters that pass the gas stripper (120; Fig. 5, Fig. 6 and Fig. 7) and into the ionizer (122; Fig. 5, Fig. 6 and Fig. 7), with a kinetic energy of approximately 130 to 1000 eV. At these low energies, a deviation from space charge neutrality in the ionizer 122 leads to rapid scattering of the beam with a significant loss of beam current. Fig. Figure 8 shows a self-neutralizing ionizer. As with other ionizers, gas clusters are ionized by electron impacts. In this configuration, thermoelectrons (seven examples are designated 310) are emitted from multiple linear thermionic filaments 302a, 302b, and 302c (mostly tungsten) and are extracted and focused by the action of appropriate electric fields provided by electron-repelling electrodes 306a, 306b, and 306c and beam-generating electrodes 304a, 304b, and 304c. The thermoelectrons 310 traverse the gas cluster beam and the beam axis and then impinge on the opposing beam-generating electrode 304b to generate low-energy secondary electrons (e.g., 312, 314, and 316).

[0100] Although not shown (for simplicity), the linear thermionic filaments 302b and 302c also generate thermoelectrons, which subsequently generate low-energy secondary electrons. Providing low-energy secondary electrons, which can be drawn into the positively ionized gas cluster beam if necessary to maintain space charge neutrality, helps ensure that the ionized cluster beam remains space charge neutral. The beam generation electrodes 304a, 304b, and 304c are positively biased with respect to the linear thermionic filaments 302a, 302b, and 302c, and the electron repulsion electrodes 306a, 306b, and 306c are negatively biased with respect to the linear thermionic filaments 302a, 302b, and 302c. Insulators 308a, 308b, 308c, 308d, 308e and 308f electrically insulate and support the electrodes 304a, 304b, 304c, 306a, 306b and 306c.This self-neutralizing ionizer is effective and reaches, for example, argon GCIBs with more than 1000 microamperes.

[0101] Alternatively, electron extraction from plasma can be used for ionizers to ionize clusters. The geometry of these ionizers differs greatly from the three-filament ionizer described above, but the operation and control of the ionizer are very similar. Let us now turn to Fig. 9, where a part 400 of an ionizer (122; Fig. 5, Fig. 6 and Fig. 7) for ionizing a gas cluster beam (the gas cluster beam 118; Fig. 5, Fig. 6 and Fig. 7). The part 400 is perpendicular to the axis of the GCIB 128. For typical gas cluster sizes of 2000 to 15,000 atoms, clusters that pass the gas stripper (120; Fig. 5, Fig. 6 and Fig. 7) and into the ionizer (122; Fig. 5, Fig. 6 and Fig. 7), with a kinetic energy of approximately 130 to 1000 eV. At these low energies, a deviation from space charge neutrality in the ionizer 122 leads to rapid scattering of the beam with a significant loss of beam current. Fig. Figure 9 shows a self-neutralizing ionizer. As with other ionizers, gas clusters are ionized by electron collisions.

[0102] The ionizer includes an array of thin rod anode electrodes 452 held and electrically connected by a support plate (not shown). The array of thin rod anode electrodes 452 is substantially concentric with the axis of the gas cluster jet (e.g., gas cluster jet 118; Fig. 5, Fig. 6 and Fig. 7). The ionizer further includes an array of thin electron-repelling rod electrodes 458, which are held and electrically connected by a further support plate (not shown). The array of thin electron-repelling rod electrodes 458 is substantially concentric with the axis of the gas cluster beam (e.g., gas cluster beam 118; Fig. 5, Fig. 6 and Fig. 7). The ionizer further includes an array of thin ion-repelling rod electrodes 464, which are held and electrically connected by yet another support plate (not shown). The array of thin ion-repelling rod electrodes 464 is substantially concentric with the axis of the gas cluster jet (e.g., gas cluster jet 118; Fig. 5, Fig. 6 and Fig. 7).

[0103] High-energy electrons are supplied from a plasma electron source 470 to a beam region 444. The plasma electron source 470 includes a plasma chamber 472 in which plasma is generated in a plasma region 442. The plasma electron source 470 further includes a thermionic filament 476, a gas inlet opening 426, and a plurality of extraction openings 480. The thermionic filament 476 is insulated from the plasma chamber 472 by an insulator 477. As an example, the thermionic filament 476 may be a tungsten filament with a one-and-a-half-twist braid configuration.

[0104] The gas cluster ionizer portion 400 includes an electron accelerating electrode 488 having a plurality of openings 482. Furthermore, the portion 400 includes an electron decelerating electrode 490 having a plurality of openings 484. The plurality of openings 482, the plurality of openings 484, and the plurality of extraction openings 480 are all aligned from the plasma region 442 to the beam region 444.

[0105] A plasma-generating gas, such as a noble gas, is introduced into the plasma chamber 472 via the gas inlet port 426. An insulated gas supply line 422 supplies pressurized plasma-generating gas to a remotely controllable gas valve 424, which regulates the introduction of plasma-generating gas into the plasma chamber 472.

[0106] A filament current source 408 provides a filament tension V Fto allow current to flow through the thermionic filament 476 to stimulate the emission of thermoelectrons. The filament current source 408 controllably supplies approximately 140 to 200 A (amperes) at 3 to V (volts). An arc current source 410 controllably provides an arc voltage V A to positively bias the plasma chamber 472 relative to the thermionic filament 476. The arc power source 410 is typically operated at a fixed voltage, most often about 35 V, and provides a means for accelerating the electrons in the plasma chamber 472 to generate a plasma. The filament current is controlled to regulate the arc current supplied by the arc power source 410.

[0107] The electron deceleration electrode 490 is positively biased with respect to the plasma chamber 472 by an electron bias current source 412. The electron bias current source 412 provides a bias voltage V B, which can be adjusted over a range of 30 to 400 V. The electron accelerating electrode 488 is positively biased with respect to the electron decelerating electrode 490 by an electron extraction current source 416. The electron extraction current source 416 provides an electron extraction voltage V EE which can be regulated in a range of 20 to 250 V. An accelerating current source 420 supplies an accelerating voltage V ACC to positively bias the array of thin rod anode electrodes 452 and the electron deceleration electrode 490 with respect to ground. V ACC is the acceleration potential for the gas cluster ions generated by the gas cluster ionizer shown in part 400 and can be controlled and adjusted in the range from 1 to 100 kV. An electron repulsion current source 414 provides an electron repulsion bias voltage V ERready to arrange the thin electron repulsion rod electrodes 458 in relation to the V ACC negative bias. An ion repulsion current source 418 provides an ion repulsion bias voltage V IR ready to arrange the thin ion repulsion rod electrodes 464 in relation to the V ACC positively biased. The V IR can be regulated in the range from 50 to 150 kV.

[0108] A fiber optic controller 430 receives electrical control signals on a cable 434 and converts them into optical signals on a control line 432 to control components operating at high potential using signals from a grounded control system. The fiber optic control line 432 transmits control signals to the remotely controllable gas valve 424, the filament power source 408, the arc power source 410, the electron bias power source 412, the electron repulsion power source 414, the electron extraction power source 416, and the ion repulsion power source 418.

[0109] The configuration of the ionizer may, for example, be similar to that of the ionizer described in US patent US 7 173 252 B2 entitled "Ionizer and method for gas-cluster ion-beam formation", the contents of which are hereby deemed to be disclosed in their entirety in this application.

[0110] The ionizer (122; Fig. 5, Fig. 6 and Fig. 7) can be configured to modify the beam energy distribution of the GCIB 128 by changing the charge state of the GCIB 128. The charge state can be modified, for example, by adjusting the electron flow, the electron energy, or the electron energy distribution for electrons used in electron impact-induced ionization of gas clusters.

Claims

[1] A method for modifying an upper layer of a workpiece (152, 252) using a gas cluster ion beam, GCIB, comprising the following steps: Acquiring parameter data relating to an upper layer of a workpiece (152, 252), the parameter data comprising an initial profile of a measured attribute of the upper layer and at least one n-th order derivative of a spatial change of the measured attribute, where n is an integer greater than zero; determining a predicted systematic error response for applying a GCIB (128, 128A) to the upper layer to change the initial profile of the measured attribute using the parameter data comprising the at least one n-th order derivative as input to a predetermined predictive model; Identifying a target profile of the measured attribute; Directing a gas cluster ion beam, GCIB (128, 128A), to the upper layer of the workpiece (152, 252) and spatially modulating an applied property of the GCIB (128, 128A) based, at least in part, on the predicted systematic error response and the parameter data as a function of position on the upper layer of the workpiece (152, 252) to achieve the target profile of the measured attribute. [2] The method of claim 1, wherein the measured attribute comprises a layer thickness, a surface roughness, a surface contamination, a feature depth, a trench depth, a via depth, a feature width, a trench width, a via width, a critical dimension, or an electrical resistance, or a combination of two or more thereof. [3] The method of claim 1, wherein the at least one n-th order derivative of a spatial change of the measured attribute comprises a first derivative of a spatial change of the measured attribute on the workpiece (152, 252). [4] The method of claim 3, wherein the at least one n-th order derivative of a spatial change in the measured attribute further comprises a second derivative of a spatial change in the measured attribute at the workpiece (152, 252). [5] The method of claim 1, wherein the at least one n-order derivative of a spatial change of the measured attribute is calculated at each position, wherein the measured upper layer attribute is obtained using an interpolation algorithm or a data fitting algorithm or a combination thereof. [6] The method of claim 1, further comprising the steps of: Calculating correction data using the initial profile and the target profile for the measured attribute; Combining the correction data with the predicted systematic error response to produce correction data with a corrected predicted systematic error; and Using the correction data with a corrected predicted systematic error for the workpiece (152, 252) by spatially modulating the applied dose. [7] The method of claim 1, further comprising creating a predetermined forecast model by performing the following steps: Measuring representative parameter data comprising a representative initial profile of a representative upper layer attribute and at least one n-order derivative of a spatial change of the representative attribute, where n is an integer greater than zero; Defining a representative target profile; Calculating representative correction data using the representative initial profile and the representative target profile for the representative attribute; Using the representative correction data for the workpiece (152, 252) by spatially modulating an applied dose of a representative GCIB; Comparing a representative actual profile with the representative target profile to determine a representative systematic error; and Correlating the representative systematic error with the representative parameter data. [8] The method of claim 7, wherein the correlating comprises the following steps: Applying a least squares method to the representative parameter data and the representative systematic error and Formulate a functional relationship between the representative parameter data and the representative systematic error that minimizes a sum of the squared deviations caused by the functional relationship. [9] The method of claim 1, wherein the applied property of the GCIB (128, 128A) comprises a beam dose. [10] The method of claim 1, wherein the applied property of the GCIB (128, 128A) comprises a beam dose, a beam area, a beam profile, a beam intensity, a beam scan speed, or a dwell time, or a combination of two or more thereof. [11] The method of claim 1, wherein the GCIB (128, 128A) performs an etching process, a deposition process, a growth process, a smoothing process, a doping process, a modification process, or a combination of two or more thereof to achieve the target profile. [12] The method of claim 1, further comprising repeating the steps of detecting, determining, identifying, directing, or spatially modifying, or a combination of two or more thereof, to further reduce a difference between the target profile and an actual profile of the measured attribute. [13] The method of claim 1, wherein the workpiece (152, 252) comprises a microelectronic workpiece. [14] A machining system configured to perform position-specific machining of a workpiece (152, 252), comprising: a GCIB machining system (100) configured to treat a workpiece (152, 252) with a GCIB (128, 128A); and a multi-process controller configured to receives parameter data relating to an upper layer of a workpiece (152, 252), the parameter data comprising an initial profile of a measured attribute of the upper layer and at least one n-th order derivative of a spatial change of the measured attribute, where n is an integer greater than zero, determining a predicted systematic error response for applying the GCIB (128, 128A) to the upper layer to change the initial profile of the measured attribute using the parameter data comprising the at least one n-th order derivative as input to a predetermined predictive model, identifies a target profile of the measured attribute, directs the GCIB (128, 128A) to the upper layer of the workpiece (152, 252) and spatially modulating an applied property of the GCIB (128, 128A) based, at least in part, on the predicted systematic error response and the parameter data of the GCIB (128, 128A) as a function of position on the upper layer of the workpiece (152, 252) to achieve the target profile of the measured attribute. [15] The system of claim 14, further comprising a measurement system configured to acquire the parameter data for one or more workpieces. [16] The system of claim 15, wherein the measurement system comprises digital optical profilometry (ODP), scatterometry, ellipsometry, reflectometry, interferometry, X-ray fluorescence spectroscopy, scanning electron microscopy (SEM), tunneling electron microscopy (TEM), atomic force microscopy (AFM), or four-point probe scanning, or a combination of two or more thereof. [17] The system of claim 14, wherein the GCIB processing system comprises: a vacuum housing; a gas or vapor source configured to generate a GCIB (128, 128A) inside the vacuum housing; and a workpiece holder (150) configured to hold the given workpiece in the vacuum housing. [18] The system of claim 17, wherein the gas or vapor source supplies an inert substance or a reactive substance to the materials exposed on the workpiece (152, 252). [19] The system of claim 17, wherein the gas or vapor source supplies one or more elements from the group B, C, H, Si, Ge, N, P, As, O, S, F, Cl and Br. [20] The system of claim 17, further comprising a scanner disposed in the vacuum enclosure for scanning the workpiece holder (150) through the GCIB (128, 128A).

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