Component assembly fixture

Abstract

Component assembly device (100, 200), comprising: a conveying unit (1) that conveys a placement element (90, 91, 190, 191, 290, 291) on which an assembly target (P) is placed; a head unit (2) comprising a head (21) which holds a component (E) and mounts the held component (E) on the assembly target (P), wherein the head unit (2) is movable in a horizontal plane; and a control or regulation (7) that controls or regulates the operation of the head unit (2); wherein the head unit (2) comprises the head (21) or a plurality of heads (21), and The control or regulation (7) of the transfer of the assembly target (P) from the conveying unit (1) to a transfer position (B2) located at a position different from that of the conveying unit (1) is controlled or regulated by controlling or regulating at least the movement of the head unit (2) in the horizontal plane in a state in which the placement element (90, 91, 190, 191, 290, 291) is held by means of the head (21) or a plurality of heads (21) of the head unit (2).

Description

Technical field

[0001] The present invention relates to a component assembly device and in particular to a component assembly device that transfers an assembly target from a conveying unit to a transfer position. General state of the art

[0002] A conventional component assembly device is known that transfers an assembly target from a conveying unit to a transfer position. Such a component assembly device is disclosed in Japanese patent no. JP 5 721 469 B2.

[0003] Japanese patent no. JP 5 721 469 B2 discloses a component assembly device that transfers a substrate (assembly target) from a substrate conveying device (conveying unit) to a substrate holder (transfer position) located at a position different from that of the substrate conveying device, and assembles components onto the substrate held by the substrate holder.

[0004] This component assembly device includes a dedicated substrate transfer device to transfer the substrate from the substrate conveying device to the substrate holder. State of the art

[0005] JP 2005-210003A describes the automation of substrate adhesion to a required transport device for the production of flexible substrates. The device comprises a movable head unit with a vacuum-held substrate (flexible substrate) during processing, a fixture recognition camera mounted on the unit, a substrate recognition camera attached to a base, and a controller for integrated control of these components. The controller directs the head to hold the substrate to be processed from a feeder by vacuum and moves it to a transport device in a working position for adhesion. The fixture recognition camera captures an image of the transport device, and the substrate recognition camera captures an image of the substrate. If at least one vacuum-held position error of the substrate or a position error of the transport device occurs, the head unit, etc., is automatically repositioned.driven and controlled to correct the error in adhering the substrate to the transport device.

[0006] DE 100 63 609 A1 describes a substrate transfer device that can hold the substrate without touching its surface during transfer and that does not require an additional pre-alignment mechanism. The substrate is transferred by a gripper. The gripper comprises a substrate holding device and a substrate contact device. The substrate holding device includes a non-contact receiver for holding the substrate without touching its surface, and a lifting mechanism for lowering and raising the non-contact receiver. The substrate contact device includes a contact element for contacting the end face of the substrate, a movement mechanism for moving the contact element away from the end face of the substrate when the non-contact receiver is lowered, and for moving the contact element toward the end face of the substrate when the non-contact receiver is raised.The gripper has a suitable number of substrate holding devices and a suitable number of substrate contact devices.

[0007] JP H11-26990 A describes the provision of a device and a method for transferring a substrate that quickly and reliably detects when multiple substrates have been picked up simultaneously, removes the unneeded substrates, and transfers the substrates individually to a transfer path. In the case of transferring substrates stacked in a storage area to a transfer path, the substrate is picked up by a transfer head using vacuum suction. A transfer head uses a suction cup to pick up the top substrate from the substrates stacked in a storage area and transfers it to a first rail. When a sensor detects that multiple substrates are being picked up simultaneously, the suction cup of a vacuum suction unit moves upwards and vacuum-seals the bottom substrate onto the first rail.The transfer head then lifts the upper substrate to remove it from the first rail, and the substrate remaining on the first rail is transported downstream by a pusher.

[0008] JP 2010 - 114 108 A describes the provision of a non-contact transport device for a printed circuit board (PCB) capable of reliably transporting the PCB even at high speeds. The non-contact transport device has a suction section. Within the suction section, a recess is provided on a suction surface, and an air nozzle hole is provided that is open on the inner circumferential surface of the recess. The non-contact transport device uses suction at the suction surface to hold a major surface of the PCB for transport by means of a vacuum created by air blown from the air nozzle hole along the inner circumferential surface of the recess.The non-contact transport device also features a substrate holding element for holding and fixing the printed circuit board without any positional misalignment by bringing the main surface of the printed circuit board into contact with the outer circumferential edge of the printed circuit board when the main surface of the substrate is suctioned to and held against the suction surface.

[0009] JP 2014 - 220 406 A describes the provision of a workpiece holder that enables a conventional machine to adequately machine a non-flat work surface. A substrate holder for holding a printed circuit board on which assembly work is performed by an electronic component assembly machine comprises a fixed plate that is firmly supported by the electronic component assembly machine, a holding mechanism for holding the printed circuit board in a state in which the angle relative to a horizontal plane can be changed, and an electromagnetic motor for changing the angle of the printed circuit board relative to the horizontal plane by actuating the holding mechanism, and this electromagnetic motor is provided within the substrate holder.Consequently, even a conventional electronic component assembly machine that is not equipped with an actuator to operate the holding mechanism can perform assembly work on electronic components on a non-flat component mounting surface.

[0010] DE 35 40 476 A1 describes a device for loading and unloading a printed circuit board (PCB) processing machine, which includes a return device with a gripping device that is horizontally and vertically movable in the area between a PCB receiving track and a loading / unloading position on the PCB processing machine. To enable the transfer of PCBs from the PCB receiving track to the loading / unloading position without requiring structural modifications to the device for differently configured loading / unloading positions, a transfer device with a gripping device is provided. This gripping device is horizontally and vertically movable in the area between the receiving track and the loading / unloading position and can simultaneously be positioned vertically above the loading / unloading position at varying distances, along with the gripping device of the transfer device. Brief description of the invention; Problems to be solved by the invention

[0011] In the aforementioned component assembly device described in Japanese patent no. JP 5 721 469 B2, the dedicated substrate transfer device is provided to transfer the substrate from the substrate conveying device to the substrate holder, and thus there is a problem that the device structure becomes complex.

[0012] The present invention was proposed to solve the aforementioned problems, and one object of the present invention is to provide a component assembly device that is capable of transferring an assembly target while significantly reducing or preventing the complexity of the device structure. Means of solving the tasks

[0013] A component assembly device according to one aspect of the present invention comprises a conveying unit that transports a placement element on which an assembly target is placed, a head unit comprising a head that holds a component and mounts the held component onto the assembly target, wherein the head unit is movable in a horizontal plane, and a control system that controls the operation of the head unit. The control system controls the transfer of the assembly target from the conveying unit to a transfer position located at a position different from that of the conveying unit by controlling at least the movement of the head unit in the horizontal plane in a state in which the placement element is held by means of a head or a plurality of heads of the head unit.

[0014] In the component assembly device according to this aspect of the present invention, the control system, as previously described, manages the transfer of the assembly target from the conveying unit to the transfer position, which is located at a position different from that of the conveying unit, by controlling at least the movement of the head unit in the horizontal plane in the state in which the placement element is held by the single head or the plurality of heads of the head unit. Accordingly, the assembly target (placement element) can be transferred from the conveying unit to the transfer position by means of the head unit that assembles the component, and thus it is not necessary to provide a separate, dedicated device for transferring the assembly target. Consequently, the assembly target can be transferred while the complexity of the device structure is significantly reduced or eliminated.Moreover, when the mounting target is transferred, the head unit does not hold the mounting target itself, but rather the placement element on which the mounting target is positioned in such a way that, compared to the case where the mounting target is held directly by the head unit, the degree of freedom in selecting a holding position of the head unit can be improved.

[0015] In the aforementioned component assembly device, the control system preferably manages the lowering of the plurality of heads towards the placement element and the synchronous raising of the plurality of heads holding the placement element, following the control of the plurality of heads for holding the placement element. According to this design, the placement element can be raised by means of the plurality of heads while maintaining a secure holding position. Consequently, when the placement element is raised by means of the plurality of heads, positional deviation and the falling of the placement element can be significantly reduced or prevented.

[0016] In the aforementioned component assembly device, according to this aspect, the control system preferably directs or regulates one or more pairs of heads to hold the placement element in such a way that the assembly target is stacked when the plurality of heads holds the placement element. According to this design, the placement element can be held in symmetrical positions over the assembly target by means of the one or more pairs of heads, thus ensuring a balanced hold. Consequently, during the transfer of the placement element, positional deviation and the risk of the placement element falling can be significantly reduced or prevented.

[0017] The aforementioned component assembly device, according to this aspect, preferably further comprises a suction nozzle attached to a tip of the head. The suction nozzle, attached to the one or multiple heads, preferably draws suction onto the placement element in such a way that the head unit holds the placement element. According to this design, the placement element can be held simply by suction, and thus the head of the unit can easily hold the placement element. Moreover, the placement element is held by the suction nozzle, which allows the suction nozzle to be used in conjunction with the component. This significantly reduces or prevents an increase in the number of components due to the transfer of the placement element. Furthermore, the degree of freedom in selecting the holding position (suction position) of the head unit can be improved.

[0018] The aforementioned component assembly device, according to this aspect, preferably further comprises a gripper attached to a tip of the head. The gripper attached to the one head or the plurality of heads preferably grasps a pair of facing sections of the placement element such that the head unit holds the placement element. According to this structure, the placement element can be held more stably compared to the case where the placement element is held by suction. Thus, when the placement element is held and transferred, positional deviation and falling of the placement element can also be significantly reduced or prevented.

[0019] In this case, the placement element preferably comprises a pair of notches or openings facing each other, and the head unit preferably grips the pair of notches or openings of the placement element by means of a gripper or grips the pair of notches or openings of the placement element by means of a pair of grippers. According to this structure, in a state where the gripper is positioned at a gripping position by means of the pair of notches or openings of the placement element, the pair of notches or openings of the placement element can be gripped, and thus the positional deviation of the placement element can be effectively and significantly reduced or prevented.

[0020] In the aforementioned structure, where the placement element comprises the pair of notches or openings facing each other, each pair of notches or openings of the placement element preferably includes a guide having a shape that gradually tapers towards a gripping position of the gripper in the placement element, in order to guide the gripper to the gripping position. According to this structure, in a state where the gripper is reliably positioned at the gripping position by means of the guide of the placement element, the pair of notches or openings of the placement element can be gripped.

[0021] In the aforementioned structure, where the gripper is attached to the top of the head, the gripper preferably comprises a first gripper capable of holding the placement element at one point and a second gripper capable of holding the placement element at two points. The first gripper preferably holds one side of the placement element at the one point, and the second gripper preferably holds another side of the placement element at the two points such that the head unit grips the placement element in a three-point support manner. With one side of the placement element and another side of the placement element each held at two points (four points in total), a gap may occur between the gripper and the placement element at any of the four gripping points of the gripper.Therefore, if the placement element is gripped in a three-point support manner, as described previously, the formation of a gap between the gripper and the placement element at any of the three gripping points can be prevented. Consequently, the placement element can be gripped more stably.

[0022] In the aforementioned component assembly device, according to this aspect, the control system preferably determines, among the plurality of heads, the head that holds the placement element based on information about the size of the placement element, the size of the mounting target placed on the placement element, and the distance between a pair of heads. According to this structure, among the plurality of heads, the head in a suitable holding position can hold the placement element according to the size of the placement element to be held and the size of the mounting target placed on it. Consequently, when the placement element is held and transferred, positional deviation and falling of the placement element can be significantly reduced or prevented.

[0023] In the aforementioned component assembly device, according to this viewpoint, the control system preferably announces the size of the placement element on which the assembly target is placed, based on information about the size of the assembly target and information about the distance between a pair of heads holding the placement element. According to this structure, an operator can easily determine the placement element on which the next assembly target to be produced will be placed, based on the announced size of the placement element, from among a variety of placement element types.

[0024] The aforementioned component assembly device, according to this aspect, preferably further comprises an image that represents the placement element held by the head of the head unit when the assembly target is transmitted via the head unit. The control system preferably detects the state of the placement element held by the head of the head unit based on the result of the image's representation of the placement element. According to this structure, it can be confirmed, for example, based on the detected state of the placement element, whether the placement element is being held by the head of the head unit or not (whether the holding of the placement element is being performed or not). If the placement element is not being held, the repetition process for holding the placement element can, for example, be performed quickly by the head unit.Furthermore, for example, the position deviation amount from the theoretical holding position of the placement element held by the head of the head unit can be detected based on the detected state of the placement element, and the placement element can be transferred to the transfer position in a state in which the detected position deviation amount has been corrected.

[0025] Additionally, the placement element can be transferred precisely to the transfer position by correcting the position deviation amount.

[0026] In the aforementioned component assembly device according to this aspect, the assembly target preferably has a three-dimensional shape compared to the shape of a flat plate. The component assembly device preferably also includes an assembly target holder that holds the assembly target above the placement element and moves the held assembly target along an upward-downward direction, or rotates or tilts the held assembly target when the head unit performs the assembly on the assembly target. The control or regulation preferably controls the transfer of the assembly target from the conveying unit to the assembly target holder by controlling or regulating the movement of the head unit in the horizontal plane in the state in which the placement element is held by means of the one head or the plurality of heads of the head unit.According to this structure, when the assembly target, which has a complex shape, is transferred from the conveying unit to the assembly target holder, the transfer of the assembly target can be carried out while significantly reducing or eliminating the complexity of the fixture structure. Additionally, the assembly target is moved along the up-down direction or rotated or tilted by the assembly target holder in such a way that assembly can be easily performed even on the assembly target, which has a complex (three-dimensional) shape. Effect of the invention

[0027] According to the present invention, as described above, it is possible to provide the component assembly device which is capable of transferring the assembly goal, while significantly reducing or preventing the complexity of the device structure. Brief description of the drawings [ Fig. 1] A top view showing the overall structure of a component assembly device according to the first and second embodiments. [ Fig. 2] A side view showing the overall structure of the component assembly device according to the first and second embodiments. [ Fig. 3] A perspective view showing a first placement section of a placement element, a second placement section of the placement element and an assembly target according to the first embodiment. [ Fig. 4] A perspective view showing the first placement section of the placement element and the assembly target according to the first embodiment. [ Fig. 5] A representation showing a mounting target holder of the component assembly device according to the first and second embodiments. [ Fig. 6] A top view (A) and a side view (B) illustrating the state of the placement element held by a head of the component assembly device according to the first embodiment. [ Fig. 7] A top view (A) and a side view (B) illustrating the state of the placement element held by a pair of heads of the component assembly device according to the first embodiment. [ Fig. 8] A representation illustrating the control or regulation of positioning heads that hold the placement element, which is carried out by the component assembly device according to the first embodiment. [ Fig. 9] A representation illustrating the control or regulation of the announcement of the size of the placement element, which is carried out by the component assembly device according to the first embodiment. [ Fig. 10] A flowchart illustrating the assembly process carried out by the component assembly device according to the first embodiment. [ Fig. 11] A side view illustrating the state of a placement element held by a head of the component assembly device according to the second embodiment. [ Fig. 12] A side view illustrating the state of the placement element held by a pair of heads of the component assembly device according to the second embodiment. [ Fig. 13] A top view illustrating a first placement section of the placement element according to the second embodiment. [ Fig. 14] A top view illustrating a first placement section of a placement element according to a modified example of the second embodiment. Embodiments of the invention

[0028] The following describes embodiments of the present invention based on the drawings. In the following description, the conveying direction of a placement element 90 (mounting target P) is defined as an X-direction, a direction orthogonal to the X-direction in a horizontal plane is defined as a Y-direction, and an upward-downward direction orthogonal to the horizontal plane is defined as a Z-direction. Furthermore, the upstream side in the conveying direction is defined as the X1-direction side, and the downstream side in the conveying direction is defined as the X2-direction side. [First embodiment](structure of the component assembly device)

[0029] The structure of a component assembly device 100 according to a first embodiment of the present invention is now described with reference to Fig. 1 to 9 described.

[0030] As in Fig. 1 and Fig. As shown in Figure 2, the component mounting device 100 is a component mounting device that mounts components E (electronic components) such as ICs, transistors, capacitors and resistors to the mounting target P, such as a printed circuit board.

[0031] In the component assembly device 100, as described in Fig. Figure 3 shows that the assembly target P is carried into the device and transported in a state in which it is positioned on the placement element 90 for transport. In the first embodiment, the placement element 90 comprises a plurality of first placement sections 91 and a single second placement section 92. The assembly target P is positioned on each of the plurality of first placement sections 91. The plurality of first placement sections 91 is positioned on the second placement section 92. In the component assembly device 100, the plurality of first placement sections 91 is positioned on the single second placement section 92 such that a plurality of assembly targets P can be carried into the component assembly device 100 simultaneously.

[0032] Additionally, the multitude of first placement sections 91 is removable and placed on an upper section of the second placement section 92.

[0033] In the component assembly device 100, a single first placement section 91 can be separated from the second placement section 92 of the placement element 90, and the assembly target P can be moved together with the separated first placement section 91.

[0034] As in Fig. As shown in Figure 4, the first placement sections 91 of the placement element 90 each comprise a placement section 91a on which the mounting target P is placed, a retained section 91b projecting downwards (in the Z2 direction) from a lower section of the placement section 91a and held by a mounting target holder 4 described below, and positioning sections 91c that position the mounting target P in the first placement section 91. The positioning sections 91c comprise recesses (positioning holes) or projections (positioning pins), and the recesses or projections of the positioning sections 91c engage with projections or recesses provided accordingly on the mounting target P such that the mounting target P is positioned on the first placement section 91. Furthermore, a plurality of (two) positioning sections 91c are provided.Thus, the positioning sections 91c prevent the assembly target P from rotating on the first placement section 91. The number of positioning sections 91c is not limited to two; more than two positioning sections 91c can be provided. In the component assembly device 100, the components E are mounted on the assembly target P in a state where the assembly target P is positioned on the first placement section 91 of the placement element 90.

[0035] In the present embodiment, the mounting target P has a three-dimensional shape compared to the shape of a flat plate. The mounting target P can have any shape, as long as it has a three-dimensional shape compared to the shape of a flat plate, and can have any number of mounting target surfaces Pa. Fig. Figure 4 illustrates, as an example of the assembly target P, the assembly target P, which has a multitude of assembly target surfaces Pa, including assembly target surfaces Pa that intersect each other. The assembly target P is not limited to the one in Fig. The example shown is limited, but it may also be that the assembly target P does not have the assembly target surfaces Pa that intersect each other.

[0036] As in Fig. 1 and Fig. As shown in Figure 2, the component assembly device 100 comprises a conveying unit 1, a head unit 2, a horizontal head movement mechanism 3, an assembly target holder 4, component images 5, a marking image 6 and a control or regulation system 7. The component images 5 are examples of an “image” in the claims.

[0037] The conveying unit 1 is a conveying device that carries in, transports, and removes the placement element 90, on which the assembly target P is placed. Specifically, the conveying unit 1 comprises a pair of conveyors 11 spaced apart in the Y-direction and conveys the placement element 90 in the X-direction, while supporting both ends of the second placement section 92 of the placement element 90 from below in the Y-direction by means of the pair of conveyors 11. The conveying unit 1 transports the inserted assembly target P to a transfer stop position B1 and stops the assembly target P at the transfer stop position B1.

[0038] The head unit 2 comprises a plurality of (six) heads 21 that hold the components E and mount the held components E at the assembly target P, and is movable in the horizontal plane (in an XY plane). In the component assembly device 100, a plurality of belt conveyors 100a, which feed the components E to be mounted at the assembly target P, are arranged on both sides (the Y1 side and the Y2 side) in the Y direction. The heads 21 of the head unit 2 hold the components E supplied by the belt conveyors 100a.

[0039] The multitude of heads 21 are arranged in a row at equal intervals (intervals d) along the X-direction. The multitude of heads 21 have essentially the same structure. Suction nozzles 21a (see Fig. 2), which hold the components E, are detachably attached to the tips of the heads 21. In addition, the heads 21 are equipped with a vacuum source 93 (see Fig. 2) connected, which is provided in the component assembly device 100. The suction nozzles 21a draw in the components E by means of a negative pressure supplied by the vacuum source 93 such that the heads 21 hold the components E. The heads 21 release the holding (suction) of the components E, as the supply of negative pressure from the vacuum source 93 is stopped in order to mount the components E at the assembly target P.

[0040] The head unit 2 comprises a plurality of head-up-down movement mechanisms 22, which are provided for the corresponding heads 21. The plurality of head-up-down movement mechanisms 22 have essentially the same structure. The head-up-down movement mechanisms 22 move the heads 21 in the up-down direction (Z-direction) by means of ball screw mechanisms. Thus, the heads 21 are movable in the up-down direction between lowered positions, in which the heads 21 are lowered to hold the components E or the first placement sections 91 of the placement element 90, and raised positions, in which the heads 21 are raised to transfer the components E or the first placement sections 91 of the placement element 90.

[0041] The horizontal head movement mechanism 3 moves the head unit 2 in the horizontal plane (in the XY plane) above the placement element 90 (mounting target P). In particular, the horizontal head movement mechanism 3 comprises an X-axis movement mechanism 31 and a pair of Y-axis movement mechanisms 32.

[0042] The head unit 2 is attached to the X-axis motion mechanism 31, and the X-axis motion mechanism 31 moves the head unit 2 in the X direction by means of a ball screw mechanism. The X-axis motion mechanism 31 is attached to the pair of Y-axis motion mechanisms 32, and the pair of Y-axis motion mechanisms 32 moves the X-axis motion mechanism 31 and the head unit 2 in the Y direction by means of the ball screw mechanism.

[0043] The mounting target holder 4 holds the mounting target P above the first placement section 91 of the placement element 90 when the head unit 2 performs the mounting operation on the mounting target P. Furthermore, the mounting target holder 4 moves the held mounting target P along the up-down direction (Z-direction) or rotates or tilts the held mounting target P.

[0044] In particular, as in Fig. Figure 5 shows the mounting target holder 4 comprising a lifting mechanism 41, a tilting mechanism 42, a rotational mechanism 43, and a holder 44. In the mounting target holder 4, the holder 44 is attached to the rotational mechanism 43, the rotational mechanism 43 is attached to the tilting mechanism 42, and the tilting mechanism 42 is attached to the lifting mechanism 41.

[0045] The lifting mechanism 41 comprises a drive motor 41a and moves the mounting target P, which is held by the holder 44, by means of the driving force of the drive motor 41a along the upward-downward direction (Z-direction). The tilting mechanism 42 comprises a drive motor 42a and rotates the mounting target P, which is held by the holder 44, about a rotational axis A1 extending along a horizontal direction by means of the driving force of the drive motor 42a. Thus, the tilting mechanism 42 tilts the mounting target P, which is held by the holder 44. The rotation mechanism 43 comprises a drive motor 43a and rotates the mounting target P, which is held by the holder 44, about a rotational axis A2 extending in a direction substantially orthogonal to the rotational axis A1 by means of the driving force of the drive motor 43a. The holder 44 holds the mounting target P via the first placement section 91 of the placement element 90.In particular, the holder 44 comprises a plurality of claws 44a and holds and fixes the held section 91b of the first placement section 91 of the placement element 90 by means of the plurality of claws 44a.

[0046] The component images 5 are cameras for component recognition that image the components E which are sucked in by the heads 21 prior to a component assembly process. The component images 5 are fixed to the upper surface of a base of the component assembly device 100 and image the components E, which are sucked in by the heads 21, from the underside (Z2 direction side) of the components E. The control system 7 detects (recognizes) the suction states (the rotational orientations and the suction positions with respect to the heads 21) of the components E based on the results of the component images 5 capturing the components E.

[0047] The marker imager 6 is a marker detection camera that images a position detection marker (not shown) attached to the assembly target P before the assembly of the components E. The position detection marker is used to identify the position of the assembly target P. The controller 7 detects the exact position and orientation of the assembly target P based on the image of the position detection marker by the marker imager 6. Additionally, the marker imager 6 is attached to the head unit 2 and, together with the head unit 2, is movable in the horizontal plane (in the XY plane) above the placement element 90 (assembly target P).

[0048] The control system 7 comprises a central processing unit (CPU), a read-only memory (ROM), a random access memory (RAM), etc., and is a control circuit that controls the operation of the component assembly device 100. The control system 7 controls the operation of the conveyor unit 1, the head unit 2, the horizontal head movement mechanism 3, the component images 5, and the marking image 6 according to a production program for assembling the components E at the assembly target P. (Structure in relation to the transfer of the placement element)

[0049] As in Fig. As shown in Figure 1, in the component assembly device 100, the assembly target holder 4 is arranged outside a conveying path 1a of the conveying unit 1. This means that the assembly target holder 4 is located at a position to which the conveying unit 1 cannot transport the assembly target P. Therefore, in the component assembly device 100, it is necessary to transfer the assembly target P from the conveying unit 1 to the assembly target holder 4.

[0050] Therefore, in the first embodiment, the control unit 7 controls the head unit 2 to transfer the assembly target P from the conveyor unit 1 to the assembly target holder 4, as a transfer position B2 located at a position different from that of the conveyor unit 1. That is, in the first embodiment, the head unit 2 is doubled as a head unit for component assembly and a head unit for transferring the assembly target.

[0051] In particular, the controller 7 controls or regulates a head or a plurality of heads 21 of the head unit 2 to hold the first placement section 91 of the placement element 90, and controls or regulates the transfer of the assembly target P from the conveyor unit 1 to the transfer position B2 (assembly target holder 4) by controlling or regulating the movement of the head unit 2 in the horizontal plane and the raising and lowering of the heads 21 of the head unit 2 in a state in which the first placement section 91 of the placement element 90 is held. Thus, the controller 7 controls or regulates the transfer of the assembly target P from the conveyor unit 1 to the assembly target holder 4.Furthermore, the suction nozzles 21a for component assembly, which are attached to a head or the plurality of heads 21, suction an upper section of the first placement section 91 of the placement element 90 in such a way that the head unit 2 holds the placement element 90. <Wenn ein Kopf das Platzierungselement überträgt>

[0052] As in Fig. As shown in Figure 6, the control unit 7 first controls the lowering of a head 21 towards the first placement section 91 of the placement element 90, which was stopped at the transfer stop position B1, and controls a head 21 to hold the first placement section 91 of the placement element 90. In particular, the control unit 7 controls a suction nozzle 21a from a head 21 to draw in the upper section of the first placement section 91 of the placement element 90 such that a head 21 is controlled to hold the first placement section 91 of the placement element 90.

[0053] The controller 7 then controls the raising of a head 21 that holds the first placement section 91 of the placement element 90. The controller 7 then controls the movement of the head unit 2 to a position above the transfer position B2 (mounting target holder 4) by moving the head unit 2 in the horizontal plane. Finally, the controller 7 controls the lowering of a head 21 that holds the first placement section 91 of the placement element 90 towards the transfer position B2 (mounting target holder 4).

[0054] The control unit 7 then controls a head 21 to release the holding (suction) of the first placement section 91 of the placement element 90 such that the transfer of the first placement section 91 of the placement element 90 to the transfer position B2 (mounting target holder 4) is controlled. The first placement section 91 of the placement element 90, which has been transferred, is held by the mounting target holder 4 at the transfer position B2. <Wenn eine Vielzahl von Köpfen das Platzierungselement überträgt>

[0055] As in Fig. As shown in Figure 7, the control unit 7 controls a pair of heads 21 to hold the first placement section 91 of the placement element 90 such that the assembly target P is layered when the multitude of heads 21 holds the first placement section 91 of the placement element 90. Even if the pair of heads 21 holds and transmits the first placement section 91 of the placement element 90, the process is fundamentally the same as if a single head holds and transmits the first placement section 91 of the placement element 90.

[0056] This means that, first, the control unit 7 controls the synchronous lowering of the pair of heads 21 towards the first placement section 91 of the placement element 90, which was stopped at the transmission stop position B1, and controls the pair of heads 21 to hold the first placement section 91 of the placement element 90. In particular, the control unit 7 controls the suction nozzles 21a of the pair of heads 21 to draw suction to two positions on the upper section of the first placement section 91 of the placement element 90 such that the pair of heads 21 is controlled to hold the first placement section 91 of the placement element 90.

[0057] Then, the controller 7 controls the synchronous lifting of the pair of heads 21 that hold the first placement section 91 of the placement element 90. Then, the controller 7 controls the movement of the head unit 2 to the position above the transfer position B2 (mounting target holder 4) by moving the head unit 2 in the horizontal plane. Then, the controller 7 controls the lowering of the pair of heads 21 that hold the first placement section 91 of the placement element 90 towards the transfer position B2 (mounting target holder 4). Then the control or regulation 7 controls or regulates the pair of heads 21 to release the holding (suction) of the first placement section 91 of the placement element 90 in such a way that the transfer of the first placement section 91 of the placement element 90 to the transfer position B2 (mounting target holder 4) is controlled or regulated.The first placement section 91 of the placement element 90, which was transferred, is held by the mounting target holder 4 at the transfer position B2.

[0058] In the first embodiment, the control unit 7 determines, as in Fig. 7 and Fig. Figure 8 shows the pair of (two) heads 21 holding the first placement section 91 of the placement element 90, among the plurality of (six) heads 21 based on information about the size of the first placement section 91 of the placement element 90, information about the size of the assembly target P placed on the first placement section 91 of the placement element 90, and information about a distance between the pair of heads 21. At this point, the controller 7 detects the width W1 of the assembly target P in the X-direction (the arrangement direction of the heads 21) as the information about the size of the assembly target P placed on the first placement section 91 of the placement element 90. The controllerControl 7 detects the width W2 of the first placement section 91 of the placement element 90 in the X direction as information about the size of the first placement section 91 of the placement element 90. Control 7 detects a distance D1 between the pair of heads 21 as information about the distance between the pair of heads 21 that hold the first placement section 91 of the placement element 90.

[0059] In particular, the control or regulation 7 determines the pair of (two) heads 21 that hold the first placement section 91 of the placement element 90 among the plurality of (six) heads 21 such that the relationship between the distance D1 between the pair of heads 21 that hold the first placement section 91 of the placement element 90, the width W1 of the assembly target P in the X-direction (the arrangement direction of the heads 21) and the width W2 of the first placement section 91 of the placement element 90 in the X-direction W1 < D1 < W2 is satisfied.

[0060] For example, it is assumed that a distance d between adjacent heads 21 is 30 mm. In such a case, if, for example, the width W1 is 20 mm and the width W2 is 40 mm, two heads 21 spaced apart by a distance d(D1) = 30 mm, without any other head 21 being stacked, are defined as a pair of heads 21 for transmission. If, for example, the width W1 is 50 mm and the width W2 is 70 mm, two heads 21 spaced apart by a distance 2d(D1) = 60 mm, with one head 21 being stacked, are defined as a pair of heads 21 for transmission. For example, if the width W1 is 80 mm and the width W2 is 100 mm, two heads 21 spaced apart by a distance 3d (D1) = 90 mm and stacking two heads 21 are defined as a pair of heads 21 for transmission.

[0061] If the width W2 of the first placement section 91 of the placement element 90 in the X direction is less than d, which is a minimum distance between the pair of heads 21 in the head unit 2 (when W2 < d), a head 21 holds and transfers the first placement section 91 of the placement element 90, as previously described. <Erfassung des Zustands des von dem Kopf gehaltenen Platzierungselements>

[0062] In the first embodiment, the component images 5 form the first placement section 91 of the placement element 90, which is held from below (Z2 direction) by the head(s) 21 of the head unit 2 when the head unit 2 transfers the assembly target P from the conveyor unit 1 to the transfer position B2 (assembly target holder 4). The control system 7 detects the state of the first placement section 91 of the placement element 90, which is held by the head(s) 21 of the head unit 2, based on the results of the mapping of the first placement section 91 of the placement element 90 by the component images 5.

[0063] The controller 7 determines whether the first placement section 91 of the placement element 90 is held by the head(s) 21 of the head unit 2, based on the detected state of the first placement section 91 of the placement element 90. If it is determined that the first placement section 91 of the placement element 90 is held by the head(s) 21 of the head unit 2, the controller 7 controls the head unit 2 to continue the process of transferring the first placement section 91 of the placement element 90. Conversely, if it is determined that the first placement section 91 of the placement element 90 is not held by the head(s) 21 of the head unit 2, the controller 7 does not continue the process of transferring the first placement section 91 of the placement element 90.Regulation 7 the head unit 2, for example to perform the repeat operation to repeat the operation to hold the first placement section 91 of the placement element 90.

[0064] The control unit 7 detects the position deviation from the theoretical holding position of the first placement section 91 of the placement element 90 held by the head(s) 21 of the head unit 2, based on the detected state of the first placement section 91 of the placement element 90, and transfers the first placement section 91 of the placement element 90 to the transfer position B2 (mounting target holder 4) in a state in which the detected position deviation has been corrected. <Ankündigung der Größe des Platzierungselements>

[0065] In the first embodiment, the control unit 7 performs, as shown in Fig. Figure 9 shows the control system for announcing the size of the first placement section 91 of the placement element 90, on which the assembly target P to be produced next is placed, based on information about the size of the assembly target P to be produced next and information about the distance between the pair of heads 21 that hold the first placement section 91 of the placement element 90. At this point, the control system 7 detects the width W1 of the assembly target P to be produced next in the X-direction (the arrangement direction of the heads 21) as information about the size of the assembly target P to be produced next. In addition, the control system detectsControl 7 specifies the distance D1, which is a minimum distance between the pair of heads 21, as the distance between pairs of heads 21 that is greater than the width W1 of the next assembly target P to be produced, as the information about the distance between the pair of heads holding the first placement section 91 of the placement element 90. Control 7 announces the width W2 of the first placement section 91 of the placement element 90 in the X-direction, which is greater than the distance D1, as the size of the first placement section 91 of the placement element 90 on which the next assembly target P to be produced is placed.

[0066] For example, let's assume the distance d between adjacent heads 21 is 30 mm. In such a case, if the width W1 is, for example, 20 mm, then d = 30 mm is recorded as the distance D1 and 40 mm is reported as the width W2. If the width W1 is, for example, 40 mm, then 2d = 60 mm is recorded as the distance D1 and 70 mm is reported as the width W2. If the width W1 is, for example, 70 mm, then 3d = 90 mm is recorded as the distance D1 and 100 mm is reported as the width W2. (Assembly processing)

[0067] The assembly process, which is carried out by the component assembly device 100, is now described based on a flowchart with reference to Fig. 10 described. Each step in the flowchart is carried out by the control or regulation 7.

[0068] As in Fig. As shown in 10, the placement element 90 is first carried in in step S1 and transported to the transfer stop position B1 by means of the conveyor unit 1.

[0069] Next, in step S2, the head(s) 21 (one head or the pair of heads 21) of head unit 2 are lowered towards the first placement section 91 of the multitude of first placement sections 91 of placement element 90, which were stopped at the transfer stop position B1. When the pair of heads 21 is lowered, the pair of heads 21 is lowered synchronously.

[0070] Next, in step S3, the first placement section 91 of the placement element 90 is sucked in by the suction nozzle 21a of the head(s) 21 of the head unit 2 in order to be held by the head(s) 21 of the head unit 2.

[0071] Next, in step S4, the head(s) 21 of head unit 2, which holds the first placement section 91 of placement element 90, is / are raised. When the pair of heads 21 is raised, the pair of heads 21 is raised synchronously.

[0072] Next, in step S5, the head unit 2 is moved in the horizontal plane to the position above the transfer position B2 (mounting target holder 4).

[0073] Next, in step S6, the head(s) 21 of head unit 2, which holds the first placement section 91 of the placement element 90, is / are lowered towards the transfer position B2 (mounting target holder 4). When the pair of heads 21 is lowered, the pair of heads 21 is lowered synchronously.

[0074] Next, in step S7, the holding of the first placement section 91 of the placement element 90 is released by means of the head(s) 21 of the head unit 2 and the first placement section 91 of the placement element 90 is held by the mounting target holder 4.

[0075] Next, in step S8, the head(s) 21 of the head unit 2 mount(s) the components E onto the mounting target P, which is held by the mounting target holder 4. In step S8, the mounting target P is moved along the up-down direction or rotated or tilted by means of the mounting target holder 4 such that the orientations and positions of the mounting target surfaces Pa of the mounting target P allow the head(s) 21 of the head unit 2 to perform the mounting. For example, the mounting target P is rotated or tilted such that the mounting target surfaces Pa of the mounting target P are substantially parallel to the horizontal plane. Additionally, for example, the mounting target P is moved up-down such that the mounting target surfaces Pa of the mounting target P are at heights at which the head unit 2 can perform the mounting.When the assembly process at the assembly target P is complete, the assembly target P (the first placement section 91 of the placement element 90) is positioned at a predetermined location by means of the assembly target holder 4, where the assembly target P can be held by the head(s) 21 of the head unit 2. Then, the first placement section 91 of the placement element 90, onto which the assembly target P is placed after assembly, is transferred from the transfer position B2 to the conveyor unit 1 by means of the head(s) 21 of the head unit 2. The assembly process is then complete. (Effects of the first embodiment)

[0076] According to the first embodiment, the following effects are achieved.

[0077] According to the first embodiment, the control unit 7, as previously described, controls the transfer of the assembly target P from the conveying unit 1 to the transfer position B2 (assembly target holder 4), which is located at a position different from that of the conveying unit 1, by controlling the movement of the head unit 2 in the horizontal plane in a state in which the first placement section 91 of the placement element 90 is held by a head or the plurality of heads 21 of the head unit 2. Accordingly, the assembly target P (the first placement section 91 of the placement element 90) can be transferred from the conveying unit 1 to the transfer position B2 (assembly target holder 4) by means of the head unit 2, which assembles the components E, and thus it is not necessary to provide a separate dedicated device for transferring the assembly target P.Consequently, the assembly target P can be transferred, while the complexity of the fixture structure is significantly reduced or eliminated. Moreover, when the assembly target P is transferred, the head unit 2 does not hold the assembly target P itself, but rather the first placement section 91 of the placement element 90, on which the assembly target P is positioned such that, compared to the case where the assembly target P is held directly by the head unit 2, the degree of freedom in selecting a holding position of the head unit 2 can be improved.

[0078] According to the first embodiment, the controller 7, as previously described, controls the lowering of the plurality of heads 21 towards the first placement section 91 of the placement element 90 and the synchronous raising of the plurality of heads 21 that hold the first placement section 91 of the placement element 90, after the plurality of heads 21 have been controlled to hold the first placement section 91 of the placement element 90. Accordingly, the first placement section 91 of the placement element 90 can be raised by means of the plurality of heads 21 while maintaining a secure holding state. Consequently, when the first placement section 91 of the placement element 90 is raised by means of the plurality of heads 21, positional deviation and falling of the first placement section 91 of the placement element 90 can be significantly reduced or prevented.

[0079] According to the first embodiment, the controller 7, as previously described, controls the pair of heads 21 to hold the first placement section 91 of the placement element 90 in such a way that the assembly target P is layered when the plurality of heads 21 hold the first placement section 91 of the placement element 90. Accordingly, the first placement section 91 of the placement element 90 can be held at symmetrical positions over the assembly target P by means of the pair of heads 21, and thus the first placement section 91 of the placement element 90 can be held in a balanced manner. Consequently, when the first placement section 91 of the placement element 90 is transferred, positional deviation and falling of the first placement section 91 of the placement element 90 can be significantly reduced or prevented.

[0080] According to the first embodiment, the suction nozzles 21a are attached to the tips of the heads 21, as described above. Furthermore, the suction nozzles 21a, which are attached to one or more heads 21, draw suction onto the first placement section 91 of the placement element 90 such that the head unit 2 holds the first placement section 91 of the placement element 90. Accordingly, the first placement section 91 of the placement element 90 can be held simply by suction, and thus the heads 21 of the head unit 2 can easily hold the first placement section 91 of the placement element 90.Furthermore, the first placement section 91 of the placement element 90 is held by means of the suction nozzles 21a, which hold the components E in such a way that the suction nozzles 21a can be used together, and thus an increase in the number of components due to the transfer of the first placement section 91 of the placement element 90 can be significantly reduced or prevented. In addition, the degree of freedom in selecting the holding position (suction position) of the head unit 2 can be improved.

[0081] According to the first embodiment, the controller 7, as described above, determines the head(s) 21 that holds the first placement section 91 of the placement element 90 from among the plurality of heads 21 based on the information about the size of the first placement section 91 of the placement element 90, the information about the size of the mounting target P that is placed on the first placement section 91 of the placement element 90, and the information about the distance between the pair of heads 21.Accordingly, the head(s) 21, among the multitude of heads 21 that are in a position suitable for holding, can hold the first placement section 91 of the placement element 90 according to the size of the first placement section 91 of the placement element 90 to be held and the size of the assembly target P placed on this first placement section 91 of the placement element 90. Consequently, if the first placement section 91 of the placement element 90 is held and transferred, positional deviation and falling of the first placement section 91 of the placement element 90 can also be significantly reduced or prevented.

[0082] According to the first embodiment, the controller 7, as previously described, performs the control or regulation to announce the size of the first placement section 91 of the placement element 90, on which the assembly target P is placed, based on information about the size of the assembly target P and information about the distance between the pair of heads 21 that hold the first placement section 91 of the placement element 90. Accordingly, an operator can easily determine the first placement section 91 of the placement element 90, on which the next assembly target P to be produced is placed, from among a variety of first placement sections 91 of placement elements 90 based on the announced size of the first placement section 91 of the placement element 90.

[0083] According to the first embodiment, the component assembly device 100, as previously described, comprises the component images 5, which depict the first placement section 91 of the placement element 90, held by the head(s) 21 of the head unit 2, when the assembly target P is transmitted via the head unit 2. Furthermore, the control system 7 detects the state of the first placement section 91 of the placement element 90, held by the head(s) 21 of the head unit 2, based on the results of the component images 5 depicting the first placement section 91 of the placement element 90.Accordingly, based on the detected state of the first placement section 91 of the placement element 90, it can be confirmed whether the first placement section 91 of the placement element 90 is being held by the head(s) 21 of the head unit 2 or not (whether the holding of the first placement section 91 of the placement element 90 is being performed or not). If the first placement section 91 of the placement element 90 is not being held, the retry process to repeat the process of holding the first placement section 91 of the placement element 90 can, for example, be quickly performed by the head unit 2.Furthermore, the position deviation amount from the theoretical holding position of the first placement section 91 of the placement element 90, held by the head(s) 21 of the head unit 2, can be determined based on the detected state of the first placement section 91 of the placement element 90, and the first placement section 91 of the placement element 90 can be transferred to the transfer position in a state in which the detected position deviation amount has been corrected. Additionally, the first placement section 91 of the placement element 90 can be transferred exactly to the transfer position by correcting the position deviation amount.

[0084] According to the first embodiment, the mounting target P, as previously described, has a three-dimensional shape compared to a flat plate. The component mounting device 100 comprises the mounting target holder 4, which holds the mounting target P over the first placement section 91 of the placement element 90 and moves the held mounting target P along the upward-downward direction, or rotates or tilts the held mounting target P when the head unit 2 performs the mounting operation on the mounting target P. Furthermore, the control unit 7 controls the transfer of the mounting target P from the conveying unit 1 to the mounting target holder 4 by controlling the movement of the head unit 2 in the horizontal plane in a state where the first placement section 91 of the placement element 90 is held by a head or a plurality of heads 21 of the head unit 2.Accordingly, when the assembly target P, which has a complex shape, is transferred from the conveying unit 1 to the assembly target holder 4, the assembly target P can be transferred while significantly reducing or eliminating the complexity of the fixture structure. Additionally, the assembly target P is moved along the up-down direction or rotated or tilted by the assembly target holder 4 in such a way that assembly can be easily performed even on the assembly target P, which has a complex (three-dimensional) shape.

[0085] A second embodiment is now described with reference to Fig. Figures 1, 2, and 11 to 13 describe the first embodiment. This second embodiment describes an example in which, unlike the first embodiment mentioned above, a first placement section of a placement element is held by gripping. The same structures as those of the first embodiment mentioned above are designated by the same reference numerals in the figures, and a description of them is omitted. (Structurality of the component assembly device)

[0086] A component assembly device 200 (see Fig. 1 and Fig. 2) According to the second embodiment of the present invention, the component assembly device 100 differs from the component assembly device 100 according to the first embodiment mentioned above in that a gripper 123 is / are detachably attached to the tip(s) of a head 21 of a head unit 2, as shown in Fig. 11 and Fig. 12 shown.

[0087] In the second embodiment, grippers 123, attached to a head or a plurality of heads 21, each grasp a pair of facing sections (a pair of notches 191c, described below) of a first placement section 191 of a placement element 190 such that the head unit 2 holds the first placement section 191 of the placement element 190. The grippers 123 are arranged together with suction nozzles 21a in nozzle changers (not shown) provided in the component assembly device 200. When the first placement section 191 of the placement element 190 is transferred by means of the head unit 2, the suction nozzles 21a, which are attached to the heads 21 of the head unit 2, are exchanged for the grippers 123.

[0088] The grippers 123 include a gripper 124 (see Fig. 11), which grasps the first placement section 191 of the placement element 190, and a pair of grippers 125 and 126 (see Fig. 12), which grip the first placement section 191 of the placement element 190. Grippers 125 and 126 are examples of a “first gripper” and a “second gripper” respectively in the claims.

[0089] As in Fig. As shown in Figure 11, the gripper 124 is attached to the tip of a head 21 when the first placement section 191 of the placement element 190 is gripped and transferred by means of the head 21. The gripper 124 comprises a pair of gripping sections 124a and 124b facing each other in an X-direction and grips the first placement section 191 of the placement element 190 by means of the pair of gripping sections 124a and 124b.

[0090] The gripping section 124a of the gripper 124 on one side (X1-direction side) is movable in the X-direction (a direction in which the gripping sections 124a and 124b face each other) between a gripping position in which the gripping section 124a grips the first placement section 191 of the placement element 190, and a retracted position in which the gripping section 124a does not grip the first placement section 191 of the placement element 190. On the other side (X2-direction side), the gripping section 124b of the gripper 124 is fixed. The gripper 124 grips the first placement section 191 of the placement element 190 between the gripping section 124a and the gripping section 124b by moving the gripping section 124a from the retracted position to the gripping position.

[0091] The gripping section 124a moves through a negative pressure supplied by a vacuum source 93 (see Fig. 2) is supplied, from the retracted position to the gripping position. Additionally, the gripping section 124a moves from the gripping position to the retracted position when the supply of negative pressure from the vacuum source 93 is stopped. Thus, the vacuum source 93, which is intended to hold components E, can be used to move the gripping section 124a.

[0092] The gripping sections 124a and 124b comprise receiving sections 124c and 124d, respectively, which prevent the first placement section 191 of the placement element 190 from falling. In a state where the receiving sections 124c and 124d hold the first placement section 191 of the placement element 190, the receiving sections 124c and 124d are both oriented towards a lower section of the first placement section 191 of the placement element 190 in an upward-downward direction (Z-direction) beneath the first placement section 191 of the placement element 190.

[0093] As in Fig. As shown in Figure 12, the pair of grippers 125 and 126 are attached to the tips of a pair of heads 21 when the first placement section 191 of the placement element 190 is gripped and transferred by means of the pair of heads 21. The grippers 125 and 126 comprise a gripping section 125a and a gripping section 126a, respectively. The pair of grippers 125 and 126 grip the first placement section 191 of the placement element 190 by means of the gripping section 125a of gripper 125 and the gripping section 126a of gripper 126.

[0094] The gripping section 125a (126a) of the gripper 125 (126) is movable in the X-direction (a direction in which the gripping sections 125a and 126a face each other) between a gripping position in which the gripping section 125a (126a) grips the first placement section 191 of the placement element 190, and a retracted position in which the gripping section 125a (126a) does not grip the first placement section 191 of the placement element 190. The movement mechanism of the gripping section 125a (126a) of the gripper 125 (126) is the same as the movement mechanism of the gripping section 124a of the gripper 124, and therefore its description is omitted. Furthermore, the gripping section 125a (126a) includes a receiving section 125b (126b) which, similar to the gripping section 124a (124b) of the gripper 124, prevents the first placement section 191 of the placement element 190 from falling.

[0095] In the second embodiment, as in Fig. Figure 13 shows that the gripper 125 can grasp the first placement section 191 of the placement element 190 at one point (gripping point Cl) and the gripper 126 can hold the first placement section 191 of the placement element 190 at two points (gripping points C2 and C3) on the side (X2-direction side) opposite the side (X1-direction side) on which the gripper 125 holds the first placement section 191 of the placement element 190. Thus, the gripper 125 holds one side (X1-direction side) of the first placement section 191 of the placement element 190 at one point, and the gripper 126 holds another side (X2-direction side) of the first placement section 191 of the placement element 190 at two points such that the head unit 2 grips the first placement section 191 of the placement element 190 in the manner of a three-point support.The head unit 2 grips the first placement section 191 of the placement element 190 in such a way as a three-point support that the three gripping points of the grippers 125 and 126 are each located at three vertex positions of an isosceles triangle.

[0096] In the second embodiment, the first placement section 191 of the placement element 190 comprises the pair of notches 191c facing each other in the X direction. The head unit 2 grips the pair of notches 191c of the first placement section 191 of the placement element 190 by means of the pair of gripping sections 124a and 124b of a gripper 124, or grips the pair of notches 191c of the first placement section 191 of the placement element 190 by means of the pair of grippers 125 and 126.

[0097] The pair of notches 191c each includes a guide 191e having a shape that gradually tapers towards a gripping position 191d of the gripper 124 (125, 126) in the placement element 190. The guide 191e guides the gripper 124 (125, 126) to the gripping position 191d by guiding the gripping section 124a (124b, 125a, 126a) of the gripper 124 (125, 126) along the gradually tapered shape.

[0098] In a Y-direction, the width W3 of the entry of each of the notches 191c is greater than the width W4 of the gripper 125 (126). Moreover, in the Y-direction, the width W5 of each of the notches 191c at the gripping position 191d is less than the width W3 of the entry of each of the notches 191c and is equal to or greater than the width W4 of the gripper 125 (126). In particular, in the Y-direction, the width W5 of each of the notches 191c at the gripping position 191d is substantially equal to or slightly greater than the width W4 of the gripper 125 (126).

[0099] The remaining structures of the second embodiment are similar to those of the previously mentioned first embodiment. (Effects of the second embodiment)

[0100] According to the second embodiment, the following effects are achieved.

[0101] According to the second embodiment, the grippers 123 are attached to the tips of the heads 21, as described above. Furthermore, the grippers 123 attached to one or more heads 21 each grip the pair of facing sections (pair of notches 191c) of the first placement section 191 of the placement element 190 such that the head unit 2 holds the first placement section 191 of the placement element 190. Accordingly, the first placement section 191 of the placement element 190 can be held more securely compared to the case where it is held by suction. Therefore, when the first placement section 191 of the placement element 190 is held and transferred, positional deviation and falling of the first placement section 191 of the placement element 190 can be significantly reduced or prevented.

[0102] According to the second embodiment, the first placement section 191 of the placement element 190, as previously described, comprises the pair of notches 191c facing each other. Furthermore, the head unit 2 grips the pair of notches 191c of the first placement section 191 of the placement element 190 by means of a gripper 124 or grips the pair of notches 191c of the first placement section 191 of the placement element 190 by means of the pair of grippers 125 and 126. Accordingly, in a state in which the gripper 124 (125, 126) is positioned at gripping position 191e by means of the pair of notches 191c of the first placement section 191 of the placement element 190, the pair of notches 191c of the first placement section 191 of the placement element 190 can be gripped and thus the positional deviation of the first placement section 191 of the placement element 190 can be effectively and significantly reduced or prevented.

[0103] According to the second embodiment, as previously described, the pair of notches 191c of the first placement section 191 of the placement element 190 each comprise the guide 191e, which has a shape that gradually tapers towards the gripping position 191d of the gripper 124 (125, 126) in the first placement section 191 of the placement element 190 in order to guide the gripper 123 to the gripping position 191d. Accordingly, in a state in which the gripper 124 (125, 126) is reliably positioned by the guide 191e of the first placement section 191 of the placement element 190 at the gripping position 191d, the pair of notches 191c of the first placement section 191 of the placement element 190 can be gripped.

[0104] According to the second embodiment, the grippers 123, as previously described, comprise the gripper 125, which is capable of holding the first placement section 191 of the placement element 190 at one point, and the second gripper 126, which is capable of holding the first placement section 191 of the placement element 190 at two points. Furthermore, the gripper 125 holds one side of the first placement section 191 of the placement element 190 at one point, and the gripper 126 holds another side of the first placement section 191 of the placement element 190 at two points such that the head unit 2 grips the first placement section 191 of the placement element 190 in the manner of a three-point support.If one side of the first placement section 191 of the placement element 190 and another side of the first placement section 191 of the placement element 190 are each held at two points (four points in total), a gap can occur between the gripper and the first placement section 191 of the placement element 190 at any of the four gripping points of the gripper. Therefore, if the first placement section 191 of the placement element 190 is gripped in the manner of a three-point support, as described above, the occurrence of a gap between the gripper 125 or 126 and the first placement section 191 of the placement element 190 at any of the three gripping points can be prevented. Consequently, the first placement section 191 of the placement element 190 can be gripped more stably.

[0105] The remaining effects of the second embodiment are similar to those of the previously mentioned first embodiment. (Modified examples)

[0106] The embodiments disclosed herein are intended to illustrate, not limit, the invention in all respects. The scope of protection of the present invention is not defined by the aforementioned description of the embodiments, but rather by the scope of protection of the patent claims, and moreover, it includes all modifications (modified examples) within the meaning and scope of protection that are equivalent to the scope of protection of the patent claims.

[0107] For example, although each of the aforementioned first and second embodiments illustrates an example in which the mounting target has a three-dimensional shape compared to that of a flat plate, the present invention is not limited to such examples. According to the present invention, it is possible for the mounting target to not have a three-dimensional shape compared to that of a flat plate, as long as it is conveyed in a state where it is placed on the placement element. For example, the mounting target can be a printed circuit board (rigid or flexible) having the shape of a flat plate and placed on the placement element.

[0108] Although each of the aforementioned first and second embodiments illustrates an example in which the head unit comprises a plurality of heads arranged in a row, the present invention is not limited thereto. For example, the head unit can be a so-called rotatable head unit comprising a plurality of heads arranged in a circle.

[0109] Although each of the aforementioned first and second embodiments illustrates an example in which the transfer position is the mounting target holder, the present invention is not limited thereto. According to the present invention, the transfer position can be a position different from the mounting target holder.

[0110] Although each of the aforementioned first and second embodiments illustrates an example in which the placement element, comprising the plurality of first placement sections on which the plurality of mounting targets are placed, and the second placement section on which the plurality of first placement sections are placed, is carried in and the first placement section of the placement element is transferred by means of the head unit, the present invention is not limited thereto. For example, a single placement element on which a single mounting target is placed can be carried in and the carried-in single placement element can be transferred by means of the head unit.

[0111] Although each of the aforementioned first and second embodiments shows an example in which the suction nozzle(s) draws in the placement element in such a way that the head unit holds the placement element, and the aforementioned second embodiment shows an example in which the gripper(s) grasp the placement element in such a way that the head unit holds the placement element, the present invention is not limited thereto. For example, an engagement tool(s) that engages with the placement element by a method different from gripping can be attached to the tip(s) of the head(s) of the head unit, and the engagement tool(s) can engage with the placement element in such a way that the head unit holds the placement element.

[0112] Although each of the aforementioned first and second embodiments illustrates an example in which the placement element is held by means of a plurality of heads, the present invention is not limited thereto. For example, if the placement element is held by means of a plurality of heads, the placement element can be held by means of a plurality of heads other than a pair of heads (for example, three heads).

[0113] Alternatively, if the placement element is held by a multitude of heads, the placement element can be held by a multitude of pairs of heads.

[0114] Although each of the aforementioned first and second embodiments illustrates an example in which, while holding the placement element, a plurality (a pair) of heads are lowered synchronously towards the placement element, the present invention is not limited thereto. According to the present invention, as long as the plurality of heads are raised or lowered synchronously after the placement element is held, it is possible for the plurality of heads not to be lowered synchronously before the placement element is held.

[0115] Although each of the aforementioned first and second embodiments illustrates an example in which the component images are used as images representing the placement element held by the head unit, the present invention is not limited thereto. For example, dedicated images can be used as the images representing the placement element held by the head unit.

[0116] Although the aforementioned first embodiment demonstrated the example in which the suction nozzles for component assembly are used as suction nozzles for transmission, the present invention is not limited thereto. For example, suction nozzles dedicated to transmission can be used as the suction nozzles for transmission.

[0117] Although the previously mentioned second embodiment showed an example in which the placement element comprises the pair of notches facing each other for gripping, the present invention is not limited thereto. For example, the placement element may comprise a pair of openings for gripping that face each other. Alternatively, it is possible that the placement element does not include the pair of notches or openings facing each other.

[0118] Although the previously mentioned second embodiment showed an example in which each of the pair of notches of the placement element encompasses the guide having a shape that gradually tapers towards the gripping position, the present invention is not limited thereto. For example, as in the modified example shown in Fig.As shown in Figure 14, a first placement section 291 of a placement element 290 has a pair of right-angled notches 291c.

[0119] Description of reference symbols 1 conveying unit 2 head unit 4 mounting target holders 5 component images (images) 7 Control or regulation 21 heads 21a Suction nozzle 90, 91, 190, 191, 290, 291 Placement element 100, 200 component assembly device 123 grippers 124 grippers 125 grippers (first gripper) 126 grippers (second gripper) 191c, 291c notch 191d Gripping position 191e Guided Tour E component P Assembly target

Claims

[1] Component assembly device (100, 200), comprising: a conveying unit (1) that conveys a placement element (90, 91, 190, 191, 290, 291) on which an assembly target (P) is placed; a head unit (2) comprising a head (21) which holds a component (E) and mounts the held component (E) on the assembly target (P), wherein the head unit (2) is movable in a horizontal plane; and a control or regulation (7) that controls or regulates the operation of the head unit (2); wherein the head unit (2) comprises the head (21) or a plurality of heads (21), and The control or regulation (7) of the transfer of the assembly target (P) from the conveying unit (1) to a transfer position (B2) located at a position different from that of the conveying unit (1) is controlled or regulated by controlling or regulating at least the movement of the head unit (2) in the horizontal plane in a state in which the placement element (90, 91, 190, 191, 290, 291) is held by means of the head (21) or a plurality of heads (21) of the head unit (2). [2] Component assembly device (100, 200) according to claim 1, wherein, in the case in which the placement element (90, 91, 190, 191, 290, 291) is held by the plurality of heads (21), the control or regulation (7) controls the lowering of the plurality of heads (21) towards the placement element (90, 91, 190, 191, 290, 291) and the synchronous raising of the plurality of heads (21) holding the placement element (90, 91, 190, 191, 290, 291), after controlling or regulating the plurality of heads (21) to hold the placement element (90, 91, 190, 191, 290, 291). [3] Component assembly device (100, 200) according to claim 1 or 2, wherein in the case in which the placement element (90, 91, 190, 191, 290, 291) is held by the plurality of heads (21), the control or regulation (7) controls or regulates one or more pairs of the heads (21) in order to hold the placement element (90, 91, 190, 191, 290, 291) in such a way that the assembly target (P) is layered. [4] Component assembly device (100, 200) according to any one of claims 1 to 3, which further comprises a suction nozzle (21a) attached to a tip of the head (21); wherein the suction nozzle (21a) attached to the one head (21) or the plurality of heads (21) draws in the placement element (90, 91, 190, 191, 290, 291) such that the head unit (2) holds the placement element (90, 91, 190, 191, 290, 291). [5] Component assembly device (100, 200) according to any one of claims 1 to 3, which further comprises a gripper (123, 124, 125, 126) attached to a tip of the head (21); wherein the gripper (123, 124, 125, 126) attached to the one head (21) or the plurality of heads (21) grips a pair of facing sections of the placement element (90, 91, 190, 191, 290, 291) such that the head unit (2) holds the placement element (90, 91, 190, 191, 290, 291). [6] Component assembly device (100, 200) according to claim 5, wherein the placement element (90, 91, 190, 191, 290, 291) comprises a pair of notches (191c, 291c) or openings facing each other; and the head unit (2) grips the pair of notches (191c, 291c) or openings of the placement element (90, 91, 190, 191, 290, 291) by means of the gripper (123, 124, 125, 126) or grips the pair of notches (191c, 291c) or openings of the placement element (90, 91, 190, 191, 290, 291) by means of a pair of grippers (125, 126). [7] Component assembly device (100, 200) according to claim 6, wherein the pair of notches (191c, 291c) or openings of the placement element (90, 91, 190, 191, 290, 291) each comprises a guide (191e) having a shape which gradually tapers towards a gripping position (191d) of the gripper (123, 124, 125, 126) in the placement element (90, 91, 190, 191, 290, 291) in order to guide the gripper (123, 124, 125, 126) to the gripping position (191d). [8] Component assembly device (100, 200) according to any one of claims 5 to 7, wherein the gripper (123, 124, 125, 126) comprises a first gripper (125) capable of holding the placement element (90, 91, 190, 191, 290, 291) at one point, and a second gripper (126) capable of holding the placement element (90, 91, 190, 191, 290, 291) at two points; and the first gripper (125) holds one side of the placement element (90, 91, 190, 191, 290, 291) at one point and the second gripper (126) holds another side of the placement element (90, 91, 190, 191, 290, 291) at the two points such that the head unit (2) grips the placement element (90, 91, 190, 191, 290, 291) in the manner of a three-point support. [9] Component assembly device (100, 200) according to any one of claims 1 to 8, wherein, in the case where the placement element (90, 91, 190, 191, 290, 291) is held by the plurality of heads (21), the control or regulation (7) determines the head (21) holding the placement element (90, 91, 190, 191, 290, 291) under the plurality of heads (21) based on information about a size of the placement element (90, 91, 190, 191, 290, 291), information about a size of the assembly target (P) placed on the placement element (90, 91, 190, 191, 290, 291), and information about a distance between a pair of heads (21). [10] Component assembly device (100, 200) according to any one of claims 1 to 9, wherein, in the case where the placement element (90, 91, 190, 191, 290, 291) is held by the plurality of heads (21), the control or regulation (7) performs the control or regulation (7) to announce a size of the placement element (90, 91, 190, 191, 290, 291) on which the assembly target (P) is placed, based on information about a size of the assembly target (P) and information about a distance between a pair of the heads (21) that hold the placement element (90, 91, 190, 191, 290, 291). [11] Component assembly device (100, 200) according to any one of claims 1 to 10, which furthermore comprises an image (5) that images the placement element (90, 91, 190, 191, 290, 291) held by the head (21) of the head unit (2) when the assembly target (P) is transmitted by means of the head unit (2); wherein the control or regulation (7) detects a state of the placement element (90, 91, 190, 191, 290, 291) held by the head (21) of the head unit (2) based on a result of the image of the placement element (90, 91, 190, 191, 290, 291) by the image (5). [12] Component assembly device (100, 200) according to any one of claims 1 to 11, wherein the assembly target (P) has a three-dimensional shape compared to the shape of a flat plate; The component assembly device (100, 200) further comprises an assembly target holder (4) which holds the assembly target (P) over the placement element (90, 91, 190, 191, 290, 291) and moves the held assembly target (P) along an upward-downward direction or rotates or tilts the held assembly target (P) when the head unit (2) performs the assembly on the assembly target (P); and the control or regulation (7) the transfer of the assembly target (P) from the conveying unit (1) to the assembly target holder by controlling or regulating the movement of the head unit (2) in the horizontal plane in the state in which the placement element (90, 91, 190, 191, 290, 291) is held by means of a head (21) or the plurality of heads (21) of the head unit (2).

Images