POWER CONVERSION DEVICE

Abstract

Power conversion device (100), comprising: a circuit body (6) that converts a direct current into an alternating current; a driver circuit board (5) that drives the circuit body (6); a base element (4) arranged between the circuit body (6) and the driver circuit board (5); and a housing (1) that accommodates the circuit body (6) and the base element (4), wherein the base element (4) forms a first current channel formation section (4A) which forms a current channel space (1C1) between the circuit body (6) and the base element (4), and comprising a first extension section (4B2) extending from the first current channel formation section (4A) and connected to an inner surface of the housing (1), wherein the circuit body (6) includes a signal terminal (6E) which receives a driver signal from the driver circuit board (5), the basic element (4) comprises a second extension section (4B1) extending from the first current channel formation section (4A) to the vicinity of the signal terminal (6E), and a through hole (4F), through which the signal connection (6E) runs, is formed in the second extension section (4B1), and wherein the first current channel formation section (4A), the first extension section (4B2) and the second extension section (4B1) are integrally formed.

Description

Technical field

[0001] The present invention relates to a power conversion device that converts direct current power into alternating current power or converts alternating current power into direct current power, and in particular a power conversion device suitable for installation in a vehicle. Current state of the art

[0002] The prior art is represented by a power conversion device as described in JP 2014-072938 A (PTL 1). In the power conversion device of PTL 1, a first current path forming body, a first base plate, a second current path forming body, power semiconductor modules, a capacitor module, a driver circuit board, and a control circuit board are arranged in a housing, and a cover covers the inside of the housing in which these components are contained (see paragraph 0015). Of these components, the control circuit board is mounted on a second base plate, and the second base plate comprises a first mounting element connected to a first support element extending from the first base plate, a second mounting element connected to a second support element extending from the second current path forming body, and a third mounting element directly connected to the housing (see paragraphs 0020 to 0024).In PTL 1, the terms "first," "second," and "third" are not used for the "first mounting part," "second mounting part," and "third mounting part"; however, in this description, the terms "first," "second," and "third" have been added to distinguish each mounting part. In the power conversion device, because the third mounting part is directly connected to the enclosure, electromagnetic noise radiated by the power semiconductor module flows through the second base plate, the third mounting part, and the enclosure to ground, thus shielding the control circuit board from the electromagnetic noise (see paragraph 0024).

[0003] In the power conversion device of PTL 1, as in Fig. Figure 3 shows the first fastening part, the second fastening part and the third fastening part arranged at five locations along an outer circumference of the second base plate; in particular, the third fastening part is arranged at a corner of the rectangular second base plate.

[0004] PTL 2 discloses an inverter device comprising a main circuit section with smoothing capacitors, some of which are arranged in a cooling medium channel.

[0005] PTL 3 discloses an inverter device comprising a metallic base element, a switching element arranged on a first surface of the base element, a control board arranged on a second surface of the base element, and a driver mounted on the control board to switch the switching element. List of quotations Patent literature PTL 1: JP 2014-072938 A PTL 2: DE 689 20 513 T2 PTL 3: JP 2000 - 60 149 A Summary of the invention; Technical task

[0006] A power semiconductor module comprises a circuit body (current conversion circuit section) that converts direct current (DC) to alternating current (AC). Electromagnetic noise is generated in the current conversion circuit section of the power semiconductor module and propagates from the power semiconductor module, or from interconnecting wiring between the power semiconductor module and an electrical circuit component arranged around the power semiconductor module, to the second base plate and control board. In the PTL 1 power conversion device, the electromagnetic noise propagating to the control board can be blocked by the second base plate, and the electromagnetic noise can then flow from the second base plate through the enclosure to ground. In this case, the enclosure serves as a reference ground corresponding to earth potential.

[0007] The second base plate, on which the control board is mounted, is in contact with the housing at one corner of its rectangular shape. Therefore, the section of the second base plate connected to the housing as a reference ground is limited to a narrow area (a small surface) at one corner. Thus, the power conversion device of PTL 1 has a limitation in improving its effectiveness in reducing electromagnetic noise.

[0008] In the following, the power semiconductor module that converts a direct current into an alternating current is referred to as a circuit body, and a board that drives the circuit body is referred to as a driver board.

[0009] One object of the present invention is to provide a power conversion device capable of reducing the influence of electromagnetic noise propagating from a circuit body to a driver circuit board. Technical solution

[0010] The aforementioned problem is achieved by the subject matter of the attached set of claims. In particular, the claimed subject matter comprises a power conversion device with a contact section that is in contact with an inner surface of a housing, arranged in a base element that supports a driver circuit board, thereby increasing the contact length or contact area of ​​the contact section and facilitating the flow of electromagnetic noise from the base element to the housing. Advantageous effects of the invention

[0011] According to the present invention, the influence of electromagnetic noise propagating from the circuit body to the driver circuit board can be reduced.

[0012] Other tasks, configurations and effects such as those described above will become apparent from the following description of embodiments. Brief description of the drawings [ Fig. 1] Fig. Figure 1 shows a perspective view of the appearance of a current conversion device 100 according to an embodiment of the present invention. [ Fig. 2] Fig. Figure 2 shows a cross-sectional view of the current conversion device 100 according to an embodiment of the present invention. [ Fig. 3] Fig. Figure 3 shows a perspective view of a power semiconductor module 6 of the current conversion device 100 according to an embodiment of the present invention, viewed from a base element 4. [ Fig. 4] Fig. Figure 4 shows a top view of the current conversion device 100 according to an embodiment of the present invention, in which an upper cover 2, a control circuit board 5 and the base element 4 have been removed and the interior of a housing 1 is visible from above. Fig. 1 is shown. [ Fig. 5] Fig. Figure 5 shows a perspective view of the base element 4 of the current conversion device 100 according to an embodiment of the present invention, viewed from a current conversion device. [ Fig. 6] Fig. Figure 6 shows an exploded view of the power conversion device 100 according to an embodiment of the present invention. Description of embodiments

[0013] A power conversion device according to an embodiment of the present invention is described below with reference to the drawings. Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5 to Fig. 6. As described below, the same components are designated by the same reference symbols and an overlapping description is omitted.

[0014] The power conversion device according to an embodiment of the present invention is intended for use in hybrid vehicles or electric vehicles and can also be a device used in other devices, such as a household appliance inverter in a refrigerator or air conditioner or an inverter in industrial equipment.

[0015] Fig. Figure 1 shows a perspective view of the appearance of a current conversion device 100 according to an embodiment of the present invention.

[0016] Fig. Figure 2 shows a cross-sectional view of the current conversion device 100 according to an embodiment of the present invention. Fig. 2 represents a cross-section along line II-II of Fig. 1. In the following description, when naming and describing a direction from top to bottom, the direction from top to bottom is based on a direction from top to bottom in Fig. 1 and does not necessarily correspond to a top-to-bottom direction in a state in which the power conversion device 100 is mounted.

[0017] As in Fig. Figure 2 shows a housing 1 accommodating a power semiconductor module 6, a driver circuit board (control circuit board) 5, an electrical peripheral circuit component of the power semiconductor module 6 and the like, and an upper end of the housing 1 is covered by an upper cover (first cover) 2 and a lower end of the housing 1 is covered by a lower cover (second cover) 3.

[0018] As in Fig. Figure 1 shows an outlet pipe connection section 1C3 and an inlet pipe connection section (not shown) for a cooling medium, each arranged on side faces of the housing 1. The inlet pipe connection section is located on the side face opposite the side face on which the outlet pipe connection section 1C3 is located. The cooling medium is fed into the power conversion device 100 through the inlet pipe connection section, discharged from the power conversion device 100 to the outside through the outlet pipe connection section 1C3, and circulates within and outside the power conversion device 100.

[0019] Housing 1 has an opening 1E, and AC busbars 12A, 12B, and 12C are inserted through opening 1E and protrude from the inside of housing 1 to the outside. AC busbars 12A, 12B, and 12C are wiring elements (conductive elements) that supply alternating current. AC busbar 12A is connected to a U-phase, AC busbar 12B is connected to a V-phase, and AC busbar 12C is connected to a W-phase. AC busbars 12A, 12B, and 12C are connected to a motor (not shown) and carry out AC power transmission with the motor.

[0020] Furthermore, the housing 1 has another opening 1F, and a GS positive electrode connection 8A and a GS negative electrode connection 8B are inserted through the opening 1F and protrude from the inside of the housing 1 to the outside. The GS positive electrode connection 8A and the GS negative electrode connection 8B are connected to a battery and carry out GS current transmission.

[0021] A signal connector 11 protrudes upwards from the upper cover 2. The signal connector 11 is attached to the driver circuit board 5, passes through an opening 2A formed in the upper cover 2 and protrudes from the inside of the housing 1 to the outside.

[0022] The signal connector 11 is connected to a host control device located in the vehicle to perform the sending and receiving of a signal.

[0023] As in Fig. Figure 2 shows that the housing 1 is divided by a first partition 1A and a second partition 1B into a first chamber (first recording chamber) 1X, a second chamber (second recording chamber) 1Y, and a third chamber (third recording chamber) 1Z. Furthermore, the first chamber 1X is subdivided by a base element 4 into an upper chamber 1X1 and a lower chamber 1X2.

[0024] The first compartment 1X contains the base element 4, the driver circuit board 5, the power semiconductor module (circuit body) 6, and a current sensor 10 as the main components. The driver circuit board 5 is located in the upper compartment 1X1. The power semiconductor module 6 and the current sensor 10 are located in the lower compartment 1X2. Thus, the upper compartment 1X2 provides a receiving space (a receiving chamber) for the driver circuit board 5, and the lower compartment 1X2 provides a receiving space (a receiving chamber) for the power semiconductor module 6 and the current sensor 10.

[0025] The base element 4, which divides the upper space 1X1 and the lower space 1X2, is attached such that fastening sections 4C are fastened to a plurality of housing-side base element fastening sections 1D arranged within the housing 1. A screw fastening can be used as a specific fastening method. The base element 4 is fastened such that an outer circumferential edge of the base element 4 is in contact with an inner surface of the housing 1 and with an upper end of the second partition 1B when fastened to the housing-side base element fastening sections 1D.

[0026] The driver circuit board 5, located in the upper space 1X1, is mounted on the base element 4, and fastening sections 5A are attached to a plurality of base-element-side plate support sections 4D, each of which is located on the base element 4. The plurality of base-element-side plate support sections 4D are designed as convex sections that project upwards from an upper surface of the base element 4. A screw fastening can be used as a specific fastening method. Thus, the driver circuit board 5 is directly supported by the base element 4.

[0027] In the lower space 1X2, the power semiconductor module 6 is in the middle, oriented in a left-right direction. Fig. 2 arranged and the current sensor 10 is in a space at the right end in the left-right direction in Fig. 2 arranged. In the cross-section of Fig. 2. A current channel wall 1A1 is formed on the first partition wall 1A of the housing 1, and a current channel wall 4E is formed on the base element 4 in the central section, extending from left to right. The current channel wall 1A1 is configured to project upwards (towards the base element 4) from the first partition wall 1A. The current channel wall 4E is configured to project downwards (towards the first partition wall 1A) from the base element 4. A first current channel formation section 4A is formed on the current channel wall 4E of the base element 4 and on an inner surface of the current channel wall 4E. A second current channel formation section 1A2 is formed on an inner surface of the current channel wall 1A1 of the first partition wall 1A.

[0028] The direction from left to right in Fig. 2 is a direction along a plate surface of the base element 4 and a wall surface of the first partition wall 1A and is parallel to the plate surface of the base element 4 and wall surface of the first partition wall 1A.

[0029] The power semiconductor module 6 is arranged such that it is positioned between the current channel wall 1A1 and the current channel wall 4E, with a lower surface of the power semiconductor module 6 facing the first partition wall 1A of the housing 1 and an upper surface of the power semiconductor module 6 facing the base element 4. This creates a first current channel section (first current channel space) 1C1 between the upper surface of the power semiconductor module 6 and a lower surface of the base element 4, and a second current channel section (second current channel space) 1C2 between the lower surface of the power semiconductor module 6 and an upper surface of the first partition wall 1A.The first flow channel section 1C1 and the second flow channel section 1C2 are connected to the outlet pipe connection section 1C3 and the inlet pipe connection section, arranged on the side surfaces of the housing 1, and the cooling flow passes through the inlet pipe connection section and outlet pipe connection section 1C3 in the first flow channel section 1C1 and second flow channel section 1C2.

[0030] The current conversion device 100 comprises a current conversion circuit section 6C, which converts a direct current into an alternating current, and the driver circuit board 5, which drives the current conversion circuit section 6C. In the present embodiment, since a control circuit is mounted on the control circuit board 5, the driver circuit board 5 can be referred to as a control circuit board.

[0031] The power semiconductor module 6 receives DC power supplied by a DC positive electrode terminal 8A and a DC negative electrode terminal 8B via a filter circuit 8 and a smoothing capacitor 9, and converts the DC power into AC power in the current conversion circuit section 6C. The filter circuit 8 is located in the second compartment (second receiving chamber) 1Y of the housing 1, and the smoothing capacitor 9 is located in the third compartment (third receiving chamber) 1Z of the housing 1. The second compartment 1Y provides a receiving space (receiving chamber) for the filter circuit 8, and the third compartment 1Z provides a receiving space (receiving chamber) for the smoothing capacitor 9.

[0032] A GS busbar 14 is arranged on a lower surface of the first partition wall 1A of the housing 1.

[0033] This means that the DC busbar 14 is arranged on a surface of the first partition 1A that faces the smoothing capacitor 9. The DC busbar 14 comprises two DC busbars: a positive electrode DC busbar and a negative electrode DC busbar. The smoothing capacitor 9 is electrically connected to the DC busbar 14, and an upwardly bent terminal section 14A is connected to a DC terminal 6G of the power semiconductor module 6. Thus, the DC busbar 14 connects the power semiconductor module 6, the smoothing capacitor 9, and the filter circuit 8 to each other and transmits a current supplied by the DC positive electrode terminal 8A and DC negative electrode terminal 8B to the power semiconductor module 6.

[0034] As previously described, the housing 1 comprises the filter circuit 8, including the DC terminals 8A and 8B, the smoothing capacitor 9, the base element 4, the driver circuit board 5, the power semiconductor module 6, the current sensor 10, the DC busbar 14, and the AC busbars 12A, 12B, and 12C. The DC terminals 8A and 8B and the AC busbars 12A, 12B, and 12C are partially exposed to the outside of the housing and are electrically connected to an external device.

[0035] The upper cover 2 closes the opening on the top side of the housing 1 to protect the components inside the housing 1, acting as a lid. The signal connector 11 sends and receives a signal to and from the outside and transmits the signal to the driver circuit board 5. The AC busbars 12A, 12B, and 12C receive AC power from the power semiconductor module 6 and transmit the AC power to the motor.

[0036] The configuration of the power semiconductor module 6 is in relation to Fig. 3 together with Fig. 2 described. Fig. Figure 3 shows a perspective view of the power semiconductor module 6 of the current conversion device 100 according to an embodiment of the present invention, viewed from the base element 4.

[0037] The current conversion circuit section 6C comprises a switching element, such as an insulated gate bipolar transistor (IGBT) or a diode. Furthermore, the current conversion circuit section 6C may include a conductor frame that carries a current flowing through the switching element, and a resin sealant 6D that seals the conductor frame and the switching element. The conductor frame is exposed from the resin sealant 6D and represents the DC terminal 6G and an AC terminal 6F. Fig. 3).

[0038] The power semiconductor module 6 comprises the current conversion circuit section 6C, a first fin base 6A, and a second fin base 6B. The current conversion circuit section 6C includes a signal terminal 6E, which receives a driver signal from the driver circuit board 5. The current conversion circuit section 6C is located between the first fin base 6A and the second fin base 6B, and the outer surfaces of the first fin base 6A and the second fin base 6B are in direct contact with the cooling medium. That is, an upper surface of the first fin base 6A is exposed in the first current channel section 1C1, and a lower surface of the second fin base 6B is exposed in the second current channel section 1C2.

[0039] The power semiconductor module 6 comprises the GS terminal 6G connected to the GS busbar 14, the WS terminal 6F connected to the WS busbars 12A, 12B and 12C, and the signal terminal 6E connected to the driver circuit board 5. The number of each of the following is multiple: GS busbar 14, GS terminal 6G, WS busbar 12A, 12B and 12C, WS terminal 6F and signal terminal 6E.

[0040] The first fin base 6A and the second fin base 6B comprise a heat distribution fin 6H and the heat distribution fin 6H distributes heat generated by the power semiconductor module 6 to a cooling water feedthrough comprising the first current channel section 1C1 and the second current channel section 1C2.

[0041] An internal configuration of the housing 1 and an electrical wiring of the power semiconductor module 6 is described in relation to Fig. 4 described. Fig. Figure 4 shows a top view of the current conversion device 100 according to an embodiment of the present invention, in which the upper cover 2, the control circuit board 5 and the base element 4 are removed and the interior of the housing 1 is visible from above. Fig. 1 is shown.

[0042] The housing 1 contains the mounting sections (base element mounting sections) 1D, which secure the base element 4, and a contact section 1G, which is in contact with an outer circumferential section (outer edge section) of the base element 4. The contact section 1G represents a base element receiving section that receives the base element 4. The housing 1 has a rectangular outer shape on a surface Fig. The contact section 1G is formed on an inner circumferential side of an outer circumferential wall section (side wall section) 1H, which has a rectangular shape. The contact section 1G extends over the entire circumference of the outer circumferential wall section 1H along the inner circumferential surface of the outer circumferential wall section 1H.

[0043] The fastening sections 1D are arranged at a plurality of positions on the inside relative to the contact section 1G. In the present embodiment, since the fastening sections 1D are arranged at at least four corners of the outer circumferential wall section 1H and in the middle of the second partition 1B, the base element 4 is in close contact with the upper edges of the contact section 1G and the second partition 1B when the base element 4 is attached to the fastening sections 1D.

[0044] The filter circuit 8 is electrically connected to the DC busbar 14 via terminals 8C and 8D in the filter circuit housing 1Y. Thus, the filter circuit 8 is electrically connected to the smoothing capacitor 9 via the DC busbar 14.

[0045] The current conversion circuit section 6C of the power semiconductor module 6 is electrically connected to the GS busbar 14 and the smoothing capacitor 9 in the power semiconductor module receiving space 1X2.

[0046] The second partition 1B of the housing 1 forms a filter shield between the power semiconductor module 6 and the filter circuit 8. Since the filter circuit 8 is shielded from the power semiconductor module 6 by the second partition 1B and the base element 4, the propagation of electromagnetic noise generated in the power semiconductor module 6 to the filter circuit 8 can be prevented.

[0047] The AC terminals 6F of the power semiconductor module 6 are connected to the AC busbars 12A, 12B, and 12C and are electrically connected to an external motor via the current sensor 10 housed in the enclosure 1. The current sensor 10 is electrically connected to the driver circuit board 5 and sends and receives a signal to and from the driver circuit board 5 for controlling the motor. For this purpose, the current sensor 10 is equipped with a sensor connection cable (not shown), and the sensor connection cable is electrically connected to the driver circuit board 5 via a cutout section 4H (see Figure 1). Fig. 5) of the base element 4 connected.

[0048] Basic element 4 is described below in relation to Fig. 5 described. Fig. Figure 5 shows a perspective view of the base element 4 of the current conversion device 100 according to an embodiment of the present invention, viewed from a current conversion device.

[0049] A contact section 4G, which is in contact with the contact section 1G (housing-side contact section) of the housing 1, is arranged on the outer circumferential edge of the base element 4. The previously described cutout section 4H is formed in the outer circumferential edge of the base element 4. The cutout section 4H is a cutout through which the sensor connection cable runs. In the present embodiment, only the cutout section 4H is a section that is not in contact with the housing-side contact section 1G. For other purposes, a section that is not in contact with the housing-side contact section 1G may also be present.However, in order to increase the contact area with the housing-side contact section 1G, the number of non-contact sections and the area of ​​the non-contact section are preferably kept as small as possible. In the present embodiment, the ratio of the length of the non-contact section to the length of the outer circumferential edge of the base element 4 is less than 1 / 10 (10%).

[0050] Furthermore, in the base element 4, the first current channel formation section 4A is arranged in the center of the base element 4 in a first direction parallel to the plate surface of the base element 4, and second extension sections 4B1 extending from the first current channel formation section 4A in the first direction are arranged on opposite sides of the first current channel formation section 4A in the first direction. Furthermore, a first extension section 4B2 and a third extension section 4B3 each extend from the second extension sections 4B1 in the first direction away from the first current channel formation section 4A. The first extension section 4B2 is a section extending above the current sensor 10, and the third extension section 4B3 is a section extending above the filter circuit 8.

[0051] A multitude of through-holes 4F, into which the signal connections 6E are inserted, are arranged in the second extension section 4B1. Outer circumferential edge sections of the base element 4 in the first extension section 4B2 and third extension section 4B3 constitute part of the base element-side contact section 4G. Outer circumferential edge sections 4G of the first extension section 4B2, the second extension section 4B1, and the third extension section 4B3, arranged at opposite ends in a second direction parallel to the plate surface of the base element 4 and orthogonal to the first direction, also constitute part of the base element-side contact section 4G.

[0052] The first current channel formation section 4A, the second extension section 4B1, the first extension section 4B2, and the third extension section 4B3 are integrally formed, such that the base element 4 has advantageous thermal conductivity. Furthermore, a section 4K, designated by reference numeral 4K, represents a filter shield wall contact section, which is in contact with the second partition (filter shield wall) 1B, shown in Fig. 4, stands.

[0053] The base element 4 is made of metal, and the current channel wall 4E is also made of metal. The first rib base 6A of the power semiconductor module 6 is also made of metal, and the current channel wall 4E is arranged to be in contact with a current channel forming section 6A1 of the first rib base 6A. In the present embodiment, the housing 1 is also made of metal, and the current channel wall 1A1 is also made of metal. The second rib base 6B of the power semiconductor module 6 is also made of metal and is arranged to be in contact with a current channel forming section (a section corresponding to the current channel forming section 6A1 of the first rib base 6A) of the second rib base 6B.

[0054] Electromagnetic noise from the power semiconductor module 6 is transmitted from the metal current channel forming section 6A1 to the current channel wall 4E of the base element 4. The electromagnetic noise transmitted to the current channel wall 4E is introduced into the housing 1 via the outer circumferential edge section 4G of the base element 4. Furthermore, the electromagnetic noise transmitted to the current channel wall 4E is introduced into the housing 1 via the housing-side base element mounting section 1D and the second partition (filter shielding wall) 1B.

[0055] Furthermore, the heat generated by the power semiconductor module 6 is transferred to the cooling medium in the cooling water feedthrough formed by the first current channel formation section 4A and the second current channel formation section 1A2. Additionally, a heating element 5B on the driver circuit board 5 transfers heat to the cooling medium in the cooling water feedthrough formed by the first current channel formation section 4A via a heat dissipation section 7 arranged on the base element 4.

[0056] The configuration of the power conversion device 100 is described below with regard to Fig. 5 together with Fig. 2 described. Fig. Figure 6 shows an exploded view of the power conversion device 100 according to an embodiment of the present invention.

[0057] In the present embodiment as in Fig.Figure 5 shows the driver circuit board 5, the base element 4, the power semiconductor module 6, the filter circuit 8, and the current sensor 10 being inserted and mounted into the housing 1 through the opening in the housing 1 that faces the upper cover 2. The DC busbar 14 and the smoothing capacitor 9, in turn, are inserted and mounted into the housing 1 through an opening in the housing 1 that faces a lower cover 3.

[0058] The outer circumferential edge of the base element 4 is in contact with the contact section (base element receiving section) 1G of the housing 1, and the base element 4 covers the power semiconductor module 6, the filter circuit 8, and the current sensor 10 from above, so that the base element 4 acts as an intermediate cover located on the inside of the upper cover 2. The upper cover 2 covers the driver circuit board 5 and the base element 4 from above and closes the opening on the top of the housing 1. The lower cover 3 closes the opening on the bottom of the housing 1 to protect the smoothing capacitor 9.

[0059] The actions and effects of the power conversion device 100 according to the present embodiment are described below.

[0060] In the present embodiment, the outer circumferential edge section 4G of the base element 4 is in contact with the housing 1, and the base element 4 serves as a shielding wall that separates a receiving area for the power semiconductor module 6 (current conversion circuit section 6C9) and a receiving area for the driver circuit board 5. The base element 4 reduces the influence of noise from the current conversion circuit section 6C on the driver circuit board 5. On one side of the base element 4, facing the current conversion circuit section 6C, the first current channel forming section 4E, which forms the current channel space 1C1, is arranged. The base element 4 includes the heat dissipation section 7, which cools the heating element 5B on the driver circuit board 5.

[0061] The GS terminals 8A and 8B receive GS power from a battery (not shown) and transfer the GS power to the filter circuit 8. The filter circuit 8 removes electromagnetic noise contained in the GS power supplied by a GS power supply and transfers the GS power to the smoothing capacitor 9.

[0062] The smoothing capacitor 9 absorbs a pulsating current of DC power to reduce a pulsating component and thus smooth the current. The DC busbar 14 connects the current conversion circuit section 6C and the smoothing capacitor 9. The power semiconductor module 6 and the housing 1 form the current channel space 1C2. Therefore, the second current channel formation section 1A2 is formed in the first partition 1A of the housing 1.

[0063] The filter circuit 8, which conducts a DC current to the current conversion circuit section 6C, has a high impedance with respect to a high-frequency current and acts as a low-pass filter, thereby removing electromagnetic noise contained in the GS power. The third extension section 4B3, extending from the base element 4, is in contact with the second partition 1B of the housing 1, blocking between the filter circuit 8 and the current conversion circuit section 6C, and forms the filter circuit area (second chamber or second receiving chamber) 1Y. The third extension section 4B3 acts as a shielding wall forming the filter circuit area 1Y and reduces the influence of electromagnetic noise from the current conversion circuit section 6C on the filter circuit 8.

[0064] In the present embodiment, the first extension section 4B2 and the third extension section 4B3, which conduct electromagnetic noise from the outer circumferential edge section 4G of the base element 4 to ground via the housing 1, which serves as a receptacle, are arranged. The first extension section 4B2 and the third extension section 4B3 are in direct contact with the inner surface of the housing 1. In particular, the first extension section 4B2 and the third extension section 4B3 each comprise the mounting section 4C, which is attached to the housing-side base element mounting section 1D of the housing 1 by a mounting element, and the contact section 4G, which is distinct from the mounting section 4C and is in contact with the inner surface of the housing 1. Thus, the influence of electromagnetic noise from the current conversion circuit section 6C on the driver circuit board 5 can be reduced.

[0065] The present invention is not limited to the previously described embodiments but includes various modified examples. For instance, the previously described embodiments have been described in detail to present the invention in an easily understandable manner, and the present invention is not necessarily limited to all configurations. Furthermore, a part of the configuration of one embodiment can be replaced with a configuration of another embodiment, and a configuration of one embodiment can be added to a configuration of another embodiment. Additionally, a part of the configuration of each embodiment can be added to, deleted from, or replaced by another configuration. Reference symbol list 1 case 1A2 second current channel formation section 1C2 Power duct room 6 circuit bodies 5 Driver circuit board 4 Basic element 4A First current channel formation section 4B1 second extension section 4B2 first extension section 4B3 third extension section 4C Mounting section 4G contact section 4F Through hole 6E Signal connection 8 Filter circuit 1Y space in which the filter circuit is arranged 100 Power conversion device

Claims

[1] Power conversion device (100), comprising: a circuit body (6) that converts a direct current into an alternating current; a driver circuit board (5) that drives the circuit body (6); a base element (4) arranged between the circuit body (6) and the driver circuit board (5); and a housing (1) that accommodates the circuit body (6) and the base element (4), wherein the base element (4) forms a first current channel formation section (4A) which forms a current channel space (1C1) between the circuit body (6) and the base element (4), and comprising a first extension section (4B2) extending from the first current channel formation section (4A) and connected to an inner surface of the housing (1), wherein the circuit body (6) includes a signal terminal (6E) which receives a driver signal from the driver circuit board (5), the basic element (4) comprises a second extension section (4B1) extending from the first current channel formation section (4A) to the vicinity of the signal terminal (6E), and a through hole (4F), through which the signal connection (6E) runs, is formed in the second extension section (4B1), and wherein the first current channel formation section (4A), the first extension section (4B2) and the second extension section (4B1) are integrally formed. [2] Power conversion device (100) according to claim 1, wherein the first extension section (4B2) comprises a fastening section (4C) attached to the housing (1) by a fastening element and a contact section (4G) which is different from the fastening section (4C) and is in contact with the inner surface of the housing (1). [3] Power conversion device (100) according to claim 1, wherein the housing (1) comprises a second current channel formation section (1A2) which forms a current channel space (1C2) between the circuit body (6) and the housing (1). [4] Power conversion device (100) according to one of claims 1 to 2, further comprising a filter circuit (8) which passes the direct current through, wherein the base element (4) comprises a third extension section (4B3) extending from the first current channel formation section (4A) to separate the driver circuit board (5) and a space (1Y) in which the filter circuit (8) is arranged.

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