Method and device for cutting a brittle body

Abstract

Method for cutting a brittle body (T), the method comprising the following steps: Providing (S100) a brittle body (T) with an axis of rotation (Ax1); Identifying a position of the brittle body (T) using an alignment camera (150); Forming (S200) a scribe line (Sc) by irradiating a laser (L) onto the brittle body (T) along a preset path by means of a laser irradiation means (130); and Cutting (S300) the brittle body (T) by contacting a vibrating means (140) which vibrates at a preset frequency in a first region of the brittle body (T) spaced from the scoring line (Sc), wherein the step of forming (S200) the scribe line (Sc) comprises: Rotating the brittle body (T) around the rotation axis (Ax1); and Irradiating the laser (L) onto the rotating brittle body (T) in such a way that a focus position of the laser (L) moves from the center of the brittle body (T) to the outer part of the brittle body (T), wherein in the step of forming (S200) the scribe line (Sc), the laser (L) is irradiated such that the laser irradiation means (130) is moved in a first direction from the center of the brittle body (T) to the outer part, and wherein a position of a plate (100) connecting the laser irradiation means (130), the vibration means (140) and the alignment camera (150) is controlled by a position setting means (105).

Description

field of technology

[0001] One embodiment of the present invention relates to a method and apparatus for cutting a structure made of brittle materials (hereinafter "a brittle body"). State of the art

[0002] As a method for cutting brittle bodies, there are mainly laser processing and mechanical processing. These methods are used in different ways depending on the type of material. Laser processing is a non-contact method that generates less dust than mechanical processing and is used to increase the intensity of external impact and improve the quality of the cut surface. Its laser sources include carbon dioxide lasers (CO2 lasers), UV lasers, infrared lasers, etc. In mechanical processing, a physical crack is formed on the surface of a brittle body using a diamond tip or diamond wheel, which is a traditional glass cutting method. Then, breaking is performed using a bar, roller, bending, etc.

[0003] However, the above-described methods for cutting a brittle body involve a plate-shaped brittle body, and the brittle body has the problem that the cutting process applied to the plate-shaped brittle body cannot be used without modification. DE 10 2018 100 443 A1 describes a method and an apparatus for producing glass precursors and glass products. EP 2 781 296 A1 discloses an apparatus and a method for cutting contours from flat substrates using a laser. DE 10 2015 210 030 A1 discloses a chip manufacturing method for forming a chip with a desired shape from a plate-like workpiece. EP 3 366 656 A1 describes a method and an apparatus for cutting glass tubing and a method for producing glass tubing products.DE 10 2014 109 792 A1 relates to a method for producing a long-term stable crack on the surface of brittle-hard elements made of glass, ceramic or glass-ceramic, in particular glass plates, glass panes or capillary tubes, in preparation for subsequent separation. Description of the inventionObject of the invention

[0004] One embodiment of the present invention is to provide a method and apparatus for cutting a brittle body with a high-quality cut surface without an additional polishing process. Means of solving the problem

[0005] According to one embodiment of the present invention, a method and an apparatus for cutting a brittle body according to claims 1 and 9 are provided, the method comprising, as a first aspect of the present invention, the following steps: providing a brittle body having a rotation axis; identifying a position of the brittle body using an alignment camera; forming a scribe line by irradiating a laser onto the brittle body along a preset path using a laser irradiation means; and cutting the brittle body by contacting a vibrating means that vibrates at a preset frequency in a first region of the brittle body spaced from the scribe line.

[0006] According to the present invention, the step of forming the scribe line comprises the steps of: rotating the brittle body about the rotation axis; and irradiating the laser onto the rotating brittle body such that a focus position of the laser moves from the center of the brittle body to the outer part of the brittle body.

[0007] According to the present invention, in the step of forming the scribe line, the laser is irradiated such that the laser irradiation means is moved in a first direction from the center of the brittle body to the outer part, and a position of a plate connecting the laser irradiation means, the vibration means, and the alignment camera is controlled by a position adjusting means.

[0008] According to an embodiment of the present invention, in the step of forming the scribe line, the laser may be irradiated by moving the laser irradiation means in the first direction and reciprocating in a second direction perpendicular to the first direction.

[0009] According to one embodiment of the present invention, the step of cutting the brittle body may further comprise placing the brittle body under pressure by means of the vibration means.

[0010] According to an embodiment of the present invention, the direction of pressurization of the vibration means may be opposite to the set laser irradiation direction.

[0011] According to one embodiment of the present invention, the irradiation direction of the laser may intersect the rotation axis of the brittle body.

[0012] According to one embodiment of the present invention, the brittle body may be a circular brittle body, and during a rotation period of the circular brittle body, the laser irradiation means may maintain a constant distance from the rotation axis.

[0013] According to one embodiment of the present invention, the brittle body may be a polygonal brittle body, and during a rotation period of the polygonal brittle body, the distance of the laser irradiation means to the rotation axis may change periodically.

[0014] According to one embodiment of the present invention, the brittle body may comprise a cut surface, wherein the cut surface is a laser machined surface (ie, a laser machining surface).

[0015] According to one embodiment of the present invention, the processing pattern of the cut surface may be non-oriented.

[0016] According to an embodiment of the present invention, an apparatus for cutting a brittle body is provided as a second aspect of the present invention, the apparatus comprising: rotating means for rotating a brittle body having a rotation axis; laser irradiation means for forming a scribe line by irradiating a laser onto the brittle body along a preset path; and vibrating means that vibrates at a preset frequency and contacts a first region of the brittle body spaced from the scribe line to transmit the vibration energy to the brittle body.

[0017] According to the present invention, the apparatus further comprises an alignment camera for checking the position of the brittle body to irradiate the laser.

[0018] According to the present invention, the laser irradiation means irradiates the laser onto the brittle body rotated by the rotating means such that the focus position of the laser moves from the center of the brittle body to the outer part of the brittle body, wherein the laser irradiation means is configured to move in a first direction from the center of the brittle body to the outer part.

[0019] According to an embodiment of the present invention, the oscillation means may further comprise means for placing the brittle body under pressure in a direction opposite to a first direction, wherein the first direction is a direction of movement of the focus position of the laser.

[0020] According to an embodiment of the present invention, the tip of the vibrating means may comprise one of a ball type and a roller type.

[0021] In addition to the above information, other aspects, features and advantages are made clear from the following drawings, claims and description of the invention. Effect of the invention

[0022] According to the method for cutting a brittle body according to the embodiments of the present invention, the object to be processed in a specific shape of a brittle body can be easily cut by performing the cutting by combining a laser and an oscillator. Short description of the drawings Fig. 1 is a perspective view showing a brittle body cutting device according to an embodiment of the present invention. Fig. Figure 2 is a conceptual diagram schematically showing the brittle body cutting device of Fig. 1 shows. Fig. 3 is a flowchart sequentially showing a method for cutting a brittle body according to an embodiment of the present invention. Fig. 4 to 6 are views for explaining a process of cutting a brittle body by the method of cutting a brittle body of Fig. 3. Fig. 7 is a view for explaining a cut portion processed by release using the method for cutting a brittle body according to an embodiment of the present invention. Fig. 8 is a cross-sectional view showing the method of cutting a brittle body of Fig. 3 represents. Fig. Fig. 9 is a view for explaining the positional relationship of the laser irradiation means according to the rotation period in the method for cutting a brittle body of Fig. 8. Fig. 10 illustrates a process of cutting a polygonal brittle body using the brittle body cutting method. Fig. Fig. 11 is a view for explaining the positional relationship of the laser irradiation means according to the rotation period in the method for cutting a brittle body of Fig. 10. Description of the embodiments

[0023] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings, and in the description with reference to the drawings, the same or corresponding components are given the same reference numerals, and redundant descriptions thereof will be omitted.

[0024] Since the present embodiments are susceptible to various modifications, specific embodiments are illustrated in the drawings and described in detail in the specification. The effects and features of the present embodiments and methods for achieving them will become apparent by referring to embodiments described in detail later with reference to the drawings. However, the present embodiments are not limited to the following embodiments, but can be implemented in various forms.

[0025] In the following embodiments, terms such as "first," "second," etc., are used to describe various components, and such components should not be limited to the above terms. These terms are used only to distinguish one component from another.

[0026] In the following embodiments, a singular expression includes a plural expression unless the context clearly indicates otherwise.

[0027] In the following embodiments, terms such as "comprise" or "have" mean that the features or components described in the description are present, and the possibility of adding one or more other features or components is not excluded in advance.

[0028] In the following embodiments, it is understood that when a part such as a unit, region, or component is referred to as being "on" or "over" another part, it may be directly on or over the other part, or an intermediate part may also be present.

[0029] In the following embodiments, terms such as "connecting" or "combining" do not necessarily mean a direct and / or fixed connection or combination of two components, and unless the context clearly indicates otherwise, the presence of another component between the two components is not excluded.

[0030] This indicates that the features or components described in the description are present and does not exclude the possibility that one or more other features or components may be added.

[0031] In the drawings, the size of the components may be exaggerated or reduced for ease of explanation. For example, the size and thickness of each component shown in the drawings are shown arbitrarily for ease of description, and therefore the following embodiments are not necessarily limited to the drawings.

[0032] Fig. Fig. 1 is a perspective view showing a brittle body cutting device 10 according to an embodiment of the present invention, and Fig. 2 is a conceptual diagram showing the brittle body cutting device 10 of Fig. 1 shows schematically.

[0033] Referring to Fig. 1 and Fig. 2, the brittle body cutting device 10 according to an embodiment of the present invention may include a fixing means 110, a laser irradiation means 130, a vibration means 140, and a rotation means 120.

[0034] In the present description, the brittle body T refers to an object to be cut having a rotation axis and, in particular, to a tubular brittle body in the form of a tube, with a depression TO (see Fig. 4) and an inner surface A1 and an outer surface A2 located outside the inner surface A1. The brittle body T can be made of a brittle material containing a glass material such as quartz, soda lime, and borosilicate, but the present invention is not limited to this, and it can be an object to be cut made of various materials that can be cut with a laser or vibrator. The cross-section of the brittle body T can be circular or have a polygonal shape such as a triangle or a square, but is not limited to these, and any objects for cutting that can be rotated by the rotating means 120 to be described later can be included here.

[0035] The fastening means 110 fastens one end of the brittle body T and may, for example, be a tension member that wraps around and fastens the outer surface of one end of the brittle body T. The fastening means 110 is provided as one to fasten at least one end of the brittle body T and may serve to fasten one end of the brittle body T so that it does not wobble while the vibration means 140 is pressed against the outer surface of the brittle body T spaced from a scribe line Sc to be described later. In another embodiment, as shown, the fastening means 110 may further comprise at least one auxiliary fastening means 115 for fastening another end of the brittle body T opposite the one end or a portion spaced from the one end.As a result, the fastening means 110 can be stably fastened regardless of the length of the brittle body T, and an unintentional falling of the cut section T' (see . Fig. 6) from the main body part of the brittle body T. In other words, even if the brittle body is cut, since the two fixing means, that is, the fixing means 110 and the auxiliary fixing means 115, stably fix the brittle body, falling off can be prevented.

[0036] The brittle body cutting device 10 irradiates a laser along the circumference of the brittle body T to form a scribe line Sc of a preset path on the brittle body T. The brittle body T is fixed here, and the laser irradiation means 130 to be described later can rotate around the brittle body T to form the scribe line SC. For convenience of execution, a description will be given below, focusing on the case of forming a scribe line Sc by irradiating a laser using a fixed laser irradiation means while rotating the brittle body T.

[0037] The brittle body cutting device 10 may further include the rotating means 120 connected to the fastening means 110 for rotating the brittle body T. The rotating means 120 may be a drive means such as a motor or an actuator and may rotate the brittle body T by rotating the connected fastening means 110. The rotating means 120 may rotate the brittle body T at a constant speed.

[0038] The laser irradiation means 130 can form a scribe line Sc by irradiating the brittle body T with a laser along a preset path. The laser irradiation means 130 can irradiate the brittle body T with the laser by a Bessel beam processing method or a filament processing method. In other words, the laser irradiation means 130 can form a laser in the form of a Bessel beam by a filament processing method and irradiate it onto the brittle body T.

[0039] Filamentation processing is a processing method due to filamentation phenomena. Filamentation refers to the phenomenon where a plasma longer than several to dozen Rayleigh lengths occurs under certain conditions by focusing a femtosecond laser inside the glass. In other words, in a material with the Kerr effect, such as transparent glass, a pulse larger than a threshold must be irradiated for the focused laser pulse to become self-focused. After self-focusing, plasma scattering occurs, and the beam more tightly focused by self-focusing is large enough to locally exceed the damage threshold, but the pulse width is not long enough to cause avalanche ionization. Therefore, although ionization occurs, the material is not permanently damaged.When such self-focusing and plasma scattering are in balance and thus continuously generated, the refractive index changes continuously over several Rayleigh lengths, which is called the filamentation phenomenon. The present invention can improve the quality of the cut surface of the brittle body T by using such a filamentation processing method. However, the present invention is not limited thereto.

[0040] The laser irradiation means 130 may directly generate a laser to irradiate toward the brittle body T, but in another embodiment, as shown in Fig. 2, a laser L generated by an externally arranged laser generating means 137 can be received and transmitted to the brittle body T. For this purpose, the laser irradiation means 130 can have an optical unit 133 and a light irradiation unit 131, which convert the laser L provided by the laser generating means 137 into a Bessel beam shape and guide the changed laser to the brittle body T. In the drawing, only one mirror 1331 is shown, with which the optical unit 133 reflects the laser L and changes the path of the laser L, but is not limited to this, and multiple mirrors or multiple lenses for changing the path of the laser L can be provided.

[0041] On the other hand, the laser irradiation means 130 irradiates the laser L onto the brittle body T rotating by the rotating means 120, such that the focus position of the laser L moves from the inner surface A1 to the outer surface A2 of the brittle body T. When the laser irradiation means 130 irradiates the focus position of the laser L from the outer surface A2, the processed part is located in the path of the laser, and thus it is difficult to adjust an accurate focus position because, for example, the laser is scattered due to the processed part. Therefore, the laser irradiation means 130 according to the invention irradiates the laser L such that the focus position of the laser L moves from the inner surface A1 to the outer surface A2 of the brittle body T.In other words, the laser irradiation means 130 can irradiate the laser L by moving the focus position of the laser L in a first direction (z-direction) that intersects the longitudinal direction (x-direction) of the brittle body T, in particular in the first direction (z-direction) perpendicular to the longitudinal direction (x-direction).

[0042] In particular, the laser irradiation means 130 can irradiate the laser L by moving the focus position of the laser L from the inner surface A1 to the outer surface A2 of the brittle body T. Here, the brittle body cutting device 10 is provided with a position adjustment means 105 for adjusting the position of the laser irradiation means 130 so that the focus position of the laser L can move according to the position of the laser irradiation means 130. The position adjustment means 105 can include a first-direction moving unit that moves at least the laser irradiation means 130 in the first direction (z-direction).In addition, the position adjusting means 105 further includes a second-direction moving unit and a third-direction moving unit that move the laser irradiation means 130 in the arc direction and y-direction perpendicular to the first direction (z-direction) to control the position of the laser irradiation means 130 in the three-axis direction, whereby the object to be cut can be cut into various shapes.

[0043] On the other hand, the vibration means 140 vibrates at a preset frequency and contacts a first region of the brittle body T spaced from the scribe line Sc to transmit the vibration energy to the brittle body T. The vibration means 140 may include a vibration generating unit 143 that generates vibration energy, and a vibration tip part 141 that directly contacts the brittle body T and supplies the vibration energy generated by the vibration generating unit 143 to the brittle body T.

[0044] The vibrating means 140 is capable of contacting the brittle body T in both a stationary state and a rotating state. In the stationary state, it can contact the brittle body T through line or surface contact, and in the rotating state, it can contact the brittle body T through line or point contact. In other words, if the tip of the vibrating means 140 is a ball type, the brittle body T can be contacted through point contact in both a static state and a rotating state. Alternatively, if the tip of the vibrating means 140 is a roller type, the brittle body T can be contacted through line contact in both a stationary state and a rotating state.In another embodiment, when the tip of the vibrating means 140 is formed into a cylindrical shape corresponding to the curved surface of the brittle body, the vibrating means 140 can contact the brittle body T through surface contact. By changing the contact method of the vibrating tip part according to the stationary or rotating state, it is possible to cut the object to be cut more effectively. In one embodiment, the vibrating means 140 can use ultrasonic vibration and can use magnetostrictive, piezoelectric / electrostrictive, and electronic vibrators depending on the sound source. In addition, the resonance frequency can be in the range of 20 kHz to 400 kHz.

[0045] On the other hand, the vibration means 140 can be used to pressurize the brittle body T. Here, the vibration means 140 can pressurize the brittle body T in any direction to exert pressure. In one embodiment, the vibration means 140 can press the brittle body T in a direction opposite to the first direction (+z direction), which is the direction of movement of the laser's focal position (-z direction). That is, by applying vibration to the brittle body T, the vibration means 140 can make it easier to cut the brittle body T.

[0046] The vibration tip part 141 may have a curved surface, and in particular, may be provided in a ball type or a roller type to be able to contact the brittle body T even in a rotating state of the brittle body T. The vibration tip part 141 may be made of a material with a lower hardness than the brittle body T, and thus, the scratches generated on the outer surface A2 during the uniform generation of vibrations on the outer surface A2 of the brittle body T can be reduced.

[0047] On the other hand, the brittle body cutting apparatus 10 according to an embodiment of the present invention further includes an alignment camera 150 for checking the position of the brittle body T for laser irradiation. Here, the brittle body cutting apparatus 10 can control the positions of the alignment camera 150, the laser irradiation means 130, and the vibration means 140, which are the above-described components. As shown in the drawing, the brittle body cutting apparatus 10 connects the vibration means 140, the alignment camera 150, and the laser irradiation means 130 above a plate 100 and controls the position of the plate 100 using the position adjustment means 105, thus making it possible to control the positions of the above-described components at once.

[0048] Hereinafter, a method for cutting a brittle body T using the brittle body cutting device 10 described above will be described with reference to Fig. 3 to 11 are described in detail.

[0049] Fig. 3 is a flowchart sequentially showing a method for cutting a brittle body according to an embodiment of the present invention, and Fig. 4 to 6 illustrate a process in which the brittle body T is cut by the method of cutting a brittle body of Fig. 3 is cut.

[0050] With reference to Fig. 3 and Fig. 4, in the brittle body cutting method, a brittle body T is first provided (S100). As described above, the brittle body T is a tubular object to be cut, consisting of a cavity TO, an inner surface A1 surrounding the cavity TO, and an outer surface A2 located outside the inner surface A1. The cross-section of the brittle body T may be circular or have a polygonal shape such as a triangle or a square. The brittle body T may be provided by fastening by means of the fastening means 110.

[0051] Next, in the method for cutting a brittle body, a scribe line Sc is formed by irradiating the laser L from the laser irradiation means 130 along a preset path onto the brittle body T (S200). The scribe line Sc may be a closed curve formed along the circumference of the brittle body T. In other words, in the step of forming the scribe line Sc in the brittle body T, the brittle body T is rotated about the rotation axis Ax1 passing through the cavity TO, and while the brittle body T is rotated, the scribe line Sc may be formed on the brittle body T by irradiating the laser L.

[0052] Here, in the step of forming the scribe line Sc, the laser L may be irradiated such that the focus position of the laser L moves from the inner surface A1 to the outer surface A2 of the brittle body T. When forming the scribe line Sc, according to the brittle body cutting method according to one embodiment, the laser L may be irradiated by moving the laser irradiation means 130 in a first direction (+z direction) from the inner surface A1 to the outer surface A2 of the brittle body T. In another embodiment, the laser irradiation means 130 may irradiate the laser in a fixed state while moving the position of the brittle body T along the -z direction.

[0053] In a selective embodiment, in the step of forming the scribe line Sc, the laser is irradiated by moving the laser irradiation means 130 in the first direction (z direction) such that the laser irradiation means 130 reciprocates in the second direction (y direction) perpendicular to the z direction. In other words, the laser irradiation means 130 can move away from the brittle body T along the z axis by reciprocating in the y direction, which is the radial direction of the brittle body T.

[0054] Meanwhile, the laser irradiation means 130 can irradiate the laser by moving in a third direction (x-direction) that intersects both the first direction (z-direction) and the second direction (y-direction). As described above, in the method for cutting a brittle body, the brittle body can be processed to have various types of cut surfaces by controlling the position of the laser irradiation means 130.

[0055] Thereafter, with reference to Fig. 3, Fig. 5 and Fig. 6, in the method for cutting a brittle body T, the brittle body T is cut by contacting the vibrating means 140, wherein the vibrating means 140 vibrates at a preset frequency in the first region of the brittle body spaced from the scribe line Sc (S300). In the cutting process of the brittle body T, the brittle body T may be pressurized using the vibrating means 140, and the pressurization direction of the vibrating means 140 may be a direction (-z direction) opposite to the first direction (+z direction).

[0056] The vibrating means 140 can achieve breaking by vibrating at a preset frequency and contacting the brittle body T to impart vibration energy to the scribe line Sc. The vibrating means 140 can contact the brittle body T both in a stationary state and in a rotating state of the brittle body T; and in a stationary state, the vibrating means 140 can contact the brittle body T through point, line, or surface contact depending on the tip shape of the vibrating means 140, and in the rotating state, the vibrating means 140 can contact the brittle body T through line or point contact.

[0057] The section T' cut by the process described above has a Fig. 6. That is, the cutting surface A3 consists of a laser processing surface by laser irradiation, and since it is processed by a non-contact method using a laser rather than a physical cutting method such as a mechanical cutting method, the generation of not only particles but also chips or burrs can also be minimized, resulting in a high-quality cutting surface.

[0058] In addition, the method for cutting a brittle body described above can eliminate the need for polishing to remove chips or burrs, thus improving process efficiency. Since the brittle body T' thus produced is formed only by laser machining and without a polishing process, the processing pattern is non-oriented.

[0059] Fig. 7 is a view for explaining a cut portion T' processed by release using the method for cutting a brittle body according to an embodiment of the present invention.

[0060] Referring to Fig. 7, the method for cutting a brittle body can form a scribe line Sc by moving the laser irradiation means 130 in the triaxial direction of the x, y, and z directions, thus enabling release processing as shown in the drawing. Accordingly, the cut surface A3 of the brittle body T' cut by this can be formed as a curved surface with a curvature. In the brittle body cutting method, the laser can be irradiated such that the rotational speed of the brittle body T and the moving speed of the laser irradiation means 130 are synchronized in the x direction (length direction of the brittle body) while the brittle body T is rotated at a constant speed.

[0061] Fig. Fig. 8 is a cross-sectional view showing a method of cutting a brittle body of Fig. 3, and Fig. Fig. 9 is a view for explaining the positional relationship of the laser irradiation means according to the rotation period in the method for cutting a brittle body of Fig. 8.

[0062] With reference to Fig. 8(a) to 8(c), in the method for cutting a brittle body according to an embodiment of the present invention, the laser is irradiated such that the focus position of the laser is moved from the inner surface A1 to the outer surface A2 of the brittle body T. However, the scribe line Sc must form a closed path or a closed curve.

[0063] In one embodiment, when the brittle body T is a circular brittle body, the focus position of the laser must remain fixed at the same position while the brittle body T rotates once. In other words, during one rotation period of the brittle body T, the laser irradiation means 130 must maintain a constant distance from the rotation axis Ax1. After one rotation of the brittle body T is completed, the position of the laser irradiation means 130 can move away from the brittle body T in the first direction.

[0064] Referring to Fig. 9 is the focus position of the laser irradiation 130 during the first rotation period R1 of the brittle body T at the first position P1 (see Fig. 8(a)) is kept constant, and during the second rotation period R2 the focus position can be kept constant at the second position P2 (see Fig. 8(b)) further away from the rotation axis Ax1 than the first position P1. This sequence ends when the laser irradiation from the inner surface A1 to the outer surface A2 of the brittle body T is completed.

[0065] Fig. 10 is a diagram showing a process of cutting a polygonal brittle body using the brittle body cutting method of Fig. 3, and Fig. Fig. 11 is a view for explaining the positional relationship of the laser irradiation stage according to the rotation period in the method for cutting the brittle body of Fig. 10.

[0066] With reference to Fig. 10(a) to 10(d), a method for cutting a brittle body according to another embodiment of the present invention can be applied even when the brittle body T is a polygon. As with the circular brittle body, the polygonal brittle body T can be rotated and irradiated with a laser to form a scribe line Sc that is a closed path or curve.

[0067] In one embodiment, as shown in the figure, when the brittle body T is a square brittle body, the laser focus position needs to be moved periodically to irradiate the laser onto the surface at the same distance from the rotation axis Ax1 while the brittle body T rotates one lap. In other words, when the laser irradiation starts from the center M of one side of the square due to the cross-section, the laser focus position can be the initial position P1, and the closer to the apex as the brittle body T rotates, the farther the laser focus position can be from the rotation axis Ax1 (P1→P3). As the brittle body T continues to rotate, the laser focus position can periodically approach or move away from the rotation axis Ax1.

[0068] Referring to Fig.11, the focus position of the laser irradiation means 130 is periodically repeated between the first position P1 and the third position P3 during the first rotation period R1 of the brittle body T. Thereafter, during the second rotation period R2 of the brittle body T, the focus position of the laser irradiation means 130 moves in the first direction (z-direction) and then periodically repeatedly moves between a new 1-1 position P1' and a 1-3 position P3'. This sequence ends when the laser irradiation from the inner surface A1 to the outer surface A2 of the brittle body T is completed.

[0069] As described above, in the brittle body cutting method according to embodiments of the present invention, cutting is performed by combining a laser and an oscillator, and thus an object to be processed with the specificity of a material called a brittle body can be easily cut. In addition, in the brittle body cutting method according to embodiments of the present invention, a separate breaking unit is not needed, and the breaking process can be performed on the same line as the scribing process, so that equipment can be reduced. Furthermore, the brittle body cutting method can process not only tempered glass that could not be processed with a physical wheel, but also short objects that were difficult to break.In addition, by cutting the object to be processed using a laser and an oscillator, an additional polishing process for removing chips or burrs can be omitted, thereby increasing process efficiency.

[0070] The above-described embodiments have been described based on a tubular object to be processed having a cavity, but the present invention is not limited thereto, and the present invention can be equally applied when the object to be processed has a rotation axis.

[0071] The present invention has been described with reference to an embodiment shown in the drawings, but this is only by way of example and it will be apparent to those skilled in the art that various modifications and variations of the embodiment are possible.

Claims

[1] A method for cutting a brittle body (T), the method comprising the following steps: Providing (S100) a brittle body (T) with an axis of rotation (Ax1); Identifying a position of the brittle body (T) using an alignment camera (150); Forming (S200) a scribe line (Sc) by irradiating a laser (L) onto the brittle body (T) along a preset path by means of a laser irradiation means (130); and Cutting (S300) the brittle body (T) by contacting a vibrating means (140) which vibrates at a preset frequency in a first region of the brittle body (T) spaced from the scoring line (Sc), wherein the step of forming (S200) the scribe line (Sc) comprises: Rotating the brittle body (T) around the rotation axis (Ax1); and Irradiating the laser (L) onto the rotating brittle body (T) in such a way that a focus position of the laser (L) moves from the center of the brittle body (T) to the outer part of the brittle body (T), wherein in the step of forming (S200) the scribe line (Sc), the laser (L) is irradiated such that the laser irradiation means (130) is moved in a first direction from the center of the brittle body (T) to the outer part, and wherein a position of a plate (100) connecting the laser irradiation means (130), the vibration means (140) and the alignment camera (150) is controlled by a position setting means (105). [2] The method according to claim 1, wherein in the step of forming (S200) the scribe line (Sc), the laser (L) is irradiated by moving the laser irradiation means (130) in the first direction and reciprocating in a second direction perpendicular to the first direction. [3] The method according to claim 1, wherein the step of cutting (S300) the brittle body (T) further comprises putting the brittle body (T) under pressure by means of the vibration means (140). [4] The method according to claim 3, wherein the direction of pressurization of the vibration means (140) is opposite to the set laser irradiation direction. [5] Method according to claim 1, wherein the irradiation direction of the laser (L) intersects the rotation axis (Ax1) of the brittle body (T). [6] The method according to claim 1, wherein the brittle body (T) is a circular brittle body (T), and during a rotation period (R) of the circular brittle body (T), the laser irradiation means (130) maintains a constant distance from the rotation axis (Ax1). [7] Method according to claim 1, where the brittle body (T) is a polygonal brittle body (T), and During a rotation period (R) of the polygonal brittle body (T), the distance of the laser irradiation means (130) to the rotation axis (Ax1) changes periodically. [8] The method according to claim 1, wherein the brittle body (T) comprises a cutting surface (A3), wherein the cutting surface (A3) is a laser processing surface. [9] Device (10) for cutting a brittle body (T), the device (10) comprising: a rotating means (120) for rotating a brittle body (T) having a rotation axis (Ax1); a laser irradiation means (130) for forming a scribe line (Sc) by irradiating a laser (L) onto the brittle body (T) along a preset path; a vibration means (140) which vibrates at a preset frequency and contacts a first region of the brittle body (T) spaced from the scribe line (Sc) to transfer the vibration energy to the brittle body (T); an alignment camera (150) for checking the position of the brittle body (T) to irradiate the laser (L), and a position adjusting means (105) for controlling a position of a plate (100) connecting the laser irradiation means (130), the vibration means (140) and the alignment camera (150), wherein the laser irradiation means (130) irradiates the laser (L) onto the brittle body (T) rotated by the rotating means (120) such that a focus position of the laser (L) moves from the center of the brittle body (T) to the outer part of the brittle body (T), and wherein the laser irradiation means (130) is configured to move in a first direction from the center of the brittle body (T) to the outer part. [10] The apparatus of claim 9, wherein the oscillation means (140) further comprises means for pressurizing the brittle body (T) in a direction opposite to the first direction, the first direction being a direction of movement of the focus position of the laser (L). [11] The apparatus of claim 9, wherein the tip (141) of the vibrating means (140) comprises one of a ball type or a roller type.

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