cabling component

Abstract

Wiring component (10), comprising: a basic element (30); and a wire-shaped transmission element (20) with a transmission wire body (22) and a covering (24) arranged around the transmission wire body, wherein the wire-shaped transmission element has a fastening area (26) attached to the base element and a separation area (28) separate from the base element, a thermally conductive layer (25; 25B) which has a better thermal conductivity than the encapsulation is formed on an outer circumference of the encapsulation in the separation region, and the wire-shaped transmission element (20) and the base element (30) are attached to each other via an adhesive (40) which does not correspond to the thermally conductive layer (25; 25B).

Description

[0001] The present disclosure relates to a wiring component. TECHNICAL AREA

[0002] JP 2019-003925A discloses a wiring harness comprising a planar element 30, an electrical wire, and a retaining element. The retaining element is a part that lies at least partially between the electrical wire and the planar element 30 and secures the electrical wire to the planar element 30 in a state in which it is welded to the planar element 30 by ultrasonic welding or laser welding.

[0003] DE 11 2018 003 127 T5 discloses a cable harness comprising a web-shaped material, an electrical wire, and a retaining element. The electrical wire comprises a wire core and an insulating cover that directly covers the circumference of the wire core and is arranged along the web-shaped material. The retaining element, at least part of which lies between the electrical wire and the web-shaped material, provides a bond between the web-shaped material and the electrical wire by means of a welded connection.

[0004] US 9,531,173 B2 discloses a cable harness comprising a conductor path and a flexible sheathing element through which the conductor path passes and which has recessed sections and protruding sections. The recessed sections and the protruding sections extend circumferentially on the surface of the sheathing element and are formed alternately along a longitudinal direction of the sheathing element. A curing adhesive or a resin containing the adhesive is applied to the recessed sections of a bent portion that is created when the cable harness is bent and cures while the bent portion is held in its bent shape.

[0005] US 2018 / 0301832A1 discloses wire harness assemblies and methods for manufacturing such wire harness assemblies. A wire harness assembly comprises a conductor track that includes a conductor with a width-to-thickness ratio of at least 2. This ratio results in a thinner profile and improves heat transfer from the wire harness to the environment. In some examples, a conductor track can be formed from a thin sheet of metal. The same sheet can be used to form other components of the wire harness. The conductor track also includes a connector end that is monolithically formed with the conductor. The width-to-thickness ratio of the connector end can be smaller than that of the conductor track, allowing the connector end to be directly mechanically and electrically connected to a connector of the wire harness assembly.The joining end may be folded, shaped, slotted, and the like to reduce its width-to-thickness ratio, which may be close to 1.

[0006] JP 2012 - 89 315 A discloses a flexible flat cable characterized by the following features: a plurality of conductors; two layers of polyimide enclosing the plurality of conductors on both sides; and a shielding layer provided outside the polyimide layers, wherein there is no adhesive layer of a material other than polyimide between the polyimide layers and the conductors or between the polyimide layers and the shielding layer. OVERVIEW OF THE INVENTION TASKS TO BE SOLVED BY THE INVENTION

[0007] In JP 2019 - 003 925 A, the electrical wire may include a part that is not attached to the flat element 30. Improving the heat dissipation properties of this part is desirable.

[0008] The present disclosure is based on the objective of improving the heat radiation properties of a part of a wire-shaped transmission element that is not attached to the base element in a wiring component that contains the base element and the wire-shaped transmission element attached to the base element. MEANS OF SOLVING THE TASK

[0009] A wiring component according to the present disclosure comprises: a base element; a transmission wire body; and a wire-shaped transmission element with a sheath provided around the transmission wire body, wherein the wire-shaped transmission element has a fastening area attached to the base element and a separation area separated from the base element, and a thermally conductive layer having a better thermal conductivity than the sheath is formed on an outer circumference of the sheath in the separation area. ADVANTAGEOUS EFFECTS OF THE INVENTION

[0010] According to the present disclosure, a heat radiation property of a part of a wire-shaped transmission element that is not attached to the base element is improved in a wiring component that has the base element and the wire-shaped transmission element attached to the base element. FORMS OF EXECUTION OF THE INVENTION Fig. Figure 1 is a perspective view showing a wiring component according to one embodiment. Fig. Figure 2 is a side view showing the wiring component. Fig. Figure 3 is a cross-sectional view along lines III-III in Fig. 2. Fig. Figure 4 is a cross-sectional view showing a wiring component according to a modification example. FORMS OF EXECUTION OF THE INVENTION

[0011] [Description of embodiments of the present disclosure] First, embodiments of the present disclosure are listed and described.

[0012] A wiring component according to the present disclosure looks like this.

[0013] (1) A wiring component according to the invention includes the features of claim 1.

[0014] (2) The thermally conductive layer can be formed in a region extending from the separation zone to the base element. In this case, the heat generated in the separation zone is transferred along the thermally conductive layer to the base element.

[0015] (3) The thermally conductive layer may be formed in an area excluding at least part of the outer circumference of the covering in the fastening area. In this case, the thermally conductive layer does not need to be formed over the entire circumference of the covering, which can result in a cost reduction.

[0016] (4) The thermally conductive layer can be a plastic layer with a thermally conductive filler or a metal layer. In this case, the heat is transferred along the plastic layer with the thermally conductive filler or the metal layer.

[0017] (5) The base element may contain a metal layer. In this case, the heat generated in the mounting area of ​​the wire-shaped transfer element is effectively transferred to the metal layer of the base element.

[0018] (6) The wire-shaped transfer element can be attached to the base element by means of a thermally conductive material that has a better thermal conductivity than the covering in the attachment area. In this case, the heat generated in the attachment area of ​​the wire-shaped transfer element propagates along the thermally conductive material to the base element. Details of the embodiment of the present disclosure

[0019] Specific examples of a wiring component of the present disclosure are described below with reference to the drawings. The present disclosure is not limited to these examples, but is specified in the claims, and it is intended that equivalents and all modifications within the scope of the claims are included. embodiment

[0020] A wiring component according to one embodiment is described below. Fig. Figure 1 is a perspective view showing a cabling component 10. Fig. Figure 2 is a side view showing the wiring component 10. Fig. 3 is a cross-sectional view along a line III-III in Fig. 2.

[0021] The wiring component 10 comprises a base element 30 and wire-shaped transmission elements 20. The wiring component 10 is, for example, mounted on a vehicle. The wiring component 10 is used, for example, as wiring for connecting electrical components in the vehicle.

[0022] Each wire-shaped transmission element 20 has a transmission wire body 22 and a sheath 24. The transmission wire body 22 is a wire-shaped body that transmits an electric current. The sheath 24 is attached around the transmission wire body 22. The outermost layer of the sheath 24 is a plastic layer.

[0023] The wire-shaped transmission element 20 can, for example, be an electrical wire. The electrical wire has a core wire as the transmission wire body 22 and an insulating layer as its sheath 24. The core wire is a wire-shaped conductor, which is formed, for example, from a conductive metal part. The insulating layer is an insulating part that surrounds the core wire. Besides an electrical cable, the wire-shaped transmission element 20 can, for example, be a shielded wire, a twisted wire, or an enameled wire.

[0024] The base element 30 is an element with a main surface to which the wire-shaped transmission elements 20 described above are attached. The base element 30 is a planar element that can, for example, be bent. The base element 30 can be a plate-shaped element that possesses a certain stiffness and can maintain a constant shape. The base element 30 can have a flat shape or a shape with a section bent in the direction of its thickness. In the present description, the base element 30 is a planar element 30.

[0025] The wire-shaped transmission element 20 includes a fastening area 26 and a (loose) separation area 28 located in regions that differ from each other in their direction of extension. The fastening area 26 is a region that is attached to the planar element 30. The separation area 28 is a region that is separated from the planar element 30. In other words, the fastening area 26 and the separation area 28 are located in regions that differ from each other in the longitudinal direction of the wire-shaped transmission element 20.

[0026] The planar element 30 is formed in an elongated quadrilateral shape. An intermediate section of the wire-shaped transmission elements 20 is attached to the planar element 30 in one direction of extension. The intermediate sections of the multiple (here two) wire-shaped transmission elements 20 are attached to a main surface of the planar element 30 in a parallel arrangement, spaced apart from one another, in the direction of extension. Thus, the area of ​​the wire-shaped transmission elements 20 that is attached to a main surface of the planar element 30 is the attachment area.

[0027] At least one end section of the wire-shaped transmission element 20 projects outwards from an end section of the planar element 30. The portion of the wire-shaped transmission element 20 that projects outwards from the end section of the planar element 30 is the separation area 28. A connector 50 is connected to the end section of the wire-shaped transmission element 20. The end section of the wire-shaped transmission element 20 is separated from the planar element 30 and leads to a device to which the connector 50 is connected. The connector 50 is connected to a device-side connector. For example, the separation area 28 is provided to connect the connector 50 at the end section of the wire-shaped transmission element 20, which is separated from the planar element 30, to the other device.

[0028] The separation area 28 of the wire-shaped transmission elements 20 does not necessarily have to be the area that projects from the planar element 30. For example, there may be a case in which an area on one side of the end section of the wire-shaped transmission elements 20, even in a region that is located further inwards from the end section of the planar element 30, is not attached to the planar element 30, but is arranged in such a way that it is separated from the main surface of the planar element 30 and led to a different position. In such a case, too, the area on the side of the end section of the wire-shaped transmission element 20 is the separation area. Fig. Figure 1 shows wire-shaped transmission elements 20, which are already separated from the planar element 30 somewhat before the edge of the end section of the planar element 30.

[0029] There are no particular restrictions on the design of how the wire-shaped transmission elements 20 are attached to the flat element 30. The fixing of the flat element 30 and the wire-shaped transmission elements 20 can be a contact surface fixing, a non-contact surface fixing, or both fixings can be used together. Contact surface fixing means that a section where the wire-shaped transmission elements 20 and the flat element 30 are in contact with each other is glued and fixed. Non-contact surface fixing refers to a fixing condition that is not contact surface fixing. Non-contact surface fixing can be such that, for example, a sewing thread, another flat element 30, or an adhesive tape presses the wire-shaped transmission elements 20 against the flat element 30.The non-contact surface fixation can also be configured such that, for example, a sewing thread, another flat element 30, or an adhesive tape surrounds and positions between the wire-shaped transfer element 20 and the flat element 30 to hold them in a fixed state. In the following description, the wire-shaped transfer elements 20 and the flat element 30 are in a state of contact surface fixation.

[0030] The contact surface fixing can be configured in either an indirect or a direct manner, or both fixing methods can be used together in different areas. In this context, "indirect contact surface fixing" means that the wire-shaped transfer elements 20 and the flat element 30 are attached and fixed indirectly via an intervening element, such as an adhesive, a bonding agent, or double-sided tape. "Direct contact surface fixing" means that the wire-shaped transfer elements 20 and the flat element 30 are attached and fixed directly, without the need for a separate adhesive.

[0031] In direct contact surface fixation, it is possible to melt the plastic contained in the wire-shaped transmission elements 20 and / or the flat element 30, thereby attaching and fixing the wire-shaped transmission elements 20 and the flat element 30. To achieve direct contact surface fixation, the plastic can be melted by heat, for example, by ultrasonic welding, pressure welding, hot air welding, and high-frequency welding. The plastic can also be melted, for example, by a solvent.

[0032] In the present description, the wire-shaped transmission elements 20 and the flat element 30 are attached to one another by means of an adhesive 40 provided between them. The adhesive 40 is applied to the flat element 30 along the entire attachment area 26. That is, the wire-shaped transmission element 20 is attached to the flat element 30 along its entire length in the direction of attachment 26. The wire-shaped transmission elements 20 can be partially attached to the flat element 30 in the attachment area 26 in the direction of attachment. For example, the wire-shaped transmission elements 20 can be attached to the flat element 30 section by section in the attachment area 26 in the direction of attachment. However, the adhesive 40 can also extend over the entire main surface of the flat element 30.

[0033] The wire-shaped transmission elements 20 can be wired in a configuration that follows a routing path in a vehicle on the flat element 30. For example, the wire-shaped transmission elements 20 can also be arranged in a bent configuration on the flat element 30. For example, the wire-shaped transmission elements 20 can be branched according to the position of the electrical components to which the wire-shaped transmission elements 20 are connected. In this case, a branch section can be attached to the flat element 30. The wire-shaped transmission elements 20 can also be stacked in layers on the flat element 30. The wire-shaped transmission elements 20 can cross each other on the flat element 30. In any case, the wire-shaped transmission elements 20 are attached to the flat element 30 such that the wiring component 10 is a flat wiring component.

[0034] A thermally conductive layer 25 is formed on the outer circumference of the sheath 24 in the separation zone 28 of the wire-shaped transmission elements 20. The thermally conductive layer 25 has a higher thermal conductivity than the sheath 24. The thermal conductivity can be assessed, for example, by a heat conduction rate. The thermally conductive layer 25 can be formed completely or partially around the sheath 24 in the separation zone 28 in the circumferential direction of the sheath 24. In this case, the thermally conductive layer 25 is formed completely around the sheath 24 in the separation zone 28. The thermally conductive layer 25 can be formed on the sheath 24 in the separation zone 28 completely or partially in the direction of extension of the separation zone 28. For example, if the end section of the wire-shaped transmission element 20 is inserted into the connector 50, the heat-conducting layer 25 on the end section of the wire-shaped transmission elements 20 can be omitted.

[0035] The thermally conductive layer 25 can, for example, be a plastic layer with a thermally conductive filler F. The thermally conductive layer 25 can, for example, contain epoxy resin, silicone, modified silicone, acrylic resin, or a resin of the cyanoacrylate series as its main component. The thermally conductive filler F is a substance with a higher thermal conductivity than the coating 24. The thermally conductive filler F can be an inorganic filler or a metallic filler. Suitable materials for the inorganic filler include, for example, silicon dioxide, aluminum oxide, magnesium oxide, beryllium oxide, boron nitride, aluminum nitride, silicon nitride, silicon carbide, boron carbide, titanium carbide, mullite, graphite, and carbon nanotubes. Copper, aluminum, silver, and iron are suitable materials for the metallic filler.

[0036] The thermally conductive layer 25 can be formed, for example, by applying a thermally conductive adhesive in liquid form around the covering 24 and then allowing it to harden.

[0037] As in Fig. As shown in Figure 4, a thermally conductive layer 25B, corresponding to the thermally conductive layer 25, can be, for example, a metal layer made of chromium, nickel, copper, or gold. In this case, the thermally conductive layer 25B can be formed by plating around the casing 24.

[0038] The thermally conductive layer 25 can be formed in an area extending from the separation area 28 to the base element 30. More precisely, the thermally conductive layer 25 can be formed in an area extending from the separation area 28 to the attachment area 26 on the base element 30. In this case, the thermally conductive layer 25 is attached to the base element 30 at least in a portion of the attachment area 26. Specifically, the thermally conductive layer 25 is attached to the base element 30 via the adhesive 40, at least in a portion of the attachment area 26. However, the thermally conductive layer 25 does not necessarily have to extend from the separation area 28 to the base element 30.

[0039] The thermally conductive layer 25 can be formed in an area excluding at least a portion of the outer circumference of the covering 24 in the fastening area 26. The thermally conductive layer 25 is formed in an area extending from the separation area 28 to an end section of the fastening area 26 on the side of the separation area 28. The thermally conductive layer 25 does not necessarily have to be formed in an intermediate section of the fastening area 26 in the direction of its extension and in its end section on a side opposite the separation area 28.

[0040] In the cabling component 10, the heat generated in the separation zone 28 within the wire-shaped transmission elements 20 extends across the entire surface of the thermally conductive layer 25 along its length. Even if, for example, heat is generated section by section in the separation zone 28, the heat is distributed across the entire surface of the thermally conductive layer 25 and efficiently distributed. This improves the heat dissipation properties of the portion of the wire-shaped transmission elements 20 not attached to the wire-shaped transmission elements 20 in the cabling component 10, which contains the planar element 30 and the wire-shaped transmission elements 20, and suppresses or reduces heat accumulation in the separation zone 28.

[0041] The heat generated in the mounting area 26 of the wire-shaped transmission elements 20 is expected to be transferred to the base element 30. This will suppress or reduce the heat accumulation in the mounting area 26.

[0042] The thermally conductive layer 25 described above can be formed in an area extending from the separation zone 28 to the planar element 30. In this case, the heat generated in the separation zone 28 is transferred to the base element 30 via the thermally conductive layer 25. This further suppresses or reduces heat accumulation in the separation zone 28.

[0043] The thermally conductive layer 25 described above can be formed in an area excluding at least part of the outer circumference of the casing 24 in the fastening area 26. In this case, the area in which the thermally conductive layer 25 is formed is reduced, thereby lowering material and processing costs. This design also contributes to weight savings in the wiring component 10.

[0044] The thermally conductive layer 25 can also be a plastic layer with the thermally conductive filler F or a metal layer. Accordingly, the heat generated in the separation area 28 is readily transferred to the plastic layer containing the thermally conductive filler F or to the thermally conductive layer 25, which is the metal layer.

[0045] The heat in the fastening area 26 can be transferred to the flat element 30. The heat in the separation area 28 can be transferred to the flat element 30 via the thermally conductive layer 25. In these cases, the heat transferred to the flat element 30 can be transferred to the entire flat element 30. The flat element 30 therefore preferably contains a metal layer. The metal layer 32 can be provided in the flat element 30 on the side to which the wire-shaped transfer elements 20 are attached. The flat element 30 can consist of a single layer containing only the metal layer 32. The flat element 30 can have a multilayer structure in which another layer is stacked on top of the metal layer 32. The layer applied to the metal layer 32 can be a metal layer made of a different metal than that of the metal layer 32, or it can be a plastic layer. Fig. 1 to Fig. Figure 4 shows a case in which the entire planar element 30 is a metal layer.

[0046] Various configurations can be used for attaching a portion of the wire-shaped transmission elements 20, in which the plastic of the sheath 24 is exposed, to a portion in which the metal layer 32 is exposed on the planar element 30. For example, the adhesive 40 may contain a chemical compound with a plastic-side functional group and a metal-side functional group in a molecular structure, wherein the plastic-side functional group is chemically bonded to the plastic forming the sheath 24 and the metal-side functional group is chemically bonded to the metal forming the metal layer 32, as in an adhesive containing a silane coupling agent.For example, it is also possible that the functional group on the metal side is an alkoxy group and that the chemical compound also contains a silicon bond between the alkoxy group and the functional group on the polymer side in a molecular structure. The functional group on the metal side can be a chelate group. If the polymer from which the coating 24 is formed is polyvinyl chloride, the polymer-side functional group can be one type, two types, or more types of functional groups selected from a group consisting of an amino group, a thiol group, and an epoxy group.If the plastic from which the coating 24 is formed is polyolefin, the plastic-side functional group can be one type, two, or more types of functional groups selected from a group consisting of an amino group, a thiol group, a vinyl group, an acrylic group, a methacrylic group, and an epoxy group. The chemical compound can be a polymer in which the functional groups on the plastic side and the functional groups on the side of the inorganic material are bonded to a molecular chain.

[0047] If the surface of the metal layer 32 has an uneven or porous structure, an adhesive suitable for bonding the plastic of the casing 24 can be used as the adhesive 40. In this case, the adhesive 40 is expected to bond to the surface of the metal layer 32 by means of an anchoring effect.

[0048] Various configurations can be used to attach a portion of the wire-shaped transmission element 20, in which the metal of the thermally conductive layer 25 is exposed, to a portion of the flat element 30 in which the metal layer 32 is exposed. For example, an adhesive suitable for bonding metals, such as an epoxy adhesive, can be used. The thermally conductive layer 25 and the metal layer 32 can be joined, for example, by soldering, brazing, or welding.

[0049] Alternatively, the wire-shaped transfer element 20 can be sewn to the flat element 30 with a sewing thread. The wire-shaped transfer elements 20 can be coated with plastic together with the flat element 30 in order to be attached to the flat element 30. The wire-shaped transfer elements 20 can also be arranged between the flat element 30 and the other element in order to attach the wire-shaped transfer elements 20 to the flat element 30.

[0050] In this way, when the base element 30 contains the metal layer 32, the heat generated in the mounting area 26 in the wire-shaped transmission element 20 is transferred to the metal layer 32, so that it can easily spread across the entire metal layer 32. This further suppresses or reduces heat accumulation in the mounting area 26. The heat, which spreads across the entire metal layer 32, is easily dissipated.

[0051] Starting with an embodiment in which the thermally conductive layer 25 is attached to the planar element 30, the heat generated in the separation area 28 is transferred via the thermally conductive layer 25 to the metal layer 32, so that it spreads easily across the entire metal layer 32. This further suppresses or reduces heat accumulation in the separation area 28. The heat that spreads across the entire metal layer 32 is easily conducted away.

[0052] When the wire-shaped transmission elements 20 are attached to the flat element 30 via the adhesive 40, the adhesive 40 can be made of a thermally conductive material with a better thermal conductivity than the coating 24. For example, the adhesive 40 described above can contain a material that is included as a thermally conductive filler F in the thermally conductive layer 25. Accordingly, the heat generated in the wire-shaped transmission elements 20 is transferred more easily to the flat element 30.

[0053] The adhesive 40 that bonds the portion of the wire-shaped transmission elements 20, in which the thermally conductive layer 25 is formed, to the planar element 30 may have a better thermal conductivity than the other portion of the adhesive 40. For example, the adhesive 40 that bonds the portion of the wire-shaped transmission elements 20, in which the thermally conductive layer 25 is formed, to the planar element 30 may contain more thermally conductive filler than the rest, or a thermally conductive filler with better thermal conductivity.

[0054] The heat generated in the fastening area 26 is transferred via the adhesive 40 to the flat element 30 across almost the entire fastening area 26. The heat generated in the separation area 28 is transferred via the thermally conductive layer 25 to the flat element 30, thus potentially concentrating more heat in the portion of the adhesive 40 that bonds the thermally conductive layer 25 to the flat element 30. The thermal conductivity of the portion of the adhesive 40 that fixes the thermally conductive layer 25 to the flat element 30 is optimized to ensure that heat in the separation area 28 is effectively transferred to the flat element 30, thereby more effectively suppressing or reducing heat accumulation in the separation area 28.The other part of the adhesive 40 does not need to have better thermal conductivity compared to the part of the adhesive 40 that fixes the heat-conducting layer 25 to the planar element 30, which can result in a cost reduction.

[0055] It is also conceivable that only the part of the adhesive 40 that fixes the part on which the thermally conductive layer 25 is formed on the planar element 30 contains a thermally conductive filler in order to have a better thermal conductivity than the coating 24.

[0056] Each embodiment described in the embodiment and each modification example described above can be combined in a suitable manner, as long as they do not contradict each other. REFERENCE MARK LIST 10 Wiring component 20 Wire-shaped transmission element 22 transmission wire bodies 24 Envelope 25 Thermally conductive layer 25B Thermally conductive layer 26 Mounting area 28 Separation area 30 Basic element (flat element) 32 metal layer 40 adhesive 50 connectors F Thermally conductive filler

Claims

[1] Wiring component (10) comprising: a basic element (30); and a wire-shaped transmission element (20) with a transmission wire body (22) and a covering (24) arranged around the transmission wire body, wherein the wire-shaped transmission element has a fastening area (26) attached to the base element and a separation area (28) separate from the base element, a thermally conductive layer (25; 25B) which has a better thermal conductivity than the encapsulation is formed on an outer circumference of the encapsulation in the separation region, and the wire-shaped transmission element (20) and the base element (30) are attached to each other via an adhesive (40) which does not correspond to the thermally conductive layer (25; 25B). [2] Wiring component according to claim 1, wherein the thermally conductive layer (25; 25B) is formed in a region extending from the separation area (28) to the base element (30). [3] Wiring component according to claim 1 or 2, wherein the thermally conductive layer (25; 25B) is formed in an area excluding at least a part of the outer circumference of the covering (24) in the fastening area (26). [4] Wiring component according to one of claims 1 to 3, wherein the thermally conductive layer (25; 25B) is a plastic layer with a thermally conductive filler or a metal layer. [5] Wiring component according to one of claims 1 to 4, wherein the base element has a metal layer (32). [6] Wiring component according to one of claims 1 to 5, wherein the wire-shaped transmission element (20) is attached to the base element (30) in the fastening area by a thermally conductive material (40) having a better thermal conductivity than the covering.

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