FORM PRESSING DEVICE

Abstract

Compression molding device (1) for compression molding resin (R) onto a workpiece (10), wherein a plurality of components (12) are mounted on a carrier (11) via a plurality of connecting elements and a plurality of packings are produced, each of which has at least one of the components (12) sealed with resin (R), wherein the compression molding device (1) comprises: a measuring part (110) that measures the weight of the workpiece (10); a calculation part (120) that calculates a supply quantity of resin (R) based on the weight of the workpiece (10), measured by the measuring part (110); a feed part (130) that feeds the resin (R) in the feed quantity calculated by the calculation part (120); a volume measuring element that measures a volume of the workpiece (10); and a forming tool (190) that presses the resin (R), supplied by the feed part, onto the workpiece (10), wherein the calculation part (120) calculates a total volume of a plurality of assembled items comprising the plurality of components (12) and the plurality of connecting elements, based on the weight of the workpiece (10), and the resin feed rate (R) is calculated based on the total volume of the multitude of mounted items, wherein the calculation part (120) calculates a total weight of the multitude of assembled items based on the weight of the workpiece (10), and the total volume of the multitude of assembled items calculated from the total weight of the multitude of assembled items based on a specific gravity of the multitude of assembled items, wherein the measuring part (110) measures a weight of a first test piece, wherein a first number of sets of mounted items are mounted on a reference carrier, and a weight of a second test piece, wherein a second number of sets of mounted items are mounted on the reference carrier, the second number of sets being different from the first number of sets, and wherein the volume measuring part measures a volume of the first test piece and a volume of the second test piece, and the calculation part (120) calculates the specific gravity of the multitude of assembled objects by dividing a weight difference between the weight of the first test piece and the weight of the second test piece by a volume difference between a volume of the first test piece and a volume of the second test piece.

Description

Technical field

[0001] The present invention relates to a compression molding device. State of the art

[0002] A molding device is known as a device for producing packings containing components, such as semiconductor elements, sealed within them with resin. The molding device applies resin to a workpiece in which a multitude of components are mounted on a carrier to collectively form a multitude of packings. One such molding device is a compression molding device, in which one of a pair of molds has a cavity with a variable structure. To improve the accuracy of the packing thickness, the compression molding device has the function of adjusting the amount of resin supplied, for example, depending on the number of missing components in the workpiece.

[0003] Patent literature 1 discloses a liquid material ejection device which subtracts the weight of a single substrate from the weight of the workpiece, taking into account the chip distance, which is measured by a weight measuring device, then divides the obtained weight by the weight per chip to obtain the number of chips mounted on the workpiece, subtracts this from the number of regular chips to calculate the number of missing chips, and multiplies the number of missing chips by the amount of resin to be replenished for a missing chip to calculate a corrected amount of resin.Patent literature 2 discloses a weight inspection device comprising a weight measuring unit, an irradiation unit, a detection unit and an estimated weight calculation unit that calculates a weight of a material based on the amount of transmitted and reflected X-rays used to irradiate the material. Bibliography Patent literature [Patent Literature 1] Japanese patent application Publication JP 2003 - 165 133 A [Patent Literature 2] US Patent Application Publication US 2010 0046703 A1 BRIEF DESCRIPTION OF THE INVENTION Technical Problem

[0004] The components are attached to the substrate using fasteners such as bond wires, solder, and anisotropic conductive adhesive. If a component is missing from the workpiece, its volume changes according to the volume of the fastener, even if it is smaller than the component's volume. The weight and volume of the fastener vary depending on its shape, size, etc., when the component is actually mounted on the substrate. Therefore, it is necessary to measure the exact weight and volume of the assembled item, including both the component and the fastener, when it is actually mounted on the workpiece. However, it is unclear how to measure the weight per chip and the amount of resin that needs to be added for a missing chip, as described in patent literature 1, so it is unclear whether the fastener is taken into account.If part or all of the connecting element is missing due to the loss of part of a chip, the number of missing chips and the number of missing connecting elements may not match. Therefore, the corrected resin quantity, calculated based on the number of missing chips and the weight per chip, as described in patent literature 1, may result in an error in the packing thickness.

[0005] In view of these circumstances, the present invention provides a molding press device that is capable of improving the accuracy of the resin supply. Solution to the problem

[0006] The invention is defined by the appended claims. A compression molding device according to one aspect of the present invention is provided for compression molding resin onto a workpiece in which a plurality of components are mounted on a carrier via a plurality of connecting elements, and for the production of a plurality of packages, each comprising at least one of the components sealed with resin. The compression molding device comprises: a measuring element that measures the weight of the workpiece; a calculating element that calculates a supply quantity of resin based on the weight of the workpiece as measured by the measuring element; a supply element that feeds the resin in the supply quantity calculated by the calculating element; and a molding tool that compresses the resin supplied by the supply element onto the workpiece.The calculation part calculates a total volume of a multitude of assembled items containing a multitude of components and a multitude of connecting elements, based on the weight of the workpiece, and calculates the resin feed rate based on the total volume of the multitude of assembled items.

[0007] According to this aspect, it is possible to easily and quickly adjust the resin feed rate to the condition of the components on the substrate. Furthermore, the resin feed rate is calculated based on the total volume of the mounted items, taking into account not only the quantity of components but also the quality of the fasteners. This improves the accuracy of the resin feed rate calculation and prevents defective products due to excess or insufficient resin.

[0008] In the aspect above, the calculation part calculates a total weight of the multitude of assembled items based on the weight of the workpiece and calculates the total volume of the multitude of assembled items based on the total weight of the multitude of assembled items.

[0009] In the aspect above, the calculation part calculates the total volume of the multitude of assembled items from the total weight of the multitude of assembled items based on a specific density or gravity of the multitude of assembled items.

[0010] In the aspect described above, the measuring part measures the weight of a first test specimen, in which a first number of sets of assembled items are mounted on a reference carrier, and the weight of a second test specimen, in which a second number of sets of assembled items are mounted on the reference carrier, and the second number of sets differs from the first number of sets. The calculation part calculates the specific gravity of the multitude of assembled items by dividing the weight difference between the weight of the first test specimen and the weight of the second test specimen by the volume difference between the volume of the first test specimen and the volume of the second test specimen.

[0011] In the above aspect, the measuring part can measure the weight of a first test piece in which no mounted item is attached to a reference carrier, and the weight of a second test piece in which all mounted items are attached to the reference carrier, and the calculating part can calculate the specific gravity of the multitude of mounted items by dividing a weight difference between the weight of the first test piece and the weight of the second test piece by a volume difference between a volume of the first test piece and a volume of the second test piece.

[0012] In the above aspect, the compression molding device further includes a volume measuring part that measures a volume of the workpiece, and the volume measuring part measures the volume of the first test workpiece and the volume of the second test workpiece.

[0013] In the above aspect, the calculation part calculates the number of sets of the multitude of assembled items from the weight of the multitude of assembled items based on a weight of assembled items per set, and calculates the total volume of the multitude of assembled items from the number of sets of the multitude of assembled items based on a volume of assembled items per set.

[0014] From the above perspective, the compression molding device further includes a thickness gauge that measures the thickness of the packing. The gauge measures the weight of a third test workpiece, in which a third number of sets of assembled items are mounted on a reference carrier, and the weight of a fourth test workpiece, in which a fourth number of sets of assembled items are mounted on the reference carrier. The thickness gauge measures the thickness of a first sample assembly packing, in which a first feed quantity of resin is formed onto the third test workpiece, and the thickness of a second sample assembly packing, in which the first feed quantity of resin is formed onto the fourth test workpiece, and the calculation part calculates the volume of the assembled items per set.by multiplying a thickness difference between the thickness of the first sample assembly pack and the thickness of the second sample assembly pack by an upper surface area of ​​the first sample assembly pack or the second sample assembly pack, and dividing the resulting product by a difference in the number of sets between the third number of sets and the fourth number of sets, and calculating the weight of the assembled items per set by dividing a weight difference between the weight of the third sample piece and the weight of the fourth sample piece by the difference in the number of sets.

[0015] In the aspect described above, the compression molding device further includes a thickness gauge that measures the thickness of the packing. The gauge can measure the weight of a third sample workpiece with no mounted item on a reference carrier, and the weight of a fourth sample workpiece with all mounted items on the reference carrier. The thickness gauge can measure the thickness of a first sample assembly packing, where an initial feed of resin is formed onto the third sample workpiece, and the thickness of a second sample assembly packing, where the initial feed of resin is formed onto the fourth sample workpiece. The computational unit can calculate the volume of the mounted items per pack.by multiplying a thickness difference between the thickness of the first sample assembly pack and the thickness of the second sample assembly pack by a top surface area of ​​the first sample assembly pack or the second sample assembly pack, and dividing the resulting product by the number of sets of assembled items mounted on the fourth sample workpiece, and calculating the weight of the assembled items per set by dividing a weight difference between the weight of the third sample workpiece and the weight of the fourth sample workpiece by the number of sets of assembled items mounted on the fourth sample workpiece.

[0016] In the above aspect, the calculation part can calculate the weight of the multitude of mounted items by subtracting the weight of a reference support from the weight of the workpiece.

[0017] In the above aspect, the compression molding device may further include a thickness measuring part that measures the thickness of the support, and the calculation part may calculate the weight of the support based on the thickness of the support and calculate the weight of the multitude of mounted items by subtracting the weight of the support from the weight of the workpiece.

[0018] In the above aspect, the calculation part can calculate a resin volume after molding that is required to form the multitude of packs with a desired thickness based on the total volume of the multitude of assembled items, and calculate a weight of resin after molding as the quantity of resin supplied based on the resin volume after molding.

[0019] In the above aspect, the calculation part can calculate a resin volume after molding required to form the multitude of packs with a desired thickness based on the total volume of the multitude of assembled items, calculate a weight of the resin after molding based on the resin volume after molding, and calculate a weight of the resin before molding from the weight of the resin after molding as the amount of resin supplied based on a weight change rate of the resin before and after molding. Effects of the invention

[0020] According to the present invention, a compression molding device is provided which is able to improve the accuracy of the resin supply. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a diagram that schematically shows the configuration of the compression molding device according to one embodiment. Fig. Figure 2 is a top view that schematically shows the configuration of the workpiece before the resin is compressed. Fig. Figure 3 is a flowchart showing an example of the procedure for calculating the amount of resin to be supplied. Fig. Figure 4 is a flowchart showing an example of the procedure for adjusting the corrected resin quantity. Fig. Figure 5 is a flowchart showing an example of a procedure for calculating the resin feed position. Fig. Figure 6 is a flowchart showing another example of a method for calculating the resin feed position. Fig. Figure 7 is a flowchart showing another example of the procedure for calculating the amount of resin to be supplied. Fig. Figure 8 is a diagram that schematically shows the configuration of the compression molding device according to the first modified example. Fig. Figure 9 is a diagram that schematically shows the configuration of the compression molding device according to the second modified example. Fig. Figure 10 is a flowchart showing part of the procedure for calculating the resin feed rate. Fig. Figure 11 is a flowchart showing part of the procedure for calculating the resin feed rate. Fig. Figure 12 is a flowchart showing part of the procedure for calculating the resin feed rate. Fig. Figure 13 is a flowchart showing part of the procedure for calculating the resin feed rate. DESCRIPTION OF THE EXECUTION FORMS

[0021] An embodiment of the present invention is described below with reference to the drawings. However, the drawings of this embodiment are exemplary, the dimensions and shape of the individual parts are schematic, and the technical scope of the present invention should not be interpreted as being limited to this embodiment. <formpressvorrichtung>

[0022] The configuration of a compression molding device 1 according to an embodiment of the present invention is described with reference to Fig. 1 and Fig. 2 described. Fig. Figure 1 is a diagram that schematically shows the configuration of the compression molding device according to one embodiment. Fig. Figure 2 is a top view that schematically shows the configuration of a workpiece before resin compression.

[0023] The compression molding device 1 is a device for compression molding resin R onto a workpiece 10 in which a plurality of components 12 are mounted on a carrier 11 to produce a plurality of packings, in each of which at least one component 12 is resin-sealed (molded). The compression molding device 1 also produces at least one packing on which no component 12 is mounted. The compression molding device 1 comprises a resin supply device 100 that supplies the resin R and a molding tool 190 that heats and compresses the resin R.

[0024] The carrier 11 is, for example, an intermediate substrate, the component 12 is a semiconductor element (IC chip, diode, transistor, or the like) mounted on the carrier 11, and the resin R is a granulate. However, the carrier 11, the component 12, and the resin R are not limited to the properties mentioned above. The carrier 11, for example, is a substrate made of resin, glass, metal, a semiconductor, or the like, and can be a leadframe, a carrier plate with an adhesive film, or the like. The component 12 can be, for example, a MEMS component or an electronic component (capacitor, inductor, resistor, etc.). The component 12 can be mounted on the carrier 11 by a wire bonding or flip-chip process, or it can be detachably attached. The components 12 can, for example, comprise two types of components 12a and 12b, or even three or more types of components. The resin R can be in the form of a powder, tablets, liquid, or the like.The resin R contains, for example, a thermosetting resin such as epoxy resin and can be shaped into any desired form by heating and compression. The component 12 is attached to the carrier 11 by means of a connecting element (not shown). The connecting element is either an element that attaches the component 12 to the carrier 11 or an element that electrically connects the component 12 to the carrier 11. The connecting element is, for example, a bonding wire, a solder, an anisotropic conductive adhesive, or the like. Hereinafter, a plurality of components 12 and a plurality of connecting elements are collectively referred to as a plurality of assembled items. At least one component 12 mounted in a packing area PA and at least one connecting element that connects the at least one component 12 to the carrier 11 are combined to form a set of assembled items.In other words, a set of assembled items refers to all sealed items on the carrier 11 that are to be sealed with resin in one of several packages produced by the compression molding device 1 from the workpiece 10.

[0025] For example, the packing formed by the compression molding device 1 may require high accuracy in thickness. Since the resin feed rate R required to produce the packing with a desired thickness varies depending on the condition of the workpiece 10, it is desirable to configure the compression molding device 1 so that it is able to calculate the resin feed rate R with high accuracy.

[0026] Here, the relationship between the state of workpiece 10 and the amount of resin supplied R to workpiece 10 is shown in Fig. Figure 2, described as an example. The workpiece 10 is provided with a plurality of packing areas PA, which are subdivided by a plurality of division lines LN1 and LN2. The division lines LN1 and LN2 are imaginary lines for subdividing the workpiece 10, which is injection-molded with resin R into a plurality of packings, and the division lines LN1 and LN2 are essentially orthogonal to each other. The packing area PA is an area that serves as a packing, and a plurality of packing areas PA are arranged in a matrix. A first component 12a and a second component 12b are arranged in a first packing area PA1 of the packing areas PA. However, in a second packing area PA2 and a third packing area PA3 of the packing areas PA, part or all of at least one of the first component 12a and the second component 12b is missing.As shown in the second packing area PA2, for example, component 12b may detach upon impact with workpiece 10, and part or all of component 12b may be missing. If, for example, part or all of component 12b is missing after component 12b has been assembled, but the connecting element that joins the partially missing component 12b to the carrier 11 is present, the number of components 12b in workpiece 10 and the number of connecting elements joining the components 12b will not match. Furthermore, as shown in the third packing area PA3, for example, the first component 12a and the second component 12b may have been omitted for a section that cannot be used due to a wiring error in the carrier 11, in order to reduce component loss.To suppress the thinning of the packings in these cases, it is necessary to make an adjustment by increasing the supply quantity of resin R by the volumes of the missing first component 12a and second component 12b, which should be mounted in the second packing area PA2 and in the third packing area PA3.

[0027] The resin supply device 100 calculates the supply quantity of resin R based on the condition of the workpiece 10 and supplies the resin R to the workpiece 10 or a release film RF before it is conveyed into the mold tool 190. In the Fig. In the example shown, the resin feed device 100 feeds the resin R to the release film RF. The resin feed device 100 comprises a measuring part 110, a calculation part 120, a feed part 130, a platform 140, a thickness measuring part 150, an imaging part 160, and a reversing part 180.

[0028] The measuring part 110 measures the weight of the workpiece 10 and transmits the measurement result to the calculation part 120. For example, the measuring part 110 is an electronic scale with an upper pan that measures the weight of an object loaded on top and loads the workpiece 10 onto the top, with the mounting surface on which the components 12 are mounted facing upwards (opposite the measuring part 110) to measure the weight of the workpiece 10.

[0029] Calculation unit 120 calculates the resin feed rate R based on the weight of the workpiece 10, measured by the measuring unit 110. Calculation unit 120 consists of computer hardware and software. Data for calculating the resin feed rate R can be pre-registered in calculation unit 120. This data can include, for example, the standard weight, minimum weight, maximum weight, standard thickness, minimum thickness, maximum thickness, and specific gravity of the substrate 11.Furthermore, the data can include the standard weight, minimum weight, and maximum weight of workpiece 10; the standard quantity, maximum quantity, minimum quantity, standard total weight, maximum total weight, minimum total weight, and specific gravity of the components 12 mounted on a workpiece 10; the standard feed rate, minimum feed rate, maximum feed rate, and specific gravity of the resin R; as well as the number of packing areas PA, the desired packing thickness, the permissible packing thickness range, and the like. The resin R feed rate can be specified by volume or by weight. The resin R feed rate can also be specified by a control parameter of the feed component 130. Here, the "standard" of the above standard weight, etc., is used.The average or median value is treated as the standard value in the manufacturing process when there are no defects in any of the above elements as a product, or when the number of defects is within the permissible range. The "minimum" and "maximum" of the aforementioned weights, etc., are the lower and upper limits of the manufacturing tolerances, respectively. The data recorded in calculation part 120 may include statistical information such as the average, median, and mode for each of the weight and thickness of the support 11, the weight of the workpiece 10, the quantity and total weight of the components 12, and the resin feed rate R. The data recorded in calculation part 120 may be predicted or measured values.

[0030] The carrier 11 with the standard weight corresponds to an example of the "reference carrier" of the present invention, and the standard weight of the carrier 11 corresponds to an example of the "reference carrier weight" of the present invention. The "reference carrier" of the present invention can be a carrier 11 with the minimum weight or the maximum weight, or a carrier 11 with a weight of the mean, median, or mode. That is, the "reference carrier weight" of the present invention can be the minimum, maximum, average, median, or mode of the weight of the carrier 11. The standard quantity of components 12 corresponds to an example of the "reference component quantity" of the present invention, and the standard total weight of the components 12 corresponds to an example of the "reference component total weight" of the present invention.The “reference component quantity” of the present invention can be the maximum quantity or the minimum quantity of components 12, and the “reference component total weight” of the present invention can be the maximum total weight or the minimum total weight of components 12.

[0031] The workpiece 10 with the standard weight corresponds to an example of the "reference workpiece" of the present invention, and the standard weight of the workpiece 10 corresponds to an example of the "reference workpiece weight" of the present invention. The "reference workpiece" of the present invention is a workpiece with components in the reference component quantity, mounted on the reference carrier, and the "reference workpiece weight" of the present invention is the weight of the reference workpiece. The "reference workpiece" of the present invention can be a workpiece 10 with the minimum weight or the maximum weight, and the "reference workpiece weight" of the present invention can be the minimum weight or the maximum weight of the workpiece 10. The maximum weight of the workpiece 10 is, for example, the weight of the workpiece 10 with all components 12, mounted on the reference carrier. The minimum weight of the workpiece 10 is, for example,the weight of workpiece 10 without component 12 mounted on the reference carrier (i.e. the weight of the reference carrier).

[0032] The standard resin feed rate R corresponds to an example of the "reference resin rate" of the present invention. The "reference resin rate" of the present invention is the amount of resin required to injection mold the resin R onto the reference workpiece with a desired thickness. The "reference resin rate" of the present invention can be the maximum or the minimum resin feed rate. The minimum resin feed rate is, for example, the amount of resin required to injection mold the resin R onto the workpiece 10 with the maximum weight and desired thickness. The maximum resin feed rate is, for example, the amount of resin required to injection mold the resin R onto the workpiece 10, which has the minimum weight and desired thickness.

[0033] The feeder 130 supplies the resin R in the quantity calculated by the computational unit 120. Although the feeder 130 is configured to supply the resin R to the release film RF, as in the example in Fig. As shown in Figure 1, the feeder 130 can be configured to supply the resin R to the workpiece 10. The feeder 130 includes a hopper 131, a controller 133, and a linear conveyor 135. The hopper 131 receives the resin R. The controller 133 controls the feed quantity, feed rate, feed timing, etc., of the resin R based on the result of the calculation input from the computational unit 120. The linear conveyor 135 dispenses the resin R, causing it to fall from the tip. However, the configuration of the feeder 130 is not limited to the above. For example, if the resin R is liquid, the feeder 130 can include a dispenser with a syringe that stores the resin R, a piston that dispenses the resin R, and a pinch valve that opens and closes the tip of the syringe.Furthermore, the feed part 130 can have a configuration using the linear conveyor 135 or a configuration other than the dispenser with the syringe.

[0034] Platform 140 is a base for the release film RF, onto which the resin R is fed. Platform 140 is configured to be movable relative to the feeder 130. In particular, at least one of the feeder 130 and platform 140 is configured to be moved by a moving means such as a servo motor. For example, either the feeder 130 or the platform 140 moves relative to each other to apply the resin R over a large area onto the release film RF. However, the positions of the feeder 130 and platform 140 relative to each other can be essentially fixed, and the resin R can, for example, be fed to the central part of the release film RF. Platform 140 can include a vibrator that disperses the resin R fed onto the release film RF by vibration.

[0035] The thickness gauge 150, for example, measures the thickness of the carrier 11. The thickness gauge 150 is, for example, a non-contact measuring instrument such as a reflection spectroscopy system or an ellipsometer system, but it is not limited to these and can also be a contact measuring instrument such as a micrometer system. The thickness gauge 150 can measure the thickness using a laser displacement meter. For example, the thickness gauge 150 can measure the thickness at multiple points or on multiple surfaces to measure the thickness distribution within the plane, and it can measure the thickness while scanning in the direction within the plane to measure the thickness distribution within the plane. Information measured by the thickness gauge 150 is transmitted to the computation unit 120 and used to calculate the resin feed rate R.For example, the calculation part 120 corrects a weight deviation in the weight of the workpiece 10, measured by the measuring part 110, due to a thickness deviation of the carrier 11.

[0036] The thickness gauge 150 can measure the thickness of the workpiece 10. The thickness of the workpiece 10, which is referenced here, contains information about the assembly status, e.g., whether a component 12 is mounted on the carrier 11, as well as the height and position of the component 12. That is, the assembly status information includes the number, positions, density, etc., of the second packing area PA2 and the third packing area PA3. When measuring the thickness of the workpiece 10, the thickness gauge 150 preferably uses a non-contact measuring device or a laser displacement meter to prevent the measurement from damaging the component 12. The assembly status information, measured by the thickness gauge 150, is transmitted to the calculation unit 120 and used to calculate the resin feed rate and feed position R.The feed position of the resin R, which is referred to here, contains not only the information about the position that corresponds to the packing area PA to which the resin R is to be fed, but also the information about the position that corresponds to the packing area PA to which the feed quantity of the resin R is to be increased or decreased.

[0037] The thickness gauge 150 can measure the thickness of the packing. The packing thickness, measured by the thickness gauge 150, is transmitted to the calculation unit 120. The calculation unit 120 can, for example, compare the calculated resin feed rate R with the thickness of the packing, as it is molded with resin R, and adjust the procedure for calculating the resin feed rate R accordingly.

[0038] Imaging unit 160 captures an image of workpiece 10. Imaging unit 160 includes, for example, a camera (a monocular camera or a compound eye camera) and an image processing system that processes the image captured by the camera. Imaging unit 160 captures an image of component 12 on carrier 11 and, through image processing, obtains information about the assembly status. This assembly status information, acquired by image processing unit 160, is transmitted to calculation unit 120 and used to calculate the resin feed quantity and feed position R.

[0039] It should be noted that the thickness measuring element 150 and the imaging element 160 can be omitted in the compression molding device 1. Furthermore, the thickness of the carrier 11, the thickness of the workpiece 10, and the thickness of the packing can be measured by separate thickness measuring elements.

[0040] The reversing part 180 rotates the workpiece 10 vertically, as measured by the measuring part 110, while the workpiece 10 is transported into the forming tool 190. As in Fig. As shown in Figure 1, when the workpiece 10 is measured with the components 12 facing upwards and inserted into an upper tool 192, which will be described later, the reversing part 180 reverses the vertical direction of the workpiece 10, with the components 12 pointing downwards. Similarly, when the workpiece 10 is measured with the components 12 facing downwards and inserted with the components 12 facing upwards into a lower tool 191, which will be described later, the reversing part 180 reverses the vertical direction of the workpiece 10. If the orientation of the workpiece 10 during measurement by the measuring part 110 is the same as the orientation of the workpiece 10 when inserted into the forming tool 190, the reversing part 180 is not required.

[0041] The mold 190 is a pair of tools (lower tool 191 and upper tool 192) for resin sealing of the workpiece 10 using compression molding. The release film RF is inserted into the tool, which has a cavity 199 between the lower tool 191 and the upper tool 192, and the workpiece 10 is inserted into the other tool. The resin R is also supplied either to the release film RF or to the workpiece 10, which is inserted into the lower tool 191. In this embodiment, the mold 190 has a lower mold cavity structure that includes the cavity 199 in the lower tool 191.

[0042] The mold 190 includes a sealing ring 193 (e.g., an O-ring) that seals the interior of the mold 190 (the space between the lower mold 191 and the upper mold 192). Although not shown, the molding device 1 includes a pressure-adjusting element (e.g., a vacuum pump) for adjusting the internal pressure of the mold 190 and a temperature-adjusting element (e.g., a heater) for adjusting the internal temperature (mold temperature).

[0043] The lower tool 191 comprises a chassis or frame 19A, a cavity 19B attached to the frame 19A on the side of the upper tool 192, a clamping device 19C surrounding the cavity 19B, and a chamber block 19D surrounding the clamping device 19C with a gap. The cavity 19B is attached to the frame 19A on the side of the upper tool 192. The clamping device 19C projects from the cavity 19B toward the upper tool 192 and, together with the cavity 19B, forms the cavity 199. The clamping device 19C is connected to the frame 19A via a spring and is configured to be displaceable relative to the cavity 19B. When the tools are clamped, the outer edge section (carrier 11) of the workpiece 10 is clamped between the clamping device 19C and the upper tool 192.On the upper surface of the clamping device 19C (the surface facing the frame 192) are a plurality of vent openings that connect the space on the side of the chamber block 19D and the cavity 199. The vent openings are radially arranged grooves located in the center of the cavity 199. The vent openings serve as exhaust ports for the removal of air remaining in the cavity 199 of the clamped mold 190 and gas generated from the resin R. The vent openings are designed to be sufficiently deep (e.g., a few micrometers (µm)) to allow air or gas to escape, but to prevent the resin R from flowing out. The sealing ring 193 contacts the chamber block 19D.

[0044] The compression molding device 1 according to this embodiment can also include a volume measuring element. The volume measuring element is not particularly limited as long as it is capable of measuring the volume of the workpiece 10, the volume of the assembly formed by molding the resin R onto the workpiece 10, the volume of the carrier 11, the volume of the mounted objects attached to the workpiece 10, or the like.

[0045] Next, an example of a method for manufacturing a package using the compression molding device 1 will be given with reference to the Fig. 3 to Fig. 7 described.

[0046] Fig. Figure 3 is a flowchart showing an example of a procedure (S110) for calculating the resin feed rate R. In procedure S110 for calculating the resin feed rate R, the reference workpiece weight and the reference resin quantity are first recorded (S111). For example, the reference workpiece weight and the reference resin quantity are input from an external port into the calculation unit 120. In this calculation procedure S110, the reference workpiece weight is the weight of workpiece 10 (hereinafter referred to as the "reference workpiece") with all components mounted on the reference carrier 12. In other words, the reference workpiece weight is the weight of workpiece 10 where all packing areas PA are the first packing areas PA1. For example, a carrier 11 with the standard weight is used as the reference carrier.In this case, the reference resin quantity is the amount of resin R required to compress the resin R onto the reference workpiece with all components 12 mounted on it, in order to obtain a packing of the desired thickness. However, it is also possible to use a carrier 11 with the minimum weight as the reference carrier. In this case, the reference resin quantity is the amount of resin R required to compress the resin R onto the reference workpiece without any component 12 mounted on it, in order to obtain a packing of the desired thickness.

[0047] The weight of workpiece 10 is then measured (S112) and the weight difference of workpiece 10 is calculated (S113). The weight of workpiece 10 is measured by measuring part 110, and the weight difference of workpiece 10 is calculated by calculation part 120. The weight difference of workpiece 10 is the difference between the reference weight of the workpiece and the measured weight of workpiece 10. Workpiece 10 may have a second packing area PA2, in which some of the components 12 are missing, and a third packing area PA3, in which all components 12 are missing. For example, the third packing areas PA3 may be scattered due to defects in the internal wiring of the substrate, or half of the carrier 11 may be the third packing area PA3, in which not all components 12 can be mounted.Therefore, the missing components 12, which should be assembled in the second packing area PA2 or in the third packing area PA3, are collectively referred to as "missing components 12". The weight of workpiece 10 measured in step S112 is less than the weight of the reference workpiece by the weight of the missing components 12. In step S113, the weight of workpiece 10 measured in step S112 is subtracted from the reference workpiece weight to calculate the weight of the missing components 12 as the weight difference of workpiece 10.

[0048] The corrected resin quantity is then calculated based on the weight difference of workpiece 10 (S114), and the corrected resin quantity is included in the reference resin quantity (S115). The corrected resin quantity is calculated by calculation part 120 and included in the reference resin quantity by calculation part 120. When the resin R in the reference resin quantity is injection-molded onto workpiece 10, which has the second packing area PA2 and the third packing area PA3, the packing thickness is reduced according to the missing components 12. Therefore, in step S115, the corrected resin quantity for the missing components 12 is added to the reference resin quantity to obtain a packing with the desired thickness. In step S114, the corrected resin quantity is, for example,The weight of the resin R is calculated by multiplying the weight difference of the workpiece 10 by the specific gravity of the resin R and dividing the product by the specific gravity of the component 12. If the specific gravity of the resin R and the specific gravity of the component 12 are close to each other, the weight difference of the workpiece 10 can be used as the corrected amount of resin.

[0049] Calculating the resin feed rate R based on the weight of workpiece 10 in this way makes it possible to calculate the resin feed rate R simply and quickly. That is, compared to a compression molding device configured to essentially scan the entire surface of a workpiece to measure the thickness and check the assembly status of all components, the compression molding device according to this embodiment and the compression molding process that the compression molding device uses improve the production capacity of packages.

[0050] Furthermore, in procedure S110 for calculating the resin feed rate R, the reference workpiece weight can be the weight of workpiece 10 without any component 12 mounted on the reference carrier, as described above. In other words, the reference workpiece weight can be the weight of the reference carrier. The reference resin feed rate, at this point, is the amount of resin R required to compress the resin R onto the reference workpiece without any component mounted on it, in order to obtain a packing of the desired thickness. In this case, the weight of workpiece 10 measured in step S112 will be greater than the weight of the reference workpiece by the weight of the mounted components 12. The weight of the mounted components 12 is calculated as the weight difference of workpiece 10 by subtracting the reference workpiece weight from the weight of workpiece 10 measured in step S112.At this point in step S115, the resin supply quantity R is calculated by subtracting the corrected resin quantity for the components 12, mounted on the workpiece 10, from the reference resin quantity.

[0051] Fig. Figure 4 is a flowchart showing an example of a procedure (S120) for setting the corrected resin quantity. In procedure S120 for setting the corrected resin quantity, the thickness of the support 11 is first measured (S121). The thickness of the support 11 is measured using the thickness gauge 150. Next, the support weight is calculated from the thickness of the support 11 (S122), the weight difference of the support 11 is calculated (S123), and the corrected resin quantity is set based on the weight difference of the support 11 (S124). The weight difference of the support 11 is calculated by the computational unit 120, and the corrected resin quantity is adjusted by the computational unit 120. The weight difference of the support 11 is the difference between the weight that the reference support occupies in the reference workpiece weight and the measured weight that the support 11 occupies in the workpiece 10.The weight of the carrier 11 varies depending on a variation in its thickness. Therefore, the weight difference of the workpiece 10 calculated in step S113 includes not only the weight of the missing components 12 but also the weight difference of the carrier 11. However, a variation in the weight of the carrier 11 does not affect the resin feed rate R required to compression mold a pack with a desired thickness. Therefore, the resin feed rate R can be calculated more accurately by eliminating the influence of the weight difference of the carrier 11 from the corrected resin feed rate. For example, in step S124, the corrected resin feed rate is calculated from the weight difference of the workpiece 10 and then adjusted based on the weight difference of the carrier 11.However, the corrected amount of resin can also be calculated by subtracting the weight difference of the carrier 11 from the weight difference of the workpiece 10.

[0052] Fig. Figure 5 is a flowchart showing an example of a procedure (S130) for calculating the resin supply position R. In procedure S130 for calculating the resin supply position R, the thickness of workpiece 10 is first measured (S131). The thickness of workpiece 10 is measured using thickness gauge 150. Next, the assembly status of component 12 is calculated (S132), and the resin supply position R is calculated (S133). The assembly status of component 12 is calculated by computational component 120 based on the thickness of workpiece 10, and the resin supply position R is calculated by computational component 120 based on the assembly status of component 12. The resin supply position R is calculated based on the assembly status of component 12.By supplying more resin R to the positions corresponding to the second packing area PA2 and the third packing area PA3 than the resin R supplied to the position corresponding to the first packing area PA1, the time required to fill the resin R within the mold tool 190 can be reduced in order to suppress molding defects of the resin R.

[0053] Fig. Figure 6 is a flowchart showing another example of procedure (S140) for calculating the resin R supply position. In procedure S140 for calculating the resin R supply position, an image of workpiece 10 is first acquired (S141). The image of workpiece 10 is acquired by imaging part 160. Subsequently, the assembly status of component 12 is calculated (S142), and the resin R supply position is calculated (S143). The assembly status of component 12 is calculated by computation part 120 based on the image of workpiece 10, and the resin R supply position is calculated by computation part 120 based on the assembly status of component 12. Furthermore, computation procedure S130 and computation procedure S140 can be used together to calculate the resin R supply position.

[0054] Fig. Figure 7 is a flowchart showing another example of procedure (S210) for calculating the resin feed rate R. In procedure S210 for calculating the resin feed rate R, the maximum workpiece weight, the minimum workpiece weight, and the maximum number of packs are first recorded (S211). For example, the maximum workpiece weight, the minimum workpiece weight, and the maximum number of packs are input from an external port into calculation part 120. In this calculation procedure S210, the maximum workpiece weight is the weight of workpiece 10 (hereinafter referred to as the "maximum workpiece") with all components 12 mounted on the reference carrier. In other words, the maximum workpiece weight is the weight of workpiece 10 where all packing areas PA are the first packing areas PA1.The minimum workpiece weight is the weight of workpiece 10 (hereinafter referred to as the "minimal workpiece") with no component 12 mounted on the reference carrier. In other words, the minimum workpiece weight is the weight of the reference carrier. The reference carrier is, for example, a carrier 11 with the standard weight. The maximum number of packs is the number of packs that can be produced from the maximum workpiece, i.e., the number of pack areas PA.

[0055] A weight range is then calculated and subdivided into a multitude of sub-ranges (S212). The weight range is calculated by calculation part 120, and the weight range is subdivided into sub-ranges by calculation part 120. The weight range is a numerical range from the minimum workpiece weight to the maximum workpiece weight, and the sub-ranges are numerical ranges obtained by dividing the weight range by the maximum number of packages.

[0056] Next, the weight of workpiece 10 is measured (S213), and the resin feed rate R is calculated based on the sub-area to which the weight of workpiece 10 belongs (S214). Workpiece 10 is measured by measuring unit 110, and the resin feed rate R is calculated by calculation unit 120. For example, calculation unit 120 records the resin feed rate R corresponding to each sub-area, determines which sub-area the weight of workpiece 10 belongs to, and reads the recorded resin feed rate R. Therefore, highly accurate measurement and calculation are not required, which improves the speed of calculating the resin feed rate R.

[0057] Modified examples of the compression molding device are described below. It should be noted that the similarities with the embodiment described above also apply to the following modified examples, and therefore their description is omitted; only the differences are described. In particular, the same configurations are designated with the same reference numerals, and the same configurations and the same resulting effects are not mentioned sequentially.

[0058] The configuration of a compression molding device 2 according to a modified example is described with reference to Fig. 8 described. Fig. Figure 8 is a diagram that schematically shows the configuration of the compression molding device according to the first modified example. In this modified example, the measuring part 110 measures the weight of the workpiece 10, with the components 12 pointing downwards (towards the side of the measuring part 110). The workpiece 10 is supported by the carrier 11 at its outer edge, and the components 12 are not in contact with the measuring part 110, etc. The workpiece 10 is transported in this orientation and placed onto the upper tool 192 of the mold 190.

[0059] The configuration of a compression molding device 3 according to a modified example is described with reference to Fig. 9 described. Fig. Figure 9 is a diagram that schematically shows the configuration of the compression molding device according to the second modified example. In this modified example, the mold tool 190 has an upper mold cavity structure in which the upper tool 192 has the cavity 199. The workpiece 10, measured by the measuring part 110, is transported to the platform 140. The workpiece 10, supplied with resin R, is placed on the lower tool 191 from the platform 140, and the release film RF is placed on the upper tool 192.

[0060] Next, an example of a method for calculating the resin feed rate according to one embodiment will be given with reference to Fig. 10 and Fig. 11 described. Fig. 10 and Fig. Figure 11 are flowcharts that show part of the procedure for calculating the amount of resin supplied. Fig. 10 is a flowchart showing a testing phase, and Fig. Figure 11 is a flowchart showing a production phase. Unless otherwise specified, the following description describes how the calculation is performed in calculation section 120.

[0061] First, the weights and volumes of a first and a second test workpiece are measured (S311). The test workpiece is a workpiece used for trial production to determine the manufacturing conditions for actual production. The first and second test workpieces are workpieces on which a different number of sets of mounted items are mounted on the reference carriers. Preferably, the first and second test workpieces are selected from workpieces on which none of the mounted components 12 are missing, but some of the components 12 may be missing. It is desirable that the number of sets of mounted items on the first and second test workpieces differs significantly. Preferably, the first test workpiece is the minimum workpiece on which no mounted item is mounted (i.e.,the reference carrier), and the second test workpiece is the maximum workpiece with all objects mounted on it.

[0062] The weight of the first test piece is Ww1, the weight of the second test piece is Ww2, the volume of the first test piece is Vw1, and the volume of the second test piece is Vw2. The weight Ww1 of the first test piece and the weight Ww2 of the second test piece are measured by measuring part 110. Furthermore, the volume Vw1 of the first test piece and the volume Vw2 of the second test piece are measured directly by the volume measuring part. The volume Vw1 of the first test piece and the volume Vw2 of the second test piece can be calculated based on the thickness of the first test piece and the thickness of the second test piece, which are measured by the thickness measuring part 150.

[0063] The specific gravity of the assembled items is then calculated based on the weight difference and the volume difference of the test specimen (S312). The weight difference of the test specimen is the difference between the weight of the first test specimen and the weight of the second test specimen, and the volume difference of the test specimen is the difference between the volume of the first test specimen and the volume of the second test specimen. The specific gravity of the assembled items is the combined specific gravity of a multitude of components and a multitude of fasteners connecting the components to the support; that is, the specific gravity of the portion of the section excluding the support.

[0064] The weight difference of the test specimen is ΔWw21, the volume difference of the test specimen is ΔVw21, and the specific gravity of the assembled items is dm. ΔWw21 is calculated using the following equation: ΔWw21 = Ww2 - Ww1. ΔVw21 is calculated using the following equation: ΔVw21 = Vw2 - Vw1. dm is calculated using the following equation: dm = ΔWw21 / ΔVw21.

[0065] Next, the weight and volume of a first sample assembly pack or a second sample assembly pack are measured (S313). The first sample assembly pack is a post-molding workpiece formed by molding a predetermined feed quantity of resin onto the first sample workpiece and is an arrangement of a plurality of packs produced based on the first sample workpiece. The second sample assembly pack is a post-molding workpiece formed by molding a predetermined feed quantity of resin onto the second sample workpiece and is an arrangement of a plurality of packs produced based on the second sample workpiece.

[0066] The weight of the first sample assembly pack is Wp1, the weight of the second sample assembly pack is Wp2, the volume of the first sample assembly pack is Vp1, and the volume of the second sample assembly pack is Vp2. The weight Wp1 of the first sample assembly pack and the weight Wp2 of the second sample assembly pack are measured using measuring part 110. Furthermore, the volume Vp1 of the first sample assembly pack and the volume Vp2 of the second sample assembly pack can be measured directly using the volume measuring part or calculated based on the thickness of the first sample assembly pack and the thickness of the second sample assembly pack, respectively, as measured by the thickness measuring part 150. The weights Wp1 and Wp2 and the volumes Vp1 and Vp2 of both the first and second sample assembly packs can be measured.

[0067] The weight of the resin added to the first test piece to produce the first sample assembly pack, before molding, is Wr1. The weight of the resin added to the second test piece to produce the second sample assembly pack, before molding, is Wr2. The weights Wr1 and Wr2 of the resin can be measured values ​​obtained after addition or target values ​​determined before addition.

[0068] The specific gravity of the resin after molding is then calculated based on the weight and volume differences between the test specimen and the sample assembly pack (S314). The weight difference between the test specimen and the sample assembly pack is the difference between the weight of the test specimen before the resin is added and the weight of the test specimen after the resin has been molded, and corresponds to the weight of the resin after molding in the sample assembly pack. The same applies to the volume difference between the test specimen and the sample assembly pack, which corresponds to the volume of the resin after molding in the sample assembly pack. The specific gravity of the resin after molding is the specific gravity of the resin after molding in the sample assembly pack.

[0069] The weight difference between the first test piece and the first sample assembly is ΔWpw1, the volume difference between the first test piece and the first sample assembly is ΔVpw1, the weight difference between the second test piece and the second sample assembly is ΔWpw2, the volume difference between the second test piece and the second sample assembly is ΔVpw2, and the specific gravity of the resin after molding is dr. ΔWpw1 is calculated using the following equation: ΔWpw1 = Wp1 - Ww1. ΔVpw1 is calculated using the following equation: ΔVpw1 = Vp1 - Vw1. ΔWpw2 is calculated using the following equation: ΔWpw2 = Wp2 - Ww2. ΔVpw2 is calculated using the following equation: ΔVpw2 = Vp2 - Vw2.

[0070] When the weight and volume of the first sample assembly pack are measured in step S313, the weight and volume differences calculated in step S314 are ΔWpw1 and ΔVpw1, respectively, and dr is calculated using the following equation: V = ΔWpw1 / ΔVpw1. When the weight and volume of the second sample assembly pack are measured in step S313, the weight and volume differences calculated in step S314 are ΔWpw2 and ΔVpw2, respectively, and dr is calculated using the following equation: dr = ΔWpw2 / ΔVpw2.

[0071] If the weights and volumes of both the first and second sample packs are measured in step S313, the specific gravity of the resin after shaping can be the average of the specific gravity calculated based on the weight and volume of the first sample pack and the specific gravity calculated based on the weight and volume of the second sample pack. At this point, dr is calculated by the following equation: dr = {(ΔWpw1 / ΔVpw1) + (ΔWpw2 / ΔVpw2)} / 2.

[0072] The rate of weight change of the resin before and after molding is then calculated based on the weight difference between the test specimen and the sample assembly packing (S315). The rate of weight change of the resin before and after molding is the ratio between the weight of the resin after molding and the weight of the resin before molding.

[0073] The rate of weight change of the resin before and after molding is α. If the weight and volume of the first sample assembly pack are measured in step S313, α is calculated using the following equation: α = ΔWpw1 / Wr1. If the weight and volume of the second sample assembly pack are measured in step S313, α is calculated using the following equation: α = ΔWpw2 / Wr2.

[0074] If, in step S313, the weights and volumes of both the first and second sample assembly packs are measured, the rate of weight change of the resin before and after forming can be the average of the rate of weight change of the resin fed to the first sample and the rate of weight change of the resin fed to the second sample. At this point, α is calculated by the following equation: α = {(ΔWpw1 / Wr1) + (ΔWpw2 / Wr2)} / 2.

[0075] The weight of workpiece 10 and the thickness of support 11 are then measured (S321). The weight of workpiece 10 is Ww and the thickness of support 11 is Tc. The weight Ww of workpiece 10 is measured with measuring part 110 and the thickness Tc of support 11 with thickness measuring part 150.

[0076] Here, the weight of beam 11 is calculated based on its thickness Tc. If the weight of beam 11 is Wc, the area of ​​beam 11 is Sc, and the specific gravity of beam 11 is dc, then Wc is calculated using the following equation: Wc = Tc × Sc × dc. The area Sc and the specific gravity dc of beam 11 are recorded as target values ​​in calculation section 120. The area Sc of beam 11 can be a measured value.

[0077] The total weight of the assembled items is then calculated based on the weight of workpiece 10 (S322). The total weight of the assembled items is the sum of the total weight of all components 12 mounted on workpiece 10 and the total weight of all fasteners connecting all components 12 to the support 11. In other words, the total weight is the weight of the section of workpiece 10 excluding the support 11. If a component 12 is missing, or if the number of components 12 and the number of fasteners do not match, the total weight of the assembled items calculated in step S322 may be a number that is not an integer multiple of the weight of the assembled items per set.

[0078] If the total weight of the mounted items is Wm, then Wm is calculated according to the following equation: Wm=Ww-Wc.

[0079] The total volume of the assembled items is then calculated from their total weight based on their specific gravity (S323). The total volume of the assembled items is the sum of the total volume of all components 12 mounted on workpiece 10 and the total volume of all fasteners connecting all components 12 to the support 11. In other words, the total volume is the volume of the section of workpiece 10 excluding the support 11. Similar to the total weight of the assembled items, the total volume of the assembled items can also be calculated as a number that is not an integer multiple of the volume of the assembled items per set.

[0080] If the total volume of the assembled items is Vm, then Vm is calculated using the following equation: Vm=Wm×dm.

[0081] The volume of resin after molding is then calculated based on the total volume of the assembled items (S324). The volume of resin after molding is the volume of resin after molding in the assembly pack and is the volume of the section of the assembly pack excluding workpiece 10.

[0082] The volume of cavity 199 is Vcv, and the volume of the resin after molding is Vrc. Vrc is calculated using the following equation: Vrc = Vcv - Vm. The volume Vcv of cavity 199 is designed in advance according to the target dimensions of the assembly package and recorded as the target value in calculation section 120.

[0083] The weight of the resin after molding is then calculated from its volume based on the specific gravity of the resin after molding (S325). The weight of the resin after molding is the weight of the resin after molding in the assembly package and is the weight of the assembly package excluding workpiece 10.

[0084] If the weight of the resin after molding is Wrc, then Wrc is calculated using the following equation: Wrc=Vrc×dr.

[0085] The weight of the resin before molding is then calculated from the weight of the resin after molding, based on the rate of weight change of the resin before and after molding (S326). The calculated weight of the resin before molding is treated as an appropriate amount of resin to feed into workpiece 10.

[0086] If the weight of the resin before molding is Wr, then Wr is calculated using the following equation: Wr=(1 / α)×Wrc.

[0087] In this embodiment, the total weight of the assembled items is calculated based on the weight of the workpiece, the total volume of the assembled items is calculated from their total weight based on their specific gravity, and the resin feed rate is calculated based on their total volume. The specific gravity of the assembled items is calculated by dividing the weight difference between the first and second test workpieces by the volume difference between the first and second test workpieces.

[0088] Accordingly, it is possible to calculate the resin feed rate not only by considering the quantity of components but also the quantity of fasteners. This improves the accuracy of the resin feed rate calculation, preventing defective products due to an excess or deficiency of resin.

[0089] Furthermore, in this embodiment, the minimum workpiece without any mounted object on the reference carrier can be the first test workpiece and the maximum workpiece with all mounted objects on the reference carrier can be the second test workpiece.

[0090] Accordingly, the weight difference and the volume difference between the first and second test specimens are increased, which improves the accuracy in calculating the specific weight of a large number of assembled items.

[0091] Furthermore, in this embodiment, the weight of the mounted items is calculated by subtracting the weight of the support, which is calculated based on the thickness of the support, from the weight of the workpiece.

[0092] Accordingly, calculation errors in the resin supply quantity caused by a variation in the thickness of the support can be reduced.

[0093] The total weight of the assembled items can also be calculated by subtracting the weight of the reference support from the weight of the workpiece. In this case, the weight of the reference support is registered as the target value in the calculation section, thus eliminating the need to measure the thickness of the support in the measuring section of step S321, which simplifies the manufacturing process.

[0094] Furthermore, in this embodiment, the volumes of the first and second test pieces are measured directly by the volume measuring unit, and the volume difference between the volume of the first test piece and the volume of the second test piece is calculated based on the measurement result in the volume measuring unit.

[0095] Accordingly, the configuration of this embodiment reduces the time required to calculate the specific gravity of the mounted items compared to a configuration where the volumes of the first and second test pieces are calculated based on the thickness measured with the thickness gauge.

[0096] Furthermore, in this embodiment, the weight of the resin before molding is calculated as a suitable supply quantity of resin for the workpiece from the weight of the resin after molding, based on the rate of weight change of the resin before and after molding.

[0097] Accordingly, calculation errors in the resin feed rate caused by a change in the weight of the resin before and after molding can be reduced.

[0098] However, the weight of the resin after molding can be calculated based on the volume of the resin after molding as an appropriate supply of resin for the workpiece.

[0099] Accordingly, steps S315 and S326 can be omitted to simplify the manufacturing process.

[0100] Although the manufacturing conditions (specific gravity of a large number of assembled items, specific gravity of the resin after molding, rate of weight change of the resin before and after molding, etc.) are calculated in this embodiment based on two test pieces, the manufacturing conditions can be calculated based on three or more test pieces. Increasing the number of test pieces can improve the accuracy of the manufacturing conditions.

[0101] The following is an example of a method for calculating the resin feed rate according to one embodiment, with reference to Fig. 12 and Fig. 13 described. Fig. 12 and Fig. Figure 13 are flowcharts that show part of the procedure for calculating the amount of resin to be supplied. Fig. 12 is a flowchart showing the testing phase, and Fig. Figure 13 is a flowchart showing the production phase. The following description omits details of the steps, which are similar to those described in reference to... Fig. 10 and Fig. 11 were described.

[0102] First, the weights of a third and a fourth test workpiece are measured (S411). The third and fourth test workpieces are workpieces with a different number of sets of mounted items attached to the reference carrier. The third and fourth test workpieces are selected accordingly from workpieces in which none of the mounted components 12 are missing. Therefore, the number of mounted components 12 and the number of sets of mounted items are the same in the third and fourth test workpieces. It is desirable that the number of sets of mounted items in the third test workpiece and the number of sets of mounted items in the fourth test workpiece differ significantly from each other. Preferably, the third test workpiece is the smallest workpiece on which no mounted item is attached (i.e.,the reference carrier), and the fourth test workpiece is the maximum workpiece on which all mounted items are mounted.

[0103] The weight of the third test piece is Ww3, and the weight of the fourth test piece is Ww4. The weight Ww3 of the third test piece and the weight Ww4 of the fourth test piece are measured by measuring part 110. The number of sets of assembled items mounted on the third test piece is Nw3, and the number of sets of assembled items mounted on the fourth test piece is Nw4. The number Nw3 and Nw4 of sets of assembled items mounted on the third and fourth test pieces, for example, are proportional to the number of components 12 counted by the thickness measurement and image analysis performed on the third and fourth test pieces, but Nw3 and Nw4 can be predetermined target values ​​recorded in calculation part 120.One of the numbers Nw3 and Nw4 of sets of assembled items mounted on the third and fourth test pieces can be zero.

[0104] The thicknesses, top surface areas, and weights of the third through sixth sample assembly packs are then measured (S412). The third sample assembly pack is a post-molding workpiece formed by molding an initial feed of resin onto the third sample workpiece and is an arrangement of multiple packs produced based on the third sample workpiece. The fourth sample assembly pack is a post-molding workpiece formed by molding the initial feed of resin onto the fourth sample workpiece and is an arrangement of multiple packs produced based on the fourth sample workpiece. The fifth sample assembly pack is a post-molding workpiece formed by molding a second feed of resin onto the third sample workpiece and is an arrangement of multiple packs produced based on the third sample workpiece.The sixth sample assembly pack is a workpiece formed after molding by molding the second feed quantity of resin onto the fourth sample workpiece, and is an arrangement of a plurality of packs produced based on the fourth sample workpiece. The first sample assembly pack and second sample assembly pack described in the claims of the present application are, for example, the third and fourth sample assembly packs.

[0105] The weight of the first resin feed before molding is Wra, and the weight of the second resin feed before molding is Wrb. The weight Wra of the first resin feed before molding and the weight Wrb of the second resin feed before molding can be measured values ​​obtained from measuring part 110, e.g., after feeding and before molding, or they can be target values ​​determined before feeding.

[0106] The thickness of the sample pack is the average thickness of the section where the top surface is flat, assuming the support side of the sample pack is the bottom surface and the resin side is the top surface. The top surface of the sample pack is the area of ​​the section where the top surface is flat. However, the thickness of the sample pack can also be the maximum or minimum thickness of the section where the top surface is flat, or the thickness at a specific location, such as the center.

[0107] The thickness of the third sample assembly pack is Tp3, the thickness of the fourth sample assembly pack is Tp4, the thickness of the fifth sample assembly pack is Tp5, and the thickness of the sixth sample assembly pack is Tp6. The thicknesses Tp3 to Tp6 of the third to sixth sample assembly packs are measured using the thickness measuring part 150. If at least three of the thicknesses Tp3 to Tp6 of the third to sixth sample assembly packs are measured, the measurement for the remaining pack can be omitted. If the top surface area Sp is , the top surface area Sp can be obtained by measuring the top surface of any third to sixth sample assembly pack, or the top surfaces of two or more third to sixth sample assembly packs can be measured to calculate an average. The top surface area Sp can be the area of ​​the flat bottom surface of the cavity 199, which is recorded as the setpoint in the calculation part 120.The weight of the third sample assembly pack is Wp3, the weight of the fourth sample assembly pack is Wp4, the weight of the fifth sample assembly pack is Wp5, and the weight of the sixth sample assembly pack is Wp6. The weights Wp3 to Wp6 of the third to sixth sample assembly packs are measured, for example, with measuring part 110. If at least one of the weights Wp3 to Wp6 of the third to sixth sample assembly packs is measured, the measurement for the remaining three can be omitted.

[0108] Next, the volume of assembled items per set is calculated based on the first thickness difference and the difference in the number of sets of assembled items (S413). The first thickness difference is a thickness difference that occurs when the same feed quantity of resin is molded onto two workpieces with a different number of sets of assembled items, and it correlates with the difference in the number of sets of assembled items. The difference in the number of sets of assembled items is the difference between the number Nw3 of sets of assembled items mounted on the third sample workpiece and the number Nw4 of sets of assembled items mounted on the third sample workpiece.The volume of the assembled items per set is the sum of the volume of a component 12 that is not missing and is assembled in a packing area, and the volume of a connecting element that is not missing and connects the component 12 to the carrier 11.

[0109] The first thickness difference is ΔT1, the difference in the number of sets of assembled items is ΔNw43, and the volume of assembled items per set is Vs.

[0110] If the measurement of thickness Tp5 of the fifth sample assembly pack or thickness Tp6 of the sixth sample assembly pack is omitted in step S412, the first thickness difference ΔT1 is the difference between thickness Tp4 of the fourth sample assembly pack and thickness Tp3 of the third sample assembly pack. At this point, ΔT1 is calculated using the following equation: ΔT1 = |Tp4 - Tp3|. If the measurement of thickness Tp3 of the third sample assembly pack or thickness Tp4 of the fourth sample assembly pack is omitted in step S412, the first thickness difference ΔT1 is the difference between thickness Tp6 of the sixth sample assembly pack and thickness Tp5 of the fifth sample assembly pack. At this point, ΔT1 is calculated using the following equation: ΔT1 = |Tp6 - Tp5|.If, in step S412, all thicknesses Tp3 to Tp6 of the third to sixth sample assembly packings are measured, the first thickness difference ΔT1 can be the average of the thickness difference between the fourth and third sample assembly packings and the thickness difference between the sixth and fifth sample assembly packings. At this point, ΔT1 is calculated according to the following equation: ΔT1 = (|Tp4 - Tp3| + |Tp6 - Tp5|) / 2.

[0111] ΔNw43 is calculated using the following equation: ΔNw43 = |Nw4 - Nw3|. For example, if the third test piece is the smallest piece (Nw = 0), the number of sets of assembled items mounted on the fourth test piece is the difference in the number of sets (ΔNw43 = Nw4). Since the third and fourth test pieces are selected from pieces where none of the assembled components are missing, Nw3 and Nw4 are 0 or positive integers, and ΔNw43 is a positive integer.

[0112] Vs is calculated according to the following equation: Vs=(ΔT1×Sp) / ΔNw43.

[0113] The weight of the assembled items per set is then calculated based on the weight difference between the test pieces and the difference in the number of sets of assembled items (S414). The weight difference between the test pieces is the difference between the weight Ww4 of the fourth test piece and the weight Ww3 of the third test piece and corresponds to the total weight of the assembled items of the difference ΔNw43 in the number of sets. The weight of the assembled items per set is the sum of the weight of a component 12 that is present and assembled in a packing area and the weight of a connecting element that is present and connects the component 12 to the carrier 11.

[0114] The weight difference between the test pieces is ΔWw43, and the weight of the assembled items per set is Ws. ΔWw43 is calculated using the following equation: ΔWw43 = |Ww4 - Ww3|. Ws is calculated using the following equation: Ws = ΔWw43 / ΔNw43.

[0115] The estimated specific gravity of the resin is then calculated based on the second thickness difference and the feed rate difference (S415). The second thickness difference is a difference in thickness that occurs when two workpieces with the same number of mounted items are fed different feed rates of resin and correlates with the volume of resin after molding. The feed rate difference is the difference between the weight Wra of the first feed rate of resin before molding and the weight Wrb of the second feed rate of resin before molding. The estimated specific gravity of the resin is the specific gravity of the resin calculated assuming that the weight of the resin before and after molding is essentially constant.

[0116] The second thickness difference is ΔT2, the difference in the feed rate is ΔWr, and the estimated specific gravity of the resin is drx.

[0117] If the measurement of thickness Tp4 of the fourth sample assembly pack or thickness Tp6 of the sixth sample assembly pack is omitted in step S412, the second thickness difference ΔT2 is the difference between thickness Tp5 of the fifth sample assembly pack and thickness Tp3 of the third sample assembly pack. At this point, ΔT2 is calculated using the following equation: ΔT2 = |Tp5 - Tp3|. If the measurement of thickness Tp3 of the third sample assembly pack or thickness Tp5 of the fifth sample assembly pack is omitted in step S412, the second thickness difference ΔT2 is the difference between thickness Tp6 of the sixth sample assembly pack and thickness Tp4 of the fourth sample assembly pack. At this point, ΔT2 is calculated using the following equation: ΔT2 = |Tp6 - Tp4|.If, in step S412, all thicknesses Tp3 to Tp6 of the third to sixth sample assembly packs are measured, the second thickness difference ΔT2 can be the average of the thickness difference between the fifth sample assembly and the third sample assembly and the thickness difference between the sixth sample assembly and the fourth sample assembly pack. At this point, ΔT2 is calculated according to the following equation: ΔT2 = (|Tp5 - Tp3| + |Tp6 - Tp4|) / 2.

[0118] ΔWr is calculated according to the following equation: ΔWr=|Wrb-Wra|.

[0119] drx is calculated according to the following equation: drx=ΔWr / (ΔT2×Sp).

[0120] The maximum weight of the resin is then calculated based on the estimated specific gravity of the resin (S416). The maximum weight of the resin is the weight of resin required to produce an array pack with the target dimensions for the minimum workpiece without a component mounted on it (i.e., the reference support).

[0121] The maximum weight of the resin is Wrm, and the target thickness of the array pack, which is recorded as the setpoint in calculation part 120, is Tpt. If the third specimen is a reference support, the maximum weight Wrm of the resin can be determined by correcting the weight difference between the weight of the sample array pack produced from the third specimen and the target weight of the sample array pack with respect to the weight of the resin supplied to the third specimen. At this point, Wrm is calculated according to the following equation: Wrm = Wra - {(Tp3 - Tpt) × Sp / drx} or according to the following equation: Wrm=Wrb−{(Tp5−Tpt)×Sp / drx}.

[0122] If the thickness of the reference beam is registered as a target value in calculation part 120 and the thickness of the reference beam is Tcs, then Wrm can also be calculated using the following equation: Wrm = (Tpt - Tcs) × Sp / drx. Furthermore, in the equations above for calculating Wrm, a measurement obtained by measuring the thickness of the beam in the third or fourth test specimen can be used instead of Tcs, which is a target value for the thickness of the reference beam.

[0123] Next, the weight of workpiece 10 and the thickness of support 11 are measured (S421). The weight of workpiece 10 is Ww and the thickness of support 11 is Tc. Furthermore, the weight Wc of support 11 is calculated from its thickness Tc.

[0124] The total weight of the assembled items is then calculated based on the weight of the workpiece (S422). The total weight of the assembled items is Wm.

[0125] Next, the number of sets of assembled items is calculated from the total weight of the assembled items based on the weight of the assembled items per set (S423). The number of sets of assembled items is the total number of sets of assembled items mounted on workpiece 10. If a part of component 12 is missing, or if the number of components 12 and the number of fasteners do not match, the number of sets of assembled items can be calculated as a non-integer.

[0126] If the number of sets of assembled items is Nm, then Nm is calculated using the following equation: Nm=Wm / Ws.

[0127] The total volume of the assembled items is then calculated from the number of sets of assembled items based on the weight of the assembled items per set (S424).

[0128] If the total volume of the assembled items is Vm, then Vm is calculated using the following equation: Vm=Nm×Vs.

[0129] Next, a resin-equivalent weight of the assembled items is calculated from the total volume of the assembled items, based on the estimated specific gravity of the resin (S425). The resin-equivalent weight of the assembled items is the weight if the assembled items in workpiece 10 were replaced by molded resin. In other words, the resin-equivalent weight is the weight of the resin after molding that has the same volume as the total volume of the assembled items.

[0130] If the resin-equivalent weight of the assembled items is Wrx, then Wrx is calculated according to the following equation: Wrx=Vm×drx.

[0131] The weight of the resin after molding is then calculated based on the maximum weight of the resin after molding and the resin-equivalent weight of the assembled items (S426).

[0132] If the weight of the resin after molding is Wrc, then Wrc is calculated using the following equation: Wrc = Wrm - Wrx. The calculated weight Wrc of the resin after molding is treated as an appropriate amount of resin to be applied to workpiece 10.

[0133] In this embodiment, the total weight of the assembled items is calculated based on the weight of the workpiece, the number of sets of assembled items is calculated from the total weight of the assembled items based on the weight of the assembled items per set, the total volume of the assembled items is calculated from the number of sets of assembled items based on the volume of the assembled items per set, and the resin feed rate is calculated based on the total volume of the assembled items.The volume of the assembled items per set is calculated, for example, by multiplying the thickness difference between the thickness of the third sample assembly pack and the thickness of the fourth sample assembly pack by the upper surface area of ​​the third or fourth sample assembly pack, and dividing the product by the difference in the number of sets between the number of sets of assembled items in the third sample and the number of sets of assembled items in the fourth sample. The weight of the assembled items per set is calculated, for example, by dividing the weight difference between the weight of the third sample and the weight of the fourth sample by the difference in the number of sets between the number of sets of assembled items in the third sample and the number of sets of assembled items in the fourth sample.

[0134] Accordingly, it is possible to calculate the resin feed rate not only by considering the quantity of components but also the quantity of fasteners. This improves the accuracy of the resin feed rate calculation, preventing defective products due to an excess or deficiency of resin.

[0135] Furthermore, in this embodiment, the minimum workpiece, in which no mounted object is attached to the reference carrier, can be the third test workpiece, and the maximum workpiece with all mounted objects on the reference carrier can be the fourth test workpiece.

[0136] Accordingly, the thickness difference between the third and fourth sample assembly packs and the difference in the number of assembled items between the third and fourth sample workpieces are increased, which improves the accuracy in calculating the volume of assembled items per pack. Additionally, the weight difference between the third and fourth sample workpieces is also increased to improve the accuracy in calculating the weight of assembled items per pack.

[0137] Furthermore, in this embodiment, the weight of the mounted items is calculated by subtracting the weight of the support, which is calculated based on the thickness of the support, from the weight of the workpiece.

[0138] Accordingly, calculation errors in the amount of resin supplied, caused by a variation in the thickness of the support, can be reduced.

[0139] However, the weight of the assembled items can be calculated by subtracting the weight of the reference support from the weight of the workpiece. In this case, the weight of the reference support is registered as the target value in the calculation section, thus eliminating the need to measure the thickness of the support in the measuring section of step S321, which simplifies the manufacturing process.

[0140] Furthermore, in this embodiment, the estimated specific gravity of the resin is calculated by dividing the weight of the resin before molding by the volume of the resin after molding, the maximum weight of the resin is calculated based on the estimated specific gravity of the resin, and the weight of the resin after molding is calculated based on the maximum weight of the resin.

[0141] However, the procedure for calculating the maximum weight Wrm of the resin is not limited to the above specifications. For example, Wrm can be calculated using the following equation: Wrm = Wrb - {(Tp5 - Tpt)×Sp / drc}, where drc is the specific gravity of the resin after molding. If the weight difference between the weight Wp5 of the fifth sample pack and the weight Wp3 of the third sample pack is ΔWp53, then drc is calculated using the following equation: drc = ΔWp53 / (ΔT2×Sp).

[0142] The maximum weight Wrm of the resin can be calculated by multiplying the capacity of the cavity 199, which is entered as a design value in the calculation part 120, by the estimated specific gravity of the resin or the specific gravity of the molding resin.

[0143] Furthermore, in this embodiment, the weight of the resin after molding is calculated as an appropriate supply quantity of resin for the workpiece.

[0144] However, it is also possible to calculate the rate of weight change of the resin before and after molding, and to calculate the weight of the resin before molding from the weight Wrc of the resin after molding, and to treat this as an appropriate feed rate of resin for the workpiece. For example, the rate of weight change of the resin before and after molding is calculated by dividing the weight difference between the weight Wp5 of the fifth sample pack and the weight Wp3 of the third sample pack by the weight difference between the weight of the second feed rate of resin and the weight of the first feed rate of resin.

[0145] As described above, one aspect of the present invention can provide a compression molding device capable of improving the accuracy of resin supply.

[0146] The embodiments described above are intended to facilitate understanding of the present invention and are not meant to limit or define it. Each element included in the embodiment, as well as its arrangement, material, conditions, shape, size, etc., are not limited to the embodiments shown and can be modified as needed. Furthermore, it is possible to partially replace or combine the configurations shown in different embodiments. Reference symbol list 1... Forming press device 10... workpiece 11... Carriers 12... Component 100... Resin feed device 110... Measuring part 120... Calculation section 130... Feed section 140... platform 150... Thickness measuring part 160... Imaging section 180... Reversing part 190... Forming tool 191... lower tool 192... upper tool 199... cavity< / formpressvorrichtung>

Claims

[1] Compression molding device (1) for molding resin (R) onto a workpiece (10), wherein a plurality of components (12) are mounted on a carrier (11) via a plurality of connecting elements and a plurality of packings are produced, each of which has at least one of the components (12) sealed with resin (R), wherein the compression molding device (1) comprises: a measuring part (110) that measures the weight of the workpiece (10); a calculation part (120) that calculates a supply quantity of resin (R) based on the weight of the workpiece (10), measured by the measuring part (110); a feed part (130) that feeds the resin (R) in the feed quantity calculated by the calculation part (120); a volume measuring element that measures a volume of the workpiece (10); and a forming tool (190) that presses the resin (R), supplied by the feed part, onto the workpiece (10), wherein the calculation part (120) calculates a total volume of a plurality of assembled items comprising the plurality of components (12) and the plurality of connecting elements, based on the weight of the workpiece (10), and the resin feed rate (R) is calculated based on the total volume of the multitude of mounted items, wherein the calculation part (120) calculates a total weight of the multitude of assembled items based on the weight of the workpiece (10), and the total volume of the multitude of assembled items calculated from the total weight of the multitude of assembled items based on a specific gravity of the multitude of assembled items, wherein the measuring part (110) measures a weight of a first test piece, wherein a first number of sets of mounted items are mounted on a reference carrier, and a weight of a second test piece, wherein a second number of sets of mounted items are mounted on the reference carrier, the second number of sets being different from the first number of sets, and wherein the volume measuring part measures a volume of the first test piece and a volume of the second test piece, and the calculation part (120) calculates the specific gravity of the multitude of assembled objects by dividing a weight difference between the weight of the first test piece and the weight of the second test piece by a volume difference between a volume of the first test piece and a volume of the second test piece. [2] Molding device (1) according to claim 1, wherein the calculating part (120) calculates the weight of the plurality of mounted items by subtracting a weight of the reference carrier from the weight of the workpiece (10). [3] Molding press device (1) according to claim 1, further comprising a thickness measuring element (150) that measures the thickness of the reference carrier, wherein the calculation part (120) calculates a weight of the support based on the thickness of the reference support and calculates the weight of the plurality of mounted items by subtracting the weight of the reference support from the weight of the workpiece (10). [4] Molding device (1) according to claim 1, wherein the calculating part (120) calculates a resin volume after molding required to form the plurality of packs with a desired thickness, based on the total volume of the plurality of assembled items, and calculates a weight of resin after molding as the quantity of resin supplied, based on the resin volume after molding. [5] Molding device (1) according to claim 1, wherein the calculating part (120) calculates a resin volume after molding that is required to form the plurality of packs with a desired thickness, based on the total volume of the plurality of assembled items, a weight of the resin after molding, calculated based on the resin volume after molding and The weight of the resin before molding is calculated from the weight of the resin after molding as the amount of resin supplied, based on a rate of change of weight of the resin before and after molding. [6] Compression molding device (1) for compression molding resin (R) onto a workpiece (10), wherein a plurality of components (12) are mounted on a carrier (11) via a plurality of connecting elements, and for producing a plurality of packings, each having at least one of the components (12) sealed with the resin, wherein the compression molding device (1) comprises: a measuring part (110) that measures the weight of the workpiece (10); a calculation part (120) that calculates a supply quantity of resin based on the weight of the workpiece, measured by the measuring part (110); a feed part (130) that supplies the resin in the feed quantity, calculated by the calculation part (120); a thickness measuring element (150) that measures the thickness of the packaging; and a forming tool (190) that presses the resin, supplied by the feeder (130), into the workpiece (10), wherein the calculation part (120) calculates a total volume of a multitude of assembled items comprising the multitude of components (12) and the multitude of connecting elements, based on the weight of the workpiece (10), and the amount of resin supplied is calculated based on the total volume of the multitude of assembled items, wherein the calculation part (120) calculates a total weight of the multitude of assembled items based on the weight of the workpiece (10), and the total volume of the multitude of assembled items is calculated based on the total weight of the multitude of assembled items, wherein the calculation part (120) calculates the number of sets of the plurality of assembled items from the total weight of the plurality of assembled items based on a weight of assembled items per set, and the total volume of the multitude of assembled items calculated from the number of sets of the multitude of assembled items based on a volume of assembled items per set, wherein the measuring part (110) measures a weight of a third test piece in which a third number of sets of mounted items are mounted on a reference carrier, and a weight of a fourth test piece in which a fourth number of sets of mounted items are mounted on the reference carrier, wherein the thickness measuring element measures a thickness of a first sample assembly pack in which a first feed quantity of resin is formed onto the third sample workpiece, and a thickness of a second sample assembly pack in which the first feed quantity of resin is formed onto the fourth sample workpiece, and the calculation part (120) the volume of the assembled items per set by multiplying a thickness difference between the thickness of the first sample arrangement pack and the thickness of the second sample arrangement pack by a top area of ​​the first sample arrangement pack, or of the second sample arrangement pack, and dividing a obtained product by a difference in the number of sets between the third number of sets and the fourth number of sets, and The weight of the assembled items per set is calculated by dividing the weight difference between the weight of the third test piece and the weight of the fourth test piece by the difference in the number of sets.

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