ELECTRONIC CONTROL DEVICE

Abstract

One objective is to comprehensively implement a noise countermeasure for an electronic component mounted on any one of several printed circuit boards contained in an electronic control device. The electronic control device 100 comprises a first printed circuit board 4 and a second printed circuit board 5 arranged facing each other, with a gap provided between mounting surfaces 4a and 5a of the respective first printed circuit board 4 and second printed circuit board 5, each of which is mounted with an electronic component 8. Furthermore, the electronic control device 100 of the first embodiment comprises: a shielding element 9 arranged in a gap between the first printed circuit board 4 and the second printed circuit board 5, which blocks noise; and conductive elements 10a and 10b connecting the first printed circuit board 4 and the second printed circuit board 5 to the shielding element 9.The shielding element 9 is a frame body that surrounds the entire perimeter of the electronic components 8, each mounted on one of the first circuit board 4 and the second circuit board 5, and forms a closed path having a width equal to the gap.

Description

Technical area

[0001] The present invention relates to an electronic control device. State of the art

[0002] An electronic control device that controls a vehicle includes: a main electronic control device that outputs a control command; and a plurality of sub-electronic control devices, each of which performs engine control, automatic braking control, display control, and the like based on the control command from the main electronic control device. Furthermore, many sensors for detecting external conditions (road conditions, etc.) are mounted on the vehicle. The electronic control device controls the vehicle, while the sub-electronic control devices connected to the main electronic control device process sensor signals.

[0003] The main electronic control device or sub-electronic control devices are equipped with a mechanism that ensures redundancy of each function even if some abnormality occurs, ensuring a basic function in each electronic control device without affecting vehicle driving. In electronic control devices, multifunctionality including redundancy is advanced, and a configuration including multiple circuit boards can be considered. In addition, due to multifunctionality, there is a high possibility that multiple microcomputers and double data rate (DDR) memories with high operating frequencies are used in each circuit board of the electronic control device, and the number of electronic components that generate heat also increases.As a result, noise countermeasures and heat countermeasures are essential in the electronic control device.

[0004] PTL 1 is cited as a prior art document in the present technical field. PTL 1 describes a high-frequency communication device including a high-frequency circuit board and a shield case covering the entire surface of the high-frequency circuit board. Citation listPatent literature

[0005] PTL 1: JP 6012220 B2 Summary of the inventionTechnical problem

[0006] In the high-frequency communication device described in PTL 1, since the shield case covers the entire surface of the high-frequency circuit board, it is possible to take noise countermeasures for electronic components mounted on the high-frequency circuit board, but there is room for improvement in noise countermeasures for electronic components mounted on a control circuit board.

[0007] The present invention has been made in view of the above, and an object of the present invention is to comprehensively take noise countermeasures for an electronic component mounted on any one of a plurality of circuit boards included in an electronic control device. Solution to the problem

[0008] To solve the above problem, an electronic control device according to the present invention comprises: a first circuit board and a second circuit board arranged to face each other, wherein a gap is provided between mounting surfaces of respective ones of the first circuit board and the second circuit board, each mounted with an electronic component; and a shielding member disposed in the gap between the first circuit board and the second circuit board and blocking noise; and a conductive element connecting the first circuit board and the second circuit board to the shielding element, wherein the shielding member is a frame body forming a closed path surrounding an entire periphery of a periphery of the electronic components each mounted on one of the first circuit board and the second circuit board, and having a width corresponding to the gap. Advantageous effects of the invention

[0009] The present invention makes it possible to comprehensively take a noise countermeasure for an electronic component mounted on any one of a plurality of circuit boards included in an electronic control device.

[0010] Problems, configurations, and effects different from those mentioned above will be clarified by the following description of embodiments. Short description of the drawings [ Fig. 1] Fig. 1 is an exploded perspective view of an electronic control device of a first embodiment. [ Fig. 2] Fig. 2 is a cross-sectional view of the Fig. 1 illustrated electronic control device. [ Fig. 3] Fig. 3 is a configuration diagram of a shielding element. [ Fig. 4] Fig. 4 is an exploded perspective view of an electronic control device of a second embodiment. [ Fig. 5] Fig. 5 is a cross-sectional view of the Fig. 4 illustrated electronic control device. [ Fig. 6] Fig. 6 is a configuration diagram of a shielding member, a heat dissipation plate, and a heat sink. Description of embodiments

[0011] Embodiments of the present invention will be described below with reference to the drawings. Note that components designated by the same reference numerals in the embodiments have the same functions in each embodiment, and their descriptions will be omitted unless otherwise specified. [First embodiment]

[0012] With reference to Fig. 1 to Fig. 3, an electronic control device 100 of a first embodiment is described. Fig. 1 is an exploded perspective view of the electronic control device 100 of the first embodiment. Fig. 2 is a cross-sectional view of the Fig. 1 illustrated electronic control device 100. Fig. 3 is a configuration diagram of a shielding element 9.

[0013] The electronic control device 100 is an electronic control device that includes a plurality of circuit boards. The electronic control device 100 may be an electronic control unit (ECU) mounted on a vehicle and controlling the vehicle.

[0014] The electronic control device 100 comprises a housing 1, 2, a first circuit board 4 and a second circuit board 5, electronic components 8, a shielding element 9, conductive elements 10a and 10b and a holder 11.

[0015] The housing 1, 2 accommodates the first circuit board 4, the second circuit board 5, the shielding member 9, and the conductive members 10a and 10b. The housing 1, 2 is formed in a hollow rectangular parallelepiped shape. The housing 1, 2 is made of metal or resin. The housing 1, 2 includes: a housing base 1 forming four wall portions and a ceiling portion of the housing 1, 2; and a housing cover 2 forming a bottom portion of the housing 1, 2. A wall portion of the housing 1, 2, that is, a wall portion of the housing base 1, has an opening 3 through which an external connector 6 to be connected to an external device is exposed. The external connector 6 is mounted on a mounting surface 4a of the first circuit board 4 and is connected to an external device via a wire harness or a cable.

[0016] The first circuit board 4 and the second circuit board 5 are arranged to face each other, with a gap provided between their respective mounting surfaces 4a and 5a mounted with the electronic components 8. The first circuit board 4 and the second circuit board 5 are arranged parallel to each other. The electronic components 8 are semiconductor elements such as a microcomputer, a DDR memory, and the like. A plurality of the electronic components 8 are mounted on the first circuit board 4 and the second circuit board 5, respectively. The first circuit board 4 and the second circuit board 5 are each provided with a ground circuit pattern. As grounds, each of the first circuit board 4 and the second circuit board 5 is provided with a signal ground 12 and a frame ground 13. Alternatively, only the signal ground 12 may be provided on each of the first circuit board 4 and the second circuit board 5.

[0017] The first circuit board 4 and the second circuit board 5 are connected to each other with an inter-board connector 7. The gap between the first circuit board 4 and the second circuit board 5 is maintained by spacers 14. The spacers 14 are each, for example, a highly rigid rod-shaped member, one end of which is fixed to the first circuit board 4 with a bolt or the like, and the other end of which is fixed to the second circuit board 5 with a bolt or the like. The spacers 14 are fixed to the shielding member 9.

[0018] The shielding element 9 is a member disposed in the gap between the first circuit board 4 and the second circuit board 5 and blocks noise. The shielding element 9 is formed of aluminum, copper, carbon fiber, a conductive resin, or a material in which a surface of a non-conductive material is coated with a conductive resin. The shielding element 9 is connected and fixed to the housing 1, 2.

[0019] The shielding member 9 is a frame body that surrounds the entire periphery of the electronic components 8, each mounted on the first circuit board 4 and the second circuit board 5, and forms a closed path having a width corresponding to the gap between the first circuit board 4 and the second circuit board 5. The shielding member 9 surrounds the entire periphery of the electronic components 8, each mounted on the first circuit board 4 and the second circuit board 5, and, in cooperation with the first circuit board 4 and the second circuit board 5, forms a closed space in the gap between the first circuit board 4 and the second circuit board 5. For example, the shielding member 9 may include a plurality of shielding plates. Fig. 1 and Fig. 3 illustrates an example in which the shielding member 9 consists of four shielding plates provided along each side of the rectangular first circuit board 4 and second circuit board 5. One of the shielding plates is a shielding plate extending in a direction in which the first circuit board 4 and the second circuit board 5 are separated from each other or approach each other (the normal direction of the first circuit board 4 or the second circuit board 5) and in a direction along one side of the first circuit board 4 and the second circuit board 5.

[0020] The number of electronic components 8 surrounded by the shielding member 9 is not particularly limited. That is, the shielding member 9 surrounds the entire circumference of a part or all of the electronic components 8 mounted on the first circuit board 4 and surrounds the entire circumference of a part or all of the electronic components 8 mounted on the second circuit board 5.

[0021] The conductive members 10a and 10b are members that connect the first circuit board 4 and the second circuit board 5 to the shielding member 9. The conductive members 10a and 10b can be formed integrally with the shielding member 9 by using the same material as the shielding member 9. The conductive members 10a and 10b include: first conductive members 10a that connect a first end surface 9a of the shielding member 9 on the first circuit board 4 side and the mounting surface 4a of the first circuit board 4; and second conductive members 10b that connect a second end surface 9b of the shielding member 9 on the second circuit board 5 side and the mounting surface 5a of the second circuit board 5.

[0022] The first conductive element 10a is connected to the ground provided on the first circuit board 4. The second conductive element 10b is connected to the ground provided on the second circuit board 5. Specifically, when the signal ground 12 and the frame ground 13 are provided on the first circuit board 4 and the second circuit board 5, respectively, the first conductive element 10a and the second conductive element 10b are respectively connected to the frame ground 13 of the first circuit board 4 and the frame ground 13 of the second circuit board 5. When only the signal ground 12 is provided on the first circuit board 4 and the second circuit board 5, respectively, the first conductive element 10a and the second conductive element 10b are respectively connected to the signal ground 12 of the first circuit board 4 and the signal ground 12 of the second circuit board 5.

[0023] A plurality of first conductive elements 10a are arranged along the first end surface 9a at intervals of less than or equal to one-half of the wavelength λ (i.e., λ / 2) of the electromagnetic wave constituting noise, or at intervals of less than or equal to one-quarter of the wavelength λ (i.e., λ / 4). The plurality of first conductive elements 10a are arranged at equal intervals from each other. A plurality of second conductive elements 10b are arranged along the second end surface 9b at intervals of less than or equal to one-half of the wavelength λ (i.e., λ / 2) of the electromagnetic wave constituting noise, or at intervals of less than or equal to one-quarter of the wavelength λ (i.e., λ / 4). The plurality of second conductive elements 10b are arranged at equal intervals from each other.

[0024] One of the noises formed by electromagnetic waves is the noise (hereinafter also referred to as "irradiation noise") radiated outside the electronic control device 100 and intended to irradiate the electronic components 8, each mounted on the first circuit board 4 and the second circuit board 5. One of the noises formed by electromagnetic waves is the noise (hereinafter also referred to as "radiation noise") radiated inside the electronic components 8, each mounted on the first circuit board 4 and the second circuit board 5, and intended to go outside the electronic control device 100. The wavelength λ of the electromagnetic wave forming noise may be the wavelength of the electromagnetic wave forming the irradiation noise or the wavelength of the electromagnetic wave forming the radiation noise.

[0025] CISPR25 is known as a standard relating to the measurement of electromagnetic interference (EMI) from on-board equipment. The electronic control device 100, which is on-board equipment, implements noise countermeasures in accordance with CISPR25. The frequency range of radiation emission is 0.15 MHz to 2500 MHz. For example, the frequency range of "GLONASS L1" of CISPR25 is 1591 MHz to 1616 MHz, which can be considered a high frequency. The wavelength λ is calculated using the following equation: Wavelength λ [m] = Propagation velocity C0 [m] 2 / s] / Frequency [Hz]

[0026] From the above equation, the wavelength λ of 1616 MHz, which is the maximum value of the frequency range of "GLONASS L1" of CISPR25, is 185.5 [mm]. Therefore, in a case where it is desired to block the radiation noise of 1616 MHz, the distance between the plurality of first conductive elements 10a and the distance between the plurality of second conductive elements 10b are set to, for example, λ / 4 = 46 [mm] or less in the electronic control device 100. As a result, the electronic control device 100 can reliably attenuate the radiation noise that is to pass between the first circuit board 4 and the shielding member 9.

[0027] A bracket 11 attaches the electronic control device 100 to a vehicle body. The bracket 11 connects the housing 1, 2 to a frame ground of the vehicle body. The bracket 11 is formed from aluminum, copper, carbon fiber, a conductive resin, or a material in which a surface of a non-conductive material is coated with a conductive resin. The bracket 11 is connected to the housing 1, 2. The bracket 11 is connected to the shielding member 9. For example, the bracket 11 can be connected to the shielding member 9 through a wall portion of the housing base 1 in which the opening 3 is not formed.

[0028] As described above, the electronic control device 100 of the first embodiment includes: the first circuit board 4 and the second circuit board 5 arranged to face each other, with a gap provided between the mounting surfaces 4a and 5a of the first circuit board 4 and the second circuit board 5, respectively, mounted with the electronic component 8; the shielding member 9 arranged in the gap between the first circuit board 4 and the second circuit board 5 and blocking noise; and the conductive members 10a and 10b connecting the first circuit board 4 and the second circuit board 5 to the shielding member 9. The shielding member 9 is a frame body that surrounds the entire periphery of the electronic components 8, respectively mounted on the first circuit board 4 and the second circuit board 5, and forms a closed path having a width corresponding to the gap.

[0029] As a result, the shielding member 9 can block or attenuate the radiation noise radiated outside the electronic control device 100 and intended to radiate the electronic components 8 mounted on the first circuit board 4 and the second circuit board 5, respectively. The shielding member 9 can block or attenuate the radiation noise radiated inside the electronic components 8 mounted on the first circuit board 4 and the second circuit board 5, respectively, and intended to go outside the electronic control device 100. Therefore, the electronic control device 100 of the first embodiment can effectively implement EMI and electromagnetic susceptibility (EMS) measures for the electronic components 8 mounted on the first circuit board 4 and the second circuit board 5, respectively.As a result, the electronic control device 100 of the first embodiment can comprehensively take a noise countermeasure for the electronic components 8 mounted on any one of the plurality of circuit boards 4 and 5 included in the electronic control device 100.

[0030] Furthermore, in the electronic control device 100 of the first embodiment, the conductive elements 10a and 10b include: the first conductive elements 10a connecting the first end surface 9a of the shielding element 9 on the first circuit board 4 side and the mounting surface 4a of the first circuit board 4; and the second conductive elements 10b connecting the second end surface 9b of the shielding element 9 on the second circuit board 5 side and the mounting surface 5a of the second circuit board 5. The plurality of first conductive elements 10a are arranged along the first end surface 9a at intervals of less than or equal to one-half of the wavelength λ (i.e., λ / 2) of the electromagnetic wave constituting noise, or at intervals of less than or equal to one-quarter of the wavelength λ (i.e., λ / 4).The plurality of second conductive elements 10b are arranged along the second end surface 9b at intervals of less than or equal to one half (λ / 2) of the wavelength λ of the electromagnetic wave constituting noise, or at intervals of less than or equal to one quarter (λ / 4) of the wavelength λ.

[0031] As a result, the electronic control device 100 of the first embodiment can reliably attenuate the irradiation noise or the radiation noise that is to pass between the first circuit board 4 and the shielding member 9 without completely closing between the first circuit board 4 and the shielding member 9. The electronic control device 100 of the first embodiment can reliably attenuate the irradiation noise or the radiation noise that is to pass between the second circuit board 5 and the shielding member 9 without completely closing between the second circuit board 5 and the shielding member 9. Therefore, the electronic control device 100 of the first embodiment can comprehensively and easily implement noise countermeasures for the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 included in the electronic control device 100.

[0032] Further, in the electronic control device 100 of the first embodiment, the first conductive elements 10a are connected to the ground provided on the first circuit board 4, and the second conductive elements 10b are connected to the ground provided on the second circuit board 5.

[0033] As a result, the electronic control device 100 of the first embodiment can output the irradiation noise to each ground provided on the first circuit board 4 and the second circuit board 5. The electronic control device 100 of the first embodiment can reliably prevent a malfunction or failure of the electronic control device 100, such as a malfunction or failure of the electronic components 8 mounted on the first circuit board 4 and the second circuit board 5, respectively. As a result, the electronic control device 100 of the first embodiment can comprehensively implement noise countermeasures for the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 included in the electronic control device 100.

[0034] Further, in the electronic control device 100 of the first embodiment, the shielding member 9 is formed of aluminum, copper, carbon fiber, a conductive resin, a material in which a surface of a non-conductive material is coated with a conductive resin, or other materials.

[0035] As a result, in the electronic control device 100 of the first embodiment, the shielding member 9 can be formed without using a special material. Therefore, the electronic control device 100 of the first embodiment can comprehensively and easily implement noise countermeasures for the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 included in the electronic control device 100.

[0036] Furthermore, the electronic control device 100 of the first embodiment further includes: the housing 1, 2 mounted on the vehicle and accommodating the first circuit board 4, the second circuit board 5, the shielding member 9, and the conductive members 10a and 10b; and the bracket 11 connecting the housing 1, 2 to the frame ground of the vehicle body. The shielding member 9 is connected to the bracket 11.

[0037] As a result, the electronic control device 100 of the first embodiment can dissipate static electricity charged on the first circuit board 4, the second circuit board 5, and the housing 1, 2 to the vehicle frame ground via the shielding member 9 and the bracket 11. The electronic control device 100 of the first embodiment can reliably prevent a malfunction or failure of the electronic control device 100, such as a malfunction or failure of the electronic components 8 mounted on the first circuit board 4 and the second circuit board 5, respectively.As a result, the electronic control device 100 of the first embodiment can take an electrostatic countermeasure while comprehensively taking a noise countermeasure also for the electronic components 8 mounted on any one of the plurality of circuit boards 4 and 5 included in the electronic control device 100.

[0038] Further, in the electronic control device 100 of the first embodiment, the bracket 11 is formed of aluminum, copper, carbon fiber, a conductive resin, or a material in which a surface of a non-conductive material is coated with a conductive resin.

[0039] As a result, in the electronic control device 100 of the first embodiment, the bracket 11 can be formed without using a special material. Therefore, the electronic control device 100 of the first embodiment can comprehensively and easily implement noise countermeasures for the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 included in the electronic control device 100.

[0040] Furthermore, the electronic control device 100 of the first embodiment further includes the spacers 14 that maintain the gap between the first circuit board 4 and the second circuit board 5. The spacers 14 are attached to the shielding member 9.

[0041] As a result, the electronic control device 100 of the first embodiment can prevent the first circuit board 4 and the second circuit board 5 from causing positional displacement due to vibration and interfering with each other, and can prevent the inter-board connector 7 from being disconnected. As a result, the electronic control device 100 of the first embodiment can improve vibration resistance while comprehensively implementing noise countermeasures even for the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 included in the electronic control device 100.

[0042] Furthermore, the electronic control device 100 of the first embodiment further includes the housing 1, 2, which houses the first circuit board 4, the second circuit board 5, the shielding member 9, and the conductive elements 10a and 10b. The housing 1, 2 is made of metal or resin.

[0043] As a result, in the electronic control device 100 of the first embodiment, the housing 1, 2 can be formed without using a special material. Therefore, the electronic control device 100 of the first embodiment can comprehensively and easily implement noise countermeasures for the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 included in the electronic control device 100. [Second embodiment]

[0044] With reference to Fig. 4 to Fig. 6, an electronic control device 100 of a second embodiment is described. In the electronic control device 100 of the second embodiment, the same configuration and operation as in the first embodiment are not described. Fig. 4 is an exploded perspective view of the electronic control device 100 of the second embodiment. Fig. 5 is a cross-sectional view of the Fig. 4 illustrated electronic control device 100. Fig. 6 is a configuration diagram of a shielding member 9, a heat dissipation plate 15, and a heat sink 17.

[0045] Similar to the electronic control device 100 of the first embodiment, the electronic control device 100 of the second embodiment can implement noise countermeasures for the electronic components 8 mounted on a plurality of circuit boards 4 and 5. Furthermore, the electronic control device 100 of the second embodiment can implement thermal countermeasures for the electronic components 8 mounted on the plurality of circuit boards 4 and 5.

[0046] The electronic control device 100 of the second embodiment includes, in addition to the components included in the electronic control device 100 of the first embodiment: the heat dissipation plate 15, the heat sink 17, and heat dissipation materials 18.

[0047] A housing 1, 2 of the second embodiment accommodates the first circuit board 4, the second circuit board 5, the shielding member 9, the conductive members 10a and 10b, the heat dissipation plate 15 and the heat dissipation materials 18.

[0048] The heat dissipation plate 15 is arranged within the shielding member 9 between the electronic components 8 mounted on the first circuit board 4 and the electronic components 8 mounted on the second circuit board 5. The heat dissipation plate 15 is arranged along the first circuit board 4 and the second circuit board 5. The heat dissipation plate 15 is formed from a material with high thermal conductivity, such as aluminum, copper, or carbon fiber. The heat dissipation plate 15 is connected to the heat sink 17 through or via the shielding member 9 and the housing 1, 2. The heat dissipation plate 15 is formed integrally with the shielding member 9 and the heat sink 17.

[0049] The heat dissipation plate 15 includes first bases 16a protruding toward the electronic components 8 mounted on the first circuit board 4; and second bases 16b protruding toward the electronic components 8 mounted on the second circuit board 5. An area of ​​an upper surface of each of the first bases 16a and the second bases 16b may be greater than or equal to an area of ​​an upper surface of the electronic component 8 corresponding to each of the first bases 16a and the second bases 16b. The first base 16a and the second base 16b may be provided for the electronic components 8 mounted on the first circuit board 4 and the second circuit board 5 and which have a large amount of heat generation, and the first base 16a and the second base 16b may not be provided for the electronic component 8 which has a small amount of heat generation.The heat dissipation plate 15 may be formed to have (i) a depressed shape in a region located on the surface of the heat dissipation plate 15 facing the first circuit board 4 and on which no first base 16a is provided, and (ii) a depressed shape in a region located on the surface of the heat dissipation plate 15 facing the second circuit board 5 and on which no second base 16b is provided, and the respective depressed shapes are formed to be spaced apart from the first circuit board 4 and the second circuit board 5.

[0050] The heat dissipation materials 18 are elements in contact with the electronic components 8 and the heat dissipation plate 15. The heat dissipation materials 18 consist of, for example, heat dissipation grease or a heat dissipation film. The heat dissipation materials 18 fill spaces between the electronic components 8 mounted on the first circuit board 4 and the first bases 16a, and spaces between the electronic components 8 mounted on the second circuit board 5 and the second bases 16b.

[0051] The heat sink 17 is provided outside the housing 1, 2. The heat sink 17 is provided so as to be in contact with an outer surface of the housing 1, 2. The heat sink 17 is provided on the outer surface of the housing 1, 2 so as to be spaced from the opening 3 of the housing 1, 2 and located close to the electronic component 8 that has a larger heat generation amount than the electronic component 8 that has a smaller heat generation amount. The heat sink 17 has a plurality of fins 17a that extend along the gravity direction (vertical direction) and are arranged so as to be spaced from each other in the horizontal direction (front-back direction or left-right direction). Regardless of an installation position of the housing 1, 2, the plurality of ribs 17a extend along the direction of gravity and are arranged to be spaced apart from each other in the horizontal direction.The heat sink 17 is made of a material with high thermal conductivity, such as aluminum, copper, carbon fiber, or the like. The shielding element 9, the heat dissipation plate 15, and the heat sink 17 are integrally formed.

[0052] A bracket 11 of the second embodiment is connected to the heat sink 17 provided on the outer surface of the housing 1, 2. The bracket 11 of the second embodiment connects the housing 1, 2 to the frame ground of the vehicle via the heat sink 17. The bracket 11 of the second embodiment is connected to the housing 1, 2 via the heat sink 17. The bracket 11 of the second embodiment is connected to the shielding element 9 via the heat sink 17 and the heat dissipation plate 15.

[0053] The shielding member 9, the heat dissipation plate 15, and the heat sink 17 are connected and fixed to the casing 1, 2 so as to withstand vibration of the electronic control device 100 or impact at the time of falling. These fixing methods may be the following. For example, a method may be adopted in which a screw mechanism or a hook mechanism (a mechanism using a claw and a hole) is provided on an outer surface of the shielding member 9 and an inner surface of the casing base 1, and fixing is achieved by connecting the two. For example, a method may be adopted in which a screw mechanism or a hook mechanism is provided on the heat sink 17 and an outer surface of the casing base 1, and fixing is achieved by connecting the two.Further, a method may be adopted in which a screw mechanism or a hook mechanism is provided on the case base 1 and the case cover 2 and in which fastening is performed by connecting the two.

[0054] As described above, the electronic control device 100 of the second embodiment includes: the heat dissipation plate 15 disposed within the shielding member 9 between the electronic components 8 mounted on the first circuit board 4 and the electronic components 8 mounted on the second circuit board 5; the heat dissipation materials 18 in contact with the electronic components 8 and the heat dissipation plate 15; the casing 1, 2 accommodating the first circuit board 4, the second circuit board 5, the shielding member 9, the conductive members 10a and 10b, the heat dissipation plate 15, and the heat dissipation materials 18; and the heat sink 17 provided outside the casing 1, 2. The heat dissipation plate 15 is connected to the heat sink 17 through or via the shielding member 9 and the casing 1, 2.

[0055] As a result, the electronic control device 100 of the second embodiment can directly transport heat generated in the electronic components 8 to the heat dissipation plate 15, not via the first circuit board 4 or the second circuit board 5. The electronic control device 100 of the second embodiment can directly transport the heat generated in the heat dissipation plate 15 to the heat sink 17 outside the housing 1, 2 and dissipate the heat from the heat sink 17. Therefore, the electronic control device 100 of the second embodiment can directly dissipate the heat generated in the electronic components 8 outside the housing 1, 2 and can therefore reliably reduce the temperature of the electronic components 8.As a result, the electronic control device 100 of the second embodiment, while comprehensively taking a noise countermeasure for the electronic components 8 mounted on any one of the plurality of circuit boards 4 and 5 included in the electronic control device 100, can reliably take a heat countermeasure for the electronic components 8 mounted on the plurality of circuit boards 4 and 5.

[0056] Furthermore, in the electronic control device 100 of the second embodiment, the heat dissipation plate 15 includes: the first bases 16a protruding toward the electronic components 8 mounted on the first circuit board 4; and the second bases 16b protruding toward the electronic components 8 mounted on the second circuit board 5. The heat dissipation materials 18 fill the spaces between the electronic components 8 mounted on the first circuit board 4 and the first bases 16a, and the spaces between the electronic components 8 mounted on the second circuit board 5 and the second bases 16b.

[0057] With this arrangement, in the electronic control device 100 of the second embodiment, it is possible to reduce the heat resistance between the electronic components 8 and the heat dissipation plate 15, so that the heat generated in the electronic components 8 can be transported to the heat dissipation plate 15 more quickly. Therefore, the electronic control device 100 of the second embodiment can more reliably reduce the temperature of the electronic components 8. As a result, the electronic control device 100 of the second embodiment, while comprehensively taking noise countermeasures for the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 included in the electronic control device 100, can more reliably take heat countermeasures for the electronic components 8 mounted on the plurality of circuit boards 4 and 5.

[0058] Further, in the electronic control device 100 of the second embodiment, the heat sink 17 has the plurality of fins 17a extending along the gravity direction regardless of the installation position of the housing 1, 2 and arranged to be spaced apart from each other in the horizontal direction.

[0059] As a result, the electronic control device 100 of the second embodiment can dissipate the heat transported to the heat sink 17 more quickly, regardless of the installation position of the housing 1, 2, so that the temperature of the electronic components 8 can be reduced more reliably. As a result, the electronic control device 100 of the second embodiment, while comprehensively taking noise countermeasures for the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 included in the electronic control device 100, can more reliably take heat countermeasures for the electronic components 8 mounted on the plurality of circuit boards 4 and 5.

[0060] Further, in the electronic control device 100 of the second embodiment, the shielding member 9, the heat dissipation plate 15, and the heat sink 17 are each formed of aluminum, copper, or carbon fiber.

[0061] As a result, in the electronic control device 100 of the second embodiment, it is possible to form the shielding member 9, the heat dissipation plate 15, and the heat sink 17 without using any special material. As a result, the electronic control device 100 of the second embodiment, while comprehensively implementing noise countermeasures for the electronic components 8 mounted on any of the plurality of circuit boards 4 and 5 included in the electronic control device 100, can reliably and easily implement thermal countermeasures for the electronic components 8 mounted on the plurality of circuit boards 4 and 5.

[0062] Further, in the electronic control device 100 of the second embodiment, the shielding member 9, the heat dissipation plate 15, and the heat sink 17 are integrally formed.

[0063] As a result, the electronic control device 100 of the second embodiment can transport heat from the first circuit board 4 and the second circuit board 5 to the heat dissipation plate 15 via the shielding member 9. Furthermore, in the electronic control device 100 of the second embodiment, it is possible to reduce the heat resistance between the shielding member 9 and the heat dissipation plate 15 and the heat resistance between the heat dissipation plate 15 and the heat sink 17. Therefore, the electronic control device 100 of the second embodiment can transport the heat generated in the first circuit board 4, the second circuit board 5, and the electronic components 8 more quickly to the heat dissipation plate 15, so that the temperature of the electronic components 8 can be reduced more reliably.As a result, the electronic control device 100 of the second embodiment, while comprehensively taking a noise countermeasure for the electronic components 8 mounted on any one of the plurality of circuit boards 4 and 5 included in the electronic control device 100, can more reliably take a heat countermeasure for the electronic components 8 mounted on the plurality of circuit boards 4 and 5.

[0064] It should be noted that the present invention is not limited to the above embodiments and includes various modifications. For example, the above-described embodiments have been described in detail in order to describe the present invention in an easy-to-understand manner, and they are not necessarily limited to those having all of the described configurations. In addition, a part of the configuration of one embodiment may be replaced with a configuration of another embodiment, and a configuration of one embodiment may be added with a configuration of another embodiment. In addition, with respect to a part of the configuration of each embodiment, addition of another configuration, deletion, and replacement may be performed. List of reference symbols 1, 2 housings 4 first circuit board 4a Mounting surface 5 second circuit board 5a Mounting surface 8 electronic component 9 Shielding element 9a first end face 9b second end face 10a, 10b conductive element 10a first conductive element 10b second conductive element 11 Bracket 14 spacers 15 Heat dissipation plate 16a first base 16b second base 17 Heat sink 17a rib 18 Heat dissipation material 100 electronic control device QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] JP 6012220 B2

[0005]

Claims

[1] Electronic control device according to claim 1, comprising: a first circuit board and a second circuit board arranged to face each other, wherein a gap is provided between mounting surfaces of respective ones of the first circuit board and the second circuit board, each mounted with an electronic component; and a shielding member disposed in the gap between the first circuit board and the second circuit board and blocking noise; and a conductive element connecting the first circuit board and the second circuit board to the shielding element, wherein the shielding member is a frame body forming a closed path surrounding an entire periphery of a periphery of the electronic components each mounted on one of the first circuit board and the second circuit board, and having a width corresponding to the gap. [2] The electronic control device according to claim 1, wherein the conductive element comprises: a first conductive member connecting a first end surface on one side of the first circuit board of the shielding member to the mounting surface of the first circuit board; and a second conductive element connecting a second end surface on one side of the second circuit board of the shielding element to the mounting surface of the second circuit board, wherein a plurality of the first conductive elements are arranged along the first end surface at intervals of less than or equal to one-half of a wavelength of an electromagnetic wave constituting the noise, or at intervals of less than or equal to one-quarter of the wavelength, and wherein a plurality of the second conductive elements are arranged along the second end face at intervals of less than or equal to one-half of the wavelength or at intervals of less than or equal to one-quarter of the wavelength. [3] The electronic control device according to claim 2, wherein the first conductive elements are connected to a ground provided on the first circuit board, and wherein the second conductive elements are connected to a ground provided on the second circuit board. [4] The electronic control device according to claim 1, wherein the shielding member is formed of aluminum, copper, carbon fiber, a conductive resin, or a material in which a surface of a non-conductive material is coated with a conductive resin. [5] The electronic control device according to claim 1, further comprising: a heat dissipation plate disposed within the shielding member between the electronic component mounted on the first circuit board and the electronic component mounted on the second circuit board; and Heat dissipation materials in contact with the electronic components and the heat dissipation plate; and a housing that accommodates the first circuit board, the second circuit board, the shielding member, the conductive elements, the heat dissipation plate, and the heat dissipation materials; and a heat sink provided outside the housing, wherein the heat dissipation plate is connected to the heat sink through or via the shielding member and the housing. [6] The electronic control device according to claim 5, wherein the heat dissipation plate comprises: a first base projecting toward the electronic component mounted on the first circuit board; and a second base projecting toward the electronic component mounted on the second circuit board, and the heat dissipation materials fill a space between the electronic component mounted on the first circuit board and the first base and a space between the electronic component mounted on the second circuit board and the second base. [7] The electronic control device according to claim 5, wherein the heat sink comprises a plurality of fins extending along a gravity direction regardless of an installation position of the housing and arranged to be spaced apart from each other in a horizontal direction. [8] The electronic control device according to claim 5, wherein the shielding member, the heat dissipation plate and the heat sink are each formed of aluminum, copper or carbon fiber. [9] The electronic control device according to claim 5, wherein the shielding member, the heat dissipation plate and the heat sink are integrally formed. [10] The electronic control device according to claim 1, wherein the electronic control device is mounted on a vehicle, the electronic control device further comprising: a housing that accommodates the first circuit board, the second circuit board, the shielding member, and the conductive member; and a bracket that connects the housing to a frame mass of a vehicle body, wherein the shielding element is connected to the holder. [11] The electronic control device according to claim 10, wherein the bracket is formed of aluminum, copper, carbon fiber, a conductive resin, or a material in which a surface of a non-conductive material is coated with a conductive resin. [12] The electronic control device according to claim 1, further comprising a spacer that maintains the gap between the first circuit board and the second circuit board, the spacer being fixed to the shielding member. [13] The electronic control device according to claim 1, further comprising a case that houses the first circuit board, the second circuit board, the shielding member and the conductive member, the case being made of metal or resin.

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