Immersion cooling device
The immersion cooling apparatus addresses inefficiencies in existing systems by using oblique housings and a sophisticated refrigerant management system, resulting in improved arrangement efficiency and cooling performance.
Patent Information
- Application Number
- DE112023003176
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-07-22
- Filing Date
- 2023-02-20
- Publication Date
- 2025-05-22
AI Technical Summary
Existing immersion cooling systems for electronic devices are inefficient in terms of space usage and cooling performance, as they require multiple devices to be vertically stacked, leading to a large system size and reduced energy efficiency.
The proposed immersion cooling apparatus features a housing group with oblique housings that extend downward, a refrigerant supply and discharge system, a refrigerant pump unit, and a heat exchanger unit, which together improve the arrangement efficiency and cooling performance by allowing for horizontal flow of refrigerant and efficient heat exchange.
This configuration enhances the disposition and cooling efficiency of the immersion cooling system, allowing for improved heat transfer and reduced system size, while also conserving energy and refrigerant.
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Abstract
Description
TECHNICAL FIELD
[0001] The present disclosure relates to an immersion cooling device.
[0002] Priority is claimed for Japanese Patent Application No. 2022-117547, filed on July 22, 2022, the contents of which are hereby incorporated by reference. STATE OF THE ART
[0003] Patent Document 1 discloses a cooling system that cools an electronic device having a heating element. The cooling system includes a cooling tank containing a refrigerant. The electronic device is immersed in the refrigerant of the cooling tank. The electronic device is arranged in the cooling tank in a plurality of vertical positions. The refrigerant in the cooling tank circulates so that, after cooling the heating element, the refrigerant is cooled outside the cooling tank and then returned to the cooling tank. Citation listPatent document
[0004] Patent Document 1: PCT International Publication No. WO2016 / 075838 SUMMARY OF THE INVENTIONTechnical Problem
[0005] However, in the cooling system described in Patent Document 1, a plurality of electronic devices are arranged vertically in a cooling tank, resulting in a large cooling system. Therefore, one goal is to improve the arrangement efficiency from the perspective of reducing the size of the cooling system. Another goal is to improve cooling efficiency from the perspective of energy saving and refrigerant conservation.
[0006] The present disclosure has been made to achieve the above-described objects, and an object of the present disclosure is to provide an immersion cooling device that can improve the disposition and cooling efficiency. Solution to the problem
[0007] To achieve the above-described objects, the present disclosure provides an immersion cooling device that cools a heating element provided on a circuit board, the immersion cooling device comprising: a case group including inclined cases, each of which has a box shape extending downward to a first side in a horizontal direction and each of which is configured to accommodate the heating element, and which is configured by arranging the inclined cases in an up-down direction; a supply-side header extending in the up-down direction on a second side in the horizontal direction of the case group and configured to introduce a first refrigerant into each of the inclined cases;a discharge-side header extending in the up-down direction on the first side in the horizontal direction of the case group and configured to receive the introduction of the first refrigerant from each of the inclined cases; a refrigerant pump unit configured to pump the first refrigerant from the discharge-side header to the supply-side header; and a heat exchanger unit configured to cool the first refrigerant by exchanging heat between a second refrigerant supplied from the outside and the first refrigerant. Advantageous effects of the invention
[0008] With the immersion cooling device according to the present disclosure, the disposition and cooling efficiency can be improved. BRIEF DESCRIPTION OF THE DRAWINGS [ Fig. 1] Schematic representation of a full immersion cooling device according to an embodiment of the present disclosure. [ Fig. 2] A schematic view showing the schematic configuration of an inner portion of a slant case according to the embodiment of the present disclosure. [ Fig. 3] An enlarged view showing a configuration near an end portion of the slanted housing closer to a supply side collector according to the embodiment of the present disclosure. [ Fig. 4] A schematic view showing the schematic configuration of an internal portion of a server chassis according to the embodiment of the present disclosure. [ Fig. 5] A schematic view showing a rail provided in the slant housing according to the embodiment of the present disclosure. [ Fig. 6] A schematic view showing a schematic configuration of the inner portion of the server chassis according to the embodiment of the present disclosure. DESCRIPTION OF THE EMBODIMENTS
[0009] Hereinafter, an immersion cooling device 10 according to an embodiment of the present disclosure will be described with reference to the Fig. 1 to 6.
[0010] As in Fig. As shown in Figure 1, the immersion cooling device 10 is used for cooling an electronic device that performs high-speed computing. In the present embodiment, the immersion cooling device 10 is used for a server 1 installed in a data center. A plurality of servers 1 are provided.
[0011] As in Fig. As shown in Figure 2, the server 1 includes a printed circuit board and an element such as a CPU or GPU chip provided on the printed circuit board. Since the CPU or GPU is a component responsible for high-speed computing, a high load is exerted on the CPU or GPU, and the CPU or GPU generates heat at a higher temperature than other areas of the server 1.
[0012] A heat exchanger 4 using water as a coolant is installed in the data center. The heat exchanger 4 can be, for example, a dry cooler or a water chiller. The immersion cooling device 10 according to the present embodiment is provided separately from the heat exchanger 4 and is used to cool an element that generates high-temperature heat, such as the CPU or GPU.
[0013] Hereinafter, the printed circuit board of server 1 is simply referred to as “board 2,” and the element that generates particularly high-temperature heat in board 2, such as the CPU or GPU, is referred to as “heating element 3.”
[0014] The circuit board 2 has the shape of a rectangular plate. The heating element 3 is mounted on one surface of the circuit board 2. (Immersion cooling device configuration)
[0015] A configuration of the immersion cooling device 10 is described below.
[0016] As in the Fig. 1 and Fig. 2, the immersion cooling device 10 includes a frame 20, a housing group 30, a sealing portion 11, a server housing 40, a nozzle 12, a backflow prevention door 50, a supply side header 60, a supply side connection pipe 13, a valve 14, a discharge side header 70, a backflow prevention cover 80, a refrigerant pump unit 15, a first header 16, a second header 17, and a heat exchanger unit 90. (Frame)
[0017] The rack 20 is a cubic storage rack in which the housing assembly 30 is housed. The rack 20 has a rack body 21, an inlet door 22, an outlet door 23, a support column 24, and a beam 25.
[0018] The rack body 21 includes an upper wall 21a in the shape of a rectangular plate extending horizontally, a lower wall 21b having the same shape as the upper wall and located directly below the upper wall, and a pair of side walls 21c connecting side edges of the upper wall 21a and the lower wall 21b and facing each other horizontally. The rack body 21 has a tubular shape open on both sides in the horizontal direction orthogonal to a direction in which the two side walls 21c face each other.
[0019] Hereinafter, an opening direction of the frame body 21 in the horizontal direction is referred to as "front-rear direction Da," and a direction orthogonal to the front-rear direction Da in the horizontal direction is referred to as "width direction Dw." Furthermore, a first side in the front-rear direction Da is referred to as "a first side D1 in the horizontal direction," and a second side in the front-rear direction Da is referred to as "a second side D2 in the horizontal direction."
[0020] Hereinafter, among the opening areas of the frame body 21, the opening area on the second side D2 in the horizontal direction is referred to as “inlet side opening area 21d” and the opening area on the first side D1 in the horizontal direction is referred to as “outlet side opening area 21e”.
[0021] The inlet door 22 is located in the inlet side opening area 21d, and the outlet door 23 is located in the outlet side opening area 21e.
[0022] The inlet door 22 is attached to the second side D2 in the horizontal direction of the frame 20. The inlet door 22 is a rectangular plate-shaped member extending in an up-down direction and opening and closing a space in the frame 20. The inlet side opening 22 closes all areas of the inlet side opening portion 21d except for a lower end portion. The inlet door 22 is provided to be rotatable about an edge 21f extending in the up-down direction and located on the inlet side opening portion 21d side of an outer surface of the side wall 21c, for example, by 80 degrees to 110 degrees from a state where the inlet side opening portion 21d is blocked. In the present embodiment, the inlet door 22 is rotatable by 90 degrees with respect to the edge 21f on the inlet side opening portion 21d side.
[0023] The exhaust door 23 is mounted on the first side D1 in the horizontal direction of the frame 20. The exhaust door 23 is a rectangular plate-shaped member extending in the up-down direction and opening and closing a space in the frame 20. The exhaust door 23 closes all areas of the exhaust-side opening portion 21e except for a lower end portion. The exhaust door 23 is provided to be rotatable about an edge 21g extending in the up-down direction and located on the inlet-side opening portion 21d side of the outer surface of the side wall 21c from a state where the exhaust-side opening portion 21e is blocked, for example, from 80 degrees to 110 degrees. In the present embodiment, the exhaust door 23 is rotatable 90 degrees about the edge 21g on the outlet-side opening portion 21e side.
[0024] The support column 24, which extends upward from the lower wall 21b of the frame body 21, is located in a space divided by the frame body 21, the inlet door 22 and the outlet door 23.
[0025] Four support columns 24 are arranged in a quadrangular lattice shape in the up-down direction. All four support columns 24 are fixed to an inner surface of the side wall 21c of the rack body 21. Moreover, of the four support columns 24, two support columns 24 are arranged near the inlet side opening portion 21d, and the remaining two support columns 24 are arranged near the outlet side opening portion 21e.
[0026] Hereinafter, the two support columns 24 near the inlet side opening portion 21d are referred to as “first support columns 24a” and the two support columns 24 near the outlet side opening portion 21e are referred to as “second support columns 24b”.
[0027] The two first support columns 24a face each other in the width direction Dw. The two second support columns 24b also face each other in a similar manner in the width direction Dw.
[0028] The two first support columns 24a and the two second support columns 24b are connected to each other by the beam 25 extending in the width direction Dw.
[0029] The beam 25 is a rod-shaped member having a rectangular cross-sectional shape when viewed in the width direction Dw. Hereinafter, among the beams 25, the beam 25 connecting the two first support columns 24a is referred to as the "first beam 25a," and the beam 25 connecting the two second support columns 24b is referred to as the "second beam 25b."
[0030] A plurality of first beams 25a and a plurality of second beams 25b are provided so as to be spaced apart from each other at equal intervals in the up-down direction. The first beams 25a and the second beams 25b are arranged in the same number and at the same position in the up-down direction. Note that the first beam 25a is formed thicker in the up-down direction than the second beam 25b. Moreover, with the first beam 25a and the second beam 25b provided at the same position in the up-down direction, an upper surface 25c of the first beam 25a is located above an upper surface 25d of the second beam 25b. (housing group)
[0031] The housing group 30 is housed in the frame 20 described above. The housing group 30 is an assembly including inclined housings 31, each of which has a box shape extending in the horizontal direction and is configured by arranging the inclined housings 31 in the up-down direction. (Slanted case)
[0032] The inclined housing 31 accommodates the circuit board 2 of the server 1. That is, the inclined housing 31 can accommodate the heating element 3 provided on the circuit board 2. The inclined housing 31 is arranged above the first bracket 25a and the second bracket 25b, which are provided at the same position in the up-down direction, to bridge the first bracket 25a and the second bracket 25b. As described above, with the first bracket 25a and the second bracket 25b provided at the same position in the up-down direction, the upper surface 25c of the first bracket 25a is located above the upper surface 25d of the second bracket 25b, so that the inclined housing 31 extends horizontally downward to the first side D1.
[0033] A first refrigerant R1 can be stored in the inclined housing 31. The first refrigerant R1 is a refrigerant with insulating properties. The first refrigerant R1 cools the heating element 3 in a liquid phase state. The first refrigerant R1 can be, for example, a fluorocarbon-based liquid.
[0034] The shape of the inclined housing 31 is described in more detail below.
[0035] The inclined housing 31 has a housing body 32, a flange 33, a feed side distributor 34 and a rail 35.
[0036] The housing body 32 is a member constituting a main part of the inclined housing 31 for accommodating the circuit board 2 and is box-shaped in the form of an outer rectangular board extending in the horizontal direction. The housing body 32 is open in the front-rear direction Da (see Fig. 3 and Fig. 4).
[0037] Hereinafter, among the opening areas of the housing 32, the opening area on the second side D2 in the horizontal direction is referred to as “first opening area 32a” and the opening area on the first side D1 in the horizontal direction is referred to as “second opening area 32b”.
[0038] As in the Fig. 2 and Fig. 3, the flange 33 is provided over the entire circumference at one end portion of the housing body 32 on the side of the first opening portion 32a. The flange 33 protrudes perpendicularly from an outer surface of the housing 32.
[0039] The supply-side distributor 34 is provided in the end portion of the housing body 32 on the side of the first opening portion 32a. The supply-side distributor 34 extends in the width direction Dw. The supply-side distributor 34 evenly distributes the first refrigerant R1 supplied from the supply-side header 60 described later in the housing body 32 in the width direction Dw.
[0040] The feed side distributor 34 has a distributor body 36, a cover portion 37 and an introduction portion 38.
[0041] The distributor body 36 is a box-shaped container extending in the width direction Dw. The distributor body 36 is fitted into the first opening portion 32a. The distributor body 36 has a rectangular cross-section as viewed in the width direction Dw and is open horizontally toward the second side D2.
[0042] The cover portion 37 closes the opening of the distributor body 36 from the second side D2 in the horizontal direction. The cover portion 37 has the shape of a rectangular plate extending in the width direction Dw. An outer peripheral edge of the cover portion 37 overlaps with the flange 33. The cover portion 37 is fixed to the flange 33, e.g., by a screw connection.
[0043] The introduction portion 38 is provided in an end portion on a side opposite to the manifold body 36, with the lid portion 37 interposed therebetween in the front-rear direction Da. The introduction portion 38 is a tubular member that introduces the first refrigerant R1 from the supply-side header 60 to the supply-side manifold 34. The introduction portion 38 communicates with the manifold body 36. A plurality of introduction portions 38 (three in the present embodiment) are provided at equal intervals in the width direction Dw.
[0044] As in the Fig. 2 and Fig. 5, the rail 35 is provided in each of two side walls 32c opposite each other in the width direction Dw of the case body 32. The rail 35 protrudes inward in the width direction Dw from a plate material 39 fixed to an inner surface of the side wall 32c and extends in the front-rear direction Da. The rail 35 is a square bar having a rectangular cross-sectional shape when viewed in the front-rear direction Da. (Sealing area)
[0045] As in the Fig. 3 and Fig. 4, the sealing portion 11 is provided in the end portions of each of the inclined casings 31 on the first side D1 in the horizontal direction and on the second side D2 in the horizontal direction. The sealing portion 11 prevents the first refrigerant R1 from leaking out. More specifically, the sealing portion 11 is provided in the end portion of the inclined casing 31 on the supply-side manifold 34 side, between the manifold body 36 and the first opening portion 32a of the inclined casing 31, and between the lid portion 37 and the flange 33 of the inclined casing 31. Furthermore, in the end portion of the inclined casing 31 on a side opposite to the supply-side manifold 34, the sealing portion 11 is provided between an outer surface of the inclined casing 31 and an inflow port 73 of the discharge-side header 70, which will be described later. (Server chassis)
[0046] The server housing 40 is provided in each of the inclined housings 31. The server housing 40 has a box shape in which the circuit board 2 of the server 1 is housed. As shown in Fig. 6, the server housing 40 is formed in the form of an outer rectangular plate extending in the horizontal direction.
[0047] An introduction hole 41a for introducing the first refrigerant R1 into the server case 40 is formed in a front wall 41 of the server case 40 on the second side D2 in the horizontal direction. A plurality of introduction holes 41a are formed throughout the front wall 41. Furthermore, an outlet port 42a for discharging the first refrigerant R1 in the server case 40 to the outside is formed in a rear wall 42 of the server case 40 on the first side D1 in the horizontal direction. A plurality of outlet ports 42a are formed throughout the rear wall 42.
[0048] A guide 44 is provided on the two side walls 43 opposite each other in the width direction Dw of the server case 40. The guide 44 is a member that positions the server case 40 and guides the movement of the server case 40 in the front-to-back direction Da when the server case 40 is inserted into and removed from the inclined case 31. The guide 44 protrudes outward in the width direction Dw from the outer surface of the side wall 43 and extends in the front-to-back direction Da. The guide 44 is a square bar having a rectangular cross-sectional shape when viewed in the front-to-back direction Da. The guide 44 is provided in two pieces on each side wall to be spaced apart from each other in the up-down direction and to interrupt the rail 35 of the inclined housing 31 in the up-down direction.Therefore, in the case where the server case 40 is taken in and out of the inclined case 31, it moves linearly in the front-to-back direction Da along the rail 35. (Nozzle)
[0049] As in the Fig. 1 and Fig. 2, the nozzle 12 is provided in each of the inclined housings 31 and attached to a lower outer surface of the supply-side manifold 34 on a side opposite the lid portion 37. The nozzle 12 communicates with the supply-side manifold 34 and radially jets the first refrigerant R1 supplied from the supply-side header 60 toward the server case 40. The nozzle 12 has a conical shape whose diameter increases toward the first side D1 in the horizontal direction. (Backflow prevention door)
[0050] The backflow prevention door 50 is provided in each of the inclined casings 31 and prevents the first refrigerant R1 in the inclined casing 31 from flowing back horizontally to the second side D2. The backflow prevention door 50 has a hinge 51 and a backflow prevention door body 52. As shown in Fig. As shown in Figure 4, the hinge 51 is disposed in the inclined housing 31 and fixed to an upper wall 32d. The hinge 51 is a spring hinge. The backflow prevention door body 52 extends downward from the hinge 51 and extends in the width direction Dw. The backflow prevention door body 52 is held in a position perpendicular to a horizontal plane by an elastic force exerted by the spring of the hinge 51.
[0051] The backflow prevention door 50 blocks a flow channel of the first refrigerant R1 and opens the flow channel of the first refrigerant R1 in a case where an external force equal to or greater than a predetermined magnitude is applied in a direction of the first side D1 in the horizontal direction. In the present embodiment, in a case where the server case 40 is not arranged in the inclined case 31, the backflow prevention door body 52 is held in the inclined case 31 by the elastic force of the hinge 51 in a position perpendicular to the horizontal plane. Therefore, the flow channel of the first refrigerant R1 in the inclined case 31 is blocked by the backflow prevention door body 52.On the other hand, in a case where the server case 40 is arranged in the inclined case 31, the backflow prevention door body 52 is pressed by the server case 40 and receives the external force toward the first side D1 in the horizontal direction. This external force causes the backflow prevention door body 52 to rotate around the hinge 51 and open the flow channel for the first refrigerant R1. (Feed side collector)
[0052] As in Fig. 1 and Fig. As shown in Figure 2, the supply-side header 60 is provided on an inner surface of the inlet door 22. The supply-side header 60 extends in the up-down direction on the second side D2 in the horizontal direction of the case group 30 and can introduce the first refrigerant R1 into each of the inclined cases 31. The supply-side header 60 has a cylindrical shape extending in the up-down direction. The supply-side header 60 is provided with a plurality of supply-side connection pipes 13. (Supply side connection line)
[0053] The supply-side connecting pipe 13 connects the supply-side header 60 and each of the inclined casings 31 to each other in a state where the supply-side header 60 and each of the inclined casings 31 communicate with each other. A plurality of (three in the present embodiment) supply-side connecting pipes 13 are provided for each of the inclined casings 31 and are connected to the insertion portion 38 of the corresponding inclined casing 31. The valve 14 that can open and close the supply-side connecting pipe 13 is provided in the supply-side connecting pipe 13. (Valve)
[0054] The valve 14 is provided for each of the inclined housings 31. In the present embodiment, the three supply-side connecting pipes 13 connected to the corresponding inclined housing 31 via a valve 14 can be opened and closed simultaneously. The supply-side connecting pipe 13 is a flexible tube that can be deformed according to the rotational movement of the inlet door 22. (Disposal side collector)
[0055] The discharge side header 70 is housed in the frame body 21 and extends in the up-down direction on the first side D1 in the horizontal direction of the case group 30. The first refrigerant R1 is introduced into the discharge side header 70 from each of the inclined cases 31. The discharge side header 70 has a discharge side header body 71 and a storage area 72.
[0056] The discharge-side header 71 is adjacent to the first side D1 in the horizontal direction of the case group 30. The discharge-side header 71 is a box-shaped container having an outer rectangular plate shape extending in the up-down direction. In the present embodiment, both end portions of the discharge-side header body 71 in the width direction Dw are fixed to the inner surface of the side wall 21c of the frame body 21. In the discharge-side header body 71, the inflow port 73 is provided at each position corresponding to each of the inclined cases 31. The first refrigerant R1 introduced from the inclined case 31 flows into the inflow port 73. In the present embodiment, the second opening portion 32b of the corresponding inclined case 31 is inserted into each inflow port 73. In addition, the sealing area 11 described above is provided between the inlet connection 73 and the inclined housing 31.
[0057] The storage portion 72 is provided in a lower end portion of the inclined housing 31. The storage portion 72 stores the refrigerant introduced into the discharge-side header body 71. A dimension Da of the storage portion 72 in the front-rear direction is larger than a dimension Da of the inclined housing 31 in the front-rear direction. The storage portion 72 is arranged on the bottom wall 21b of the frame body 21. (Backflow prevention cover)
[0058] The backflow prevention cover 80 is provided at a position corresponding to each inflow port 73 in the discharge side header 70. The backflow prevention cover 80 prevents the first refrigerant R1 from flowing back from the discharge side header 70 into the inclined case 31. The backflow prevention cover 80 extends in the width direction Dw and covers the inflow port 73 with a gap from above and from the first side D1 in the horizontal direction. As shown in Fig. 4, the backflow prevention cover 80 has a top wall 81 and a back wall 82.
[0059] The upper wall 81 is provided on an inner surface of the discharge-side header 70 on a side where the inflow port 73 is formed. The upper wall 81 is attached above the corresponding inflow port 73, for example, by welding or the like, and extends in the front-rear direction Da. The upper wall 81 is linearly inclined to be arranged gradually downward toward the rear.
[0060] The rear wall 82 is provided at a rear end of the upper wall 81 and extends vertically downward from the rear end of the upper wall 81. The rear wall 82 is formed at a position spaced rearward from the second opening portion 32b of the inclined housing 31 to cover the entire second opening portion 32b. The rear wall 82 is formed integrally with the upper wall 81. (refrigerant pump unit)
[0061] As in Fig.1, the refrigerant pump unit 15 is housed in the frame 20 and arranged below the casing assembly 30. The refrigerant pump unit 15 is connected to a lower portion of the discharge-side header 70 via the first connecting pipe 16 and to a lower portion of the supply-side header 60 via the second connecting pipe 17. The discharge-side header 70 and the refrigerant pump unit 15 can be connected to each other through the first connecting pipe 16, and the supply-side header 60 and the refrigerant pump unit 15 can be connected to each other through the second connecting pipe 17. The refrigerant pump unit 15 pumps the first refrigerant R1 from the lower portion of the discharge-side header 70 to the lower portion of the supply-side header 60. The refrigerant pump unit 15 according to the present embodiment is a pump. (heat exchanger unit)
[0062] The heat exchanger unit 90 is arranged below the housing group 30. In the present embodiment, the heat exchanger unit 90 is arranged in the storage area 72 of the discharge-side header 70. The heat exchanger unit 90 cools the first refrigerant R1 by heat exchange between an externally supplied second refrigerant R2 and the first refrigerant R1.
[0063] According to the present embodiment, the heat exchanger unit 90 consists of a plurality of heat transfer tubes 91 that penetrate the storage area 72 in the width direction Dw. The heat transfer tube 91 communicates with the externally provided heat exchanger 4. The second refrigerant R2 of the heat exchanger 4 flows within the heat transfer tube 91. The plurality of heat transfer tubes 91 extend parallel to each other and are arranged at equal intervals.
[0064] In the present embodiment, the second refrigerant R2 flows in the heat transfer tube 91 at least in a partial region of the storage region 72 in a direction opposite to a flow direction of the first refrigerant R1. (Circulation of the first refrigerant)
[0065] The circulation of the first refrigerant R1 in the immersion cooling device 10 is described below.
[0066] First, during operation of the refrigerant pump unit 15, the first refrigerant R1 is supplied from the supply-side header 60 to each of the inclined casings 31. In this case, the first refrigerant R1 is injected into the inclined casing 31 through a plurality of nozzles 12. The first refrigerant R1 flows into each of the inclined casings 31 in the front-to-back direction Da as a jet. The first refrigerant R1 in the inclined casing 31 flows into the server casing 40, passes through the heating element 3, and exchanges heat with the heating element 3. This cools the heating element 3. On the other hand, the first refrigerant R1 is heated by the heat absorption of the heating element 3. Subsequently, the first refrigerant R1 is discharged from the server casing 40 and introduced from each of the inclined casings 31 into the discharge-side header 70.The first refrigerant R1 flows from the top to the bottom of the discharge side collector 70 due to the pressure of the refrigerant pump unit 15 and its own weight. The first refrigerant R1 is then temporarily stored in the storage area 72 of the discharge side collector 70.
[0067] Meanwhile, the second refrigerant R2 flows in the heat transfer tube 91 towards Dw.
[0068] The first refrigerant R1 exchanges heat with the second refrigerant R2 as it flows through the discharge side collector 70. This cools the first refrigerant R1 and heats the second refrigerant R2. After exchanging heat with the first refrigerant R1, the second refrigerant R2 is fed into the external heat exchanger 4. The second refrigerant R2 is cooled by the heat exchanger 4 and fed back to the respective heat transfer tube 91.
[0069] When the first refrigerant R1 is cooled by heat exchange with the second refrigerant R2, the first refrigerant R1 is pumped again by the refrigerant pump unit 15 to the supply-side header 60. Subsequently, the first refrigerant R1 is supplied again to the inclined housing 31 as described above. In this way, the first refrigerant R1 circulates in the immersion cooling device 10. (Operation and effects)
[0070] With the immersion cooling device 10 according to the present embodiment, the following operations and effects are observed.
[0071] In the present embodiment, the immersion cooling device 10 includes the case group 30 configured by arranging the inclined cases 31, each of which can accommodate the heating element 3, in the up-down direction, the supply-side header 60 extending in the up-down direction on the second side D2 in the horizontal direction of the case group 30 and capable of introducing the first refrigerant R1 into each of the inclined cases 31, and the discharge-side header 70 extending in the up-down direction on the first side D1 in the horizontal direction of the case group 30 and receiving the introduction of the first refrigerant R1 from each of the inclined cases 31. The inclined case 31 extends downward toward the first side D1 in the horizontal direction.
[0072] The housing group 30 is configured by arranging the plurality of inclined housings 31 in the up-down direction. This makes it possible to prevent the plurality of inclined housings 31 from being randomly arranged and spreading in the horizontal direction and to improve the arrangement efficiency.
[0073] Furthermore, since each of the inclined casings 31 extends downward toward the first side D1 in the horizontal direction, the first refrigerant R1 can flow smoothly in the horizontal direction in the inclined casing 31. As a result, the immersion cooling device 10 can quickly discharge the first refrigerant R1, which has absorbed heat from the heating element 3, to the discharge-side header 70, thereby improving the cooling efficiency.
[0074] In the present embodiment, the immersion cooling device 10 further includes the plurality of supply-side connecting pipes 13 that connect the supply-side header 60 and each of the inclined casings 31 to each other in a state where the supply-side header 60 and each of the inclined casings 31 are connected to each other, and the valve 14 that is provided for each of the inclined casings 31 and that can open and close the supply-side connecting pipes 13.
[0075] This makes it possible to easily cut off the supply of the first refrigerant R1 to the inclined casing 31 connected to the supply-side connection line 13 by operating the valve 14 to block the supply-side connection line 13. Therefore, it is possible to easily remove each inclined casing 31. Thus, each of the inclined casings 31 can be easily removed and serviced.
[0076] In the present embodiment, the immersion cooling device 10 further includes the backflow prevention door 50 provided in each of the inclined cases 31, which blocks the flow channel of the first refrigerant R1 and which opens the flow channel of the first refrigerant R1 in a case where the external force equal to or greater than the predetermined magnitude acts toward the first side D1 in the horizontal direction.
[0077] Thus, in the inclined housing 31, the first refrigerant R1 can be prevented from flowing back to the second side D2 in the horizontal direction without preventing the first refrigerant R1 from flowing to the first side D1 in the horizontal direction.
[0078] In the present embodiment, the discharge-side header 70 is provided with the inflow port 73 at the position corresponding to each of the inclined casings 31, through which the first refrigerant R1 introduced from the inclined casing 31 flows. The immersion cooling device 10 further includes the backflow prevention cover 80 provided at the position corresponding to each inflow port 73 in the discharge-side header 70, and covering the inflow port 73 from above and from the first side D1 in the horizontal direction with a gap.
[0079] This makes it possible to prevent the first refrigerant R1 from flowing back into the inclined housing 31 in a process in which the first refrigerant R1 flows downward in the discharge side header 70, without preventing the first refrigerant R1 from flowing out of the inclined housing 31 toward the discharge side header 70.
[0080] As described above, the first refrigerant R1 flows more smoothly in the inclined housing 31 because it is prevented from flowing back by the backflow prevention door 50 or the backflow prevention cover 80 in the immersion cooling device 10. Therefore, the immersion cooling device 10 can more quickly discharge the first refrigerant R1, which has absorbed heat from the heating element 3, to the discharge-side header 70, thereby further improving the cooling efficiency.
[0081] As in the present embodiment, by providing the valve 14, the backflow prevention door 50, and the backflow prevention cover 80 in the immersion cooling device 10, it is possible to stop the flow of the first refrigerant R1 in each of the inclined casings 31 without stopping the entire flow of the first refrigerant R1 in the immersion cooling device 10. This makes it possible to individually remove the server 1 housed in the inclined casing 31 and to individually maintain the server 1.
[0082] In the present embodiment, the immersion cooling device 10 further includes the frame 20 in which the housing assembly 30 is housed. The frame 20 has an inlet door 22 that can open and close a space in the frame 20 on the second side D2 in the horizontal direction. The supply-side collector 60 is provided in the inlet door 22.
[0083] When the inlet door 22 is opened, the feed side collector 60 also moves with the inlet door 22. Therefore, the inclined housing 31 can be easily removed. As a result, it is easier to remove the server 1 and perform maintenance for each of the inclined housings 31.
[0084] In the present embodiment, the heat exchanger unit 90 is arranged below the housing group 30.
[0085] Thereby, it is possible to cool the first refrigerant R1 through the heat exchanger 4 without filling the supply side header 60 and the discharge side header 70 with the first refrigerant R1, and thus to reduce an amount of the first refrigerant R1.
[0086] In the present embodiment, the immersion cooling device 10 further includes the nozzle 12 provided in each of the inclined housings 31 and ejecting the first refrigerant R1 supplied from the supply side header 60.
[0087] As a result, the immersion cooling device 10 can generate convection in the first refrigerant R1 in the inclined housing 31 through the jet of the nozzle 12, while the first refrigerant R1 flows smoothly due to the inclination of the inclined housing 31. This improves the efficiency of heat exchange between the heating element 3 and the first refrigerant R1, thereby further increasing the cooling efficiency.
[0088] In the present embodiment, the immersion cooling device 10 further includes the sealing portions 11 provided in the end portions of each of the inclined casings 31 on the first side D1 in the horizontal direction and on the second side D2 in the horizontal direction, and which suppress the leakage of the first refrigerant R1.
[0089] Thereby, the leakage of the first refrigerant R1 is suppressed when the first refrigerant R1 is introduced into the inclined housing 31 and when the first refrigerant R1 is discharged from the inclined housing 31, so that the amount of the first refrigerant R1 used can be reduced. (Other embodiments)
[0090] Although the embodiment of the present disclosure has been described in detail above with reference to the drawings, the specific configuration is not limited to this embodiment, and design changes and the like that do not deviate from the gist of the present disclosure are also included.
[0091] In the above-described embodiment, the heat exchange unit 90 is disposed in the storage area 72 of the discharge-side header 70, but the present disclosure is not limited thereto. The heat exchange unit 90 may be provided directly below the case assembly 30 and may exchange heat between the first refrigerant R1 and the second refrigerant R2 in the first connecting pipe 16 and the second connecting pipe 17 connecting the supply-side header 60 and the discharge-side header 70.
[0092] Furthermore, in the embodiment described above, the heat exchange unit 90 is the plurality of heat transfer tubes 91 penetrating the storage area 72 in the width direction Dw, but the present disclosure is not limited thereto. The heat exchange unit 90 may be, for example, the heat transfer tube 91 extending in the up-down direction into the discharge-side header 70. In this case, the backflow prevention door 50 and the backflow prevention cover 80 need not be provided. When the backflow prevention door 50 and the backflow prevention cover 80 are not provided, the first refrigerant R1 is directly blown from the inclined housing 31 to the heat transfer tube 91, so that the heat exchange efficiency between the first refrigerant R1 and the second refrigerant R2 can be improved.
[0093] Furthermore, in the above-described embodiment, the second refrigerant R2 in the heat transfer tube 91 flows in the counterflow direction opposite to the flow direction of the first refrigerant R1 in at least a portion of the storage region 72, but the present disclosure is not limited thereto. The second refrigerant R2 in the heat transfer tube 91 may flow in the same direction as the first refrigerant R1 in the storage region 72, and the flow of the second refrigerant R2 in the heat transfer tube 91 may be adjusted without considering the flow of the first refrigerant R1. <Ergänzende Anmerkung>
[0094] The immersion cooling device 10 described in each embodiment is to be understood, for example, as follows
[0095] (1) A first aspect relates to an immersion cooling device 10 that cools a heating element 3 provided on a circuit board 2, the immersion cooling device 10 comprising a case group 30 having inclined cases 31, each of which has a box shape extending downward toward a first side D1 in a horizontal direction and each of which is configured to accommodate the heating element 3, and is configured by arranging the inclined cases 31 in an up-down direction; a supply-side header 60 extending in the up-down direction on a second side D2 in the horizontal direction of the case group 30 and configured to introduce a first refrigerant R1 into each of the inclined cases 31;a discharge-side header 70 extending in the up-down direction on the first side D1 in the horizontal direction of the case group 30 and configured to receive the introduction of the first refrigerant R1 from each of the inclined cases 31; a refrigerant pump unit 15 configured to pump the first refrigerant R1 from the discharge-side header 70 to the supply-side header 60; and a heat exchanger unit 90 configured to cool the first refrigerant R1 by exchanging heat between an externally supplied second refrigerant R2 and the first refrigerant R1.
[0096] The casing group 30 is configured by arranging a plurality of inclined casings 31 in the up-down direction. Furthermore, since each of the inclined casings 31 extends downward toward the first side D1 in the horizontal direction, the first refrigerant R1 can flow smoothly in the horizontal direction in the inclined casing 31.
[0097] (2) A second aspect relates to the immersion cooling device 10 according to (1), which may further include: a plurality of supply-side connecting lines 13 configured to connect the supply-side header 60 and each of the inclined casings 31 to each other in a state where the supply-side header 60 and each of the inclined casings 31 are connected to each other; and a valve 14 provided for each of the inclined casings 31 and configured to open and close the supply-side connecting lines 13.
[0098] This makes it possible to easily cut off the supply of the first refrigerant R1 to the inclined casing 31 connected to the supply-side connecting pipe 13 by operating the valve 14 to block the supply-side connecting pipe 13. Therefore, it is possible to easily remove each inclined casing 31.
[0099] (3) A third aspect relates to the immersion cooling device 10 according to (1) or (2), which may further comprise: a backflow prevention door 50 provided in each of the inclined cases 31, which is configured to block a flow channel of the first refrigerant R1, and which is configured to open the flow channel of the first refrigerant R1 in a case where an external force equal to or greater than a predetermined magnitude is applied in a direction of the first side D1 in the horizontal direction.
[0100] Thus, in the inclined housing 31, the first refrigerant R1 can be prevented from flowing back to the second side D2 in the horizontal direction without preventing the first refrigerant R1 from flowing to the first side D1 in the horizontal direction.
[0101] (4) A fourth aspect relates to the immersion cooling device 10 according to any one of aspects (1) to (3), in which the discharge-side headers 70 may be provided with an inflow port 73 through which the first refrigerant R1 introduced from the inclined casings 31 flows at a position corresponding to each of the inclined casings 31, and the immersion cooling device 10 may further include a backflow prevention cover 80 provided at a position corresponding to each inflow port 73 in the discharge-side header 70 and configured to cover the inflow port 73 with a gap from above and from the first side D1 in the horizontal direction.
[0102] This can prevent the first refrigerant R1 from flowing back into the inclined housing 31 in a process in which the first refrigerant R1 flows downward in the discharge side header 70, without the first refrigerant R1 being discharged from the inclined housing 31 toward the discharge side header 70.
[0103] (5) A fifth aspect relates to the immersion cooling device 10 according to any one of aspects (1) to (4), which may further comprise: a frame 20 configured to accommodate the housing group 30, the frame 20 having an inlet door 22 configured to open and close a space in the frame 20 on the second side D2 in the horizontal direction, and the supply side collector 60 is provided on the inlet door 22.
[0104] When the inlet door 22 is opened, the feed side collector 60 also moves with the inlet door 22. Therefore, the inclined housing 31 can be easily removed.
[0105] (6) A sixth aspect relates to the immersion cooling device 10 according to any one of the aspects (1) to (5), in which the heat exchanger unit 90 can be arranged below the housing group 30.
[0106] This makes it possible to cool the first refrigerant R1 through the heat exchanger 4 without filling the supply side collector 60 and the discharge side collector 70 with the first refrigerant R1.
[0107] (7) A seventh aspect relates to the immersion cooling device 10 according to any one of the aspects (1) to (6), which may further comprise: a nozzle 12 provided in each of the inclined housings 31 and configured to jet the first refrigerant R1 supplied from the supply-side header 60.
[0108] Thereby, the immersion cooling device 10 can generate convection in the first refrigerant R1 in the inclined housing 31 through the jet of the nozzle 12, while the first refrigerant R1 flows evenly due to the inclination of the inclined housing 31.
[0109] (8) An eighth aspect relates to the immersion cooling device 10 according to any one of the aspects (1) to (7), which may further comprise: sealing portions 11 provided in end portions of each of the inclined casings 31 on the first side D1 in the horizontal direction and on the second side D2 in the horizontal direction and configured to prevent leakage of the first refrigerant R1.
[0110] Thereby, the leakage of the first refrigerant R1 is suppressed when the first refrigerant R1 is introduced into the inclined housing 31 and the first refrigerant R1 leaks from the inclined housing 31. INDUSTRIAL APPLICABILITY
[0111] With the immersion cooling device according to the present disclosure, the disposition and cooling efficiency can be improved. REFERENCE SYMBOL LIST 1 server 2 circuit boards 3 heating element 4 heat exchangers 10 Immersion cooling device 11 Sealing area 12 nozzles 13 Supply side connection line 14 Valve 15 Refrigerant pump unit 16 First connecting pipe 17 Second connecting pipe 20 frame 21 frame body 21a Upper Wall 21b Lower Wall 21c side wall 21d Inlet side opening area 21e Exhaust side opening area 21f edge 21g edge Since front-back direction Dw latitude direction D1 First page in horizontal direction D2 Second side in horizontal direction 22 Entrance door 23 Outlet door 24 support column 24a First support column 24b Second support column 25 carriers 25a First Carrier 25b Second carrier 25c Upper surface 25d Upper surface 30 Housing group 31 Slanted housing 32 housing bodies 32a First opening area 32b Second opening area 32c side wall 32d Upper Wall 33 Flange 34 feed side distributors 35 rail 36 distribution housings 37 Lid area 38 Introduction area 39 Panel material 40 server chassis 41 Front wall 41a insertion hole 42 rear wall 42a Drain opening 43 Side wall 44 Guide 50 Backflow prevention door 51 Hinge 52 Backflow prevention door housing 60 feed side collectors 70 side collectors 71 Discharge side collector body 72 memory area 73 Inlet connection 80 Backflow prevention cover 81 Upper Wall 82 rear wall 90 heat exchanger unit 91 Heat transfer tube R1 First refrigerant R2 Second refrigerant A angle of inclination Since front-back direction D1 First page in horizontal direction D2 Second side in horizontal direction Dw latitude direction QUOTES CONTAINED IN THE DESCRIPTION
[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature
[0000] JP 2022-117547
[0002] WO 2016 / 075838
[0004]
Claims
[1] An immersion cooling device that cools a heating element provided on a circuit board, the immersion cooling device comprising: a housing group including inclined housings, each having a box shape extending downward to a first side in a horizontal direction, and each configured to accommodate the heating element and configured by arranging the inclined housings in an up-down direction; a supply side header extending in the up-down direction on a second side in the horizontal direction of the shell group and configured to introduce a first refrigerant into each of the inclined shells; a discharge side header extending in the up-down direction on the first side in the horizontal direction of the shell group and configured to receive the introduction of the first refrigerant from each of the inclined shells; a refrigerant pump unit configured to pump the first refrigerant from the discharge side to the supply side receiver; and a heat exchanger unit configured to cool the first refrigerant by heat exchange between a second refrigerant supplied from the outside and the first refrigerant. [2] The immersion cooling device according to claim 1, further comprising: a plurality of supply-side connecting lines configured to connect the supply-side collector and each of the inclined housings to each other in a state where the supply-side collector and each of the inclined housings communicate with each other; and a valve provided for each of the inclined housings and configured to open and close the supply side connecting lines. [3] The immersion cooling device according to claim 1 or 2, further comprising: a backflow prevention door provided in each of the inclined cases, which is configured to block a flow channel of the first refrigerant and is configured to open the flow channel of the first refrigerant in a case where an external force equal to or greater than a predetermined magnitude is applied in a direction of the first side in the horizontal direction. [4] The immersion cooling device according to claim 1 or 2, wherein the discharge side header is provided with an inflow port through which the first refrigerant introduced from the inclined casings flows, at a position corresponding to each of the inclined casings, and the immersion cooling device further comprises a backflow prevention cover provided at a position corresponding to each inflow port in the discharge side header and configured to cover the inflow port with a gap from above and from the first side in the horizontal direction. [5] The immersion cooling device according to claim 1 or 2, further comprising: a frame configured to accommodate the housing group, wherein the frame has an inlet door configured to open and close a space in the frame on the second side in the horizontal direction, and the feed side collector is attached to the inlet door. [6] The immersion cooling device according to claim 1 or 2, wherein the heat exchanger unit is arranged below the housing group. [7] The immersion cooling device according to claim 1 or 2, further comprising: a nozzle provided in each of the inclined casings and configured to eject the first refrigerant supplied from the supply side header. [8] The immersion cooling device according to claim 1 or 2, further comprising: Sealing portions provided in end portions of each of the inclined casings on the first side in the horizontal direction and on the second side in the horizontal direction, and configured to prevent leakage of the first refrigerant.
Citation Information
Patent Citations
2022-117547
Cooling system and cooling method for electronic apparatus
WO2016075838A1