Optical splitter and optical network system

Abstract

Optical splitter (20), comprising a housing, a circuit board (207), an input interface, a voltage transformation module (209), a shunt module, an optical splitting module (206), and at least two photoelectric output interfaces (205), wherein the circuit board (207) is arranged in the housing and the input interface, the voltage transformation module (209), the shunt module, and the at least two photoelectric output interfaces (205) are all arranged on the circuit board (207); the optical splitting module (206) is arranged in the housing and is connected to the input interface and the photoelectric output interfaces (205) by an optical fiber; the housing and the circuit board (207) enclose a first space and a second space, the first space and the second space are separated by the housing, at least a part of the input interface and the voltage transformation module (209) are arranged in the first space, and the shunt module and the at least two photoelectric output interfaces (205) are arranged in the second space; and the input interface is configured to receive an external optical signal and external electrical energy; the voltage transformation module (209) is configured to perform voltage balancing on the external electrical energy and convert the external electrical energy into output electrical energy; the shunt module is configured to shunt the output electrical energy into at least two paths of output electrical energy; the optical splitting module (206) is configured to split the external optical signal into at least two beams of output optical signals; and each photoelectric output interface (205) is configured to output one path of output electrical energy and one beam of output optical signal.

Description

[0001] This application claims priority to Chinese Patent Application No. 202222242549.4, filed with the China National Intellectual Property Administration on August 24, 2022, entitled “OPTICAL SPLITTER AND OPTICAL NETWORK SYSTEM,” which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] This application relates to the field of optical communications and, in particular, to an optical splitter and an optical network system. BACKGROUND

[0003] With the proliferation of fiber-to-the-room (FTTR) services, a growing number of point-to-multipoint (P2MP) optical fiber network solutions are being deployed in the home. As a passive component implementing P2MP optical splitting technology, an optical splitter plays a key role. The optical splitter splits a coupled downlink signal among multiple optical network units (ONTs) and sends an uplink signal to an optical line terminal (OLT).

[0004] Both the input and output of an existing optical splitter are pure optical signals, and an output port of the optical splitter can only provide the pure optical signal and cannot provide electrical power to a lower-level device. When the lower-level device is active, the lower-level device must independently obtain local power. In this case, a plurality of cables are interlaced and used around the lower-level device, resulting in a poor product experience. Therefore, this type of optical splitter is generally used in a feeder section or a distribution section and is not used at a user access point. A usage scenario is limited. SUMMARY

[0005] Technical solutions of this application provide an optical splitter and an optical network system. The optical splitter can provide an optical signal and electrical power to a lower-level device, eliminating the need for the lower-level device to receive additional local power, thereby improving the product experience and expanding the applicable scenarios of the optical splitter.

[0006] According to a first aspect, a technical solution of this application provides an optical splitter including a housing, a circuit board, an input interface, a voltage transformation module, a shunt module, an optical splitting module, and at least two photoelectric output interfaces. The circuit board is arranged in the housing, and the input interface, the voltage transformation module, the shunt module, and the at least two photoelectric output interfaces are all arranged on the circuit board. The optical splitting module is arranged in the housing and is connected to the input interface and the photoelectric output interfaces by an optical fiber.The housing and the circuit board enclose a first space and a second space, the first space and the second space are separated by the housing, at least a portion of the input interface and the voltage transformation module are arranged in the first space, and the shunt module and the at least two photoelectric output interfaces are arranged in the second space. The input interface is configured to receive an external optical signal and external electrical power. The voltage transformation module is configured to perform voltage balancing on the external electrical power and convert the external electrical power into output electrical power. The shunt module is configured to shunt the output electrical power into at least two paths of output electrical power.The optical splitting module is configured to split the external optical signal into at least two beams of optical output signals. Each photoelectric output interface is configured to output one path of electrical output energy and one beam of optical output signal.

[0007] In this solution, the housing may be an optical splitter housing. The circuit board and each component on the circuit board may be mounted in the housing, wherein the input interface may be completely concealed within the housing or a portion of the input interface may be exposed by the housing; and the photoelectric output interface may be completely concealed within the housing or a portion of the photoelectric output interface may be exposed by the housing. The input interface may be a single component and may implement a composite input of an optical signal and electrical power; or the input interface may include several separate components, and the different components each implement an input of an optical signal and an input of electrical power.The external electrical power received through the input interface can be transmitted to the voltage transformation module through a circuit on the circuit board, and the voltage transformation module performs voltage equalization processing on the external electrical power to obtain the output electrical power. The output electrical power can be transmitted to the shunt module through the circuit on the circuit board, and the shunt module shunts the output electrical power into a plurality of output electrical power paths.The photoelectric output interface is a single component and can implement a composite output of an optical signal and electrical energy, wherein a path of electrical output energy can be transmitted through the circuitry on the circuit board to a photoelectric output interface and output through the photoelectric output interface; and a beam of optical output signal can be transmitted through the optical fiber to a photoelectric output interface and output through the photoelectric output interface.

[0008] In this solution, when an optical signal and electrical power need to be output externally, a photoelectric connector of an external device can be inserted into the photoelectric output interface to transmit the optical output signal and electrical power to the external device. Therefore, in this solution, the optical signal can be provided to the external device and the electrical power can also be input to the external device. In this way, the external device does not need to receive additional local power, thereby avoiding cable entanglement around the external device and improving the user experience. In addition, the optical splitter in this solution can be used not only in a feeder section or a distribution section, but can also be used at a user access point and is applicable to various scenarios.

[0009] In this solution, the housing and the circuit board enclose the first space and the second space, and the first space and the second space are separated by a structure on the housing. The first space can be arranged on one side or two sides of the circuit board, and the first space can not be connected from the outside. The second space can be arranged on one side or two sides of the circuit board. At least part of the input interface and the voltage transformation module are arranged in the first space, and the shunt module and the at least two photoelectric output interfaces are arranged in the second space. Both the input interface and the voltage transformation module are high-voltage components, and both the shunt module and the photoelectric output interface are low-voltage components.This solution can separate the high voltage components from the low voltage components to meet safety requirements.

[0010] In an implementation of the first aspect, the input interface includes an electrical input interface and an optical input interface, the electrical input interface is arranged in the first space and the optical input interface is arranged in the second space; the electrical input interface is configured to receive the external electrical power, and the optical input interface is configured to receive the external optical signal; and the optical splitting module is connected to the optical input interface through the optical fiber.

[0011] In this solution, the input interface includes an independent electrical input interface and an independent optical input interface. The electrical input interface implements the input of external electrical power, and the optical input interface implements the input of external optical signals. The electrical input interface and the optical input interface are separated. This solution can meet product requirements and meet the safety requirements of high-voltage components.

[0012] In an implementation of the first aspect, the input interface includes a first photoelectric composite adapter and a first photoelectric connector that are attached, and the first photoelectric composite adapter is attached to the circuit board; the first photoelectric connector is connected to the circuit board and is connected to the optical splitting module through the optical fiber; and the first photoelectric connector is configured to receive the external optical signal and the external electrical power.

[0013] In this solution, the input interface is a single component and can implement a composite input of a photoelectric signal. The first photoelectric composite adapter can mount and receive the first photoelectric connector. For example, the first photoelectric connector can be inserted into one end of the first photoelectric composite adapter. The photoelectric connector of the external device can be inserted into the other end of the first photoelectric composite adapter and is connected to the first photoelectric connector to transmit the photoelectric signal. The first photoelectric connector is a component located in the input interface that implements a composite photoelectric input.An optical transmission structure (including, for example, a ferrule) and an electrical transmission structure (including, for example, an electrode) can be incorporated into the first photoelectric connector. The optical transmission structure can accommodate and secure the optical fiber connected to the optical splitter module to transmit the external optical signal to the optical splitter module. The electrical transmission structure can be connected to the circuit board to transmit the external electrical power. This solution can meet product requirements and comply with the safety requirements of high-voltage components.

[0014] In an implementation of the first aspect, each photoelectric output interface includes a second photoelectric composite adapter and a second photoelectric connector that are attached, and the second photoelectric composite adapter is attached to the circuit board; the second photoelectric connector is connected to the circuit board and is connected to the optical splitting module through the optical fiber; and the second photoelectric connector is configured to output a path of output electrical energy and a beam of output optical signal.

[0015] In this solution, the second photoelectric composite adapter can secure and accommodate the second photoelectric connector. For example, the second photoelectric connector can be inserted into one end of the second photoelectric composite adapter. The photoelectric connector of the external device can be inserted into the other end of the second photoelectric composite adapter and is connected to the second photoelectric connector to transmit the photoelectric signal. The second photoelectric connector is a component located in the photoelectric output interface and that implements a photoelectric composite output. An optical transmission structure (including, for example, a ferrule) and an electrical transmission structure (including, for example, an electrode) can be incorporated into the second photoelectric connector.The optical transmission structure can accommodate and secure the optical fiber connected to the optical splitter module to receive an optical output signal beam from the optical splitter module. The electrical transmission structure can be connected to the circuit board and receive an output electrical power path through the circuit board. This solution can meet product requirements and comply with the safety requirements of high-voltage components.

[0016] In an implementation of the first aspect, the optical splitter includes a display, the display being electrically connected to the circuit board, and the display being configured to emit light that can propagate to the exterior of the housing.

[0017] In this solution, the display is electrically connected to the circuit board and is configured to control light emission to indicate an operating state of the optical splitter. A display hole may be provided on the housing, and the light emitted by the display may be emitted through the display hole. For example, a first display may be arranged to indicate an electrical power input state and / or an electrical power output state. For example, a photoelectric conversion device and a second display may be arranged. The photoelectric conversion device may be arranged on the circuit board and connected to the optical splitter module, and the photoelectric conversion device is configured to convert an optical signal of the optical splitter module into an electrical signal.The second display may be electrically connected to the photoelectric conversion device through the circuit board, and the second display is configured to display an input state and / or an output state of the optical signal. This solution can implement an intuitive display of an operating state of the optical splitter.

[0018] In an implementation of the first aspect, the voltage transformation module includes a heat-generating component and a heat-dissipating piece, and the heat-generating component is connected to the heat-dissipating piece in a fixing manner; and the heat-generating component is connected to the circuit board, and the heat-dissipating piece is connected to the circuit board.

[0019] In this solution, the heat-generating component can be a component, such as a MOS transistor, that generates significant heat during operation and needs to dissipate heat. The heat dissipation pad plays a role in securing the MOS transistor. Additionally, the heat dissipation pad has good heat dissipation performance. After connecting to the circuit board, the heat dissipation pad can transfer heat to the circuit board to dissipate heat through the circuit board with a large heat dissipation area, thereby improving the heat dissipation performance of the heat-generating component and ensuring that the heat-generating component can operate reliably.

[0020] In an implementation of the first aspect, the housing includes a peripheral sidewall and a bottom wall, wherein the peripheral sidewall surrounds a peripheral edge of the bottom wall; a separation rib is disposed on an inner side of the bottom wall and an upper surface of the separation rib faces the circuit board; and the bottom wall, the separation rib, the circuit board, and the peripheral sidewall enclose the first space and the second space, and the first space and the second space are separated by the separation rib.

[0021] In this solution, the peripheral sidewall surrounds the peripheral edge of the bottom wall and is connected to the bottom wall. The separation rib may be convexly arranged on an inner surface of the bottom wall, there may be one or more separation ribs, and the separation rib may be arranged on one side or two sides of the circuit board. The upper surface of the separation rib refers to a surface of the separation rib on a side opposite to a root of the separation rib, and the upper surface may be in contact with the circuit board, or there may be a gap between the upper surface and the circuit board. In this solution, the first space and the second space are enclosed by the bottom wall, the separation rib, the circuit board, and the peripheral sidewall, and the separation rib separates the first space and the second space.This solution implements the isolation between the high-voltage components and the low-voltage components through a simple structure and has good reliability and good mass production performance.

[0022] In an implementation of the first aspect, the bottom wall includes a first bottom wall and a second bottom wall opposite each other, and the peripheral side wall is disposed between the first bottom wall and the second bottom wall; the separation ribs include a first separation rib and a second separation rib, the first separation rib is disposed on an inner side of the first bottom wall, and the second separation rib is disposed on an inner side of the second bottom wall; both the voltage transformation module and the shunt module are disposed on two opposite sides of the circuit board;the circuit board is arranged between the first separation rib and the second separation rib, the first bottom wall, the first separation rib, the circuit board, the second separation rib, the second bottom wall and the peripheral side wall enclose the first space and the second space, and both the first space and the second space are distributed on the two opposite sides of the circuit board; on one side of the circuit board, the first space and the second space are separated by the first separation rib; and on the other opposite side of the circuit board, the first space and the second space are separated by the second separation rib.;

[0023] In this solution, the peripheral side wall is connected between the first bottom wall and the second bottom wall. The first separation rib and the second separation rib are respectively arranged on the two opposite sides of the circuit board, and the first separation rib and the second separation rib may substantially overlap or may be staggered. The first separation rib separates a space on one side of the circuit board, and the second separation rib separates a space on the other side of the circuit board. Both the high-voltage component and the low-voltage component can be arranged on the two opposite sides of the circuit board, allowing the high-voltage component and the low-voltage component to be separated on each side of the circuit board, thus ensuring safety requirements.

[0024] In an implementation of the first aspect, the housing is provided with an input through-hole and at least two output through-holes, the input interface receives the external optical signal and the external electrical power through the input through-hole, and a photoelectric output interface outputs a path of electrical output power and a beam of optical output signal, respectively, through an output through-hole; and a positioning rib is arranged on an inner wall of the housing, and the positioning rib abuts a side that is from the input interface and that is remote from the circuit board, and / or the positioning rib abuts a side that is from each photoelectric output interface and that is remote from the circuit board.

[0025] In this solution, the positioning rib can abut the input interface and / or the photoelectric output interface so that the input interface is aligned with the input through-hole and / or the photoelectric output interface is aligned with the output through-hole, thereby avoiding inaccurate alignment caused by unevenness of the input interface and / or unevenness of the photoelectric output interface.

[0026] In an implementation of the first aspect, a restriction structure is arranged in the housing, the restriction structure including a restriction portion and a connecting portion, the connecting portion connecting the restriction portion and the inner wall of the housing, and a gap being formed between the restriction portion and the inner wall; and the optical splitting module is clamped and mounted in the gap.

[0027] In this solution, the limiting structure can be similar to a chair back, and the connecting portion can be similar to a chair surface. The gap between the limiting structure and the inner wall of the housing can be used to mount the optical splitting module, and the limiting structure can clamp and limit the optical splitting module. In this solution, the optical splitting module is mounted in the housing using a simple design with good mass production performance.

[0028] In an implementation of the first aspect, the optical splitter includes a fiber restriction base configured to restrict the optical fiber, and the fiber restriction base is fixed to the circuit board; and a support member is arranged on the inner wall of the housing, the support member and the fiber restriction base are respectively arranged on the two opposite sides of the circuit board, and the support member abuts the circuit board.

[0029] In this solution, a plurality of fiber restraint bases can be mounted along a fiber winding path on the circuit board, and optical fibers are clamped and fixed in the fiber restraint bases to restrain the optical fibers along the fiber winding path. The number and position of fiber restraint bases can be properly adjusted based on requirements to prevent damage to the optical fibers during assembly. The support member can correspond to a mounting position of the fiber restraint base on the circuit board, and the support member can provide structural support on the circuit board to prevent stress generated by inserting and mounting the fiber restraint base from damaging stress-sensitive components on the circuit board.

[0030] According to a second aspect, a technical solution of this application provides an optical network system including an optical line terminal, at least two optical network units, and the optical splitter according to any one of the above, wherein the optical line terminal is configured to provide an external optical signal; and an optical network unit is connected to a photoelectric output interface, respectively, and an optical network unit is configured to receive a path of output electrical energy and a beam of output optical signal.

[0031] In this solution, the optical network system may be an FTTR system and may be used in a P2MP optical fiber network solution. The optical network system may be part of an access network, and the optical network system may perform signal interaction with a public switched telephone network (PSTN) and an IP backbone network in a core network through the optical line connector. The optical line connector is configured to deliver a downlink signal (including, but not limited to, a voice signal, a video signal, a data signal, and the like). The optical network unit is located near a user side and is configured to receive an optical signal and electrical power from the optical splitter.In this solution, the optical splitter can provide the optical signal and electrical power to the optical network unit, so that the optical network unit does not need to receive additional local power, thereby improving the product experience. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic diagram of a frame structure of an optical network system according to an embodiment of this application; Fig. 2 is a schematic diagram of an assembled structure of the optical splitter in Fig. 1; Fig. 3 is a schematic representation of a hierarchical structure of the optical splitter in Fig. 2; Fig. 4 is a schematic diagram of a structure of an upper case of the optical splitter in Fig. 3; Fig. 5 is a schematic representation of a partially enlarged structure at a position A in Fig. 4; Fig. 6 is a schematic representation of a partially enlarged structure at a position B in Fig. 4; Fig. Fig. 7 is a schematic diagram of a structure of a lower case of the optical splitter in Fig. 3; Fig. Fig. 8 is a schematic diagram of a structure of a lower case of the optical splitter in Fig. 3; Fig. 9 is a schematic representation of a partially enlarged structure at a position C in Fig. 8; Fig. 10 is a schematic diagram showing a fitting structure of an upper case and a lower case of an optical splitter; Fig. 11 is a schematic diagram of a structure of a circuit board assembly of the optical splitter in Fig. 3; Fig. 12 is a schematic diagram of a structure of a photoelectric output interface in Fig. 11; Fig. 13 is a schematic diagram of an exploded structure of the photoelectric output interface in Fig. 12; Fig. 14 shows a functional frame structure of an optical splitter according to an embodiment of this application; and Fig. 15 is a schematic cross-sectional view of a structure of an optical splitter according to an embodiment of this application. DESCRIPTION OF EMBODIMENTS

[0032] As in Fig. 1, an embodiment of this application provides an optical network system 1. The optical network system 1 may be an FTTR system and may be used in a P2MP optical fiber network solution.

[0033] For example, the optical network system 1 may include an optical line connector 30, an optical splitter 20, and a plurality of optical network units 10 ( Fig. 1 schematically shows three optical network units 10. The optical splitter 20 may be connected to the optical line port 30 and the optical network unit 10. The optical splitter 20 is configured to split a downlink signal (including, but not limited to, a voice signal, a video signal, a data signal, and the like) of the optical line port 30 to each optical network unit 10, wherein the optical splitter 20 may output an optical signal and electrical power to the optical network unit 10 (which will be described further below). The optical splitter 20 is further configured to send an uplink signal (including, but not limited to, a voice signal, a video signal, a data signal, and the like) of each optical network unit 10 to the optical line port 30.

[0034] For example, the optical network system 1 may belong to an access network, and the optical network system 1 may perform signal interaction with a public switched telephone network (PSTN) and an IP backbone network in a core network through the optical line port 30.

[0035] In one embodiment, as in Fig. 2 and Fig. 3, the optical splitter 20 may include an upper housing 201, a lower housing 202, a circuit board 207, a fiber confinement base 208, a voltage transformation module 209, an electrical input interface 210, an optical input interface 203, a cascading interface 204, a photoelectric output interface 205, and an optical splitting module 206. The upper housing 201 and the lower housing 202 may form a housing, and the upper housing 201 and the lower housing 202 are assembled together to form a receiving cavity. The circuit board 207, the fiber restriction base 208, the voltage transformation module 209, the electrical input interface 210, the optical input interface 203, the cascading interface 204, the photoelectric output interface 205, and the optical splitting module 206 can all be mounted in the receiving cavity.The electrical input interface 210 and the optical input interface 203 may be collectively referred to as an input interface. A description will be given sequentially below.

[0036] As in Fig. 3 and Fig. For example, as shown in Figure 4, the upper housing 201 may include a first bottom wall 201a, and the first bottom wall 201a may be approximately plate-shaped. There may be no hole on the first bottom wall 201a. A plurality of first buckles 201b may be arranged on a peripheral edge of an inner side (a side located away from the first bottom wall 201a and located near the lower housing 202) of the first bottom wall 201a. The first buckle 201b may form a buckle connection with a second buckle (described below) on the lower housing 202. The buckle connection may be a detachable connection for opening the housing of the optical splitter 20 for maintenance.

[0037] As in Fig. 4, for example, a first positioning rib 201e and a second positioning rib 201d may be further arranged on the inside of the first bottom wall 201a. Fig. 5 and Fig. 6 show partially enlarged structures of the first positioning rib 201e and the second positioning rib 201d. As in Fig. 5 and Fig. As shown in Figure 6, both the first positioning rib 201e and the second positioning rib 201d (hereinafter referred to as positioning ribs) may be substantially a frame structure or a lattice structure. The positioning ribs include a plurality of walls standing on the first bottom wall 201a, and the walls may enclose a plurality of grooves. Based on product requirements, upper surfaces of the walls in the positioning ribs may be flush or form a step difference. As shown in Fig. For example, as shown in Figure 6, the second positioning rib 201d may include a first portion 201f and a second portion 201g that are connected to each other. Upper surfaces of walls in the first portion 201f may be flush, and upper surfaces of walls in the second portion 201g may be flush. However, the upper surfaces of the walls in the first portion 201f may be lower, the upper surfaces of the walls in the second portion 201g may be higher, and the upper surfaces of the walls in the first portion 201f and the upper surfaces of the walls in the second portion 201g may form a step difference.

[0038] In this embodiment, the first positioning rib 201e is configured to correspond to the electrical input interface 210, and an upper surface of the first positioning rib 201e can abut against the electrical input interface 210 such that the electrical input interface 210 is aligned with a power supply hole 202a on the lower housing 202. The second positioning rib 201d is configured to correspond with the optical input interface 203, the cascading interface 204, and the photoelectric output interface 205. An upper surface of the first portion 201f can abut against the optical input interface 203 and the cascading interface 204 such that the optical input interface 203 and the cascading interface 204 are respectively aligned with an optical input hole 202b and a cascading hole 202c on the lower housing 202.An upper surface of the second portion 201g may abut the photoelectric output interface 205 such that the photoelectric output interface 205 is aligned with a photoelectric output hole 202d on the lower housing 202. The above construction will be further described below.

[0039] As in Fig. 4, a first separation rib 201c may be further disposed on the inner side of the first bottom wall 201a, and the first separation rib 201c may be approximately in a wall shape. For example, the first separation rib 201c may extend from one side of the first bottom wall 201a to the other opposite side of the first bottom wall 201a. The first separation rib 201c may be disposed between the first positioning rib 201e and the second positioning rib 201d, and the first separation rib 201c may be connected to the second positioning rib 201d.

[0040] In this embodiment, when components such as the circuit board 207 and the voltage transformation module 209 are mounted in the housing, an upper surface of the first separation rib 201c may face the circuit board 207, and the upper surface may be in contact with the circuit board 207, or there may be a gap (the gap may be small) between the upper surface and the circuit board 207. The first separation rib 201c is configured to separate high-voltage components such as the voltage transformation module 209 from low-voltage components excluding the voltage transformation module 209. The structure will be further described below.

[0041] The structure of the upper housing 201 is merely an example and is not a limitation of this embodiment of this application. Indeed, the structure of the upper housing can be flexibly designed based on product requirements. For example, the upper housing may not include at least one of the above structural features such as the positioning ribs, the separation rib, and the first buckle.

[0042] As in Fig. 7 and Fig. As shown in Figure 8, a lower housing 202 may be approximately an open box structure. For example, the lower housing 202 may include a second bottom wall 202f (which may be collectively referred to as a bottom wall with the first bottom wall 201a) and a peripheral side wall 202e surrounding and connected to a peripheral edge of the second bottom wall 202f.

[0043] As in Fig. 7 and Fig. As shown in FIG. 8, a second partition rib 202h may be formed on an inner side (a side located inside the lower case 202) of the second bottom wall 202f, and the second partition rib 202h may be approximately a strip structure. For example, the second partition rib 202h may extend from one side of the second bottom wall 202f to the other opposite side of the second bottom wall 202f, two opposite ends of the second partition rib 202h may be connected to the peripheral side wall 202e, and the second partition rib 202h may divide the interior of the lower case 202 into two regions.When components such as the circuit board 207 and the voltage transformation module 209 are mounted in the housing, an upper surface of the second separation rib 202h may face the circuit board 207, and the upper surface may be in contact with the circuit board 207, or there may be a gap (the gap may be small) between the upper surface and the circuit board 207. The second separation rib 202h is configured to separate the high-voltage components such as the voltage transformation module 209 from the low-voltage components except for the voltage transformation module 209. The structure will be further described below.

[0044] As in Fig. 7 and Fig. 8, a support part 202i may be further formed on the inner side of the second bottom wall 202f, and at least one support part 202i may be provided. The support part 202i may correspond to a mounting position of the fiber restriction base 208 on the circuit board 207. The support part 202i may provide structural support on the circuit board 207 to prevent stress generated by inserting and mounting the fiber restriction base 208 from damaging a stress-sensitive component on the circuit board 207. The construction will be further described below.

[0045] As in Fig. 7 to Fig. 9, a restricting structure 202j may be further formed on the inner side of the second bottom wall 202f. For example, the restricting structure 202j may include a restricting portion 202k and a connecting portion 202m. The restricting portion 202k may be a plate structure and may have a degree of bending. The connecting portion 202m may be in a block shape or a strip shape and is connected to the restricting portion 202k and the peripheral side wall 202e, so that a gap is formed between the restricting portion 202k and the peripheral side wall 202e. The restricting portion 202k in the restricting structure 202j is similar to a chair back, and the connecting portion 202m is similar to a chair surface.The gap between the limiting structure 202j and the peripheral sidewall 202e can be used to mount the optical splitting module 206, and the limiting structure 202j can clamp and limit the optical splitting module 206. For example, a chamfer or a round chamfer can be formed on top of the limiting portion 202k. The chamfer or round chamfer has guiding and friction-reducing functions to facilitate smooth mounting of the optical splitting module 206 into the gap.

[0046] As in Fig. 7 and Fig. As shown in FIG. 8, the power supply hole 202a, the optical input hole 202b, the cascading hole 202c, and the photoelectric output hole 202d may be provided on the peripheral side wall 202e. These holes are all through holes and may be provided on a same side plate of the peripheral side wall 202e. There are at least two photoelectric output holes 202d. For example, four photoelectric output holes 202d are shown in the figure. For example, the power supply hole 202a may be arranged on one side of the second separation rib 202h, and the optical input hole 202b, the cascading hole 202c, and the photoelectric output hole 202d may be arranged on the other side of the second separation rib 202h.

[0047] In this embodiment, both the power supply hole 202a and the optical input hole 202b may be referred to as input through holes, and both the cascading hole 202c and the photoelectric output hole 202d may be referred to as output through holes.

[0048] As in Fig. 7 and Fig. 8, the peripheral side wall 202e, the second bottom wall 202f and the second separating rib 202h may enclose two areas and for an area 202n (ie, a left space from a perspective of Fig. 7 and an upper room from a perspective of Fig. 8), corresponding to the power supply hole 202a, a part of the peripheral side wall 202e corresponding to the area 202n has no hole other than the power supply hole 202a, and there is no hole at a part of the second bottom wall 202f corresponding to the area 202n. The area 202n is used to arrange the high-voltage components such as the electrical input interface 210 and the voltage transformation module 209. There is no hole structure at a part of the peripheral side wall 202e corresponding to the area 202n and a part of the second bottom wall 202f corresponding to the area 202n, which is conducive to the implementation of the safety requirements of the high-voltage components. The structure will be further described below.

[0049] As in Fig. 7 and Fig. As shown in Figure 8, a plurality of second buckles 202g may be further disposed on the peripheral sidewall 202e. For example, the second buckles 202g may be disposed near an upper surface of the peripheral sidewall 202e. The second buckle 202g may form a buckle connection with the first buckle 201b. The buckle connection may be a detachable connection for opening the housing of the optical splitter 20 for maintenance.

[0050] The structure of the lower housing 202 is merely an example and is not a limitation of this embodiment of this application. Indeed, the structure of the lower housing can be flexibly designed based on product requirements. For example, the lower housing may not include at least one of the above structural features such as the separation rib, the second buckle, and the cascading hole.

[0051] Fig. 10 is used to show a cooperative relationship between the upper housing 201 and the lower housing 202. Referring to Fig. 10, when the upper housing 201 and the lower housing 202 are assembled, the upper housing 201 covers the lower housing 202, and the first bottom wall 201a is opposite and spaced from the second bottom wall 202f. The first positioning rib 201e may correspond to the power supply hole 202a, the first portion 201f of the second positioning rib 201d may correspond to the optical input hole 202b and the cascading hole 202c, and the second portion 201g of the second positioning rib 201d may correspond to the photoelectric output hole 202d. The first separation rib 201c and the second separation rib 202h may substantially overlap (may completely overlap or may be misplaced) and there is a gap between the upper surface of the first separation rib 201c and the upper surface of the second separation rib 202h.

[0052] In this embodiment, the upper housing 201 and the lower housing 202 may be connected by a buckle. Additionally, the upper housing 201 and the lower housing 202 may be further connected by a connecting piece such as a screw or other suitable connection method to ensure assembly reliability.

[0053] As in Fig. 3, the optical splitting module 206 is configured to split an external optical signal, and the split optical signal may be referred to as an optical output signal. The optical splitting module 206 may be a passive component including a plurality of optical elements. As shown in Fig. 3 and Fig. 9, the optical splitting module 206 may be mounted on the confinement structure 202j and is clamped between the confinement structure 202j and the peripheral sidewall 202e.

[0054] Fig. 11 may show each component arranged on the circuit board 207. It is understood that Fig. 11 is merely an example and does not limit a specific structure and layout form of the circuit board 207 and each component on the circuit board 207.

[0055] As in Fig. As shown in FIG. 11, a fiber winding path pattern 213 may be formed on the circuit board 207, and the fiber winding path pattern 213 may avoid a high component on the circuit board 207. On the circuit board 207, a plurality of fiber restriction bases 208 may be mounted along the fiber winding path pattern 213, and optical fibers are clamped and fixed in the fiber restriction bases 208 to restrict the optical fibers on the fiber winding path pattern 213. The quantity and position of the fiber restriction bases 208 may be properly adjusted based on requirements to prevent damage to the optical fiber when the upper case 201 and the lower case 202 are strapped and assembled.

[0056] As in Fig. 11 and Fig. 10, when the circuit board 207 and each component are mounted on the lower case 202, the support parts 202i in the lower case 202 may correspond to mounting positions provided by some fiber restriction bases 208 provided on the circuit board 207, and the support part 202i may support the mounting position to prevent a stress generated when the fiber restriction base 208 is inserted into the circuit board 207 from damaging the stress-sensitive component on the circuit board 207.

[0057] As in Fig. As shown in Figure 11, the electrical input interface 210 may be arranged on an edge of the circuit board 207. The electrical input interface 210 is configured to connect to an external power supply and receive external electrical energy input. The external electrical energy received by the electrical input interface 210 may be high-voltage electricity, for example, a voltage between 170 V and 264 V (including an endpoint value). A specific structure of the electrical input interface 210 is not limited in this embodiment. For example, the electrical input interface 210 may be a C8 power socket. As shown in Fig. 11 and Fig. As shown in Figure 10, the electrical input interface 210 may be aligned with the power supply hole 202a to connect to the external power supply through the power supply hole 202a. The electrical input interface 210 may be completely concealed within the lower case 202, or a portion of the electrical input interface 210 may be exposed from the power supply hole 202a. In addition, the first positioning rib 201e may abut the electrical input interface 210 to keep the electrical input interface 210 aligned with the power supply hole 202a and prevent inaccurate alignment caused by unevenness of the electrical input interface 210. A groove in the first positioning rib 201e may be a key structure of the electrical input interface 210 to prevent interference with the operation of the electrical input interface 210.

[0058] As in Fig. As shown in Figure 11, the voltage transformation module 209 may be disposed near the electrical input interface 210, and the voltage transformation module 209 may be disposed on two sides or one side of the circuit board 207. The voltage transformation module 209 may be electrically connected to the electrical input interface 210 through a circuit on the circuit board 207. The voltage transformation module 209 is configured to convert the external electrical power received through the electrical input interface 210 to convert high-voltage electricity into low-voltage electricity, where the low-voltage electricity may be, for example, 56 V. The electrical power obtained after the down-conversion may be output to the outside, and the electrical power may be referred to as output electrical power.

[0059] The voltage transformation module 209 may be formed by a plurality of components and circuits. For example, as shown in Fig. As shown in FIG. 11, the voltage transformation module 209 may include a MOS transistor 209b. The MOS transistor 209b generates heat during operation and may be referred to as a heat-generating component. The MOS transistor 209b may be attached to a heat dissipation piece 209a. The heat dissipation piece 209a may be, for example, a copper bracket. The heat dissipation piece 209a may be attached to the circuit board 207. The heat dissipation piece 209a may dissipate heat from the MOS transistor 209b and may further transfer the heat to the circuit board 207 to dissipate the heat through the circuit board 207 with a large heat dissipation area.

[0060] In this embodiment, both the electrical input interface 210 and the voltage transformation module 209 have high operating voltages (e.g., 170 V to 264 V) and may be referred to as high-voltage components. The high-voltage components may be arranged on two sides or one side of the circuit board 207. In addition to the high-voltage components, other components have low operating voltages (e.g., 56 V) and may be referred to as low-voltage components. The low-voltage components are arranged on two sides or one side of the circuit board 207.

[0061] In this embodiment, the shunt module may be further disposed on the circuit board 207. The shunt module may be electrically connected to the voltage transformation module 209 through the circuitry on the circuit board 207, and the shunt module is configured to shunt the electrical output energy converted by the voltage transformation module 209 into at least two electrical output energy paths. The shunt module may be formed by a plurality of components and circuits. This is not specifically limited in this embodiment.

[0062] As in Fig. 11, the optical input interface 203 may be arranged on an edge of the circuit board 207. The optical input interface 203 is configured to connect to an external light source and receive an external optical signal, and may transmit the external optical signal to the optical splitting module 206 through an optical fiber (for the purpose of clarity, the optical input interface 203 is not connected to the optical splitting module 206 through the optical fiber in Fig. 11). A specific structure of the optical input interface 203 is not limited in this embodiment. As shown in Fig. 11 and Fig. As shown in FIG. 10, the optical input interface 203 may be aligned with the optical input hole 202b to connect to the external light source through the optical input hole 202b. Part of the optical input interface 203 may be exposed outside the lower case 202, or the optical input interface 203 may be completely concealed within the lower case 202. In addition, the first portion 201f in the second positioning rib 201d may abut against the optical input interface 203 to keep the optical input interface 203 aligned with the optical input hole 202b and prevent inaccurate alignment caused by unevenness of the optical input interface 203. A groove in the first portion 201f may be a key structure of the optical input interface 203 to prevent interference with the operation of the optical input interface 203.

[0063] In another embodiment different from the above embodiments, the external electrical power and the external optical signal may be input to the optical splitter through the same input interface. The input interface may be a photoelectric input interface. For example, the photoelectric input interface may include a first photoelectric composite adapter and a first photoelectric connector. The first photoelectric connector is connected to the first photoelectric composite adapter in a fixing manner. For example, a part of the first photoelectric connector may be inserted into the first photoelectric composite adapter. An optical transmission structure (including, for example, a ferrule) and an electrical transmission structure (including, for example, an electrode) may be incorporated into the first photoelectric connector.The optical transmission structure may accommodate and fix an optical fiber, and the optical transmission structure is connected to the optical splitter module through the optical fiber. The electrical transmission structure may be connected to a circuit board. When the external optical signal and external electrical power need to be received, a photoelectric connector of an external device may be inserted into the first photoelectric composite adapter and connected to the first photoelectric connector, so that the external optical signal and external electrical power are input to the optical splitter.

[0064] As in Fig. As shown in Figure 11, the cascading interface 204 may be arranged on an edge of the circuit board 207 and may be arranged side by side with the optical input interface 203. One end of the cascading interface 204 may be connected to the optical splitter module 206 by an optical fiber, and the other end of the cascading interface 204 may be in a bridge connection with the external device (for example, a lower-level optical splitter) to transmit an optical signal to the external device. A specific structure of the cascading interface 204 is not limited in this embodiment. As shown in Fig. 11 and Fig. As shown in Figure 10, the cascading interface 204 may be aligned with the cascading hole 202c to connect to the external device through the cascading hole 202c. Part of the cascading interface 204 may be exposed outside the lower housing 202, or the cascading interface 204 may be completely concealed within the lower housing 202. Additionally, the second portion 201g in the second positioning rib 201d may abut the cascading interface 204 to keep the cascading interface 204 aligned with the cascading hole 202c and avoid inaccurate alignment caused by unevenness of the cascading interface 204. A groove in the second portion 201g may avoid a key structure of the cascading interface 204 to avoid affecting the operation of the cascading interface 204.

[0065] As in Fig. 11, the photoelectric output interface 205 may be disposed at an edge of the circuit board 207. The photoelectric output interface 205 may be connected to the optical splitting module 206 through an optical fiber and transmit a beam of optical output signal split by the optical splitting module 206 to the external optical network unit 10. The photoelectric output interface 205 may further be electrically connected to the shunt module through the circuit board 207, and the photoelectric output interface 205 may transmit a path of output electrical energy shunted by the shunt module to the external optical network unit 10.

[0066] A structure of the photoelectric output interface 205 is not limited in this embodiment. For example, as shown in Fig. 12 and Fig. 13, the photoelectric output interface 205 includes a second photoelectric composite adapter 205a and a second photoelectric connector 205b. The second photoelectric connector 205b is connected to the second photoelectric composite adapter 205a in a fixing manner. For example, a portion of the second photoelectric connector 205b may be inserted into the second photoelectric composite adapter 205a. An optical transmission structure (including, for example, a ferrule) and an electrical transmission structure (including, for example, an electrode) may be incorporated into the second photoelectric connector 205b. The optical transmission structure may receive and fix an optical fiber connected to the optical splitting module 206 to receive a beam of optical output signal from the optical splitting module 206.The electrical transmission structure may be connected to the circuit board 207 and receive a path of electrical output energy through the circuit board 207.

[0067] When an optical signal and electrical power need to be output to the outside, a photoelectric connector of an external device can be inserted into the second photoelectric composite adapter 205a and connected to the second photoelectric connector 205b to transmit the optical output signal and electrical power to the external device. Therefore, the optical splitter 20 in this embodiment can not only provide the optical signal to the external device but also input the electrical power to the external device. In this way, the external device does not need to receive additional local power, thereby avoiding cable entanglement around the external device and improving the user experience.In addition, the optical splitter 20 can be used not only in a feeder section or a distribution section, but also at a user access point and is applicable to various scenarios.

[0068] In this embodiment, there is one optical input interface 203 and at least two photoelectric output interfaces 205 may be provided to implement one optical / electrical input and a plurality of optical / electrical outputs. Fig. 14 shows a functional frame structure of the optical splitter 20 with such an input / output characteristic.

[0069] In another embodiment, at least two optical input interfaces 203 may be present. This is a backup redundancy design and can ensure that the optical signal is input to the optical splitter. One or at least two photoelectric output interfaces 205 may be present. This type of optical splitter is suitable for a specific application scenario.

[0070] As in Fig. 11 and Fig. As shown in FIG. 10, the photoelectric output interface 205 may be aligned with the photoelectric output hole 202d to connect to the external device through the photoelectric output hole 202d. A part of the photoelectric output interface 205 may be exposed outside the lower housing 202, or the photoelectric output interface 205 may be completely concealed within the lower housing 202. In addition, the second portion 201g in the second positioning rib 201d may abut against the photoelectric output interface 205 to keep the photoelectric output interface 205 aligned with the photoelectric output hole 202d and avoid inaccurate alignment caused by unevenness of the photoelectric output interface 205 and / or insufficient unevenness of the circuit board 207.A groove in the second portion 201g can avoid a key structure of the photoelectric output interface 205 to avoid affecting the operation of the photoelectric output interface 205.

[0071] In this embodiment, the optical splitter 20 may further include a display. The display is electrically connected to the circuit board 207 and is configured to control light emission to indicate an operating state of the optical splitter 20. A display hole may be provided on the housing, and the light emitted by the display may be emitted through the display hole. For example, a first display may be arranged to indicate an electrical power input state and / or an electrical power output state. For example, a photoelectric conversion device and a second display may be arranged. The photoelectric conversion device may be arranged on the circuit board 207 and connected to the optical splitting module 206. The photoelectric conversion device is configured to convert an optical signal of the optical splitting module 206 into an electrical signal.The second display may be electrically connected to the photoelectric conversion device through the circuit board 207, and the second display is configured to display an input state and / or an output state of the optical signal.

[0072] Fig. 15 is a cross-sectional view showing an assembly structure of the lower case 202, the circuit board 207, and each component, wherein only the lower case 202 is shown in the cross-sectional view.

[0073] As in Fig. 15, the second separation rib 202h on the lower housing 202 may be in contact with (or have a gap) the circuit board 207. Referring to Fig. 15, Fig. 10 and the above description, the first separation ribs 201c on the upper case 201 may also coincide with (be in contact with or have a gap) the circuit board 207, and the two separation ribs are respectively arranged on two opposite sides of the circuit board 207.

[0074] Therefore, the first bottom wall 201a, the first separation rib 201c, the circuit board 207, the second separation rib 202h, the second bottom wall 202f, and the peripheral side wall 202e define a first space and a second space. The first space and the second space are distributed on two sides of the circuit board 207, or the first space includes two parts, each arranged on two sides of the circuit board 207, and the second space includes two parts, each arranged on the two sides of the circuit board 207. The first space is a space in which the region 202n is arranged, for example, a space on a left side of the first separation rib 201c and the second separation rib 202h in Fig. 10. The second space is a space on a right side of the first separating rib 201c and the second separating rib 202h in Fig. 10. As in Fig. 15 and Fig. 10, on one side of the circuit board 207, the first space and the second space are separated by the first separation rib 201c; and on the other opposite side of the circuit board 207, the first space and the second space are separated by the second separation rib 202h.

[0075] As in Fig. 15, for a side of the circuit board 207 facing the second separating rib 202h (the side facing a paper surface in Fig. 15), the high-voltage components (for example, the voltage transformation module 209 and the electrical input interface 210) on the circuit board 207 may be arranged in a high-voltage area (the high-voltage area may refer to an area on two sides of the circuit board 207, and the high-voltage components may be distributed on both sides of the circuit board 207) of the circuit board 207, and the low-voltage components (for example, the optical input interface 203, the cascading interface 204, the photoelectric output interface 205, and the shunt module) on the circuit board 207 may be arranged in a low-voltage area (the low-voltage area may refer to an area on two sides of the circuit board 207, and the shunt module may be arranged on both sides of the circuit board 207) of the circuit board 207.The high voltage components and the high voltage area can be shown on one side (for example a left side in . Fig. 15) of the second separating rib 202h, and the high-voltage components and the high-voltage region may be arranged in the protruding first space. The low-voltage components and the low-voltage region may be arranged on the other side (for example, a right side in Fig. 15) of the second separating rib 202h, and the low-voltage components and the low-voltage region may be arranged in the above second space.

[0076] As in Fig. 15 and Fig. 10, for a side of the circuit board 207 facing the first separation rib 201c, the high-voltage components and the low-voltage components may also be arranged in the above first space, and the low-voltage components and the low-voltage region may also be arranged in the above second space.

[0077] Therefore, the high-voltage components and the low-voltage components can be arranged in different spaces on two sides of the circuit board 207, respectively, and are separated by the first separation rib 201c and the second separation rib 202h.

[0078] With reference to Fig. 15, Fig. 10 and the above description, a part of the housing corresponding to the first space (or the high-voltage area) has no hole other than the power supply hole 202a. Since the power supply hole 202a may be blocked by the electrical input interface 210, it is difficult for an external foreign matter to enter the first space from the power supply hole 202a. Therefore, it can be considered that the first space is not communicated with the outside.

[0079] As in Fig. 15 and Fig.As shown in FIG. 10, a part of the housing corresponding to the second space (or the low-voltage region) may be provided with a hole, for example, a plurality of strip-shaped holes on the lower housing 202. Without the above insulation structure between the high-voltage component and the low-voltage component, an external conductive foreign matter may enter the low-voltage region through the hole and reach the high-voltage region, resulting in a short circuit of the high-voltage component. Since a voltage of the high-voltage component is high and a short-circuit current is large, the performance of the optical splitter 20 is degraded and even the optical splitter 20 is damaged (if the external conductive foreign matter causes a short circuit of the low-voltage component, since a voltage of the low-voltage component is low and a short-circuit current is small, an impact on the optical splitter 20 is limited).However, since the optical splitter 20 in this embodiment has a structure for isolating the high-voltage component from the low-voltage component, the external conductive foreign matter entering the low-voltage region is blocked by the barrier rib and cannot enter the high-voltage region, thereby avoiding the risk of short-circuiting the high-voltage component. Therefore, the insulation structure in this embodiment can meet safety requirements, so that the optical splitter 20 has high reliability.

[0080] Based on the above description, it is easily understood that when the high-voltage component is distributed on only one side of the circuit board 207 (the low-voltage component may be distributed on two sides or one side of the circuit board 207), a separation rib may also be arranged on one side of the circuit board 207, that is, the separation rib is arranged in the upper case or the lower case. The upper case or the lower case, the separation rib, and the circuit board 207 may enclose a first space and a second space, wherein the first space may be arranged on one side of the circuit board 207, the second space may be arranged on one side or two sides of the circuit board 207, and the first space and the second space are separated by the separation rib. The high-voltage component is arranged in the first space, and the low-voltage component is arranged in the second space.The separation rib isolates the high-voltage component from the low-voltage component to ensure safety requirements.

[0081] In the descriptions of embodiments of this application, unless otherwise stated, "and / or" is merely an association relationship to describe an associated object and indicates that three relationships can exist. For example, A and / or B can represent the following three cases: only A exists alone, both A and B exist, and only B exists.

[0082] In the descriptions of embodiments of this application, “a plurality of” means two or more.

[0083] In the descriptions of embodiments of this application, terms such as "first" and "second" are used merely to distinguish between technical features for the purpose of clarity of description and should not be understood to imply a relative importance or to implicitly indicate a set of specified technical features.

[0084] The orientation terms mentioned in embodiments of this application, for example, "top," "bottom," "front," "back," "left," "right," "inside," "outside," "side," "top," and "bottom," refer only to viewing directions in the accompanying drawings. Therefore, the orientation terms are used to better and more clearly illustrate and understand embodiments of this application and do not explicitly or implicitly indicate that the specified device or element must have a specific orientation and must be constructed and operated in a specific orientation. Therefore, the orientation terms cannot be construed as limiting embodiments of this application.

[0085] In the descriptions of embodiments of this application, unless expressly stated and limited otherwise, the terms "mounted," "connected," "connection," and "disposed upon..." should be understood in a broad sense. For example, the "connection" may be a detachable connection or may be a non-detachable connection; or may be a direct connection or an indirect connection through an intermediate connection.

[0086] The above descriptions are merely specific implementations of this application and are not intended to limit the scope of this application. Any variation or substitution readily devised by one skilled in the art within the technical scope disclosed in this application is intended to be within the scope of this application. Therefore, the scope of this application is subject to the scope of the claims.

Claims

[1] Optical splitter (20), comprising a housing, a circuit board (207), an input interface, a voltage transformation module (209), a shunt module, an optical splitting module (206), and at least two photoelectric output interfaces (205), wherein the circuit board (207) is arranged in the housing and the input interface, the voltage transformation module (209), the shunt module, and the at least two photoelectric output interfaces (205) are all arranged on the circuit board (207); the optical splitting module (206) is arranged in the housing and is connected to the input interface and the photoelectric output interfaces (205) by an optical fiber; the housing and the circuit board (207) enclose a first space and a second space, the first space and the second space are separated by the housing, at least a part of the input interface and the voltage transformation module (209) are arranged in the first space, and the shunt module and the at least two photoelectric output interfaces (205) are arranged in the second space; and the input interface is configured to receive an external optical signal and external electrical energy; the voltage transformation module (209) is configured to perform voltage balancing on the external electrical energy and convert the external electrical energy into output electrical energy; the shunt module is configured to shunt the output electrical energy into at least two paths of output electrical energy; the optical splitting module (206) is configured to split the external optical signal into at least two beams of output optical signals; and each photoelectric output interface (205) is configured to output one path of output electrical energy and one beam of output optical signal. [2] The optical splitter (20) according to claim 1, wherein the input interface comprises an electrical input interface (210) and an optical input interface (203), the electrical input interface (210) is arranged in the first space and the optical input interface (203) is arranged in the second space; the electrical input interface (210) is configured to receive the external electrical power, and the optical input interface (203) is configured to receive the external optical signal; and the optical splitting module (206) is connected to the optical input interface (203) through the optical fiber. [3] The optical splitter (20) according to claim 1, wherein the input interface comprises a first photoelectric composite adapter and a first photoelectric connector which are fixed, and the first photoelectric composite adapter is fixed to the circuit board (207); the first photoelectric connector is connected to the circuit board (207) and is connected to the optical splitter module (206) through the optical fiber; and the first photoelectric connector is configured to receive the external optical signal and the external electrical power. [4] The optical splitter (20) according to any one of claims 1 to 3, wherein each photoelectric output interface (205) comprises a second photoelectric composite adapter (205a) and a second photoelectric connector (205b) which are fixed, and the second photoelectric composite adapter (205a) is fixed to the circuit board (207); the second photoelectric connector (205b) is connected to the circuit board (207) and is connected to the optical splitter module (206) through the optical fiber; and the second photoelectric connector (205b) is configured to output the one path of output electrical energy and the one beam of output optical signal. [5] The optical splitter (20) of any one of claims 1 to 4, wherein the optical splitter includes a display, the display being electrically connected to the circuit board (207), and the display being configured to emit light that can propagate to the outside of the housing. [6] The optical splitter (20) according to any one of claims 1 to 5, wherein the voltage transformation module (209) comprises a heat-generating component (209b) and a heat-dissipating piece (209a), and the heat-generating component (209b) is connected to the heat-dissipating piece (209a) in a fixing manner; and the heat-generating component (209b) is connected to the circuit board (207), and the heat-dissipating piece (209a) is connected to the circuit board (207). [7] The optical splitter (20) according to any one of claims 1 to 6, wherein the housing comprises a peripheral side wall (202e) and a bottom wall, and the peripheral side wall (202e) surrounds a peripheral edge of the bottom wall; a partition rib is disposed on an inner side of the bottom wall, and an upper surface of the partition rib faces the circuit board (207); and the bottom wall, the partition rib, the circuit board (207), and the peripheral side wall (202e) enclose the first space and the second space, and the first space and the second space are separated by the partition rib. [8] Optical splitter (20) according to claim 7, wherein the bottom wall comprises a first bottom wall (201a) and a second bottom wall (202f) which are opposite to each other, and the peripheral side wall (202e) is arranged between the first bottom wall (201a) and the second bottom wall (202f); and the separating rib comprises a first separating rib (201c) and a second separating rib (202h), wherein the first separating rib (201c) is arranged on an inner side of the first bottom wall (201a) and the second separating rib (202h) is arranged on an inner side of the second bottom wall (202f); and both the voltage transformation module (209) and the shunt module are arranged on two opposite sides of the circuit board (207); the circuit board (207) is arranged between the first separating rib (201c) and the second separating rib (202h), the first bottom wall (201a), the first separating rib (201c), the circuit board (207), the second separating rib (202h), the second bottom wall (202f) and the peripheral side wall (202e) enclose the first space and the second space, and both the first space and the second space are distributed on the two opposite sides of the circuit board (207); on one side of the circuit board (207), the first space and the second space are separated by the first separating rib (201c); and on the other opposite side of the circuit board (207), the first space and the second space are separated by the second separating rib (202h). [9] Optical splitter (20) according to one of claims 1 to 8, wherein the housing is provided with an input through-hole and at least two output through-holes, the input interface receives the external optical signal and the external electrical energy through the input through-hole, and a photoelectric output interface (205) outputs a path of electrical output energy and a beam of optical output signal, respectively, through an output through-hole; and a positioning rib is arranged on an inner wall of the housing and the positioning rib abuts on a side which is from the input interface and which is remote from the circuit board (207), and / or the positioning rib abuts on a side which is from each photoelectric output interface (205) and which is remote from the circuit board (207). [10] The optical splitter (20) according to any one of claims 1 to 9, wherein a limiting structure (202j) is arranged in the housing, the limiting structure (202j) comprising a limiting portion (202k) and a connecting portion (202m), the connecting portion (202m) connecting the limiting portion (202k) and the inner wall of the housing, and a gap is formed between the limiting portion (202k) and the inner wall; and the optical splitting module (206) is clamped and mounted in the gap. [11] The optical splitter (20) according to any one of claims 1 to 10, wherein the optical splitter comprises a fiber restriction base (208) configured to restrict an optical fiber, and the fiber restriction base (208) is fixed to the circuit board (207); and a support member (202i) is arranged on the inner wall of the housing, the support member (202i) and the fiber restriction base (208) are respectively arranged on two opposite sides of the circuit board (207), and the support member abuts against the circuit board (207). [12] An optical network system (1) comprising an optical line terminal (30), at least two optical network units (10), and the optical splitter (20) according to any one of claims 1 to 11, wherein the optical line terminal (30) is configured to provide an external optical signal; and an optical network unit (10) is connected to a photoelectric output interface (205) respectively, and an optical network unit (10) is configured to receive a path of output electrical energy and a beam of output optical signal.

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