Vehicle-mounted projector and vehicle

Abstract

Vehicle-mounted projector, characterized in that it comprises the following: a light source pre-installation module comprising a base, a light source and a first printed circuit board, wherein the light source is located at the base, and wherein the first printed circuit board is abutted against one side of the base, and wherein the light source is electrically connected to the first printed circuit board; a first sensor located on the first circuit board, the first sensor being used to detect the temperature of the light source in real time; a first heat dissipation component that is connected to the light source pre-installation module, so that the first heat dissipation component dissipates heat from the light source pre-installation module.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of vehicle accessories, in particular to a vehicle-mounted projector and a vehicle. STATE OF THE ART

[0002] In recent years, China's automobile industry has been developing at an ever-increasing pace, and the future development trend of the automobile industry remains the core development of the industry. With the continuous advancement of science and technology and the continuous improvement of people's living standards, the demand for vehicle leisure functions is also increasing. With the popularization and rapid development of new energy intelligent vehicles, more and more entertainment functions are being offered, making it possible to use projectors in vehicles.

[0003] Generally, the working environment of home projectors is better, while vehicles often have complex working conditions and higher requirements for vibration resistance, high-temperature resistance, waterproofness, dustproofness, and weather resistance. The requirements of home projectors for light sources, chips, and other components are much higher than those of office projectors. Therefore, the projectors used in vehicles must be made with high reliability to ensure good stability and maturity.

[0004] However, most projectors at this stage are consumer projectors. Since the operating temperature of consumer projectors is in the range of 0-40°C, while the operating temperature of vehicle-mounted projectors must be in the range of -20-70°C, consumer projectors cannot meet the requirements of vehicle-mounted projectors. In order for the entire vehicle to be used in a variety of harsh environments under different working conditions, the vehicle-mounted projector must be able to operate normally in an ambient temperature of -20-70°C. To achieve this, the vehicle-mounted projector must be cooled down so that the vehicle-mounted projector can operate normally. At the same time, the key components can also be protected to meet the vehicle's 20,000-hour service life requirement. CONTENT OF THIS APPLICATION

[0005] The present application provides a vehicle-mounted projector and a vehicle, wherein with the arrangement of a heat dissipation structure, heat is dissipated from the units inside a vehicle-mounted projector, whereby the vehicle-mounted projector can meet the ambient temperature requirement to protect the main units of the vehicle-mounted projector, so that the vehicle-mounted projector can operate normally, and the service life of the vehicle-mounted projector is effectively extended.

[0006] To achieve the above purpose, the present invention uses the following technical solution: In a first aspect of the present application, there is provided a vehicle-mounted projector comprising: a light source pre-installation module comprising a base, a light source, and a first circuit board, wherein the light source is located on the base, and wherein the first circuit board abuts one side of the base, and wherein the light source is electrically connected to the first circuit board; a first sensor located on the first circuit board, the first sensor used to detect a temperature of the light source in real time; a first heat dissipation component connected to the light source pre-installation module, such that the first heat dissipation component dissipates heat from the light source pre-installation module.

[0007] Based on the above technical solution, the present application can be improved as follows.

[0008] In one possible embodiment, the first heat dissipation component comprises a heat dissipation block, a heat-conducting bar, and a first fan; wherein the heat-conducting strip is connected to an end of the heat dissipation block facing the light source pre-installation module, and wherein the first fan is connected to an end of the heat dissipation block facing away from the light source pre-installation module.

[0009] In one possible embodiment, the heat dissipation block is provided with at least one recess; wherein the heat-conducting strip is embedded in the recess, and wherein the heat-conducting strip abuts the heat dissipation block.

[0010] In one possible embodiment, the vehicle-mounted projector further comprises a chip module and a second heat dissipation component; wherein the chip module comprises a chip and a second circuit board, and wherein the chip is electrically connected to the second circuit board; and wherein the chip module is connected to the second heat dissipation component; and wherein the second heat dissipation component is used to dissipate heat from the chip module.

[0011] In one possible embodiment, the second heat dissipation component comprises a first heat sink, a second heat sink, a second fan, and a first thermally conductive adhesive; wherein the first heat sink has a first protrusion, and wherein one side of the first thermally conductive adhesive is bonded to the first protrusion and the other side of the first thermally conductive adhesive is bonded to the chip module; and wherein the second heat sink is connected to an end of the first heat sink facing away from the chip module, and wherein the second fan is connected to the other end of the second heat sink.

[0012] In one possible embodiment, the vehicle-mounted projector further comprises a second sensor and a third sensor; wherein the second sensor is located on the second circuit board, and wherein the second sensor is used to detect a temperature of the chip in real time; and wherein the third sensor is located on the second heat sink, and wherein the third sensor is used to detect an external ambient temperature of the vehicle-mounted projector.

[0013] In one possible embodiment, the vehicle-mounted projector further comprises a drive main board and a third heat dissipation component; and wherein the drive main board is connected to the third heat dissipation component; and wherein the third heat dissipation component is used to dissipate heat from the drive main board.

[0014] In one possible embodiment, the third heat dissipation component comprises a cover plate and a plurality of second thermally conductive adhesives; wherein the cover plate has a plurality of second protrusions, and wherein one side of the second thermally conductive adhesive is bonded to the second protrusions and the other side of the second thermally conductive adhesive is bonded to the drive main board.

[0015] In one possible embodiment, the vehicle-mounted projector further comprises a support shell and a fourth heat dissipation component; wherein the fourth heat dissipation component comprises a plurality of cooling disks located in the support shell; and wherein the fourth heat dissipation component is used to dissipate heat from the support shell.

[0016] In a second aspect of the present application, a vehicle is provided comprising the vehicle-mounted projector described above.

[0017] The present application provides a vehicle-mounted projector and a vehicle, wherein the vehicle-mounted projector includes a light source pre-installation module, a first sensor, and a first heat dissipation component. The light source pre-installation module includes a base, a light source, and a first circuit board, wherein the light source is located on the base, and wherein the first circuit board abuts one side of the base, and wherein the light source is electrically connected to the first circuit board. The first sensor is located on the first circuit board, wherein the first sensor is used to detect a temperature of the light source in real time. The first heat dissipation component is connected to the light source pre-installation module, such that the first heat dissipation component dissipates heat from the light source pre-installation module. The vehicle includes the vehicle-mounted projector described above.In these ways, the present application, with the arrangement of a heat dissipation structure, can dissipate heat from the units inside a vehicle-mounted projector, whereby the vehicle-mounted projector can meet the ambient temperature requirement to protect the key units of the vehicle-mounted projector, so that the vehicle-mounted projector can operate normally, and the service life of the vehicle-mounted projector is effectively extended. SHORT DESCRIPTION OF THE DRAWING

[0018] In order to more clearly explain the technical solution in the embodiments of the present application or in the prior art, the drawings to be used in the explanation of the embodiments or for the prior art are briefly presented below. Obviously, the drawings presented below show only some embodiments of the present application. Those of ordinary skill in the art can obtain other drawings based on these drawings, provided no creative work is performed. Fig. 1 is a schematic diagram showing the structure for dissipating heat from a light source of a vehicle-mounted projector provided by an embodiment of the present application; Fig. 2 is a schematic diagram showing the structure for dissipating heat from a chip of a vehicle-mounted projector provided by an embodiment of the present application; Fig. 3 is a schematic diagram showing the structure for dissipating heat from a drive main board of a vehicle-mounted projector provided by an embodiment of the present application; Fig. 4 shows a schematic diagram of the structure for dissipating heat from a support tray provided by an embodiment of the present application. List of reference symbols 100 Vehicle-mounted projector 200 light source pre-installation module 210 Base 220 light source 230 First circuit board 240 First Sensor 300 First heat dissipation component 310 heat dissipation block 311 recess 320 Heat-conducting strip 330 First fan 400 chip module 410 Chip 420 Second circuit board 430 Second sensor 500 Second heat dissipation component 510 First heat sink 511 First lead 520 Second heat sink 530 Second fan 540 First thermally conductive adhesive 550 Third Sensor 600 drive main board 700 Third heat dissipation component 710 cover plate 711 Second lead 720 Second thermally conductive adhesive 800 carrier tray 810 First carrier layer 820 Second carrier layer 900 Fourth heat dissipation component 910 cooling disc DETAILED DESCRIPTION

[0019] As described in the prior art, most projectors at this stage are consumer projectors. Since the operating temperature of consumer projectors is in the range of 0-40°C, while the operating temperature of vehicle-mounted projectors must be in the range of -20-70°C, consumer projectors cannot meet the requirements of vehicle-mounted projectors. In order for the entire vehicle to be used in a variety of harsh environments under different working conditions, the vehicle-mounted projector must be able to operate normally in an ambient temperature of -20-70°C. To achieve this, the vehicle-mounted projector must be cooled down so that the vehicle-mounted projector can operate normally. At the same time, the key components can also be protected to meet the vehicle's 20,000-hour service life requirement.

[0020] In view of the above-described technical problems, an embodiment of the present application provides a vehicle-mounted projector and a vehicle, wherein the vehicle-mounted projector includes a light source pre-installation module, a first sensor, and a first heat dissipation component. The light source pre-installation module includes a base, a light source, and a first circuit board, wherein the light source is located on the base, and wherein the first circuit board abuts one side of the base, and wherein the light source is electrically connected to the first circuit board. The first sensor is located on the first circuit board, wherein the first sensor is used to detect a temperature of the light source in real time. The first heat dissipation component is connected to the light source pre-installation module, such that the first heat dissipation component dissipates heat from the light source pre-installation module.The vehicle includes the vehicle-mounted projector described above. In these ways, the embodiment of the present application, with the provision of a heat dissipation structure, can dissipate heat from the components inside a vehicle-mounted projector, allowing the vehicle-mounted projector to meet the ambient temperature requirement to protect the key components of the vehicle-mounted projector, allowing the vehicle-mounted projector to operate normally, and effectively extending the service life of the vehicle-mounted projector.

[0021] To make the aforementioned purposes, features, and advantages of the embodiments of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments do not represent all embodiments, but only a part of the embodiments. All other embodiments obtained by one of ordinary skill in the art based on the embodiments in the present application without creative work should be considered to be covered by the scope of the present application.

[0022] An embodiment of the present application provides a vehicle-mounted projector and a vehicle, wherein, with the provision of a heat dissipation structure, heat is dissipated from the units inside a vehicle-mounted projector, whereby the vehicle-mounted projector can meet the ambient temperature requirement to protect the key units of the vehicle-mounted projector, so that the vehicle-mounted projector can operate normally, and the service life of the vehicle-mounted projector is effectively extended. The specific structure of the vehicle-mounted projector and the vehicle provided by the embodiment of the present application will be described below in combination with the accompanying drawings.

[0023] With reference to Fig. 1, a first aspect of the embodiment of the present application provides a vehicle-mounted projector 100, wherein the vehicle-mounted projector 100 may include a light source pre-installation module 200, a first sensor 240, and a first heat dissipation component 300. The light source pre-installation module 200 may further include a base 210, a light source 220, and a first circuit board 230. In one embodiment of the present application, the light source 220 may be located on the base 210, and the first circuit board 230 may be adjacent to one side of the base 210 so that the light source 220 and the first circuit board 230 can establish an electrical connection. In one possible embodiment, the light source 220 may be a laser light source, and the base 210 may be an aluminum block base with good electrical conductivity. Alternatively, the first sensor 240 may be located on the first circuit board 230.It should be understood that the first sensor 240 is capable of detecting the temperature of the light source 220 in real time to protect the light source 220 according to the detected temperature in real time, while the first heat dissipation component 300 may be connected to the light source pre-installation module 200 to enable the first heat dissipation component 300 to dissipate heat from the light source pre-installation module 200. In this way, when the light source 220 gradually heats up with increasing operating time, the first heat dissipation component 300 can dissipate heat from the light source 220, reduce the real-time temperature of the light source 220, and achieve a good heat dissipation function.

[0024] With reference to Fig. 1, based on the above embodiment, the first heat dissipation component 300 may include a heat dissipation block 310, a heat-conducting strip 320, and a first fan 330. The heat-conducting strip 320 may be connected to an end of the heat dissipation block 310 facing toward the light source pre-installation module 200, while the first fan 330 may be connected to an end of the heat dissipation block 310 facing away from the light source pre-installation module 200.

[0025] With reference to Fig. 1, a side of the heat dissipation block 310 facing the heat-conducting strip 320 may be provided with a recess 311 based on the above embodiment. In one possible embodiment, the recesses 311 and the heat-conducting strips 320 may be provided in a number greater than 1, and the present application does not limit the number of the recesses 311 and the heat-conducting strips 320. In one embodiment of the present application, the number of heat-conducting strips 320 may be equal to the number of recesses 311, wherein the heat-conducting strips 320 and the recesses 311 may be arranged one-to-one correspondingly, and wherein each heat-conducting strip 320 may be embedded in each recess 311 to enable the heat-conducting strip 320 to abut against the heat dissipation block 310.It should be understood that the shape of the recess 311 may be the same as the shape of the heat-conducting strip 320, and the dimension of the recess 311 may be greater than or equal to the dimension of the heat-conducting strip 320, so that the heat-conducting strip 320 can better adhere to the heat dissipation block 310. In one possible embodiment, the heat dissipation block 310 may be an aluminum heat dissipation block 310, and the heat-conducting strip 320 may be a heat-conducting copper strip, all of which have good thermal conductivity properties. Under the action of the heat dissipation block 310, the heat-conducting strip 320, and the first fan 330, a good heat dissipation function for the light source 220 can be achieved.

[0026] With reference to Fig. 2, the vehicle-mounted projector 100 based on the above embodiment may further include a chip module 400 and a second heat dissipation component 500. Here, the chip module 400 may further include a chip 410 and a second circuit board 420, wherein the chip 410 and the second circuit board 420 may establish electrical connection. In one embodiment of the present application, the chip module 400 may be connected to the second heat dissipation component 500 to enable the second heat dissipation component 500 to dissipate heat from the chip module 400. In this way, when the chip 410 gradually heats up with increasing operating time, the second heat dissipation component 500 can dissipate heat from the chip 410, reduce the temperature of the chip 410, and achieve a good heat dissipation function.

[0027] With reference to Fig. 2, based on the above embodiment, the second heat dissipation component 500 may further comprise a first heat sink 510, a second heat sink 520, a second fan 530, and a first thermally conductive adhesive 540. In one possible embodiment, a side of the first heat sink 510 facing the chip module 400 may have a first protrusion 511, wherein one side of the first thermally conductive adhesive 540 may be bonded to the first protrusion 511, and wherein the other side of the first thermally conductive adhesive 540 may be bonded to the chip module 400. In this way, the first heat sink 510 may be connected to the chip module 400 by the first thermally conductive adhesive 540, wherein the first protrusion 511 of the first heat sink 510 may correspond to the chip 410.Accordingly, the second heat sink 520 can be connected to an end of the first heat sink 510 facing away from the chip module 400, wherein the first heat sink 510 can be located between the second heat sink 520 and the chip module 400. Furthermore, the second fan 530 can be connected to the other end of the second heat sink 520. For example, the second fan 530 can be located on a side surface of the second heat sink 520, wherein the second fan 530 and the first heat sink 510 are each arranged in different directions of the second heat sink 520. In one possible embodiment, the first heat sink 510 can be an aluminum block heat sink and the second heat sink 520 can be an iron heat sink, both of which have good thermal conductivity.Under the action of the first heat sink 510, the second heat sink 520, the first fan 330 and the first thermally conductive adhesive 540, a good heat dissipation function for the chip 410 can be achieved.

[0028] See also Fig. 2, the vehicle-mounted projector 100 based on the above embodiment may further include a second sensor 430 and a third sensor 550. The second sensor 430 may be located on the second circuit board 420. It should be understood that the second sensor 430 is capable of detecting the temperature of the chip 410 in real time to protect the chip 410 according to the temperature detected in real time. Accordingly, the third sensor 550 may be located on the second heat sink 520. Since the second heat sink 520 is located at a more outer end in the vehicle-mounted projector 100, the third sensor 550 is capable of detecting the external ambient temperature of the vehicle-mounted projector 100 to detect the ambient temperature around the entire vehicle in real time.

[0029] Based on the above embodiment, the internal and external temperatures of the vehicle-mounted projector 100 can be detected by the first sensor 240, the second sensor 430, and the third sensor 550, respectively. When the vehicle-mounted projector 100 is operating normally, the first fan 330 and the second fan 530 operate at normal speeds, and the light source 220 operates at normal current. When the actual temperature is close to the maximum operating temperature of the light source 220 and the chip 410, the speed of the first fan 330 and the second fan 530 can be increased.It should be understood that if the actual temperature is still close to the maximum operating temperature of the light source 220 and the chip 410 after the first fan 330 and the second fan 530 increase their speeds, the current of the light source 220 can be reduced, thereby reducing the temperature and protecting the light source 220 and the chip 410. Additionally, the speed and current of the first fan 330 and the second fan 530 are dynamically controlled by the control board, thereby achieving dynamic temperature control.

[0030] With reference to Fig. 3, the vehicle-mounted projector 100 based on the above embodiment may further include a drive main board 600 and a third heat dissipation component 700. Here, in one embodiment of the present application, the drive main board 600 may be connected to the third heat dissipation component 700 to enable the third heat dissipation component 700 to dissipate heat from the drive main board 600. In this way, when the drive main board 600 gradually heats up with increasing operating time, the third heat dissipation component 700 can dissipate heat from the drive main board 600, reduce the temperature of the drive main board 600, and achieve a good heat dissipation function.

[0031] With reference to Fig. 3, the third heat dissipation component 700 based on the above embodiment may further include a cover plate 710 and a second thermally conductive adhesive 720. In one possible embodiment, a side of the cover plate 710 facing the drive main board 600 may have a second protrusion 711, wherein one side of the second thermally conductive adhesive 720 may be bonded to the second protrusion 711, and wherein the other side of the second thermally conductive adhesive 720 may be bonded to the drive main board 600. In one possible embodiment, the second thermally conductive adhesives 720 and the second protrusions 711 may be provided in a number greater than one, and the present application does not limit the number of the second thermally conductive adhesives 720 and the second protrusions 711.In one embodiment of the present application, the number of second thermally conductive adhesives 720 may be equal to the number of second protrusions 711, with the second thermally conductive adhesives 720 and the second protrusions 711 being arranged in a one-to-one correspondence. In this way, the cover plate 710 may be connected to the drive main board 600 by the plurality of second thermally conductive adhesives 720. In one possible embodiment, the cover plate 710 may be an aluminum cover plate with good thermal conductivity. Under the action of the cover plate 710 and the second thermally conductive adhesives 720, a good heat dissipation function for the drive main board 600 can be achieved.

[0032] With reference to Fig. 4, the vehicle-mounted projector 100 based on the above embodiment may further include a support tray 800 and a fourth heat dissipation component 900. The fourth heat dissipation component 900 may include a heat sink 910. In one possible embodiment, the heat sinks 910 may be provided in a number greater than one, and the present application does not limit the number of heat sinks 910. In one embodiment of the present application, the plurality of heat sinks 910 may be located in the support tray 800 to enable the fourth heat dissipation component 900 to dissipate heat from the support tray 800. Of course, in some other embodiments, the fourth heat dissipation component 900 may also be another heat dissipation structure, which is not limited in the present application.In one possible embodiment, the carrier shell 800 can be a cast aluminum shell, which is characterized by its low weight and high thermal conductivity. The cooling disk 910 can be provided at the higher-temperature location inside the carrier shell 800 to accelerate heat dissipation.

[0033] See also Fig.4, the carrier shell 800 can be formed as a three-dimensional structure based on the above embodiment. In one possible embodiment, the carrier shell 800 can have a first carrier layer 810 and a second carrier layer 820. The first carrier layer 810 and the second carrier layer 820 can be arranged at the top and bottom in the height direction of the carrier shell 800. In one possible embodiment, the light source pre-installation module 200, the chip module 400, and the drive main board 600 can all be located on the carrier shell 800. The light source pre-installation module 200 can be located in the first carrier layer 810, the chip module 400 in the second carrier layer 820, and the drive main board 600 can be located at the top of the carrier shell 800.In this way, the support shell 800 with a three-dimensional structure can utilize the height space within the vehicle itself, which meets the installation space requirement and ensures the projection performance of the vehicle-mounted projector 100.

[0034] A second aspect of the embodiment of the present application provides a vehicle (not shown). The vehicle may include the vehicle-mounted projector 100 described above. The vehicle-mounted projector 100 provided by the present application can meet the requirements for vibration resistance, high-temperature resistance, waterproofness, dustproofness, and weather resistance, etc., which is capable of both achieving normal operation and effectively extending the service life of the vehicle-mounted projector 100.

[0035] The respective embodiments or embodiments in the description are explained progressively, with each embodiment focusing on the differences from other embodiments and the same and similar parts of each embodiment can be related to each other.

[0036] It should be noted that throughout the specification, references to "in a particular embodiment," "in some embodiments," "in the present embodiment," "exemplary," etc., indicate that the described embodiments may include a particular feature, structure, or characteristic, but not every embodiment necessarily includes the particular feature, structure, or characteristic. Furthermore, such terms do not necessarily refer to the same embodiment. In describing a particular feature, structure, or characteristic in connection with one embodiment, the implementation of such feature, structure, or characteristic in connection with other embodiments, explicitly or not explicitly described, is within the skill of those skilled in the art.

[0037] In general, terms should be understood at least in part by their use in context. For example, the term "one or more," as used in the description, may be used, at least in part, in context to describe any singular feature, structure, or property, or it may be used to describe a combination of features, structures, or properties in the plural. Similarly, terms such as "a" or "a-represented" may also be used in the singular or the plural, depending at least in part on the context.

[0038] It should be understood that the terms "on ...", "over ...", and "above ..." in this disclosure should be interpreted as broadly as possible, such that "over ...." includes not only the meaning of "directly on something", but also "on something" with an intervening feature or layer, and "over ..." or "above ..." includes not only the meaning of "over" or "above" something, but also the meaning of "over" or "above" without an intervening feature or layer (i.e., directly on something).

[0039] In addition, spatially relative terms may be used in the text for illustrative purposes, e.g., "below," "under," "beneath," "above," "above," etc., to describe the relationship of one element or feature to other elements or features as shown. The spatially relative terms are intended to encompass various orientations of a device in use or operation that differ from the orientation shown in the accompanying drawings. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatially relative terms used in the text may also be interpreted accordingly.

[0040] Finally, it should be noted that the above embodiments serve only to illustrate the technical solution of the present application, rather than to limit it. Although the present application is explained in more detail in connection with the above embodiments, those skilled in the art should understand that they may modify the technical solutions listed in the above embodiments or replace the technical features partially or entirely with equivalent ones. With these modifications or replacements, the corresponding technical solutions should still be considered to be covered by the spirit and scope of the technical solutions of the respective embodiments of the present application.

Claims

[1] Vehicle-mounted projector, characterized by that it includes: a light source pre-installation module comprising a base, a light source, and a first circuit board, wherein the light source is located on the base, and wherein the first circuit board abuts one side of the base, and wherein the light source is electrically connected to the first circuit board; a first sensor located on the first circuit board, the first sensor used to detect a temperature of the light source in real time; a first heat dissipation component connected to the light source pre-installation module, such that the first heat dissipation component dissipates heat from the light source pre-installation module. [2] Vehicle-mounted projector according to claim 1, characterized byin that the first heat dissipation component comprises a heat dissipation block, a heat-conducting strip, and a first fan; wherein the heat-conducting strip is connected to an end of the heat dissipation block facing the light source pre-installation module, and wherein the first fan is connected to an end of the heat dissipation block facing away from the light source pre-installation module. [3] Vehicle-mounted projector according to claim 2, characterized by that the heat dissipation block is provided with at least one recess; wherein the heat-conducting strip is embedded in the recess, and wherein the heat-conducting strip rests against the heat dissipation block. [4] Vehicle-mounted projector according to claim 1, characterized by that the vehicle-mounted projector further comprises a chip module and a second heat dissipation component; wherein the chip module comprises a chip and a second circuit board, and wherein the chip is electrically connected to the second circuit board; and wherein the chip module is connected to the second heat dissipation component; and wherein the second heat dissipation component is used to dissipate heat from the chip module. [5] Vehicle-mounted projector according to claim 4, characterized by that the second heat dissipation component comprises a first heat sink, a second heat sink, a second fan and a first thermally conductive adhesive; wherein the first heat sink has a first protrusion, and wherein one side of the first thermally conductive adhesive is bonded to the first protrusion and the other side of the first thermally conductive adhesive is bonded to the chip module; and wherein the second heat sink is connected to an end of the first heat sink facing away from the chip module, and wherein the second fan is connected to the other end of the second heat sink. [6] Vehicle-mounted projector according to claim 5, characterized by that the vehicle-mounted projector further comprises a second sensor and a third sensor; wherein the second sensor is located on the second circuit board, and wherein the second sensor is used to detect a temperature of the chip in real time; and wherein the third sensor is located on the second heat sink, and wherein the third sensor is used to detect an external ambient temperature of the vehicle-mounted projector. [7] Vehicle-mounted projector according to claim 1, characterized by that the vehicle-mounted projector further comprises a drive main board and a third heat dissipation component; wherein the drive main board is connected to the third heat dissipation component; and wherein the third heat dissipation component is used to dissipate heat from the drive main board. [8] Vehicle-mounted projector according to claim 7, characterized by in that the third heat dissipation component comprises a cover plate and a plurality of second thermally conductive adhesives; wherein the cover plate has a plurality of second protrusions, and wherein one side of the second thermally conductive adhesive is bonded to the second protrusions and the other side of the second thermally conductive adhesive is bonded to the drive main board. [9] Vehicle-mounted projector according to claim 1, characterized by that the vehicle-mounted projector further comprises a support tray and a fourth heat dissipation component; wherein the fourth heat dissipation component comprises a plurality of cooling disks located in the support shell; and wherein the fourth heat dissipation component is used to dissipate heat from the support shell. [10] Vehicle, characterized by that it comprises a vehicle-mounted projector according to one of claims 1 to 9.

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