Electrolytic capacitor

Abstract

Electrolytic capacitor comprising: a cylindrical main body casing having a base and in which one end side is closed and an opening is formed on the other end side; a capacitor element housed in the main body casing; a sealing means in which a first through-hole and a second through-hole are formed so as to be aligned in a first direction and which is arranged on an inner side of the main body case for sealing the opening; an outer compression deformation suppression plate, which slides against an end face of the sealant on the side of the opening, in which a third through-hole is formed to overlap the first through-hole in the first direction and in a second direction orthogonal to the first direction, and in which a fourth through-hole is formed to overlap the second through-hole in the first direction and in the second direction; a first lead terminal connected to the capacitor element in the main body case and drawn to the outside of the main body case through the first through hole and the third through hole; a second lead terminal connected to the capacitor element in the main body case and drawn through the second through-hole and the fourth through-hole to the outside of the main body case; and a seat plate disposed close to and opposite an end portion of the main body casing on the side of the opening in a third direction orthogonal to the first direction and the second direction, wherein the first line connection comprises: a first round rod portion disposed within the first through-hole and having an outer diameter larger than an inner diameter of the third through-hole; a first welded portion disposed at an end portion of the first round bar portion on the side of the opening in the third direction; and a first fixed portion disposed outside the main body housing and soldered to a circuit board, the second line connection includes: a second round rod portion disposed within the second through-hole and having an outer diameter larger than the inner diameter of the fourth through-hole; a second welded portion disposed at an end portion of the second round bar portion on the side of the opening in the third direction; and a second fixed portion disposed outside the main body housing and soldered to the circuit board, the main body housing includes: a body portion in which the capacitor element is housed; and a narrowed portion extending from the body portion to the opening, in which an inner diameter is smaller than an inner diameter of the body portion, the sealant is arranged to overlap the narrowed portion in the third direction, when the sealant is pressed against a side of the capacitor element along the third direction, an edge portion of the third through-hole abuts against the first welded portion and an edge portion of the fourth through-hole abuts against the second welded portion to limit movement of the sealant to the side of the capacitor element, and a gap is provided between the first lead terminal and the third through-hole and a gap is provided between the second lead terminal and the fourth through-hole.

Description

BACKGROUND

[0001] The present device relates to electrolytic capacitors.

[0002] An electrolytic capacitor is provided, which includes a main body casing, a capacitor element, a sealant, and lead terminals. The main body casing is in the shape of a cylinder with a base in which one end is closed and the other end is open. The capacitor element is housed in the main body casing. The sealant is in the shape of a plate. The sealant seals the opening of the main body casing. The capacitor element includes an anode foil, a separator, and a cathode foil. The anode foil and the cathode foil are arranged opposite each other via the separator.

[0003] The capacitor element is formed by winding the anode foil, separator, and cathode foil together. The capacitor element contains at least one electrolytic solution or solid electrolyte. One end of the lead terminals is connected to the anode foil and the cathode foil, respectively. The other end of the lead terminals penetrates the sealant and is drawn to the outside of the opening portions of the main body casing.

[0004] In the electrolytic capacitor described above, a plate-shaped accessory can be applied to the end surface of the sealant on the opening portion side of the main body case (Patent Document 1). In the sealant and the accessory, all contact surfaces are bonded together, so that the sealant and the accessory form a single unit. The outer diameter of the accessory is substantially equal to the outer diameter of the sealant. SUMMARY OF THE INVENTION

[0005] Furthermore, depending on the environment in which the electrolytic capacitor is installed, the pressure inside the main body casing or the external pressure may fluctuate, which may lead to deformation of the sealant. Here, as described above, the accessory is bonded to the end surface of the sealant on the opening portion side. This prevents the sealant from deforming, making it unlikely that the sealant will follow the expansion / contraction of the electrolytic capacitor caused by pressure fluctuations inside the main body casing. This may reduce the sealing effect of the sealant.

[0006] Examples of the above-described environment include a case where the electrolytic capacitor is mounted on a circuit board and is being soldered. Specifically, in this case, the heat generated by soldering may cause a component inside the main body case (e.g., the electrolytic solution, a component of the solid electrolyte, moisture contained in the capacitor element, or the like) to evaporate, thus increasing the pressure inside the main body case, with the result that the electrolytic capacitor may be expanded. Furthermore, at this time, the electrolytic capacitor is likely to be cooled to room temperature after the completion of soldering, and thus the expanded electrolytic capacitor is contracted to its original state.When the pressure inside the main body housing increases, the sealant may deform and be forced out of the opening section of the main body housing. Especially during reflow soldering, the heat impact is increased.

[0007] Depending on the environment in which the electrolytic capacitor is arranged, the sealant may be inadvertently displaced from its fixed position. An example of the environment as described above is a case where the electrolytic capacitor's surroundings are molded with a molding resin. In such a case, the sealant is pressed to the capacitor element side (the inside of the main body case) by a pressure applied during the injection of the molding resin. Then, the sealant may be deformed by the pressing force or pressed to the capacitor element side (the inside of the main body case) to be moved from the fixed position.

[0008] As described above, if the sealant is moved from its fixed position to the side of the capacitor element, the sealant may press against the capacitor element and adversely affect it. If the sealant is moved from its fixed position, the sealing effect of the sealant may be reduced. Furthermore, if the sealant is moved, the piping connections may be adversely affected.

[0009] Therefore, an object of the present invention is to provide an electrolytic capacitor that can suppress adverse effects on a capacitor element and lead terminals while suppressing the reduction in the sealing effect of a sealant.

[0010] To achieve the above-described object, an electrolytic capacitor according to the first aspect of the present invention comprises: a main body case, a capacitor element, a sealant, an outer compression deformation suppressing plate, a first lead terminal, a second lead terminal, and a seat plate. The main body case has a base, and one end side is closed, while an opening is formed on the other end side. The capacitor element is housed in the main body case. A first through-hole and a second through-hole are formed in the sealant so as to be aligned in a first direction, and the sealant is arranged on the inside of the main body case to seal the opening.The outer compression deformation suppressing plate slidably abuts against an end surface of the sealant on one side of the opening, a third through-hole is formed to overlap the first through-hole in the first direction and a second direction orthogonal to the first direction, and a fourth through-hole is formed to overlap the second through-hole in the first direction and the second direction. The first lead terminal is connected to the capacitor element in the main body case and is pulled to the outside of the main body case through the first through-hole and the third through-hole. The second lead terminal is connected to the capacitor element in the main body case and is pulled to the outside of the main body case through the second through-hole and the fourth through-hole.The seat plate is disposed close to and opposite an end portion of the main body casing on the opening side in a third direction orthogonal to the first direction and the second direction. The first lead terminal includes: a first round bar portion disposed within the first through-hole and having an inner diameter larger than the inner diameter of the third through-hole; a first welded portion disposed at an end portion of the first round bar portion on the opening side in the third direction; and a first welded portion disposed outside the main body casing and soldered to a circuit board.The second lead terminal includes: a second round rod portion disposed inside the second through-hole and having an outer diameter larger than the inner diameter of the fourth through-hole; a second welded portion disposed at an end portion of the second round rod portion on the opening side in the third direction; and a second fixed portion disposed outside the main body case and soldered to the circuit board. The main body case includes: a body portion accommodating the electrolytic capacitor therein; and a constricted portion extending from the body portion to the opening and having an inner diameter smaller than the inner diameter of the body portion. The sealant is disposed to overlap the constricted portion in the third direction.When the sealant is pressed toward one side of the capacitor element along the third direction, an edge portion of the third through-hole abuts against the first welded portion, and an edge portion of the fourth through-hole abuts against the second welded portion to limit movement of the sealant toward the capacitor element side. A gap is provided between the first lead terminal and the third through-hole, and a gap is provided between the second lead terminal and the fourth through-hole.

[0011] In the first aspect of the present device, the outer compression deformation suppressing plate is arranged to slidably engage the end face of the sealant on the opening side. Therefore, the outer compression deformation suppressing plate slides on the end face of the sealant on the opening side to follow the deformation of the sealant, even when the sealant is deformed or moved. Therefore, the outer compression deformation suppressing plate is unlikely to hinder the deformation of the sealant, and thus, it is possible to prevent a reduction in the sealing effect of the sealant.

[0012] Even if the sealant is pressed toward the capacitor element side along the third direction, the movement of the sealant toward the capacitor element side is to be limited. Therefore, the sealant is unlikely to be moved from a fixed position, and thus adverse effects on the capacitor element caused by the movement of the sealant are suppressed. The gap is provided between the first lead terminal and the third through-hole, and the gap is provided between the second lead terminal and the fourth through-hole. Therefore, the sealant (the inner surface of the third through-hole and the inner surface of the fourth through-hole) is unlikely to come into contact with the first lead terminal and the second lead terminal, even if the sealant is slightly moved or deformed.This makes it possible to reduce the friction between the first and second pipe terminals and the sealant. Therefore, it is possible to suppress adverse effects on the first and second pipe terminals caused by the movement of the sealant. SHORT DESCRIPTION OF THE CHARACTERS Fig. 1 is a view illustrating a state in which an electrolytic capacitor according to the present embodiment is mounted on a circuit board; Fig. 2 is an enlarged cross-sectional view illustrating the vicinity of a constricted portion; Fig. 3 is a perspective view illustrating the configuration of a capacitor element; Fig. 4 is a view illustrating a state in which the vicinity of the electrolytic capacitor is formed; Fig. 5 is a view in which a sealant and an outer compression deformation suppressing plate are viewed from the side of an end face on the side of the opening along a Z direction; Fig. 6 is a perspective view of the sealant and the outer compression deformation suppression plate; and Fig. 7 is a cross-sectional view showing a cross section of the electrolytic capacitor along a Fig. 6 illustrates the straight line L2. DETAILED DESCRIPTION <grundausgestaltung>

[0013] A basic configuration in an embodiment of the present device will be described below with reference to drawings. Fig. 1 is a view illustrating a state in which an electrolytic capacitor 1 according to the present embodiment is mounted on a circuit board 2.

[0014] As in Fig. 1, the electrolytic capacitor 1 is mounted on the circuit board 2 via a seat plate 1a. One direction (direction parallel to the Fig. 1) which is parallel to a direction in which the electrolytic capacitor 1 is mounted on the printed circuit board 2 is hereinafter referred to simply as the "Z direction" (= third direction). In each of the drawings, the direction indicated by the arrows ZZ' is the Z direction.

[0015] The electrolytic capacitor 1 includes a main body case 4, a capacitor element 5, a sealant 6, a first lead terminal 7a, a second lead terminal 7b, and an outer compression deformation suppression plate 8.

[0016] The main body housing 4 is made of aluminum, for example. The main body housing 4 is a cylinder having a base, one end of which is closed in the Z direction and the other end of which is open. The main body housing 4 includes an upper portion 4c, a body portion 4d, a constricted portion 4a, and a bent portion 4b. An opening portion 3 is formed in the main body housing 4.

[0017] The upper portion 4c closes one end side of the main body case 4 in the Z direction. The opening portion 3 is arranged on the other end side of the main body case 4 in the Z direction. The opening portion 3 is an opening that serves as a boundary between the inside and outside of the main body case 4. The body portion 4d extends from the peripheral edge of the upper portion 4c to the opening portion 3 side (the circuit board 2 side) along the Z direction.

[0018] Fig. 2 is an enlarged cross-sectional view illustrating the vicinity of the constricted portion 4a. As shown in Fig. 1 and Fig. 2, the narrowed portion 4a is connected to the lower portion of the body portion 4d (the end portion of the body portion 4d on the circuit board 2 side) in the Z direction. The narrowed portion 4a has a shape that is narrowed toward the inside of the main body case 4, that is, in the radial direction of the main body case 4, from the body portion 4d and the bending portion 4b. The preferable position of the narrowed portion 4a in the Z direction is the position of about half the length from the end surface on the main body side 6q (details of which will be described later) to the end surface on the opening 6r side (details of which will be described later) in the Z direction. The narrowed portion 4a is formed in a circular shape so as to extend around the inner surface of the main body case 4.

[0019] A more detailed description will be given below. The inner surface of the constricted portion 4a protrudes in a direction (parallel to the circuit board 2) orthogonal to the Z direction toward the inside of the main body case 4, compared to the inner surface of the body portion 4d. The vertex of the inner surface of the constricted portion 4a in the direction orthogonal to the Z direction (in other words, the part of the inner surface of the constricted portion 4a closest to the inside of the main body case) is referred to as vertex P1. The inner diameter d1 of the main body case 4 at vertex P1 is smaller than the inner diameter d2 of the main body case 4 in the body portion 4d.

[0020] The bending portion 4b is connected to the lower portion of the narrowed portion 4a (the end portion of the narrowed portion 4a on the circuit board 2 side) in the Z direction. Since the bending portion 4b extends from the lower portion of the narrowed portion 4a along the Z direction to the circuit board 2 side, the bending portion 4b is bent in the Y direction toward the interior of the main body case 4. The front end of the bending portion 4b forms the opening edge of the opening portion 3.

[0021] The lower end portion 4e of the bending portion 4b (the part of the main body case 4 located on the lowermost side along the Z direction) is close to and opposite to the surface of the seat plate 1a in the Z direction. Here, the lower end portion 4e being close to and opposite to the surface of the seat plate 1a means that the lower end portion 4e may be adjacent to the seat plate 1a or may be opposite to the seat plate 1a with a slight gap therebetween in the Z direction.

[0022] The capacitor element 5 is housed in the main body casing 4. The capacitor element 5 is arranged to overlap the body portion 4d in the Z direction. The capacitor element 5 contains an electrolytic solution.

[0023] Fig. 3 is a perspective view illustrating the configuration of the capacitor element 5. As in Fig. 3, the capacitor element 5 comprises a separator 10, an anode foil 11 and a cathode foil 12. The capacitor element 5 contains at least one electrolytic solution or a solid electrolyte.

[0024] The separator 10 is applied to the anode foil 11. The cathode foil 12 lies opposite the anode foil 11 above the separator 10. The separator 10, the anode foil 11, and the cathode foil 12 are wound together and housed in the body portion 4d (see Fig. 1). The width of the separator 10 in the Z direction is greater than the width of the anode foil 11 and the width of the cathode foil 12.

[0025] The sealant 6 is an insulating elastic element. The sealant 6 consists, for example, of butyl rubber, ethylene-propylene rubber, or similar.

[0026] The sealant 6 has the shape of a round plate in plan view (see Fig. 5, which will be discussed later). As in the Fig. 1 and Fig. As illustrated in Figure 2, the sealant 6 is housed in the main body casing 4. The sealant 6 is arranged to overlap the narrowed portion 4a in the Z direction. The sealant 6 is arranged between the capacitor element 5 and the opening portion 3 in the Z direction.

[0027] The sealant 6 is inserted into the main body casing 4. The outer peripheral surface of the sealant 6 abuts against the inner peripheral surface of the main body casing 4 (more specifically, against the inner surface of the constricted portion 4a). Thus, the sealant 6 seals the opening portion 3. The detailed configuration of the sealant 6 is as follows.

[0028] The sealant 6 includes the end face on the side of the main body 6q, the end face on the side of the opening 6r, a first through hole 6a, a second through hole 6b and holding portions 6c and 6d.

[0029] The end face on the main body side 6q is the end face of the end faces of the sealant 6 in the Z direction on the capacitor element 5 side. The end face on the opening side 6r is the end face of the end faces of the sealant 6 in the Z direction on the opening portion 3 side.

[0030] The first through-hole 6a and the second through-hole 6b penetrate the sealant 6 in a thickness direction (= Z direction) from the end face on the main body 6q side to the end face on the opening 6r side. The first through-hole 6a and the second through-hole 6b are aligned on a straight line L1 parallel to the circuit board 2 (see Fig. 5, which will be discussed later).

[0031] A direction in which the first through-hole 6a and the second through-hole 6b are aligned with each other will hereinafter be referred to as the "X direction" (first direction). A direction orthogonal to the X direction and the Z direction will hereinafter be referred to as the "Y direction" (second direction). In each of the drawings, the direction indicated by the arrows XX' is the X direction. The direction indicated by the arrows YY' is the Y direction.

[0032] The holding portions 6c and 6d are arranged in both end portions of the sealant 6 in the X direction. The holding portions 6c and 6d protrude downward from the edge portion of the end surface on the opening 6r side along the Z direction (in a direction opposite to the end surface on the main body 6q side). The holding portions 6c and 6d are opposed to each other along the X direction. Preferably, the holding portions 6c and 6d are formed to be connected to each other in the Y direction to improve the sliding properties in the abutment portion of the sealant 6 and the main body casing 4.

[0033] The surfaces on the outside of the holding portions 6c and 6d are tapered in the X direction so that as the surfaces extend closer to the circuit board 2, they extend further from the inner peripheral surface of the main body case 4 along the X direction (in other words, they extend closer to a center O, which will be described later).

[0034] A gap a1 is provided between the holding portions 6c and 6d (more precisely, the tapered portions described above) and the inner surface of the bent portion 4b in the Z direction. The size of the gap a1 gradually increases from the capacitor element 5 side to the opening portion 3 side in the holding portions 6c and 6d. In other words, the gap a1 is small on the capacitor element 5 side in the holding portion 6c and large on the opening 3 side in the holding portion 6c.

[0035] The first wire connector 7a is inserted through the first through-hole 6a. The second wire connector 7b is inserted through the second through-hole 6b. The first wire connector 7a and the second wire connector 7b penetrate the seat plate 1a.

[0036] One end of the first lead terminal 7a and the second lead terminal 7b are arranged in the main body case 4 (more precisely, in the body portion 4d). One end of the first lead terminal 7a is connected to the anode foil 11. One end of the second lead terminal 7b is connected to the cathode foil 12.

[0037] The other ends of the first lead terminal 7a and the second lead terminal 7b are drawn to the outside of the main body case 4 (the outside with respect to the opening portion 3 of the main body case 4). The detailed configuration of the first lead terminal 7a is as follows.

[0038] As in Fig. As illustrated in Figure 2, the first lead terminal 7a includes a first member 21 and a second member 22. The first member 21 is made of, for example, aluminum. The second member 22 is formed of, for example, a CP wire having a copper layer on the outer peripheral surface of an iron wire.

[0039] The first member 21 includes a first round bar portion 15a, a first rib portion 15b, a first welded portion 15c, and a flat plate portion 25. The first round bar portion 15a has a cylindrical shape. The first round bar portion 15a, the first rib portion 15b, and the first welded portion 15c are formed using the shape of a round bar (e.g., a cylindrical aluminum member) that constitutes the first member 21.

[0040] The first round bar section 15a is pressed into the first through-hole 6a (with an interference). The first round bar section 15a is arranged to overlap the narrowed section 4a in the Z direction. The diameter (diameter d3) of the first round bar section 15a is larger than the width of the first welded section 15c (length parallel to a plane perpendicular to the Fig. 1 arrows Z-Z').

[0041] The first rib portion 15b is formed at an end portion on the side of the flat plate portion 25 relative to the first round bar portion 15a. The second member 22 is drawn to the outside of the main body case 4.

[0042] The first welded portion 15c is located at the bottom of the first round bar portion 15a (the side of the circuit board 2) in the Z direction and is the welded part of the first member 21 and the second member 22. The first welded portion 15c is shaped so that the first welded portion 15c extends upward from the bottom end in the Z direction and its width increases. The diameter d4 of the first lead terminal 7a on the other end side relative to the first welded portion 15c (on the side of the end portion drawn to the outside of the main body case 4) is smaller than the diameter d3 of the first round bar portion 15a.

[0043] The flat plate portion 25 has the shape of a long, thin plate, and the width of the flat plate portion 25 is designed to be constant from the first rib portion 15b to a front end. The flat plate portion 25 is formed by pressing one end side of the round bar constituting the first member 21 and cutting off an unnecessary part. During the pressing, the first rib portion 15b is formed simultaneously.

[0044] The second member 22 is a tinned CP wire. The second member 22 is inserted into a hole (not shown) in the first welded portion 15c of the first member 21 and welded. In this way, the first member 21 and the second member 22 are mechanically and electrically fixed. The second member 22 includes a first bending portion 16 (first fixed portion) located at an end portion on a side opposite the first member 21.

[0045] Dating back to Fig. 1, the first welded portion 16 extends downward from the lower end portion of the first welded portion 15c along the Z direction and is bent toward the outside of the electrolytic capacitor 1 along the circuit board 2. A part of the first lead terminal 7a on the other end side of the first bent portion 16 is soldered to the circuit board 2.

[0046] The detailed design of the second line connection 7b is as follows. As shown in Fig. As illustrated in Figure 2, the second lead terminal 7b includes a third member 23 and a fourth member 24. The third member 23 is made of, for example, aluminum. The fourth member 24 is formed of, for example, a CP wire having a copper layer on the outer peripheral surface of an iron wire.

[0047] The third member 23 consists of a second round bar portion 17a, a rib portion 17b, a second welded portion 17c, and a flat plate portion 26. The second round bar portion 17a has a cylindrical shape. The second round bar portion 17a, the second rib portion 17b, and the second welded portion 17c are formed by utilizing the shape of a main body casing (e.g., a cylindrical aluminum member) from which the third member 23 is composed.

[0048] The second round bar portion 17a is press-fitted (inserted with interference) into the second through-hole 6b. The second round bar portion 17a is arranged to overlap the narrowed portion 4a in the Z direction. The diameter (diameter d5 of the second round bar portion 17a) of the second round bar portion 17a is larger than the width of the second welded portion 17c.

[0049] The second rib portion 17b is formed at an end portion on the side of the flat plate portion 26 relative to the second round bar portion 17a. The fourth member 24 is drawn to the outside of the main body case 4.

[0050] The second welded portion 17c is located at the bottom of the second round bar portion 17a (the circuit board 2 side) in the Z direction and is the welded part of the third member 23 and the fourth member 24. The second welded portion 17c is shaped so that the second welded portion 17c extends upward from the lower end (boundary portion with the fourth member 24) in the Z direction and its width increases. The diameter d4 of the second lead terminal 7b on the other end side relative to the second welded portion 17c (on the side of the end portion drawn to the outside of the main body case 4) is smaller than the diameter d5 of the second round bar portion 17a.

[0051] The flat plate portion 26 has the shape of a long, thin plate, and the width of the flat plate portion 26 is designed to be constant from the second rib portion 17b to a front end. The flat plate portion 26 is formed by pressing one end side of the round bar constituting the third member 23 and cutting off an unnecessary part. During the pressing, the second rib portion 17b is formed simultaneously.

[0052] The fourth member 24 is a tinned CP wire. The fourth member 24 is inserted into a hole (not shown) in the second welded portion 17c of the third member 23 and welded. In this way, the third member 23 and the fourth member 24 are mechanically and electrically fixed. The fourth member 24 includes a second bent portion 18 (second fixed portion) located at an end portion on a side opposite the third member 23. The diameter d6 of the fourth member 24 is smaller than the diameter d5 of the second round bar portion 17a.

[0053] Dating back to Fig. 1, the second bent portion 18 extends downward from the lower end portion of the second welded portion 17c along the Z direction and is bent toward the outside of the electrolytic capacitor 1 along the circuit board 2. A part of the second lead terminal 7b on the other end side of the second bent portion 18 is soldered to the circuit board 2.

[0054] The outer compression deformation suppression plate 8 is made of a synthetic resin plate mixed with a reinforcing material (such as glass fiber, cellulose fiber, or ceramic). The outer compression deformation suppression plate 8 is made of, for example, Bakelite (registered trademark).

[0055] The outer compression deformation suppressing plate 8 is a plate-shaped member having a minor axis d9 and a major axis d10 and having an oval shape in plan view along the Z direction (see the Fig. 5 and Fig. 6, which are described below). The minor axis d9 of the outer compression deformation suppression plate 8 is parallel to the X direction. The major axis d10 of the outer compression deformation suppression plate 8 is parallel to the Y direction.

[0056] As in Fig. 1 and Fig. As illustrated in FIG. 2, the surface of the outer compression deformation suppressing plate 8 on the sealant 6 side is slidably abutted against the end surface on the opening 6r side. The surface of the outer compression deformation suppressing plate 8 on a side opposite to the sealant 6 is opposed to the front end of the bending portion 4b in the Z direction. The outer compression deformation suppressing plate 8 abuts against the front end of the bending portion 4b or is located opposite the front end, with a slight gap provided therebetween in the Z direction.

[0057] The outer compression deformation suppressing plate 8 includes a third through-hole 8c, a fourth through-hole 8d, a pair of holding portions 8a and a pair of outer peripheral extension portions 8b (see Fig. 5, which will be discussed below).

[0058] The third through-hole 8c and the fourth through-hole 8d are holes that penetrate the outer compression deformation suppression plate 8 in the thickness direction (=Z direction). The third through-hole 8c and the fourth through-hole 8d are aligned along the X direction. The center of the third through-hole 8c coincides with the center of the first through-hole 6a in the X direction and the Y direction (see Fig. 5, which is described below). The center of the fourth through-hole 8d coincides with the center of the second through-hole 6b in the X-direction and in the Y-direction (see Fig. 5, which will be discussed below).

[0059] The first lead terminal 7a is inserted through the third through-hole 8c. The inner diameter d7 of the third through-hole 8c is larger than the diameter d4 of the first lead terminal 7a. Therefore, a gap a3 is provided between the first lead terminal 7a and the inner peripheral surface of the third through-hole 8c.

[0060] The second lead terminal 7b is inserted through the fourth through-hole 8d. The inner diameter d8 of the fourth through-hole 8d is larger than the diameter d6 of the second lead terminal 7b. Therefore, a gap a4 is provided between the second lead terminal 7b and the inner peripheral surface of the fourth through-hole 8d.

[0061] The inner diameter d7 of the third through-hole 8c is smaller than the diameter d3 of the first round rod portion 15a. The edge portion 8m of the third through-hole 8c, which is arranged on the sealant 6 side, is located below the first round rod portion 15a in the Z direction. The edge portion 8m and the first welded portion 15c are opposite each other in the Z direction. The inner diameter d8 of the fourth through-hole 8d is smaller than the diameter d5 of the second round rod portion 17a. The edge portion 8n of the fourth through-hole 8d, which is arranged on the sealant 6 side, is located below the second round rod portion 17a in the Z direction. The edge portion 8n and the second welded portion 17c are opposite each other in the Z direction.

[0062] The pair of holding portions 8a are arranged in parts of the outer compression deformation suppressing plate 8 on both sides in the X direction (parts overlapping the outer periphery of the outer compression deformation suppressing plate 8). The held portions 8a are arranged inward in the X direction relative to the holding portions 6c and 6d. The held portions 8a may be formed over the entire outer periphery of the outer compression deformation suppressing plate 8.

[0063] The outer peripheral surfaces of the pair of holding portions 8a (surfaces of the holding portions 8a parallel to the Z direction) abut against the inner peripheral surfaces of the holding portions 6c and 6d (surfaces of the holding portions 6c and 6d orthogonal to the end surface on the opening 6r side), respectively. The outer peripheral surfaces of the pair of holding portions 8a are rougher than the surface of the outer compression deformation suppressing plate 8 on the capacitor element 5 side. In this way, the sealant 6 penetrates into the holes and valleys of the rough surfaces, so that the outer peripheral surfaces of the held portions 8a and the inner peripheral surfaces of the holding portions 6c and 6d are bonded to each other by an anchor effect.

[0064] A compressive force corresponding to the elastic modulus of the sealant 6 is applied from the holding portions 6c and 6d toward the outer compression deformation suppressing plate 8 (more precisely, the held portions 8a) in the X direction. In this way, the outer compression deformation suppressing plate 8 is sandwiched between the holding portions 6c and 6d. As described above, the outer compression deformation suppressing plate 8 is sandwiched between the holding portions 6c and 6d while being connected to the holding portions 6c and 6d, and is thereby supported by the sealant 6.

[0065] The parts where the pair of held portions 8a and the holding portions 6c and 6d are connected to each other are arranged outside the opening portion 3 in the X direction. The detailed configuration of the pair of outer peripheral extension portions 8b will be described below.

[0066] When the internal pressure of the electrolytic capacitor 1 is increased by reflow soldering or the like when the electrolytic capacitor 1 is attached to the circuit board 2, and thus the sealant 6 is pressed along the Z direction against the circuit board 2 side, the outer compression deformation suppressing plate 8 abuts against the front end of the bending portion 4b, and thus the movement of the sealant 6 on the circuit board 2 side in the Z direction is suppressed. Even if the sealant 6 is deformed or moved, a reduction in the sealing effect of the sealant 6 is suppressed because the sealant 6 can slide on the main body case, the first round bar portion 15a, the second round bar portion 17a, and the end surface on the member 6r side of the outer compression deformation suppressing plate 8 abutting against the sealant 6.

[0067] After reflow soldering, the part of the first lead terminal 7a on the other end side of the first bending portion 16 is soldered and fixed to the circuit board 2. The part of the second lead terminal 7b on the other end side of the second bending portion 18 is soldered and fixed to the circuit board 2.

[0068] Fig. 4 is a view illustrating a state in which the vicinity of the electrolytic capacitor 1 is sealed. As in Fig. 4, the surroundings of the electrolytic capacitor 1 can be molded with a molding resin 9 together with the circuit board 2. The surroundings of the electrolytic capacitor 1 are molded, whereby the water, moisture, oil, chemical, dust, and vibration resistance can be improved. When molding using the molding resin 9 as shown in Fig. 4, the electrolytic capacitor 1 and the circuit board 2 may be molded with the molding resin 9 on the side of the electrolytic capacitor 1 (the front surface side) or molded together with the back side of the circuit board 2 (not shown).

[0069] When casting the surroundings of the electrolytic capacitor 1, a mold is prepared that covers the parts to be cast, and the casting resin 9 is injected into the mold. The injection pressure of the casting resin 9 (in Fig. 4 illustrated by white arrows) to the electrolytic capacitor 1.

[0070] Specifically, when injecting the mold resin, a compressive force acts on the upper portion 4c toward the inside of the main body case 4 along the Z direction, a compressive force acts on the side portions of the main body case 4 (the body portion 4d, the narrowed portion 4a, and the bending portion 4b) toward the capacitor element 5 side (toward the inside of the main body case 4) along the X direction, and a compressive force acts on the outer compression deformation suppressing plate 8 and the sealant 6 toward the capacitor element 5 side (toward the inside of the main body case 4) along the Z direction.

[0071] As described above, the upper portion 4c is pressed to the inside of the main body case 4 along the Z direction (when the upper portion 4c is pressed to the side of the capacitor element 5), the lower end portion 4e of the bending portion 4b is close to and opposite to the surface of the seat plate 1a in the Z direction, and thus the movement of the main body case is restricted, with the result that it is possible to suppress adverse effects on the capacitor element.

[0072] As described above, when the outer compression deformation suppressing plate 8 is pressed to the capacitor element side (the side opposite to the circuit board 2) along the Z direction, the edge portion 8m of the third through-hole 8c and the edge portion 8n of the fourth through-hole 8d in the outer compression deformation suppressing plate 8 respectively abut against the first welded portion 15c of the first lead terminal 7a and the second welded portion 17c of the second lead terminal having the fixed portion to which the circuit board 2 is fixed, with the result that the movement is restricted.

[0073] As described above, even if the outer compression deformation suppressing plate 8 and the sealant 6 are pressed in the Z direction by the injection of the die or the like, the movement of the sealant 6 toward the capacitor element side in the Z direction is limited by the restriction of the movement of the outer compression deformation suppressing plate 8. Therefore, the force with which the sealant 6 presses on the capacitor element 5 is unlikely to be exerted, and thus it is possible to suppress adverse effects on the capacitor element 5.

[0074] As described above, the end surface on the opening 6r side is slidable on the end surface of the outer compression deformation suppressing plate 8 on the sealant 6 side. Therefore, depending on the environment in which the electrolytic capacitor 1 is disposed, the sealant 6 is easily deformed when the electrolytic capacitor 1 expands or contracts, following the expansion / contraction. In other words, when the sealant 6 is deformed, the outer compression deformation suppressing plate 8 is unlikely to hinder the deformation of the sealant 6. Therefore, even if the electrolytic capacitor 1 expands or contracts, it is possible to prevent a reduction in the sealing effect of the sealant 6.

[0075] As described above, the gap a3 is provided between the first lead terminal 7a and the inner peripheral surface of the third through-hole 8c, and the gap a4 is provided between the second lead terminal 7b and the inner peripheral surface of the fourth through-hole 8d. Therefore, the friction between the first lead terminal 7a and the second lead terminal 7b and the sealant 6 is small even when the sealant 6 is slightly moved in the Z direction. Therefore, it is possible to prevent damage to the first lead terminal 7a and the second lead terminal 7b.In addition, in this way, it is possible to suppress the peeling of the tin plating caused by the friction with the sealant 6 applied to the surface of the first lead terminal 7a on the other end side with respect to the first welded portion 15c and the surface of the second lead terminal 7b on the other end side with respect to the second welded portion 17c.

[0076] As described above, the gap a1 is provided between the holding portions 6c and 6d and the inner surface of the bending portion 4b. The gap a1 gradually increases from the holding portions 6c and 6d on the capacitor element 5 side toward the opening portion 3 side. Thereby, the pressing force acting on the holding portion 6c during the injection of the mold resin 9 is easily directed in a direction (direction along the X direction) parallel to the outer compression deformation suppressing plate 8. In this way, the outer peripheral portion of the outer compression deformation suppressing plate 8 is firmly held by the holding portion 6c. The outer compression deformation suppressing plate 8 then limits the movement of the sealant 6 even if it is deformed or moved toward the capacitor element 5 side (toward the inside of the main body case 4) by the pressing force caused by the mold resin 9.Consequently, a reduction in the distance between the end face of the sealant 6 on the main body 6q side and the capacitor element 5 is suppressed, and thus it is possible to suppress adverse effects on the capacitor element 5.

[0077] As described above, the width of the separator 10 in the Z direction is larger than the width of the anode foil 11 and the width of the cathode foil 12, respectively. Therefore, even if the sealant 6 presses on the capacitor element 5, the separator 10 serves as a cushioning material, so that the force is unlikely to act on the anode foil 11 and the cathode foil 12. Therefore, it is possible to prevent damage to the anode foil 11 and the cathode foil 12. <Bevorzugte Ausgestaltung von Dichtmittel 6 und äußerer Druckverformungsunterdrückungsplatte 8>

[0078] Next, a preferred embodiment of the sealant 6 and the outer compression deformation suppression plate 8 will be described.

[0079] Fig. 5 is a view in which the sealant 6 and the outer compression deformation suppressing plate 8 are viewed from the end face side on the opening 6r side along the Z direction. Fig. 6 is a perspective view of the sealant 6 and the outer compression deformation suppression plate 8. As in Fig. 5 and Fig. 6, in addition to the configuration described above, cuts 6t and 6u are formed in the sealant 6. The cuts 6t and 6u are formed along the peripheral edge of the sealant 6 including the holding portion 6c, the opening-side end surface 6r, and the holding portion 6d. The cuts 6t and 6u are formed by cutting out an area between the holding portions 6c and 6d along the peripheral edge of the sealant 6. The outer compression deformation suppressing plate 8 is inserted into the cuts 6t and 6u.

[0080] The load deformation temperature of the outer compression set suppression plate 8 (measured according to ASTM standard "D648" A (1.82 MPa)) is equal to or greater than 140°C and equal to or less than 240°C. The load deformation temperature is adjusted by the resin plate, the reinforcing material mixed therein, and the amount of the reinforcing material mixed therein.When the outer compression deformation suppressing plate 8 is used as described above and thus the ambient temperature of the electrolytic capacitor 1 is increased (220°C to 260°C) during reflow soldering, even if the pressure inside the electrolytic capacitor 1 (= inside the main body case 4) is increased and thus a stress accompanied by deformation of the sealant 6 acts on the outer compression deformation suppressing plate 8, the rigidity of the outer compression deformation suppressing plate 8 is reduced, with the result that the central portion of the outer compression deformation suppressing plate 8 (= area around the center O including the center O) is elastically deformed and warped along with the plastic deformation toward the side of the printed circuit board 2.In other words, when the sealant 6 is deformed, the outer compression deformation suppressing plate 8 is unlikely to hinder the deformation of the sealant 6, thus preventing cracking, breakage, and destruction of the outer compression deformation suppressing plate 8. At the molding temperature during molding (e.g., 120°C to 180°C), the rigidity of the outer compression deformation suppressing plate 8 is maintained high, suppressing the deformation of the outer compression deformation suppressing plate 8 and the deformation of the sealant 6 caused by the resin injection pressure, thus preventing damage to the capacitor element 5.In addition, the central portion of the outer compression deformation suppressing plate 8 is curved to protrude toward the circuit board 2 side due to the plastic deformation during reflow soldering, thereby increasing the strength for the injection pressure of the resin compared to a flat surface, so that damage to the capacitor element 5 can be appropriately suppressed.

[0081] The length of the outer compression deformation suppression plate 8 is preferably 0.5 mm to 1.5 mm. If the length is less than 0.5 mm, the rigidity for the injection pressure of the molding resin is reduced, while if the length is more than 1.5 mm, the elastic deformation of the outer compression deformation suppression plate is small even if the internal pressure is significantly increased during reflow soldering, and thus the main body case 4 may be deformed.

[0082] The pair of holding portions 8a are arranged on the straight line L1 drawn to pass through the center of the first through-hole 6a and the center of the second through-hole 6b. In other words, the pair of holding portions 8a, the first through-hole 6a, and the second through-hole 6b are aligned on the straight line L1. The Y-direction center portions of the held portions 8a (vertices P2, which will be discussed later) are arranged on the straight line L1. A more detailed description will be given below.

[0083] The end portions (outermost parts of the outer compression deformation suppression plate 8 in the X direction) of the held portions 8a in the X direction are assumed to be the vertices P2. The vertices P2 are located on the straight line L1. As shown in Fig. 2, the vertices P2 are arranged on the inside of the main body casing 4 relative to the vertices P1 in the X direction. The vertices P2 are arranged outward in the X direction relative to the edge portions of the opening portion 3. The previously described minor axis d9 is referred to as the distance between the vertices P2 in the X direction.

[0084] As in Fig. 5 and Fig. 6, the outer compression deformation suppressing plate 8 includes, in addition to the configuration described above, the outer peripheral extension portions 8b. The outer peripheral extension portions 8b are connected to the held portions 8a along the outer periphery of the sealant 6. The outer peripheral extension portions 8b are arranged between the pair of held portions 8a in the X direction.

[0085] Here, a straight line drawn orthogonally to the straight line L1 and passing through the center O of the outer compression deformation suppressing plate 8 in the X direction and the Y direction is assumed to be the straight line L2. The pair of outer peripheral extension portions 8b are arranged on the straight line L2.

[0086] In the Y direction, the outer circumferential extension portions 8b protrude outward relative to the vertices P1 of the narrowed portion 4a. A more detailed description of the outer circumferential extension portions 8b will be given below.

[0087] Fig. 7 is a cross-sectional view showing a cross section of the electrolytic capacitor 1 along the Fig. 6 illustrates the straight line L2. As shown in the Fig. 5 to Fig. 7, a straight line L3 is arranged to overlap the X-direction end portions of the outer peripheral extension portions 8b in the Y direction (outermost parts of the outer compression deformation suppressing plate 8 in the Y direction). Specifically, the Y-direction end portions of the outer peripheral extension portions 8b are preferably arranged near the X-direction center of the outer peripheral extension portions 8b, preferably closer to the straight line L2.

[0088] As described above, the end portions of the outer peripheral extension portions 8b are located outside the main body case 4 in the Y direction with respect to the apex P1. Therefore, when the outer compression deformation suppressing plate 8 receives the injection pressure of the molding resin 9, the inner surface of the narrowed portion 4a of the main body case 4 supports the outer peripheral extension portions 8b. Then, it is possible to more strongly suppress the pressing of the outer compression deformation suppressing plate 8 (i.e., the sealant 6) toward the capacitor element 5 side (toward the inside of the main body case 4) along the Z direction.

[0089] As described above, on the straight line L1, the holding portion 6c, the held portion 8a, the third through-hole 8c, the fourth through-hole 8d, the held portion 8a, and the holding portion 6d are aligned in this order. In other words, in the X direction, the second member 22 and the fourth member 24 are arranged between the pair of holding portions 8a.

[0090] Furthermore, as described above, the straight line L1 and the straight line L2 are orthogonal to each other. In other words, the first through-hole 6a, the second through-hole 6b, the held portions 8a, and the holding portions 6c and 6d aligned on the straight line L1 are orthogonal to the outer peripheral extension portions 8b aligned on the straight line L2. Therefore, deformation of the sealant 6 is unlikely because the holding portions 6c and 6d are in contact with the holding portions 8a in the X direction and the outer peripheral extension portions 8b are in contact with the end surface on the opening 6r side in the Y direction. <variation>

[0091] The present device is not limited to the above-described embodiment, and various changes can be made without departing from the spirit of the present device. For example, although the oval shape in plan view is described as the preferred configuration of the outer compression deformation suppressing plate 8, the present device is not limited to this configuration. Specifically, the outer compression deformation suppressing plate 8 may have a shape other than the oval shape (e.g., a polygon such as a hexagon or a rhombus square) in which the distance from the center O to the front end of the outer peripheral extension portion 8b in the Y direction is longer than the distance from the center O to the front end of the held portion 8a in the X direction, or it may be a circle that does not include the outer peripheral extension portions 8b. <zusätzliche Anmerkungen>

[0092] An electrolytic capacitor (1) comprises: a cylindrical main body case (4) having a base and in which one end side is closed and an opening (3) is formed on the other end side; a capacitor element (5) housed in the main body case (4); a sealing means (6) in which a first through-hole (6a) and a second through-hole (6b) are formed to be aligned in a first direction (X-X') and which is arranged on the inside of the main body case (4) to seal the opening (3); an outer compression deformation suppressing plate (8) which slidably abuts an end face (6r) of the sealant (6) on the side of the opening (3), in which a third through-hole (8c) is formed to overlap the first through-hole (6a) in the first direction (X-X') and in a second direction (Y-Y') orthogonal to the first direction (X-X'),and in which a fourth through-hole (8d) is formed to overlap the second through-hole (8b) in the first direction (X-X') and in the second direction (Y-Y'); a first lead terminal (7a) which is connected to the capacitor element (5) in the main body case (4) and is drawn to an outside of the main body case (4) through the first through-hole (6a) and the third through-hole (8c); a second lead terminal (7b) which is connected to the capacitor element (5) in the main body case (4) and is drawn to the outside of the main body case (4) through the second through-hole (6b) and the fourth through-hole (8d); and a seat plate (1a) arranged close to and opposite an end portion (4e) of the main body casing (4) on the side of the opening (3) in a third direction (Z-Z') orthogonal to the first direction (X-X') and the second direction (Y-Y'),wherein the first lead terminal comprises a first round rod portion (15a) arranged within the first through-hole (6a), and whose outer diameter (d3) is larger than an inner diameter (d7) of the third through-hole (8c); a first welded portion (15c) arranged at an end portion of the first round rod portion (15a) on the side of the opening (3) in the third direction (Z-Z'); and a first welded portion (16) arranged outside the main body casing (4) and soldered to a circuit board (1a); wherein the second lead terminal (7b) comprises a second round rod portion (17a) arranged within the second through-hole (6b), and whose outer diameter (d5) is larger than an inner diameter (d8) of the fourth through-hole (8d); a second welded portion (17c),which is arranged at an end portion of the second round rod portion (17a) on the side of the opening (3) in the third direction (Z-Z'); and a second fixed portion (18) which is arranged outside the main body casing (4) and is soldered to the seat plate (1a), wherein the main body casing (4) comprises a body portion (4d) which houses the capacitor element (1) therein; and a constricted portion (4a) extending from the body portion (4d) to the opening (3), and whose inner diameter (d1) is smaller than an inner diameter (d2) of the body portion (4d), wherein the sealing means (6) is arranged to overlap the constricted portion (4a) in the third direction (Z-Z') when the sealing means (6) is pressed to one side of the capacitor element (5) along the third direction (Z-Z'), an edge portion (8m) of the third through-hole (8c) abuts against the first welded portion (15c),and an edge portion (8n) of the fourth through-hole (8d) abuts the second welded portion (17c) to limit movement of the sealing means (6) to the capacitor element (5) side, and a gap (a3, a4) is provided between the first lead terminal (7a) and the third through-hole (8c), and a gap (a3, a4) is provided between the second lead terminal (7b) and the fourth through-hole (8d) (first embodiment).

[0093] In the electrolytic capacitor (1) of the first embodiment, the capacitor element (5) comprises: an anode foil (11); a separator (10) applied to the anode foil (11);and a cathode foil (12) facing the anode foil (11) via the separator (10), wherein the anode foil (11), the separator (10), and the cathode foil (12) are wound together, one end of the first lead terminal (7a) is connected to the anode foil (11) and the other end thereof is drawn to the outside of the main body casing (4), one end of the second lead terminal (7b) is connected to the cathode foil (12), and the other end thereof is drawn to the outside of the main body casing (4), a width of the separator (10) in the third direction (Z-Z') is greater than a width of both the cathode foil (12) and the anode foil (11) in the third direction (Z-Z'), and the cathode foil (12) and the anode foil (11) relative to both end portions of the separator (10) in the third direction Z-Z') are arranged inwards (second embodiment).;

[0094] In the electrolytic capacitor (1) of the first aspect, the inside of the main body case (4) has a bending portion (4b) in which an end portion in the third direction (Z-Z') extending from the narrowed portion (4a) toward the opening (3) while bending toward the inside of the main body case (4) is close to or abuts against the end surface (6r) of the sealant on the side of the opening so as to be opposed to the end surface (6r) of the sealant on the side of the opening in the third direction (Z-Z') (third aspect).

[0095] In the electrolytic capacitor (1) of the first aspect, the sealing means comprises a pair of holding portions (6c, 6d) which protrude in the third direction (Z-Z') from a peripheral edge portion of the end face (6r) of the sealing means on the side of the opening toward the side of the opening (3) and are respectively provided on both sides of the outer compression deformation suppressing plate (8) in the first direction (X-X'), wherein the outer compression deformation suppressing plate (8) comprises: a pair of held portions (8a) which respectively abut against the holding portions (6c, 6d) to be opposite to the holding portions (6c, 6d) in the first direction (X-X');and a pair of outer peripheral extension portions (8b) each connected to the holding portions (8a), disposed between the holding portions (6c, 6d) in the first direction (X-X') and respectively disposed at both end portions of the outer compression deformation suppressing plate (8) in the second direction (Y-Y'), and when the outer compression deformation suppressing plate (8) is viewed in plan view along the third direction (Z-Z'), a first distance from a central portion (O) of the outer compression deformation suppressing plate (8) in the first direction (X-X') and in the second direction (Y-Y') to an end portion of each of the held portions (8a) in the first direction (X-X') is shorter than a second distance from the central portion (O) to an end portion of each of the outer peripheral extension portions (8b) in the second direction (Y-Y') (fourth embodiment).

[0096] In the electrolytic capacitor (1) of the fourth aspect, the holding portions (6c, 6d) are arranged on a first straight line (L1) drawn through a center of the first through-hole (6a) and a center of the second through-hole (6b), and are respectively arranged in positions on both sides sandwiching the first through-hole (6a) and the second through-hole (6b), and a second straight line (L2) drawn through the outer peripheral extending portions (8b) is orthogonal to the first straight line (L1) (fifth aspect).

[0097] In the electrolytic capacitor (1) of the fifth embodiment, an intersection point of the first straight line (L1) and the second straight line (L2) overlaps the central portion (O) (sixth embodiment).

[0098] In the electrolytic capacitor (1) of the sixth aspect, the second straight line (L2) passes through end portions of the outer peripheral extending portions (8b) in the second direction (Y-Y') (seventh aspect).

[0099] In the electrolytic capacitor (1) of the fourth aspect, the sealant (6) is round when viewed in plan along the third direction (Z-Z'), the outer compression deformation suppressing plate (8) is elliptically cylindrical when viewed in plan along the third direction (Z-Z'), and has a minor axis (d9) parallel to the first direction (X-X') and a major axis (d10) parallel to the second direction (Y-Y'), and the held portions (8a) are respectively arranged at both end portions of the outer compression deformation suppressing plate (8) along the minor axis (d9) (eighth aspect).

[0100] In the electrolytic capacitor (1) of the eighth embodiment, the outer peripheral extension portions (8b) are respectively arranged at the two end portions of the outer compression deformation suppressing plate (8) along the main axis (d10) (ninth embodiment).

[0101] In the electrolytic capacitor (1) according to any one of the first to eighth aspects, a load deformation temperature of the outer compression deformation suppressing plate (8) measured according to an ASTM D648 standard is equal to or greater than 140°C and equal to or less than 240°C (tenth aspect).< / variation> < / grundausgestaltung>

Claims

[1] Electrolytic capacitor comprising: a cylindrical main body casing having a base and in which one end side is closed and an opening is formed on the other end side; a capacitor element housed in the main body casing; a sealing means in which a first through-hole and a second through-hole are formed so as to be aligned in a first direction and which is arranged on an inner side of the main body case for sealing the opening; an outer compression deformation suppression plate, which slides against an end face of the sealant on the side of the opening, in which a third through-hole is formed to overlap the first through-hole in the first direction and in a second direction orthogonal to the first direction, and in which a fourth through-hole is formed to overlap the second through-hole in the first direction and in the second direction; a first lead terminal connected to the capacitor element in the main body case and drawn to the outside of the main body case through the first through-hole and the third through-hole; a second lead terminal connected to the capacitor element in the main body case and drawn through the second through-hole and the fourth through-hole to the outside of the main body case; and a seat plate disposed close to and opposite an end portion of the main body casing on the side of the opening in a third direction orthogonal to the first direction and the second direction, where the first line connection comprises: a first round rod portion disposed within the first through-hole and having an outer diameter larger than an inner diameter of the third through-hole; a first welded portion disposed at an end portion of the first round bar portion on the side of the opening in the third direction; and a first fixed portion disposed outside the main body housing and soldered to a circuit board, the second line connection includes: a second round rod portion disposed within the second through-hole and having an outer diameter larger than the inner diameter of the fourth through-hole; a second welded portion disposed at an end portion of the second round bar portion on the side of the opening in the third direction; and a second fixed portion disposed outside the main body housing and soldered to the circuit board, the main body housing includes: a body portion in which the capacitor element is housed; and a narrowed portion extending from the body portion to the opening, in which an inner diameter is smaller than an inner diameter of the body portion, the sealant is arranged to overlap the narrowed portion in the third direction, when the sealing means is pressed against a side of the capacitor element along the third direction, an edge portion of the third through-hole abuts against the first welded portion and an edge portion of the fourth through-hole abuts against the second welded portion to limit movement of the sealing means to the side of the capacitor element, and a gap is provided between the first lead terminal and the third through-hole, and a gap is provided between the second lead terminal and the fourth through-hole. [2] An electrolytic capacitor according to claim 1, wherein the capacitor element comprises: an anode foil; a separating element applied to the anode foil; and a cathode foil, which is opposite the anode foil via the separating element, the anode foil, the separator and the cathode foil are wound together, one end of the first lead terminal is connected to the anode foil, and another end thereof is pulled to the outside of the main body casing, one end of the second lead terminal is connected to the cathode foil, and another end thereof is drawn to the outside of the main body casing, a width of the separator in the third direction is greater than the width of both the cathode foil and the anode foil in the third direction and the cathode foil and the anode foil are arranged inwardly in the third direction relative to the two end portions of the separator. [3] The electrolytic capacitor according to claim 1 or 2, wherein the main body case has a bending portion in which an end portion extending from the narrowed portion to the opening in the third direction is close to or abuts against the end surface of the sealing means on the side of the opening when the main body case is bent inwardly so as to be opposite to the end surface of the sealing means on the side of the opening in the third direction. [4] Electrolytic capacitor according to one of claims 1 to 3, wherein the sealing means comprises a pair of holding portions which protrude in the third direction from a peripheral edge portion of the end face of the sealant on the side of the opening toward the side of the opening, and are provided on both sides of the outer compression deformation suppression plate in the first direction, the outer compression deformation suppression plate includes: a pair of held portions each abutting against the holding portions so as to oppose the holding portions in the first direction; and a pair of outer peripheral extension sections, which are each connected to the held sections, are arranged between the holding sections in the first direction and are respectively arranged at both end portions of the outer compression deformation suppression plate in the second direction, and when the outer compression deformation suppressing plate is viewed in plan view along the third direction, a first distance from a central portion of the outer compression deformation suppressing plate in the first direction and in the second direction to an end portion of each of the held portions in the first direction is shorter than a second distance from the central portion to an end portion of each of the outer peripheral extending portions in the second direction. [5] Electrolytic capacitor according to claim 4, wherein the holding portions are arranged on a first straight line passing through a center of the first through-hole and a center of the second through-hole, and are respectively arranged in positions on both sides, thereby sandwiching the first through-hole and the second through-hole, and a second straight line drawn through the outer circumferential extension sections is orthogonal to the first straight line. [6] The electrolytic capacitor according to claim 5, wherein an intersection point of the first straight line and the second straight line overlaps the central portion. [7] The electrolytic capacitor according to claim 6, wherein the second straight line passes through end portions of the outer peripheral extension portions in the second direction. [8] Electrolytic capacitor according to claim 4, wherein the sealant is round when viewed in plan along the third direction, the outer compression deformation suppression plate is elliptically cylindrical when viewed in plan along the third direction and has a minor axis parallel to the first direction and a major axis parallel to the second direction, and the holding portions are respectively arranged at both end portions of the outer compression deformation suppression plate along the minor axis. [9] The electrolytic capacitor according to claim 8, wherein the outer peripheral extension portions are respectively arranged at the two end portions of the outer compression deformation suppressing plate along the main axis. [10] The electrolytic capacitor according to any one of claims 1 to 9, wherein the load deformation temperature of the outer compression set suppression plate, measured according to ASTM D648, is equal to or greater than 140°C and equal to or less than 240°C.

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