Image capture module, camera module and electronic device

Abstract

Image acquisition module (1b) comprising: a circuit substrate (110) with: an upper surface (111); a lower surface (112) opposite the upper surface (111); an opening surface (113) connected to the upper surface (111) and the lower surface (112); and an opening (114) located on the opening surface (113); an optical flat element (120) attached to the upper surface (111) of the circuit substrate (110), wherein the optical flat element (120) is arranged corresponding to the opening (114) of the circuit substrate (110); a detection element (130) arranged on the lower surface (112) of the circuit substrate (110), wherein the opening (114) of the circuit substrate (110) is arranged between the detection element (130) and the optical flat element (120), the detection element (130) and the optical flat element (120) forming an air gap (AG) between them, and the opening area (113) surrounds the air gap (AG); and a plurality of metallic projections (140) arranged between the circuit substrate (110) and the sensing element (130), each of the plurality of metallic projections (140) being electrically connected to the circuit substrate (110) and the sensing element (130); wherein the image acquisition module (1b) further comprises at least one antireflection layer (160a-160d) arranged on at least one surface at the air gap (AG), wherein the at least one antireflection layer (160a-160d) comprises: a plurality of nanorib structures (161a-161d) extending along a direction from the at least one surface at the air gap (AG) to the air gap (AG), wherein the plurality of nanorib structures (161a-161d) are arranged irregularly.

Description

BACKGROUND Subject area

[0001] The present disclosure relates to an image acquisition module, a camera module and an electronic device, in particular an image acquisition module that can be used in a camera module and an electronic device. Description of related technology

[0002] With technological advancements, high image quality has become an indispensable feature of optical systems. Furthermore, electronic devices equipped with optical systems are increasingly multifunctional for various applications, which has raised the bar for the functionality of these systems.

[0003] However, some elements in conventional optical systems struggle to meet the high optical quality requirements of electronic devices, which have undergone extensive development in recent years. This is particularly true because non-imaging light is reflected within conventional imaging lenses, impairing image quality. Therefore, a key focus in this field is currently on improving the structures of internal components within imaging lenses to reduce the reflection intensity of non-imaging light and thus meet the requirements of high-end electronic devices. SUMMARY

[0004] According to one aspect of the present disclosure, an image acquisition module comprises a circuit substrate, an optical flat element, a sensing element, and a plurality of metallic projections. The circuit substrate has an upper surface, a lower surface, an opening surface, and an opening. The upper surface and the lower surface are arranged opposite each other. The opening surface is connected to both the upper and lower surfaces. The opening is located at the opening surface. The optical flat element is attached to the upper surface of the circuit substrate. The optical flat element is arranged corresponding to the opening of the circuit substrate. The sensing element is arranged on the lower surface of the circuit substrate. The opening of the circuit substrate is located between the sensing element and the optical flat element.The sensing element and the optical flat element form an air gap between them. The aperture area surrounds the air gap. A plurality of metallic protrusions are arranged between the circuit substrate and the sensing element. Each of the plurality of metallic protrusions is electrically connected to the circuit substrate and the sensing element. The image acquisition module further comprises at least one antireflection layer arranged on at least one surface adjacent to the air gap. The at least one antireflection layer comprises a plurality of nanorib structures extending along a single direction from the at least one surface adjacent to the air gap to the air gap itself. The plurality of nanorib structures are arranged irregularly.

[0005] According to another aspect of the present disclosure, a camera module comprises a lens module and the aforementioned image acquisition module, wherein the image acquisition module is arranged on an image side of the lens module.

[0006] According to another aspect of the present disclosure, an electronic device comprises the aforementioned camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The disclosure can be better understood with reference to the following detailed description of the embodiments and the accompanying drawings: Fig. Figure 1 is a perspective view of a camera module according to the first embodiment of the present disclosure; Fig. Figure 2 is an exploded view of the camera module. Fig. 1; Fig. Figure 3 is a perspective view of the camera module from Fig. 1, which is partially cut open; Fig. Figure 4 is a cross-sectional view of the camera module. Fig. 1; Fig. Figure 5 is an enlarged view of the AA area of ​​the camera module. Fig. 4; Fig. Figure 6 is an enlarged view of area BB of the camera module. Fig. 5; Fig. Figure 7 is a schematic view of a partial and enlarged view of the camera module. Fig. 6; Fig. Figure 8 is an enlarged view of the CC area of ​​the camera module. Fig. 5; Fig. Figure 9 is a schematic view of a partial and enlarged view of the camera module. Fig. 8; Fig. 10 is an enlarged view of the DD area of ​​the camera module. Fig. 5; Fig. Figure 11 is a schematic view of a partial and enlarged view of the camera module. Fig. 10; Fig. Figure 12 is an enlarged view of the EE area of ​​the camera module. Fig. 5; Fig. Figure 13 is an exploded view of a camera module according to the second embodiment of the present disclosure; Fig. Figure 14 is an exploded view of a camera module according to the 3rd embodiment of the present disclosure; Fig. Figure 15 is an exploded view of a camera module according to the 4th embodiment of the present disclosure; Fig. Figure 16 is a cross-sectional view of a partial section of a camera module according to the 5th embodiment of the present disclosure; Fig. Figure 17 is an enlarged view of the FF area of ​​the camera module. Fig. 16; Fig. Figure 18 is a cross-sectional view of a partial area of ​​a camera module according to the 6th embodiment of the present disclosure; Fig. Figure 19 is an enlarged view of the GG area of ​​the camera module. Fig. 18; Fig. Figure 20 is an exploded view of a partial area of ​​a camera module according to the 7th embodiment of the present disclosure; Fig. 21 is an enlarged view of area HH of the camera module from Fig. 20; Fig. Figure 22 is an enlarged view of area II of the camera module. Fig. 20; Fig. Figure 23 is a cross-sectional view showing a configuration of a camera module according to an embodiment of the present disclosure; Fig. Figure 24 is a cross-sectional view showing another configuration of a camera module according to an embodiment of the present disclosure; Fig. Figure 25 is a cross-sectional view showing another configuration of a camera module according to an embodiment of the present disclosure; Fig. Figure 26 is a cross-sectional view showing another configuration of a camera module according to an embodiment of the present disclosure; Fig. Figure 27 is a perspective view of an electronic device according to the 8th embodiment of the present disclosure; Fig. Figure 28 is another perspective view of the electronic device in Fig. 27; Fig. 29 is an image taken by an ultra-wide-angle camera module; Fig. 30 is an image taken by a high-pixel camera module; Fig. 31 is an image taken by a telephoto camera module; Fig. Figure 32 is a perspective view of an electronic device according to the 9th embodiment of the present disclosure; Fig. Figure 33 is a perspective view of an electronic device according to the 10th embodiment of the present disclosure; Fig. Figure 34 is a side view of the electronic device in Fig. 33; and Fig. 35 is a top view of the electronic device in Fig. 33. DETAILED DESCRIPTION

[0008] The following detailed description includes numerous specific details for illustrative purposes, in order to provide a comprehensive understanding of the disclosed embodiments. However, it is obvious that one or more embodiments can also be realized without these specific details. In other cases, known structures and devices are shown schematically to simplify the drawing.

[0009] In the present disclosure, a camera module is provided. The camera module comprises a lens module and an image acquisition module. The lens module is configured to allow light to pass through it. The image acquisition module is arranged on an image side of the lens module.

[0010] The image acquisition module can comprise a circuit substrate, an optical flat element, a sensing element, a variety of metallic protrusions, a filler element, and at least one antireflection layer.

[0011] The circuit substrate can be made of materials such as ceramic, aluminum, PTFE (polytetrafluoroethylene), etc., but the present disclosure is not limited to these materials. The circuit substrate can have an upper surface, a lower surface, an opening surface, and an opening. The upper surface and the lower surface are arranged opposite each other. The opening surface is connected to both the upper and lower surfaces. The opening is located on the opening surface.

[0012] The optical flat element can be, for example, a filter, a blue glass, or a coverslip, but the present disclosure is not limited to these. The optical flat element is attached to the upper surface of the circuit substrate. Furthermore, the optical flat element can be firmly bonded to the circuit substrate, for example, by adhesive, but the present disclosure is not limited to this. The optical flat element is arranged corresponding to the opening of the circuit substrate. The optical flat element can have an inner surface and an outer surface that face each other.

[0013] The sensing element is arranged on the lower surface of the circuit substrate, with the opening of the circuit substrate located between the sensing element and the optical flat element. The sensing element and the optical flat element form an air gap between them, the opening surface surrounding the air gap. Furthermore, the inner surface of the optical flat element can be oriented towards the air gap. The boundary of the air gap can also be defined by three surfaces: the surface of the sensing element oriented towards the optical flat element, the surface of the optical flat element oriented towards the sensing element, and the opening surface, although the present disclosure is not limited to these.

[0014] The sensing element can have a sensing surface and a boundary surface arranged to surround the sensing surface. The sensing surface can be arranged according to the opening of the circuit substrate and is configured to convert an optical image signal from light passing through the lens module into an electrical signal. Furthermore, the sensing surface can be provided with a microlens array mounted on it.

[0015] The metallic protrusions can be, for example, cylindrical, spherical, conical, or hourglass-shaped, but the present disclosure is not limited to these. The metallic protrusions are arranged between the circuit substrate and the sensing element, with each metallic protrusion being electrically connected to both the circuit substrate and the sensing element. Furthermore, the metallic protrusions can be arranged on the edge surface of the sensing element and on at least one side of the edge surface. This is advantageous for ensuring electrical connectivity and miniaturization of the image acquisition module, and for increasing the design flexibility of the metallic protrusions.Furthermore, the metallic projections can alternatively be arranged on the edge surface of the sensing element and on at least two opposite sides of the edge surface, but the present disclosure is not limited thereto. Furthermore, the metallic projections can alternatively be arranged around the air gap, but the present disclosure is not limited thereto.

[0016] The filler element can be positioned between the circuit substrate and the sensing element. It can completely cover any metal protrusion and surround and seal the air gap. Therefore, it is advantageous to prevent contamination of the sensing element during the manufacturing process of the image acquisition module and to improve the durability of the metal protrusions. The filler element can have at least one curved surface. This surface can be, for example, convex or concave, but the present disclosure is not limited to such surfaces. Furthermore, the filler element can have at least one portion positioned at the opening face of the circuit substrate. This is advantageous to ensure the tightness of the seal formed by the filler element. Additionally, the filler element can be made of an opaque material.Therefore, it is advantageous for improving optical image quality. Furthermore, the filler element can, for example, be a black colloid or made of an insulating material, but the present disclosure is not limited to these.

[0017] The at least one antireflection layer is arranged on at least one surface at the air gap. According to the definition of the air gap boundary discussed above, the at least one surface at the air gap can be a surface associated with the three surfaces, namely the surface of the sensing element facing the flat element, the surface of the flat element facing the sensing element, and the opening surface. It can also be considered that the at least one surface could be one of the three surfaces, a surface extending to two of the three surfaces, or a surface extending to all three surfaces, but the present disclosure is not limited to these possibilities. Furthermore, the at least one antireflection layer can be arranged on at least one of the top surface, the bottom surface, and the opening surface of the circuit substrate.Therefore, it is advantageous to reduce the possibility of generating stray light. Furthermore, the at least one antireflection layer can also be arranged on the inner surface of the optical flat element. This is advantageous to reduce surface reflections occurring inside the optical flat element. Furthermore, the at least one antireflection layer can also be arranged on the outer surface of the flat element. Additionally, the at least one antireflection layer can also be arranged on at least one of the sensing surface and the edge surface of the sensing element. This is advantageous to simplify the manufacturing process. Furthermore, the at least one antireflection layer can also be arranged on the microlens array above the sensing surface. Additionally, the at least one antireflection layer can also be arranged on the filler element.Furthermore, the at least one antireflective layer can also be arranged on the at least one curved surface of the filler element. This is advantageous for ensuring the antireflective capability of the filler element and also for increasing the design flexibility of the at least one antireflective layer.

[0018] The at least one antireflective layer comprises a multitude of nanorib structures. The nanorib structures can be made of, for example, aluminum oxide, etc., but this disclosure is not limited to such materials. Furthermore, the nanorib structures can be doped with titanium, vanadium, chromium, tantalum, zirconium, niobium, or oxides of the aforementioned metals, but this disclosure is not limited to such materials. The nanorib structures extend in a direction from the at least one surface at the air gap to the air gap, and the nanorib structures are arranged irregularly.

[0019] In the image acquisition module or camera module described above, the electrical connectivity of an image acquisition module in a flip-chip package according to the present disclosure can be ensured by electrically connecting the metallic projections to the circuit substrate and the sensing element, as well as by designing the at least one antireflective layer. This arrangement also fulfills the requirement for miniaturization of the image acquisition module and simultaneously reduces the loss of optical image signals, thereby improving the signal-to-noise ratio of images to achieve good optical image quality.

[0020] If the height of each of the multiple nanorib structures is H, the following condition can be met: 25 nm (nanometers) ≤ H ≤ 400 nm. Therefore, this is advantageous for increasing the manufacturing efficiency of the image acquisition module. Furthermore, the following condition can also be met: 40 nm ≤ H ≤ 280 nm. Therefore, this is advantageous for achieving good antireflection properties. Additionally, H, as the structure height of the multiple nanorib structures, can be a perpendicular height from the bottom to the top of the multiple nanorib structures when the multiple nanorib structures are viewed in a cross-sectional section thereof (destructive measurement), but the present disclosure is not limited to this.Furthermore, the heights of any three of the multitude of nanorib structures selected for height measurement may be within the range of the above-mentioned condition for H, but the present disclosure is not limited thereto.

[0021] If the distance between the lower surface of the circuit substrate and the optical flat element is D1, and the thickness of the air gap is D2, the following condition can be met: 0.25 ≤ D1 / D2 ≤ 0.98. Therefore, this is advantageous for further miniaturization requirements. Furthermore, the following condition can also be met: 0.3 ≤ D1 / D2 ≤ 0.95. Therefore, this is advantageous for further improving the yield of the image acquisition module. In addition, the thickness of the air gap can be reduced by etching the circuit substrate, but this is not the sole purpose of this disclosure.

[0022] The circuit substrate can further incorporate a variety of anti-flare structures. These structures can be arranged at the aperture of the circuit substrate and can taper from the aperture towards the air gap. The design of these anti-flare structures is advantageous for further reducing interference from stray light and providing good image recognition capability. Furthermore, each anti-flare structure can, for example, have a sharp end or a rounded end, but this disclosure is not limited to such possibilities.

[0023] The at least one antireflection layer can further comprise an intermediate layer. The intermediate layer can be arranged between the at least one surface at the air gap and the nanorib structures. Designing the intermediate layer is advantageous for increasing the coating yield. Furthermore, the intermediate layer can, for example, be a single-layer or multi-layer film that can be used for optical antireflection or contamination control, or can serve as a material matching layer. However, the present disclosure is not limited to these possibilities. In addition, the thickness of the intermediate layer can be greater than the height of the nanorib structures, but this is not limited to this possibility. Furthermore, the intermediate layer can have at least one region exposed to the air gap.Therefore, it is advantageous for increasing the mass production possibilities of at least one anti-reflective layer.

[0024] The camera module can further comprise a protective layer. The protective layer can be made, for example, of colloid, resin, polymer, etc., although the present disclosure is not limited to such materials. The protective layer can be arranged on a side of the image acquisition module that is away from the lens module. Therefore, it is advantageous to protect the circuit substrate, the optical flat element, the sensing element, the metal projections, the filler element, and the at least one antireflection layer from external environmental influences.

[0025] According to the present disclosure, the above-mentioned features and conditions can be used in numerous combinations to achieve the desired effect.

[0026] In accordance with the above description of the present disclosure, the following specific embodiments are provided for further explanation. 1. Design

[0027] See Fig. 1 to Fig. 12, wherein Fig. 1 a perspective view of a camera module according to the first embodiment of the present disclosure is, Fig. 2 an exploded view of the camera module from Fig. 1 is, Fig. 3 a perspective view of the camera module Fig. 1 is, which is partially cut open, Fig. 4 a cross-sectional view of the camera module Fig. 1, Fig. Figure 5 is an enlarged view of the AA area of ​​the camera module. Fig. 4, Fig. Figure 6 is an enlarged view of area BB of the camera module. Fig. 5, Fig. Figure 7 is a schematic view of a partial and enlarged view of the camera module. Fig. 6, Fig. Figure 8 is an enlarged view of the CC area of ​​the camera module. Fig. 5, Fig. Figure 9 is a schematic view of a partial and enlarged view of the camera module. Fig. 8, Fig. 10 is an enlarged view of the DD area of ​​the camera module. Fig. 5, Fig. Figure 11 is a schematic view of a partial and enlarged view of the camera module. Fig. 10 and Fig. Figure 12 is an enlarged view of the EE area of ​​the camera module. Fig. 5.

[0028] In this embodiment, a camera module 1 is provided, comprising a lens module 1a, an image acquisition module 1b and a protective layer 1c.

[0029] The lens module 1a is designed to allow light to pass through it. It should be noted that the appearance or internal structure of the lens module 1a is not intended to limit the present disclosure.

[0030] The image acquisition module 1b is arranged on an image side of the lens module 1a. The image acquisition module 1b comprises a circuit substrate 110, an optical flat element 120, a detection element 130, a plurality of metallic projections 140, a filler element 150, and a plurality of antireflection layers 160a-160d.

[0031] The circuit substrate 110 has an upper surface 111, a lower surface 112, an opening surface 113, and an opening 114. The upper surface 111 and the lower surface 112 are arranged opposite each other. The opening surface 113 is connected to the upper surface 111 and the lower surface 112. The opening 114 is located at the opening surface 113.

[0032] The optical flat element 120 is attached to the upper surface 111 of the circuit substrate 110. The optical flat element 120 is positioned corresponding to the opening 114 of the circuit substrate 110. The optical flat element 120 has an inner surface 121 and an outer surface 122, which are arranged opposite each other.

[0033] The sensing element 130 is arranged on the lower surface 112 of the circuit substrate 110, such that the opening 114 of the circuit substrate 110 is located between the sensing element 130 and the optical flat element 120. The sensing element 130 has a sensing surface 131 and a boundary surface 132 that surrounds the sensing surface 131. The sensing surface 131 is aligned with the opening 114 of the circuit substrate 110 and is configured to convert an optical image signal of light passing through the lens module 1a into an electrical signal. Furthermore, the sensing surface 131 is provided with a microlens arrangement 131a mounted on it.

[0034] The detection element 130 and the optical flat element 120 form an air gap AG between them, such that the opening surface 113 surrounds the air gap AG and the inner surface 121 of the optical flat element 120 faces the air gap AG. It should be noted that the boundary of the air gap AG can be defined by three surfaces: the surface of the detection element 130 facing the optical flat element 120 (e.g., the detection surface 131 or the edge surface 132), the surface of the optical flat element 120 facing the detection element 130 (e.g., the inner surface 121), and the opening surface 113, but the present disclosure is not limited to these. It should be noted that the area of ​​the air gap AG is represented by grid points.

[0035] If the distance between the lower surface 112 of the circuit substrate 110 and the optical flat element 120 is D1 and the thickness of the air gap AG is D2, the following conditions are met: D1 = 0.31 mm (millimeters); D2 = 0.4 mm; and D1 / D2 = 0.78.

[0036] The cylindrical metallic projections 140 are arranged between the circuit substrate 110 and the sensing element 130, each metallic projection 140 being electrically connected to both the circuit substrate 110 and the sensing element 130. In particular, the metallic projections 140 are divided into four groups, each group located within four regions on the edge surface 132 of the sensing element 130 on four sides of the edge surface 132. It can also be considered that the metallic projections 140 are arranged surrounding the air gap AG.

[0037] The filling element 150 is arranged between the circuit substrate 110 and the detection element 130. The filling element 150 completely covers each metallic projection 140 and surrounds and seals the air gap AG.

[0038] The antireflection layers 160a-160d are arranged on at least one surface of the air gap AG. In particular, the antireflection layer 160a is arranged on the lower surface 112 and the opening area 113 of the circuit substrate 110, as shown in Fig. 5 and Fig. Figure 6 shows that the antireflection layer 160b is arranged on the inner surface 121 of the optical flat element 120, as shown in Fig. 5 and Fig. Figure 8 shows that the antireflection layer 160c is arranged on the microlens assembly 131a above the detection surface 131 of the detection element 130, as shown in Figure 8. Fig. 5 and Fig. Figure 10 shows that the antireflection layer 160d is arranged on the filler element 150, as shown in Figure 10. Fig. 5 and Fig. 12 shown.

[0039] The antireflection layer 160a comprises a multitude of nanorib structures 161a extending from the lower surface 112 and the opening area 113 to the air gap AG, and the nanorib structures 161a are arranged irregularly, as shown in Fig. 6 shown.

[0040] If the height of each of three arbitrary nanorib structures 161a selected for height measurement is H, then the following conditions are met: H = 187 nm; 131 nm; and 108 nm, as indicated by the labels H from left to right in Fig. 6 is shown. In addition, in Fig. Figure 7 shows an enlarged view of the nanorib structures 161a.

[0041] The antireflection layer 160b comprises a multitude of nanorib structures 161b and an intermediate layer 162b, which is arranged between the inner surface 121 and the nanorib structures 161b. The nanorib structures 161b extend from the intermediate layer 162b towards the air gap AG in a direction from the inner surface 121 to the air gap AG, and the nanorib structures 161b are arranged irregularly, as shown in Fig. 8 shown. Furthermore, the thickness of the intermediate layer 162b can be greater than the height of the nanorib structures 161b, and the intermediate layer 162b can have at least one region exposed to the air gap AG.

[0042] If the height of any three of the multitude of nanorib structures 161b selected for height measurement is H, then the following conditions are satisfied: H = 165 nm; 48 nm; and 86 nm, as shown by the H labels in Fig. 8 are marked consecutively from left to right. Furthermore, in Fig. Figure 9 shows an enlarged view of the nanorib structures 161b.

[0043] The antireflection layer 160c comprises a multitude of nanorib structures 161c and an intermediate layer 162c, which is arranged between the microlens array 131a and the nanorib structures 161c. The nanorib structures 161c extend from the intermediate layer 162c towards the air gap AG in a direction from the detection surface 131 to the air gap AG, and the nanorib structures 161c are arranged irregularly, as shown in Fig. Figure 10 shows. Furthermore, the thickness of the intermediate layer 162c can be greater than the height of the nanorib structures 161c, and the intermediate layer 162c can have at least one region exposed to the air gap AG.

[0044] If the height of each of three of the multiple nanorib structures 161c selected for height measurement is H, then the following conditions are met: H = 32 nm; 99 nm; and 67 nm, as shown by the H labels in Fig. 10 are marked consecutively from left to right. Furthermore, in Fig. 11 an enlarged view of the nanorib structures 161c is shown.

[0045] The antireflection layer 160d comprises a multitude of nanorib structures 161d. The nanorib structures 161d extend from the filler element 150 to the air gap AG, and the nanorib structures 161d are arranged irregularly, as shown in Fig. 12 shown.

[0046] If the height of any three of the multitude of nanorib structures 161d selected for height measurement is H, then the following conditions are satisfied: H = 64 nm; 221 nm; and 161 nm, as shown by the H labels in Fig. 12 are marked one after the other from top to bottom.

[0047] The protective layer 1c is arranged on a side of the image acquisition module 1b that is away from the lens module 1a in order to protect the circuit substrate 110, the optical flat element 120, the sensing element 130, the metal protrusions 140, the filler element 150 and the antireflection layers 160a-160d from external environmental influences. 2. Design

[0048] See Fig. 13, which shows an exploded view of a camera module according to the 2nd embodiment of the present disclosure.

[0049] In this embodiment, a camera module 2 is provided, comprising a lens module (not shown), an image acquisition module 2b and a protective layer (not shown), which are arranged one after the other.

[0050] The image acquisition module 2b comprises a circuit substrate 210, an optical flat element 220, a detection element 230, a plurality of metallic projections 240, a filler element 250, and a plurality of antireflection layers (not numbered). The circuit substrate 210, the optical flat element 220, the detection element 230, the metallic projections 240, the filler element 250, and the antireflection layers of the image acquisition module 2b are each similar to the circuit substrate 110, the optical flat element 120, the detection element 130, the metallic projections 140, the filler element 150, and the antireflection layers 160a-160d of the image acquisition module 1b, so that only the differences between this and the previous embodiments are described below.

[0051] The circuit substrate 210 further comprises a plurality of anti-flare structures 215 arranged at the opening surface 213 of the circuit substrate 210. Each anti-flare structure 215 tapers from the opening surface 213 towards the air gap AG and has a rounded end.

[0052] The metallic projections 240 are divided into two groups, each arranged within two regions on the edge surface 232 of the sensing element 230 on two opposite sides of the edge surface 232, the metallic projections 240 in each group being arranged in two rows and aligned with each other. Furthermore, the sensing element 230 and the filler element 250 have structures that differ from those of the sensing element 130 and the filler element 150 in order to correspond to the arrangement of the metallic projections 240. 3. Design

[0053] See Fig. 14, which is an exploded view of a camera module according to the 3rd embodiment of the present disclosure.

[0054] In this embodiment, a camera module 3 is provided, comprising a lens module (not shown), an image acquisition module 3b and a protective layer (not shown), which are arranged one after the other.

[0055] The image acquisition module 3b comprises a circuit substrate 310, an optical flat element 320, a detection element 330, a plurality of metallic projections 340, a filler element 350, and a plurality of antireflection layers (not numbered). The circuit substrate 310, the optical flat element 320, the detection element 330, the metallic projections 340, the filler element 350, and the antireflection layers of the image acquisition module 3b are each similar to the circuit substrate 110, the optical flat element 120, the detection element 130, the metallic projections 140, the filler element 150, and the antireflection layers 160a-160d of the image acquisition module 1b, so that only the differences between this and the first embodiments are described below.

[0056] The circuit substrate 310 further comprises a plurality of anti-flare structures 315 arranged at the opening surface 313 of the circuit substrate 310. Each anti-flare structure 315 tapers from the opening surface 313 towards the air gap AG and has a sharp end.

[0057] The metallic projections 340 are divided into four groups, each arranged within four regions on the edge surface 332 of the sensing element 330 on four sides of the edge surface 332, with the metallic projections 340 in each group offset from the center of the side of the edge surface 332. Furthermore, the sensing element 330 and the filler element 350 have structures that differ from those of the sensing element 130 and the filler element 150 in order to correspond to the arrangement of the metallic projections 340. 4. Design

[0058] See Fig. 15, which is an exploded view of a camera module according to the 4th embodiment of the present disclosure.

[0059] In this embodiment, a camera module 4 is provided, comprising a lens module (not shown), an image acquisition module 4b and a protective layer (not shown), which are arranged one after the other.

[0060] The image acquisition module 4b comprises a circuit substrate 410, an optical flat element 420, a detection element 430, a plurality of metallic projections 440, a filler element 450, and a plurality of antireflection layers (not numbered). The circuit substrate 410, the optical flat element 420, the detection element 430, the metallic projections 440, the filler element 450, and the antireflection layers of the image acquisition module 4b are each similar to the circuit substrate 110, the optical flat element 120, the detection element 130, the metallic projections 140, the filler element 150, and the antireflection layers 160a-160d of the image acquisition module 1b, so that only the differences between this and the first embodiments are described below.

[0061] The circuit substrate 410 has steps in its structure at the opening 414. The circuit substrate 410 further features a plurality of anti-flare structures 415, which are arranged at one of the steps on the opening surface 413 of the circuit substrate 410. Each anti-flare structure 415 tapers from the opening surface 413 towards the air gap AG and has a rounded end.

[0062] The metallic projections 440 are divided into two groups, each arranged within two areas on the edge surface 432 of the sensing element 430 on two opposite sides of the edge surface 432, with the metallic projections 440 in each group arranged alternately in two rows. Furthermore, the sensing element 430 and the filler element 450 have structures that differ from those of the sensing element 130 and the filler element 150 in order to correspond to the arrangement of the metallic projections 440. 5. Design

[0063] See Fig. 16 and Fig. 17, where Fig. 16 a cross-sectional view of a partial area of ​​a camera module according to the 5th embodiment of the present disclosure is and Fig. 17 an enlarged view of the FF area of ​​the camera module from Fig. 16.

[0064] In this embodiment, a camera module 5 is provided, comprising a lens module (not shown), an image acquisition module 5b and a protective layer 5c, which are arranged one after the other.

[0065] The image acquisition module 5b comprises a circuit substrate 510, an optical flat element 520, a detection element 530, a plurality of metallic projections 540, a filler element 550, and an antireflection layer 560. The circuit substrate 510, the optical flat element 520, the detection element 530, the metallic projections 540, the filler element 550, and the antireflection layer 560 of the image acquisition module 5b are each similar to the circuit substrate 110, the flat element 120, the detection element 130, the metallic projections 140, the filler element 150, and the antireflection layers 160a-160d of the image acquisition module 1b, so that only the differences between this and the first embodiments are presented below.

[0066] The opening surface 513 of the circuit substrate 510 is an inclined surface facing the optical flat element 520. The metallic projections 540 are conical. The filler element 550 has a plurality of curved surfaces 551, which are concave.

[0067] If the distance between the lower surface 512 of the circuit substrate 510 and the optical flat element 520 is D1 and the thickness of the air gap AG is D2, the following conditions are met: D1 = 0.31 mm; D2 = 0.4 mm; and D1 / D2 = 0.78.

[0068] The antireflection layer 560 is arranged on the edge surface 532 of the detection element 530, as shown in Fig. 16 and Fig. Figure 17 shows that the antireflection layer 560 comprises a multitude of nanorib structures 561 extending from the edge surface 532 to the air gap AG, and the nanorib structures 561 are arranged irregularly, as shown in Fig. 17 shown.

[0069] If the height of any three of the multitude of nanorib structures 561 selected for height measurement is H, then the following conditions are satisfied: H = 129 nm; 75 nm; and 145 nm, as shown by the H labels in Fig. 17 are marked one after the other from left to right.

[0070] The image acquisition module 5b further comprises a light-blocking element 570, which is arranged on the outer surface 522 of the optical flat element 520. The light-blocking element 570 has an inclined surface that points away from the optical flat element 520 in order to block some of the light from the lens module. 6. Design

[0071] See Fig. 18 and Fig. 19, where Fig. 18 a cross-sectional view of a partial area of ​​a camera module according to the 6th embodiment of the present disclosure and Fig. 19 an enlarged view of area GG of the camera module from Fig. 18.

[0072] In this embodiment, a camera module 6 is provided, comprising a lens module (not shown), an image acquisition module 6b and a protective layer 6c, which are arranged one after the other.

[0073] The image acquisition module 6b comprises a circuit substrate 610, an optical flat element 620, a detection element 630, a plurality of metallic projections 640, a filler element 650, and an antireflection layer 660. The circuit substrate 610, the optical flat element 620, the detection element 630, the metallic projections 640, the filler element 650, and the antireflection layer 660 of the image acquisition module 6b are each similar to the circuit substrate 110, the optical flat element 120, the detection element 130, the metallic projections 140, the filler element 150, and the antireflection layers 160a-160d of the image acquisition module 1b, so that only the differences between this and the first embodiments are presented below.

[0074] The opening surface 613 of the circuit substrate 610 is an inclined surface facing the detection element 630. The metallic projections 640 are spherical. The filler element 650 has a curved surface 651, which is concave and faces the optical flat element 620.

[0075] If the distance between the lower surface 612 of the circuit substrate 610 and the optical flat element 620 is D1 and the thickness of the air gap AG is D2, the following conditions are met: D1 = 0.16 mm; D2 = 0.25 mm; and D1 / D2 = 0.64.

[0076] The antireflective layer 660 is arranged on the curved surface 651 of the filler element 650, as shown in Fig. 18 and Fig. Figure 19 shows that the antireflection layer 660 comprises a plurality of nanorib structures 661 extending from the curved surface 651 to the air gap AG, the nanorib structures 661 being irregularly arranged as shown in Fig. 19 shown.

[0077] If the height of each of the three of the multitude of nanorib structures 661 selected for height measurement is H, then the following conditions are met: H = 111 nm; 50 nm; and 189 nm, as shown by the H labels in Fig. 19 are marked one after the other from left to right.

[0078] The image acquisition module 6b further comprises a light-blocking element 670, which is arranged on the outer surface 622 of the flat element 620 to block some of the light from the lens module. 7. Design

[0079] See Fig. 20 and Fig. 22, where Fig. 20 a cross-sectional view of a partial area of ​​a camera module according to the 7th embodiment of the present disclosure is, Fig. 21 an enlarged view of area HH of the camera module from Fig. 20 is and Fig. 22 an enlarged view of area II of the camera module from Fig. 20 is.

[0080] In this embodiment, a camera module 7 is provided, comprising a lens module (not shown), an image acquisition module 7b and a protective layer 7c, which are arranged one after the other.

[0081] The image acquisition module 7b comprises a circuit substrate 710, an optical flat element 720, a detection element 730, a plurality of metallic projections 740, a filler element 750, and a plurality of antireflection layers 760a-760b. The circuit substrate 710, the optical flat element 720, the detection element 730, the metallic projections 740, the filler element 750, and the antireflection layers 760a-760b of the image acquisition module 7b are each similar to the circuit substrate 110, the optical flat element 120, the detection element 130, the metallic projections 140, the filler element 150, and the antireflection layers 160a-160d of the image acquisition module 1b, so that only the differences between this and the first embodiments are presented below.

[0082] The metallic projections 740 have an hourglass shape. The filling element 750 has at least a portion positioned on the opening surface 713 of the circuit substrate 710. The filling element 750 has a curved surface 751, which is convex and faces the optical flat element 720.

[0083] If the distance between the lower surface 712 of the circuit substrate 710 and the optical flat element 720 is D1 and the thickness of the air gap AG is D2, the following conditions are met: D1 = 0.11 mm; D2 = 0.26 mm; and D1 / D2 = 0.42.

[0084] The antireflection layer 760a is arranged on the outer surface 722 of the optical flat element 720, as shown in Fig. 20 and Fig. 21 shown. The antireflection layer 760b is arranged on the inner surface 721 of the optical flat element 720, as shown in Fig. 20 and Fig. 22 shown.

[0085] The antireflection layer 760a comprises a multitude of nanorib structures 761a and an intermediate layer 762a, which is arranged between the outer surface 722 and the nanorib structures 761a. The nanorib structures 761a extend from the intermediate layer 762a in a direction away from the outer surface 722, and the nanorib structures 761a are arranged irregularly, as shown in Fig. 21 shown. Furthermore, the thickness of the intermediate layer 762a can be greater than the height of the nanorib structures 761a.

[0086] If the height of each of the three of the multiple nanorib structures 761a selected for height measurement is H, then the following conditions are met: H = 82 nm; 194 nm; and 150 nm, as shown by the H labels in Fig. 21 are arranged one after the other from left to right.

[0087] The antireflection layer 760b comprises a multitude of nanorib structures 761b and an intermediate layer 762b, which is arranged between the inner surface 721 and the nanorib structures 761b. The nanorib structures 761b extend from the intermediate layer 762b to the air gap AG along a direction from the inner surface 721 to the air gap AG, and the nanorib structures 761b are arranged irregularly, as shown in Fig. 22 shown. Furthermore, the thickness of the intermediate layer 762b can be greater than the height of the nanorib structures 761b, and the intermediate layer 762b can have at least one region exposed to the air gap AG.

[0088] If the height of each of the three of the multiple nanorib structures 761b selected for height measurement is H, then the following conditions are met: H = 150 nm; 131 nm; and 93 nm, as shown by the H labels in Fig. 22 are marked one after the other from left to right. Further configurations of the camera module

[0089] The camera module 1 of the present disclosure can have configurations other than those described in Fig. 4 shown.

[0090] See Fig. 23, which is a cross-sectional section showing a configuration of a camera module according to an embodiment of the present disclosure. As in Fig. As shown in Figure 23, a camera module 1-1 can further comprise a Ball Grid Array BGA, which is equipped with the image acquisition module 1b.

[0091] In the configuration of the camera module 1-1, the distance between the lower surface 112 of the circuit substrate 110 and the optical flat element 120 is D1, the thickness of the air gap AG is D2, and the following conditions are met: D1 = 0.21 mm; D2 = 0.4 mm; and D1 / D2 = 0.53. However, the present disclosure is not limited thereto.

[0092] See Fig. 24, which shows a cross-sectional view of a further configuration of a camera module according to an embodiment of the present disclosure. As in Fig. As shown in Figure 24, a camera module 1-2 can further comprise a flexible printed circuit board FPCB equipped with the image acquisition module 1b.

[0093] In the configuration of the camera module 1-2, the distance between the lower surface 112 of the circuit substrate 110 and the optical flat element 120 is D1, the thickness of the air gap AG is D2, and the following conditions are met: D1 = 0.31 mm; D2 = 0.48 mm; and D1 / D2 = 0.65. However, the present disclosure is not limited thereto.

[0094] See Fig. 25, which is a cross-sectional view showing yet another configuration of a camera module according to an embodiment of the present disclosure. As in Fig. As shown in Figure 25, a camera module 1-3 may further comprise a rolling assembly RA which is equipped with the image acquisition module 1b to provide at least one degree of movement of the image acquisition module 1b.

[0095] In the configuration of the camera module 1-3, the distance between the lower surface 112 of the circuit substrate 110 and the optical flat element 120 is D1, the thickness of the air gap AG is D2, and the following conditions are met: D1 = 0.16 mm; D2 = 0.25 mm; and D1 / D2 = 0.64. However, the present disclosure is not limited thereto.

[0096] See Fig. 26, which is a cross-sectional view showing another configuration of a camera module according to an embodiment of the present disclosure. As in Fig. As shown in Figure 26, a camera module 1-4 can further comprise an elastic assembly EA which is equipped with the image acquisition module 1b in order to enable at least one degree of movement of the image acquisition module 1b.

[0097] In the configuration of the camera module 1-4, the distance between the lower surface 112 of the circuit substrate 110 and the optical flat element 120 is D1, the thickness of the air gap AG is D2, and the following conditions are met: D1 = 0.16 mm; D2 = 0.25 mm; and D1 / D2 = 0.64. However, the present disclosure is not limited thereto.

[0098] The configurations mentioned above are not only suitable for camera module 1 of the first embodiment, but also for camera modules 2-7 and other camera modules. 8. Design

[0099] See Fig. 27 to Fig. 28, where Fig. 27 a perspective view of an electronic device according to the 8th embodiment of the present disclosure and Fig. 28 another perspective view of the electronic device in Fig. 27 is.

[0100] In this embodiment, an electronic device 8 is a smartphone comprising a plurality of camera modules, a flash module 81, a focus assist module 82, an image signal processor 83, a display module (user interface) 84 and an image software processor (not shown).

[0101] The camera modules comprise an ultra-wide-angle camera module 80a, a high-pixel camera module 80b, a telephoto camera module 80c, and a telephoto camera module 80. Furthermore, camera module 80 comprises one of camera modules 1 to 7 and 1-1 to 1-4 of the present disclosure.

[0102] The image captured by the ultra-wide-angle camera module 80a is characterized by several depicted objects. Fig. Figure 29 is an image captured by the ultra-wide-angle camera module 80a. Furthermore, the maximum field of view (FOV) of camera module 80a corresponds to the viewing angle in Fig. 29.

[0103] The image captured by the high-pixel camera module 80b is characterized by high resolution and low distortion, and the high-pixel camera module 80b can capture part of the image in Fig. Record 29. Fig. 30 is an image taken by the high-pixel camera module 80b.

[0104] The image captured by the 80c telephoto camera module is characterized by high optical magnification, and the 80c telephoto camera module can capture part of the image in Fig. Record 30. Fig. Image 31 is taken by the telephoto camera module 80c.

[0105] When a user takes pictures of an object, the light rays are focused in the ultra-wide-angle camera module 80a, the high-pixel camera module 80b, the telephoto camera module 80c, or the telephoto camera module 80 to create images, and the flash module 81 is activated for illumination. The focus assist module 82 detects the distance of the imaged object to achieve fast autofocus. The image signal processor 83 is designed to optimize the captured image to improve image quality and the zoom function provided. The light beam emitted by the focus assist module 82 can be either conventional infrared light or laser light.The Display Module 84 can include a touchscreen, and the user can interact with it to adjust the viewing angle and switch between different camera modules. The image software processor has several functions for capturing images and completing image processing. Alternatively, the user can capture images using a physical button. The image processed by the image software processor can be displayed on the Display Module 84. 9. Design

[0106] See Fig. 32, which represents a perspective view of an electronic device according to the 9th embodiment of the present disclosure.

[0107] In this embodiment, an electronic device 9 is a smartphone comprising a camera module 90, a camera module 90a, a camera module 90b, a camera module 90c, a camera module 90d, a camera module 90e, a camera module 90f, a camera module 90g, a camera module 90h, a flash module 91, an image signal processor, a display module, and an image software processor (not shown). The camera modules 90, 90a, 90b, 90c, 90d, 90e, 90f, 90g, and 90h are arranged on the same side of the electronic device 9, while the display module is arranged on the opposite side of the electronic device 9. Furthermore, the camera module 90 comprises one of the camera modules 1 to 7 and 1-1 to 1-4 of the present disclosure.

[0108] Camera module 90 is a telephoto camera module, camera module 90a is a telephoto camera module, camera module 90b is a telephoto camera module, camera module 90c is a telephoto camera module, camera module 90d is a wide-angle camera module, camera module 90e is a wide-angle camera module, camera module 90f is an ultra-wide-angle camera module, camera module 90g is an ultra-wide-angle camera module, and camera module 90h is a ToF (Time of Flight) camera module. In this embodiment, camera module 90, camera module 90a, camera module 90b, camera module 90c, camera module 90d, camera module 90e, camera module 90f, and camera module 90g have different fields of view, so that the electronic device can have 9 different magnification ratios to meet the requirements of the optical zoom functionality. Furthermore, camera module 90a and camera module 90b are each telephoto camera modules with a light deflection configuration.Furthermore, the camera module 90h can determine depth information of the imaged object. In this embodiment, the electronic device 9 comprises a plurality of camera modules 90, 90a, 90b, 90c, 90d, 90e, 90f, 90g, and 90h, but the present disclosure is not limited to the number and arrangement of the camera modules. When a user takes pictures of an object, the light beams are focused in the camera modules 90, 90a, 90b, 90c, 90d, 90e, 90f, 90g, or 90h to produce one or more images, and the flash module 91 is activated to provide additional light. The subsequent processes are carried out in a similar manner to those in the embodiments mentioned above, so the details relating thereto are not repeated. 10. Design

[0109] See Fig. 33 to Fig. 35, whereby Fig. 33 a perspective view of an electronic device according to the 10th embodiment of the present disclosure is, Fig. 34 a side view of the electronic device in Fig. 33 is and Fig. 35 A top view of the electronic device in Fig. 33 is.

[0110] In this embodiment, an electronic device 10 is an automobile. The electronic device 10 comprises a plurality of automotive camera modules 100, and the camera modules 100 each comprise, for example, one of the camera modules 1 to 7 and 1-1 to 1-4 of the present disclosure. The camera modules 100 can serve, for example, as panoramic car cameras, dashboard cameras, and vehicle reversing cameras.

[0111] As in Fig. As shown in Figure 33, the camera modules 100 are arranged around the vehicle to capture peripheral images of the vehicle, which is advantageous for recognizing road conditions outside the vehicle in order to achieve automatic driving assistance. Furthermore, the image software processor can stitch the peripheral images together to create a panoramic image so that the driver can check every angle surrounding the vehicle, which is beneficial for parking and driving.

[0112] As in Fig. As shown in Figure 34, the camera modules 100 are, for example, arranged on the lower sections of the side mirrors. The maximum field of view of each of the camera modules 100 can be between 40 degrees and 90 degrees in order to capture images on the left and right sides within the nearby lane segments.

[0113] As in Fig.As shown in Figure 35, the camera modules 100 are, for example, located on the lower sections of the side mirrors and also on the inner sides of the front and rear windscreens to provide the driver with external information and also to offer more viewing angles in order to reduce blind spots and thereby improve driving safety.

[0114] The smartphones or automobile in the embodiments serve only as examples to illustrate the camera modules 1 to 7 and 1-1 to 1-4 of the present disclosure, which are installed in an electronic device 8, 9, or 10, and the present disclosure is not limited thereto. The camera modules 1 to 7 and 1-1 to 1-4 can optionally be applied to optical systems with movable focus. Furthermore, the camera modules 1 to 7 and 1-1 to 1-4 are characterized by good aberration correction and high image quality and can be used for 3D imaging (three-dimensional imaging) in products such as digital cameras, mobile devices, digital tablets, smart televisions, network surveillance devices, multi-camera devices, image recognition systems, motion sensors, wearable devices, and other electronic imaging devices.

[0115] The foregoing description has been provided for illustrative purposes with reference to specific embodiments. It should be noted that the present disclosure shows different data for the various embodiments; however, the data for the different embodiments were obtained experimentally. The embodiments were selected and described to best illustrate the principles of the disclosure and their practical applications, so that other skilled persons may make the best possible use of the disclosure and the various embodiments with different modifications suitable for their respective intended uses. The embodiments shown above and the accompanying drawings are exemplary and are not intended to be exhaustive, nor are they intended to limit the scope of the present disclosure to the forms exactly disclosed. In view of the above teachings, many modifications and variations are possible.

Claims

[1] Image acquisition module (1b) comprising: a circuit substrate (110) with: an upper surface (111); a lower surface (112) opposite the upper surface (111); an opening surface (113) connected to the upper surface (111) and the lower surface (112); and an opening (114) located on the opening surface (113); an optical flat element (120) attached to the upper surface (111) of the circuit substrate (110), wherein the optical flat element (120) is arranged corresponding to the opening (114) of the circuit substrate (110); a detection element (130) arranged on the lower surface (112) of the circuit substrate (110), wherein the opening (114) of the circuit substrate (110) is arranged between the detection element (130) and the optical flat element (120), the detection element (130) and the optical flat element (120) forming an air gap (AG) between them, and the opening area (113) surrounds the air gap (AG); and a plurality of metallic projections (140) arranged between the circuit substrate (110) and the sensing element (130), each of the plurality of metallic projections (140) being electrically connected to the circuit substrate (110) and the sensing element (130); wherein the image acquisition module (1b) further comprises at least one antireflection layer (160a-160d) arranged on at least one surface at the air gap (AG), wherein the at least one antireflection layer (160a-160d) comprises: a plurality of nanorib structures (161a-161d) extending along a direction from the at least one surface at the air gap (AG) to the air gap (AG), wherein the plurality of nanorib structures (161a-161d) are arranged irregularly. [2] The image acquisition module (1b) according to claim 1, wherein the height of each of the plurality of nanorib structures (161a-161d) is H and the following condition is satisfied: 25 nm≤H≤400 nm. [3] The image acquisition module (1b) according to claim 2, wherein the height of each of the plurality of nanorib structures (161a-161d) is H and the following condition is satisfied: 40 nm≤H≤280 nm. [4] Image acquisition module (1b) according to claim 1, wherein the at least one antireflection layer (160a-160d) further comprises an intermediate layer (162b-162c) arranged between the at least one surface at the air gap (AG) and the plurality of nanorib structures (161a-161d). [5] Image acquisition module (1b) according to claim 4, wherein at least one area of ​​the intermediate layer (162b-162c) is exposed to the air gap (AG). [6] The image acquisition module (1b) according to claim 1, wherein the acquisition element (130) comprises: a detection surface (131) arranged corresponding to the opening (114) of the circuit substrate (110), wherein the detection surface (131) is configured to convert an optical image signal into an electrical signal; and a boundary surface (132) arranged to surround the detection surface (131); wherein the at least one antireflection layer (160a-160d) is arranged on at least one of the detection surface (131) and the edge surface (132) of the detection element (130). [7] Image acquisition module (1b) according to claim 1, wherein the at least one antireflection layer (160a-160d) is arranged on at least one of the upper surfaces (111), the lower surface (112) and the opening area (113) of the circuit substrate (110). [8] Image acquisition module (1b) according to claim 1, wherein the optical flat element (120) has an inner surface (121) which is arranged facing the air gap (AG) and which has at least one antireflection layer (160a-160d) arranged on the inner surface (121) of the optical flat element (120). [9] Image acquisition module (1b) according to claim 1, further comprising a filler element (150) arranged between the circuit substrate (110) and the sensing element (130), wherein the filler element (150) completely covers each of the plurality of metallic projections (140) and the filler element (150) surrounds and seals the air gap (AG). [10] Image acquisition module (5b) according to claim 9, wherein the fill element (550) has at least one curved surface (551) on which the at least one antireflection layer (560) is arranged. [11] Image acquisition module (1b) according to claim 9, wherein at least a part of the filling element (150) is arranged at the opening surface (113) of the circuit substrate (110). [12] Image capture module (1b) according to claim 9, wherein the filler element (150) is made of an opaque material. [13] Image acquisition module (1b) according to claim 6, wherein the plurality of metallic projections (140) are arranged on the edge surface (132) and are arranged on at least one side of the edge surface (132). [14] Image acquisition module (2b) according to claim 1, wherein the circuit substrate (210) further comprises a plurality of anti-flare structures (215) arranged at the opening surface (213) of the circuit substrate (210), and the plurality of anti-flare structures (215) taper from the opening surface (213) towards the air gap (AG). [15] Image acquisition module (1b) according to claim 1, wherein a distance between the lower surface (112) of the circuit substrate (110) and the optical flat element (120) is D1, a thickness of the air gap (AG) is D2 and the following condition is met: 0.25≤D1 / D2≤0.

98. [16] Image acquisition module (1b) according to claim 15, wherein the distance between the lower surface (112) of the circuit substrate (110) and the optical flat element (120) is D1, the thickness of the air gap (AG) is D2 and the following condition is met: 0.3≤D1 / D2≤0.

95. [17] Camera module (1), comprising: a lens module (1a); and the image acquisition module (1b) according to claim 1, which is arranged on an image side of the lens module (1a). [18] Electronic device (8) comprising: the camera module (1) according to claim 17.

Images