A multi-layer structure

Abstract

Multilayer structure, characterized in that the multilayer structure comprises the following: a substrate film (102) comprising conductors (104) to a first side of the substrate film, wherein the substrate film further comprises a via (106) wherein the via is provided with conductive material, wherein the conductive material is coupled to the conductors, at least one optical and / or electrical functional element (108) on the first side of the substrate film, wherein the functional element is coupled to the conductors, at least one polymer layer (110) on the first side of the substrate film to at least partially embed the conductor and the at least one functional element, and at least one connecting element (112) arranged on a second side of the substrate film, wherein the connecting element is coupled to the conductive material of the via.

Description

AREA OF INVENTION

[0001] The present invention relates generally to multilayer structures incorporating functional features such as electronic elements. In particular, the present invention relates to a multilayer structure comprising a substrate film with a via provided with conductive material. A functional element is provided on a first side of the substrate film, and a connecting element is arranged on a second side of the substrate film. The connecting element can be provided in a post-assembly or post-processing step. STATE OF THE ART

[0002] Molded structural electronics, characterized by advanced integration of materials and electronic components, finds application in various fields. Typically, a substrate, usually a substrate film, features conductors and functional components arranged on a first side of the substrate, which is intended to face the environment or the user.

[0003] A connecting element, such as a connector, for external connections can be located on the first side of the substrate or on a second side. Traditionally, connecting elements were mounted onto the substrate by crimping, either pin by pin and by further shaping of the connector body using a molding process, such as injection molding, or by crimping onto a pre-formed connector assembly, or alternatively by using "flexible connections," where a flexible "end piece" of a PCB is inserted through a slot in the substrate. It should be noted that in some embodiments, in the case of crimp connectors provided on the first, "functional" side of the substrate, the effective surface area required for the connecting elements on that functional side can be substantial.

[0004] If the fasteners are required in the center of the substrate, they are mounted using surface mount technology (SMT), for example, with conductive adhesives. This is only possible with single-substrate solutions where the fastener is located on the first side of the substrate. A through-substrate option for a fastener is not possible if the substrate film is to be formed, for example, by high-pressure thermoforming, as components cannot be present on both sides of the substrate film during the forming process.

[0005] Crimped fasteners restrict substrate movement during molding processes, such as injection molding, which can lead to wrinkling or cracking in the substrate film. Crimping individual pins can also be a slow process. Furthermore, only laterally bending fasteners are generally possible.

[0006] When using molded connectors, the mold casting of the connecting elements may in some cases require complex, special casting tools.

[0007] It can be difficult to make flexible connections waterproof because the PI-Flex is not wetted by the molded plastic and thin air gaps may be present through which water can penetrate by capillary action. SUMMARY

[0008] The object of the present invention is to mitigate at least one or more of the disadvantages associated with known solutions or to provide new solutions for realizing certain functionalities. This object can be achieved with various embodiments of the present invention.

[0009] According to one aspect of the invention, a multilayer structure is provided, wherein the multilayer structure comprises: a substrate film comprising conductors on a first side of the substrate film, wherein the substrate film further comprises a via, wherein the via is provided with conductive material, and wherein the conductive material is coupled to the conductors, at least one optical and / or electrical functional element on the first side of the substrate film, wherein the functional element is coupled to the conductors, at least one polymer layer on the first side of the substrate film to at least partially embed the conductors and functional elements, and at least one connecting element arranged on a second side of the substrate film, wherein the connecting element is coupled to the conductive material of the via.

[0010] In the present invention, the connection to the conductors and the functional element(s) on the first side of the substrate film can be established by vias, with a connecting element being arranged on the second side of the substrate film. The connecting element does not require a surface on the first, functional side of the substrate film. The first side of the substrate film can be configured to face the environment / user and thus represent a "visible" side of the multilayer structure. Providing the connecting element on the second side of the substrate film can then also conceal the connecting element from the user.

[0011] Molding, such as injection molding of the first side of the substrate, or forming, such as high-pressure forming of the substrate film, can be carried out without considering the connecting element. The connecting element can be provided in a post-assembly or post-processing step, meaning that the connecting element can be provided at least after the conductors and the functional element have been provided on the first side of the substrate, and preferably after the polymer layer has been provided on the first side of the substrate film. Furthermore, it can optionally be provided after forming, such as high-pressure forming of the substrate film, which can take place after the conductors and / or the functional element(s) have been provided.

[0012] In a manufacturing process, a first and potentially a second or further forming shot can be provided on the first side of the substrate film, which is configured to face the environment and / or a user. The structure can then be rotated to expose the second side, or back side, of the substrate film for processing. The multilayer structure can, for example, be fed into a fixture that allows an assembly machine to attach a standard or custom fastener to the second side of the substrate film, such as to contact pads that may be provided. Manufacturing time can be reduced compared to the prior art.

[0013] Depending on the application, the present invention makes it possible to provide a fully sealed structure, at least in one area near the connecting element. Here, a connecting element body can cover the via. The optional structural adhesive can be provided in an amount sufficient to seal the conductive material of the via and any other conductive material coupled to the connecting element. The same structural and conductive adhesives used in standard electronic assembly can be employed in the present invention.

[0014] The present invention enables free movement of the substrate film during molding, e.g., injection molding, with respect to the first side of the substrate film, i.e., during the application of at least one polymer layer to the first side of the substrate film. Wrinkling or jamming of the substrate film during this process step can be avoided or reduced. It should be noted that the choice of the connecting element used is relatively free and, for example, almost any SMD connector can be used.

[0015] The connecting element can also be a connector that is attached through the film. For example, a thicker conductive material can be provided on the first side of the substrate film.

[0016] An additional film can be provided on top of the polymer layer.

[0017] The conductors can be printed conductive traces.

[0018] At least one contact pad can be arranged on the first side of the substrate film or on the second side of the substrate film, wherein the contact pad(s) are coupled to the conductive material of the via.

[0019] At least one second connecting element can be arranged on the first side of the substrate film. This connecting element can be positioned to cover the via on the first side of the substrate film and provide the conductive material for the via. Preferably, one shape of the connecting element corresponds at least partially to the shape of the via. The second connecting element can include a contact pad shaped to match the via.

[0020] The second side of the substrate film can include printed conductive features, such as printed conductive traces and / or printed conductive pads. If the first side of the substrate film also has printed conductive features, such as printed conductive traces, this type of multilayer structure allows for the integration of a connector on the back side of the substrate film. Double-sided conductive printing (optionally combined with conductive adhesive) is used to ensure a reliable electrical and mechanical connection between the connector and the first side of the substrate film. This allows for flexible placement of the connector on the second side of the substrate film, as the connector does not need to be placed on or in close proximity to the via.This can also allow the use of connectors with pins positioned closer together (since a narrower distance can be achieved during printing). This results in a larger contact area with the connector.

[0021] The multilayer structure may further comprise structural adhesive, conductive adhesive, low-temperature solder paste and / or conductive film or tape, such as anisotropic conductive foil tape (ACF), between at least one part of the connecting element and the second side of the substrate film.

[0022] The multilayer structure can include at least one contact pad on the second side of the substrate film, with the connecting element on the second side of the substrate film being coupled to the conductive material of the via via via the contact pad. The contact pad on the second side of the substrate film can be a post-applied contact pad, i.e., it is provided after the electronics and the polymer layer have been applied to the first side of the substrate film. The type of connecting element used in this case is freely selectable and can be, for example, a connecting element comprising pins, pogo pins, or another contact method. The wear resistance and mechanical strength with respect to the various contact methods can be increased compared to a solution where a connecting element is provided on the functional side of the substrate film.The location of the connecting element can also be chosen more freely and does not need to be in the immediate vicinity of the via. Furthermore, the contact pad provides a larger contact area with the connecting element than a solution where the connecting element is directly coupled to the conductive material of the via. This type of structure can be implemented, for example, using SMT assembly, automated adhesive application robots, and assembly robots, or entirely manually. The solution can also accommodate various types of contact interfaces to the functional side of the substrate film, such as solder or spring contacts.

[0023] The contact pad can be provided in cases where the second side of the substrate film does not include conductive features, such as printed conductive features. In other embodiments, the contact pad can be provided in cases where the second side of the substrate film is provided with conductive features, such as printed conductive features.

[0024] A multilayer structure can include an additional polymer layer on the second side of the substrate film, wherein the additional polymer layer at least partially embeds or surrounds the connecting element. The additional polymer layer can be provided as a second mold shot after a first mold shot has been used to provide the polymer layer on the first side of the substrate film.

[0025] The substrate film can comprise malleable material, preferably thermoformable material, optionally polymer, PMMA (polymethyl methacrylate), polycarbonate (PC), copolyester, copolyester resin, polyimide, copolymer of methyl methacrylate and styrene (MS resin), glass and / or polyethylene terephthalate (PET).

[0026] The connecting element may include a connector or be a connecting element configured to couple the multilayer structure to an external unit in some other way, for example.

[0027] The connecting element can include a surface mountable (SMD) connector.

[0028] The exemplary embodiments of the present invention presented herein are not to be construed as limiting the applicability of the accompanying claims. The verb "comprise" is used herein as an open limitation that does not preclude the presence of features not explicitly mentioned. The features listed in various embodiments and, for example, dependent claims are freely combinable with one another, unless expressly stated otherwise.

[0029] The new features considered characteristic of the present invention are set out in particular in the accompanying claims. However, the present invention itself, both in terms of its structure and method, as well as its additional objectives and advantages, is best understood from the following description of certain embodiments when read in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE FIGURES

[0030] Some embodiments of the invention are illustrated by way of example in the figures of the accompanying drawings. Fig. Figure 1 shows a cross-sectional view of a multi-layer structure. Fig. Figure 2 shows a cross-sectional view of a multi-layer structure. Fig. Figure 3 shows a cross-sectional view of part of a multi-layer structure. Fig. Figure 4 shows a cross-sectional view of a multi-layer structure. Fig. Figure 5 shows a cross-sectional view of a multi-layer structure. Fig. Figure 6 shows a cross-sectional view of a multi-layer structure. Fig. Figure 7 shows a cross-sectional view of a multi-layer structure. Fig. Figure 8 shows a flowchart for a process for producing a multilayer structure. DETAILED DESCRIPTION OF SOME VERSIONS

[0031] Fig. Figure 1 shows a cross-sectional view of a multilayer structure. It should be noted that the figures in this document are not drawn to scale. The multilayer structure comprises a substrate film 102 with a first and a second side.

[0032] The substrate film can comprise malleable material, preferably thermoformable material, optionally polymer, PMMA (polymethyl methacrylate), polycarbonate (PC), copolyester, copolyester resin, polyimide, copolymer of methyl methacrylate and styrene (MS resin), glass and / or polyethylene terephthalate (PET).

[0033] The substrate film can be formed into a selected three-dimensional, non-planar shape.

[0034] The conductors 104 are provided on the first side of the substrate film 102. The conductors 104 can be printed conductive traces.

[0035] The first side of the substrate film 102 can also include other printed conductive features. The first side of the substrate film can be provided with conventional conductive pads.

[0036] Conductive material, such as conductive traces and / or conductive pads, may include at least one material selected from the following group: conductive ink, conductive nanoparticle ink, copper, steel, iron, tin, aluminum, silver, gold, platinum, conductive adhesive, carbon fiber, alloy, silver alloy, zinc, brass, titanium, solder, and any component thereof. The conductive materials used may be optically opaque, translucent, and / or transparent at desired wavelengths, such as visible light, to, for example, shield radiation such as visible light or allow it to be reflected, absorbed, or transmitted. In the case of conductors 104, these may specifically be silver conductive traces.

[0037] The substrate film 102 comprises at least one via 106, wherein the via 106 comprises conductive material. The via can be filled with conductive material. The via 106 in Fig. 1 is filled with conductive material, although this is not always necessary. The via 106 can be partially filled or at least partially coated with conductive material.

[0038] In the case of a filled via 106, the substrate film 102 can be processed as if no via were present. This can be advantageous in manufacturing processes involving shaping, such as high-pressure forming, since compressed air can escape through unfilled vias. Furthermore, filled vias can be advantageous in manufacturing processes involving molding, such as injection molding, because the injected plastic material could cause the substrate film 102 to collapse locally if the plastic is forced into an unfilled via.

[0039] The conductive material of the via 106 is coupled to the conductors 104, which are provided on the first side of the substrate film 102.

[0040] Furthermore, at least one optical and / or electrical functional element 108 is provided on the first side of the substrate film, wherein the functional element 108 is coupled to the conductors 104 on the first side of the substrate film 102.

[0041] The functional element can be, for example, an electrode, an electronic component, an electromechanical component, an electro-optical or optoelectronic component, a radiation-emitting component, a light-emitting component such as an LED (light-emitting diode), an OLED (organic LED), a downward-facing LED or another light source, a radiation-detecting component, a light-sensing component, a photodiode, a phototransistor, a photovoltaic device, a sensor, a micromechanical component, a switch, a touch switch, a proximity switch, a touch sensor, a proximity sensor, a capacitive switch, a capacitive sensor, a projected capacitive sensor or switch, a single-electrode capacitive switch or sensor, a multi-electrode capacitive switch or sensor, a self-capacitive sensor, or a mutual capacitive sensor.include an inductive sensor, a sensor electrode, an UL element, a user input element, a vibration element, a communication element, a data processing element, a data storage element, or an electronic subassembly.

[0042] Furthermore, at least one polymer layer 110 is provided on the first side of the substrate film 102 to at least partially embed the conductors 104. The polymer layer 110 can also at least partially embed at least one of the provided functional elements 108.

[0043] The polymer layer 110 can be a shaped polymer layer, which is provided, for example, by injection molding.

[0044] The polymer layer 110 can, for example, comprise a thermoplastic material. The polymer layer 110 can comprise at least one material selected from the group consisting of: elastomeric resin, thermoset material, thermoplastic material, PC, PMMA, ABS, PET, copolyester, copolyester resin, nylon (PA, polyamide), PP (polypropylene), TPU (thermoplastic polyurethane), polystyrene (GPPS), TPSiV (thermoplastic silicone vulcanizate), and MS resin. The thickness of the formed polymer layer can vary depending on the embodiment and may be, for example, less than one millimeter, several millimeters, or ten millimeters. The polymer layer can comprise at least partially transparent or translucent material.

[0045] The first side of the substrate film can represent a functional or visible side of the multilayer structure and can be configured to face the environment and / or a user. The functional element(s) can, for example, include indicators (such as light displays) that are accessible or visible to a user. The visible / functional side of the multilayer structure can also, for example, implement a user interface.

[0046] The multilayer structure further comprises at least one connecting element 112, which is arranged on the second side of the substrate film, wherein the connecting element 112 is coupled to the conductive material of the via 106.

[0047] The connecting element 112 can be arranged to be directly coupled to the conductive material of the via. Alternatively, the connecting element 112 can be coupled to the conductive material of the via 106 via the provided conductive features. In further embodiments, the connecting element 112 can be coupled to the conductive material of the via 106, e.g., by low-temperature solder paste and / or conductive film or tape, such as anisotropic conductive film tape (ACF).

[0048] The second side of the substrate film 102 can represent a physical interface side of the multilayer structure, wherein the physical interface side is intended to establish an external connection with the multilayer structure via the connecting element 112.

[0049] The connector 112 can be a connector that is attached through or onto the foil. The connector can include, for example, pins or pogo pins for the connection. The connector 112 can be an SMD connector.

[0050] The multilayer structure can further comprise an additional film 113 provided on the polymer layer 110. The additional film 113 can, for example, comprise the same or a similar material as the substrate film 102. The additional film 113 can include selected opacity properties and represent a masking layer that is at least partially opaque. The additional film 113 can, for example, include symbols, text, indicators, or other graphic features that can be created, for example, by using one or more inks in addition to or as an alternative to the opaque parts in the material of the additional film 113. The additional film 113 can also have optical features such as surface relief.

[0051] Any number of additional films can be provided in a multilayer structure, e.g., on any number of additional polymer layers that can be provided, resulting, for example, in a stacked structure with alternating polymer layers and additional film layers.

[0052] The multilayer structure can include a structural and / or conductive adhesive for fastening one or more components of the multilayer structure, such as the connecting element 112.

[0053] The connecting element 112 can be attached to the substrate film 102 using structural adhesive, but the attachment can also be done by hot gluing or ultrasonic welding.

[0054] On the second side of the substrate film 102, a further polymer layer 114 can be provided, wherein the further polymer layer 114 at least partially embeds or surrounds the connecting element 112. The further polymer layer 114 can comprise a similar material to the polymer layer 110. It should be noted that the further polymer layer 114 is only optional and not necessary in the multilayer structure.

[0055] As described above, the first side of the substrate film 102 can be provided with conductive features, such as printed conductive features. In some embodiments, the second side of the substrate film 102 can also be provided with conductive features, such as printed conductive features. The printed conductive features on the second side of the substrate film 102 can, for example, include printed conductive traces and / or printed conductive contact pads. At least some of the printed conductive features can be coupled to the conductive material of the via 106 and the connector 112. This can allow for more flexible placement of the connector 112 on the second side of the substrate film 102.

[0056] Fig. Figure 2 shows a cross-sectional view of another multilayer structure. At least one second interconnect is arranged on the first side of the substrate film 102, the second interconnect comprising a contact pad 116 arranged to cover the via 106 on the first side of the substrate film 102. In this case, the contact pad 116 provides the conductive material for the via and at least partially conforms to the shape of the via 106 in order to at least partially fill the via 106 or to at least partially coat the walls of the via 106. A conductive adhesive may be provided between the substrate film 102 and the contact pad 116.

[0057] Fig. Figure 2 represents an example of a multilayer structure obtained after the steps for providing the depicted elements. The shape of the contact pad 116 can be achieved through the manufacturing process of the multilayer structure.

[0058] Fig. Figure 3 shows part of the multilayer structure of Fig. 2 during the manufacturing process. The substrate film 102 is provided with at least one via 106. The via 106 can be provided, for example, by punching after the conductors 104 have been provided, which can be provided by printing.

[0059] The substrate film 102 is then provided with a second connecting element, which in this case is a contact pad 116. The contact pad 116 is arranged such that it covers at least one via 106. The contact pad 116 can be provided, for example, using SMD methods. At this point, the functional element 108 can also be provided.

[0060] The multi-layered structure (or at least the part of the structure that has been produced at this point) can then be formed into a desired 3D shape.

[0061] After a molding step, such as injection molding, in which the polymer layer 110 is provided, the structure of Fig. 3 of the structure of Fig. 2. The contact pad 116 resembles the shape of the contact pad. The pressure applied during forming, such as high-pressure forming, deforms the contact pad 116 so that it assumes a shape that at least partially corresponds to the shape of the via. The manufacturing process can then continue, at least with the provision of the connecting element 112.

[0062] Fig. Figure 4 illustrates a multilayer structure in which a second connecting element, comprising conductive material, is provided on the first side of the substrate film 102. Here, the second connecting element is a spacer 118. The shape of the spacer 118 corresponds to the shape of the via 106 and provides the conductive material for the via. Here, the via 106 can be completely filled with conductive material.

[0063] Fig. Figure 5 represents a multilayer structure in which a variety of functional elements 108, such as LEDs, are provided on the first side of the substrate film 102. Naturally, any number of functional elements 108 and any number of vias 106, the conductive material to which the functional elements 108 can be coupled, can be provided.

[0064] The multilayer structure of Fig. 5 also includes an optional superimposed polymer layer 124, which is provided on top of the polymer layer 110. The superimposed polymer layer 124 can, for example, be provided in a second molding shot in a molding process such as injection molding.

[0065] The embodiment of Fig. 5 further comprises a sealing structure 126, which can be provided between the second side of the substrate film 102, at least a part of the connecting element 112 and an external structure 128. The external structure could, for example, be a hood. The sealing structure 126 could be a sealing ring structure, which is, for example, prefabricated or manufactured in a separate production step, or the sealing structure 126 could be provided in a molding process and correspond to the further polymer layer 114.

[0066] Fig. Figure 6 represents an example of a multilayer structure. The multilayer structure comprises at least one post-mounted contact pad 130, which is arranged on the second side of the substrate film 102. The contact pad 130 is arranged such that it is coupled to the conductive material of the via 106. The contact pad 130 is further coupled to the connecting element 112. A multilayer structure comprising a contact pad 130, as shown in Figure 6, is described in Figure 6. Fig. The method shown in Figure 6 could also be applied in cases where no conductive features are provided on the second side of the substrate film 102. For example, a contact pad 130 can be directly coupled to a connecting element 112. Conductive adhesive could, for example, be provided at least on the first side of the substrate film 102, for example in conjunction with the via 106. Conductive and / or structural adhesive could be provided on the second side of the substrate film to attach at least the contact pad 130 to the substrate film 102.

[0067] Fig. Figure 7 illustrates a multi-layered structure, which is shown in Fig. 6 resembles. In Fig. However, in 7 the contact pad 130 is arranged at a distance from the via 106, while it is coupled to the conductive material of the via 106 by (a) conductor 132, which is / are provided, for example, by printing on the second side of the substrate film 102.

[0068] Fig.Figure 8 shows a flowchart of a process for manufacturing a multilayer structure. The process may include a start-up phase 002. In the start-up phase, tasks such as material selection (e.g., substrates, components, and tools), data acquisition, calibration, and other configuration tasks may be performed. This ensures, for example, that the individual elements and the material selection are compatible and can withstand the chosen manufacturing and installation process. The selection can be verified, for example, using the manufacturing process specifications and component datasheets, or by examining and testing the manufactured prototypes. The equipment used, such as in-mold decoration (IMD), laminating, bonding, (hot) forming, electronics assembly, cutting, drilling, and / or printing equipment, can thus be brought into operation during this phase.

[0069] The start-up phase may also include the procurement and configuration of various casting tools and / or perforation tools used.

[0070] In step 004, a substrate film is obtained which may comprise a malleable material, possibly malleable under high pressure.

[0071] The conductors 104 are provided on the first side of the substrate film 102 and optionally on the second side of the substrate film. Step 008 can refer to printing conductive traces. Optionally, step 006 can also include providing other conductive features.

[0072] At least one via 106 is provided in the substrate film 102. The via can be made, for example, by standard punching processes: laser cutting, cutting, or similar.

[0073] At least one optical and / or electrical functional element 108 is provided on the first side of the substrate film in step 010. The method can include SMD technologies. In step 010, further components, e.g., SMD components, can be provided. Unprinted contact pads, for example, can also be provided.

[0074] The method can include the application of a structural and / or conductive adhesive, for example between the substrate film 102 and the functional element 108.

[0075] The process involves applying conductive material to the via (012). The via can be at least partially filled with conductive material. The conductive material for the via can also be provided at different stages of the manufacturing process.

[0076] In 014, one or more secondary connecting elements may be provided. Additionally or alternatively, one or more contact pads 116 may be provided.

[0077] The process can include shaping the substrate film 102 into a desired three-dimensional, non-planar shape, optionally by forming, such as high-pressure forming.

[0078] The method further comprises the molding 018, preferably by injection molding, of a polymer layer 110 on the first side of the substrate film 102. The polymer layer is provided to embed the conductor 104 at least partially, optionally to embed the conductor 104 and the at least one functional element 108.

[0079] Following a molding step, the process may include the provision of an additional film 113 or another film, which may be, for example, a decorative film.

[0080] Step 018 may further include the use of one or more additional forming shots to form further superimposed polymer layers 124.

[0081] Additional films can also be provided on any further polymer layers.

[0082] In step 020, at least one connecting element 112 is provided on the second side of the substrate film 102. The connecting element 112 is coupled to the conductive material of the via 106. Step 020 can be performed using SMD technologies. In step 020, one or more post-assembled contact pads 130 can be provided on the second side of the substrate film 102. Of course, any other components, such as electronic components, can also be provided. In step 020, securing elements, such as conductive and / or structural adhesives, can also be provided.

[0083] The process can include an optional step of molding 022 (a) further polymer layer(s) 114 on the second side of the substrate film 102. The further polymer layer 114 can at least partially embed or surround the connecting element 112.

[0084] The execution of the procedure ends at 024.

[0085] The scope of the present invention is defined by the appended claims and their equivalents. A person skilled in the art will appreciate the fact that the disclosed embodiments were constructed for illustrative purposes only, and that other arrangements employing many of the above-mentioned principles could easily be prepared to best suit any potential application scenario.

Claims

[1] Multilayer structure, characterized by , that the multi-layer structure includes the following: a substrate film (102) comprising conductors (104) to a first side of the substrate film, wherein the substrate film further comprises a via (106) wherein the via is provided with conductive material, wherein the conductive material is coupled to the conductors, at least one optical and / or electrical functional element (108) on the first side of the substrate film, wherein the functional element is coupled to the conductors, at least one polymer layer (110) on the first side of the substrate film to at least partially embed the conductor and the at least one functional element, and at least one connecting element (112) arranged on a second side of the substrate film, wherein the connecting element is coupled to the conductive material of the via. [2] Multilayer structure according to claim 1, wherein an additional film (113) is provided on the polymer layer. [3] Multilayer structure according to one of the preceding claims, wherein the conductors are printed conductive traces. [4] Multilayer structure according to one of the preceding claims, wherein at least one contact pad is arranged on the first side of the substrate film and is coupled to the conductive material of the via. [5] Multilayer structure according to one of the preceding claims, wherein at least one second connecting element is arranged on the first side of the substrate film, wherein the second connecting element optionally comprises a contact pad, wherein the second connecting element is arranged such that it covers the via on the first side of the substrate film and provides the conductive material of the via, wherein optionally a shape of the contact pad corresponds to the shape of the via. [6] Multilayer structure according to one of the preceding claims, wherein the second side of the substrate film comprises conductive features such as printed conductive traces and / or printed conductive pads. [7] Multilayer structure according to one of the preceding claims, wherein the multilayer structure further comprises structural adhesive, conductive adhesive, low-temperature solder paste and / or conductive film or tape, such as anisotropic conductive foil tape (ACF), between at least one part of the connecting element and the second side of the substrate film. [8] Multilayer structure according to one of the preceding claims, wherein the multilayer structure further comprises at least one contact pad (130) on the second side of the substrate film, wherein the connecting element on the second side of the substrate film is coupled to the conductive material of the via via via the contact pad. [9] Multilayer structure according to one of the preceding claims, comprising a further polymer layer (114) on the second side of the substrate film, wherein the further polymer layer at least partially embeds or surrounds the connecting element. [10] Multilayer structure according to one of the preceding claims, wherein the substrate film comprises formable material, preferably thermoformable material, optionally polymer, PMMA (polymethyl methacrylate), polycarbonate (PC), copolyester, copolyester resin, polyimide, copolymer of methyl methacrylate and styrene (MS resin), glass and / or polyethylene terephthalate (PET). [11] Multilayer structure according to one of the preceding claims, wherein the connecting element comprises a surface mountable connector (SMD).

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