Electronic device and ultrasonic fingerprint recognition device

Abstract

Ultrasonic fingerprint recognition device mounted in an electronic device, characterized in that the ultrasonic fingerprint recognition device comprises an ultrasonic sensor and a circuit board; wherein the circuit board is electrically connected to a processing unit of the electronic device; wherein the ultrasonic sensor is used to emit ultrasonic signals and to receive ultrasonic signals which are reflected and then pass through an outer edge frame of the electronic device, and is further used to convert the received ultrasonic signals into electrical signals and to send the electrical signals via the circuit board to the processing unit; wherein the ultrasonic sensor is mounted in a recess formed on the back side of a protruding structure; wherein at least part of the ultrasonic sensor is arranged within the recess, wherein the outer edge frame of the electronic device protrudes to form a front face of the protruding structure; the protruding structure is designed as part of the outer edge frame of the electronic device.

Description

Technical field

[0001] The present application relates to the technical field of fingerprint recognition, in particular to an electronic device and an ultrasonic fingerprint recognition device. Technical background

[0002] With technological advancements, fingerprint unlocking and other features are becoming increasingly common in electronic devices such as mobile phones, tablets, and laptops. Typically, a capacitive fingerprint module is located on one side edge of an electronic device, but this module has limited penetration capability. Placing the capacitive fingerprint module within a midframe or on the inside of a midframe cover can easily reduce penetration capability and thus impair the accuracy of fingerprint recognition. Content of the invention

[0003] In a first aspect of the embodiments of the present application, an electronic device is provided which comprises: a midframe assembly, wherein the midframe assembly is arranged in a circumferential direction of the electronic device; and an ultrasound scanning module for capturing fingerprint information; the ultrasound detection module is mounted in the midframe assembly.

[0004] In one possible embodiment, the central frame assembly includes a button, with the ultrasonic detection module being arranged at the button.

[0005] In one possible embodiment, the button has a receiving chamber, with the ultrasound detection module being glued to an inner wall of the receiving chamber.

[0006] In one possible embodiment, the central frame assembly comprises a main body and a cover plate, wherein the main body is arranged in the circumferential direction of the electronic device, and the cover plate is located outside the main body; the ultrasound detection module is located between the main body and the cover plate.

[0007] In one possible embodiment, the ultrasound detection module is glued to the central frame assembly.

[0008] In one possible embodiment, the electronic device comprises an adhesive layer, wherein the adhesive layer is located on a side of the ultrasonic detection module facing the cover plate, and wherein the ultrasonic detection module is adhered to the cover plate by means of the adhesive layer.

[0009] In one possible embodiment, the ultrasonic detection module comprises an ultrasonic fingerprint module and an acoustic layer, wherein the acoustic layer is located on a side of the ultrasonic fingerprint module facing away from the interior of the electronic device.

[0010] In one possible embodiment, the acoustic layer comprises a first electrode, a second electrode and a piezoelectric layer, wherein the piezoelectric layer is located between the first electrode and the second electrode, wherein the first electrode is used for electrical connection to a signal transmitting circuit and the second electrode is used for electrical connection to a signal receiving circuit, and wherein the piezoelectric layer is used for transmitting and receiving ultrasonic signals.

[0011] In one possible embodiment, the second electrode comprises several electrodes, each connected to an operational amplifier.

[0012] In one possible embodiment, the electronic device includes a pressure sensor, wherein the pressure sensor is arranged on the central frame assembly, and wherein the pressure sensor is electrically connected to the ultrasonic detection module.

[0013] The first aspect of the present application provides an electronic device comprising a central frame assembly arranged circumferentially and an ultrasonic detection module mounted in the central frame assembly, which is used to capture fingerprint information. This design enables the fingerprint capture function to be located at the side edge of the electronic device; simultaneously, the ultrasonic detection module captures the fingerprints using ultrasonic signals. The ultrasonic signals exhibit good penetration, resulting in higher capture accuracy, which better meets actual usage requirements.

[0014] In a second aspect of the embodiments of the present application, an ultrasonic fingerprint recognition device is provided which is mounted in an electronic device, wherein the ultrasonic fingerprint recognition device comprises an ultrasonic sensor and a printed circuit board; wherein the circuit board is electrically connected to a processing unit of the electronic device; wherein the ultrasonic sensor is used to emit ultrasonic signals and to receive ultrasonic signals which are reflected and then pass through an outer edge frame of the electronic device, and is further used to convert the received ultrasonic signals into electrical signals and to send the electrical signals via the circuit board to the processing unit; wherein the ultrasonic sensor is mounted in a recess formed on the back side of a protruding structure; wherein at least part of the ultrasonic sensor is arranged within the recess, wherein the outer edge frame of the electronic device protrudes to form a front face of the protruding structure; the protruding structure is designed as part of the outer edge frame of the electronic device.

[0015] In connection with the second aspect, one implementation form of the second aspect further provides that the depth of the recess is equal to or less than the thickness of the ultrasonic sensor; wherein the base area of ​​the recess is larger than the area of ​​the ultrasonic sensor; wherein a long side of the protruding structure is parallel to a long side of a display screen of the electronic device, and a short side of the protruding structure is parallel to a short side of the display screen of the electronic device.

[0016] In connection with the second aspect, one implementation form of the second aspect further stipulates that the height of the protruding structure shall be no less than 0.5 mm and no more than 3 mm; wherein the height of the protruding structure is equal to the height of a volume button or an on / off button of the electronic device; the protruding structure is a cuboid-shaped protruding structure.

[0017] In connection with the second aspect, one implementation form of the second aspect further provides that the ultrasonic sensor comprises an acoustic layer and a silicon wafer layer, wherein the silicon wafer layer is connected to the acoustic layer; the installation of the ultrasonic sensor in the recess formed on the back of the protruding structure includes: Applying the acoustic layer in the recess, wherein the acoustic layer is positioned between the protruding structure and the silicon wafer layer; or The silicon wafer layer is placed in the recess, with the silicon wafer layer positioned between the protruding structure and the acoustic layer.

[0018] In connection with the second aspect, one implementation form of the second aspect provides that the ultrasonic sensor further comprises an adhesive layer, wherein the acoustic layer or the silicon wafer layer is attached by means of the adhesive layer in the recess formed on the back of the protruding structure, wherein the adhesive layer is a copper foil adhesive; wherein the ultrasonic fingerprint recognition device further comprises a reinforcement element, wherein the reinforcement element is used to attach the ultrasonic sensor, wherein the acoustic layer or the silicon wafer layer is attached to the reinforcement element by means of the mounting layer; wherein the ultrasonic fingerprint recognition device further comprises a first mounting component, wherein the circuit board is attached to the outer edge frame by means of the first mounting component, wherein the first mounting component is used to support the circuit board so that the circuit board is electrically connected to the silicon wafer layer; wherein one end of the silicon wafer layer is connected to the printed circuit board by means of a bond wire, wherein the first fastening component is used to support the printed circuit board, such that an electrical connection area of ​​the printed circuit board and an electrical connection area of ​​the silicon wafer layer are at the same level; or where one end of the silicon wafer layer is bonded to the circuit board using an ACF adhesive.

[0019] In connection with the second aspect, one implementation form of the second aspect also provides that the front of the protruding structure provides a pressure surface for contact with a user's finger.

[0020] In connection with the second aspect, one implementation form of the second aspect provides that the outer edge frame and the protruding structure are made of the same material, wherein the outer edge frame is made of plastic or metal, wherein the protruding structure is formed integrally with the outer edge frame to which it is attached, and wherein there is no air gap between the protruding structure and the outer edge frame.

[0021] In connection with the second aspect, one implementation form of the second aspect also provides that the outer edge frame and the protruding structure are made of different materials, with the outer edge frame being made of plastic or metal.

[0022] In connection with the second aspect, one implementation form of the second aspect also provides for a screen print on the upper part of the front of the protruding structure, wherein the screen print is a fingerprint pattern; wherein the protruding structure is vertical or has a first chamfer on a side close to the display screen of the electronic device and on a side close to the rear of the electronic device; wherein the protruding structure is vertical on both sides along the outer edge frame or has a second chamfer; wherein the upper part of the front of the protruding structure is a flat surface; or wherein the upper part of the front of the protruding structure is a curved surface, wherein the curvature of the curved surface is less than the curvature of the first chamfer, the curvature of the curved surface is less than the curvature of the second chamfer, and the curvature of the curved surface is equal to the curvature of the outer edge frame of the electronic device.

[0023] In a third aspect of the embodiments of the present application, an electronic device for fingerprint recognition is provided, comprising the ultrasonic fingerprint recognition device according to one of the implementation forms of the second aspect and an outer rim frame.

[0024] In comparison to the prior art, the advantageous effects of the embodiments of the present application are as follows: The second and third aspects of the embodiments of the present application provide an ultrasonic fingerprint recognition device and an electronic fingerprint recognition device; on the one hand, due to its strong penetrating power, the ultrasonic wave can more easily penetrate the outer edge frame of the electronic device, resulting in a high strength of the ultrasonic signal received by the ultrasonic sensor and high accuracy of fingerprint recognition;On the other hand, by arranging the ultrasonic fingerprint recognition device in the recess formed by the protruding structure of the outer edge frame of the electronic device, space utilization can be improved, and at the same time the protruding structure can guide the user more quickly to a place where the finger is to be pressed.

[0025] In a fourth aspect of the embodiments of the present application, an ultrasonic fingerprint recognition device is provided which is mounted in an electronic device, wherein the ultrasonic fingerprint recognition device comprises an ultrasonic sensor and a printed circuit board; wherein the circuit board is electrically connected to a processing unit of the electronic device; wherein the ultrasonic sensor is used to emit ultrasonic signals and to receive ultrasonic signals which are reflected and then pass through an outer edge frame of the electronic device, and is further used to convert the received ultrasonic signals into electrical signals and to send the electrical signals via the circuit board to the processing unit; wherein the ultrasonic sensor is attached to a rear side of a first recess structure, wherein a front side of the first recess structure is formed by recessing the outer edge frame of the electronic device.

[0026] In connection with the fourth aspect, one implementation form of the fourth aspect further provides that the ultrasonic sensor comprises an acoustic layer and a silicon wafer layer, wherein the silicon wafer layer is connected to the acoustic layer; wherein the ultrasonic sensor further comprises an adhesive layer, wherein the acoustic layer or the silicon wafer layer is attached to the back of the first recess structure by means of the adhesive layer, wherein the adhesive layer is a copper foil adhesive; wherein the front of the first recess structure provides a pressure surface for contact with a user's finger; wherein there is no air gap between the first recess structure and the outer edge frame; wherein the ultrasonic fingerprint recognition device further comprises a first mounting section, wherein the printed circuit board is attached to the outer edge frame by means of the first mounting section, wherein the first mounting section is used to support the printed circuit board so that the printed circuit board is electrically connected to the silicon wafer layer; wherein one end of the silicon wafer layer is connected to the printed circuit board by means of a bond wire, wherein the first fastening section is used to support the printed circuit board, such that an electrical connection area of ​​the printed circuit board and an electrical connection area of ​​the silicon wafer layer are at the same level; or where one end of the silicon wafer layer is bonded to the circuit board using an ACF adhesive.

[0027] In connection with the fourth aspect, one implementation form of the fourth aspect further provides that a second recess structure is formed on the back of the first recess structure, which is used to accommodate at least one part of the ultrasonic sensor.

[0028] In connection with the fourth aspect, one implementation form of the fourth aspect further provides that a depth of the second recess structure is less than or equal to a thickness of the ultrasonic sensor; wherein a base area of ​​the second recess structure is greater than or equal to an area of ​​the ultrasonic sensor.

[0029] In connection with the fourth aspect, one implementation form of the fourth aspect further provides that the acoustic layer is placed inside the second recess structure, with the acoustic layer being arranged between the silicon wafer layer and the first recess structure; or that the silicon wafer layer is placed inside the second recess structure, with the silicon wafer layer being positioned between the acoustic layer and the first recess structure.

[0030] In connection with the fourth aspect, one implementation form of the fourth aspect further provides that the back of the first recess structure is flat; the process of attaching the ultrasonic sensor to the rear of the first recess structure includes: Applying the acoustic layer to the back of the first recess structure, wherein the acoustic layer is positioned between the silicon wafer layer and the first recess structure; or Attaching the silicon wafer layer to the back of the first recess structure, wherein the silicon wafer layer is positioned between the acoustic layer and the first recess structure.

[0031] In connection with the fourth aspect, one implementation form of the fourth aspect also provides that the first recess structure and the outer edge frame are made of the same material, with the outer edge frame being made of plastic or metal; wherein the first recess structure is formed by one-piece molding, by recessing the outer edge frame of the electronic device; or wherein the first recess structure is a physical button, wherein the front of the first recess structure is used to provide a contact surface for the physical button.

[0032] In connection with the fourth aspect, one implementation form of the fourth aspect also provides that the first recess structure and the outer edge frame are made of different materials, with the outer edge frame being made of plastic or metal; wherein the first recess structure is a physical button, wherein the front of the first recess structure is used to provide a contact surface for the physical button.

[0033] In connection with the fourth aspect, one implementation form of the fourth aspect also stipulates that the depth of the first recess structure is not less than 0.5 mm and not more than 2 mm.

[0034] In connection with the fourth aspect, one implementation form of the fourth aspect also provides that the front of the first recess structure is a flat surface, with the front of the first recess structure being perpendicular to a display screen of the electronic device; wherein a screen print is provided on the front of the first recess structure, the screen print being a fingerprint pattern; wherein the first recess structure has two side surfaces, wherein the two side surfaces are two opposite side surfaces along the outer edge frame; wherein the two side surfaces of the first recess structure form a chamfered structure; or wherein the two side surfaces of the first recess structure are side surfaces that run perpendicular to the front of the first recess structure.

[0035] In a fifth aspect of the embodiments of the present application, an electronic device for fingerprint recognition is provided, comprising the ultrasonic fingerprint recognition device according to one of the implementation forms of the fourth aspect and an outer rim frame.

[0036] In comparison to the prior art, the advantageous effects of the embodiments of the present application are as follows: The fourth and fifth aspects of the embodiments of the present application provide an ultrasonic fingerprint recognition device and an electronic fingerprint recognition device; on the one hand, due to its strong penetrating power, the ultrasonic wave can more easily penetrate the outer edge frame of the electronic device, resulting in a high strength ultrasonic signal and high fingerprint recognition accuracy; on the other hand, by arranging the ultrasonic fingerprint recognition device on the rear side of the first recess structure formed by the indentation of the outer edge frame of the electronic device, the first recess structure can guide the user more quickly to a point on which to press the finger.

[0037] It should be understood that the above general description and the following detailed description are merely exemplary and cannot limit the present application. Images Fig. Figure 1 shows a sectional view of an electronic device according to the present application; Fig. 2 shows a schematic view of a key according to the present application; Fig. Figure 3 shows a schematic view of an electronic device according to the present application; Fig. Figure 4 shows a schematic sectional view of an ultrasonic fingerprint recognition device according to an embodiment of the present application; Fig. Figure 5 shows a schematic sectional view of another ultrasonic fingerprint recognition device according to an embodiment of the present application; Fig. Figure 6 shows a schematic view of a cross-section from any outer edge frame to another outer edge frame when mounting an ultrasonic fingerprint recognition device on the outer edge frame of an electronic device according to an embodiment of the present application; Fig. Figure 7 shows a schematic view of a cross-section from any outer edge frame to another outer edge frame when mounting another ultrasonic fingerprint recognition device on the outer edge frame of an electronic device according to an embodiment of the present application; Fig. Figure 8 shows a schematic view of a cross-section from a display screen of an electronic device to a bottom surface of the electronic device when mounting an ultrasonic fingerprint recognition device on the outer edge frame of the electronic device according to an embodiment of the present application; Fig. Figure 9 shows a schematic view of a cross-section from a display screen of an electronic device to a base surface of the electronic device when mounting a further ultrasonic fingerprint recognition device on the outer edge frame of the electronic device according to an embodiment of the present application; Fig. Figure 10 shows a schematic view of a cross-section from a display screen of an electronic device to a base surface of the electronic device when mounting yet another ultrasonic fingerprint recognition device on the outer edge frame of the electronic device according to an embodiment of the present application; Fig. Figure 11 shows a schematic view of a cross-section from a display screen of an electronic device to a base surface of the electronic device when mounting yet another ultrasonic fingerprint recognition device on the outer edge frame of the electronic device according to an embodiment of the present application; Fig. Figure 12 shows a schematic view of a cross-section from any outer edge frame to another outer edge frame when mounting yet another ultrasonic fingerprint recognition device on the outer edge frame of an electronic device according to an embodiment of the present application; Fig. Figure 13 shows a schematic view of a cross-section from any outer edge frame to another outer edge frame when mounting yet another ultrasonic fingerprint recognition device on the outer edge frame of an electronic device according to an embodiment of the present application; Fig. Figure 14 shows a schematic sectional view of an ultrasonic fingerprint recognition device according to an embodiment of the present application; Fig. Figure 15 shows a schematic sectional view of an ultrasonic fingerprint recognition device according to an embodiment of the present application; Fig. Figure 16 shows a schematic sectional view of an outer edge frame of an electronic device according to an embodiment of the present application; Fig. Figure 17 shows a schematic sectional view of the outer edge frame of the electronic device. Fig. 16, on which a fingerprint recognition device is mounted, according to an embodiment of the present application; Fig. Figure 18 shows a schematic sectional view of the outer edge frame of the electronic device. Fig. 16, on which a further fingerprint recognition device is mounted, according to an embodiment of the present application; Fig. Figure 19 shows a schematic sectional view of another outer edge frame of an electronic device according to an embodiment of the present application; Fig. Figure 20 shows a schematic sectional view of the outer edge frame of the electronic device. Fig. 19, on which a fingerprint recognition device is mounted, according to an embodiment of the present application; Fig. Figure 21 shows a schematic sectional view of the outer edge frame of the electronic device. Fig. 19, on which a further fingerprint recognition device is mounted, according to an embodiment of the present application; Fig. Figure 22 shows a schematic sectional view of another outer edge frame of an electronic device on which a fingerprint recognition device is mounted, according to an embodiment of the present application;

[0038] The drawings included here are incorporated into the specification, form part of the specification, show embodiments corresponding to the present application, and are used together with the description to explain the principles of the present application. Description of embodiments

[0039] To better understand the technical solutions of the present application, the embodiments of the present application are described in more detail in conjunction with the drawings.

[0040] It should be clear that the described embodiments represent a subset of the embodiments in the present application, rather than all embodiments. All other embodiments that a person skilled in the art could obtain from the embodiments in the present application without inventive step are also within the scope of protection of the present application.

[0041] The technical terms used in the embodiments of the present application serve only to describe certain embodiments and are not intended to limit the present application. The singular forms "a / an / an", "the / a / a" and "this / this / these", which are used in the embodiments of the present application and the attached claims, are also intended to include the plural forms unless the context clearly indicates otherwise.

[0042] It is understood that the term "and / or" used here represents only an associative relationship describing related objects, and that the use of this term indicates that three relationships are possible. For example, the expression "A and / or B" can be understood as encompassing three possibilities: the presence of A alone, the simultaneous presence of A and B, and the presence of B alone. Furthermore, the " / " symbol generally indicates that the related objects before and after it are in an "or" relationship.

[0043] It should be noted that the orientation terms, such as "top", "bottom", "left", and "right", given in the embodiments of this application, are described from a perspective shown in the drawings and should not be interpreted as limiting the embodiments shown in the present drawings. Furthermore, it should be noted in this context that the expression "top" or "bottom" of an element can be understood not only as meaning that this element is directly connected "top" or "bottom" to the other element, but also as meaning that this element is indirectly connected "top" or "bottom" to the other element via an intermediate element.

[0044] As in Fig. As shown in Figure 1, the embodiments of the present application provide an electronic device, which may be a mobile phone, a tablet, a laptop, or the like. The electronic device comprises a central frame assembly 1 and an ultrasonic detection module 2. The central frame assembly 1 is arranged in a circumferential direction of the electronic device, and the ultrasonic detection module 2 is used to capture fingerprint information, wherein the ultrasonic detection module 2 is arranged in the central frame assembly 1 so that the electronic device can achieve fingerprint recognition on a side edge.

[0045] By installing the Ultrasonic Detection Module 2, a fingerprint can be recognized. Fingerprint recognition enables functions such as unlocking electronic devices and making payments with a fingerprint, thus better meeting actual user requirements. Furthermore, the Ultrasonic Detection Module 2 has a higher penetration capability than a capacitive detection module, resulting in greater detection accuracy and more precise fingerprint recognition, thereby increasing security.

[0046] As in Fig. As shown in Figure 2, the central frame assembly 1 in one possible embodiment comprises a button 11, wherein the ultrasonic detection module 2 is arranged at the button 11. The button 11 can be a side button 11 of the electronic device, including, but not limited to, a volume button, a screen lock button, and an on / off button.

[0047] Integrating the Ultrasonic Detection Module 2 into Key 11 makes it easier for the user to perform fingerprint recognition during use. Furthermore, the Ultrasonic Detection Module 2 can be directly embedded inside Key 11, reducing the space it occupies. This, in turn, optimizes the structure of the electronic device, facilitating miniaturization and a thinner, lighter design, resulting in a slimmer device that better meets actual requirements.

[0048] As in Fig. As shown in Figure 2, in one possible embodiment the button 11 has a receiving chamber 111, wherein the ultrasound detection module 2 is glued to an inner wall of the receiving chamber 111.

[0049] In this way, the ultrasonic detection module 2 can be attached to the inner wall of key 11, which facilitates the improvement of the accuracy of fingerprint recognition by the ultrasonic detection module 2 and better meets actual usage requirements.

[0050] As in Fig. As shown in Figure 1, the central frame assembly 1 can, in one possible embodiment, comprise a main body 12 and a cover plate 13, wherein the main body 12 is arranged in the circumferential direction of the electronic device, and the cover plate 13 is located outside the main body 12, i.e., on a side of the main body 12 facing away from the electronic device. The ultrasonic detection module 2 is located between the main body 12 and the cover plate 13.

[0051] This design allows the cover plate 13 to protect the ultrasonic sensing module 2, thereby reducing the likelihood of damage to the ultrasonic sensing module 2. It also contributes to the realization of a design without physical buttons. During use, the ultrasonic sensing module 2 can be used to detect finger movements to enable functions such as volume control and accessing the navigation bar.In comparison to providing physical buttons, the solution provided in this embodiment of the present application can save the cost of providing physical buttons and reduce the number of operations such as drilling holes in the central frame assembly 1 of the electronic device, which not only helps to reduce machining difficulties but also helps to improve the overall sealing of the electronic device, increase the water and dust resistance of the electronic device and reduce the likelihood of accidents such as liquid ingress, thereby better meeting actual usage requirements.

[0052] When an electronic device uses a capacitive sensing module, due to the limited penetration capability of the capacitive sensing module, a slot must be provided in the central frame assembly 1, or the cover plate 13 must be flattened towards the interior of the electronic device to reduce the gap that the capacitive sensing module must penetrate. However, such a design not only compromises the overall structural strength of the central frame assembly 1 but also increases the number of machining steps, making the machining process very complex and costly. Furthermore, the outer surface of the central frame assembly 1 of the electronic device becomes uneven, negatively impacting the user's tactile experience.The electronic device provided by this embodiment of the present application, due to the use of the ultrasonic detection module 2 for fingerprint recognition, not only has good penetration capability but also higher recognition accuracy for wet fingers, etc., and at the same time does not require any additional machining of the central frame assembly 1, so that it better meets actual usage requirements.

[0053] In one possible embodiment, the ultrasound detection module 2 is glued to the central frame assembly 1.

[0054] Adhesive bonding offers the advantages of ease of use and processing. Furthermore, it places lower demands on the material of the objects being joined and can adapt to various surfaces, with a relatively uniform bonding force and a relatively low adhesive mass, thus better meeting actual usage requirements.

[0055] As in Fig. As shown in Figure 1, in one possible embodiment the electronic device comprises an adhesive layer 3, wherein the adhesive layer 3 is located on a side of the ultrasonic detection module 2 facing the cover plate 13, and wherein the ultrasonic detection module 2 is adhered to the cover plate 13 by means of the adhesive layer 3.

[0056] Such a design can help improve the degree of fit between the ultrasonic detection module 2 and the cover plate 13, making it easier for the ultrasonic detection module 2 to detect the fingerprint of the finger coming into contact with the cover plate 13, which contributes to improving the accuracy of fingerprint recognition and better meets actual usage requirements.

[0057] As in Fig. As shown in Figure 1, the ultrasonic detection module 2, in one possible embodiment, comprises an ultrasonic fingerprint module 21 and an acoustic layer 22, wherein the acoustic layer 22 is located on a side of the ultrasonic fingerprint module 21 facing away from the interior of the electronic device. The ultrasonic fingerprint module 21 may be a fingerprint recognition chip. The acoustic layer 22 is used for emitting and receiving ultrasonic waves.

[0058] Such a design allows the acoustic layer 22 to be located on a side of the ultrasonic detection module 2 that is closer to the finger, which facilitates fingerprint recognition by the ultrasonic detection module 2, contributes to improving detection accuracy and better meets actual usage requirements.

[0059] In one possible embodiment, the acoustic layer 22 comprises a first electrode, a second electrode and a piezoelectric layer, wherein the piezoelectric layer is located between the first electrode and the second electrode, wherein the first electrode is electrically connected to a signal transmitting circuit and the second electrode is electrically connected to a signal receiving circuit, wherein the piezoelectric layer is used for transmitting and receiving ultrasonic signals.

[0060] The signal transmission circuit is used to generate a mechanism signal and charge it to the first electrode to excite the piezoelectric layer, causing it to emit an ultrasonic signal to a finger in contact with the central frame assembly 1. When the ultrasonic signal returns from the finger, it is used by the piezoelectric layer to generate an ultrasonic detection signal between the first and second electrodes. This detection signal is then used to obtain a fingerprint image of the finger. Programs and algorithms integrated into the electronic device recognize this fingerprint image, enabling the corresponding functions.

[0061] In one possible embodiment, the second electrode comprises several electrodes, each connected to an operational amplifier.

[0062] The individual electrodes can each be connected to different operational amplifiers; alternatively, multiple electrodes can be connected to the same operational amplifier. The operational amplifier is used to acquire an electrical signal converted from the ultrasound signal.

[0063] In one possible embodiment, the electronic device includes a pressure sensor, wherein the pressure sensor is electrically connected to the ultrasonic detection module 2.

[0064] By providing a pressure sensor, the ultrasonic detection module 2 can also perform pressure detection during fingerprint recognition, enabling various functions, such as accessing the navigation bar, to be implemented depending on different pressures applied by the user.

[0065] As in Fig. As shown in Figure 3, in one possible embodiment the central frame assembly 1 is arranged between a screen 4 and a rear shell 5 of the electronic device. The solution provided in this embodiment of the present application enables the implementation of the ultrasonic sidebar fingerprint (USF) function. The ultrasonic detection module 2 has a fingerprint recognition area 211. The user can swipe, click, and perform other actions in a corresponding area of ​​the cover plate 13. In conjunction with the internal programs and algorithms of the electronic device, the ultrasonic detection module 2 can detect the finger's movement path, process multiple successive fingerprint images, and output changes in finger movement, thereby enabling corresponding functions.The feasible functions include, but are not limited to, volume control, brightness control, screen on / off switching, and fingerprint payment.

[0066] The cover plate 13 can be made of an ultrasound-permeable material, such as metal, glass, or plastic. The cover plate 13 can be curved or flat. If the cover plate 13 is curved, the detected fingerprint image can be processed in conjunction with the programs and algorithms of the electronic device to reduce the influence of the curved cover plate 13 on the fingerprint image, thus better meeting actual usage requirements.

[0067] In one possible embodiment, the ultrasound signals emitted by the ultrasound detection module 2 to the finger can partially penetrate the skin and be absorbed by the blood. The electronic device can be equipped with health detection functions, such as heart rate detection, whereby appropriate programs and algorithms analyze the returning ultrasound signals, determining relevant information about the blood based on the absorption of ultrasound signals by the blood. This allows for the assessment of the human body's health status, which better meets actual usage requirements.

[0068] The embodiments of the present application provide an electronic device comprising a central frame assembly 1 arranged circumferentially and an ultrasonic detection module 2 mounted in the central frame assembly 1 and used for capturing fingerprint information. Such a design enables the fingerprint capture function to be located on the side edge of the electronic device; simultaneously, the ultrasonic detection module 2 captures the fingerprints by means of ultrasonic signals. The ultrasonic signals exhibit good penetration, resulting in higher capture accuracy, which better meets actual usage requirements.

[0069] The basic principle of in-display ultrasonic fingerprint recognition is as follows: The ultrasonic sensor is mounted beneath the screen, and the ultrasonic waves it emits reach the surface of the finger after passing through the screen. The fingerprint reflects these waves. Because the ridges and depressions of the fingerprint reflect the ultrasonic waves differently, the reflected echoes are received by the ultrasonic sensor through the screen, and a fingerprint image is obtained based on the difference between the echoes.

[0070] One embodiment of the present application provides an ultrasonic fingerprint recognition device. Fig. Figure 4 shows a schematic sectional view of the ultrasonic fingerprint recognition device according to the embodiment of the present application. The ultrasonic fingerprint recognition device 100 comprises an ultrasonic sensor 101 and a printed circuit board 102, wherein the printed circuit board 102 is electrically connected to a processing unit of the electronic device, wherein the ultrasonic sensor 101 is used for emitting ultrasonic signals and for receiving ultrasonic signals that are reflected and then pass through the outer edge frame of the electronic device, and furthermore for converting the received ultrasonic signals into electrical signals and for transmitting the electrical signals via the printed circuit board 102 to the processing unit. In this embodiment, the ultrasonic sensor 101 and the printed circuit board 102 are connected by means of a bond wire 103.In the above-mentioned embodiment, the circuit board is electrically connected to the processing unit in the electronic device, wherein the circuit board 102 can be a flexible circuit board, wherein the circuit board is used to transmit electrical signals to the processing unit of the electronic device, wherein the processing unit performs fingerprint recognition and anti-counterfeiting protection via fingerprint depending on the electrical signals.

[0071] Compared to the ultrasonic sensor, which is in Fig. As shown in Figure 4, in this embodiment the use of bond wires to connect the circuit board and the ultrasonic sensor can also be omitted. As shown in Figure 4, the use of bond wires to connect the circuit board and the ultrasonic sensor can be omitted. Fig. As shown in Figure 5, the ultrasonic fingerprint recognition device 100 comprises an ultrasonic sensor 101 and a printed circuit board 102, wherein a bond pad area 14 of the ultrasonic sensor 101 is electrically connected to the flexible printed circuit board 102, the flexible printed circuit board 102 being used for connection to an external circuit, which is, for example, a processing unit of the electronic device. In this embodiment, the electrical connection area of ​​the flexible printed circuit board 102 can also include a bond pad (not shown). The bond pad area 14 of the ultrasonic sensor 101 and the electrical connection area of ​​the flexible printed circuit board 102 can be electrically connected by means of a conductive adhesive 1031.Optionally, the bond pad area 14 of the ultrasonic sensor 101 and the electrical connection area of ​​the flexible printed circuit board 102 can be electrically connected using an ACF adhesive (Anisotropic Conductive Film) 1031 and an ACF lamination process. The ultrasonic sensor 101 and the flexible printed circuit board 102 are bonded by the ACF adhesive 1031 to establish an electrical connection. Simultaneously, the ACF adhesive 1031 itself exhibits adhesive properties that can enable better bonding of the ultrasonic sensor 101 to the flexible printed circuit board 102. A solution in which the in . Fig. The bond wire shown in step 4 is easier to process and has good structural stability, whereas a solution using ACF adhesive does not have to address the problem of fixing the bond wires.

[0072] The Fig. 6, Fig. 7, Fig. 8, Fig. 9, Fig. 10 to Fig. Figure 11 shows schematic sectional views from different angles of an ultrasonic fingerprint recognition device provided by embodiments of the present application, which is mounted on an outer edge frame of an electronic device. This ultrasonic fingerprint recognition device is applied to electronic devices. The ultrasonic fingerprint recognition device is mounted in an electronic device, e.g., a mobile phone, an electronic watch, or another electronic device. The embodiments of the present application are explained using the example of an ultrasonic fingerprint recognition device mounted in a mobile phone. In the following embodiments, the Fig. 6, Fig. 7, Fig. 12 and Fig. 13 each a view of a cross-section from any outer edge frame to another outer edge frame of the electronic device, while the Fig. 8, Fig. 9, Fig. 10 to Fig. 11 each show a view of a cross-section from a display screen of the electronic device to a floor surface of the electronic device.

[0073] Fig. Figure 6 shows a long outer frame 300 of the entire electronic device, wherein the ultrasonic fingerprint recognition device comprises an ultrasonic sensor 301 and a printed circuit board 302, the ultrasonic sensor 301 being mounted in a recess 306 formed on the rear side 3051 of a projecting structure 305. Viewed from a side edge of the mobile phone, the outer outer frame 300 of the mobile phone projects outwards, thus forming a projecting structure 305. Outer frames 3000 and 3001 of the mobile phone are two short outer frames of the mobile phone. The outer frame 300 of the mobile phone is one of the long outer frames of the mobile phone, and the other long outer frame, which is opposite the long outer frame 300, is not shown. The long outer frame 300 of the mobile phone may also include a power button and volume control buttons.Inside the projecting structure 305, a recess 306 is formed to accommodate the ultrasonic sensor 301. Specifically, a rear surface 3051 of the projecting structure 305 is recessed inwards towards the front surface 3052 to form a recess 306 for the ultrasonic sensor 301. On the one hand, the projecting structure 305 makes it easier for the user to quickly locate a fingerprint capture area. On the other hand, the recess 306 inside the projecting structure is used to accommodate at least part of the ultrasonic sensor 301, thus improving space utilization.Since the recess 306 formed on the rear side of the projecting structure 305 is used to accommodate part of the ultrasonic sensor 301, the distance between the ultrasonic sensor and a fingerprint capture surface is reduced, which can significantly improve the strength of the ultrasonic signal and thus increase the accuracy of fingerprint capture. At least part of the ultrasonic sensor 301 is located inside the projecting structure 305. More precisely, at least part of the ultrasonic sensor 301 is located inside the recess 306. The projecting structure 305 is part of the outer edge frame 300 of the electronic device. The outer edge frame 300 of the electronic device projects outwards, thus forming the front 3052 of the projecting structure. The projecting structure 305 extends from the outer edge frame 300 of the electronic device.Since the protruding structure extends from the outer edge frame of the electronic device, it can serve the function of indicating to the user the place where the finger should be pressed, so that the user can haptically find the position for fingerprint capture.

[0074] Design and position of the protruding structure 305: Part of the outer edge frame of the electronic device is designed in a protruding form. This protruding structure is not only part of the outer edge frame, but is also specifically designed to accommodate the ultrasonic sensor 301.

[0075] Design and Function of the Recess 306: A recess 306 is provided on the rear side 3051 of the projecting structure 305 (i.e., on the side facing the interior of the electronic device). The recess 306 is specifically designed for mounting the ultrasonic sensor 301, and its shape and size are suitable for this purpose. Specifically, the base area of ​​the recess 306 is larger than the area of ​​the ultrasonic sensor 301. The depth of the recess 306 can be equal to the thickness of the ultrasonic sensor to fully accommodate it; alternatively, the depth of the recess 306 can be less than the thickness of the ultrasonic sensor to accommodate a portion of it. Because the recess has a relatively shallow depth, the projecting structure 305 retains a certain thickness, resulting in a comparatively high strength of the outer edge frame.In some embodiments, the depth of the recess 306 can be greater than the thickness of the ultrasonic sensor, so that the ultrasonic sensor can be arranged completely inside the recess and there is also space in the recess to accommodate other associated components.

[0076] Mounting the ultrasonic sensor: As shown in Fig. As shown in Figure 6, the ultrasonic sensor can comprise an adhesive layer 304, wherein the acoustic layer or the silicon wafer layer can be attached to the recess 306 by means of the adhesive layer 304, the adhesive layer 304 being a glue or other sticky material. A front-mounting or a back-mounting approach can be used to bond the ultrasonic sensor to the recess. In this solution, the adhesive layer is not limited to adhesives such as copper foil adhesive, double-sided adhesive tape, or thermosetting adhesive. Since the copper foil adhesive can provide better acoustic impedance matching, the copper foil adhesive is preferably used as the adhesive layer, wherein the copper foil adhesive comprises a copper foil layer and adhesive layers arranged on the upper and lower surfaces of the copper foil layer. At least a portion (optionally)The majority or all of the ultrasonic sensor 301 is arranged in the recess 306. This allows the ultrasonic sensor to be better secured, while also potentially providing some protection for the ultrasonic sensor.

[0077] The aforementioned structure protects the ultrasonic sensor, effectively utilizing the device's space and improving its reception and transmission capabilities. The presence of the 306 recess shortens the ultrasound propagation path, thereby enhancing the fingerprint recognition performance of the entire electronic device.

[0078] Based on the content of the above-mentioned embodiments, this embodiment, as in Fig. As shown in Figure 6, the front surface 3052 of the protruding structure 305 provides a contact surface for the user's finger, enabling the ultrasonic sensor 301 to capture the user's fingerprint. To increase the device's water resistance rating and to prevent water vapor from entering the ultrasonic sensor 301 and thus impairing fingerprint recognition, there is no air gap between the protruding structure 305 and the outer edge frame 300.

[0079] In this embodiment, the circuit board 302 can be attached to the outer edge frame 300 to facilitate the fastening of the circuit board 302. Fig. 6 the approach of front-side application is used; i.e. the acoustic layer 3012 is applied by means of the adhesive layer 304 in the recess 306 formed by the protruding structure 305, wherein the acoustic layer 3012 is arranged between the silicon wafer layer 3011 and the protruding structure 305.

[0080] Based on the content of the above-mentioned embodiments, this embodiment also presents a schematic view of an outer edge frame of an electronic device, as shown in Fig. 7 shown, ready. In Fig. 7. The approach of front-mounting is also used. In this embodiment, the Fig. 6 and Fig. 7. The approach of front-mounting is merely given as an example. It must be stated that the Fig. 6 and Fig. 7 are also suitable for the back-mounting approach. In the back-mounting approach, a silicon wafer layer is attached by means of an adhesive layer in the recess 306 formed by the protruding structure 305, wherein the silicon wafer layer 3011 is arranged between the acoustic layer 3012 and the protruding structure 305. The back-mounting approach will not be discussed in more detail here.

[0081] In this solution, the ultrasonic fingerprint recognition device, as described in Fig. Figure 7 shows a reinforcing element 308, which is used to attach the ultrasonic sensor 301. The ultrasonic sensor 301 is attached to the reinforcing element 308 by means of the mounting layer 309, which can consist of an adhesive or a foam adhesive. In this embodiment, the foam adhesive provides a protective effect. When attaching the acoustic layer to the reinforcing element from the rear, the foam adhesive is used to attach the acoustic layer to the reinforcing element, providing some protection for the acoustic layer. In this embodiment, one end of the circuit board 302 can also be attached to the reinforcing element 308 by means of the mounting layer 309, which can be a steel plate.

[0082] As in Fig. As shown in Figure 7, the outer edge frame 300 of the electronic device projects outwards to form a protruding structure 305, wherein mobile phone edge frames 3000 and 3001 are short edge frames of the mobile phone and the outer edge frame 300 of the mobile phone is the long outer edge frame of the mobile phone. A recess for receiving the ultrasonic sensor 301 is formed inside the protruding structure 305. In this embodiment, the ultrasonic fingerprint recognition device further comprises a first fastening component 307, wherein the first fastening component 307 is attached to the rear of the outer edge frame 300 to secure the printed circuit board 302 to the outer edge frame 300. Furthermore, the first fastening component 307 may have a certain height, and the first fastening component is used to support the printed circuit board to facilitate the electrical connection between the printed circuit board and the silicon wafer layer.As in . Fig. As shown in Figure 7, one end of the silicon wafer layer 3011 is connected to the printed circuit board 302 by means of a bond wire 310, the first fastening component 307 being used to support the printed circuit board 302, so that a second electrical connection area 3061 of the printed circuit board 302 and a first electrical connection area 3062 of the silicon wafer layer 3011 are at the same level to facilitate the connection of the two by means of the bond wire 310 and their simultaneous fastening to the reinforcing element 308. Fig. 7. A first electrical connection area 3062 is provided at one end of the silicon wafer layer 3011, and a second electrical connection area 3061 is provided at one end of the printed circuit board 302, with the bond wire 310 being used to connect the first and second electrical connection areas. If the depth of the recess is insufficient to accommodate the entire acoustic layer 3012, the introduction of the first fastening component 307 is more advantageous when using a front-mounted approach in order to keep the electrical connection areas of the printed circuit board 302 and the silicon wafer layer 3011 at the same level, which facilitates the connection of the two by means of the bond wire.

[0083] Based on the content of the above-mentioned embodiments, in this embodiment, as in Fig. Figure 7 shows that the height h1 of the protruding structure 305 is not less than 0.5 mm and not more than 3 mm. Setting the height of the protruding structure to between 0.5 mm and 3 mm prevents it from being too thin and thus failing to fulfill its protective function for the ultrasonic fingerprint recognition device, and also prevents it from being too thick and thus impairing the strength of the received ultrasonic signals. In this embodiment, if the height of the protruding structure is equal to the height of the volume button or the on / off button of the electronic device, the electronic device has good visual consistency, which facilitates its use by the user.In this embodiment, the protruding structure can be a cuboid-shaped protruding structure, wherein the long side of the protruding structure is parallel to the long side of the electronic device's display screen, and the short side of the protruding structure is parallel to the short side of the electronic device's display screen, thus allowing the ultrasonic sensor's detection range to be long enough to capture more fingerprint data. The long side of the protruding structure is shown in the figures. Fig. 6, Fig. 7, Fig. 12 and Fig. 13 to recognize, and the short side of the protruding structure is in the Fig. 8, Fig. 9, Fig. 10 to Fig. 11 to recognize.

[0084] Based on the content of the above-mentioned embodiments, this embodiment provides that, as in Fig. Figure 6 shows that the outer rim frame 300 and the protruding structure 305 are made of the same material, the outer rim frame being made of plastic or metal, and the protruding structure 305 being formed integrally with the outer rim frame 300. This integral forming of the protruding structure with the outer rim frame allows for the elimination of process steps and simplifies machining, prevents the ingress of water vapor into the ultrasonic sensor, which could impair fingerprint recognition, and improves the water resistance rating of the electronic device.

[0085] Based on the content of the above-mentioned embodiments, in this embodiment, as in Fig. As shown in Figure 6, the outer rim frame 300 and the protruding structure 305 can be made of different materials. If the outer rim frame is made of plastic, the protruding structure is made of metal; or if the protruding structure is made of plastic, the outer rim frame is made of metal. Because the protruding structure 305 and the outer rim frame 300 are made of different materials, the user can easily see the position of the protruding structure with the naked eye, thus indicating to the user where to press their finger. In this embodiment, the outer rim frame can be made of plastic, metal, glass, ceramic, etc., and its surface can be treated by vacuum coating, vacuum matting, oil spraying, polishing, etc.

[0086] Based on the content of the above-mentioned embodiments, this embodiment also presents a schematic view of an outer edge frame of an electronic device, as shown in Fig. 8 shown, ready. Fig. Figure 8 shows a schematic sectional view from the display screen of the electronic device to the base of the electronic device, in which the stack structure of the ultrasonic sensor 501 is clearly visible in the cross-section.

[0087] As in Fig. As shown in Figure 8, the ultrasonic fingerprint recognition device comprises an ultrasonic sensor 501 and a printed circuit board (not shown), wherein the ultrasonic sensor 501 includes an adhesive layer 504, the acoustic layer 5012 being attached inside the projecting structure 505 by means of the adhesive layer 504, and in particular, the ultrasonic sensor 501 being attached in a recess 506 formed on the rear side 5051 of the projecting structure 505. Fig. In Figure 8, an outer edge frame 500 of an electronic device is arranged perpendicular to an upper surface of a display screen 5000 and to a rear side 5001 of the electronic device, wherein the height of a portion of the outer edge frame located near the display screen 5000 is less than the height of the front side of the projecting structure 505. In particular, a central frame section 5003 located near the display screen 5000 is less than the height of the front side 5052 of the projecting structure, wherein the central frame section 5003 located near the display screen 5000 and the front side 5052 of the projecting structure form a first step structure, i.e., the projecting structure is vertical on a side located near the display screen of the electronic device and on a side located near the rear side of the electronic device. The height of the first step structure is h2. In this embodiment, h2 can be equal to h1.In . Fig. 8. The height of the midframe section located near the display screen 5000 and the height of a midframe section located near the rear 5001 of the electronic device are less than the height of the front 5052 of the protruding structure. In particular, the midframe section of the electronic device located near the rear 5001 and the front 5052 of the protruding structure form a further stepped structure, wherein the protruding structure 505 is vertical on a side 5053 located near the display screen of the electronic device and on a side 5054 located near the rear of the electronic device.

[0088] Based on the content of the above-mentioned embodiments, in this embodiment, as in Fig. Figure 8 shows that the protruding structure 505 is raised by a certain height relative to the outer edge frame 500, which is located near the display screen, and that the upper part of the front surface 5052 of the protruding structure 505 is a flat surface. The fact that the upper part of the front surface 5052 of the protruding structure 505 is a flat surface contributes better to the capture of fingerprint recognition signals.

[0089] Based on the content of the above-mentioned embodiments, this embodiment differs from the embodiment of the Fig. 8 by the fact that the protruding structure forms a first chamfer on a side near the display screen of the electronic device and on a side near the rear of the electronic device. As in Fig. As shown in Figure 9, the protruding structure 505 forms a first chamfer 5041 on the side near the display screen 5000 of the electronic device; simultaneously, the protruding structure 505 forms a first chamfer 5042 on the side near the rear 5001 of the electronic device. In this solution, the design of the first chamfers facilitates gripping the electronic device and is better suited for electronic devices whose outer edge frames are chamfered.

[0090] Based on the content of the aforementioned embodiments, this embodiment provides that the upper part of the front face of the protruding structure can be a curved surface, wherein the curvature of the curved surface is less than the curvature of the first chamfer, and the curvature of the curved surface can be equal to the curvature of the outer edge frame of the electronic device. As in Fig. As shown in Figure 10, the upper part of the front surface 5052 of the protruding structure 505 can be a curved surface, the curvature of which is less than the curvature of the first chamfer 5041, which is more advantageous for capturing fingerprint recognition signals. Furthermore, if the curvature of the curved surface is equal to the curvature of the outer edge frame of the electronic device, the electronic device will have better visual consistency and be more comfortable to grip. Having the upper part of the front surface 5052 of the protruding structure 505 as a curved surface is more suitable for mobile phone models with curved side edges.In this embodiment, if the upper part of the front surface 5052 of the protruding structure is a curved surface, the protruding structure forms a first chamfer 5041 on the side closest to the display screen 5000 of the electronic device, and simultaneously, the protruding structure forms a first chamfer 5042 on the side closest to the rear surface 5001 of the electronic device. In this embodiment, the curvature of the curved surface on the upper part of the front surface 5052 of the protruding structure 505 is less than the curvature of the first chamfer 5041, with the curvatures of the first chamfers 5041 and 5042 being identical. The greater the curvature, the greater the degree of curvature of a curve.The curved surface on the upper part of the front of the protruding structure has a lower degree of curvature, which facilitates the capture of fingerprint information and improves the consistency of the propagation path of the ultrasonic sensor.

[0091] Based on the content of the aforementioned embodiments, this embodiment provides that a screen print, consisting of a fingerprint pattern, is provided on the upper part of the front of the protruding structure. The design of the screen print makes it easier for the user to quickly locate the fingerprint capture area, further improving the user experience.

[0092] Based on the content of the above-mentioned embodiments, this embodiment comprises, as in Fig. Figure 8 shows the ultrasonic sensor having a copper foil adhesive 504, wherein the copper foil adhesive 504 is attached inside the recess 506 formed on the rear side 5051 of the projecting structure 505, wherein a recess 506 for receiving the ultrasonic sensor 501 is formed on the rear side 5051 of the projecting structure 505. Since a recess 506 for receiving the ultrasonic sensor is provided inside the projecting structure, space can be saved and the device utilization improved.

[0093] Based on the content of the above-mentioned embodiments, this embodiment comprises, as in Fig. Figure 8 shows the ultrasonic sensor 501 comprising an acoustic layer 5012 and a silicon wafer layer 5011, wherein the silicon wafer layer 5011 is connected to the acoustic layer 5012, and one end of the silicon wafer layer is connected to the circuit board by means of a bond wire.

[0094] The ultrasonic sensor is attached to the recess formed on the back of the protruding structure using the following two setups: Front-side mounting approach: As in Fig. As shown in Figure 8, the acoustic layer 5012 is attached by means of the adhesive layer 504 in the recess 506 formed on the back 5051 of the protruding structure 505, wherein the acoustic layer 5012 is arranged between the protruding structure 505 and the silicon wafer layer 5011.

[0095] Approach to rear mounting: As in Fig. As shown in Figure 11, the ultrasonic sensor 501 is mounted in the recess 506 formed on the rear side 5051 of the projecting structure 505. The silicon wafer layer 5011 is mounted in the recess 506 formed on the rear side of the projecting structure 505 by means of the adhesive layer 504, and the silicon wafer layer 5011 is electrically connected to the circuit board by means of the bond wire. The silicon wafer layer 5011 is positioned between the projecting structure 505 and the acoustic layer 5012. In this embodiment, the distance between the acoustic layer and an object to be detected is smaller when using the front-side mounting method than when using the rear-side mounting method. Thus, the strength of an ultrasonic fingerprint signal detected by the electronic device for which the front-side mounting method is used is higher.

[0096] In Fig. Figure 6 shows the projecting structure 305 on two sides 3055 and 3056 along the outer edge frame 300 vertically. Based on the content of the above-mentioned embodiments, this embodiment also provides a schematic view of another outer edge frame of an electronic device. Fig. Figure 12 shows a cross-sectional view from one outer edge frame to another outer edge frame of the electronic device. Unlike in Fig. 6 and Fig. 7 forms a prominent structure in Fig. 12 along the outer edge frame, second chamfers 3053 and 3054. This rounded design of the edge of the protruding structure facilitates touching by the user and at the same time the wiping of stains. In Fig. 12 is the upper part of the front 3052 of the protruding structure a flat surface.

[0097] Based on the content of the above-mentioned embodiments, this embodiment also provides a schematic view of another outer edge frame of an electronic device. Fig. Figure 13 shows a cross-sectional view from one outer edge frame to another outer edge frame of the electronic device. Unlike in Fig. 12 the upper part of the front 3052 of the protruding structure in Fig. 13. The curved surface is a curved surface, the curvature of which is less than the curvature of the second chamfer 3053. The greater the curvature, the greater the degree of curvature of a curve. The curved surface on the upper part of the front of the protruding structure has a lower degree of curvature, which facilitates the capture of fingerprint information, improves the consistency of the ultrasonic sensor's propagation path, and favors the capture of fingerprint recognition signals. Furthermore, if the curvature of the curved surface is equal to the curvature of the outer edge frame of the electronic device, the electronic device will have better visual consistency. If the upper part of the front 3052 of the protruding structure 305 is a curved surface, this is more suitable for mobile phone models whose side edge is curved.

[0098] Based on the content of the above-mentioned embodiments, this embodiment further provides an electronic fingerprint recognition device, for example, a [device / system] in [material]. Fig. 8, Fig. 9, Fig. 10 to Fig. 11 Electronic device shown, comprising the ultrasonic fingerprint recognition device and the outer rim frame in the embodiments described above.

[0099] One embodiment of the present application further provides an ultrasonic fingerprint recognition device. Fig. Figure 14 shows a schematic sectional view of the ultrasonic fingerprint recognition device according to the embodiment of the present application. The ultrasonic fingerprint recognition device 700 comprises an ultrasonic sensor 701 and a printed circuit board 702, wherein the printed circuit board 702 is electrically connected to a processing unit of the electronic device, wherein the ultrasonic sensor 701 is used for emitting ultrasonic signals and for receiving ultrasonic signals that are reflected and then penetrate the outer edge frame of the electronic device, and furthermore for converting the received ultrasonic signals into electrical signals and for transmitting the electrical signals via the printed circuit board 702 to the processing unit. In this embodiment, the ultrasonic sensor 701 and the printed circuit board 702 are electrically connected to each other by means of a bond wire 703.

[0100] Compared to the ultrasonic sensor, which is in Fig. As shown in Figure 14, in this embodiment, the use of bond wires to connect the circuit board to the ultrasonic sensor can also be omitted. As shown in Fig. As shown in Figure 15, the ultrasonic fingerprint recognition device 700 comprises an ultrasonic sensor 701 and a printed circuit board 702, wherein a bond pad area 72 of the ultrasonic sensor 701 is electrically connected to the flexible printed circuit board 702, the flexible printed circuit board 702 being used for connection to an external circuit. In this embodiment, the electrical connection area of ​​the flexible printed circuit board 702 also includes a bond pad. The bond pad area 72 of the ultrasonic sensor 701 and the electrical connection area of ​​the flexible printed circuit board 702 can be electrically connected by means of a conductive adhesive 7031. Optionally, the bond pad area 72 of the ultrasonic sensor 701 and the electrical connection area of ​​the flexible printed circuit board 702 can be electrically connected to each other by means of an ACF adhesive (En: Anisotropic Conductive Film) 7031 using an ACF lamination process.The ultrasonic sensor 701 and the flexible printed circuit board 702 are bonded using the ACF adhesive 7031 to establish an electrical connection. Simultaneously, the ACF adhesive 7031 itself exhibits adhesive properties that enable the ultrasonic sensor 701 to be bonded to the flexible printed circuit board 702, a solution in which the [unclear text] is [unclear text]. Fig. The bond wire shown in Figure 14 is easier to process and has good structural stability, whereas a solution using ACF adhesive does not have to address the problem of fixing the bond wires.

[0101] In the above-mentioned embodiment, the circuit board is electrically connected to the processing unit in the electronic device, wherein the circuit board comprises a flexible circuit board, wherein the circuit board is used to transmit electrical signals to the processing unit of the electronic device, wherein the processing unit performs fingerprint recognition and anti-counterfeiting detection depending on the electrical signals.

[0102] Fig. Figure 16 shows a schematic sectional view of an outer edge frame of an electronic device according to an embodiment of the present application. The electronic device has four outer edge frames, consisting of two relatively long outer edge frames and two relatively short outer edge frames. The outer edge frame 410 of the electronic device is recessed into the interior of the electronic device to form a first recess structure 315. Mobile phone edge frames 3100 and 3101 represent short outer edge frames of the mobile phone. The outer edge frame 410 of the mobile phone is one of the long outer edge frames of the mobile phone, and the other long outer edge frame, which is opposite the long outer edge frame 410, is not shown. As in Fig. As shown in Figure 16, a front face 3152 of the first recess structure 315 is formed by recessing the outer edge frame 410 of the electronic device. As shown in Fig. As shown in Figure 17, the ultrasonic sensor 311 is attached to the rear side 3151 of the first recess structure 315. The ultrasonic fingerprint recognition device comprises an ultrasonic sensor 311 and a printed circuit board 312, wherein the ultrasonic sensor 311 includes an adhesive layer 314, and the ultrasonic sensor 311 is attached to the rear side 3151 of the first recess structure 315 above its adhesive layer 314. Since the first recess structure 315 is formed by the recess of the outer edge frame of the electronic device, it can serve to indicate to the user the location where the finger should be pressed, allowing the user to locate the fingerprint capture position by touch. In this embodiment, the first recess structure 315 can be a square recess.

[0103] The in Fig. The ultrasonic sensor shown in Figure 17 is mounted on the central frame by means of a rear-mounting approach, wherein the silicon wafer layer 3111 is attached to the rear side 3151 of the first recess structure 315 by means of the adhesive layer 314, and wherein the silicon wafer layer 3111 is electrically connected to the printed circuit board 312 by means of the bond wire 313. In this embodiment, a first mounting section 319 can also be used to attach the printed circuit board 312 to the outer edge frame 410. The first mounting section 319 is attached to the rear side of the outer edge frame 410 to secure the printed circuit board 312. The front side 3152 of the first recess structure 315 is used to provide a contact surface.

[0104] It should be noted that the ultrasonic sensor can also be mounted on the back of the first recess structure 315 by inserting the [unclear text]. Fig. The approach of front-side attachment shown in Figure 18 is used, in which the acoustic layer 3112 is attached to the back 3151 of the first recess structure 315 by means of the adhesive layer 314, and the acoustic layer 3112 is arranged between the silicon wafer layer 3111 and the first recess structure 315. As shown in Figure 18, the acoustic layer 3112 is positioned between the silicon wafer layer 3111 and the first recess structure 315. Fig. 16, Fig. 17 to Fig. As shown in Figure 18, the rear face 3151 of the first recess structure 315 is flat, while the front face 3152 of the first recess structure 315 is formed by the outer edge frame 410 being recessed on the long side of the electronic device. Since the rear face 3151 of the first recess structure 315 is flat and does not require a recess to accommodate an ultrasonic sensor, the outer edge frame can retain a certain thickness, thereby increasing its strength. Because the rear face of the first recess structure is flat, the ultrasonic sensor can be attached to the rear face of the first recess structure by either a front-mounting or a rear-mounting approach.

[0105] Front-side mounting approach: As in Fig. As shown in Figure 8, the acoustic layer 3112 is attached to the rear side of the first recess structure 315 by means of the adhesive layer 314. The ultrasonic fingerprint recognition device further comprises a first mounting section 319, the first mounting section 319 being attached to the rear side of the outer edge frame 410 to secure the printed circuit board 312, the front side 3152 of the first recess structure 315 being used to provide a contact surface. In this embodiment, the acoustic layer 3112 is arranged between the silicon wafer layer 3111 and the first recess structure 315. The first mounting section 319 also has a certain height so that the printed circuit board 312 and the silicon wafer layer 3111 are at the same height. The first mounting section 319 is used to support the printed circuit board 312, so that the printed circuit board 312 is electrically connected to the silicon wafer layer 3111.One end of the silicon wafer layer is connected to the printed circuit board by means of a bond wire. The first mounting section is used to support the printed circuit board so that an electrical connection area of ​​the printed circuit board and an electrical connection area of ​​the silicon wafer layer are at the same level to facilitate the connection by means of the bond wire 313.

[0106] In this embodiment, the ultrasonic sensor can be attached to the back of the first recess structure using either a front-mounting or a rear-mounting approach, by means of an adhesive layer (e.g., copper foil adhesive, double-sided adhesive tape, or thermosetting adhesive). That is, in this solution, the adhesive layer 314 can be a copper foil adhesive, a double-sided adhesive tape, a thermosetting adhesive, etc. Since the copper foil adhesive can provide better acoustic impedance matching, it is preferably used as the adhesive layer, comprising a copper foil layer and adhesive layers arranged on the upper and lower surfaces of the copper foil layer.

[0107] In this embodiment, the distance between the acoustic layer and the finger is smaller when applying the device from the front than when applying it from the back. Therefore, the fingerprint data captured when applying the device from the front is more accurate.

[0108] Based on the content of the above-mentioned exemplary embodiments, it shows Fig. Figure 19 shows a schematic sectional view of another outer edge frame of an electronic device according to an embodiment of the present application. A second recess structure 317 is formed on the rear side 3151 of the first recess structure 315, which is used to accommodate at least a part of the ultrasonic sensor 311. At least a part of the ultrasonic sensor 311 is arranged within the second recess structure 317; this contributes, on the one hand, to better space utilization and, on the other hand, reduces the distance between the ultrasonic sensor and the pressure surface, thereby enabling more accurate fingerprint recognition.

[0109] In this embodiment, the depth h4 of the second recess structure 317 can be less than or equal to the thickness of the ultrasonic sensor. The second recess structure 317 is specifically designed for mounting the ultrasonic sensor 311, and its shape and size are suitable for accommodating the ultrasonic sensor. The depth of the second recess structure 317 can be equal to the thickness of the ultrasonic sensor to snugly accommodate it; alternatively, the depth of the second recess structure 317 can be less than the thickness of the ultrasonic sensor to accommodate a portion of it. Because the second recess structure 317 has a relatively shallow depth and the edge frame has a certain thickness, the edge frame does not become too thin due to the presence of the first and second recess structures.In some embodiments, the depth of the second recess structure 317 can be greater than the thickness of the ultrasonic sensor, so that the ultrasonic sensor can be arranged completely within the second recess structure and there is also space in the second recess structure to accommodate other associated components.

[0110] Furthermore, the depth h3 of the first recess structure is greater than the depth h4 of the second recess structure, making it easier for the user to locate the fingerprint recognition position by touch. Additionally, the strength of the outer edge frame is not compromised by an excessive depth of the second recess structure. The common part 318 of the first recess structure 315 and the second recess structure 317 forms part of the edge frame and has a certain thickness to protect the ultrasonic sensor.

[0111] In this embodiment, a base area of ​​the second recess structure 317 is larger than or equal to an area of ​​the ultrasonic sensor, so that the ultrasonic sensor can be attached to the base surface of the second recess structure.

[0112] The attachment of the ultrasonic sensor 311 to the rear 3151 of the first recess structure 315 is achieved by the following two assemblies: Front-side mounting approach: As in Fig. As shown in Figure 20, the acoustic layer 3112 is attached to the back side 3151 of the first recess structure 315 by means of the adhesive layer 314, i.e., the acoustic layer 3112 is attached to the front side 3172 of the second recess structure 317 by means of the adhesive layer 314, wherein one end of the silicon wafer layer 3111 is electrically connected to the circuit board 312 by means of a bond wire 313, and wherein the acoustic layer 3112 is arranged between the silicon wafer layer 3111 and the first recess structure 315. In this embodiment, the front side 3172 of the second recess structure 317 is the back side 3151 of the first recess structure 315.

[0113] Approach to rear mounting: As in Fig. As shown in Figure 21, the silicon wafer layer 3111 is attached to the back side 3151 of the first recess structure 315 by means of the adhesive layer 314, wherein one end of the silicon wafer layer 3111 is electrically connected to the circuit board 312 by means of a bond wire 313, and wherein the silicon wafer layer 3111 is arranged between the acoustic layer 3112 and the first recess structure 315.

[0114] In this embodiment, the distance between the acoustic layer and the finger is smaller when using the front-facing mounting method than when using the rear-facing method. Therefore, the fingerprint data captured when using the front-facing method is more accurate. Furthermore, since the second recess structure is used to accommodate an ultrasonic fingerprint sensor, the distance between the ultrasonic fingerprint sensor and a fingerprint capture area is reduced, which significantly improves the accuracy of the fingerprint capture.

[0115] Based on the content of the aforementioned embodiments, in this embodiment the front face 3152 of the first recess structure 315 provides a contact surface for a user's finger. To increase the water resistance rating of the electronic device, there is no air gap between the first recess structure and the outer edge frame.

[0116] To prevent water vapor from penetrating the ultrasonic sensor and thus impairing fingerprint recognition, and simultaneously to save process steps and simplify machining, the first recess structure is formed by a single-piece molding process, by recessing the outer edge frame of the electronic device. For easier machining, the first recess structure and the outer edge frame are made of the same material, with the outer edge frame being made of either plastic or metal.

[0117] Based on the content of the aforementioned embodiments, this embodiment allows the outer rim frame and the first recess structure to be made of different materials. If the outer rim frame is made of plastic, the first recess structure is made of metal; or vice versa. Because the first recess structure and the outer rim frame are made of different materials, the user can easily identify the position of the first recess structure with the naked eye, thus indicating the point where the finger should be pressed. In this embodiment, the outer rim frame can be made of plastic, metal, glass, ceramic, etc., with the surface of the outer rim frame being finished by vacuum coating, vacuum matting, oil spraying, polishing, etc.can be treated.

[0118] Based on the content of the above-mentioned embodiments, this embodiment provides that, as in Fig. 16 and Fig. Figure 19 shows that the depth h3 of the first recess structure is no less than 0.5 mm and no more than 2 mm. Setting the depth of the first recess structure to between 0.5 mm and 2 mm not only prevents the first recess structure from being too deep, which would reduce the strength of the outer edge frame, but also prevents the first recess structure from being too shallow, which would make it difficult for the user to perceive the fingerprint capture position.

[0119] Based on the content of the above-mentioned embodiments, this embodiment provides that, as in Fig. Figure 17 shows that the front face 3152 of the first recess structure 315 is flat and is perpendicular to the display screen of the electronic device. The first recess structure has two opposing side faces, which are two opposing side faces along the outer edge frame. The two side faces 3155 and 3156 can be vertical side faces. That is, the two side faces 3155 and 3156 are perpendicular to the front face 3152 of the first recess structure. And the first recess structure 315 is a cubic recess.

[0120] Based on the content of the above-mentioned embodiments, this embodiment shows Fig. 22 A schematic sectional view of another outer edge frame of an electronic device to which a fingerprint recognition device is mounted. As in Fig. As shown in Figure 22, the first recess structure forms a chamfered structure along the outer edge frame of the electronic device. That is, the two opposing side surfaces 3153 and 3154 of the first recess structure form a chamfered structure; that is, the two opposing side surfaces 3153 and 3154 of the first recess structure along the outer edge frame form a chamfered structure. If the front surface 3152 of the first recess structure 315 is a flat surface, the capture of fingerprint recognition signals is facilitated. If the two opposing side surfaces 3153 and 3154 of the first recess structure 315 along the outer edge frame form a chamfered structure, stains on the chamfers are easier to clean.

[0121] The ultrasonic fingerprint recognition device further comprises a reinforcement element, wherein the reinforcement element is used to attach the ultrasonic sensor, wherein the acoustic layer or the silicon wafer layer is attached to the reinforcement element by means of the mounting layer, wherein the reinforcement element may be a steel plate.

[0122] Based on the content of the above-mentioned embodiments, this embodiment provides that a screen print is provided on the front of the first recess structure, wherein the screen print is a fingerprint pattern, so that the user can quickly locate the fingerprint capture area, thereby further improving the user experience.

[0123] Based on the content of the aforementioned embodiments, this embodiment provides that the first recess structure can also be a physical button, with the front face of the first recess structure being used to provide a pressing surface for the physical button. As in Fig. As shown in Figure 17, a key module can be positioned below the fingerprint sensor to implement the function of a physical keypad. As shown in Fig. As shown in Figure 20, the ultrasonic sensor can be completely enclosed within the second recess structure, where the depth of the second recess structure is greater than the thickness of the ultrasonic sensor. A button module can also be arranged beneath the ultrasonic sensor. This button module can also be enclosed within the second recess structure, meaning that the depth of the second recess structure is greater than or equal to the thickness of both the ultrasonic sensor and the button module.

[0124] The foregoing presents only preferred embodiments of the present application, which are not intended to restrict the present application. Various modifications and amendments to the present application are possible for a person skilled in the art. Any modifications, equivalent replacements, improvements, etc., made within the spirit and principles of the present application should fall within the scope of protection of the present application.

[0125] It is understood that in the embodiments of the present application, the expression "B corresponding to A" means that B is related to A and that B can be determined according to A. However, it is also understood that "determining B according to A" does not mean that B is determined only according to A, but that B can also be determined according to A and / or other information.

[0126] Furthermore, the term "and / or" here represents only an associative relationship describing related objects, and its use indicates that three relationships are possible. For example, the expression "A and / or B" can be understood as encompassing three possibilities: the presence of A alone, the simultaneous presence of A and B, and the presence of B alone. Additionally, the " / " symbol generally indicates that the related objects before and after it are in an "or" relationship.

[0127] The person skilled in the art will be aware that the units and algorithm steps of the individual examples described in connection with the embodiments disclosed herein can be implemented by electronic hardware or by a combination of computer software and electronic hardware. Whether these functions are performed by hardware or software depends on the specific applications and design constraints of the technical solutions. The person skilled in the art may employ different methods to implement the described functions for each specific application. However, such implementation should not be considered to extend beyond the scope of the present application.

[0128] The person skilled in the art can clearly understand that, for the sake of simplification and ease of description regarding the specific work processes of the systems, devices and units described above, reference can be made to the corresponding processes in the method examples described above, which is not repeated here.

[0129] In the various embodiments provided by the present application, it is understood that the disclosed method, device, and procedure can be implemented in other ways. For example, the device embodiments described above serve only for illustration. For instance, the division of units represents only a logical division of functions, whereas other types of division may be used in the actual implementation, such as combining several units or components with one another or integrating them into a further system, or omitting certain features. Furthermore, the indicated or discussed mutual couplings may be indirect coupling or communication links via some interfaces, devices, or units, and may be electrical, mechanical, or take other forms.

[0130] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of these units can be selected according to actual needs to achieve the purpose of the embodiments described in these exemplary embodiments.

[0131] Furthermore, all functional units in the individual embodiments of the present application can be integrated into a processing unit, or each unit can exist physically on its own, or two or more units can be integrated into one unit.

[0132] If the function is implemented in the form of a software functional unit and is sold or used as an independent product, it may be stored on a computer-readable storage medium. Based on such an understanding, the essential part of the technical solution of the present application, or a part thereof, may be implemented in the form of a software product stored on a storage medium and containing instructions that cause a computer device—which may be a personal computer, a server, or a network device, etc.—to perform all or some of the steps of the method in various embodiments of the present application.The storage media mentioned above include various media on which program code can be stored, such as a USB stick, a portable hard drive, a read-only memory (ROM), a random access memory, a magnetic disk, and an optical disk.

[0133] The foregoing merely indicates specific embodiments of the present application, to which the scope of protection of the present application is not limited. Any person skilled in the art familiar with this field can easily imagine, within the technical scope disclosed in the present application, modifications or replacements that should fall within the scope of protection of the present application.

[0134] Therefore, the scope of protection of the present application is subject to the scope of protection of the claims.

Claims

[1] Ultrasonic fingerprint recognition device mounted in an electronic device, characterized by , that the ultrasonic fingerprint recognition device comprises an ultrasonic sensor and a circuit board; wherein the circuit board is electrically connected to a processing unit of the electronic device; wherein the ultrasonic sensor is used to emit ultrasonic signals and to receive ultrasonic signals which are reflected and then pass through an outer edge frame of the electronic device, and is further used to convert the received ultrasonic signals into electrical signals and to send the electrical signals via the circuit board to the processing unit; wherein the ultrasonic sensor is mounted in a recess formed on the back side of a protruding structure; wherein at least part of the ultrasonic sensor is arranged within the recess, wherein the outer edge frame of the electronic device protrudes to form a front face of the protruding structure; the protruding structure is designed as part of the outer edge frame of the electronic device. [2] Ultrasonic fingerprint recognition device according to claim 1, characterized by , that a depth of the recess is equal to or less than a thickness of the ultrasonic sensor; wherein a base area of ​​the recess is larger than an area of ​​the ultrasonic sensor; wherein a long side of the protruding structure is parallel to a long side of a display screen of the electronic device, and a short side of the protruding structure is parallel to a short side of the display screen of the electronic device. [3] Ultrasonic fingerprint recognition device according to claim 1 or 2, characterized by, that the height of the protruding structure is not less than 0.5 mm and not more than 3 mm; wherein the height of the protruding structure is equal to the height of a volume button or an on / off button of the electronic device; the protruding structure is a cuboid-shaped protruding structure. [4] Ultrasonic fingerprint recognition device according to claim 1 or 2, characterized by , that the ultrasonic sensor comprises an acoustic layer and a silicon wafer layer, wherein the silicon wafer layer is bonded to the acoustic layer; comprising the placement of the ultrasonic sensor in the recess formed on the back of the protruding structure: Applying the acoustic layer in the recess, wherein the acoustic layer is positioned between the protruding structure and the silicon wafer layer; or The silicon wafer layer is placed in the recess, with the silicon wafer layer positioned between the protruding structure and the acoustic layer. [5] Ultrasonic fingerprint recognition device according to claim 4, characterized by , that the ultrasonic sensor further comprises an adhesive layer, wherein the acoustic layer or the silicon wafer layer is attached by means of the adhesive layer in the recess formed on the back of the protruding structure, wherein the adhesive layer is a copper foil adhesive; wherein the ultrasonic fingerprint recognition device further comprises a reinforcement element, wherein the reinforcement element is used to attach the ultrasonic sensor, wherein the acoustic layer or the silicon wafer layer is attached to the reinforcement element by means of the mounting layer; wherein the ultrasonic fingerprint recognition device further comprises a first mounting component, wherein the circuit board is attached to the outer edge frame by means of the first mounting component, wherein the first mounting component is used to support the circuit board so that the circuit board is electrically connected to the silicon wafer layer; wherein one end of the silicon wafer layer is connected to the printed circuit board by means of a bond wire, wherein the first fastening component is used to support the printed circuit board, such that an electrical connection area of ​​the printed circuit board and an electrical connection area of ​​the silicon wafer layer are at the same level; or where one end of the silicon wafer layer is bonded to the circuit board using an ACF adhesive. [6] Ultrasonic fingerprint recognition device according to claim 1 or 2, characterized bythat the front of the protruding structure provides a pressure surface for contact with a user's finger. [7] Ultrasonic fingerprint recognition device according to claim 1 or 2, characterized by that the outer rim frame and the protruding structure are made of the same material, wherein the outer rim frame is made of plastic or metal, wherein the protruding structure is formed integrally with the outer rim frame to which it is attached, and wherein there is no air gap between the protruding structure and the outer rim frame. [8] Ultrasonic fingerprint recognition device according to claim 1 or 2, characterized by that the outer rim frame and the protruding structure are made of different materials, with the outer rim frame being made of plastic or metal. [9] Ultrasonic fingerprint recognition device according to claim 1 or 2, characterized by, that a screen print is provided on an upper part of the front of the protruding structure, wherein the screen print is a fingerprint pattern; wherein the protruding structure is vertical or has a first chamfer on a side close to the display screen of the electronic device and on a side close to the rear of the electronic device; wherein the protruding structure is vertical on both sides along the outer edge frame or has a second chamfer; wherein the upper part of the front of the protruding structure is a flat surface; or wherein the upper part of the front of the protruding structure is a curved surface, wherein the curvature of the curved surface is less than the curvature of the first chamfer, the curvature of the curved surface is less than the curvature of the second chamfer, and the curvature of the curved surface is equal to the curvature of the outer edge frame of the electronic device. [10] Electronic fingerprint recognition device comprising the ultrasonic fingerprint recognition device according to any one of claims 1 to 9 and the outer rim frame. [11] Ultrasonic fingerprint recognition device mounted in an electronic device, characterized by , that the ultrasonic fingerprint recognition device comprises an ultrasonic sensor and a circuit board; wherein the circuit board is electrically connected to a processing unit of the electronic device; wherein the ultrasonic sensor is used to emit ultrasonic signals and to receive ultrasonic signals which are reflected and then pass through an outer edge frame of the electronic device, and is further used to convert the received ultrasonic signals into electrical signals and to send the electrical signals via the circuit board to the processing unit; wherein the ultrasonic sensor is attached to a rear side of a first recess structure, wherein a front side of the first recess structure is formed by recessing the outer edge frame of the electronic device. [12] Ultrasonic fingerprint recognition device according to claim 11, characterized by , that the ultrasonic sensor comprises an acoustic layer and a silicon wafer layer, wherein the silicon wafer layer is connected to the acoustic layer; wherein the ultrasonic sensor further comprises an adhesive layer, wherein the acoustic layer or the silicon wafer layer is attached to the back of the first recess structure by means of the adhesive layer, wherein the adhesive layer is a copper foil adhesive; wherein the front of the first recess structure provides a pressure surface for contact with a user's finger; wherein there is no air gap between the first recess structure and the outer edge frame; wherein the ultrasonic fingerprint recognition device further comprises a first mounting section, wherein the printed circuit board is attached to the outer edge frame by means of the first mounting section, wherein the first mounting section is used to support the printed circuit board so that the printed circuit board is electrically connected to the silicon wafer layer; wherein one end of the silicon wafer layer is connected to the printed circuit board by means of a bond wire, wherein the first fastening section is used to support the printed circuit board, such that an electrical connection area of ​​the printed circuit board and an electrical connection area of ​​the silicon wafer layer are at the same level; or where one end of the silicon wafer layer is bonded to the circuit board using an ACF adhesive. [13] Ultrasonic fingerprint recognition device according to claim 11 or 12, characterized by , that a second recess structure is formed on the back of the first recess structure, which is used to accommodate at least one part of the ultrasonic sensor. [14] Ultrasonic fingerprint recognition device according to claim 13, characterized by, that a depth of the second recess structure is less than or equal to a thickness of the ultrasonic sensor; wherein a base area of ​​the second recess structure is greater than or equal to an area of ​​the ultrasonic sensor. [15] Ultrasonic fingerprint recognition device according to claim 13, characterized by , that the acoustic layer is located inside the second recess structure, with the acoustic layer positioned between the silicon wafer layer and the first recess structure; or that the silicon wafer layer is placed inside the second recess structure, with the silicon wafer layer being positioned between the acoustic layer and the first recess structure. [16] Ultrasonic fingerprint recognition device according to claim 11 or 12, characterized by , that the back of the first recess structure is flat; the process of attaching the ultrasonic sensor to the rear of the first recess structure includes: Applying the acoustic layer to the back of the first recess structure, wherein the acoustic layer is positioned between the silicon wafer layer and the first recess structure; or Attaching the silicon wafer layer to the back of the first recess structure, wherein the silicon wafer layer is positioned between the acoustic layer and the first recess structure. [17] Ultrasonic fingerprint recognition device according to claim 11 or 12, characterized by , that the first recess structure and the outer edge frame are made of the same material, the outer edge frame being made of plastic or metal; wherein the first recess structure is formed by one-piece molding, by recessing the outer edge frame of the electronic device; or wherein the first recess structure is a physical button, wherein the front of the first recess structure is used to provide a contact surface for the physical button. [18] Ultrasonic fingerprint recognition device according to claim 11 or 12, characterized by , that the outer rim frame and the first recess structure are made of different materials, with the outer rim frame being made of plastic or metal; wherein the first recess structure is a physical button, wherein the front of the first recess structure is used to provide a contact surface for the physical button. [19] Ultrasonic fingerprint recognition device according to claim 11 or 12, characterized by that the depth of the first recess structure is not less than 0.5 mm and not more than 2 mm. [20] Ultrasonic fingerprint recognition device according to claim 11 or 12, characterized by, that the front of the first recess structure is a flat surface, wherein the front of the first recess structure is perpendicular to a display screen of the electronic device; wherein a screen print is provided on the front of the first recess structure, the screen print being a fingerprint pattern; wherein the first recess structure has two side surfaces, wherein the two side surfaces are two opposite side surfaces along the outer edge frame; wherein the two side surfaces of the first recess structure form a chamfered structure; or wherein the two side surfaces of the first recess structure are side surfaces that run perpendicular to the front of the first recess structure. [21] Electronic fingerprint recognition device comprising the ultrasonic fingerprint recognition device according to any one of claims 11 to 20 and the outer rim frame. [22] Electronic device, comprising: a central frame assembly (1), wherein the central frame assembly (1) is arranged in a circumferential direction of the electronic device; and an ultrasound detection module (2) for capturing fingerprint information; wherein the ultrasound detection module (2) is mounted in the midframe assembly (1). [23] Electronic device according to claim 22, characterized by , that the midframe assembly (1) includes a button (11) wherein the ultrasonic detection module (2) is arranged at the button (11). [24] Electronic device according to claim 23, characterized by , that the button (11) has a receiving chamber (111) wherein the ultrasound detection module (2) is glued to an inner wall of the receiving chamber (111). [25] Electronic device according to claim 22, characterized by, that the central frame assembly (1) comprises a main body (12) and a cover plate (13), wherein the main body (12) is arranged in the circumferential direction of the electronic device, the cover plate (13) being located outside the main body (12); wherein the ultrasonic detection module (2) is located between the main body (12) and the cover plate (13). [26] Electronic device according to claim 25, characterized by , that the ultrasound detection module (2) is glued to the midframe assembly (1). [27] Electronic device according to claim 26, characterized by , that the electronic device comprises an adhesive layer (3), wherein the adhesive layer (3) is located on a side of the ultrasonic detection module (2) facing the cover plate (13), and wherein the ultrasonic detection module (2) is adhered to the cover plate (13) by means of the adhesive layer (3). [28] Electronic device according to any one of claims 22 to 27, characterized by, that the ultrasonic detection module (2) comprises an ultrasonic fingerprint module (21) and an acoustic layer (22), wherein the acoustic layer (22) is located on a side of the ultrasonic fingerprint module (21) facing away from the interior of the electronic device. [29] Electronic device according to claim 28, characterized by , that the acoustic layer (22) comprises a first electrode, a second electrode and a piezoelectric layer, wherein the piezoelectric layer is located between the first electrode and the second electrode, wherein the first electrode is used for electrical connection with a signal transmitting circuit and the second electrode is used for electrical connection with a signal receiving circuit, and wherein the piezoelectric layer is used for transmitting and receiving ultrasonic signals. [30] Electronic device according to claim 29, characterized bythat the second electrode comprises several electrodes, each connected to an operational amplifier. [31] Electronic device according to any one of claims 22 to 27, characterized by , that the electronic device includes a pressure sensor, wherein the pressure sensor is arranged on the midframe assembly (1), and wherein the pressure sensor is electrically connected to the ultrasonic sensing module (2).

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