METHOD AND PLANT FOR FORMING A MULTI-LAYER WAFFLE INTERMEDIATE PRODUCT

Description

[0001] The invention relates to a method and a system according to the features of the independent patent claims.

[0002] Plants and, in particular, methods for forming multi-layer wafer intermediate products are known and published in various embodiments. Devices of this type are usually part of a production plant for manufacturing multi-layer wafer products, such as wafer slices or Neapolitan waffles. These wafer products comprise several layers of wafers, particularly flat wafers, with an edible filling, such as hazelnut-cocoa spread, chocolate spread, or other creams, such as fat-containing creams, sandwiched between each layer. Optionally, the products are coated with chocolate.

[0003] Conventional systems are known from US 2014 / 295043 A1 and GB 785,435 A, among others.

[0004] To manufacture such products, flat waffles are generally produced in a first step in a generic baking device. Such baking devices can also be used in combination with the present invention and are designed, for example, as so-called baking tongs machines. In these special baking devices, baking tongs that can be folded open and closed are provided along an endless conveyor, each forming a baking pan, particularly in their folded position. The baking tongs are usually continuously conveyed through the baking oven along the endless conveyor. A baking mixture is applied to an opened pair of baking tongs. The baking tongs are then folded closed, locked, and conveyed through a hot baking chamber in accordance with the state of the art. The baking mixture is conveyed through the baking chamber in the closed baking tongs, where it is baked to form a waffle.The baking tongs are then opened so that the baked product can be removed. The cycle then begins again.

[0005] The crispy, brittle consistency of the waffle results from the baking of batters or doughs with a high water content of approximately 50-70% under high pressure. The water from the batter escapes very quickly in the form of steam, leaving behind a porous, brittle structure. To enable the baking process to be carried out under high pressure, locking devices are provided. These can be used to lock the baking tongs, allowing excess pressure to build up inside. Only this excess pressure can the desired baking process be achieved. The locking devices are preferably located on the baking tongs and are activated in or after the closing area.

[0006] To produce waffle blocks or waffle slices, the waffle sheets are provided with a filling layer. To stack the individual layers, a so-called waffle sandwich is usually formed in a first step. A waffle sandwich consists of two waffle layers with a filling layer between them. Waffle sheets with a filling layer are then pressed congruently onto this waffle sandwich to add further layers and form a multi-layered intermediate baked product. The products to be formed usually have three to five waffle layers. The waffle sheets coming out of the waffle baking machine are usually approximately 40x80 cm in size. Once the waffle block, i.e. the intermediate baked product, has been formed, it can then be cut into individual slices and then packaged.

[0007] There is now a market demand for systems and processes for producing such wafer intermediates that achieve the highest possible throughput, i.e., the number of wafer intermediates produced per unit time. At the same time, however, there is also considerable price pressure on the market, making it necessary to offer such systems as cost-effectively as possible. Complex control and regulation concepts for continuous production processes require relatively expensive components, which, while enabling an increase in throughput, increase the overall costs of the system.

[0008] The object of the present invention is to provide a method and a system that allows increased throughput using inexpensive, simply constructed but nevertheless reliable components.

[0009] The object of the invention is achieved in particular by the features of the independent patent claims.

[0010] The plant according to the invention comprises in particular a new type of sandwich former which is designed to form a waffle sandwich and which enables an increase in throughput with relatively simple means.

[0011] If necessary, the system includes a new type of pressing station that enables an increase in throughput using relatively simple means.

[0012] If necessary, the system comprises several conveying devices that enable the throughput to be increased using relatively simple means.

[0013] Special processes for forming a wafer sandwich, stacking in a pressing station and / or conveying the individual parts of the intermediate wafer product can also contribute to increasing throughput by relatively simple means.

[0014] Each of these measures can bring about an improvement. However, the individual components can also achieve the inventive task independently of one another. In particular, it is a requirement of the invention to be able to perform more than 40, preferably more than 50 pressing operations per minute in the pressing station. This is achieved in particular by combining all measures. In principle, however, individual measures could also be replaced by known, conventional measures.

[0015] The invention particularly relates to a method for forming a multi-layer wafer intermediate product, comprising the following steps: Feeding a first wafer base sheet provided with an edible filling layer on a first conveyor surface into a sandwich former and positioning and stopping the first wafer base sheet in a sandwich forming area, feeding a wafer cover sheet on a second conveyor surface into the sandwich former and positioning and stopping the wafer cover sheet above the sandwich forming area, then bringing the front edge of the wafer cover sheet, seen in the removal direction, into contact with the front edge of the first waffle base sheet, in particular by lowering the front edge of the wafer cover sheet onto the front edge of the first waffle base sheet, then transporting the first waffle base sheet away in the removal direction, wherein the waffle cover sheet inclined towards the first waffle base sheet is placed congruently flat on the first waffle base sheet or the first waffle base sheet in a laying process during the removal of the first waffle base sheet.on whose filling layer is placed. .

[0016] If necessary, it is provided that the wafer cover sheet is pressed towards the first wafer base sheet during the laying process, whereby the wafer cover sheet is pressed towards the first wafer base sheet during the laying process, in particular by a targeted gas jet

[0017] If necessary, it is provided that the wafer cover sheet is moved along the second conveying surface during positioning and stopping until it rests against a stopper and is preferably supported on a front support in the region of its front edge and on a rear support in the region of its rear edge.

[0018] If necessary, it is provided that the wafer cover sheet is pulled down from the rear support by the removal of the first wafer base sheet and is placed congruently on the wafer base sheet or on its filling layer during the laying process.

[0019] If necessary, the first wafer base sheet is positioned and stopped at the sandwich forming position by a sandwich belt conveyor with a positioning drive without any stoppers.

[0020] If necessary, it is provided that several wafer base sheets are provided with a filling layer in a filling application device on the first conveying surface in front of the sandwich former.

[0021] If necessary, it is provided that the wafer base sheets are conveyed end to end through the filling application device and are thereby provided with a filling layer as a substantially continuous surface.

[0022] If necessary, it is provided that a waffle sandwich formed in the sandwich former and at least one second waffle base sheet provided with a filling layer are conveyed on the first conveyor surface to a pressing station downstream of the sandwich former, in which the waffle sandwich: in a pressing area, in particular by a press belt conveyor with a positioning drive without stoppers, is positioned and stopped, then lifted from or on a press plate until the second wafer base sheet provided with the filling layer is positioned and stopped below the lifted waffle sandwich in the pressing area, and then pressed congruently onto the second wafer base sheet or its filling layer by the press plate in a pressing process.

[0023] If appropriate, it is provided that the waffle sandwich and the second waffle base sheet provided with the filling layer, which adheres to the waffle sandwich as a result of the pressing process, together form a waffle intermediate product component.

[0024] Where appropriate, the wafer intermediate component may contain: is lifted from or on the press plate until a third wafer base sheet provided with a filling layer is positioned and stopped below the lifted wafer intermediate product component in the press area, and is then pressed congruently onto the third wafer base sheet or its filling layer by the press plate in one pressing process.

[0025] Where appropriate, it is provided that the waffle sandwich and the wafer base sheets adhering to the waffle sandwich as a result of the pressing process together form a wafer intermediate product component, and that the wafer intermediate product component: is lifted from or on the press plate until a fourth wafer base sheet provided with a filling layer is positioned and stopped below the lifted wafer intermediate product component in the press area, and is then pressed congruently onto the fourth wafer base sheet or its filling layer by the press plate in one pressing process.

[0026] If necessary, it is provided that the wafer base sheets are conveyed on the first conveying surface by several conveying devices arranged along the first conveying surface, wherein the conveying speeds of the individual conveying devices are or are set such that in the area immediately before the sandwich former: the first distance, i.e. the distance between the first waffle base sheet and the second waffle base sheet, is greater than the second distance, i.e. the distance between the second waffle base sheet and the third waffle base sheet.

[0027] Where appropriate, it is provided that the conveying speeds of the individual conveying devices are or are set in such a way that in the area immediately before the pressing station: the third distance, i.e. the distance between the waffle sandwich and the second waffle base sheet, is essentially the same as the fourth distance, i.e. the distance between the second waffle base sheet and the third waffle base sheet.

[0028] In particular, the invention relates to a plant for forming a multi-layer wafer intermediate product, comprising a sandwich former for forming a waffle sandwich by covering a first wafer base sheet, provided with an edible filling layer, with a wafer cover sheet, the sandwich former comprising the following components: a section of a first conveyor surface for feeding, positioning and stopping a first wafer base sheet provided with an edible filling layer in a sandwich forming area, a section of a second conveyor surface for feeding a wafer cover sheet above the sandwich forming area, a stopper, a front support and a rear support for stopping and positioning the wafer cover sheet above the sandwich forming area.

[0029] In particular, the system according to the invention is suitable and / or configured for carrying out the method according to the invention. In particular, the method according to the invention is carried out on the system according to the invention.

[0030] If necessary, the rear support is designed to support the wafer cover sheet in the area of ​​its rear edge.

[0031] If necessary, the front support is designed to support the wafer cover sheet in the area of ​​its front edge.

[0032] Optionally, a support movement device is provided which is arranged to move the front support and to bring the front edge of the wafer cover sheet into contact with the front edge of the first wafer base sheet.

[0033] Optionally, the invention relates to a system with a pressing station for forming a wafer intermediate product component by congruent, flat pressing of the wafer sandwich onto a second wafer base sheet provided with an edible filling layer.

[0034] If necessary, a press plate and a press plate movement device are provided.

[0035] Optionally, it is provided that the press plate movement device is configured to lift a waffle sandwich positioned and stopped in the pressing area and to press it in a pressing process in a congruent manner onto a second waffle base sheet provided with a filling layer, which is positioned and stopped below the raised waffle sandwich in the pressing area.

[0036] If necessary, several conveying devices are provided along the first conveying surface to convey the wafer base sheets to the sandwich former and the pressing station.

[0037] Where appropriate, the conveying devices may each comprise a belt or band conveyor.

[0038] Where appropriate, the conveyor devices are each driven at variable and / or adjustable speed by an asynchronous motor with frequency converter.

[0039] If appropriate, it is provided that the conveying devices each have a detector for detecting a waffle base sheet or waffle sandwich conveyed on the conveying device.

[0040] Where appropriate, the conveyor devices are to be controlled via a central control device of the system.

[0041] If necessary, the sandwich former is provided with a sandwich belt conveyor with a positioning drive for stopper-free positioning of the first wafer base sheet.

[0042] If necessary, the pressing station is provided with a pressing belt conveyor with a positioning drive for stopper-free positioning of the waffle sandwich and / or a waffle base sheet.

[0043] If necessary, a counter support plate is provided below the upper run of the press belt conveyor to form an abutment during the pressing process.

[0044] The discharge direction is the direction in which the wafer base sheet and the wafer cover sheet are discharged from the sandwich former area or from the sandwich former. Typically, the discharge direction corresponds to the general conveying direction of the system.

[0045] The wafer base sheets are provided with a filling layer in a filling application device. In particular, all wafer base sheets are provided with a filling layer in the filling application device. The wafer top sheets are preferably removed before the filling application device and fed back into the sandwich former after the filling application device. The wafer top sheets therefore do not have a filling layer.

[0046] The front edge of the wafer top sheet is brought into contact with the front edge of the wafer base sheet in the sandwich former. In particular, the front edge of the wafer top sheet rests on the filling layer of the wafer base sheet. Adhesive forces cause the two wafer sheets to stick together in the area of ​​their front edges. As the wafer base sheet is transported away, the wafer top sheet is pulled along as well. In this configuration, the wafer base sheet and the wafer top sheet are initially arranged in a V-shape or wedge-shape, with the tip of the V-shape or wedge pointing in the direction of transport. The rear edges of the wafer sheets are preferably spaced apart. As the wafer base sheet is transported away, the wafer top sheet rests on the wafer base sheet or its filling layer. Different forces act on the wafer top sheet in this process.On the one hand, the wafer top sheet is pushed toward the wafer base sheet by the movement and the wedge-shaped arrangement. Furthermore, the wafer top sheet is preferably positioned above the wafer base sheet, which also allows gravity to press the wafer top sheet onto the wafer base sheet. Additionally, an additional force can be exerted on one of the two wafer sheets, for example, by an air nozzle or a mechanical guide.

[0047] Various precautions can be taken to center the wafer top sheet relative to the wafer base sheet. The wafer base sheet is preferably positioned in a sandwich forming area. The sandwich forming area essentially corresponds to the surface of the wafer base sheet at a predetermined position. This means that the wafer base sheet is positioned essentially exactly in a sandwich forming area, taking tolerances into account. In all embodiments, this is preferably defined as stationary or machine-fixed. In particular, a positioning accuracy of less than 2 mm, preferably less than 1 mm, along the removal direction can be provided.

[0048] The positioning of the wafer topping sheet above the wafer base sheet should preferably be carried out with the same accuracy. For positioning the wafer topping sheet, a stopper is preferably provided, against which the wafer topping sheet is placed in order to achieve sufficiently precise positioning. In this position, the wafer topping sheet is preferably supported on a front support in the region of its front edge and on a rear support in the region of its rear edge. By moving, in particular by removing, the front support, the front edge of the wafer topping sheet is brought into contact with the front edge of the waffle base sheet. Preferably, the front edge of the waffle topping sheet is lowered onto the front edge of the waffle base sheet. The rear support is designed in particular such that it allows the waffle topping sheet to be supported, but does not impede movement of the waffle topping sheet along the removal direction.This allows the wafer top sheet to be pulled away from the rear support by removing the wafer base sheet so that it can be placed on the wafer base sheet or on its filling layer.

[0049] The positioning of the wafer base sheet in the sandwich forming area is preferably achieved without stoppers by the sandwich belt conveyor designed as a positioning belt, i.e., by a specially designed belt conveyor of the sandwich former. A detector, such as a light barrier, is preferably provided, which transmits a signal to the control device of the sandwich belt conveyor or the control device of the system. This signal contains information about the position or the time of a specific position. In addition, the sandwich belt conveyor preferably comprises a positioning drive, which enables precise positioning of the wafer base sheet. This positioning drive can, for example, be a servo drive or another controlled or regulated positioning drive. If necessary, the positioning drive can be an asynchronous motor with an encoder with sufficiently high resolution.

[0050] Stopperless positioning refers specifically to positioning that occurs without mechanical stoppers or stops, preferably using a belt conveyor alone. The stopperless, precise positioning of the wafer base eliminates the need for components such as retractable stops.

[0051] Preferably, a plurality of conveying devices are provided along the first conveying surface. These conveying devices can be operated at different conveying speeds to position the individual waffle base sheets relative to one another. In particular, the first waffle base sheet, which is covered with the waffle cover sheet in the sandwich former to form the waffle sandwich, is accelerated upstream of the sandwich former such that the first distance is greater than the second distance. In particular, the first distance is selected to be large enough that, at the current conveying speed, there is sufficient time to stop the first waffle cover sheet and form the waffle sandwich. During the formation of the waffle sandwich, the subsequent waffle base sheets can be conveyed further, preferably essentially uniformly.However, the subsequent wafer base sheets can be adjusted during this conveying process in terms of their position relative to each other, and especially in terms of their position relative to the wafer sandwich. This adjustment is also achieved by selecting or changing the speeds of the individual conveying devices.

[0052] The spacing between the transported wafer base sheets can be understood as a spatial distance. However, the choice of spacing is essentially a temporal interval or a time delay with which the individual wafer sheets arrive in a specific area of ​​the system.

[0053] Preferably, at least one or two conveyor devices are also provided downstream of the sandwich former. These allow the positioning of the wafer sandwich relative to the subsequent wafer base sheets, which are stacked in the pressing station to form a wafer intermediate product component or the wafer intermediate product.

[0054] The pressing station preferably comprises a pressing plate that is suitable and / or configured to lift the waffle sandwich and, in a lowering process, lower it onto a subsequent waffle base sheet or its filling layer. The movement of the pressing plate is preferably synchronized with the conveyance of the waffle base sheets along the first conveying surface, such that the waffle sandwich held on the pressing plate or the waffle intermediate product component can be lowered with essentially no downtime or with minimal downtime. The timing of the movement of the pressing plate is preferably not dependent on a sensor that detects the waffle base sheet directly in the pressing area. Rather, the components for forming the waffle intermediate product, in particular the waffle sandwich and one or more waffle base sheets, are fed to the pressing station at an optimized time so that the downtimes are minimized.

[0055] A press belt conveyor is preferably provided for positioning and stopping the wafer base sheet in the pressing area. The stopping and positioning of the wafer base sheet in the pressing area is preferably also stopperless. The pressing area essentially corresponds to the size of the wafer base sheet, whereby any tolerances are also taken into account here. In particular, a positioning accuracy of less than 2 mm, in particular less than 1 mm, can be achieved along the transport direction. The press belt conveyor can be designed identically to the sandwich belt conveyor. In addition, however, the press belt conveyor can comprise a counterholder plate below the upper run or section, which serves as an abutment to absorb the forces of the pressing station or the pressing plate. The pressing station is preferably designed to calibrate the intermediate wafer product.In particular, this means that the wafer intermediate product is compressed to a height corresponding to a predetermined wafer intermediate product height. This allows all wafer intermediate products produced to be calibrated to essentially the same height.

[0056] The press belt conveyor preferably includes a positioning drive that enables precise positioning of the wafer base sheet. This positioning drive can, for example, be a servo drive or another controlled or regulated positioning drive. Optionally, the positioning drive can be an asynchronous motor with an encoder with sufficiently high resolution.

[0057] Preferably, each conveyor device comprises a detector. Preferably, the sandwich belt conveyor comprises a detector. Preferably, the press belt conveyor comprises a detector. The detectors are suitable and / or configured to provide a signal that provides information about the position of the conveyed wafer base sheet. This allows the speeds of the individual drives to be controlled or regulated in order to position the wafer base sheets and, if applicable, the waffle sandwich, during movement or when stopped.

[0058] The invention will be further described below with reference to the figures.

[0059] Figure 1 shows a schematic side view of components of a plant for the formation of wafer intermediate products.

[0060] The Figures 2, 3 and 4 show components of a sandwich former in different positions and process steps for forming a waffle sandwich.

[0061] Figure 5 shows a schematic view of components of a pressing station.

[0062] Figure 6 shows schematic diagrams of movements of individual components of a system.

[0063] Unless otherwise stated, the reference numerals in the figures correspond to the following features: wafer intermediate product 1, wafer base sheet 2, first conveying surface 3, sandwich former 4, sandwich former area 5, wafer cover sheet 6, second conveying surface 7, removal direction 8, front edge (of the wafer cover sheet) 9, rear edge (of the wafer cover sheet) 10, front edge (of the wafer base sheet) 11, gas jet 12, stopper 13, front support 14, rear support 15, sandwich belt conveyor 16, filling application device 17, pressing area 18, pressing plate 19, wafer sandwich 20, wafer intermediate product component 21, conveying device 22, first distance 23, second distance 24, third distance 25, fourth distance 26, support movement device 27, pressing plate movement device 28, control device 29, press belt conveyor 30, counter plate 31, detector 32, press station 33.

[0064] Figure 1shows a schematic side view of a system for forming wafer intermediate products 1. A filling application device 17, a sandwich former 4, and a pressing station 33 are provided along a first conveying surface 3. The first conveying surface 3 is formed at least in sections by conveying devices 22, in this embodiment in particular by the conveying devices 22a to 22f. In addition, the first conveying surface 3 can also be formed in sections by other components. In the area of ​​the sandwich former 4, the first conveying surface 3 is formed, for example, by a sandwich belt conveyor 16. In the area of ​​the pressing station 33, the first conveying surface 3 is formed, for example, by the pressing belt conveyor 30.

[0065] The system comprises a second conveyor surface 7. The second conveyor surface 7 runs at least partially parallel to the first conveyor surface 3 or next to the first conveyor surface 3 and opens into or onto the sandwich former 4. The starting point for production is a generic baking device for producing waffles, from which wafer sheets are usually dispensed at regular intervals. These are then usually cooled and conveyed to the system via one or more conveyor devices 22. Depending on how many waffle layers the intermediate waffle product 1 to be formed is to have, a wafer sheet is removed at regular intervals to form a waffle sandwich 20 and transported along the second conveyor surface 7 as a wafer cover sheet 6 to the sandwich former 4. All other wafer sheets are conveyed along the first conveyor surface 3 to the filling application device 17 to form waffle base sheets 2.Preferably, several, at least two, conveyor devices 22 are provided along the first conveyor surface 3 upstream of the filling application device 17. The speeds of these conveyor devices 22 are preferably selected such that the wafer base sheets 2 lie butt-to-butt in the region of the filling application device 17 and thereby form a substantially continuous surface. This continuous surface can then, for example, be provided with a continuous filling layer, in particular with an edible mass. In particular, this can be done via a so-called cream spreading head or via a film spreading machine that continuously dispenses a cream film. Alternatively, the filling application device 17 can also be designed as a device in which the wafer base sheets 2 are provided with a filling individually and not butt-to-butt. The filling application device 17 can, in particular, be designed as a conventional filling application device 17.If necessary, several filling application devices 17 can also be provided.

[0066] After the filling application device 17, the wafer base sheets 2 provided with a filling layer are conveyed along the first conveying surface 3 to a sandwich former 4. The conveying devices 22, in this embodiment the conveying devices 22a, 22b and 22c, are operated in particular such that the wafer base sheets 2 are again spaced apart from one another and in particular such that the wafer base sheets 2 are conveyed spaced apart from one another along the first conveying surface 3.

[0067] Typically, the intermediate waffle products 1 to be formed have three to five wafer layers made of wafer sheets. If the intermediate waffle product 1 to be formed has only three wafer layers, the waffle sandwich 20 is already intermediate waffle product 1.

[0068] In the present embodiment of the Figure 1For example, a wafer intermediate product 1 is formed with four wafer sheets and therefore with three filling layers. For this purpose, a first wafer base sheet 2', a second wafer base sheet 2", and a third wafer base sheet 2‴ are conveyed successively towards the sandwich former 4. As the fourth wafer sheet, a wafer cover sheet 6 is conveyed via the second conveying surface 7 to the sandwich former 4. The wafer base sheets 2 each have certain distances from one another in the area in front of the sandwich former 4. A first distance 23 is provided between the first wafer base sheet 2' and the second wafer base sheet 2". A second distance 24 is provided between the second wafer base sheet 2" and the third wafer base sheet 2‴. The conveying devices 22, in particular the conveying devices 22a, 22b, 22c, are now preferably operated in this area such that the first distance 23 is greater than the second distance 24.

[0069] In particular, the spacing of the conveyed wafer base sheets 2 can be understood as a spatial spacing. However, the selection of the spacing is fundamentally dependent on the time interval at which the individual wafer sheets arrive in the sandwich former 4 and / or the pressing station 33.

[0070] In front of the sandwich former 4, the first distance 23 is selected in particular such that sufficient time remains to stop the wafer base sheet 2' in the sandwich former 4 and to form the waffle sandwich 20. During the formation of the waffle sandwich 20, the subsequent wafer base sheets 2" and 2" can be conveyed further.

[0071] In particular, the first distance 23 can be selected such that the formed waffle sandwich 20, the second waffle base sheet 2" and the third waffle base sheet 2‴ have substantially the same distances from one another after the sandwich former 4.

[0072] To form a waffle sandwich 20, in the present embodiment, only the first waffle base sheet 2' is covered with a waffle cover sheet 6. The second waffle base sheet 2" and the third waffle base sheet 2" are conveyed through or past the sandwich former 4 without forming a sandwich.

[0073] As a result, a waffle sandwich 20 and subsequently the second waffle base sheet 2" and the third waffle base sheet 2‴ are conveyed along the first conveying surface 3 after the sandwich former 4. The waffle base sheets 2 are each provided with a filling layer.

[0074] In embodiments in which wafer intermediate products 1 with more or fewer layers are to be formed, the number of wafer base sheets 2 is varied in an analogous manner.

[0075] In a pressing station 33, the waffle sandwich 20 is stopped and lifted from the first conveyor surface 3 by the pressing plate 19 or at the pressing plate 19. At the same time or thereafter, the second waffle base sheet 2" is positioned and stopped in a pressing area 18 below the pressing plate 19 and thus also below the lifted waffle sandwich 20. Subsequently, the pressing plate 19 lowers the waffle sandwich 20 onto the second waffle base sheet 2" provided with a filling layer and presses the waffle sandwich 20 onto this filling layer. This results in the second waffle base sheet 2" being joined to the waffle sandwich 20 to form a waffle intermediate product component 21. Subsequently, the pressing plate 19 of the pressing station 33 is raised again to feed the third waffle base sheet 2" and to join it in a similar manner to the waffle intermediate product component 21 provided on the pressing plate 19.

[0076] Once the intermediate wafer product 1 has been fully formed and preferably also calibrated, it is placed on the first conveyor surface 3. The intermediate wafer product 1 can then be transported away along the first conveyor surface 3.

[0077] The conveying devices 22, in particular the conveying devices 22d and 22e, are preferably operated upstream of the pressing station 33 in such a way that the waffle sandwich 20 and the waffle base sheets 2 are fed to the pressing station 33 in an optimized manner. The third distance 25, i.e. the distance between the waffle sandwich 20 and the second waffle base sheet 2", is essentially the same size as the fourth distance 26, i.e. the distance between the second waffle base sheet 2" and the third waffle base sheet 2‴.

[0078] If necessary, additional stations are provided for this system, such as a cutting station for cutting or separating the intermediate wafer product 1 into wafer slices. If necessary, a packaging machine is provided for packaging the resulting wafer products.

[0079] In all embodiments, the conveyor devices 22, in this embodiment the conveyor devices 22a to 22f, can comprise an asynchronous motor with a frequency converter as a drive. For the control and / or regulation of the speeds of the conveyor devices 22, in particular for selecting the distances between the individual wafer base sheets 2, a plurality of detectors 32 are preferably provided in all embodiments. In particular, each conveyor device 22 comprises a detector 32 or each conveyor device 22 is assigned a detector 32. Preferably, the detector 32 is a sensor, in particular an optical sensor and, for example, a light barrier. The detector 32 preferably receives a signal that provides information about when a wafer base sheet 2 is at a specific location. The speed of the wafer base sheet 2 can also be determined if necessary via the duration of the detection or the interruption of a light barrier.Additionally or alternatively, the speed signal can also be determined on the basis of the data from the drive of the respective conveyor device 22.

[0080] It is preferably provided that each conveying device 22 comprises a detector 32 which, together with this conveying device 22, forms a control unit in order to be able to carry out a temporal control of the movement of the wafer base sheets 2.

[0081] The Figures 2, 3 and 4show a sandwich former 4 in different positions. Basically, the sandwich former 4 is designed to form a waffle sandwich 20. A waffle sandwich 20 is a waffle intermediate product 1 or a waffle intermediate product component 21, consisting of a waffle base sheet 2 with a filling layer provided on the waffle base sheet 2 and with a waffle cover sheet 6 that covers the filling layer of the waffle base sheet 2. In all embodiments, the filling layer can be arranged flatly, partially, or selectively on the waffle base sheet. The waffle base sheet 2 and the waffle cover sheet 6 are placed on top of one another in a substantially congruent manner, with the filling layer being provided between the waffle base sheet 2 and the waffle cover sheet 6. To form the waffle sandwich 20, a waffle base sheet 2 provided with a filling layer is conveyed along the first conveying surface 3 into the sandwich former 4.In the present embodiment, the sandwich former 4 comprises a sandwich belt conveyor 16. This sandwich belt conveyor 16 is suitable and / or configured to position and stop the wafer base sheet 2 in a sandwich former region 5 without stoppers. The sandwich former region 5 essentially corresponds to an area of ​​the same size as the wafer base sheet 2, with certain positioning tolerances being accepted. In particular, a positioning accuracy of less than 5 mm, preferably less than 2 mm, and particularly preferably less than 1 mm should be achieved when positioning the wafer base sheet 2 along the first conveyor surface 3. At the same time, before, or after this, a wafer cover sheet 6 is fed via a second conveyor surface 7. The wafer cover sheet 6 is positioned and stopped as precisely as required above the sandwich former region 5 and the wafer base sheet 2, if present therein.In the present embodiment, the wafer top sheet 6 is conveyed along the second conveying surface 7 into the sandwich former 4 until it abuts a stopper 13 or rests in the stopper 13. In all embodiments, the stopper 13 can be a stop, a pin, a web, an angle, or a similar element. In this position, the wafer top sheet 6 is subsequently brought into contact with the wafer base sheet 2 and, in particular, lowered onto the wafer base sheet 2 to form a waffle sandwich 20.

[0082] In the present embodiment, a front support 14 and a rear support 15 are provided. The wafer cover sheet 6 is, as in Figure 2 shown, in its front area or in the area of ​​its front edge 9 is supported on a front support 14. In the area of ​​the rear edge 10 of the wafer cover sheet 6, it is supported on the rear support 15. As in Figure 3As can be seen, in a next step, the front edge 9 of the wafer cover sheet 6 is brought into contact with the front edge 11 of the wafer base sheet 2, wherein the front edge 9 of the wafer cover sheet 6 is placed in particular on the filling layer of the wafer base sheet 2. As a result, the wafer base sheet 2 and wafer cover sheet 6 have a V-shaped or wedge-shaped arrangement in this position. In the present embodiment, the front edge 9 of the wafer cover sheet 6 is brought into contact with the front edge 11 of the waffle base sheet 2 in particular by moving the front support 14 via a support movement device 27.

[0083] In the present embodiment, several front supports 14 are provided along a conveyor belt of a support movement device 27. This conveyor belt can be moved via a drive. The front support 14 may already engage under the front edge 9 of the wafer cover sheet 6 during the feeding of the wafer cover sheet 6 and before the stopper 13. The front edge 9 of the wafer cover sheet 6 is already supported on the front, movably arranged support 14 during the further conveyance of the wafer cover sheet 6 in an area above the sandwich former area 5.

[0084] Subsequently, the wafer cover sheet 6 is precisely positioned by resting it against a stopper 13. If necessary, however, the movement of the front support 14 or the support movement device 27 can also be position-controlled such that precise positioning can be achieved above the sandwich former area 5. In principle, any technical device that enables precise positioning of the wafer cover sheet 6 above the sandwich former area 5 can be used alternatively.

[0085] In the present embodiment, the front support 14 is moved further, but the wafer cover sheet 6 rests against the stopper 13. As a result, the wafer cover sheet 6, or rather its front edge 9, is stripped off the front support 14 and is therefore no longer supported from below. As a result, Figure 3As shown, the front edge 9 of the wafer cover sheet 6 is pressed onto the front edge 11 of the wafer base sheet 2. This movement can be assisted by mechanical or pneumatic forces if necessary. In particular, a gas jet 12 can be used to press the wafer cover sheet 6 toward the wafer base sheet 2.

[0086] In Figure 4 A further position of the sandwich former 4 is shown. In this step, the wafer base sheet 2 is transported away by actuating the sandwich belt conveyor 16 along the removal direction 8. Because the wafer cover sheet 6 rests on the wafer base sheet 2 with at least one edge, as in Fig. 3As shown, the wafer cover sheet 6 is pulled along by the wafer base sheet 2 and subsequently lies flat and congruently on the wafer base sheet 2 or on its filling layer. This movement can be assisted, for example, by a gas jet 12. In addition, the V-shaped or wedge-shaped arrangement and, in particular, the inclined position of the wafer cover sheet 6 relative to the removal direction 8 also helps.

[0087] In the position of Figure 4 the next front support 14 can already be engaged to support the front edge 9 with the next wafer cover sheet 6.

[0088] A detector 32 for detecting the wafer base sheets 2 can help to achieve a stopper-free and exact positioning of the wafer base sheets 2 on the sandwich belt conveyor 16.

[0089] Once the waffle sandwich 20 has been formed, it is transported further along the removal direction 8. If a further layer is to be applied to the waffle sandwich 20 to form the intermediate waffle product 1, it is preferably provided that at least the subsequent waffle base sheet 2 provided with a filling layer is conveyed through the sandwich former 4 or past the sandwich former 4 without a waffle cover sheet 6 being applied. Stacking of further layers with the waffle sandwich 20 can take place in a pressing station 33. This pressing station 33 can be designed according to the prior art or according to Figure 5 be trained.

[0090] Figure 5 shows an embodiment of a pressing station 33. This pressing station can be connected to the system according to Fig.1 and the sandwich former 4 according to the Figures 2-4be combined. In principle, however, the pressing station 33 can also be used alone or in combination with a conventional sandwich former 4 or a conventional system. The pressing station 33 comprises a pressing plate 19, which can be moved via a pressing plate movement device 28 and, in particular, moved up and down. For this purpose, the pressing plate movement device 28 can, for example, comprise a linear drive for moving the pressing plate 19 and a guide device for guiding, in particular for parallel guidance, the pressing plate 19.

[0091] The pressing plate 19 is suitable and / or configured to lift the waffle sandwich 20 from a pressing belt conveyor 30. In particular, a first waffle base sheet 2' (not shown) is conveyed in the pressing area 18 of the pressing station 33. The pressing area 18 essentially corresponds to the size of a waffle sandwich 20 or a waffle base sheet 2, whereby certain positional tolerances are accepted. In particular, the pressing belt conveyor 30 is suitable and / or configured to enable a positional accuracy of less than 5 mm, preferably less than 2 mm. The waffle sandwich 20 formed in a sandwich former 4 is conveyed along the first conveying surface 3 into the pressing area 18, where it is positioned and stopped. The positioning and stopping are preferably carried out stopless by the pressing belt conveyor 30. This preferably comprises a positioning drive that enables exact positioning.

[0092] Subsequently, the pressing plate 19 of the pressing station 33 is lowered onto the waffle sandwich 20. The waffle sandwich 20 is held on the pressing plate 19, and the pressing plate 19 is raised again via the pressing plate movement device 28. This also lifts the waffle sandwich 20 from the first conveyor surface 3.

[0093] The waffle sandwich 20 can be secured to the press plate 19, as in this embodiment, by a press plate 19 designed as a vacuum plate. A vacuum source is connected to several openings in the press plate 19, with these openings in the press plate 19 being at least partially closed by the waffle sandwich 20. The vacuum force thus holds the waffle sandwich 20 to the press plate 19.

[0094] During or after the lifting process, a second wafer base sheet 2" (not shown) provided with a filling layer is fed along the first conveyor surface 3, positioned in the pressing area 18, and stopped. In a next step, or during this step, the pressing plate moving device 28 lowers the pressing plate 19 and the waffle sandwich 20 held on it onto the following second wafer base sheet 2". As a result, the waffle sandwich 20 is placed onto the filling layer of the second wafer base sheet 2" and pressed down. The waffle sandwich 20 and the pressed-down second wafer base sheet 2" together form a wafer intermediate product component 21. This is in turn lifted off the first conveyor surface 3 in a next step, and a further, third wafer base sheet 2" can be attached to the wafer intermediate product component 21 in an analogous manner.

[0095] Once the desired number of layers has been produced, the wafer intermediate product 1 is fully formed and can be deposited and transported away by the press plate 19 onto the first conveyor surface 3.

[0096] When pressing the components held on the press plate 19, the height of the intermediate wafer product component 21, but primarily of the intermediate wafer product 1, is preferably calibrated. Intermediate calibration can be performed for intermediate layers. In particular, during the last stroke, i.e., during the last pressing of the intermediate wafer product component 21 or the wafer sandwich 20 onto the last wafer base sheet 2, the press plate 19 is moved towards the first conveying surface 3 exactly far enough so that the intermediate wafer product 1 is compressed to a predefined height. A counterholder plate 31 is provided as an abutment for the forces emanating from the press plate 19. This is preferably arranged below the upper run of the press belt conveyor 30 and attached to the side of a machine frame to ensure sufficient stability.

[0097] Figure 6shows a schematic diagram for the temporal synchronization or movement of the components of the intermediate wafer product 1. The rows of the diagram list the conveyor devices 22 arranged along the first conveyor surface 3, as well as the sandwich belt conveyor 16 and the press belt conveyor 30. The last row relates to the movement of the press plate movement device 28. The columns correspond to time periods, so-called time slots S1 to S8. The individual graphs in the rows are speed graphs, with the bottom row showing a graph representing the height of the press station 33 instead of a speed graph.

[0098] In time period S1, a first wafer base sheet 2' is first conveyed on the first conveyor device 22a. During this time, the conveying speed of the first conveyor device 22a is briefly increased.

[0099] In time period S2, the first wafer base sheet 2' is on the second conveyor device 22b and the second wafer base sheet 2" is on the first conveyor device 22a.

[0100] In time period S3, the first wafer base sheet 2' is on the third conveyor device 22c, the second wafer base sheet 2" is on the second conveyor device 22b, and the third wafer base sheet 2‴ is on the first conveyor device 22a.

[0101] In the time ranges S2 and S3, the speed of the first conveyor device 22a is briefly reduced in order to increase the distance between the first wafer base sheet 2' and the second wafer base sheet 2". In addition, the distance between the second wafer base sheet 2" and the third wafer base sheet 2‴ is also increased by a longer delay in the time range S3.

[0102] The distances between the wafer base sheets 2 can be verified and adjusted, for example, via a detector 32 arranged between the conveyor devices 22.

[0103] On the second conveyor device 22b, shown in the second line, the speed is briefly increased in the second time range when the first wafer base sheet 2' is transported on the second conveyor device 22b. This brief increase in conveying speed further increases the distance between the first wafer base sheet 2' and the subsequent wafer base sheets 2" and 2" . In the time ranges S3 and S4, the two wafer base sheets 2" and 2" are only briefly decelerated in this embodiment in order to adjust their exact positioning or the exact desired distance relative to one another and relative to the first wafer base sheet 2'.

[0104] By accelerating or decelerating the individual wafer base sheets 2 on the conveyor devices 22, a desired timing can be set.

[0105] In the present embodiment, a third conveyor device 2c is provided upstream of the sandwich former 4. On this conveyor device, the first wafer base sheet 2' is accelerated once more to further increase the distance to the two subsequent wafer base sheets 2" and 2‴. If the two subsequent wafer base sheets 2" and 2‴ are correctly adjusted with regard to their temporal synchronization, a further speed adjustment in the time periods S4 and S5 by the conveyor device 22c is no longer necessary.

[0106] In the present embodiment, the timing of the wafer base sheets 2 is achieved via three conveyor devices 22, in particular via the conveyor devices 22a, 22b, and 22c. If necessary, it may be sufficient to provide one or two conveyor devices 22 upstream of the sandwich former 4 in order to achieve the desired timing or location of the wafer base sheets 2.

[0107] In a next step, particularly in time period S4, the first waffle base sheet 2' is positioned on the sandwich belt conveyor 16 and stopped. For a certain period of time, the speed of the first waffle base sheet 2' is therefore zero. In the meantime, the other waffle base sheets 2" and 2" are conveyed further on the conveyor devices 22c and 22b in time period S4. After the time required to form the waffle sandwich 20, the latter is conveyed further by the sandwich belt conveyor 16 at a speed other than zero. In time period S5, the waffle sandwich 20 is further accelerated on the fourth conveyor device 22d in order to increase the distance to the subsequent waffle base sheets 2" and 2" . In the present embodiment, these are conveyed at a constant speed on the conveyor device 22c and on the sandwich belt conveyor 16 in time period S5.As can be seen in the time periods S5 and S6, the subsequent sheets are not stopped on the sandwich belt conveyor 16 but are conveyed further at a constant speed.

[0108] If necessary, a fifth conveyor device 22e, such as in Fig. 1 , or further conveying devices 22 may be provided to enable further synchronization of the components.

[0109] In the present embodiment, the waffle sandwich 20 is positioned on the press belt conveyor 30 and stopped. In a next step, the press plate moving device 28 is actuated and the press plate 19 is lowered onto the waffle sandwich 20. The waffle sandwich 20 is lifted off by the press plate 19 and an upward movement of the press plate moving device 28. In the present case, this occurs during the time periods S6 and S7. In the meantime, the two subsequent waffle base sheets 2" and 2‴ are conveyed further, in particular continuously, on the conveyor devices 22 and on the sandwich belt conveyor 16, respectively. In the time periods S7 and S8, the second waffle base sheet 2" and the third waffle base sheet 2‴ are then also positioned and stopped by the press belt conveyor 30 in order to pass through the pressing station 33 and the pressing station 34, respectively.the press plate 19 with the press plate moving device 28 to be stacked into a wafer intermediate product 1.

Claims

1. A method for forming a multi-layer intermediate wafer product (1) by means of a system according to claims 11-15, comprising the following steps: - supplying a first base wafer sheet (2') provided with an edible filling layer on a first conveying surface (3) into a sandwich former (4) and positioning and stopping the first base wafer sheet (2') in a sandwich forming area (5), - supplying a cover wafer sheet (6) on a second conveying surface (7) into the sandwich former (4) and positioning and stopping the cover wafer sheet (6) above the sandwich forming area (5), - subsequently bringing, as seen in the transport direction (8), the front edge (9) of the cover wafer sheet (6) into contact with the front edge (11) of the first base wafer sheet (2'), in particular by lowering the front edge (9) of the cover wafer sheet (6) onto the front edge (11) of the first base wafer sheet (2'), - subsequently transporting the first base wafer sheet (2') in the transport direction (8), wherein the cover wafer sheet (6), tilted towards the first base wafer sheet (2'), is placed in a congruent, planar manner onto the first base wafer sheet (2') or onto its filling layer, in a placing process during the transport of the first base wafer sheet (2').

2. The method according to claim 1, characterised in that the cover wafer sheet (6) is urged towards the first base wafer sheet (2') during the placing process, wherein the cover wafer sheet (6) is, in particular by a targeted gas jet (12), urged towards the first base wafer sheet (2') during the placing process.

3. The method according to one of claims 1 or 2, characterised in that the cover wafer sheet (6), upon positioning and stopping along the second conveying surface (7), is moved until it abuts against a stopper (13) and is supported in the area of its front edge (9) on a front support (14) and in the area of its rear edge (10) on a rear support (15).

4. The method according to one of claims 1 to 3, characterised in that the cover wafer sheet (6) is pulled off from the rear support (15) by the transport of the first base wafer sheet (2') and, in the placing process, is placed in a congruent, planar manner onto the base wafer sheet (2) or onto its filling layer.

5. The method according to one of claims 1 to 4, characterised in that the first base wafer sheet (2') is positioned and stopped at the sandwich forming position by a sandwich belt conveyor (16) with a positioning drive without the use of a stopper.

6. The method according to one of claims 1 to 5, characterised - in that multiple base wafer sheets (2) are provided with a filling layer in a filling application device (17) on the first conveying surface (3) upstream of the sandwich former (4), - in particular in that the base wafer sheets (2) are conveyed end-to-end through the filling application device (17) and hence a substantially continuous area is provided with a filling layer.

7. The method according to one of claims 1 to 6, characterised in that a wafer sandwich (20) formed in the sandwich former (4) and at least one second base wafer sheet (2") provided with a filling layer are conveyed on the first conveying surface (3) to a pressing station (33) downstream of the sandwich former (4), in which the wafer sandwich (20) is: - in a pressing area (18), positioned and stopped by a press belt conveyor (30) with a positioning drive without the use of a stopper, - subsequently lifted by or on a pressing plate (19) until the second base wafer sheet (2") provided with a filling layer is positioned and stopped below the lifted wafer sandwich (20) in the pressing area (18), - and, in a pressing process, is subsequently pressed in a congruent, planar manner onto the second base wafer sheet (2") and onto its filling layer by the pressing plate (19).

8. The method according to claim 7, characterised in that the wafer sandwich (20) and the second base wafer sheet (2") provided with the filling layer, adhering to the wafer sandwich (20) as a result of the pressing process, together form an intermediate wafer product component (21), and in that the intermediate wafer product component (21): - is lifted by or on the pressing plate (19) until a third base wafer sheet (2‴) provided with a filling layer is positioned and stopped below the lifted intermediate wafer product component (21) in the pressing area (18), - and is, in a pressing process, subsequently pressed by the pressing plate (19) in a congruent, planar manner onto the third base wafer sheet (2‴) or onto its filling layer, and optionally, - in that the wafer sandwich (20) and the base wafer sheets (2) adhering to the wafer sandwich (20) as a result of the pressing process together form an intermediate wafer product component (21), and in that the intermediate wafer product component (21): - in the pressing area (18), is lifted by or on the pressing plate (19) until a fourth base wafer sheet (2) provided with a filling layer is positioned and stopped below the lifted intermediate wafer product component (21), - and is, in a pressing process, subsequently pressed by the pressing plate (19) in a congruent, planar manner onto the fourth base wafer sheet (2) or onto its filling layer.

9. The method according to claim 8, characterised in that the base wafer sheets (2) are conveyed on the first conveying surface (3) by multiple conveying devices (22) arranged along the first conveying surface (3), wherein the conveying speeds of the individual conveying devices (22) are set such that, in the area immediately upstream of the sandwich former (4): - the first distance (23), i.e. the distance between the first base wafer sheet (2') and second base wafer sheet (2"), is greater than - the second distance (24), i.e. the distance between the second base wafer sheet (2") and third base wafer sheet (2‴).

10. The method according to claim 9, wherein the conveying speeds of the individual conveying devices (22) are set such that in the area immediately upstream of the pressing station (33): - the third distance (25), i.e. the distance between the wafer sandwich (20) and the second base wafer sheet (2") is substantially equal to the - the fourth distance (26), i.e. the distance between the second base wafer sheet (2") and the third base wafer sheet (2‴).

11. A system for forming a multi-layer intermediate wafer product (1) by means of a sandwich former (4) for forming a wafer sandwich (20) by covering a first base wafer sheet (2`) provided with an edible filling layer with a cover wafer sheet (6) in a congruent manner, wherein the sandwich former (4) comprises the following elements: - a section of a first conveying surface (3) in a sandwich forming area (5) for supplying, positioning and stopping a first base wafer sheet (2') provided with an edible filling layer, - a section of a second conveying surface (7) for supplying a cover wafer sheet (6) above the sandwich forming area (5), - a stopper (13), a front support (14) and a rear support (15) for stopping and positioning the cover wafer sheet (6) above the sandwich forming area (5), wherein, - the rear support (15) is configured to support the cover wafer sheet (6) in the area of its rear edge (10), - the front support (14) is configured to support the cover wafer sheet (6) in the area of its front edge (9), - and a support movement device (27) is provided that is configured to move the front support (14), to tilt the cover wafer sheet (6) towards the first base wafer sheet (2') and to bring the front edge (9) of the cover wafer sheet (6) into contact with the front edge (11) of the first base wafer sheet (2') - and in the area of the sandwich former (4) the first conveying surface (3) is formed, for example, by a sandwich belt conveyor (16), wherein the sandwich belt conveyor (16) is operable to transport the first base wafer sheet (2') along the transport direction (8) and, because the cover wafer sheet (6) rests with at least one edge on the base wafer sheet (2'), the cover wafer sheet (6) is pulled along by the base wafer sheet (2') and subsequently comes to lie in a congruent, planar manner on the base wafer sheet (2') or its filling layer.

12. The system according to claim 11, with a pressing station (33) for forming an intermediate wafer product component (21) by pressing the wafer sandwich (20) in a congruent, planar manner onto a second base wafer sheet (2") provided with an edible filling layer, characterised - in that a pressing plate (19) and a pressing plate movement device (28) are provided, - in that a pressing plate movement device (28) is configured to lift a wafer sandwich (20) positioned and stopped in the pressing area (18) and in a pressing process, to press it in a congruent, planar manner onto a second base wafer sheet (2") provided with a filling layer, positioned and stopped below the lifted wafer sandwich (20) in the pressing area (18).

13. The system according to one of claim 11 or 12, characterised - in that multiple conveying devices (22) for conveying the base wafer sheets (2) to the sandwich former (4) and to the pressing station (33) are provided along the first conveying surface (3), - in that the conveying devices (22) each comprise a belt conveyor or strap conveyor. - in that the conveying devices (22) are each driven at a variable or selectable speed by an asynchronous motor with a frequency converter, - in that the conveying devices (22) each have a detector (32) for detecting a base wafer sheet (2) or wafer sandwich (20) conveyed on the conveying device (22), - and optionally in that controlling the conveying devices (22) is executed by a central controller (29) of the system.

14. The system according to one of claims 11 to 13, characterised in that the sandwich former (4) has a sandwich belt conveyor (16) with a positioning drive for positioning the first base wafer sheets (2') without the use of a stopper.

15. The system according to one of claims 11 to 14, characterised in that - the pressing station (33) has a press belt conveyor (30) with a positioning drive for positioning the wafer sandwich (20) and / or the base wafer sheet (2) without the use of a stopper, - and in particular in that a counter-holder plate (31) is provided below the upper strand of the press belt conveyor (30) to form an abutment during the pressing process.