Method and apparatus for forming multilayer wafer biscuit intermediates

Abstract

The invention relates to a method and an apparatus for forming a multi-layer wafer biscuit intermediate product (1), said apparatus having a sandwich forming die (4) for forming a wafer sandwich (20) by coincidentally covering a first wafer base sheet (2') coated with a layer of edible filling with a wafer cover sheet (6).

Description

Technical Field

[0001] This invention relates to a method and apparatus for forming a multi-layer wafer biscuit semi-finished product. Background Technology

[0002] Various embodiments of apparatus for forming multi-layered wafer biscuit semi-finished products are known and disclosed, and in particular, methods. Such apparatus is typically part of equipment used to produce multi-layered wafer biscuit products, such as wafer bars or Neapolitan hazelnut-flavored wafers. These wafer biscuit products comprise several wafer layers, particularly flat wafer layers, with an edible filling, such as hazelnut cocoa cream, chocolate cream, or other creams, such as fatty cream, placed between each layer. Where appropriate, this product is also coated with a layer of chocolate.

[0003] To produce such products, the first step is typically to produce flat wafers in a baking apparatus of this type. This type of baking apparatus can also be used in conjunction with the present invention and is designed, for example, as a so-called automatic baking tongs. In this particular baking apparatus, openable baking tongs are arranged along a continuous conveyor, each forming a baking mold in its closed position. The baking tongs are mostly continuously conveyed along the continuous conveyor through the oven. During this process, the baked goods are placed on the open baking tongs. Subsequently, the baking tongs are closed and locked, and the baking tongs are conveyed through a high-temperature baking chamber according to existing technology. The baked goods are conveyed through the baking chamber in the closed baking tongs and baked into wafers there. The baking tongs are then opened, allowing the baked goods to be removed. The cycle then begins again.

[0004] The crispness and crumbliness of wafer biscuits are due to the effect of baking a baked good or dough with a high moisture content of approximately 50% to 70% under high pressure. During this process, the moisture in the baked good escapes rapidly as steam, leaving behind a porous, crumbly structure. A locking device is provided to enable the baking process under high pressure. This locking device locks the baking tongs, thereby creating overpressure inside. This overpressure alone is sufficient to achieve the desired baking process. The locking device is preferably located at the baking tongs and operates in or after the closing zone.

[0005] To produce wafer blocks or wafer bars, a filling layer is added to the wafer sheet. To stack individual layers, what's usually called a wafer sandwich is formed in the first step. A wafer sandwich consists of two wafer layers and a filling layer placed between them. Then, wafer sheets coated with the filling layer are pressed together at the wafer sandwich to add further layers and form a multi-layered baked semi-finished product. Typically, the product to be formed has three to five wafer layers. Wafer sheets from the wafer baking machine are usually about 40 x 80 cm in size. If wafer blocks, i.e., baked semi-finished products, have already been formed, they can then be cut into individual strips and packaged.

[0006] There is currently a market demand for equipment and methods to produce these types of wafer biscuit semi-finished products, where output—the number of wafer biscuit semi-finished products produced per unit time—must be as high as possible. However, there is also significant price pressure in the market, necessitating the provision of such equipment at the lowest possible cost. High-cost control and regulation schemes for continuous production methods require relatively expensive components, which, while increasing output, also raise the overall cost of the equipment. Summary of the Invention

[0007] The present invention aims to create a method and an apparatus that can increase output using inexpensive, simple yet reliable components.

[0008] The purpose of the invention is achieved in particular by a method and apparatus for forming a multi-layer wafer biscuit semi-finished product.

[0009] The method includes the following steps:

[0010] - On the first conveying surface, a first wafer substrate coated with an edible filling layer is delivered into a sandwich forming mold, and the first wafer substrate is positioned and held in the sandwich forming mold area.

[0011] - On the second conveying surface, the wafer cover sheet is delivered into the sandwich forming mold, and the wafer cover sheet is positioned and held above the sandwich forming mold area.

[0012] Then, looking in the direction of transport, bring the leading edge of the wafer cover into contact with the leading edge of the first wafer base sheet.

[0013] -Then the first wafer base sheet is transported away in the transport direction, wherein, during the transport of the first wafer base sheet, the wafer cover sheet, which is tilted toward the first wafer base sheet, is laid flat and overlapped on the first wafer base sheet or on the filling layer of the first wafer base sheet during the placement process.

[0014] During positioning and stopping, the wafer cover is moved along the second conveying surface until the wafer cover stops at the stop, and the area of ​​the first leading edge of the wafer cover is supported on the front support and the area of ​​the rear edge of the wafer cover is supported on the rear support.

[0015] The device has a sandwich forming mold for forming a wafer sandwich by overlapping a first wafer base sheet coated with an edible filling layer with a wafer cover sheet, wherein the sandwich forming mold includes the following components:

[0016] - A section of the first conveying surface for delivering and positioning a first wafer substrate coated with an edible filling layer within the sandwich forming mold area.

[0017] - A section of the second conveying surface is used to deliver the wafer cover sheet above the sandwich forming die area.

[0018] - A stopper, a front support, and a rear support are used to stop and position the wafer cover sheet above the sandwich molding die area.

[0019] Its features are,

[0020] - The rear support is adapted to support the area of ​​the rear edge of the wafer cover sheet.

[0021] - The front support is adapted to support the area of ​​the leading edge of the wafer cover sheet.

[0022] - A support moving device is provided, which is adapted to move the front support and bring the leading edge of the wafer cover into contact with the leading edge of the first wafer base sheet.

[0023] The apparatus according to the invention specifically includes a novel sandwich forming die adapted for forming wafer sandwiches, and makes it possible to increase production output in a relatively simple manner.

[0024] When appropriate, the equipment includes a new type of pressing station that makes it possible to increase output in a relatively simple way.

[0025] When appropriate, the equipment includes several conveying devices that make it possible to increase output in a relatively simple way.

[0026] Special methods for forming wafer sandwiches, stacking in pressing stations, and / or conveying various parts of semi-finished wafer biscuits also help to increase production in a relatively simple way.

[0027] Each of these measures individually contributes to optimization. However, individual components can also achieve the objectives of the invention independently of each other. In particular, a specified value of the invention is that the compaction station can perform more than 40 compaction operations per minute, preferably more than 50. This is achieved particularly by combining all the measures. However, in principle, individual measures can also be replaced with known, conventional measures.

[0028] This invention particularly relates to a method for forming a multi-layer wafer biscuit semi-finished product, comprising the following steps:

[0029] On the first conveying surface, a first wafer substrate coated with an edible filling layer is delivered into a sandwich forming mold, and the first wafer substrate is positioned and held in the sandwich forming area.

[0030] On the second conveying surface, the wafer cover sheet is delivered into the sandwich forming mold, and the wafer cover sheet is positioned and held above the sandwich forming area.

[0031] Then, looking in the direction of transport, bring the leading edge of the wafer cover sheet into contact with the leading edge of the first wafer substrate sheet, specifically by lowering the leading edge of the wafer cover sheet onto the leading edge of the first wafer substrate sheet.

[0032] Then, the first wafer base sheet is transported away in the transport direction, wherein, during the transport of the first wafer base sheet, wafer covering sheets tilted toward the first wafer base sheet are laid flat and overlapped on the first wafer base sheet or on the filling layer of the first wafer base sheet during the placement process.

[0033] When appropriate, the wafer cover is pressed toward the first wafer base sheet during placement, wherein the wafer cover is pressed toward the first wafer base sheet specifically by a targeted gas jet during placement.

[0034] When appropriate, the wafer cover is moved along the second conveying surface during positioning and stopping until the wafer cover stops at the stop. Preferably, the leading edge of the wafer cover is supported on the front support and the trailing edge of the wafer cover is supported on the rear support.

[0035] When appropriate, the wafer cover is positioned such that by removing the first wafer base, the wafer cover falls from the rear support and is laid flat and overlapped on the wafer base or the filling layer of the wafer base during placement.

[0036] When appropriate, the first wafer substrate is positioned and held at the position of the sandwich molding die by a sandwich transmission belt with positioning drive without a stopper.

[0037] When appropriate, the filling layer is applied to several wafer substrates on the first conveying surface in the filling placement device before the sandwich forming mold.

[0038] When appropriate, the wafer substrate is conveyed through the filling placement device to the ground and thereby the filling layer is coated onto the wafer substrate, which is a substantially continuous surface.

[0039] When appropriate, the wafer sandwich formed in the sandwich forming mold and at least one second wafer base sheet coated with a filling layer are conveyed on the first conveying surface to a pressing station arranged after the sandwich forming mold, in which...

[0040] This allows the wafer interlayer, particularly through a positioning-driven compression conveyor belt, to be positioned and held in the compression area without stops.

[0041] Then, the wafer sandwich is lifted by the pressure plate or at the pressure plate until the second wafer base sheet coated with the filling layer is positioned and held below the lifted wafer sandwich in the pressing area.

[0042] Then, during the pressing process, the wafer layers are laid flat and pressed together on the second wafer base sheet or the filling layer of the second wafer base sheet by a pressing plate.

[0043] When appropriate, the wafer interlayer, together with a second wafer base sheet coated with a filling layer that is adhered to the wafer interlayer through a pressing process, forms a component of the wafer biscuit semi-finished product.

[0044] Set it to, when appropriate.

[0045] The wafer biscuit semi-finished product component is lifted by the pressure plate or at the pressure plate until it is positioned and held below the lifted wafer biscuit semi-finished product component in the pressing area, where the third wafer base sheet coated with the filling layer is located.

[0046] Then, during the pressing process, the wafer biscuit semi-finished product components are laid flat and pressed onto the third wafer base sheet or the filling layer of the third wafer base sheet by a pressing plate.

[0047] When appropriate, the wafer interlayer, together with the wafer substrate adhered to the wafer interlayer through a pressing process, forms a component of the semi-finished wafer biscuit.

[0048] The wafer biscuit semi-finished product component is lifted by the pressure plate or at the pressure plate until it is positioned and held below the lifted wafer biscuit semi-finished product component in the pressing area, where the fourth wafer base sheet coated with the filling layer is located.

[0049] Then, during the pressing process, the wafer biscuit semi-finished product components are laid flat and pressed onto the fourth wafer base sheet or the filling layer of the fourth wafer base sheet by a pressing plate.

[0050] When appropriate, the wafer substrate is conveyed on the first conveying surface by several conveying devices arranged along the first conveying surface, wherein the conveying speed of a single conveying device is arranged such that in the region immediately preceding the sandwich forming mold:

[0051] The first gap, that is, the gap between the first wafer substrate and the second wafer substrate, is greater than [a certain value].

[0052] The second interval is the interval between the second wafer substrate and the third wafer substrate.

[0053] When appropriate, the conveying speed of a single conveyor is configured such that, in the area immediately preceding the compaction station:

[0054] The third gap, namely the gap between the wafer interlayer and the second wafer substrate, is essentially equivalent to...

[0055] The fourth interval is the interval between the second wafer substrate and the third wafer substrate.

[0056] In particular, the present invention relates to an apparatus for forming a multi-layer wafer biscuit semi-finished product, the apparatus having a sandwich forming mold for forming a wafer sandwich by overlapping a first wafer base sheet coated with an edible filling layer with a wafer cover sheet, wherein the sandwich forming mold includes the following components:

[0057] A section of the first conveying surface is used to deliver and position a first wafer substrate coated with an edible filling layer within the sandwich forming area.

[0058] The second conveying section is used to deliver the wafer cover sheet above the sandwich forming area.

[0059] Stoppers, front supports, and rear supports are used to hold and position the wafer cover sheet above the sandwich molding area.

[0060] In particular, the device according to the invention is suitable and / or adapted for performing the method according to the invention. Specifically, the method according to the invention is performed on the device according to the invention.

[0061] When appropriate, the rear support is adapted to support the area of ​​the rear edge of the wafer cover.

[0062] When appropriate, the front support is adapted to support the area of ​​the leading edge of the wafer cover.

[0063] When appropriate, a support moving device is provided, which is adapted to move the front support and bring the leading edge of the wafer cover into contact with the leading edge of the first wafer base sheet.

[0064] Where appropriate, the present invention relates to an apparatus having a pressing station for forming a semi-finished wafer biscuit component by pressing overlapping wafer layers onto a second wafer substrate coated with an edible filling layer.

[0065] When appropriate, it is configured to include a pressure plate and a pressure plate moving device.

[0066] When appropriate, the pressure plate moving device is adapted to lift the wafer interlayer positioned and held in the pressing area and, during the pressing process, lay it flat and press it onto a second wafer substrate coated with a filling layer, which is positioned and held below the lifted wafer interlayer in the pressing area.

[0067] When appropriate, several conveying devices are arranged along the first conveying surface for conveying the wafer substrate to the sandwich forming mold and the pressing station.

[0068] When appropriate, the conveying devices are configured to each include a conveyor belt or a conveyor belt.

[0069] When appropriate, the conveying devices are configured such that each is driven at a variable and / or settable speed by an asynchronous motor equipped with a frequency converter.

[0070] When appropriate, the conveying devices are each equipped with a detector for detecting the wafer substrate or wafer interlayer being conveyed onto the conveying device.

[0071] When appropriate, the control of the conveying device is configured to be performed via the central control unit of the device.

[0072] When appropriate, the sandwich forming die includes a sandwich conveyor belt with positioning drive for positioning the first wafer substrate without a stopper.

[0073] When appropriate, the pressing station includes a pressing conveyor belt with positioning drive for positioning the wafer interlayer and / or wafer substrate without a stopper.

[0074] When appropriate, a reverse support plate is provided below the upper return section of the pressing conveyor belt to form a reverse support during the pressing process.

[0075] The transport direction refers to the direction in which the wafer base sheet and wafer cover sheet are transported together away from the sandwich forming mold area or sandwich forming mold. Typically, the transport direction corresponds to the overall conveying direction of the equipment.

[0076] A filling layer is applied to the wafer base sheet in the filling placement device. Specifically, the filling layer is applied to all wafer base sheets in the filling placement device. Preferably, the wafer cover sheet is removed before the filling placement device and then delivered again in the jig forming mold after the filling placement device. Therefore, the wafer cover sheet does not have a filling layer.

[0077] In a sandwich forming mold, the leading edge of the wafer cover sheet is brought into contact with the leading edge of the wafer base sheet. Specifically, the leading edge of the wafer cover sheet is thus positioned on the filling layer of the wafer base sheet. Therefore, the areas of the leading edges of the two wafer sheets are adhered to each other by adhesive force. Thus, when the wafer base sheet is removed, the wafer cover sheet is also taken away with it. In this configuration, the wafer base sheet and the wafer cover sheet are initially arranged in a V-shape or wedge shape, with the apex of the V-shape or wedge pointing in the removal direction. In this case, the trailing edges of the wafer sheets are preferably spaced apart from each other. When the wafer base sheet is removed, the wafer cover sheet is placed on the wafer base sheet or on the filling layer of the wafer base sheet. In this case, different forces are applied to the wafer cover sheet. On one hand, the wafer cover sheet is pressed towards the wafer base sheet by movement and the wedge arrangement. Furthermore, the wafer cover sheet is preferably arranged above the wafer base sheet, whereby gravity also presses the wafer cover sheet onto the wafer base sheet. In addition, further force can be applied to one of the two wafers, for example, through an air nozzle or through a mechanical guide.

[0078] Various arrangements can be made to center the wafer cover sheet relative to the wafer base sheet. Preferably, the wafer base sheet is positioned in a sandwich-forming area. The sandwich-forming area substantially corresponds to the area of ​​the wafer base sheet at a predetermined position. This means that, taking tolerances into account, the wafer base sheet is positioned substantially precisely in the sandwich-forming area. In all embodiments, the sandwich-forming area is preferably defined as fixed in position or machine-fixed. In particular, a positioning accuracy of less than 2 mm, preferably less than 1 mm, can be provided along the transport direction.

[0079] The wafer cover sheet is preferably positioned above the wafer base sheet with the same precision. To position the wafer cover sheet, a stop is preferably provided at which the wafer cover sheet rests, achieving sufficiently precise positioning. Preferably, in this position, the leading edge region of the wafer cover sheet is supported on a front support and the trailing edge region on a rear support. Movement of the front support, particularly by removing the front support, brings the leading edge of the wafer cover sheet into contact with the leading edge of the wafer base sheet. Preferably, the leading edge of the wafer cover sheet is lowered onto the leading edge of the wafer base sheet. In particular, the rear support is designed such that while supporting the wafer cover sheet is possible, it does not impede the movement of the wafer cover sheet in the removal direction. Therefore, by removing the wafer base sheet, the wafer cover sheet falls from the rear support, allowing it to be placed on the wafer base sheet or on the filling layer of the wafer base sheet.

[0080] The positioning of the wafer substrate in the sandwich forming area is preferably performed without stops by a sandwich conveyor belt implemented as a positioning belt, i.e., a specially implemented conveyor belt for the sandwich forming mold. Preferably, a detector, such as a grating, is provided that transmits a signal containing information about the position or a specific point in time at a given position to the control device of the sandwich conveyor belt or the equipment control device. Furthermore, the sandwich conveyor belt preferably includes a positioning drive that enables precise positioning of the wafer substrate. This positioning drive can be, for example, a servo drive or other positioning drive subject to open-loop or closed-loop control. Where appropriate, the position drive can be an asynchronous motor with an encoder having sufficiently high resolution.

[0081] Positioning without stops specifically refers to positioning without mechanical stops or guards, preferably solely by means of a conveyor belt. Precise positioning of the wafer substrate without stops eliminates the need for components such as retractable guards.

[0082] Preferably, several conveying devices are arranged along the first conveying surface. These conveying devices can operate at different conveying speeds to position individual wafer substrates relative to each other. Specifically, the first wafer substrate (which is covered with a wafer cover sheet in the wafer forming mold to form a wafer sandwich) is accelerated before the sandwich forming mold such that the first interval is greater than the second interval. In particular, the first distance is chosen to be so large that at the current conveying speed, there is sufficient time for the first wafer cover sheet to remain and form the wafer sandwich. During the formation of the wafer sandwich, subsequent wafer substrates can preferably continue to be conveyed substantially uniformly. However, during this conveying process, the position of subsequent wafer substrates relative to each other, and especially their position relative to the wafer sandwich, can be adjusted. This adjustment is also made by selecting or changing the speed of the individual conveying devices.

[0083] When appropriate, the spacing of the conveyed wafer substrates can be understood as spatial isolation. However, in principle, the choice of spacing mainly involves time intervals or time delays, through which individual wafers reach specific areas of the equipment.

[0084] Preferably, at least one or two conveying devices are provided after the sandwich forming mold. These conveying devices allow the wafer sandwich to be positioned relative to subsequent wafer substrates, which are stacked in a pressing station to form wafer biscuit components or wafer biscuit semi-finished products.

[0085] The pressing station preferably includes a pressure plate adapted and / or configured to lift and lower the wafer sandwich onto a subsequent wafer base sheet or a filling layer of the wafer base sheet during descent. The movement of the pressure plate is preferably synchronized with the conveying of the wafer base sheet along a first conveying surface, such that the descent of the wafer sandwich or wafer biscuit semi-finished component held on the pressure plate can be carried out substantially without downtime or with minimal downtime. The timing control of the pressure plate movement preferably does not rely on sensors that directly probe the wafer base sheet in the pressing area. Instead, the components for forming the wafer biscuit semi-finished product, particularly the wafer sandwich and one or more wafer base sheets, are delivered to the pressing station in a time-optimized manner, thereby minimizing downtime.

[0086] Preferably, a pressing conveyor belt is provided for positioning and holding the wafer substrate in the pressing area. Preferably, the holding and positioning of the wafer substrate in the pressing area is also performed without stops. The pressing area substantially corresponds to the dimensions of the wafer substrate, with possible tolerances also taken into account. In particular, a positioning accuracy of less than 2 mm, especially less than 1 mm, along the conveying direction can be achieved. The pressing conveyor belt can adopt the same design as a sandwich conveyor belt. However, the pressing conveyor belt may also include a reverse support plate below the upper return section or upper section, which acts as a counter-support for absorbing the forces of the pressing station or pressure plate. Preferably, the pressing station is adapted for calibrating the wafer biscuit semi-finished product. This specifically means compressing the wafer biscuit semi-finished product to a height corresponding to a predetermined height of the wafer biscuit semi-finished product. Therefore, all wafer biscuit semi-finished products produced can be calibrated to substantially the same height.

[0087] The pressing conveyor belt preferably includes a positioning drive that enables precise positioning of the wafer substrate. This positioning drive can be, for example, a servo drive or other positioning drive subject to open-loop or closed-loop control. Where appropriate, the position drive can be an asynchronous motor with an encoder having sufficiently high resolution.

[0088] Preferably, each conveying device includes a detector. Preferably, the interlayer conveyor includes a detector. Preferably, the pressing conveyor includes a detector. These detectors are adapted and / or configured to provide signals that give positional information about the conveyed wafer substrate. Therefore, the speed of a single drive can be controlled or regulated to position the wafer substrate during movement or in a stationary state, and to position the wafer interlayer where appropriate. Attached Figure Description

[0089] The invention is further described below with the aid of the accompanying drawings.

[0090] Figure 1 A schematic side view of the components of an apparatus for forming semi-finished wafer biscuits is shown.

[0091] Figure 2 , 3 Figures 4 and 5 show the components of a sandwich molding die in different orientations, and the method steps for forming a wafer sandwich.

[0092] Figure 5 A schematic view of the components of the compaction station is shown.

[0093] Figure 6 A schematic diagram showing the movement of a single component of the device is shown.

[0094] Unless otherwise specified, the reference numerals in the accompanying drawings correspond to the following features: 1. Semi-finished wafer biscuit, 2. Wafer base sheet, 3. First conveying surface, 4. Sandwich forming mold, 5. Sandwich forming mold area, 6. Wafer cover sheet, 7. Second conveying surface, 8. Direction of transport, 9. Leading edge (of the wafer cover sheet), 10. Rear edge (of the wafer cover sheet), 11. Leading edge (of the wafer base sheet), 12. Gas jet, 13. Stopper, 14. Front support, 15. Rear support, 16. Sandwich conveyor belt, 17. Filling placement device, 18. Pressing area, 19. Press plate, 20. Wafer sandwich, 21. Semi-finished wafer biscuit component, 22. Conveying device, 23. First interval, 24. Second interval, 25. Third interval, 26. Fourth interval, 27. Support moving device, 28. Press plate moving device, 29. Control device, 30. Pressing conveyor belt, 31. Reverse support plate, 32. Detector, 33. Pressing station. Detailed Implementation

[0095] Figure 1A schematic side view of an apparatus for forming a semi-finished wafer biscuit 1 is shown. A filling placement device 17, a sandwich forming mold 4, and a pressing station 33 are arranged along a first conveying surface 3. The first conveying surface 3 is formed segmentally by a conveying device 22, specifically by conveying devices 22a to 22f in this embodiment. Alternatively, the first conveying surface 3 can also be formed segmentally by other components. In the region of the sandwich forming mold 4, the first conveying surface 3 is formed, for example, by a sandwich conveyor belt 16. In the region of the pressing station 33, the first conveying surface 3 is formed, for example, by a pressing conveyor belt 30.

[0096] The device includes a second conveying surface 7. The second conveying surface 7 is at least segmentally parallel to or adjacent to the first conveying surface 3, and leads into or to the sandwich forming mold 4. Production begins at baking apparatuses of this type used for producing wafer biscuits, from which wafer sheets are typically output at fixed intervals. These wafer sheets are then mostly cooled and conveyed to the device via one or more conveying devices 22. Depending on the number of wafer layers to be formed in the wafer biscuit semi-finished product 1, a wafer sheet is removed at fixed intervals and transported as a wafer cover sheet 6 along the second conveying surface 7 to the sandwich forming mold 4 to form a wafer sandwich 20. All other wafer sheets are conveyed along the first conveying surface 3 to the filling placement device 17 to form the wafer base sheet 2. Preferably, several, at least two, conveying devices 22 are arranged along the first conveying surface 3 before the filling placement device 17. Preferably, the speeds of these conveying devices 22 are selected such that the wafer base sheets 2 are placed face-to-face within the area of ​​the filling placement device 17, thereby forming a substantially continuous surface. A continuous layer of filling, particularly edible material, can then be applied to the continuous surface. Specifically, this operation can be performed via a so-called butter spreader or via a coating machine that continuously outputs a thin film of butter. Alternatively, the filling placement device 17 can also be designed such that the filling is applied separately, non-adjacent to the wafer substrate 2. Specifically, the filling placement device 17 can be designed as a conventional filling placement device 17. Several filling placement devices 17 may also be provided where appropriate.

[0097] After the filling placement device 17, the wafer base sheet 2 coated with the filling layer is continued to be conveyed along the first conveying surface 3 to the sandwich forming mold 4. In particular, the conveying device 22 is operated such that, in this embodiment, the conveying devices 22a, 22b and 22c are operated such that the wafer base sheets 2 are again spaced apart from each other, especially the wafer base layers 2 are conveyed spaced apart from each other along the first conveying surface 3.

[0098] Typically, the semi-finished wafer biscuit 1 to be formed has three to five wafer layers made of wafer sheets. If the semi-finished wafer biscuit 1 to be formed only has three wafer layers, then the wafer interlayer 20 is already the semi-finished wafer biscuit 1.

[0099] exist Figure 1 In this embodiment, for example, a wafer biscuit semi-finished product 1 with four wafer sheets and therefore three filling layers is formed. For this purpose, the first wafer base sheet 2', the second wafer base sheet 2'', and the third wafer base sheet 2''' are sequentially conveyed toward the sandwich forming mold 4. As the fourth wafer sheet, the wafer covering sheet 6 is conveyed to the sandwich forming mold 4 via the second conveying surface 7. The wafer base sheets 2 have a certain interval between each other in the region before the sandwich forming mold 4. A first interval 23 is provided between the first wafer base sheet 2' and the second wafer base sheet 2''. A second interval 24 is provided between the second wafer base sheet 2'' and the third wafer base sheet 2'''. Now, in this region, the conveying devices 22, particularly conveying devices 22a, 22b, and 22c, preferably operate such that the first interval 23 is larger than the second interval 24.

[0100] Specifically, the spacing of the conveyed wafer substrate 2 can be understood as spatial isolation. However, in principle, the choice of spacing mainly involves the time interval between the arrival of a single wafer at the sandwich forming mold 4 and / or the pressing station 33.

[0101] The first interval 23 is specifically chosen before the sandwich forming mold 4 to allow sufficient time for the wafer substrate 2' to remain in the sandwich forming mold 4 and form the wafer sandwich 20. During the formation of the wafer sandwich 20, subsequent wafer substrates 2'' and 2''' can continue to be fed.

[0102] Specifically, the first interval 23 can be selected such that the formed wafer sandwich 20, the second wafer substrate 2'' and the third wafer substrate 2''' have substantially the same interval between each other after the sandwich forming mold 4.

[0103] In order to form the wafer sandwich 20, in this embodiment, only the wafer cover sheet 6 is used to cover the first wafer base sheet 2'. The second wafer base sheet 2'' and the third wafer base sheet 2''' are conveyed through or past the sandwich forming mold 4, but the sandwich is not formed.

[0104] Therefore, the wafer sandwich 20, along with the subsequent second wafer base sheet 2'' and third wafer base sheet 2''', is conveyed along the first conveying surface 3 after the sandwich forming mold 4. Each of the wafer base sheets 2 is coated with a filling layer.

[0105] For embodiments that require more or fewer layers to form the wafer biscuit semi-finished product 1, the number of wafer base sheets 2 is changed in a similar manner.

[0106] In the pressing station 33, the wafer sandwich 20 is held and lifted from the first conveying surface 3 by the pressure plate 19 or at the pressure plate 19. Simultaneously or subsequently, the second wafer base sheet 2'' is positioned and held below the pressure plate 19, thereby also being positioned and held below the lifted wafer sandwich 20 in the pressing area 18. Subsequently, the pressure plate 19 lowers the wafer sandwich 20 onto the second wafer base sheet 2'' coated with the filling layer and presses the wafer sandwich 20 onto the filling layer. This results in the second wafer base sheet 2'' being connected to the wafer sandwich 20, becoming the wafer biscuit semi-finished product component 21. Subsequently, the pressure plate 19 of the pressing station 33 is lifted again to deliver the third wafer base sheet 2''' and connect it to the wafer biscuit semi-finished product component 21 provided at the pressure plate 19 in a similar manner.

[0107] If the wafer biscuit semi-finished product 1 has been formed and preferably calibrated, it is placed on the first conveyor surface 3. Then, the wafer biscuit semi-finished product 1 can be transported away along the first conveyor surface 3.

[0108] The conveying devices 22, particularly 22d and 22e, are preferably operated before the pressing station 33 such that the wafer interlayer 20 and the wafer base layer 2 are delivered to the pressing station 33 in an optimized manner in time. The third interval 25, that is, the interval between the wafer interlayer 20 and the second wafer base layer 2'', is substantially equivalent to the fourth interval 26, that is, the interval between the second wafer base layer 2'' and the third wafer base layer 2'''.

[0109] Where appropriate, other workstations may also be provided at the equipment, such as a cutting station for cutting or separating the semi-finished wafer biscuit 1 into wafer biscuit bars. Where appropriate, a packaging machine may be provided to package the formed wafer biscuit products.

[0110] In all embodiments, the conveying device 22, specifically conveying devices 22a to 22f, may include an asynchronous motor with a frequency converter as the drive. To control and / or regulate the speed of the conveying device 22, particularly to select the interval between individual wafer substrates 2, several detectors 32 are preferably provided in all embodiments. Specifically, each conveying device 22 includes a detector 32, or each conveying device 22 is assigned a detector 32. Preferably, the detector 32 is a sensor, particularly an optical sensor, such as a grating. The detector 32 preferably acquires a signal that provides information about when the wafer substrate 2 is in a specific position. Where appropriate, the speed of the wafer substrate 2 can also be determined via the duration of grating detection or interruption. However, additionally or alternatively, the speed signal can also be determined based on data from the drive of the respective conveying device 22.

[0111] Preferably, each conveying device 22 includes a detector 32, which together with the conveying device 22 forms a control technology unit so as to enable time control of the movement of the wafer substrate 2.

[0112] Figure 2 , 3 Figures 4 and 4 show sandwich forming molds 4 in different orientations. In principle, the sandwich forming mold 4 is adapted to form a wafer sandwich 20. The wafer sandwich 20 is a wafer biscuit semi-finished product 1 or a wafer biscuit semi-finished product component 21, consisting of a wafer base sheet 2, a filling layer coated on the wafer base sheet 2, and a wafer cover sheet 6 covering the filling layer on the wafer base sheet 2. In all embodiments, the filling layer can be arranged in a flat, partial, or dotted manner on the wafer base sheet. The wafer base sheet 2 and the wafer cover sheet 6 are overlapped in a substantially overlapping manner, with the filling layer disposed between the wafer base sheet 2 and the wafer cover sheet 6. To form the wafer sandwich 20, the wafer base sheet 2 coated with the filling layer is conveyed along a first conveying surface 3 into the sandwich forming mold 4. In this embodiment, the sandwich forming mold 4 includes a sandwich conveyor belt 16. The sandwich conveyor belt 16 is adapted and / or configured to position and hold the wafer base sheet 2 in the sandwich forming die area 5 without a stop. The sandwich forming die area 5 substantially corresponds to an area having the same size as the wafer base sheet 2, wherein certain tolerances are accepted during positioning. In particular, when positioning the wafer base sheet 2 along the first conveyor surface 3, the positioning accuracy should be less than 5 mm, preferably less than 2 mm, and particularly preferably less than 1 mm. Simultaneously, before or after this, the wafer cover sheet 6 is delivered via the second conveyor surface 7. The wafer cover sheet 6 is positioned and held precisely above the sandwich forming die area 5 and, where appropriate, above the wafer base sheet 2 in that area. In this embodiment, the wafer cover sheet 6 is conveyed along the second conveyor surface 7 into the sandwich forming die 4 until the wafer cover sheet stops at or within the stop 13. In all embodiments, the stop 13 may be a stop, pin, overlap plate, corner piece, or similar element. In this position, the wafer cover 6 is then brought into contact with the wafer substrate 2, specifically by lowering the wafer cover onto the wafer substrate 2 to form the wafer interlayer 20.

[0113] In this embodiment, a front support 14 and a rear support 15 are provided. For example... Figure 2 As shown, the front region or leading edge 9 of the wafer cover 6 is supported on the front support 14. The rear edge 10 of the wafer cover 6 is supported on the rear support 15. From Figure 3As can be seen, in the next step, the leading edge 9 of the wafer cover sheet 6 is brought into contact with the leading edge 11 of the wafer base sheet 2, specifically by placing the leading edge 9 of the wafer cover sheet 6 on the filling layer of the wafer base sheet 2. Therefore, the wafer base sheet 2 and the wafer cover sheet 6 have a V-shaped or wedge-shaped arrangement in this posture. In this embodiment, the leading edge 9 of the wafer cover sheet 6 is brought into contact with the leading edge 11 of the wafer base sheet 2, specifically by moving the front support 14 via the support moving device 27.

[0114] In this embodiment, several front supports 14 are provided along the conveyor belt of the support moving device 27. This conveyor belt can be moved by a drive. When appropriate, the front supports 14 are already hooked below the leading edge 9 of the wafer cover 6 when the wafer cover 6 is delivered to the stop 13 and before the wafer cover 6 is delivered to the stop. Here, during the continued feeding of the wafer cover 6 into the area above the sandwich molding die area 5, the leading edge 9 of the wafer cover 6 is already supported on the movably arranged front supports 14.

[0115] Subsequently, the wafer cover 6 is precisely positioned such that it rests against the stopper 13. However, if appropriate, the front support 14 can be moved or the support movement device 27 can be controlled according to its position to achieve accurate positioning above the sandwich molding die area 5. In principle, any technical device that makes it possible to precisely position the wafer cover 6 above the sandwich molding die area 5 can be used alternatively.

[0116] In this embodiment, the front support 14 continues to move, while the wafer cover 6 remains abutting the stop 13. Therefore, the wafer cover 6 or its leading edge 9 disengages from the front support 14 and is thus no longer supported from below by the front support. Therefore, as... Figure 3 As shown, the leading edge 9 of the wafer cover 6 rests on the leading edge 11 of the wafer substrate 2. This movement can be supported by mechanical or pneumatic force where appropriate. Specifically, a gas jet 12 can be used to press the wafer cover 6 toward the wafer substrate 2.

[0117] Figure 4 Another configuration of the sandwich forming mold 4 is shown. In this step, the wafer base sheet 2 is moved away along the transport direction 8 by operating the sandwich conveyor belt 16. Since at least one edge of the wafer cover sheet 6 is positioned on the wafer base sheet 2, as... Figure 3 As shown, the wafer cover sheet 6 is pulled along by the wafer base sheet 2, and then the wafer cover sheet is laid flat and overlapped on the wafer base sheet 2 or on the filling layer of the wafer base sheet. This movement can be supported, for example, by a gas jet 12. However, a V-shaped or wedge-shaped arrangement, and especially an inclined state of the wafer cover sheet 6 relative to the transport direction 8, is also helpful.

[0118] exist Figure 4 In this position, the next front support 14 may have already hooked the next wafer cover 6 to support the leading edge 9.

[0119] Here, the detector 32 used to detect the wafer substrate 2 helps to achieve precise positioning of the wafer substrate 2 on the interlayer conveyor belt 16 without a stopper.

[0120] If the wafer sandwich 20 has been formed, then the wafer sandwich continues to be transported in the transport direction 8. If another layer is to be placed on the wafer sandwich 20 to form a wafer biscuit semi-finished product 1, it is preferably arranged such that at least the subsequent wafer base sheet 2 coated with the filling layer is conveyed through or past the sandwich forming mold 4 without placing the wafer cover sheet 6. In the pressing station 33, more layers can be stacked with the wafer sandwich 20. The pressing station 33 can be based on the prior art or according to Figure 5 To carry out the design.

[0121] Figure 5 One embodiment of the clamping station 33 is shown. This clamping station can be used with... Figure 1 Equipment and according to Figures 2 to 4 The clamping station 33 is combined with the sandwich molding die 4. However, in principle, the clamping station 33 can also be used alone or in combination with a conventional sandwich molding die 4 or conventional equipment. The clamping station 33 includes a pressure plate 19, which can be moved, particularly up and down, via a pressure plate moving device 28. For this purpose, the pressure plate moving device 28 may include, for example, a linear drive for moving the pressure plate 19 and a guide device for guiding, particularly parallel guiding, the pressure plate 19.

[0122] The pressure plate 19 is adapted and / or configured to lift the wafer sandwich 20 from the pressing conveyor belt 30. Specifically, a first wafer substrate 2' (not shown) is conveyed in the pressing area 18 of the pressing station 33. The pressing area 18 substantially corresponds to the size of the wafer sandwich 20 or the wafer substrate 2, wherein certain positional tolerances are accepted. Specifically, the pressing conveyor belt 30 is adapted and / or configured to enable a positional accuracy of less than 5 mm, preferably less than 2 mm. The wafer sandwich 20, formed in the sandwich forming die 4, is conveyed along the first conveying surface 3 into the pressing area 18, and the wafer sandwich is positioned and held in the pressing area. Positioning and holding are preferably performed by the pressing conveyor belt 30 without a stopper. The pressing conveyor belt preferably includes a positioning drive that enables precise positioning.

[0123] Subsequently, the pressure plate 19 of the pressing station 33 is lowered onto the wafer sandwich 20. The wafer sandwich 20 is held at the pressure plate 19, and the pressure plate 19 is lifted again via the pressure plate moving device 28. Thus, the wafer sandwich 20 is also lifted from the first conveying surface 3.

[0124] As in this embodiment, the wafer interlayer 20 can be held in place by a pressure plate 19, which is implemented as a vacuum plate. A vacuum source communicates with several holes in the pressure plate 19, wherein these holes are at least partially closed by the wafer interlayer 20. The negative pressure thus holds the wafer interlayer 20 in place by the pressure plate 19.

[0125] During or after lifting, a second wafer base sheet 2'' (not shown) coated with a filling layer is delivered along the first conveying surface 3, positioning and holding it in the pressing area 18. In the next step or simultaneously, the pressure plate moving device 28 lowers the pressure plate 19 and the wafer interlayer 20 held at the pressure plate onto the subsequent second wafer base sheet 2''. Thus, the wafer interlayer 20 is placed on the filling layer of the second wafer base sheet 2'' and pressed. The wafer interlayer 20 and the pressed second wafer base sheet 2'' together form the wafer biscuit semi-finished component 21. In the next step, this wafer biscuit semi-finished component is lifted from the first conveying surface 3, and another third wafer base sheet 2''' can be placed on the wafer biscuit semi-finished component 21 in a similar manner.

[0126] If the required number of layers has been produced in advance, then the wafer biscuit semi-finished product 1 is formed and can be placed on the first conveyor surface 3 by the pressure plate 19 and transported away.

[0127] When pressing the components held at the pressure plate 19, the height of the wafer semi-finished component 21, but primarily the wafer semi-finished product 1, is preferably calibrated. Intermediate calibration can be performed during the processing of the intermediate layers. Particularly during the final stroke, i.e., during the final pressing of the wafer semi-finished component 21 or wafer interlayer 20 onto the final wafer substrate 2, the pressure plate 19 moves precisely in the direction of the first conveyor surface 3, thereby compressing the wafer semi-finished product 1 to a predetermined height. A reverse support plate 31 is provided as a counter-support for the force exerted by the pressure plate 19. This reverse support plate is preferably arranged below the upper return section of the pressing conveyor belt 30 and placed laterally on the machine frame for sufficient stability.

[0128] Figure 6A schematic diagram illustrating the time synchronization or movement of the components of the wafer biscuit semi-finished product 1 is shown. The rows in the diagram list the conveyor device 22 arranged along the first conveyor surface 3, as well as the interlayer conveyor belt 16 and the pressing conveyor belt 30. The last row relates to the movement of the pressure plate moving device 28. The columns correspond to time segments, namely the so-called time periods S1 to S8. The individual diagrams in these rows are speed diagrams, except that the bottom row, instead of a speed diagram, shows a diagram indicating the height of the pressing station 33.

[0129] During time period S1, the first wafer substrate 2' is first conveyed on the first conveying device 22a. During this period, the conveying speed of the first conveying device 22a is briefly increased.

[0130] During time period S2, the first wafer substrate 2' is located on the second conveying device 22b, and the second wafer substrate 2'' is located on the first conveying device 22a.

[0131] During time period S3, the first wafer substrate 2' is located on the third conveying device 22c, the second wafer substrate 2'' is located on the second conveying device 22b, and the third wafer substrate 2''' is located on the first conveying device 22a.

[0132] During time ranges S2 and S3, the speed of the first conveying device 22a is reduced for a short period of time to increase the interval between the first wafer substrate 2' and the second wafer substrate 2''. In addition, the interval between the second wafer substrate 2'' and the third wafer substrate 2''' is also increased due to the longer delay in time range S3.

[0133] For example, the spacing between the wafer substrates 2 can be verified and corrected by using detectors 32 arranged between the conveying devices 22.

[0134] On the second conveying device 22b shown in the second row, when the first wafer substrate 2' is conveyed on the second conveying device 22b, the speed is briefly increased within a second time range. This brief increase in conveying speed further increases the interval between the first wafer substrate 2' and subsequent wafer substrates 2'' and 2'''. In time ranges S3 and S4, in this embodiment, the two wafer substrates 2'' and 2''' are only slightly decelerated in order to set accurate positioning or accurate desired intervals relative to each other and relative to the first wafer substrate 2'.

[0135] The desired timing cycle can be set by accelerating or decelerating the individual wafer substrates 2 on the conveyor 22.

[0136] In this embodiment, a third conveying device 2c is provided before the sandwich forming mold 4. On this third conveying device, the first wafer substrate 2' is accelerated again to further increase the interval with the subsequent two wafer substrates 2'' and 2'''. If the subsequent two wafer substrates 2'' and 2''' are correctly set in terms of time synchronization, further speed adjustments via the conveying device 22c during time periods S4 and S5 are no longer required.

[0137] In this embodiment, the timing adjustment of the wafer substrate 2 is performed via three conveying devices 22, specifically conveying devices 22a, 22b, and 22c. Where appropriate, it is sufficient to set one or two conveying devices 22 before the sandwich forming mold 4 to establish the required timing or positional rhythm of the wafer substrate 2.

[0138] In the next step, specifically during time period S4, the first wafer substrate 2' is positioned and held on the interlayer conveyor belt 16. Therefore, for a certain period, the speed of the first wafer substrate 2' is zero. Simultaneously, other wafer substrates 2'' and 2''' continue to be conveyed on conveyor devices 22c and 22b during time period S4. After the time used to form the wafer interlayer 20, the wafer interlayer continues to be conveyed by the interlayer conveyor belt 16 at a non-zero speed. During time period S5, the wafer interlayer 20 is further accelerated on the fourth conveyor device 22d to increase the interval with subsequent wafer substrates 2'' and 2'''. In this embodiment, these wafer substrates are conveyed at a constant speed on conveyor device 22c and interlayer conveyor belt 16 during time period S5. As can be seen from time periods S5 and S6, subsequent wafer substrates are not held on the interlayer conveyor belt 16, but are conveyed at a constant speed.

[0139] When appropriate, a fifth conveying device 22e may also be provided, such as Figure 1 As shown, or more conveying devices 22, so that further synchronization of these components is possible.

[0140] In this embodiment, the wafer interlayer 20 is positioned and held on the pressing conveyor belt 30. In the next step, the pressure plate moving device 28 is operated to lower the pressure plate 19 onto the wafer interlayer 20, lifting the wafer interlayer 20 by the upward movement of the pressure plate 19 and the pressure plate moving device 28. In this embodiment, this process occurs during time periods S6 and S7. During this period, two subsequent wafer substrates 2'' and 2''' continue to be conveyed, particularly continuously, on the conveying device 22 and the interlayer conveyor belt 16. Then, during time periods S7 and S8, the second wafer substrate 2'' and the third wafer substrate 2''' are also positioned and held by the pressing conveyor belt 30 so that they are stacked by the pressing station 33, more specifically, by the pressure plate moving device 28, via the pressing plate 19 to form the wafer biscuit semi-finished product 1.

Claims

1. A method for forming a multi-layer wafer biscuit intermediate product (1), said method comprising the following steps: - on a first conveying plane (3), delivering a first wafer base sheet (2') coated with a layer of edible filling into a sandwich forming die (4) and positioning and resting said first wafer base sheet (2') in a sandwich forming die area (5), - on a second conveying plane (7), delivering a wafer cover sheet (6) into said sandwich forming die (4) and positioning and resting said wafer cover sheet (6) above said sandwich forming die area (5), - then, bringing a first leading edge (9) of said wafer cover sheet (6) into contact with a second leading edge (11) of said first wafer base sheet (2') as seen in a direction of transport (8) away, - then transporting the first wafer base sheet (2') away in the transport-away direction (8), wherein - during said transport of said first wafer base sheet (2') away, laying said wafer cover sheet (6) tilted in a direction of said first wafer base sheet (2') in a laying process coincidentally on said first wafer base sheet (2') or on a filling layer of said first wafer base sheet, - wherein said wafer cover sheet (6) is moved along said second conveying plane (7) in a positioning and resting process until said wafer cover sheet is parked at a stopper (13) and an area of said wafer cover sheet's first leading edge (9) is supported on a front support (14) and an area of said wafer cover sheet's trailing edge (10) is supported on a rear support (15).

2. The method of claim 1, wherein, - in said laying process, pressing said wafer cover sheet (6) in a direction towards said first wafer base sheet (2').

3. The method according to claim 1 or 2, characterized in that, - by said transport of said first wafer base sheet (2') away, dropping said wafer cover sheet (6) from said rear support (15) and laying said wafer cover sheet coincidentally on said first wafer base sheet (2') or on a filling layer of said first wafer base sheet in said laying process.

4. The method according to claim 1 or 2, characterized in that, - positioning and resting said first wafer base sheet (2') at a sandwich forming die position without a stopper by means of a sandwich conveyor belt (16) with a positioning drive.

5. The method according to claim 1 or 2, characterized in that - before said sandwich forming die (4), in a filling laying device (17), applying a layer of filling to several wafer base sheets on said first conveying plane (3).

6. The method of claim 1 or 2, wherein, - on said first conveying plane (3), transporting a wafer sandwich (20) formed in said sandwich forming die (4) and at least one second wafer base sheet (2'') coated with a layer of filling to a compacting station (33) arranged after said sandwich forming die (4), in which - said wafer sandwich (20) is positioned and rested in a compacting area (18) without a stopper by means of a compacting conveyor belt (30) with a positioning drive, - then lifting said wafer sandwich by a press plate (19) or at said press plate until said second wafer base sheet (2'') coated with said layer of filling is positioned and rested under said wafer sandwich (20) lifted in said compacting area (18). - the wafer sandwich (20) is then laid down and pressed in register by means of the presser plate (19) on the second wafer base sheet (2'') or on the filling layer of the second wafer base sheet during the pressing process, 7. The method of claim 6, wherein, - the wafer sandwich (20) together with the second wafer base sheet (2'') coated with the filling layer adhered at the wafer sandwich (20) by means of the pressing process forms a wafer biscuit semi-finished product component (21), and - the wafer biscuit semi-finished product component (21) is lifted by means of the presser plate (19) or at the presser plate until a third wafer base sheet (2''') coated with a filling layer is positioned and rests under the lifted wafer biscuit semi-finished product component (21) in the pressing region (18), - the wafer biscuit semi-finished product component is then laid down and pressed in register by means of the presser plate (19) on the third wafer base sheet (2''') or on the filling layer of the third wafer base sheet during the pressing process, and, if appropriate: - the wafer sandwich (20) together with the wafer base sheet adhered at the wafer sandwich (20) by means of the pressing process forms a wafer biscuit semi-finished product component (21), and - the wafer biscuit semi-finished product component (21) is lifted by means of the presser plate (19) or at the presser plate until a fourth wafer base sheet coated with a filling layer is positioned and rests under the lifted wafer biscuit semi-finished product component (21) in the pressing region (18), - the wafer biscuit semi-finished product component is then laid down and pressed in register by means of the presser plate (19) on the fourth wafer base sheet or on the filling layer of the fourth wafer base sheet.

8. The method of claim 7, wherein, On the first conveying plane (3) wafer base sheets are conveyed by several conveying devices (22) arranged along the first conveying plane (3), wherein the conveying speed of the conveying devices (22) is set such that in the region directly before the sandwich forming die (4): - a first spacing (23), i.e. the spacing between the first wafer base sheet (2') and the second wafer base sheet (2''), is greater than - a second spacing (24), i.e. the spacing between the second wafer base sheet (2'') and the third wafer base sheet (2''').

9. The method according to claim 8, wherein the conveying speed of the conveying devices (22) is set such that in the region directly before the pressing station (33): - a third spacing (25), i.e. the spacing between the wafer sandwich (20) and the second wafer base sheet (2''), is essentially equal to - a fourth spacing (26), i.e. the spacing between the second wafer base sheet (2'') and the third wafer base sheet (2''').

10. The method of claim 1, wherein, The first leading edge (9) of the wafer cover sheet (6) is lowered onto the second leading edge (11) of the first wafer base sheet (2').

11. The method of claim 2, wherein, During the placing process the wafer cover sheet (6) is pressed in the direction of the first wafer base sheet (2') by means of a targeted gas jet (12).

12. The method of claim 5, wherein, The wafer base sheet is conveyed butt-joint-wise through the filling placement device (17) and is thereby coated with a filling layer as a substantially continuous surface.

13. An apparatus for forming a multi-layer wafer biscuit intermediate (1), said apparatus having a sandwich forming die (4) for forming a wafer sandwich (20) by coincidentally covering a first wafer base sheet (2') coated with an edible filling layer with a wafer cover sheet (6), wherein the sandwich forming die (4) comprises the following components: - a section of a first conveying plane (3) for delivering and positioning and resting a first wafer base sheet (2') coated with an edible filling layer in a sandwich forming die area (5), - a section of a second conveying plane (7) for delivering a wafer cover sheet (6) above the sandwich forming die area (5), - a stopper (13), a front support (14) and a rear support (15) for resting and positioning the wafer cover sheet (6) above the sandwich forming die area (5), characterized in that - the rear support (15) is adapted to support an area of a rear edge (10) of the wafer cover sheet (6), - the front support (14) is adapted to support an area of a first front edge (9) of the wafer cover sheet (6), - a support movement device (27) is provided, which is adapted to move the front support (14) and to bring the first front edge (9) of the wafer cover sheet (6) into contact with a second front edge (11) of the first wafer base sheet (2').

14. The apparatus according to claim 13, having a compacting station (33) for forming a wafer biscuit intermediate component (21) by coincidentally laying flat and compacting the wafer sandwich (20) on a second wafer base sheet (2") coated with an edible filling layer, characterized in that - a press plate (19) and a press plate movement device (28) are provided, - the press plate movement device (28) is adapted to lift the wafer sandwich (20) positioned and resting in a compacting area (18) and to lay flat and compact the wafer sandwich coincidentally on a second wafer base sheet (2") coated with a filling layer during the compacting process, the second wafer base sheet being positioned and resting below the lifted wafer sandwich (20) in the compacting area (18).

15. The apparatus according to claim 14, characterized in that - several conveying devices (22) are provided along the first conveying plane (3) for conveying wafer base sheets to the sandwich forming die (4) and to the compacting station (33), - the conveying devices (22) each comprise a conveyor belt or a conveyor band, - the conveying devices (22) each are driven with a variable or selectable speed by an asynchronous motor with a frequency converter, - the conveying devices (22) each have a detector (32) for detecting a wafer base sheet or a wafer sandwich (20) conveyed onto the conveying device (22). - the control of the conveying device (22) is effected via the central control device (29) of the apparatus, if appropriate.

16. The apparatus according to one of claims 13 to 15, characterized in that The sandwich forming die (4) comprises a sandwich conveyor (16) with a positioning drive for positioning the first wafer base sheet (2') without a stop.

17. The apparatus according to claim 14 or 15, characterized in that - the pressing station (33) comprises a pressing conveyor (30) with a positioning drive for positioning the wafer sandwich (20) and / or wafer base sheet without a stop.

18. The apparatus of claim 17, wherein, A counter support plate (31) is arranged below the upper return section of the pressing conveyor (30) for forming a counter support during the pressing process.

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