CUTTING DEVICE

Description

TECHNICAL FIELD

[0001] The subject matter disclosed herein relates to the field of separating devices for a stack of discs. BACKGROUND

[0002] DE 10 2016 213 802 A1 discloses a method and a device for separating a material along a predetermined separating contour by means of laser radiation, wherein damage points along the separating contours are introduced into the interior of the material, a liquid is applied to the material along the separating contour and a laser beam is directed onto the separating contour in order to separate the material along the separating contour.

[0003] US 2010 / 0089883 A1 relates to a workpiece dividing method for a liquid crystal glass substrate, wherein a TFT-side polarizing plate is ablated along each intended dividing line in a belt-like shape. In a further process, a load is applied to the liquid crystal glass substrate by a bending stress or a shear stress.

[0004] US 8,444,906 B2 discloses forming a first groove line GL1 in a first glass substrate using a first oscillating laser beam LB1 and forming a second groove line in a second glass substrate using a second oscillating laser beam LB2. Separation along the groove lines is achieved by applying a force to the panel in a direction opposite to the direction in which the groove lines are recessed.

[0005] US 2003 / 0019897A1 discloses separating a laminated glass comprising a first substrate and a second substrate. Separating the first substrate and the second substrate is performed using a soft breaker.

[0006] JP 2005 001264 discloses a separating device comprising a hard tool for forming a channel in the surface of a substrate and a pressure nozzle which functions not only as a separating means but also as a conveying means. SUMMARY

[0007] Given the situation described above, there is a need for a technique that allows efficient separation of a stack of plates.

[0008] This need is addressed by the subject matter of the independent claims. Advantageous embodiments are specified in the dependent claims.

[0009] The claimed invention is defined by the independent patent claims.

[0010] According to the first aspect of the subject matter disclosed herein, a separating device according to claim 1 is disclosed.

[0011] According to a second aspect of the subject matter disclosed herein, a method for separating a plate stack according to claim 13 is disclosed.

[0012] According to a third aspect of the subject matter disclosed herein, a computer program product, in particular a non-transient

[0013] Computer program product according to claim 15.

[0014] According to a fourth aspect of the subject matter disclosed herein, a partial stack of a plate stack according to claim 12 is disclosed.

[0015] Various aspects and embodiments of the subject matter disclosed herein are based on the idea that separating a stack of plates can be efficiently accomplished by separating a first plate by means of laser radiation and separating a second plate mechanically.

[0016] According to embodiments of the first aspect, the separating device is configured to provide the functionality of one or more of the embodiments disclosed herein and / or to provide the functionality required for one or more of the embodiments disclosed herein, in particular the embodiments of the first, second, third and / or fourth aspect.

[0017] According to embodiments of the second aspect, the method is configured to provide the functionality of one or more of the embodiments disclosed herein and / or to provide the functionality required for one or more of the embodiments disclosed herein, in particular the embodiments of the first, second, third and / or fourth aspect.

[0018] According to embodiments of the third aspect, the computer program product is designed to provide the functionality of one or more of the embodiments disclosed herein and / or to provide the functionality as required for one or more of the embodiments disclosed herein, in particular the embodiments of the first, second, third and / or fourth aspect

[0019] According to embodiments of the fourth aspect, the sub-stack is configured to provide the functionality of one or more of the embodiments disclosed herein and / or to provide the functionality required for one or more of the embodiments disclosed herein, in particular the embodiments of the first, second, third and / or fourth aspect.

[0020] Further advantages and features of the subject matter disclosed herein will become apparent from the following exemplary description of currently preferred embodiments, to which, however, the present disclosure is not limited. The individual figures of the drawings in this application are to be considered merely schematic and not necessarily to scale. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Fig. 1 schematically illustrates a separation process according to embodiments of the subject matters disclosed herein. Fig. 2 shows the plate stack Fig. 1 after the separation of the first plate. Fig. 3 shows the plate stack Fig. 1 during the mechanical separation of the second plate. Fig. 4 shows the plate stack Fig. 1 after the mechanical separation of the second plate into a first part and a second part. Fig. 5 shows a separating device according to embodiments of the subject matter disclosed herein. DESCRIPTION OF EXEMPLARY EMBODIMENTS

[0022] Exemplary embodiments of the subject matter disclosed herein are described below, with reference to, for example, a separating device, a control device, a disk stack, a method, and a computer program product. It should be emphasized that any combination of features of different aspects, embodiments, and examples is naturally possible. In particular, some embodiments are described with reference to a method or a computer program product, while other embodiments are described with reference to a separating device, a control device, or a disk stack.However, those skilled in the art will appreciate from the above and following description, claims, and drawings that, unless otherwise stated, features of different aspects, embodiments, and examples may be combined, and such combinations of features are to be considered as disclosed by this application. For example, even a feature relating to a method or a computer program product may be combined with a feature relating to a separating device, a control device, or a disk stack, and vice versa. Furthermore, a feature of an embodiment relating to a separating device, a control device, or a disk stack may be combined with a corresponding feature relating to a method or a computer program product.With the disclosure of a method, an embodiment of a method, or a function, one or more actuators, as well as a functionality of a control device that interacts with the actuators, are also considered disclosed, which are designed to carry out the method or function. Furthermore, with the disclosure of a function of a device, a corresponding method that defines the function without device features is considered disclosed.

[0023] As used herein, a reference to the computer program product having a program element is equivalent to a reference to the program element and / or a computer-readable medium containing a program element, wherein the program element is configured to control the processor device (e.g., a computer system) to effect and / or coordinate the execution of one or more of the methods described above.

[0024] The program element may be implemented as computer-readable instruction code using any suitable programming language, such as, for example, JAVA, C#, etc., and may be stored on a computer-readable medium (removable disc, volatile or non-volatile memory, embedded memory / processor, etc.). The instruction code is operable to program a computer or any other programmable processor device to perform the intended functions. The program element may be available from a network, for example, the World Wide Web, from which it may be downloaded.

[0025] The subject matter disclosed herein can be implemented using a program element or software. However, the subject matter disclosed herein can also be implemented using one or more specific electronic circuits or hardware. Furthermore, the subject matter disclosed herein can also be implemented in hybrid form, i.e., in a combination of software modules and hardware modules.

[0026] A separation device is disclosed herein. The separation device comprises a laser device and a mechanical device. The laser device is configured to perform a separation of a first plate of a plate stack using laser radiation. The mechanical device is configured to perform a mechanical separation of a second plate of the plate stack.

[0027] According to one embodiment, the first plate and the second plate are end plates of the plate stack, which are arranged on opposite sides of the plate stack. According to one embodiment, the plate stack comprises more than two plates. In other words, according to one embodiment, the plate stack comprises the first plate, the second plate, and at least one inner plate arranged between the first plate and the second plate. According to one embodiment, it can be provided that the first plate and the at least one inner plate are separated by means of laser radiation from the laser device.

[0028] Accordingly, according to one embodiment, a method for separating a plate stack comprising a first plate and a second plate comprises one or more of the following embodiments. The method comprises separating the first plate using laser radiation and mechanically separating the second plate.

[0029] According to one embodiment, the first plate is a glass plate and / or the second plate is a glass plate. As used herein, glass refers to an amorphous material that includes silicon dioxide or consists of silicon dioxide.

[0030] According to one embodiment, the first plate and the second plate in the plate stack are arranged at a distance from one another. According to one embodiment, the first plate and the second plate are arranged opposite one another, i.e., the first plate and the second plate are arranged adjacent to one another. According to a further embodiment, in which the plate stack comprises at least three plates, at least two adjacent plates of the at least three plates are arranged at a distance from one another. In this context, "arranged opposite one another" or "arranged adjacently" means that no further plates are arranged between the adjacently arranged plates.

[0031] According to one embodiment, adjacent plates, for example, the first plate and the second plate, are bonded together by adhesive bonding. According to one embodiment, the adhesive bond defines a distance between the two adjacent plates, for example, the first plate and the second plate.

[0032] According to one embodiment, the first plate has a first surface and the second plate has a second surface (e.g., a main surface), wherein the first surface and the second surface face each other. According to another embodiment, the bond extends only over a portion of the first surface and only over a portion of the second surface. According to one embodiment, a surface section in which the separation of the first plate and the second plate occurs is free of the bond.

[0033] According to one embodiment, an air gap is arranged between the first plate and the second plate. According to another embodiment, the separation of the first plate and the second plate occurs in the region of the air gap.

[0034] According to a further embodiment, a treatment device is provided (for example, the separation device comprises a treatment device), wherein the treatment device is configured to create at least one separation region in the first plate and / or the second plate. According to one embodiment, the plate in question (for example, the first plate and / or the second plate) is mechanically weakened in the at least one separation region to assist the separation of the plate in question (for example, the separation of the first plate by means of laser radiation and / or the mechanical separation of the second plate).

[0035] According to one embodiment, the at least one separation region is generated by a laser beam, for example, as described in DE 10 2016 213 802 A1. For example, the at least one separation region can comprise a plurality of separation regions (or damage sites).

[0036] According to one embodiment, the separation of the first plate and the mechanical separation of the second plate occur sequentially. For example, according to one embodiment, the separation device can be configured to first separate the first plate using the laser device and then to mechanically separate the second plate.

[0037] According to one embodiment, the laser device comprises at least one CO2 laser and the laser radiation (for separating the first plate) can be generated by the at least one CO2 laser.

[0038] According to one embodiment, the mechanical device is configured to exert a force on the second plate and thereby cause the mechanical separation of the second plate.

[0039] According to one embodiment, the mechanical device comprises a support element. According to one embodiment, the support element supports the second plate in at least one support region in order to perform the mechanical separation of the second plate by breaking the second plate via the support element.

[0040] According to a further embodiment, the mechanical device can comprise a counter element. For example, the counter element can provide a counter force to press the support region and the second plate against each other. For example, the counter element can exert the counter force on the first plate, for example, in the area where the first plate is bonded to the second plate.

[0041] According to one embodiment, the support element is a cutting wheel, wherein the mechanical separation of the second plate comprises rolling the cutting wheel over an outer surface of the second plate along the at least one support region. In this case, the support element (cutting wheel) does not support the second plate simultaneously (at one time) across the entire at least one support region, but rather the second plate is supported along the at least one support region over an (extended) time interval.

[0042] The separating device thus produces a partial stack comprising a portion of the first plate and a portion of the second plate. Due to the separation of the plate stack with the separating device, the portion of the first plate has a separation surface created by laser radiation, and the portion of the second plate has a separation surface created by mechanical separation. DETAILED DESCRIPTION

[0043] Exemplary embodiments of the subject matter disclosed herein are described below with reference to the drawings. It is noted that in different figures, similar or identical elements or components are sometimes provided with the same reference numerals, or with reference numerals that differ only in the first digit and / or an appended digit. Features or components that are the same or at least functionally equivalent to the corresponding features or components in another figure are only described in detail at their first appearance in the following text, and the description is not repeated for subsequent appearances of these features and components (or the corresponding reference numerals). The above definitions apply according to one embodiment to the subsequent embodiments, and vice versa.Furthermore, the features and embodiments described above can be combined with the features and embodiments described below.

[0044] Fig. 1 schematically illustrates a separation process according to embodiments of the subject matters disclosed herein.

[0045] According to one embodiment, a plate stack 100 comprises a first plate 102 and a second plate 103. According to one embodiment, the first plate 102 is a glass plate (also referred to as a glass sheet) and the second plate 103 is also a glass plate.

[0046] According to one embodiment, the method for separating the plate stack 100 comprises separating the first plate 102 using laser radiation 104. According to one embodiment, the separation takes place using the laser radiation 104 in a separation region 106 in which the plate 102 is mechanically weakened. Mechanically weakened herein means that at least one mechanical property (e.g., a fracture strength) of the plate 102 is impaired in the separation region compared to the adjacent regions 108.

[0047] According to one embodiment, the separation of the first plate 102 occurs in the region of an air gap 110 between the first plate 102 and the second plate 103. According to one embodiment, the air gap 110 is formed by a distance 112 between the first plate 102 and the second plate 103. Thus, according to one embodiment, a first surface 114 of the first plate 102 lies opposite a second surface 116 of the second plate 103, with the air gap 110 being arranged between the first surface 114 and the second surface 116.

[0048] According to one embodiment, the first plate 102 and the second plate 103 are connected to each other by an adhesive bond 118. According to another embodiment, the adhesive bond 118 defines the distance 112 between the first plate and the second plate. According to another embodiment, spacers (in Figur 1 not shown) between the first plate 102 and the second plate 103.

[0049] Fig. 2 shows the plate stack 100 from Fig. 1 after the separation of the first plate 102.

[0050] By means of the bonding 118, a first part 120 of the first plate 102 and a second part 122 of the first plate 102 can be held in a defined position, for example so that the first part 120 and the second part 122 of the plate 102 contact each other in a contact area 124, for example as in Fig. 2 shown.

[0051] Fig. 3 shows the plate stack 100 from Fig. 1 during the mechanical separation of the second plate 103.

[0052] According to one embodiment, a force 126 is exerted on the second plate in a separation region 106, causing the second plate 103 to break in the separation region 106. According to one embodiment, the separation region 106 of the second plate 103 is designed and manufactured analogously to the separation region 106 of the first plate 102.

[0053] Fig. 4 shows the plate stack 100 from Fig. 1 after the mechanical separation of the second plate 103 into a first part 128 and a second part 130.

[0054] After the separation of the first plate 102 by means of laser radiation 104 and the mechanical separation of the second plate 103, the first parts 120, 128 of the first plate 102 and the second plate 103 can be separated from the second parts 122, 130 of the first plate 102 and the second plate 103, as shown for example in Fig. 4 According to one embodiment, the first part 120 of the first plate 102 and the part 128 of the second plate 103 are fixed relative to each other by the adhesive 118, for example as shown in Fig. 4 Accordingly, according to one embodiment, the second part 122 of the first plate 102 and the second part 130 of the second plate 103 are fixed relative to each other by the adhesive 118, for example as shown in Fig. 4 shown.

[0055] Due to the described separation method, the first part 120 and the second part 122 of the first plate 102 each have a separation surface 123 produced by separation using laser radiation. Furthermore, due to the described separation method, the first part 128 and the second part 130 of the second plate 103 each have a separation surface 125 produced by mechanical separation. The first part 120 of the first plate 102 and the first part 128 of the second plate 103 form a partial stack according to embodiments of the subject matter disclosed herein. Likewise, the second part 122 of the first plate 102 and the second part 130 of the second plate 103 form a partial stack according to embodiments of the subject matter disclosed herein.

[0056] Fig. 5 shows a separating device 150 according to embodiments of the subject matter disclosed herein.

[0057] According to one embodiment, the separating device 150 includes a laser device 152 and a mechanical device 154. The separating device 150 is configured to separate a plate stack 100 according to embodiments of the subject matter disclosed herein.

[0058] According to one embodiment, the laser device 152 is configured to generate the laser radiation 104 as described with reference to Fig. 1 to thereby separate the first plate 102 by means of the laser radiation 104. The mechanical device 154 is configured to apply a mechanical force 126 as described with reference to Fig. 3 described above, to the second plate 103 and thereby mechanically separate the second plate 103. According to one embodiment, the mechanical device 154 for this purpose comprises a support element 155 according to embodiments of the subject matter disclosed herein.

[0059] According to one embodiment, the separating device further comprises a carrier which is partially Fig. 5 at 156. According to one embodiment, the carrier 156 is configured to support the plate stack 100 and, according to another embodiment, to position it with respect to the laser device 152 and the mechanical device 154.

[0060] According to one embodiment, the separating device 150 further comprises a treatment device 158 which is configured to produce the separating region 106 in the first plate 102 and / or in the second plate 103. For example, according to one embodiment, it can be provided that the treatment device 158 is positionable relative to the carrier 156 in order to thereby position the treatment device 158 relative to the carrier 156. According to another embodiment, it can be provided that the carrier 156 is positionable relative to the treatment device 158. For example, the carrier 156 can be movable in order to initially position the plate stack 100 in the working region of the treatment device 158 and, after the separating regions 106 have been produced, to position the plate stack 100 in the working region of the laser device 152 and the mechanical device 154.

[0061] According to one embodiment, the laser device 152 and the mechanical device 154 are arranged to separate the first plate 102 and the second plate 103 without moving the plate stack 100. For example, according to one embodiment, the laser device 152 and the mechanical device 154 are positioned opposite one another, for example as shown in Figure 5. According to another embodiment, the laser device 152 and the mechanical device 154 are arranged at a distance from one another in a transport direction of the plate stack 100. In this case, according to one embodiment, the first plate of the plate stack 100 is first separated with the laser device 152, then the plate stack is positioned in the working area of ​​the mechanical device 154, and the second plate of the plate stack 100 is separated with the mechanical device 154.

[0062] According to one embodiment, the separation region 106 of the first plate 102 is aligned with the separation region 106 of the second plate. For example, according to one embodiment, the separation region 106 of the first plate 102 and the separation region 106 of the second plate 103 extend in a common plane. According to one embodiment, the common plane extends perpendicular to a surface of the plate stack 100. For example, in one embodiment, the common plane extends parallel to a stacking direction 160 along which the first plate 102 and the second plate 103 are stacked one above the other, for example as shown in Fig. 5 shown.

[0063] According to one embodiment, the separating device 150 comprises a control device 162, which is configured to control one or more components of the separating device according to one or more embodiments of the subject matter disclosed herein, for example to control the laser device 152, the mechanical device 154, the carrier 156 and / or the treatment device 158. For this purpose, the control device 162 is connected for control purposes to the respective components, for example as at 164 in Fig. 5 The control connection 164 can be unidirectional or bidirectional, depending on the desired functionality.

[0064] According to one embodiment, the control device comprises a memory 166 in which a computer program product according to embodiments of the subject matter disclosed herein is stored, in particular stored non-transiently.

[0065] Furthermore, according to one embodiment, the control device 162 comprises a processor device 168 for executing a program element of the computer program product. According to one embodiment, the program element is configured to, when the program element is executed on the processor device 168, provide a functionality of the control device 162 according to embodiments of the subject matter disclosed herein and to control a method according to embodiments of the subject matter disclosed herein.

[0066] It should be noted that elements disclosed herein (e.g., a device such as the control device, the laser device, the mechanical device, the carrier, the treatment device, an actuator, etc.) are not limited to the dedicated entities described in some embodiments. Rather, the subject matter disclosed herein may be implemented in various ways while still providing the specific functionality disclosed.

[0067] It should be noted that each entity disclosed herein (e.g., device, element, feature, and method step) is not limited to a dedicated entity as described in some embodiments. Rather, the subject matter described herein may be provided in various ways with varying granularity at the device level, the method level, or the software level while still providing the specified functionality. Further, it should be noted that, according to embodiments, a separate entity may be provided for each of the functions disclosed herein. According to other embodiments, one entity may be configured to provide two or more functions as described herein. According to still other embodiments, two or more entities may be configured to jointly provide one function as described herein.

[0068] It should be noted that the implementations described here in the drawings represent only a limited selection of possible embodiments of the subject matter disclosed herein. Thus, it is possible to combine the features of individual embodiments in a suitable manner, so that a multitude of different embodiments can be considered disclosed to a person skilled in the art with the embodiments explicitly described here. Furthermore, it should be noted that terms such as "a" or "an" do not exclude a plurality. Terms such as "containing" or "having" do not exclude further features or method steps. The terms "having" or "containing" each encompass the two meanings "including" and "consisting of."

[0069] Furthermore, it should be noted that while the exemplary implementation of separator, control device, disk stack, and computer program product in the drawings illustrates a particular combination of several embodiments of the subject matter disclosed herein, any other combination of embodiments is also possible and is to be considered disclosed in this application.

[0070] An advantageous combination of embodiments of the subject matters disclosed herein can be summarized as follows: A separating device for separating a plate stack comprising a first plate and a second plate is disclosed. The separating device comprises a laser device configured to separate the first plate by means of laser radiation, a mechanical device configured to mechanically separate the second plate, a treatment device for producing at least one separation region in the first plate, wherein the first plate is mechanically weakened in the at least one separation region in order to assist in separating the first plate, and a carrier configured to carry the plate stack and to position it with respect to the laser device and the mechanical device. Furthermore, a plate stack ora partial stack of a plate stack is revealed.

Claims

1. A separating device (150) for separating a plate stack (100) comprising a first plate (102) and a second plate (103), the separating device (150) comprising: a laser device (152) configured to perform separation of the first plate (102) by means of laser radiation (104); a mechanical device (154) configured to perform mechanical separation of the second plate (103); a treatment device (158) for generating at least one separation region (106) in the first plate (102), wherein the first plate (102) is mechanically weakened in the at least one separation region (106) to assist the separation of the first plate (102); a carrier (156) configured to carry and position the plate stack (100) with respect to the laser device (152) and the mechanical device (154).

2. The separating device (150) according to claim 1, wherein the first plate (102) is a glass plate and the second plate (103) is a glass plate.

3. The separating device (150) according to any one of the preceding claims, wherein the first plate (102) and the second plate (103) are spaced apart from each other.

4. The separating device (150) according to any one of the preceding claims, wherein the first plate (102) and the second plate (103) are connected to each other by an adhesive bond.

5. The separating device (150) according to any one of the preceding claims, wherein an air gap (110) is arranged between the first plate (102) and the second plate (103).

6. The separating device (150) according to any one of the preceding claims, wherein the treatment device (158) is configured to generate at least one separation region (106) in the second plate (103), wherein the second plate (103) is mechanically weakened in the at least one separation region (106) to assist the separation of the second plate (103).

7. The separating device (150) according to one of claims 1 to 6, wherein the treatment device is configured to generate the at least one separation region (106) with a laser beam.

8. The separating device (150) according to any one of the preceding claims, wherein the separating device (150) is configured to first perform the separation of the first plate (102) by means of the laser device (152) and to subsequently perform the mechanical separation of the second plate (103).

9. The separating device (150) according to one of the preceding claims, wherein the laser device (152) comprises at least one CO2 laser and the laser radiation is generatable by the at least one CO2 laser.

10. The separating device (150) according to any one of the preceding claims, wherein the mechanical device (154) comprises a support element (155); in particular wherein the support element (155) supports the second plate (103) in at least one support region to perform the mechanical separation of the second plate (103) by breaking the second plate (103) over the support element (155).

11. The separating device (150) according to any one of the preceding claims, wherein the support element comprises one of the following features: the support element is a cutting wheel, wherein the mechanical separation of the second plate (103) comprises rolling the cutting wheel over an outer surface of the second plate (103) along the at least one support region; the support element (155) defines at least one contact region for contacting the second plate (103), in particular wherein the support element is a roller or a beam.

12. A partial stack of a plate stack (100) comprising a part (120, 122) of a first plate (102) and a part (128, 130) of a second plate (103), wherein the part (120, 122) of the first plate (102) comprises a separation surface (123) generated by a separation by means of laser radiation in a mechanically weakened separation region that assists the separation of the first plate; and wherein the part (128, 130) of the second plate (103) comprises a separation surface (125) generated by a mechanical separation.

13. A method for separating a plate stack (100) comprising a first plate (102) and a second plate (103), the method comprising: generating at least one separation region (106) in the first plate (102), wherein the first plate (102) is mechanically weakened in the at least one separation region (106) to assist the separation of the first plate (102); a separation of the first plate (102) by means of laser radiation; a mechanical separation (103) of the second plate.

14. The separating device (150) according to one of claims 1 to 11, further comprising a control device (162), wherein the control device is configured to effect and / or coordinate an execution of a method according to claim 13.

15. A computer program product comprising a program element, wherein the computer program product is configured to, when the program element is executed on a processor device (168), effect an execution of a method according to claim 13 by a separating device (150) according to one of claims 1 to 11.