PACKAGING FOR A MEDICAL DEVICE, METHOD FOR PRODUCING A PACKAGING FOR A MEDICAL DEVICE, USE OF A PACKAGING FOR PACKAGING A MEDICAL DEVICE AND MEDICAL KIT

Description

FIELD OF APPLICATION AND STATE OF THE ART

[0001] The invention relates to a packaging for an implant, a method for producing a packaging for an implant, the use of a packaging for packaging an implant, and a medical kit. The implant is preferably a tibial implant.

[0002] Medical devices can be contaminated with particles as a result of their manufacturing process, for example, through the use of packaging materials containing particles and / or due to friction on their packaging. For example, friction-induced abrasion between the product and the packaging material can occur, particularly during transport of medical devices. If the medical device is an implant, particles can come into (permanent) contact with a patient's blood and / or tissue. This increases the risk of serious postoperative complications. In the case of a tibial implant, such in vivo particle contamination can lead to loosening of the implant.

[0003] From DE 39 17 202 A1 a packaging container is known which consists of a tub and a lid, both of which are provided with elastically yielding supports which face one another and which accommodate medical instruments, devices, their parts and implants between them, wherein the supports consist of a large number of bristles made of elastic material distributed over the tub and lid bottom surface.

[0004] EP 2 258 323 A1 relates to an application device for stents, which has hair-like projections on at least a part of the outwardly facing surface of the region of the device which is intended for attaching or crimping the stent to be applied. TASK AND SOLUTION

[0005] The present invention is therefore based on the object of providing packaging for an implant that largely or completely avoids the disadvantages mentioned above in connection with generic packaging. In particular, the packaging is intended to avoid or at least reduce transport-related abrasion between the packaging and an implant optionally contained in the packaging. Furthermore, the invention is based on the object of providing a manufacturing method for such packaging, the use of such packaging for packaging an implant, and a corresponding medical kit.

[0006] These objects are achieved by a package having the features according to independent claim 1, by a method according to claim 13, by a use according to claim 14, and by a medical kit according to claim 15. Preferred embodiments are defined in the dependent claims. The wording of all claims is hereby incorporated by express reference into the present description.

[0007] According to a first aspect, the invention relates to a packaging for an implant, such as a tibial implant.

[0008] The packaging is particularly characterized in that an inner surface of the packaging has, at least in sections, in particular only in sections or continuously (ie over the entire surface), microstructured adhesive elements, in particular protruding (ie protruding from the inner surface of the packaging), microstructured adhesive elements, for adhering or fixing the implant.

[0009] For the purposes of the present invention, the term "adhesive elements" is to be understood as meaning structures which are designed in such a way that they enable the adhesion or fixing of an implant optionally contained in the packaging to an inner surface of the packaging, preferably predominantly or exclusively on the basis of van der Waals forces.

[0010] For the purposes of the present invention, the term "microstructured adhesive elements" refers to adhesive elements that have at least one dimension, such as length and / or diameter, in the micrometer range, in particular in a range or order of magnitude from 10 µm to 150 µm, in particular 50 µm to 120 µm, preferably 80 µm to 100 µm. Preferably, the microstructured adhesive elements within the meaning of the present invention have dimensions exclusively in the aforementioned range or order of magnitude.

[0011] For the purposes of the present invention, the term "van der Waals forces" is understood, in accordance with the expert understanding, to refer to relatively weak, non-covalent interactions between atoms or molecules, named after the physicist Van der Waals, whose interaction energy for spherical particles decreases with approximately the sixth power of the distance. According to current understanding, van der Waals forces can be divided into the following three components: The Keesom interaction between two dipoles (dipole-dipole forces), which are indirectly proportional to absolute temperature, the Debye interaction between a dipole and a polarizable molecule (dipole-induced dipole forces), and the London dispersion interaction (London forces) between two polarizable molecules (induced dipole-induced dipole forces). London forces are often referred to as van der Waals forces in the narrower sense.

[0012] All van der Waals forces are weak forces compared to covalent bonding and ionic bonding, with the aforementioned dispersion interaction generally being the dominant component of the three aforementioned components of van der Waals forces.

[0013] The invention is based on the surprising discovery that implants can be sufficiently adhered or fixed in packaging with microstructured adhesive elements, so that, in particular, transport-related abrasion between the implant and the packaging, and thus particle contamination of the implant, can be significantly reduced or even completely avoided. This can significantly reduce the risk of postoperative complications when implants are packaged. The adhesion or fixation of the implant to the microstructured adhesive elements and thus to the inner surface of the packaging is, as already mentioned, preferably based on van der Waals forces. This allows the so-called gecko principle to be at least partially imitated with particular advantage.A further advantage is that, apart from the microstructured adhesive elements, preferably no further adhesives, in particular adhesives, and / or no mechanical fixing means are required for adhering or fixing the implant. The packaging according to the invention is therefore preferably free of further adhesives for adhering the implant and / or free of mechanical fixing means for fixing the implant. In other words, it is preferred that the microstructured adhesive elements are the only adhesive and / or fixing means of the packaging according to the invention for adhering and / or fixing the implant.

[0014] In one embodiment of the invention, the microstructured adhesive elements each have an elongated adhesive element body. The elongated adhesive element body is preferably cylindrical, in particular circular-cylindrical. Particularly preferably, the elongated adhesive element body is stalk- or stem-shaped.

[0015] Furthermore, the elongated adhesive element body preferably has a length of 50 µm to 150 µm, in particular 50 µm to 130 µm, preferably 80 µm to 100 µm. In principle, the elongated adhesive element bodies can have different lengths. However, the elongated adhesive element bodies preferably each have the same length. Furthermore, the elongated adhesive element bodies can be solid, i.e., non-hollow, or hollow.

[0016] Furthermore, it is preferred that the elongated adhesive element body has a diameter of 10 µm to 40 µm, in particular 20 µm to 40 µm, preferably 20 µm to 35 µm. In the context of the present invention, the term "diameter" in the context of the elongated adhesive element body of the microstructured adhesive elements is understood to mean the greatest possible distance that two points along a circumferential line of the elongated adhesive element body can assume from one another. In principle, the elongated adhesive element body can have a cornerless, in particular circular, oval, or elliptical, cross-section, or an angular, in particular triangular, rectangular, square, pentagonal, hexagonal, heptagonal, octagonal, nonagonal, or decagonal cross-section.

[0017] In a further embodiment of the invention, the microstructured adhesive elements each have a free end, in particular as a head part on the elongate adhesive element body. The adhesion of the implant preferably takes place via the free end or the head part of the microstructured adhesive elements and, as already mentioned, is preferably based predominantly or exclusively on the formation of Van der Waals forces. Preferably, the free end or the head part has a diameter that is greater than the diameter of the elongate adhesive element body. In other words, the microstructured adhesive elements preferably each have a free end or head part that is wider in diameter than the diameter of the elongate adhesive element body. This particularly advantageously makes it possible to optimize the adhesion of the implant on the basis of Van der Waals forces. Preferably, the free end orThe head portion of the microstructured adhesive elements has a diameter of 15 µm to 70 µm, in particular 25 µm to 65 µm, preferably 45 µm to 60 µm. In the context of the present invention, the term "diameter" in connection with the free end or head portion of the microstructured adhesive elements is understood to mean the greatest possible distance that two points along a circumferential line of the free end or head portion can assume from one another. Furthermore, the free end or head portion of the microstructured adhesive elements can have a height of 5 µm to 20 µm, in particular 7 µm to 15 µm, preferably 8 µm to 12 µm. In principle, the free end or the head part can have a cornerless, in particular circular, oval or elliptical, cross-section or an angular, in particular triangular, rectangular such as square, pentagonal, hexagonal, heptagonal, octagonal, nonagonal or decagonal, cross-section.

[0018] Furthermore, it is preferred if the diameter of the free end or the head portion of the microstructured adhesive elements decreases toward an upper end, i.e., near the head portion, of the elongated adhesive element body, in particular with the formation of an undercut. In particular, the microstructured adhesive elements can have a radial projection from the free end or the head portion to an upper end, i.e., near the head portion, of the elongated adhesive element body of 5 µm to 20 µm, in particular 7 µm to 15 µm, preferably 8 µm to 12 µm.

[0019] Furthermore, the microstructured adhesive elements each preferably have a base part, via which the elongated adhesive element body of a respective microstructured adhesive element is connected to the inner surface of the packaging. The base part of the microstructured adhesive elements preferably has a diameter that is larger than the diameter of the elongated adhesive element body and / or larger than the diameter of the free end or the head part of the microstructured adhesive elements. In particular, the base part of the microstructured adhesive elements can have a diameter that is larger than the diameter of the elongated adhesive element body and the free end or the head part of the microstructured adhesive elements. For example, the base part of the microstructured adhesive elements can have a diameter of 15 µm to 70 µm, in particular 25 µm to 65 µm, preferably 45 µm to 60 µm.For the purposes of the present invention, the term "diameter" in the context of the base part of the microstructured adhesive elements refers to the greatest possible distance that two points along a circumferential line of the base part can assume from each other. In principle, the base part can have a cornerless, in particular circular, oval, or elliptical, cross-section, or an angular, in particular triangular, rectangular, square, pentagonal, hexagonal, heptagonal, octagonal, nonagonal, or decagonal, cross-section.

[0020] In principle, the free end or head part of the microstructured adhesive elements can be curved, in particular convex.

[0021] According to the invention, however, it is preferred if the free end or head portion of the microstructured adhesive elements is flat, i.e., flat or non-curved. Such a configuration of the free end or head portion is particularly preferred with regard to an optimum with regard to the formation of van der Waals forces.

[0022] Furthermore, the microstructured adhesive elements or parts thereof, in particular the elongated adhesive element body of the microstructured adhesive elements, can have an aspect ratio, ie a length-diameter ratio (ratio of length to diameter) of 1:3 to 1:5.

[0023] Furthermore, adjacent free ends or head parts of the microstructured adhesive elements can have a mutual distance of 10 µm to 60 µm, in particular 20 µm to 50 µm, preferably 30 µm to 40 µm.

[0024] In a further embodiment of the invention, the microstructured adhesive elements each have the shape of a hyperboloid of revolution. Such a configuration of the microstructured adhesive elements is particularly advantageous with regard to further optimizing the implant's adhesion based on van der Waals forces.

[0025] In a further embodiment of the invention, the microstructured adhesive elements each have a spatula-like, i.e., in the form of individual fibers or filaments, separated, free end, particularly as a head portion on the elongated adhesive element body. This also particularly advantageously allows for further optimization of the implant's adhesion based on van der Waals forces.

[0026] Preferably, at least 10,000, in particular 15,000 to 40,000, preferably 25,000 to 35,000, for example 29,000, microstructured adhesive elements per cm² of the inner surface of the packaging are formed, at least in sections. Such a density of microstructured adhesive elements on the inner surface of the packaging is additionally advantageous from the point of view of achieving optimal van der Waals forces and thus optimal adhesion results.

[0027] In a further embodiment of the invention, the inner surface of the packaging is an inner surface of a packaging bottom part of the packaging.

[0028] In a further embodiment of the invention, the inner surface of the packaging base is a surface, in particular the bottom surface, of a recess in the packaging base. The recess in the packaging base preferably has a shape that is at least partially complementary, in particular only partially or completely, to a shape of the implant. The recess thus preferably allows for at least partial accommodation of the implant. This provides additional fixation of the implant and thus further reduces the risk of abrasion, particularly during transport, between the packaging and the implant.

[0029] In a further embodiment of the invention, the microstructured adhesive elements are formed only on the surface, preferably only on the bottom surface, of the recess in the packaging base. This allows the implant to adhere only to the surface, in particular only to the bottom surface, of the recess in the packaging base. This, in turn, advantageously enables a particularly small contact area between the packaging and the implant and thus particularly effectively minimizes the risk of particle abrasion between the packaging and the implant, particularly during transport.

[0030] In a further embodiment of the invention, the surface, in particular the bottom surface, of the recess in the packaging base is designed at least in sections, in particular only in sections or continuously, as the surface of a film on which the microstructured adhesive elements, in particular protruding, microstructured adhesive elements, are formed. In other words, in a further embodiment of the invention, the recess, in particular the bottom of the recess, of the packaging base is coated at least in sections, in particular only in sections or continuously, with a film on which the microstructured adhesive elements, in particular protruding, microstructured adhesive elements, are formed. Particularly preferably, only the bottom surface of the recess in the packaging base is designed as the surface of a film on which the microstructured adhesive elements, in particular protruding, microstructured adhesive elements, are formed.The film is preferably integrally bonded to the recess, in particular the base of the recess, of the packaging base, for example by gluing or laminating. The film is preferably a plastic film. The term "plastic film" in the context of the present invention refers to a film that comprises or consists of a plastic material. The embodiments of the invention described in this paragraph have the advantage that materials, in particular plastic materials, can be used for the film that allow the formation of microstructured adhesive elements that are particularly advantageous from an adhesion perspective, in particular based on van der Waals forces. Suitable plastic materials will be discussed in more detail below.

[0031] Furthermore, the film, in particular plastic film, can have a thickness of 50 µm to 2500 µm, in particular 200 µm to 1000 µm, preferably 250 µm to 400 µm.

[0032] In a further embodiment of the invention, the film, in particular a plastic film, comprises or consists of a plastic material. The plastic material can in particular be a thixotropic plastic material. The plastic material is preferably selected from the group consisting of inorganic elastomers, organic elastomers, siloxanes, in particular polyvinylsiloxane, addition-curing silicone elastomers, rubber materials, natural rubber, synthetic rubber, styrene-butadiene rubber, chloroprene rubber, ethylene-propylene-diene rubber, polyacrylates, and mixtures thereof.

[0033] In a further embodiment of the invention, the implant is contained in the packaging and adheres to the microstructured, in particular protruding, microstructured, adhesive elements.

[0034] In a further embodiment of the invention, the packaging further comprises a packaging upper part, preferably a housing-shaped packaging upper part. The packaging upper part preferably has a rectangular, in particular square, or semicircular cross-section. This further reduces the contact area between the packaging and the implant and thus further minimizes the risk of abrasion, particularly during transport, between the packaging and the implant.

[0035] Furthermore, the packaging base can have a rectangular, in particular square, or semicircular cross-section.

[0036] Furthermore, it is preferred that the packaging, in particular the packaging bottom part and / or packaging top part, comprises, in particular comprise, hard plastic or, in particular apart from the above-mentioned film, in particular plastic film, consists of, in particular consist of, hard plastic. The hard plastic can in particular be selected from the group consisting of polyolefins, polyethylene, polypropylene, polyetheretherketone, polyesters, polyamides, and mixtures thereof.

[0037] For example, the implant may be a tibial implant, i.e., an implant that is implanted into the lower leg bone (tibia). The tibial implant may be provided with a stem and, in particular, lateral fins to provide the required stability.

[0038] According to a second aspect, the invention relates to a method for producing a package according to the first aspect of the invention. The method comprises the following step: a) Forming or producing microstructured adhesive elements, in particular protruding, microstructured adhesive elements, on an inner surface of a packaging or on a film intended as an inner surface of a packaging or as part of an inner surface of a packaging, in particular a plastic film.

[0039] When performing step a), the microstructured adhesive elements are preferably formed or produced on the inner surface of a packaging base, in particular on the surface, preferably the bottom surface, of a recess of a packaging base. The formation or production of the microstructured adhesive elements can be carried out, for example, by means of an etching process ("nanoscale sculpturing") or a laser process.

[0040] Furthermore, the method can preferably comprise a further step b) coating a surface, in particular the bottom surface, of a recess of a packaging bottom part of the packaging with the film and / or packaging the implant in / by means of the packaging. The coating of the surface, in particular the bottom surface, of the recess of the packaging bottom part can be carried out using a material-to-material joining technique, such as gluing or laminating.

[0041] With regard to further features and advantages of the method, in particular with regard to the packaging, the microstructured adhesive elements, the film, and the implant, reference is made in full to the statements made in the context of the first aspect of the invention. The features and advantages described therein also apply mutatis mutandis to the method according to the second aspect of the invention.

[0042] According to a third aspect, the invention relates to the use of a packaging according to the first aspect of the invention for packaging an implant, such as a tibial implant.

[0043] With regard to further features and advantages of the packaging and the implant, reference is made in full to the statements made in the context of the first aspect of the invention. The features and advantages described therein also apply mutatis mutandis to the use according to the third aspect of the invention.

[0044] According to a fourth aspect, the invention relates to a medical kit comprising a package according to the first aspect of the invention and an implant. The implant is preferably contained in the package and preferably adheres to the microstructured adhesive elements, in particular to the protruding, microstructured adhesive elements, of the inner surface of the package.

[0045] With regard to further features and advantages of the kit, in particular with regard to the packaging and the implant, reference is made in full to the statements made in the context of the first aspect of the invention. The features and advantages described therein also apply mutatis mutandis to the medical kit according to the fourth aspect of the invention.

[0046] Further features and advantages of the invention emerge from the claims and from the following description of a preferred embodiment of the invention, which is illustrated with reference to the drawings. SHORT DESCRIPTIONS OF THE FIGURES

[0047] Fig. 1 shows a schematic perspective view of an embodiment of a packaging according to the invention, Fig. 2 shows a schematic exploded view of the embodiment of a packaging according to the invention according to Fig. 1 and Fig. 3 shows schematically an enlarged detailed representation of a surface of a recess of a packaging bottom part of a packaging according to the invention in an area A according to Fig. 2 . DETAILED DESCRIPTIONS OF THE FIGURES

[0048] The Fig. 1 and 2 show an embodiment of a packaging 1 according to the invention.

[0049] The packaging 1 comprises a packaging lower part 2, an implant, such as a tibial implant, 5, and a packaging upper part 6. The packaging lower part 2 and the packaging upper part 6 can be connected to one another, for example, by closures, snap-in lugs, fits, press fits, seals, or adhesives.

[0050] The packaging base 2 has a recess 3. The recess 3 is designed, at least in sections, to complement a shape of the implant 5. This allows the implant 5 to be received at least in sections in the recess 3.

[0051] The surface, in particular only the bottom surface, 4 of the recess 3 has protruding, microstructured adhesive elements 7 (see Fig. 3 ). This particularly advantageously allows the implant 5 to adhere to / in the recess 3 of the packaging base 2, in particular without additional adhesive and / or mechanical fixing means. The adhesion of the implant 5 is preferably based, in particular predominantly or exclusively, on the formation of van der Waals forces ("gecko principle").

[0052] Such adhesion of the implant 5 can, in particular, reduce or even completely prevent transport-related abrasion between the packaging 1 and the implant 5. This can, for example, significantly reduce the risk of postoperative complications.

[0053] Preferably, the surface, in particular only the bottom surface, 4 of the recess 3 is designed as a surface of a plastic film on which the protruding, microstructured adhesive elements 7 are formed.

[0054] Alternatively, the protruding, microstructured adhesive elements 7 can be formed by etching processes, such as "nanoscale sculpturing" or laser processes on the surface, in particular only on the bottom surface, 4 of the recess 3.

[0055] The plastic film may, in particular, comprise siloxane, in particular polyvinylsiloxane, or consist of siloxane, in particular polyvinylsiloxane. Furthermore, the plastic film may, for example, have a thickness of 0.5 mm to 2.5 mm.

[0056] Both the lower packaging part 2 and the upper packaging part 6 can each comprise hard plastic or, in particular apart from the aforementioned plastic film, can be made of hard plastic. The hard plastic can, for example, be selected from the group consisting of polyolefins, polyethylene, polypropylene, polyetheretherketone, polyester, polyamides, and mixtures thereof.

[0057] Preferably, the upper packaging part 6 further has a housing shape. This particularly advantageously allows the contact area between the implant 5 and the packaging 1 to be further reduced. This, in turn, further minimizes the risk of particle abrasion between the packaging 1 and the implant 5, particularly during transport.

[0058] Fig. 3 shows schematically an enlarged detailed representation of the surface, in particular the bottom surface, 4 of the recess 3 of the packaging base 2.

[0059] As already mentioned, the surface, in particular the bottom surface, 4 of the recess 3 of the packaging base 2 has protruding, microstructured adhesive elements 7. The microstructured adhesive elements 7 each have an elongated adhesive element body 8, a free end 9 designed as a head part on the elongated adhesive element body 8, and a foot part 10, via which the elongated adhesive element body 8 is connected to the surface, in particular the bottom surface, 4 of the recess 3.

[0060] The elongated adhesive element body 8 can in particular have a length of 50 µm to 150 µm and a diameter of 10 µm to 40 µm.

[0061] The free end or head portion 9 of the microstructured adhesive elements 7 is preferably designed to be wider in diameter than the diameter of the elongated adhesive element body 8. The free end or head portion 9 preferably has a diameter of 15 µm to 70 µm. Particularly preferably, the upper side of the free end or head portion 9 is flat or only slightly convex. Furthermore, the free end or head portion 9 can have a height of 8 µm to 12 µm, for example, 10 µm. The embodiments of the free end or head portion 9 described as examples in this paragraph are particularly advantageous from an adhesion perspective.

[0062] Furthermore, it may be preferred if the microstructured adhesive elements 7 have an undercut in a region between the free end or the head part 9 and an upper end, i.e., near the head part, of the elongated adhesive element body 8. In particular, the microstructured adhesive elements 7 can have a radial projection from the free end or the head part 9 to an upper end, i.e., near the head part, of the elongated adhesive element body 8 of 8 µm to 12 µm, for example, 10 µm.

[0063] Preferably, at least 10,000, in particular 15,000 to 40,000, microstructured adhesive elements 7 per cm 2 of surface, in particular bottom surface, 4 of the depression 3 are formed at least in sections.

[0064] The microstructured adhesive elements 7 can each be designed in particular as a hyperboloid of revolution.

[0065] Alternatively, the microstructured adhesive elements can be separated at their free end or their head part 9 in the form of individual fibers or filaments.

[0066] The above-described microstructured adhesive elements 7 on the surface, in particular the bottom surface, 4 of the recess 3 of the packaging lower part 2 are particularly advantageous with regard to adhesion of the implant 5 for the purpose of reducing or avoiding particle abrasion, in particular due to transport, between the packaging 1 and the implant 5. The adhesion of the implant 5 to / in the recess 3 preferably takes place via the free ends or head parts 9 of the microstructured adhesive elements 7 and is preferably based predominantly or entirely on the formation of Van der Waals forces.

Claims

1. Packaging (1) for an implant (5), characterized in that an inner surface (4) of the packaging (1) has at least in sections protruding microstructured adhesive elements (7) for adhering to the implant (5), the microstructured adhesive elements being designed in such a way that they allow the implant optionally contained in the packaging to adhere or be fastened to the inner surface of the packaging mainly or exclusively on the basis of van der Waals forces.

2. Packaging (1) according to Claim 1, characterized in that the microstructured adhesive elements (7) each have an elongated adhesive element body (9), in particular having a length of 50 µm to 150 µm and a diameter of 10 µm to 40 µm.

3. Packaging (1) according to Claim 2, characterized in that the microstructured adhesive elements (7) each have a free end (9), in particular as a head part on the elongated adhesive element body (8), having a diameter greater than the diameter of the elongated adhesive element body (8), the free end (9) of the microstructured adhesive elements (7) preferably having a diameter of 15 µm to 70 µm.

4. Packaging (1) according to any of the preceding claims, characterized in that the microstructured adhesive elements (7) each have the shape of a rotational hyperboloid.

5. Packaging (1) according to Claim 1, characterized in that the microstructured adhesive elements (7) each have a free end (9) which is separated in the manner of a spatula, in particular as a head part on the elongated adhesive element body (8).

6. Packaging (1) according to any of the preceding claims, characterized in that the inner surface (4) of the packaging (1) is an inner surface of a lower packaging part (2) of the packaging (1).

7. Packaging (1) according to Claim 6, characterized in that that the inner surface (4) of the lower packaging part (2) is a surface, in particular a bottom surface, of a recess (3) in the lower packaging part (2), the recess (3) having a shape which is complementary at least in sections to a shape of an implant (5) to be packaged.

8. Packaging (1) according to Claim 7, characterized in that the microstructured adhesive elements (7) are formed only on the surface, preferably only on the bottom surface, (4) of the recess (3) in the lower packaging part (2).

9. Packaging (1) according to Claim 7 or 8, characterized in that the surface, in particular bottom surface, (4) of the recess (3) in the lower packaging part (2) is designed at least in sections as the surface of a film, in particular a plastic film, on which the protruding, microstructured adhesive elements are formed.

10. Packaging (1) according to Claim 9, characterized in that the film comprises a plastic material or consists of a plastic material which is selected from the group consisting of inorganic elastomers, organic elastomers, siloxanes, especially polyvinylsiloxane, additioncrosslinking silicone elastomers, rubber materials, natural rubber, synthetic rubber, styrene-butadiene rubber, chloroprene rubber, ethylene-propylene-diene rubber, polyacrylates and mixtures thereof.

11. Packaging (1) according to any of the preceding claims, characterized in that the packaging (1) further has a housing-shaped upper packaging part (6), in particular having a rectangular, especially square, or semicircular cross-section.

12. Packaging (1) according to any of the preceding claims, characterized in that the implant (5) is contained in the packaging (1) and adheres to the protruding, microstructured adhesive elements (7).

13. Method for producing a packaging (1) according to any of the preceding claims, comprising the step of: a) generating microstructured adhesive elements (7) on an inner surface (4) of a packaging (1) or on a film, especially plastic film, provided as an inner surface (4) or part of an inner surface (4) of a packaging (1).

14. Use of a packaging (1) according to any of Claims 1 to 12 for packaging an implant.

15. Medical kit, comprising a packaging (1) according to any of Claims 1 to 12 and an implant (5), characterized in that the implant (5) is contained in the packaging (1) and adheres to the microstructured adhesive elements (7) of the inner surface (4) of the packaging (1).