TEMPERATURE SENSOR DEVICE

Description

TECHNICAL AREA

[0001] The invention relates to a temperature sensor device for measuring the temperature of media, in particular flowing media and / or media in industrial process plants, according to the preamble of claim 1. In the following, the medium whose temperature is to be measured is therefore also referred to as the process medium.

[0002] The invention further relates to a method for manufacturing such a temperature sensor device according to the preamble of claim 16.

[0003] To accurately determine the temperature of the process medium, it is often necessary to position a sensitive sensor element, such as a thermistor or a thermocouple junction, at a distance from the wall of a vessel or pipe containing or conveying the process medium. Near the wall, the process medium can often be cooler due to heat loss to the surroundings. Numerous devices are known in the prior art for this purpose, comprising a sensor element inserted into a so-called protective tube. This protective tube, in turn, extends into the vessel or pipe containing or conveying the process medium. The protective tube effectively shields the sensor element from damage and interference caused by the process medium. In particular, the protective tube prevents kinking or tearing in high-flowing process media.A disadvantage of such devices is that the robust protective tube presents a greater thermal resistance, meaning the sensor element can only detect changes in the process medium's temperature with a longer delay. This is also referred to as a longer response time.

[0004] From DE 10 2017 207 006 A1, a temperature sensor device is known which is intended to counteract this disadvantage by having the protective tube have an outlet opening at its distal end, through which a section of the sensor element projects beyond the distal end of the protective tube and can thus come into direct contact with the process medium. Such a protective tube is hereinafter also referred to as a support tube.

[0005] Furthermore, US Patent 3,539,400 A discloses an elongated electrical probe for use in environments with high temperature, oxidation, and strong vibrations. The probe consists of: a plurality of transversely spaced, longitudinally extending conductors; a first elongated volume of insulating material densely compressed between and around the conductors without voids; an annular first shell of high-temperature, creep- and deformation-resistant material densely compressed around the first volume without voids; a second shell of high-temperature and corrosion-resistant material densely compressed around the first shell without voids; means for attaching the second shell to the volume of insulating material, wherein the first shell is held between the elongated volume and the second shell without being attached to the volume or the second shell, so that the first shell can slide freely relative to them in order to absorb the effects of vibration, thermal shock and the like.

[0006] CN 109 781 286 A describes a temperature sensing device for use in high-temperature, high-pressure environments. The device comprises a temperature sensor and a sleeve. The sleeve includes a body and a combination element located on the circumferential surface of the body, which seals the opening of a container. The body has a first end located far from the high-temperature, high-pressure environment under test and a second end extending into the environment. The sensing end of the temperature sensor, extending into the high-temperature, high-pressure environment, protrudes from the body. A compensation end of the temperature sensor penetrates the body and also protrudes from it.Furthermore, the temperature sensing device includes a filling layer for sealing a gap between the temperature sensor and the sleeve body, which fills a space between the part of the temperature sensor positioned in the sleeve body and the sleeve body. TASK OF INVENTION

[0007] The object of the invention is to provide a novel temperature sensor device and a novel method for manufacturing such a device.

[0008] The problem is solved according to the invention by a temperature sensor device which has the features specified in claim 1, and by a method which has the features specified in claim 16.

[0009] Advantageous configurations are the subject of dependent claims. SUMMARY OF THE INVENTION

[0010] A first aspect of the invention relates to a temperature sensor device comprising a support tube with a distal end having a first distal opening, with a proximal end having a first proximal opening, and with a first channel extending between the openings. The temperature sensor device further comprises a first sensor element. The first sensor element comprises, for example, a sheathed cable with a sealed distal end forming a measuring tip, wherein at least one temperature sensor is brought directly to or near the measuring tip and arranged within the sheathed cable. This temperature sensor is, for example, a resistance thermometer, e.g., a platinum resistance thermometer, or a junction of a thermocouple.The sheathed cable is made of stainless steel, for example, and filled with a mineral powder to insulate the sensor wires running inside it, especially thermocouple wires.

[0011] For the purposes of this document, distal ends of the support tube, or openings therein, are defined as those which face the process medium, in particular those which are in direct contact with or adjacent to the process medium. Conversely, proximal ends of the support tube, or openings therein, which face away from the process medium, in particular those which are not in direct contact with the process medium and / or do not immerse themselves in the process medium.

[0012] When the first sensor element, the first channel, the first distal opening, and the first proximal opening are mentioned here, this does not necessarily mean that further sensor elements, channels, distal openings, and / or proximal openings are present. The chosen terminology serves only to distinguish the sensor element, the channel, the distal opening, and the proximal openings from any further sensor elements, channels, distal openings, and / or proximal openings that may be present in exemplary embodiments of the temperature sensor device.

[0013] The first sensor element is inserted through the first proximal opening into the first channel and penetrates it, such that a measuring tip of the first sensor element passes through the first distal opening and extends at least partially beyond the distal end of the support tube. The support tube has a first mounting area at or near its distal end and a second mounting area at or near its proximal end. The first sensor element is sealed to the support tube by soldered connections at both the first and second mounting areas, either directly or indirectly.

[0014] The element described as a "support tube" can alternatively be referred to as a protective tube, particularly in light of the prior art mentioned in the preceding section. The term "support tube" was chosen in the context of the invention to more clearly distinguish the element conceptually from conventional protective tubes, which completely enclose the first sensor element inserted into them and have no opening at their distal end. However, the support tube of the present invention comprises not only the first proximal opening at the proximal end, but also the first distal opening at the distal end. The first sensor element is inserted through the first proximal opening into the first channel of the support tube and passes through it, so that a measuring tip emerges through the first opening at the distal end and projects beyond the distal end.As a result, the support tube does not completely enclose the first sensor element, but only partially, namely along the section which lies between the two openings and runs through the first channel.

[0015] The present temperature sensor device offers the advantage of combining a fast response time and high measurement accuracy with high reliability and safety. The fast response time and high measurement accuracy are achieved by the fact that the measuring tip of the first sensor element extends beyond the first distal end of the support tube, thus allowing it to come into direct contact with the process medium when the temperature sensor device is inserted into a container or pipeline of a process plant containing or through which the process medium flows. Simultaneously, the soldered connections ensure particularly reliable and leak-proof connections. The soldered connection at the first mounting point effectively prevents the process medium from penetrating the first channel through the first distal opening of the support tube.The soldered connection at the second mounting point effectively prevents the process medium from escaping through the first proximal opening at the proximal end of the support tube, thus ensuring that even if the process medium enters at the first distal end or if the support tube breaks, it cannot leave the process system. Therefore, the temperature sensor device effectively prevents the process medium from escaping, even in the event of a malfunction, thereby reducing the risk of hazards.

[0016] The production of soldered joints, such as those used here, is generally referred to as the soldering process in the following.

[0017] An intermediate section of the first channel extends between the first and second mounting areas. Along this intermediate section, the support tube and the first sensor element are not connected and do not touch. This advantageously thermally decouples the first sensor element from the support tube along this intermediate section, enabling higher measurement accuracy. Furthermore, installation of the first sensor element within the support tube is simplified because the risk of jamming or misalignment between the sensor element and the inner walls of the first channel is reduced when inserting it along this intermediate section.As explained previously, the two separate mounting areas ensure a high level of process reliability, since two barriers must be overcome before any process medium could escape. At the same time, this increased process reliability can be achieved cost-effectively, simply, and reliably, because a continuous soldered connection between the first sensor element and the support tube is not required along the entire length of the tube, but only along the separate mounting sections, which are limited in length.

[0018] According to the invention, at least one of the two mounting areas comprises a first section of the first channel, which defines and surrounds the first sensor element. "Definitely surrounds" here, and in the context of this document, means that the inner diameter of the first section of the first channel is matched to the outer diameter of the first sensor element such that a defined annular gap results when the first sensor element is inserted into the first section of the first channel. This first section of the first channel is hereinafter also referred to as the first channel section or simply as the first section. A first plumb bob reservoir is arranged at one end of this first channel section.For the purposes of this document, a solder reservoir is generally defined as any geometry suitable for receiving a solder material and arranged such that the solder can flow into or be fed into designated gaps, particularly annular gaps, during the soldering process, especially vacuum soldering. This allows the solder joint, especially a vacuum solder joint, to be reliably and easily automated or semi-automated. The first solder reservoir can be filled with solder before the soldering process, especially a vacuum soldering process. Preferably, the temperature sensor device is positioned during the soldering process, especially a vacuum soldering process, such that the solder reservoir is located vertically above the first section.This allows the solder, which liquefies during the soldering process, particularly vacuum soldering, to flow into the annular gap created by the defined enclosure of the first sensor element by the first section of the first channel, eliminating the need for any other means or mechanisms. In this way, it is particularly advantageous to ensure that the solder joints, especially vacuum solder joints, extend over the entire length of the mounting sections; in this specific embodiment, this means that the solder has completely flowed into the annular gap between the first section of the first channel and the first sensor element, filling it uniformly over the entire length of the first section.

[0019] In an exemplary embodiment of the temperature sensor device, at least one of the two solder joints is a vacuum solder joint. Preferably, both solder joints—that is, the solder joint at the first mounting area and the solder joint at the second mounting area—are vacuum solder joints. Vacuum solder joints, in this context, refer to solder joints produced under vacuum. Vacuum soldering advantageously prevents or at least reduces impairments caused by oxidation, impurities, or air inclusions in the solder. Thus, the vacuum solder joints at the first and / or second mounting area are of particularly high quality and durability.

[0020] The production of vacuum solder joints, as used in exemplary embodiments of the temperature sensor device, is hereinafter generally referred to as the vacuum soldering process.

[0021] In another exemplary embodiment of the temperature sensor device, the vacuum solder joints comprise, or are produced with, a flux-free solder. This effectively prevents inclusions of flux or flux residues within the solder joint from weakening it or causing leaks. Because the solder joints are produced under vacuum, oxidation effects are effectively prevented anyway, as already mentioned in a previous section. In conjunction with flux-free solder, a joint of particularly high quality can thus be achieved. A flux-free nickel-based solder is especially preferred.

[0022] In an exemplary embodiment of the temperature sensor device, the intermediate section of the first channel is evacuated. This advantageously ensures that the first sensor element is thermally isolated from the support tube along this intermediate section, which can positively affect the measurement accuracy and long-term stability of the first sensor element. Furthermore, it prevents the first sensor element from being affected by gases within the intermediate section. Evacuation of the intermediate section is particularly advantageous when the solder joints are made under vacuum, i.e., when vacuum solder joints are produced. During the vacuum soldering process, the intermediate section is automatically evacuated and sealed on both sides by the solder joints.

[0023] In another exemplary embodiment of the temperature sensor device, the soldered connections, in particular vacuum soldered connections, extend at least substantially over the entire length of the first mounting area and / or the entire length of the second mounting area. The respective mounting area can have a length of at least one millimeter, preferably a length of at least 8 mm, and particularly preferably a length of at least 10 mm. Such a large connection length or depth allows for a particularly reliable and durable seal and connection.Even if, for example, mechanical or chemical damage occurs at the outer edge of the solder joint at the first fastening area due to the process medium, the penetration of the process medium into the first channel can be effectively and permanently prevented by the solder joint extending over the entire length of the fastening area.

[0024] In a further exemplary embodiment of the temperature sensor device, the first section has an inner diameter that is at most 0.5 mm, preferably at most 0.1 mm, and particularly preferably at most 0.03 mm larger than the outer diameter of the first sensor element in the region of the first section. Such dimensions enable a particularly reliable, uniform, and durable soldered connection, especially a vacuum soldered connection, between the first section and the first sensor element.

[0025] In a further exemplary embodiment of the temperature sensor device, the defined enclosure of the first sensor element by the first section extends over a length of at least 1 mm, preferably at least 8 mm, and particularly preferably at least 10 mm. Preferably, the resulting annular gap between the first section and the first sensor element is completely filled with solder over this length, thus tightly connecting these parts.

[0026] In another exemplary embodiment of the temperature sensor device, the intermediate section follows the first section of the first channel, the intermediate section having a larger inner diameter than the first section, at least in some sections. In this embodiment, the first solder reservoir is formed particularly simply by a transition area or a simple step between the first section and the intermediate section. This makes the support tube with the intermediate section, first solder reservoir, and first section of the first mounting area particularly easy and cost-effective to manufacture. The inner diameter of the intermediate section can be, for example, at least 0.05 mm larger, preferably at least 0.1 mm larger, and most preferably at least 1 mm larger than the inner diameter of the first section of the first channel.In this way, a sufficiently large amount of solder can be absorbed by the step or transition area between the intermediate section and the first section to achieve a stable solder joint between the parts during the soldering process, especially vacuum soldering. Furthermore, the advantages of an evacuated intermediate section described in a previous section can be exploited particularly effectively with this type of dimensioning.

[0027] In another exemplary embodiment of the temperature sensor device, at least one of the two mounting areas comprises a second section of the first channel and a connecting sleeve. This second section of the first channel is hereinafter also referred to as the second channel section or simply as the second section. The connecting sleeve precisely encloses the first sensor element, and the second section of the first channel, in turn, precisely encloses the connecting sleeve."Definitively encloses" here means, analogous to the preceding sections, that the inner diameter of the second section of the first channel is matched to the outer diameter of the connecting sleeve, and that the inner diameter of the connecting sleeve is matched to the outer diameter of the first sensor element, such that defined annular gaps result between the elements when the first sensor element is inserted into the connecting sleeve and the connecting sleeve is simultaneously inserted into the second channel section. A second solder reservoir is arranged at one end of the second section. This allows the solder joint, in particular a vacuum solder joint, to be reliably and easily produced automatically or semi-automatically. The second solder reservoir can be filled with solder before the soldering process, in particular the vacuum soldering process.During the soldering process, particularly the vacuum soldering process, the temperature sensor device must be aligned so that the second solder reservoir is located vertically above the second section. This allows the solder, which liquefies during the soldering process, particularly the vacuum soldering process, to flow into the two annular gaps created by the defined enclosure of the first sensor element by the connecting sleeve and by the defined enclosure of the connecting sleeve by the second section of the first channel. In this way, the aforementioned advantageous property can be reliably achieved, namely that the solder joint, particularly the vacuum solder joint, extends over the entire length of the fastening sections. In this specific embodiment, this means that the solder has flowed completely into the two annular gaps and that these gaps are uniformly filled over the entire length of the second section.fills the connecting sleeve.

[0028] In another exemplary embodiment of the temperature sensor device, the second section has an inner diameter that is at most 0.5 mm, preferably at most 0.1 mm, and particularly preferably at most 0.03 mm larger than the outer diameter of the connecting sleeve. Such dimensions enable a particularly reliable, uniform, and durable soldered connection, especially a vacuum soldered connection, between the second section and the connecting sleeve.

[0029] In another exemplary embodiment of the temperature sensor device, the connecting sleeve has an inner diameter that is at most 0.5 mm, preferably at most 0.1 mm, and particularly preferably at most 0.03 mm larger than the outer diameter of the first sensor element. Such dimensions enable a particularly reliable, uniform, and durable soldered connection, especially a vacuum soldered connection, between the connecting sleeve and the first sensor element.

[0030] In a further exemplary embodiment of the temperature sensor device, the defined enclosure of the first sensor element by the connecting sleeve and the second section extends over a length of at least 1 mm, preferably at least 8 mm, and particularly preferably at least 10 mm. Preferably, the resulting annular gaps between the second section and the connecting sleeve, as well as between the connecting sleeve and the first sensor element, are completely filled with solder over this length, thus tightly connecting these parts.

[0031] In another exemplary embodiment of the temperature sensor device, the first mounting area comprises the first section of the first channel, which precisely encloses the first sensor element, as described above. On a side of the first section facing away from its distal end, the intermediate section of the first channel connects to the first section, the intermediate section having a larger inner diameter than the first section. The step between the first section and the intermediate section forms the first solder reservoir, in which a solder, e.g., in the form of a ring of solder material, can be placed before the soldering process, particularly a vacuum soldering process.The second mounting area comprises the second section of the first channel and the connecting sleeve, wherein the connecting sleeve precisely encloses the first sensor element and the second section of the first channel precisely encloses the connecting sleeve, as described above. The second solder reservoir is located at the end of the second section furthest from the distal end of the support tube and is formed by an end face of the connecting sleeve on which a solder, e.g., in the form of a ring of solder material, can be placed before the soldering process, in particular a vacuum soldering process. If the temperature sensor device according to this embodiment is oriented such that the distal end points vertically downwards and the proximal end vertically upwards, the first solder reservoir is located directly above the first section and the second solder reservoir is located directly above the second section and the connecting sleeve.Thus, both solder joints can be created within a single soldering process, particularly a vacuum soldering process, without the need for intermediate realignment or re-soldering of the device. In this embodiment, the temperature sensor device is therefore particularly cost-effective to manufacture.

[0032] In another exemplary embodiment of the temperature sensor device, the proximal end of the support tube is connected to or includes a connector. This advantageously makes it possible to adapt the temperature sensor device to a variety of conceivable connections and to use it in diverse applications. For example, the connector can have a flange connection, a threaded connection (e.g., a screw-in connection), a so-called VanStone connection, or a weld-in connection.

[0033] In another exemplary embodiment of the temperature sensor device, the proximal end of the support tube is integrally connected to the connector; that is, the support tube and connector are manufactured from a single base part, such as a forged blank. This embodiment is particularly robust and durable because the integral construction eliminates the need for connection points, such as welded joints, which would otherwise represent potential weak points.

[0034] In another exemplary embodiment of the temperature sensor device, the support tube and the connector are separate parts, the connector having a through-hole or bore, and the proximal end of the support tube being arranged in or on this through-hole. An arrangement "in this through-hole" in this context means that the support tube completely penetrates the through-hole, i.e., that the support tube projects beyond the connector at least partially on both sides of the through-hole. An arrangement "on this through-hole," on the other hand, means that the proximal end of the support tube is merely inserted into a recess in the through-hole or even only rests against a side face of the connector, such that the through-hole and the second opening overlap at least partially. For example, the support tube has a shoulder that rests against a side face of the connector or an edge of the through-hole.In this arrangement, the two parts are connected by a screw connection and / or a soldered connection, in particular a vacuum soldered connection, and / or one or more welded connections. This embodiment is distinguished by its particularly cost-effective manufacturing using only a few individual parts, while still achieving high stability and load-bearing capacity.

[0035] In another exemplary embodiment, the connector also has a through-passage, and the proximal end of the support tube is arranged in this through-passage, such that the support tube projects beyond the connector at least partially on both sides. The support tube is tightly and securely connected to the connector by welds on both sides. A sealed gap is formed between the support tube and the through-passage of the connector between these welds, for example, in the form of an annular gap. The connector or the support tube has a test bore that extends from a side of the connector or the support tube facing away from the distal end of the support tube to this gap.It is also possible for a test bore to be formed at the proximal end of the support tube, which is connected to the intermediate section, with the connecting piece providing access to the test bore. Alternatively, the test bore can be formed at the proximal end of the support tube even if no connecting piece is provided. The test bore allows for reliable monitoring of whether the welds are still intact and / or whether, for example, a process medium has penetrated the space between the sections. Such monitoring can be implemented, for example, by evacuating the space and connecting a pressure sensor to it via the test bore. This allows for the early detection of damage or defects and reduces the risk of hazards.

[0036] In another exemplary embodiment of the temperature sensor device, the support tube has a conical outer contour that tapers from the proximal to the distal end, and / or the support tube has a helical structure in or on its outer surface, at least in sections, and / or the support tube has an outer diameter that changes periodically along its length. This embodiment enables particularly high reliability and stability, even when used in rapidly flowing process media. The varying thickness or outer contour along the length of the support tube significantly suppresses the excitation of vibrations caused by turbulence.

[0037] In a further exemplary embodiment of the temperature sensor device, the support tube comprises at least a second distal opening at its distal end, at least a second proximal opening at its proximal end, at least a second channel extending between the second distal opening and the second proximal opening, and at least a second sensor element. The support tube has a third mounting area at or near its distal end and a fourth mounting area at or near its proximal end. The second sensor element is inserted through the second proximal opening into the second channel and penetrates it, such that a measuring tip of the second sensor element passes through the second distal opening and projects at least partially beyond the distal end of the support tube.The second sensor element is directly or indirectly sealed to the support tube via soldered connections at the third and fourth mounting points. In this embodiment, the temperature of the process medium can be measured using at least the first and second sensor elements. This redundancy further increases the reliability of process monitoring: even if one of the two sensor elements fails, the redundant sensor element ensures continuous monitoring of the process medium's temperature. Furthermore, this embodiment advantageously allows for continuous or periodic comparison of the sensor signals from both temperature sensors. Because the measuring tips of the sensor elements are located close to each other and are in direct contact with the process medium at the distal end of the support tube, they are exposed to virtually identical environmental influences, including identical temperatures.However, if the sensor signals diverge from each other, or if the difference between the sensor signals changes, this may indicate a malfunction of at least one of the sensors. The embodiment with at least two sensor elements allows such a malfunction to be reliably detected and appropriate repair or corrective measures to be initiated.

[0038] In another exemplary embodiment of the temperature sensor device, a second intermediate section of the second channel extends between the third and fourth mounting areas, with the support tube and the second sensor element not being connected along this second intermediate section. This embodiment—analogous to the explanations in a previous section regarding the intermediate section of the first channel—offers the advantages of greater thermal decoupling between the second sensor element and the support tube, as well as simplified installation of the second sensor element in the second channel, while maintaining undiminished process reliability and enabling simple, cost-effective manufacturing. Particularly strong thermal decoupling can also be advantageously achieved here by evacuating the second intermediate section.The embodiments and configurations explained in previous sections can also be applied analogously to the second channel, the second sensor element, the second proximal opening, the second distal opening, the third and fourth mounting areas, and the second intermediate area in order to achieve the respective advantageous effects.

[0039] A second aspect of the present invention relates to a method for manufacturing a temperature sensor device, in particular a temperature sensor device according to the first aspect of the invention or an exemplary embodiment thereof.

[0040] The procedure begins with the provision of a support tube comprising a distal end with a first distal opening, a proximal end with a first proximal opening, and a first channel extending between these two openings.

[0041] In a subsequent step, a first sensor element, for example, a temperature sensor encased in a mineral-insulated sheathed cable, is inserted through the first proximal opening into the first channel and pushed through the first channel so that the first sensor element passes through the first channel and at least one measuring tip of the first temperature sensor element passes through the first distal opening at the distal end and protrudes at least partially beyond the distal end of the support tube. A first mounting area is located at or near the distal end, and a second mounting area is located at or near the proximal end. The first mounting area comprises a first section of the first channel, which defines and surrounds the support tube, forming an annular gap. A first plumb bob reservoir is positioned at one end of this first section.

[0042] In a subsequent step, soldered connections are made between the support tube and the first sensor element at the two mounting points. This is done in such a way that the support tube and the first sensor element are not connected and do not touch along an intermediate section of the first channel extending between the first and second mounting points.

[0043] This method allows for the cost-effective, efficient, and reliable production of temperature sensor devices. Furthermore, the products of this manufacturing process can effectively achieve the advantages of the temperature sensor device described in the preceding sections, according to the first aspect of this invention.

[0044] In an exemplary embodiment of the method for manufacturing temperature sensor devices, the second mounting area comprises a second section of the first channel and a connecting sleeve, wherein the connecting sleeve defines and encloses the first sensor element, and the second section defines and encloses the connecting sleeve, and wherein a second solder reservoir is arranged at one end of the second section. The term "definedly encloses" is to be understood here in the same way as described in the preceding sections with regard to the first aspect of the invention. In this exemplary embodiment of the method, the following additional step is performed between the previously described step of inserting the first sensor element into the support tube and the step of making the soldered connections: placing solder material in or on the second solder reservoir.The solder material can be used, for example, in the form of rings made of solder material.

[0045] In an exemplary further development of the method for manufacturing temperature sensor devices, the first and second solder reservoirs are each arranged either both at an end of the first section or both at an end of the second section that faces away from the distal end, respectively. This configuration allows the temperature sensor device to be aligned in a partial step of the solder joint production process such that both solder reservoirs are simultaneously located vertically above their respective assigned sections of the first channel; that is, the first solder reservoir is located vertically above the first section and the second solder reservoir is located vertically above the second section. If a soldering process is then carried out in a further partial step and the solder liquefies, it flows by gravity directly into the space between the first section and the first sensor element.The annular gap formed between the second section and the connecting sleeve, as well as between the connecting sleeve and the first sensor element, allows for the particularly efficient, reliable, and cost-effective production of a temperature sensor device using this further development of the method.

[0046] In an exemplary embodiment of the method for manufacturing temperature sensor devices, the soldered joints are vacuum soldered joints, that is, the soldered joints are manufactured under vacuum, i.e., by a vacuum soldering process.

[0047] The disclosure content of this document is not limited to the features of the aforementioned exemplary embodiments and / or further developments, but also includes any combinations of these features, insofar as they do not logically exclude each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Exemplary embodiments and further developments of the temperature sensor device are explained in more detail below with reference to drawings. The drawing(s) show(s). Figure 1 shows an exemplary embodiment of a temperature sensor device in a cross-sectional view; Figures 2A, 2B, 3A and 3B show various exemplary embodiments of a first mounting area before and after a soldering process; Figures 4A, 4B, 5A and 5B show various exemplary embodiments of a second mounting area before and after a soldering process; Figure 6 shows an exemplary embodiment of a temperature sensor device in a cross-sectional view; Figures 7A and 7B show various exemplary embodiments of a temperature sensor device; Figure 8 shows an exemplary embodiment of a temperature sensor device in a cross-sectional view; Figure 9 shows an exemplary embodiment of the temperature sensor device in a sectional view; and Figure 10 shows another exemplary embodiment of a temperature sensor device in a sectional view.

[0049] Corresponding parts are referenced in all figures using the same reference symbols. DETAILED DESCRIPTION OF THE DRAWINGS

[0050] In Figure 1Figure 1 shows an exemplary embodiment of a temperature sensor device 100. It comprises a support tube 110 with a distal end 111 having a first distal opening 112 and a proximal end 113 having a first proximal opening 114. A first channel 115 extends between the openings 112 and 114, comprising a first mounting area 130, an intermediate section 116, and a second mounting area 140. A first sensor element 120 is inserted into the first channel 115 through the first proximal opening 114 and passes through it, such that a measuring tip 121 of the first sensor element 120 passes through the first distal opening 112 and projects beyond the distal end 111 of the support tube 110. The support tube 110 is sealedly connected to the first sensor element 120 by soldered connections 150, 150' at the first and second mounting areas 130, 140.These solder joints 150, 150' are, for example, vacuum solder joints.

[0051] In this example, the first mounting area 130 comprises a first section 131 of the first channel 115, which defines and surrounds the first sensor element 120. The intermediate section 116, which has a larger inner diameter than the first section 131, adjoins this first section 131. The step formed between the sections creates a first plumb bob reservoir 132, which is thus located vertically directly above the first area 131. Such a mounting area 130 is described in detail in the Figures 2A and 2B depicted.

[0052] In this example, the second mounting area 140 comprises a second section 141 of the first channel 115 and a connecting sleeve 143, wherein the connecting sleeve 143 defines and encloses the first sensor element 120, and the second section 141 of the first channel 115 defines and encloses the connecting sleeve 143. A second plumb bob reservoir 142 is provided vertically directly above the second section 141 and the connecting element 143. Such a mounting area 140 is described in detail in the Figures 4A and 4B depicted.

[0053] The first sensor element 120 is, for example, a mineral-insulated sheathed cable within which a sensor is arranged at or near the measuring tip 121. This sensor can be, for example, a resistance thermometer or a junction of two thermocouple wires. At one end of the first sensor element 120, facing away from the measuring tip 121, there are contacts 122, via which the sensor can be connected to an evaluation unit that, for example, evaluates an electrical property of the sensor, such as voltage, current, or resistance, to obtain a temperature measurement.

[0054] The Figures 2A, 2B, 3A, and 3B Each shows different exemplary embodiments of the first fastening area 130, which Figures 4A, 4B, 5A and 5BFigures 1 and 2 show various exemplary embodiments of the second fastening area 140. Figures 1 and 2 show a respective fastening area 130, 140 before a soldering or vacuum soldering process, whereas figures 1 and 2 show a respective fastening area 130, 140 after a soldering or vacuum soldering process.

[0055] In the Figures 2A and 2BThe first attachment area 130 at the distal end 111 of the support tube 110 is shown enlarged in a sectional view. The attachment area 130 comprises a first section 131 of the first channel 115, which defines and surrounds the first sensor element 120. An intermediate section 116, which has a larger inner diameter than the first section 131, adjoins the first section 131. A step between the two sections forms a first plumb reservoir 132. As shown in Figure 2A As can be seen, solder material 132 can be placed in this solder reservoir, e.g. in the form of a ring of solder material 151. If the support tube 110, as in the Figures 2A and 2BWhen the solder reservoir 132 is oriented so that its distal end points vertically downwards, it is located vertically directly above the annular gap that forms between the first section 131 and the first sensor element 120 at the first mounting area 130. Thus, when the solder material liquefies during a soldering process, particularly a vacuum soldering process, it can flow down into the annular gap by gravity and fill it. As shown in Figure 2B As shown, this allows for a complete filling of the annular gap, so that the produced solder joint 150 extends fully over the entire length of the first section 131.

[0056] The Figures 3A and 3BFigure 1 shows another exemplary embodiment of the fastening area 130 at the distal end 111 of the support tube 110, enlarged in a sectional view. In this example, the solder reservoir 132 is formed by a recess at the distal end 111. Solder material, for example in the form of a ring of solder material 151, can simply be placed here. If the support tube 110, as shown in the figures, Figures 3A and 3B As depicted, the solder reservoir 132 is oriented so that its distal end points vertically upwards. Thus, it is located vertically directly above the annular gap that exists between the first section 131 and the first sensor element 120 at the first mounting area 130. Therefore, when the solder material liquefies during a soldering process, particularly a vacuum soldering process, it can flow down into the annular gap by gravity and fill it. As shown in Figure 3BAs shown, this allows for a complete filling of the annular gap, so that the produced solder joint 150 extends fully over the entire length of the first section 131.

[0057] In the Figures 4A and 4B The second mounting area 140 at the proximal end 113 of the support tube 110 is shown enlarged in a sectional view. The mounting area 140 comprises a second section 141 of the first channel 115 and a connecting sleeve 143, wherein the connecting sleeve 143 defines and encloses the first sensor element 120, and the second section 141 of the first channel 115 defines and encloses the connecting sleeve 143. A second plumb reservoir 142 is provided vertically directly above the second section 141 and the connecting element 143. As shown in Figure 4A As can be seen, solder material can be placed in this second solder reservoir 142, e.g. in the form of a ring of solder material 151. If the support tube 110, as in the Figures 4A and 4B When the solder reservoir 142 is oriented so that the proximal end 113 points vertically upwards, it is located vertically directly above the annular gap between the second section 141 and the connecting sleeve 143, and between the connecting sleeve 143 and the first sensor element 120 at the second mounting area 140. Thus, when the solder material liquefies during a soldering process, particularly a vacuum soldering process, it can flow down into the annular gap by gravity and fill it. As shown in Figure 4B As shown, this allows for a complete filling of both annular gaps, so that the soldered joints produced 150' extend fully over the entire length of the second section 141.

[0058] The Figures 5A and 5BFigure 1 shows another exemplary embodiment of the fastening area 140 at the proximal end 111 of the support tube 110, enlarged in a sectional view. In this example, the solder reservoir 142 is formed by a chamber within the first channel, which is located at an end of the connecting sleeve 143 facing away from the proximal end 133. Solder material, for example in the form of a ring of solder material 151, can be placed here. A schematically depicted holding device 300 holds the connecting sleeve 143 in the desired position before and during the soldering process, in particular the vacuum soldering process, so that it cannot slip downwards out of the second section 141. When the support tube 110, as shown in the figures, is mounted in the first channel, the connecting sleeve 143 is held in the desired position by a clamping device 140. Figures 5A and 5BAs depicted, the solder reservoir 142 is oriented so that the proximal end points vertically upwards. Thus, it is located vertically directly above the annular gap between the second section 141 and the connecting sleeve 143, as well as between the connecting sleeve and the first sensor element 120 at the second mounting area 140. Therefore, when the solder material liquefies during a soldering process, particularly a vacuum soldering process, it can flow down into the annular gap by gravity and fill it. As shown in Figure 5B As shown, this allows for a complete filling of the annular gap, so that the soldered joints produced 150' extend fully over the entire length of the second section 141.

[0059] Figure 6 shows an exemplary embodiment of the temperature sensor device 100, similar to that from Figure 1, in a sectional view. In this example, the support tube 110 is connected to a connector 170, which is designed in the form of a flange. The connector 170 has a central opening 174, for example, a bore. The support tube 110 has a shoulder 117 at its proximal end 113 and is pushed through the opening 174 so that the shoulder 117 rests against a side of the connector 170 facing away from the distal end 111 of the support tube 110. The support tube 110 and the connector 170 are tightly connected to each other by welds 171. A gap 173 is enclosed between the welds 171, the opening 174, and the outer circumference of the support tube 110. A test bore 172 extends from a side of the connecting piece 170 facing away from the distal end 111 of the support tube 110 to this space 173.

[0060] The Figures 7A and 7BThe figures show various exemplary embodiments of the temperature sensor device 100 in a side view. Figure 7A The support tube 110 has a conical outer contour, tapering from the proximal end 113 to the distal end 111.

[0061] In Figure 7B The support tube 110 has a conical section in the area of ​​the proximal end 113, to which a section is connected which is provided with a helical structure 160.

[0062] Although in the previously described embodiments the first mounting area 130 always comprises a first section 131 which directly (i.e., without a connecting sleeve 143) defines and encloses the first sensor element 120, and the second mounting area 140 comprises a second section 141 and a connecting sleeve 143, the present invention is not limited to this combination. For example, the arrangement can also be configured in the opposite way. That is, the first mounting area 130 can comprise a second section 141 and a connecting sleeve 143, while the second mounting area 140 can comprise a first section 131 which directly (i.e., without a connecting sleeve 143) defines and encloses the first sensor element 120.Likewise, both mounting areas 130, 140 can be designed in the same way, i.e., both may comprise a section of the first channel 115 which defines and encloses the first sensor element 120, or both may comprise a connecting sleeve 143 which defines and encloses the first sensor element 120, and a section of the first channel 115 which defines and encloses this connecting sleeve 143.

[0063] Figure 8 shows an exemplary embodiment of the temperature sensor device 100, similar to that from Figure 6 , in a sectional view.

[0064] In this example, the support tube 110 is connected to a connector 170, which is designed in the form of a flange. The connector 170 has a central opening 174, for example, a bore. The support tube 110 has a shoulder 117 between its proximal end 113 and distal end 111 and is pushed through the opening 174 from below, so that the shoulder 117 rests against a side of the connector 170 facing the distal end 111 of the support tube 110, or the connector 170 rests on the shoulder 117. The support tube 110 and the connector 170 are tightly connected to each other by welds 171. A gap 173 is enclosed between the welds 171, the opening 174, and the outer circumference of the support tube 110.A test bore 172 extends from a side of the connecting piece 170 facing away from the distal end 111 of the support tube 110 to this intermediate space 173 and from there through the support tube 110 into the intermediate section 116. That is, a test bore 172 is formed at the proximal end 113 of the support tube 110, which is connected to the intermediate section 116, with the connecting piece 170 having access to the test bore 172.

[0065] In Figure 9 is an exemplary embodiment of the temperature sensor device 100, similar to that from Figure 1 , shown in a sectional view.

[0066] In addition to the one in Figure 1 In the illustrated embodiment, a test bore 172' is formed at the proximal end 113 of the support tube 110, which is connected to the intermediate section 116.

[0067] Figure 10shows another exemplary embodiment of a temperature sensor device 100 in a sectional view.

[0068] Unlike the one in Figure 1 In the illustrated embodiment, the support tube 110 has, at its distal end 111, in addition to the first distal opening 112, a second distal opening 212 and, at its proximal end 113, in addition to the first proximal opening 114, a second proximal opening 214.

[0069] Between the second distal opening 212 and the second proximal opening 214 extends a second channel 215, which includes a third attachment area 230, an intermediate section 216 and a fourth attachment area 240.

[0070] A second sensor element 220 is inserted through the second proximal opening 214 into the second channel 215 and passes through it, so that a measuring tip 221 of the second sensor element 220 passes through the second distal opening 212 and extends beyond the distal end 111 of the support tube 110.

[0071] The support tube 110 is sealedly connected to the second sensor element 220 by soldered connections 250, 250' at the third and fourth mounting areas 230, 240. These soldered connections 250, 250' are, for example, vacuum soldered connections. In the area of ​​the intermediate section 216 of the second channel 215 extending between the third and fourth mounting areas 230, 240, the support tube 110 and the second sensor element 220 are not connected.

[0072] In this example, the third mounting area 230 comprises a first section 231 of the second channel 215, which defines and surrounds the second sensor element 220. The intermediate section 216, which has a larger inner diameter than the first section 231, adjoins this first section 231. The step formed between the sections creates a first plumb bob reservoir 232, which is thus located vertically directly above the first section 231. A mounting area 230 designed in this way is, for example, analogous to the one described in the Figures 2A and 2B The illustrated fastening area 130 is formed.

[0073] In this example, the second mounting area 240 comprises a second section 241 of the second channel 215 and a connecting sleeve 243, wherein the connecting sleeve 243 defines and encloses the second sensor element 220, and the second section 241 of the second channel 215 defines and encloses the connecting sleeve 243. A second plumb bob reservoir 242 is provided vertically directly above the second section 241 and the connecting element 243. A mounting area 240 configured in this way is, for example, analogous to that described in the Figures 4A and 4B The illustrated fastening area 140 is formed.

[0074] The second sensor element 220 is, for example, a mineral-insulated sheathed cable within which a sensor is arranged at or near the measuring tip 221. This sensor can be, for example, a resistance thermometer or a junction of two thermocouple wires. At one end of the second sensor element 220, facing away from the measuring tip 221, there are contacts 222, via which the sensor can be connected to an evaluation unit that, for example, evaluates an electrical property of the sensor, such as voltage, current, or resistance, to obtain a temperature measurement. REFERENCE MARK LIST

[0075] 100 Temperature sensor device 110 Support tube 111 Distal end of support tube 112 Distal opening 113 Proximal end of support tube 114 Proximal opening 115 First channel 116 Intermediate section 117 Shoulder 120 First sensor element 121 Measuring tip 122 Contacts 130 First mounting area 131 First section 132 First solder reservoir 140 Second mounting area 141 Second section 142 Second solder reservoir 143 Connecting sleeve 150, 150' Solder joint 151 Ring of solder material 160 Helical structure 170 Connector 171 Weld 172, 172' Test hole 173 Intermediate space 174 Through hole 212 Distal opening 214 Proximal opening 215 Second channel 216 Intermediate section 220 Second sensor element 221 Measuring tip 222 Contacts 230 Third mounting area 231 First section 232 First solder reservoir 240 Fourth mounting area 241 Second section 242 Second solder reservoir 243 Connecting sleeve 250, 250' Solder joint 300 Holding device

Claims

1. Temperature sensor device (100), comprising - a support tube (110) having a distal end (111) having a first distal opening (112), a proximal end (113) having a first proximal opening (114) and a first channel (115) which extends between the openings (112, 114), and - a first sensor element (120) which is introduced through the first proximal opening (114) into the first channel (115) and passes through the latter so that a measuring tip (121) of the first sensor element (120) penetrates the first distal opening (112) and protrudes at least in portions beyond the distal end (111) of the support tube (110), wherein - the support tube (110) has a first fastening region (130) at or near the distal end (111), and a second fastening region (140) at or near the proximal end (113), - the first sensor element (120) is connected in a sealing manner, indirectly or directly, to the support tube (110) by soldered connections (150, 150') on the first and the second fastening region (130, 140), characterized in that - an intermediate portion (116) of the first channel (115) extends between the first and the second fastening region (130, 140), wherein the support tube (110) and the first sensor element (120) are not connected and are not in contact along the intermediate portion (116), and in that - at least one of the fastening regions (130, 140) comprises a first portion (131) of the first channel (115), which encloses the first sensor element (120) in a defined manner while forming an annular gap, - a first solder reservoir (132) for receiving a solder is disposed on one end of the first portion (131), and - the soldered connection (150) is formed by solder flowing from the solder reservoir (132) into the annular gap and filling the annular gap completely.

2. Temperature sensor device (100) according to Claim 1, wherein the soldered connection (150, 150') on the first fastening region (130) and / or the soldered connection (150, 150') on the second fastening region (140) are / is a vacuum soldered connection produced with a flux-free solder.

3. Temperature sensor device (100) according to Claim 1 or 2, wherein the intermediate portion (116) is evacuated.

4. Temperature sensor device (100) according to one of the preceding claims, wherein the soldered connections (150, 150') extend in each case at least substantially over a total length of the first fastening region (130) and / or a total length of the second fastening region (140).

5. Temperature sensor device (100) according to one of the preceding claims, wherein the first portion (131) has an internal diameter which - is larger by at most 0.5 mm, or - preferably is larger by at most 0.1 mm, or - particularly preferably is larger by at most 0.03 mm than the external diameter of the first sensor element (120) in the region of the first portion (131), and / or wherein the first portion (131) encloses the first sensor element (120) in a defined manner over a length of - at least 1 mm, or - preferably at least 8 mm, or - particularly preferably at least 10 mm and is circumferentially connected in a sealing manner by the soldered connection (150, 150') to the first sensor element over this length.

6. Temperature sensor device (100) according to one of the preceding claims, wherein the intermediate portion (116) adjoins the first portion (131) of the first channel (115), wherein the intermediate portion (116) has a larger internal diameter than the first portion (131), and wherein the first solder reservoir (132) is formed by a transition region or a step between the first portion (131) and the intermediate portion (116).

7. Temperature sensor device (100) according to Claim 6, wherein the internal diameter of the intermediate portion (116) - is larger by at least 0.05 mm, or - preferably is larger by at least 0.1 mm, or - particularly preferably is larger by at least 1 mm than the internal diameter of the first portion (131) of the first channel (115).

8. Temperature sensor device (100) according to one of the preceding claims, wherein at least one of the fastening regions (130, 140) comprises a second portion (141) of the first channel (115) and a connecting sleeve (143), wherein - the connecting sleeve (143) encloses the first sensor element (120) in a defined manner, and - the second portion (141) of the first channel (115) encloses the connecting sleeve (143) in a defined manner, and - a second solder reservoir (142) is disposed on one end of the second portion (141).

9. Temperature sensor device (100) according to Claim 8, wherein the second portion (141) of the first channel (115) has an internal diameter which - is larger by at most 0.5 mm, or - preferably is larger by at most 0.1 mm, or - particularly preferably is larger by at most 0.03 mm than the external diameter of the connecting sleeve (143), and / or wherein the connecting sleeve (143) has an internal diameter which - is larger by at most 0.5 mm, or - preferably is larger by at most 0.1 mm, or - particularly preferably is larger by at most 0.03 mm than the external diameter of the first sensor element (120), and / or wherein the second portion (141) of the first channel (115) and the connecting sleeve (143) enclose the first sensor element (120) over a length of - at least 1 mm, or - preferably at least 8 mm, or - particularly preferably at least 10 mm and the second portion (141) is circumferentially connected in a sealing manner to at least the connecting sleeve (143), and the connecting sleeve (143) is moreover circumferentially connected in a sealing manner to the first sensor element (120), by the soldered connection (150, 150') over this length.

10. Temperature sensor device (100) according to one of the preceding claims, wherein the proximal end (113) of the support tube (110) is connected to a connection piece (170), or comprises such a connection piece (170).

11. Temperature sensor device (100) according to Claim 10, wherein the support tube (110) is integrally connected to the connection piece (170), or wherein the connection piece (170) has a passage and the proximal end (113) of the support tube (110) is disposed in or at this passage and is connected to the connection piece (170) by way of - a threaded connection, and / or - a soldered connection, in particular a vacuum soldered connection, and / or - one or a plurality of welded connections.

12. Temperature sensor device (100) according to Claim 10, wherein the connection piece (170) has a passage, and the proximal end of the support tube (110) is disposed in or at this passage and is connected by welded connections (171) on both sides of the passage to the connection piece (170), wherein the connection piece (170) has a test bore (172) which extends from a side of the connection piece (170) facing way from the distal end (111) of the support tube (110) into an intermediate space (173) formed between the passage, the proximal end (113) and the welded connections (171), or formed on the proximal end (113) of the support tube (110) is a test bore (172) which is connected to the intermediate portion (116), wherein the connection piece (170) has an access to the test bore (172).

13. Temperature sensor device (100) according to one of the preceding claims, wherein formed on the proximal end (113) of the support tube (110) is a test bore (172') which is connected to the intermediate portion (116).

14. Temperature sensor device (100) according to one of the preceding claims, wherein the support tube (110) comprises at least one second distal opening (212) at the distal end (111), - at least one second proximal opening (214) at the proximal end (113), - at least one second channel (215) extending between the second distal opening (212) and the second proximal opening (214), and - at least one second sensor element (220), wherein - the second sensor element (220) is introduced through the second proximal opening (214) into the second channel (215) and passes through the latter so that a measuring tip (221) of the second sensor element (220) penetrates the second distal opening (212) and protrudes at least in portions beyond the distal end (111) of the support tube (110), - the support tube (110) has a third fastening region (230) at or near the distal end (111), and a fourth fastening region (240) at or near the proximal end (113), and - the second sensor element (220) is connected in a sealing manner, indirectly or directly, to the support tube (110) by soldered connections (250, 250') on the third and the fourth fastening region (230, 240).

15. Temperature sensor device (100) according to Claim 14, wherein a second intermediate portion (216) of the second channel (215) extends between the third and the fourth fastening region (230, 240), wherein the support tube (110) and the second sensor element (220) are not connected along the second intermediate portion (216).

16. Method for producing a temperature sensor device (100) according to one of the preceding claims, comprising the steps: A) providing a support tube (110) having a distal end (111) having a first distal opening (112), a proximal end (113) having a first proximal opening (114), and a first channel (115) which extends between the openings (112, 114), B) introducing a sensor element (120) into the first channel (115) through the first proximal opening (114), so that the first sensor element (120) extends through the first channel and a measuring tip (121) of the first sensor element (120) penetrates the first distal opening (112) and protrudes at least in portions beyond the distal end (111) of the support tube (110), wherein a first fastening region (130) is located at or near the distal end (111), and a second fastening region (140) is located at or near the proximal end (113), and wherein the first fastening region (130) comprises a first portion (131) of the first channel (115), which encloses the support tube (110) in a defined manner while forming an annular gap, and wherein a first solder reservoir (132) is disposed on one end of the first portion (131), and B1) placing solder material in or at the first solder reservoir (131), and C) producing soldered connections (150, 150') between the support tube (110) and the first sensor element (120) on the first and the second fastening regions (130, 140) in such a manner that the support tube (110) and the first sensor element (120) are not connected and are not in contact along an intermediate portion (116) of the first channel (115) extending between the first and the second fastening region (130, 140).

17. Method according to Claim 16, wherein the second fastening region (140) comprises a second portion (141) of the first channel (115) and a connecting sleeve (143), wherein the connecting sleeve (143) encloses the first sensor element (120) in a defined manner, and the second portion (141) encloses the connecting sleeve (143) in a defined manner, and wherein a second solder reservoir (142) is disposed on one end of the second portion (141), comprising the following step, carried out between steps B) and C): B2) placing solder material in or at the second solder reservoir (141).

18. Method according to Claim 17, wherein the first solder reservoir (132) and the second solder reservoir (142) are in each case either both disposed on an end of the first portion (131) or second portion (141) facing away from the distal end (111), or both disposed on an end of the first portion (131) or the second portion (141) facing the distal end (111), and wherein step C) comprises the following sub-steps: C1) aligning the temperature sensor device (100) so that the first solder reservoir (132) is located vertically above the first portion (131), and the second solder reservoir (142) is located vertically above the second portion (141), and C2) carrying out a soldering process.

19. Method according to one of Claims 16 to 18, wherein the soldered connections (150, 150') are generated as vacuum soldered connections in a soldering process designed as a vacuum soldering process.