RFID antenna manufactured by multi-cutting

Description

Field of the Disclosure

[0001] The present subject matter relates to radio frequency identification ("RFID") devices. More particularly, the present subject matter relates to antennas for RFID devices and methods for making such antennas.Description of Related Art

[0002] Devices incorporating RFID technology are widely used for a variety of different applications, including security locks in cars, access control to buildings, and inventory tracking systems in manufacturing, warehouse, in-store retail, and other operations enhanced by tracking functions.

[0003] RFID devices may have a variety of integrated components, among them an RFID chip containing data (e.g., an identification code) and an antenna electrically connected to the chip and responsible for transmitting signals to and / or receiving signals from another RFID device (e.g., an RFID reader system).

[0004] The antenna of an RFID device may be manufactured in a variety of ways, such as by patterning, etching, or printing a conductor on a substrate. The configuration of the antenna is important in properly tuning the antenna for communication with an RFID reader system and for optimal performance of the antenna. Some conventional approaches to forming an antenna on a substrate are low-cost, but are limiting on the structure of the resulting antenna. For example, the central transformer section of an antenna formed by a conventional die cutting procedure may have lines and gaps that are wider than desirable and / or loops with radii that are larger than desirable. Such constraints on the dimensions and / or shape of antennae formed by die cutting processes are due to the inherent limitations of die cutting processes. Another disadvantage of die cutting processes is that a new die is required for each antenna design. The need to design, manufacture, and use a new die for each antenna design results in increased time and expense. Other approaches are capable of more precisely forming an antenna, but they tend to be more expensive than the less precise approaches.

[0005] CN106252815A relates to producing a radio frequency identification antenna and discloses a method comprising carrying out die cutting to form a main part of the antenna and carrying out laser cutting on a fine part of the antenna. CN108879068A relates to a manufacturing method of environmentally-friendly high-precision RFID label antenna structure.Summary

[0006] There are several aspects of the present subject matter which may be embodied separately or together in the devices and systems described and claimed below. These aspects may be employed alone or in combination with other aspects of the subject matter described herein, and the description of these aspects together is not intended to preclude the use of these aspects separately or the claiming of such aspects separately or in different combinations as set forth in the claims appended hereto.

[0007] The scope of the protection conferred is determined from the claims.

[0008] In one aspect of the disclosure, a method is provided for manufacturing an antenna for an RFID device. The method includes providing a conductive material on a substrate and performing a first cutting process on the conductive material to define an initial antenna. One or more subsequent cutting processes are performed on the initial antenna to define a final antenna, with the first and at least one of the one or more subsequent cutting processes being different. In some examples, the one or more subsequent cutting processes comprises a second cutting process. In some examples, the one or more subsequent cutting processes comprises a second cutting process and a third cutting process. In some examples, four or more cutting processes may be performed.

[0009] In another aspect of the disclosure, a method is provided for manufacturing an antenna for an RFID device. The method includes providing a conductive material on a substrate and performing a first cutting process via die cutting on the conductive material to define an initial antenna. One or more subsequent cutting processes are performed by laser cutting on the initial antenna to define a final antenna, with the laser cutting blowing at least a portion of the initial antenna off of the substrate. In some examples, the one or more subsequent cutting processes comprises a second cutting process performed by laser cutting. In some examples, the one or more subsequent cutting processes comprises a second cutting process and a third cutting process, where one or both of the second and third cutting processes comprise laser cutting.

[0010] According to a further aspect of the disclosure, a method is provided for manufacturing an antenna for an RFID device. The method includes providing a conductive material of aluminum foil on a substrate of paper material and performing a first cutting process on the conductive material to define an initial antenna. One or more subsequent cutting processes are performed on the initial antenna to define a final antenna, with the first and at least one of the one or more subsequent cutting processes being different. In some examples, the first cutting process is a die cutting process and at least one of the one or more subsequent cutting processes is a laser cutting process. In some examples, the one or more subsequent cutting processes comprise at least a second and a third cutting process, and one of the second or third cutting processes is different than the first cutting process and the other of the second or third cutting processes is the same as the first cutting process. For example, the first and second cutting processes may both be die cutting processes, while the third cutting process may be a laser cutting process. In other examples, the first and third cutting processes are both die cutting processes and the second cutting process is a laser cutting process.

[0011] In yet another aspect of the disclosure, a method is provided for manufacturing an antenna for an RFID device. The method includes providing a conductive material on a substrate and performing a first cutting process on at least one discrete region of the conductive material to define an initial antenna. One or more subsequent cutting processes are performed by removing substantially all of the conductive material at the at least one discrete region of the initial antenna to define a final antenna.

[0012] According to an added aspect of the disclosure, a method is provided for manufacturing an antenna for an RFID device. The method includes providing a conductive material on a substrate and performing a first cutting process on at least one discrete region of the conductive material to define an initial antenna. One or more subsequent cutting processes are performed by removing substantially all of the conductive material at the at least one discrete region of the initial antenna to define a final antenna, which at least one of the one or more subsequent cutting processes applies a laser in a plurality of offset passes within the at least one discrete region, with at least partially overlapping laser cuts removing substantially all of the conductive material in the at least one discrete region.

[0013] In accordance with a further aspect of the disclosure, a method is provided for manufacturing an antenna for an RFID device. The method includes providing a conductive material on a substrate and performing a first cutting process on the conductive material to define an initial antenna. One or more subsequent cutting processes are performed on the initial antenna to define a final antenna, with the first and at least one of the one or more subsequent cutting processes being different. At least one of the one or more subsequent cutting processes is performed on at least one discrete region of the initial antenna, and a first portion of the conductive material in the at least one discrete region is removed while retaining and isolating a second portion of the conductive material in the at least one discrete region.

[0014] Following an added aspect of the disclosure, a method is provided for manufacturing an antenna for an RFID device. The method includes providing a conductive material on a substrate and performing a first cutting process on the conductive material to define an initial antenna. One or more subsequent cutting processes are performed on the initial antenna to define a final antenna, with the first and at least one of the one or more subsequent cutting processes being different. A portion of the conductive material in a discrete region of the initial antenna is removed from the substrate during or following the one or more subsequent cutting processes.

[0015] According to another aspect of the disclosure, a method is provided for manufacturing an antenna for an RFID device. The method includes providing a conductive material on a substrate and performing a first cutting process on the conductive material to define an initial antenna. One or more subsequent cutting processes are performed on the initial antenna to define a final antenna, with the first and at least one of the one or more subsequent cutting processes being different. The initial antenna has portions selected from at least one line having a width of at least one millimeter and / or at least one loop having a radius of at least 0.75 millimeter, and at least one of the one or more subsequent cutting processes is performed to reduce the width of the at least one line and / or to reduce the radius of the at least one loop.

[0016] In a further aspect of the disclosure, a method is provided for manufacturing an antenna for an RFID device. The method includes providing a conductive material on a substrate and performing a first cutting process on the conductive material to define an initial antenna. One or more subsequent cutting processes are performed on the initial antenna to define a final antenna, with the first and second cutting processes being different. At least one of the one or more subsequent cutting processes is performed on at least a portion of at least one line and / or loop of a central transformer section of the final antenna.

[0017] In a further example, at least one of the one or more subsequent cutting processes position relative to the first cutting process compensates for inaccuracies in the dimensions provided by the first cutting process.

[0018] In a further example, at least one of the one or more subsequent cutting processes is performed after the RFID tag has a chip or strap attached to it, and the at least one of the one or more subsequent cutting process alters the dimensions of the structure formed using the first cutting process based on a measurement performed on the RFID tag, such as operational frequency, to allow compensation for manufacturing variations.Brief Description of the Drawings

[0019] Fig. 1A is a top plan view of a first conductive pattern formed on a substrate using a first cutting process; Fig. 1B is a top plan view of the first conductive pattern of FIG. 1A, configured as an initial antenna after a second cutting process; Fig. 2 is a top plan view of the initial antenna of Fig. 1B during a subsequent cutting process; and Fig. 3 is a top plan view of the initial antenna of Fig. 1B, configured as a final or fully processed antenna following the subsequent cutting process. Description of the Illustrated Embodiments

[0020] The embodiments disclosed herein are for the purpose of providing a description of the present subject matter, and it is understood that the subject matter may be embodied in various other forms and combinations not shown in detail. Therefore, specific designs and features disclosed herein are not to be interpreted as limiting the subject matter as defined in the accompanying claims.

[0021] Figs. 1A and 1B show the basic structure of a partially manufactured RFID device. In the embodiment of Fig. 1A, a conductive material 10 is provided on a substrate 12. The conductive material 10 may be provided so as to cover all or a portion of one of the surfaces of the substrate 12. The nature of the conductive material 10, the substrate 12, and the manner in which the conductive material 10 is associated to the substrate 12 may vary without departing from the scope of the present disclosure. In one exemplary embodiment, the conductive material 10 comprises a thin metallic layer (e.g., an aluminum foil) that is secured to a substrate 12, which may be formed of any suitable paper material, by an adhesive. In other embodiments, the material composition of the conductive material 10 may differ (e.g., by being provided as some other conductor), the material composition of the substrate 12 may differ (e.g., by being provided as a fabric or glass or plastic or ceramic material), and / or the manner in which the two are joined may differ (e.g., with the conductive material 10 being crimped to the substrate 12).

[0022] The conductive material 10 is subjected to a first cutting process to convert it from an initial or unprocessed shape or state to the roughly defined shape of an antenna, which structure is referred to herein as an initial or partially processed antenna 15. In some embodiments, a first cutting process and a second cutting process are used to convert conductive material 10 from an initial or unprocessed shape or state to the initial antenna 15. The shape of the initial antenna 15 approximates the shape of the conductive material 10 in its final state as a final or fully processed antenna 16 (an example being illustrated by Fig. 3), but differs from the shape of the final antenna 16 in at least one location. The difference between the respective shapes of the initial antenna 15 and of the final antenna 16 is due to the limitations of the first cutting process (and, optionally, the second cutting process) as compared to the capabilities of a subsequent, different cutting process (to be described). overlapping laser cuts removing substantially all of the conductive material 10 in the region by ablation.

[0023] According to the invention, alternatively, as noted to above, rather than removing substantially all of the conductive material 10 in a discrete region, at least a portion of the conductive material 10 is retained on the substrate 12, but electrically isolated from the final antenna 16. This may be achieved, for example, by removing a line of conductive material 10 so as to define a gap between the final antenna 16 and the portion of the conductive material 10 retained in the region, which effectively isolates the conductive material 10 in the region from the final antenna 16.

[0024] If the conductive material 10 is not removed during the one or more subsequent cutting processes, it may be removed following the one or more subsequent cutting processes. Examples of the material being removed following the one or more subsequent cutting processes may include the material being cleared from the substrate 12 by an air knife and / or a vacuum system after the one or more subsequent cutting processes have been executed.

[0025] Once the final antenna 16 has been created, an RFID chip may be electrically coupled to it to allow communication with another RFID-enabled device, such as an RFID reader. In addition to an RFID chip, it should be understood that RFID devices according to the present disclosure may include additional components beyond those shown in Figs. 1-3. For example, the substrate 12 may include additional layers, such as a liner associated with the surface of the substrate 12 opposite the surface associated with the conductive material 10.

[0026] It will be understood that the aspects, embodiments and examples described herein are illustrative examples of some of the applications of the principles of the present subject matter. Numerous modifications may be made by those skilled in the art without departing from the scope of the claimed subject matter, including those combinations of features that are individually disclosed or claimed herein. For these reasons, the scope hereof is not limited to the above description but is as set forth in the following claims, to be interpreted in accordance with Article 69 EPC and its accompanying Protocol.

Claims

1. A method for manufacturing an antenna for an RFID device, comprising: providing a conductive material (10) on a substrate (12); performing a first cutting process on the conductive material (10) to define an initial antenna (15); and performing one or more subsequent cutting processes on the initial antenna (15) to define a final antenna (16), wherein the first and one or more subsequent cutting processes are different; wherein the one or more subsequent cutting processes are performed on at least one discrete region (18) of the initial antenna (15), and comprise removing a first portion of the conductive material (10) characterized in that the one or more subsequent cutting processes comprise retaining a second portion of the conductive material in said at least one discrete region and electrically isolating said second portion of the conductive material in said at least one discrete region from the final antenna (16).

2. The method of claim 1, wherein the first cutting process comprises a die cutting process.

3. The method of claim 1, wherein at least one of the one or more subsequent cutting processes comprises a laser cutting process using a laser.

4. The method of claim 3, wherein the laser cutting process comprises blowing at least a portion of the initial antenna (15) off of the substrate (12).

5. The method of claim 3, wherein the laser comprises a fiber laser.

6. The method of claim 5, wherein the laser has a wavelength of approximately one micrometer, the substrate (12) comprises a paper material, and the conductive material (10) comprises aluminum foil.

7. The method of claim 1, wherein the first cutting process comprises a die cutting process and at least one of the one or more subsequent cutting processes comprises a laser cutting process.

8. The method of claim 1, wherein at least one of the one or more subsequent cutting processes includes applying a laser in a plurality of offset passes within said at least one discrete region (18), with at least partially overlapping laser cuts removing substantially all of the conductive material (10) in said at least one discrete region (18).

9. The method of claim 1, wherein the initial antenna (15) includes at least one line (20) having a width of at least one millimeter, and at least one of the one or more of the subsequent cutting processes is performed on said at least one line (20) to reduce the width of at least a portion of said at least one line (20) to less than one millimeter.

10. The method of claim 1, wherein the initial antenna (15) includes at least one loop (24, 26) having a radius of at least 0.75 millimeter, and at least one of the one or more subsequent cutting processes is performed on said at least one loop (24, 26) to reduce the radius of at least a portion of said at least one loop (24, 26) to less than 0.75 millimeter.

11. The method of claim 1, wherein at least one of the one or more subsequent cutting processes is performed on at least a portion of at least one line (20) of a central section of the final antenna (16).

12. The method of claim 1, wherein at least one of the one or more subsequent cutting processes is performed on at least a portion of at least one loop (24, 26) of a central section of the final antenna (16).

13. The method of claim 1, wherein at least one of the one or more subsequent cutting processes is performed on at least a portion of at least one line (20) of a central section of the final antenna (16) and at least a portion of at least one loop (24, 26) of the central section.

14. The method of claim 1, wherein at least one of the one or more subsequent cutting processes is performed on at least a portion of at least one line (20) of a central section of the final antenna (16) and at least a portion of a plurality of loops (24, 26) of the central section.