HEAT REGULATION DEVICE AND ELECTRONIC DEVICE FOR IT

Description

[0001] The invention relates to a thermal regulation device.

[0002] The invention also relates to electronic equipment comprising such a thermal regulation device. BACKGROUND OF THE INVENTION

[0003] In the field of electronics, it is known to associate thermal regulation devices with electronic equipment in order to facilitate the dissipation of heat emitted by said electronic equipment to prevent damage to it.

[0004] A thermal control device typically consists of a single piece with a base extended at the top by fins. This base is designed to be mounted on an electronic circuit board, such as a printed circuit board, so that it extends parallel to the board. Thermal control devices are usually made of aluminum to facilitate heat transfer.

[0005] Aluminum thermal regulation devices are generally manufactured either by extrusion or injection so that the fins are made of material with the base.

[0006] Extrusion manufacturing allows for the production of thinner parts, significantly reducing their volume and weight. Furthermore, the aluminum used offers better thermal performance than that used for injection molding. However, extrusion manufacturing is limited to producing parts with simple shapes. If a specific part with technical features is required, subsequent machining of the existing part is necessary after extrusion, increasing the production cost.

[0007] Injection molding, on the other hand, allows for the production of complex parts.

[0008] However, the parts produced then have a considerable thickness and the aluminum used has less good thermal performance than with extrusion.

[0009] The resulting parts are therefore heavy and expensive.

[0010] Furthermore, if we wish to compensate for the lack of thermal performance of these parts, we must then increase their dimensions, which makes them heavier and increases their manufacturing costs accordingly.

[0011] US documents 5,653,285 and US 2019 / 335614 describe prior art thermal regulation devices. SUBJECT OF THE INVENTION

[0012] One aim of the invention is to offer a solution that makes it possible to overcome at least one of the aforementioned drawbacks, at least in part. SUMMARY OF THE INVENTION

[0013] For this purpose, a thermal regulation device is planned, comprising at least: A plate, At least two heat sinks attached to the plate, each heat sink comprising at least one opening through which an airflow is intended to circulate, the two heat sinks being attached to the plate so that their openings are offset from each other and / or so that at least one wall forming at least one of the openings is in alignment with the other opening, in which the heat sinks are attached to the plate so as to extend one after the other along an axis, the device comprising between two and six groups of heat sinks, the heat sinks being identical within the same group but different between two groups, the heat sinks being arranged so as to alternate over at least one area of ​​the device successively, along the (Y) axis, a heat sink from each of the groups.

[0014] In this way, the circuit board and the heatsinks are manufactured separately and then assembled in a second step. This offers greater flexibility in the placement of the heatsinks on the circuit board.

[0015] In particular, it is thus possible to offset the openings of the heat sinks (angular and / or transverse offset) and / or to have openings of different shapes. In this way, the airflow (natural or forced) circulating within the invention encounters obstacles (the heat sinks) that disrupt the airflow by dividing it and / or changing its direction.

[0016] This promotes heat exchange between the heat sinks and the airflow.

[0017] The thermal regulation device proves to be particularly effective.

[0018] Furthermore, because the invention optimizes heat exchange with the surrounding air, the thermal regulation device can be relatively small in size.

[0019] It also turns out to be lighter and relatively inexpensive to produce.

[0020] In particular, the ability to produce the platinum and heat sinks separately makes it easy to produce them in large series.

[0021] This helps to reduce production costs.

[0022] The invention also relates to electronic equipment fitted with such a thermal regulation device.

[0023] Optionally at least one of the heat sinks has an orifice and at least one partition passing through said orifice so as to divide it into two openings.

[0024] Optionally, the wall that is in line with the other opening is the partition.

[0025] Optionally the partition has a thickness of between 1 and 3 millimeters.

[0026] Optionally the partition extends at an angle relative to at least one upper wall, one lower wall or one side of the associated heat sink.

[0027] Optionally, each of the heat sinks includes a partition extending at an angle relative to at least one upper wall, one lower wall, or one side flank of the associated heat sink.

[0028] Optionally the openings are offset angularly from each other and / or are offset transversely from each other.

[0029] Optionally, the heat sinks are arranged in parallel with each other.

[0030] Optionally the heat sinks are offset from each other along a longitudinal direction of the plate.

[0031] Optionally, the two or more heat sinks have a different geometry.

[0032] Optionally the circuit board and / or at least one of the heat sinks is made of or based on aluminum alloy.

[0033] Optionally the circuit board and / or at least one of the heat sinks is an injected or extruded part.

[0034] Optionally the circuit board and at least one of the heat sinks are made of the same material.

[0035] Optionally, at least one of the heat sinks is provided with at least one tab through which it rests against the plate.

[0036] The invention also relates to electronic equipment fitted with a thermal regulation device as mentioned above.

[0037] Optionally, the electronic equipment is an electronic board.

[0038] Other features and advantages of the invention will become apparent from the following description of particular and non-limiting embodiments of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Reference will be made to the attached drawings, including: [ Fig. 1 ] there figure 1 is a perspective view of a heat dissipation device according to a first embodiment of the invention associated with a printed circuit board; [ Fig. 2 ] there figure 2 is a top view of a circuit board of the device illustrated in the figure 1 ; Fig. 3 ] there figure 3 is a side view of a heat sink of the device illustrated in the figure 1 ; Fig. 4 ] there figure 4 is a top view of the device illustrated in the figure 1 ; Fig. 5 ] there figure 5 is a view similar to that of the figure 4 , the airflows circulating through the device are symbolized by arrows; Fig. 6 ] there figure 6 is a perspective view of a heat dissipation device according to a second embodiment of the invention associated with a printed circuit board; [ Fig. 7 ] there figure 7 is a top view of a circuit board of the device illustrated in the figure 6 ; Fig. 8 ] there figure 8 is a perspective view of a heat sink of the device illustrated in the figure 6 ; Fig. 9 ] there figure 9 is a top view of the device illustrated in the figure 6 ; Fig. 10 ] there figure 10 is a view similar to that of the figure 9 , the airflows circulating through the device being symbolized by arrows. DETAILED DESCRIPTION OF THE INVENTION

[0040] With reference to figures 1 à 5 , a first method of implementation will be described.

[0041] The thermal regulation device 1 is associated with an electronic equipment 100 in order to thermally regulate said electronic equipment 100. The electronic equipment 100 is for example an electronic board such as a printed circuit board.

[0042] Device 1 comprises a plate 2 which is shaped into a single plate. Plate 2 is therefore significantly thinner than its other dimensions. Plate 2 thus has two main faces: a first main face 3a and a second main face 3b.

[0043] Device 1 is arranged so that the first main face 3a extends opposite one of the faces of the electronic equipment 100. In the present case, the first main face 3a extends opposite one of the main faces of the electronic equipment 100. Preferably, device 1 is arranged so that the first main face 3a extends parallel to one of the main faces of the electronic equipment 100.

[0044] The plate 2 is here fixed to the electronic equipment 100. The plate 2 is thus affixed to the electronic equipment 100 and is in contact with at least one area of ​​the electronic equipment 100.

[0045] The connection between the plate 2 and the electronic equipment 100 is similar to that of a base of a prior art thermal regulation device and will therefore not be detailed here.

[0046] Device 1 also includes a plurality of heat sinks 4 (only some of which are referenced in the figure 1 ) reported on the second main face 3b of the plate 2. Device 1 includes for example between 2 and 12 heat sinks 4 and for example between 2 and 9 heat sinks 4.

[0047] The various heat sinks 4 are mounted on the plate 2 so that they extend parallel to each other. For example, the heat sinks 4 are arranged to extend parallel to the lateral edges of the plate 2, which themselves extend parallel to an X-axis. The second main face 3b is thus defined by a plane containing the X-axis and a Y-axis orthogonal to the X-axis.

[0048] The heat sinks 4 are also arranged on the plate 2 so that their width extends parallel to the Y axis and their length extends parallel to the X axis.

[0049] The heat sinks 4 are also mounted on the plate 2 so that they extend one after the other along the Y-axis. For example, the distance (along the Y-axis) between two successive heat sinks 4 is greater than 4 millimeters and, for example, greater than 5 millimeters. For example, the distance (along the Y-axis) between two successive heat sinks 4 is less than 50 millimeters and, for example, less than 40 millimeters. Optionally, the interval between two successive heat sinks 4 is the same along the entire length (along the Y-axis) of the second main face 3b.

[0050] Each heat sink 4 has two principal faces extending parallel to each other. Here, each heat sink is shaped so that its two principal faces extend parallel to a plane containing the X-axis and a Z-axis which is orthogonal to the X-axis and the Y-axis (the thickness of the plate 2 being defined along this Z-axis).

[0051] We will now describe one of the 4 heat sinks, the following description also applying to the other 4 heat sinks in this case.

[0052] The heat sink 4 is formed of several walls, each wall being shaped into a plate. The heat sink 4 is preferably a single piece. Preferably, the individual walls forming the heat sink 4 have a thickness between 1 and 3 millimeters. At least two walls of the same heat sink 4 may optionally have the same thickness.

[0053] The heat sink 4 has a lower wall 5 mounted opposite the plate 2 and optionally parallel to the second main face 3b. The lower wall 5 thus extends in a plane parallel to the X and Y axes. The lower wall 5 is shaped as a plate. The lower wall 5 is optionally provided with at least one tab, and for example, at least two tabs 6, by means of which the heat sink 4 rests on the plate 2.

[0054] The contacts with the heat sink 4 and the plate 2 are therefore of small dimensions.

[0055] The 6 pins can also facilitate the positioning of the heat sink 4 on the plate 2.

[0056] The heat sink 4 optionally includes at least one upper wall 7 arranged above the lower wall 5 and optionally extending parallel to the lower wall 5. The upper wall 7 thus extends in a plane parallel to the X and Y axes. The upper wall 7 is shaped into a plate.

[0057] The heat sink 4 also has lateral sides 8 to connect the lower wall 5 and upper wall 7 together.

[0058] For example, the left lateral flank 8 has a first wall 9a and a second wall 9b, the first wall 9a extending from the lower wall 5 to the second wall 9b and the second wall 9b extending from the first wall 9a to the upper wall 7. Similarly, the right lateral flank 8 has a first wall 10a and a second wall 10b, the first wall 10a extending from the lower wall 5 to the second wall 10b and the second wall 10b extending from the first wall 10a to the upper wall 7. The first walls 9a, 10a and the second walls 9b, 10b are here formed into plates.

[0059] In this case, the first walls 9a, 10a extend parallel to each other. Optionally, the first walls 9a, 10a extend orthogonally to the lower wall 5.

[0060] In the present case, the second walls 9b, 10b extend along the same inclination relative to the first associated wall but in opposite directions so that the second walls 9b, 10b get closer together as one approaches the upper wall 7. The upper wall 7 is therefore of a shorter length (along the X axis) than the lower wall 5. The first walls 9a, 10a of the lateral sides 8 are not necessarily of the same height (along the Z axis).

[0061] Optionally, the heat sink 4 may include at least one mounting tab for the electronic equipment 100 and / or the circuit board 2 (in addition to the pads 6). Preferably, the mounting tab is located on one of the lateral sides 8 of the heat sink 4.

[0062] In the illustrated and non-limiting example, a first tongue 11 extends from the right lateral side 8 and a second tongue 12 extends from the left lateral side 8, the two tongues 11, 12 extending in opposite directions from each other.

[0063] The heat sink 4 is also hollow.

[0064] The heat sink 4 is thus provided with at least one opening 13 passing through it so as to open onto its first main face (the face framed by the lateral sides 8, the upper wall 7, and the lower wall 5) and onto its second main face (the face framed by the lateral sides 8, the upper wall 7, and the lower wall 5, and which here extends parallel to the first main face). In this way, when the heat sink 4 is arranged on the plate 2, its opening 13 extends coaxially with the Y-axis.

[0065] If we return to the set of heat sinks 4, the heat sinks 4 are arranged so that their different upper walls 7 all extend in the same plane which is here parallel to the X and Y axes.

[0066] Preferably, the heat sinks 4 are arranged so that their various lower walls 5 all extend in the same plane which is here parallel to the X and Y axes.

[0067] Preferably, the first walls 9a of the left side walls 8 of all the heat sinks 4 and the first walls 10a of the right side walls 8 of all the heat sinks 4 all extend parallel to each other and here also to the plane containing the Y and Z axes.

[0068] Preferably, the second walls 9b of the left lateral sides 8 of all the heat sinks 4 all extend parallel to each other and here also at the same inclined plane with respect to the plane comprising the Y and Z axes.

[0069] Preferably, the second walls 10b of the right lateral sides 8 of all the heat sinks 4 all extend parallel to each other and here also to a plane inclined with respect to the plane comprising the Y and Z axes.

[0070] If externally the heat sinks 4 are aligned, internally the heat sinks 4 are not all identical to each other so that at least one of the openings 13 of at least one of the heat sinks 4 is offset by at least one of the openings 13 of at least one other of the heat sinks 4.

[0071] For example, the two openings 13 (identical or different in shape) are offset from each other along at least one direction belonging to the plane parallel to the main faces of the heat sinks 4 and / or offset from each other along a direction parallel to the Z axis and / or along a direction parallel to the X axis. For example, the openings 13 are offset from each other along a direction parallel to the X axis.

[0072] At least one of the openings 13 is shaped to present a cross-section (for a section plane parallel to the main faces of the heat sink) of rectangular, square or trapezoidal shape.

[0073] At least one of the openings 13 is shaped to have a cross-section in which at least one dimension is greater than 4 millimeters and preferably in which at least one dimension is greater than 5 millimeters. For example, the width and / or length and / or diameter of the cross-section of the opening 13 is greater than 4 millimeters and preferably greater than 5 millimeters.

[0074] Preferably, at least one of the heat sinks 4 includes a central orifice through it so as to open onto the two main faces of the heat sink 4. In this way, when the heat sink 4 is arranged on the plate 2 its central orifice extends coaxially to the Y axis.

[0075] Furthermore, the heat sink 4 has at least one partition (hereafter referred to as the internal wall) 14 arranged in the central opening. This internal wall 14 divides the central opening into at least two openings 13 as defined above. The internal wall 14 is thus common to both openings 13. For example, the internal wall 14 extends parallel to the first walls 9a, 10a of the lateral sides 8 (i.e., parallel to the Z-axis when the heat sink 4 is mounted on the platform). For example, the internal wall 14 extends between the upper wall 7 and the lower wall 5. For example, the internal wall 14 has a thickness that is identical to plus or minus 10%, and preferably to plus or minus 5%, to that of the upper wall 7 and / or to that of the lower wall 5 and / or to that of one of the walls of one of the lateral sides 8. For example, the internal wall 14 has a thickness between 1 and 3 millimeters.

[0076] It is noted that the heat sink 4 allows several fins to be formed by itself through its internal wall 14, its lateral sides 8, its upper wall 7 and its lower wall 5.

[0077] It is noted that the heat sink 4 is larger in size than a simple fin of the prior art.

[0078] Optionally, the heat sink 4 has at least two internal walls 14 arranged in the central opening, these internal walls 14 allowing the central opening to be divided into at least three openings 13 as defined above. For example, the internal walls 14 extend parallel to each other. For example, the internal walls 14 extend parallel to the first walls 9a, 10a of the lateral sides 8 (i.e., parallel to the Z-axis when the heat sink 4 is in place on the plate 2). For example, the internal walls 14 all extend between the upper wall 7 and the lower wall 5. For example, the internal walls 14 are identical to each other. For example, the internal walls 14 extend between the main faces of the heat sink 4 – i.e., across the entire width of the heat sink 4.

[0079] Preferably, all the heat sinks 4 here have a central orifice in which is arranged at least one internal wall 14 forming at least two openings 13 in the heat sink concerned.

[0080] For example, all the internal walls 14 of all the heat sinks 4 extend parallel to each other.

[0081] For example, all the internal walls 14 of all the heat sinks 4 extend parallel to the first walls 9a, 10a of the lateral sides 8 (i.e. parallel to the Z axis when the heat sink 4 is in place on the plate 2).

[0082] For example, all the internal walls 14 of all the heat sinks 4 extend between the main faces of the associated heat sink 4 - that is, over the entire width of the heat sink 4.

[0083] On the other hand, between at least two heat sinks 4, the positioning of the internal walls 14 is different and / or the number of internal walls 14 and / or the geometry of the internal walls 14 and / or the inclination of the internal walls 14 is different so that the openings 13 of said two heat sinks 4 are not aligned with each other.

[0084] Thus, when the heat sinks 4 are installed on the plate 2, the heat sinks 4 extend in alignment with each other along the Y-axis and parallel to each other, with a Y-axis spacing between two consecutive heat sinks 4. However, the internal walls 14 of the heat sinks 4 are not all aligned with each other (in a direction parallel to the Y-axis here) for at least two heat sinks 4, such that at least one internal wall 14 of one of the heat sinks 4 is aligned (in a direction parallel to the Y-axis here) with at least one opening 13 of the other heat sink 4.

[0085] The at least two heat sinks 4 concerned can be shaped so that an internal wall 14 of the first heat sink 4 is offset from an internal wall 14 of the second heat sink 4 by a distance (along a direction parallel to the X axis) between 10 and 60% of the distance (along a direction parallel to the X axis) separating the internal wall 14 of the second heat sink 4 from another internal wall 14 (or from a wall of one of the lateral sides 8) of the second heat sink 4 defining with the internal wall of the second heat sink 4 an opening 13 of the second heat sink 4.Preferably, the at least two heat sinks 4 concerned can be shaped so that an internal wall 14 of the first heat sink 4 is offset from an internal wall 14 of the second heat sink 4 by a distance (along a direction parallel to the X-axis) of between 20 and 50% of the distance (along a direction parallel to the X-axis) separating the internal wall 14 of the second heat sink 4 from another internal wall 14 (or from a wall of one of the lateral sides 8) of the second heat sink 4 defining with the internal wall 14 of the second heat sink 4 an opening 13 of the second heat sink 4. The internal wall 14 of the first heat sink 4 can thus extend opposite the middle of the opening 13 of the second heat sink 4 or to 1 / 5th of said opening 13 or to an intermediate level between the middle and 1 / 5th of said opening 13.

[0086] For example, the first heat sink 4 shown in the figure 3 understand : a first internal wall 14a which extends from the junction between the upper wall 7 and the second wall 9b of the left lateral flank 8 to the lower wall 5, a second internal wall 14b which extends from the junction between the upper wall 7 and a second wall 10b of the right lateral flank 14c to the lower wall 5, a third internal wall 14c which extends between the lower wall 5 and the upper wall 7 at an equidistance between said walls.

[0087] The internal walls 14a, 14b, 14c of the first heat sink 4 are thus distributed at regular intervals along the upper wall 7. The internal walls 14a, 14b, 14c of the first heat sink 4 are therefore of the same height. The internal walls 14a, 14b, 14c thus define four openings 13 in the central orifice.

[0088] For example, the second heat sink includes: a first internal wall which extends between a second wall 9b of the left lateral flank 8 and the lower wall 5, a second internal wall which extends between the second wall 10b of the right lateral flank 8 and the lower wall 5, a third internal wall which extends between the lower wall 5 and the upper wall 7.

[0089] The internal walls 14 of the second heat sink 4 therefore do not all have the same height.

[0090] In operation, the heat emitted by the electronic equipment 100 is transmitted to the circuit board 2 (by conduction, by convection ...) which in turn transmits it to the heat sinks 4 (by conduction, by convection ...).

[0091] The heat sinks 4 then allow the associated heat to be transferred with an airflow (forced or natural) circulating in the device by passing through the openings of the heat sinks 4. For example, if the device 1 is arranged vertically (the Y axis extending vertically and the two axes X and Z horizontally), hot air tends to rise, the airflow will start from one of the lateral edges of the plate 2 and go up along the plate 2 in a generally vertical direction to reach the other lateral edge.

[0092] Due to the offset between the openings 13, these create turbulence in the airflow, preventing it from flowing linearly. This increases the heat exchange between the device 1 and the airflow.

[0093] As seen at the figure 5 Therefore, the airflow does not follow a linear direction due to the presence of obstacles in its path. Indeed, the internal walls 14 (the obstacles) of the heat sinks 4 are aligned with openings 13 of the other heat sinks 4, the internal walls 14 not being all parallel to each other.

[0094] Therefore, the airflow will have to divide and / or reorient itself and then recombine into several airflows when passing through one, several or all of the heat sinks 4. In particular, the openings 14 are not coaxial.

[0095] This causes turbulence in the airflow which promotes heat exchange between the heat sinks 4 and the airflow and thus promotes the removal of heat generated by the electronic equipment 100.

[0096] Device 1 thus allows the said heat to be effectively removed.

[0097] Advantageously, the fact that two successive heat sinks 4 are spaced apart (along the Y-axis) allows additional airflows to enter the device via the sides of device 1 and thus mix with the general airflow. The additional airflows thus arrive obliquely or perpendicularly to the general flow (subdivided here into several airflows by the presence of the internal walls 14).

[0098] This not only allows fresh air to be brought in but also amplifies turbulence.

[0099] The dissipation of heat generated by the electronic equipment 100 is thus further increased.

[0100] Preferably, each heat sink 4 is different from the immediately upstream and immediately downstream heat sink 4. In this case, each heat sink 4 has at least one opening 13 offset (along the Y-axis) by at least one opening 13 of the immediately upstream heat sink 4 and by at least one opening 13 of the immediately downstream heat sink 4. Thus, each heat sink 4 has at least one internal wall 14 arranged in line with at least one opening 13 of the immediately upstream heat sink 4 and at least one opening of the immediately downstream heat sink 4.

[0101] This allows for an even greater increase in the turbulence generated in the airflow.

[0102] It is noted that the plate 2 allows to respond to mechanical constraints (fixing on the electronic equipment 1, port of the heat sinks, fixing or ports of other parts ...) as well as to thermal constraints by in particular making the thermal link between the electronic equipment 100 and the heat sinks 4.

[0103] It should be noted that the heat sinks 4 are intended to generate turbulence in the airflow. The thermal regulation device 1 according to the first embodiment includes an offset of the internal walls 14 (forming fins here) of the heat sinks 4 along a direction parallel to the X-axis and therefore a corresponding offset of the openings 13.

[0104] Advantageously, it is also noted that all the heat sinks 4 do not need to be different from each other to generate turbulence. Indeed, the device 1 can include at least one first group of identical heat sinks 13 and at least one second group of identical heat sinks 13, but different from those in the first group, to generate turbulence in the airflow through the device 1 when the heat sinks 4 are positioned on the plate 2. Preferably, the heat sinks 4 are then arranged so as to alternate, over at least one area of ​​the device 1, a heat sink 4 from the first group with successively a heat sink 4 from the second group (along the Y-axis).

[0105] For example, there can be at least one first group of identical heat sinks 4, a second group of identical heat sinks 4 that differ from those in the first group, and a third group of identical heat sinks 4 that differ from those in the first group and from those in the second group, in order to generate turbulence in the airflow through the device 1 when the heat sinks 4 are positioned on the platform 2. Preferably, the heat sinks 4 are then arranged so as to alternate, over at least one area of ​​the device 1, successively a heat sink 4 from the first group, a heat sink 4 from the second group, and a heat sink 4 from the third group (along the Y-axis). The device 1 can thus comprise between 2 and 6 groups of heat sinks 4 (identical heat sinks 4 within the same group but different between two groups) and, for example, between 3 and 4 groups of heat sinks.

[0106] Such a device 1 can advantageously be manufactured in multiple ways.

[0107] For example, plate 2 can be an extruded or injected plate.

[0108] Regardless of the manufacturing method of plate 2, the heat sinks 4 can be extruded or injection molded. It is also possible to have some of the heat sinks 4 extruded and some injection molded.

[0109] The assembly of the 4 heat sinks onto the plate 2 can also be done in multiple ways, for example by welding, by press fitting, by screwing, by clipping, by clamping, by gluing, by means of adhesive or glue, by clinching...

[0110] Advantageously, the heat sinks 4 and / or the plate 2 can be made from a variety of materials, for example, from one or more metal alloys, such as at least one aluminum alloy, at least one copper alloy, and / or at least one plastic. At least one of the heat sinks 4 can be made of the same material as the plate, or conversely, a different material. Furthermore, such a device 1 can easily be mass-produced. This is because the heat sinks 4 have a simple shape. Moreover, as mentioned above, not all the heat sinks 4 in a single device need to be different from each other. It is therefore possible to define a few heat sink models 4, which are then mass-produced. The alternating positioning of the different heat sink models 4 creates the offsets in the openings 13.

[0111] For example, at least two profiles with different geometries can be manufactured, and each profile can be cut to form a first group of 4 heat sinks and a second group of 4 heat sinks that are different from the first. Manufacturing the profiles is thus simple and quick.

[0112] A manufacturing process for such a device 1 will now be described.

[0113] In the first step, the circuit board 2 is manufactured (by extrusion, by injection, etc.). Preferably, the circuit board 2 is manufactured so that it meets various constraints related to the associated electronic equipment (mechanical, thermal, radio, hardware constraints, etc.).

[0114] In a second step, among the components carried by the electronic equipment 100, which is or will be located opposite the board 2, we identify those that will generate the most heat and / or those that are most sensitive to heat. This allows us to identify the key areas of the board 2.

[0115] In a third step, the 4 heat sinks are manufactured (by extrusion, by injection ...) according to these key areas (positions and / or number and / or extent and / or number of calories to be evacuated).

[0116] In a fourth step, the four heat sinks are assembled on the plate 2 so as to position them preferably opposite the key areas. It is therefore understood that the characteristics of the key areas (dimensions, number, locations, number of calories to be dissipated, etc.) allow the heat sinks 4 to be characterized (for example, they allow their dimensions and thicknesses to be determined – along the Y-axis) and positioned.

[0117] Preferably, in addition to the 4 heat sinks arranged opposite the thermal interfaces, one or more other 4 heat sinks may be arranged on the plate 2 in order to further disrupt the airflow along the plate 2.

[0118] For example, if device 1 is positioned vertically (with the Y-axis extending vertically), and there is natural airflow, the hot air will tend to rise, so the air will naturally flow along the Y-axis from bottom to top. It is therefore preferable to position the internal walls along this axis to impede its movement. The thickness of the heat sinks 4 (and thus the internal walls), defined along the Y-axis, extends parallel to the airflow. Conversely, the thickness of the internal walls (along the X-axis) extends orthogonally to the airflow.

[0119] For example, with a forced airflow, it is preferable to position the internal walls along the axis of the forced airflow. Preferably, the heat sinks 4 are then arranged so that their thickness (and therefore the thickness of their internal walls), defined along the Y-axis, extends parallel to the airflow. Conversely, the thickness of the internal walls (along the X-axis) extends orthogonally to the airflow. This describes an embodiment that generates turbulence within an airflow passing through the heat sinks 4 by using a different heat sink geometry.

[0120] Of course, other embodiments of the invention are possible.

[0121] Thus, with reference to figures 6 à 10 According to a second embodiment of the invention, the internal walls 14 of the heat sinks are not arranged parallel to each other. At least two internal walls 14 of different heat sinks 4 are arranged at an angle to each other. This forces the air to follow a non-linear path and thus generates turbulence in the airflow. It is understood that the openings 13 of the heat sinks 4 in question are angularly offset from each other.

[0122] The second embodiment will now be detailed below.

[0123] The thermal regulation device 1 is associated with an electronic equipment 100 in order to thermally regulate said electronic equipment 100. The electronic equipment 100 is for example an electronic board such as a printed circuit board.

[0124] Device 1 comprises a plate 2 which is shaped into a single plate. Plate 2 is therefore significantly thinner than its other dimensions. Plate 2 thus has two main faces: a first main face 3a and a second main face 3b.

[0125] Device 1 is arranged so that the first main face 3a extends opposite one of the faces of the electronic equipment 100. In the present case, the first main face 3a extends opposite one of the main faces of the electronic equipment 100. Preferably, device 1 is arranged so that the first main face 3a extends parallel to one of the main faces of the electronic equipment 100.

[0126] The plate 2 is here fixed to the electronic equipment 100. The plate 2 is thus affixed to the electronic equipment 100 and is in contact with at least one area of ​​the electronic equipment 100.

[0127] The connection between the plate 2 and the electronic equipment 100 is similar to that of a base of a prior art thermal regulation device and will therefore not be detailed here.

[0128] Device 1 also includes a plurality of heat sinks 4 attached to the second main face 3b of the plate 2. Device 1 includes, for example, between 2 and 12 heat sinks 4 and, for example, between 2 and 9 heat sinks 4.

[0129] The various heat sinks 4 are mounted on the plate 2 so that they extend parallel to each other. For example, the heat sinks 4 are arranged to extend parallel to the lateral edges of the plate 2, which themselves extend parallel to an X-axis. The second main face 3b is thus defined by a plane containing the X-axis and a Y-axis orthogonal to the X-axis.

[0130] The heat sinks 4 are also mounted on the plate 2 so that they extend one after the other along the Y-axis. For example, the distance (along the Y-axis) between two successive heat sinks 4 is greater than 4 millimeters and, for example, greater than 5 millimeters. For example, the distance (along the Y-axis) between two successive heat sinks 4 is less than 50 millimeters and, for example, less than 40 millimeters. Optionally, the interval between two successive heat sinks 4 is the same along the entire length (along the Y-axis) of the second main face 3b.

[0131] The heat sinks 4 are also arranged on the plate 2 so that their width extends here at an angle relative to the Y axis and their length extends parallel to the X axis.

[0132] Each heat sink 4 has two principal faces extending parallel to each other. Here, each heat sink 4 is shaped so that its two principal faces extend parallel to a plane containing the X axis and a Z axis which is orthogonal to the X and Y axes (the thickness of the plate 2 being defined along this Z axis).

[0133] We will now describe one of the 4 heat sinks, the following description also applying to the other 4 heat sinks in this case.

[0134] The heat sink 4 is formed from several walls, each wall being shaped into a plate. However, the heat sink 4 is preferably a single piece. Preferably, the individual walls forming the heat sink 4 have a thickness between 1 and 3 millimeters. At least two walls of the same heat sink 4 may optionally have the same thickness.

[0135] The heat sink 4 has a lower wall 5 mounted opposite the plate 2 and optionally parallel to the second main face 3b. The lower wall 5 thus extends in a plane parallel to the X and Y axes. The lower wall 5 is shaped as a plate.

[0136] The lower wall 5 is optionally provided with at least one tab and for example at least two tabs through which the heat sink 4 rests on the plate 2.

[0137] The contacts between the heat sink 4 and the plate 2 are therefore of small dimensions.

[0138] The heat sink 4 also optionally includes at least one upper wall 7 arranged above the lower wall 5 and optionally extending parallel to the lower wall 5. The upper wall 7 thus extends in a plane parallel to the X and Y axes. The upper wall 7 is formed into a plate.

[0139] The heat sink 4 also has lateral sides 8 to connect the lower wall 5 and upper wall 7 together.

[0140] For example, the left lateral flank 8 has a first wall 9a and a second wall 9b, the first wall 9a extending from the lower wall 5 to the second wall 9b and the second wall 9b extending from the first wall 9a to the upper wall 7. Similarly, the right lateral flank 8 has a first wall 10a and a second wall 10b, the first wall 10a extending from the lower wall 5 to the second wall 10b and the second wall 10a extending from the first wall 10a to the upper wall 7. The first walls 10a and the second walls 10b are here formed into plates.

[0141] In this case, the first walls 10a extend parallel to each other.

[0142] In this case, the second walls 10b extend at the same angle relative to the associated first wall 10a, but in opposite directions, so that the second walls 10b move closer together as they approach the upper wall 7. The upper wall 7 is therefore shorter (along the X-axis) than the lower wall 5. Optionally, the heat sink 4 may include at least one connecting tab for the electronic equipment 100 and / or the circuit board 2 (in addition to the pads). Preferably, the connecting tab is located on one of the lateral sides 8 of the heat sink.

[0143] The heat sink 4 is also hollow.

[0144] The heat sink 4 is thus provided with at least one opening 13 passing through it so as to open onto its first main face (the face framed by the lateral sides 8, the upper wall 7, and the lower wall 5) and onto its second main face (the face framed by the lateral sides 8, the upper wall 7, and the lower wall 5, and which here extends parallel to the first main face). Returning to the set of heat sinks 4, the heat sinks 4 are arranged so that their various upper walls 7 all extend in the same plane, which here is parallel to the X and Y axes.

[0145] Preferably, the heat sinks 4 are arranged so that their various lower walls 5 all extend in the same plane which is here parallel to the X and Y axes.

[0146] Preferably, the first walls 9a of the left side walls 8 of all the heat sinks 4 and the first walls 10a of the right side walls 8 of all the heat sinks 4 do not all extend parallel to each other. Furthermore, the first walls 9a of the left side walls 8 of all the heat sinks 4 and the first walls 10a of the right side walls of all the heat sinks 4 extend at an angle relative to the plane containing the Y and Z axes.

[0147] Preferably, the second walls 9b of the left lateral sides 8 of all the heat sinks 4 do not all extend parallel to each other. The second walls 9b of the left lateral sides 8 of all the heat sinks all extend at an angle to the plane containing the Y and Z axes.

[0148] Preferably, the second walls 10b of the right-hand side walls 8 of all the heat sinks 4 do not all extend parallel to each other. The second walls 10b of the right-hand side walls 8 of all the heat sinks 4 all extend at an angle to the plane containing the Y and Z axes.

[0149] At least one of the openings 13 of at least one of the heat sinks 4 is also angularly offset by at least one of the openings 13 of at least one other of the heat sinks 4.

[0150] For example, the two openings 13 (identical or different in shape) are angularly offset from each other: one has a cross-section in a plane containing an axis A parallel to the Z-axis and an axis B inclined relative to the X-axis, and the other has a cross-section extending in a plane containing an axis C parallel to the Z-axis and an axis D inclined relative to the X-axis. Axes A and C therefore extend parallel to each other. Preferably, axes B and D extend with the same angle of inclination with respect to the X-axis (in absolute value) but with opposite signs. Thus, an internal wall 14 of a first heat sink 4 is inclined with respect to the principal faces of the first heat sink 4, and an internal wall 14 of the second heat sink 4 is also inclined with respect to the principal faces of the second heat sink 4 with the same angle of inclination but with the opposite sign.The internal walls 14 therefore form a zigzag between the two heat sinks 4.

[0151] At least one of the openings 13 is shaped to present a cross-section (i.e., for a section plane parallel to the main faces of the heat sink 4) of rectangular, square or trapezoidal shape.

[0152] At least one of the openings 13 is shaped to have a cross-section in which at least one dimension is greater than 4 millimeters and preferably in which at least one dimension is greater than 5 millimeters. For example, the width and / or length and / or diameter of the cross-section of the opening 13 is greater than 4 millimeters and preferably greater than 5 millimeters.

[0153] Preferably, at least one of the heat sinks 4 includes a central opening through it so as to open onto the two main faces of the heat sink 4.

[0154] Furthermore, the heat sink 4 includes at least one partition (hereafter referred to as the internal wall) 14 arranged within the central opening. The internal wall 14 divides the central opening into at least two openings 13 as defined above. The internal wall 14 is thus common to both openings 13.

[0155] For example, the internal wall 14 extends parallel and / or orthogonally and / or inclinedly to the first walls 9a, 10a of the lateral sides 8. For example, the internal wall 14 extends between the upper wall 7 and the lower wall 5 or extends between the two lateral sides 8. For example, the internal wall 14 has a thickness that is identical to plus or minus 10%, and preferably to plus or minus 5%, that of the upper wall 7 and / or that of the lower wall 5 and / or that of one of the walls of one of the lateral sides 8. For example, the internal wall 14 has a thickness between 1 and 3 millimeters.

[0156] It is noted that the heat sink 4 allows several fins to be formed by itself through its internal wall 14, its lateral sides 8, its upper wall 7 and its lower wall 5.

[0157] It is noted that the heat sink 4 is larger in size than a simple fin of the prior art.

[0158] Optionally, the heat sink 4 has at least two internal walls 14 arranged in the central opening, these internal walls 14 allowing the central opening to be divided into at least three openings 13 as defined above. For example, the internal walls 14 extend parallel and / or orthogonally and / or inclinedly to each other. For example, at least one internal wall 14 extends parallel to the first walls 10, 9a of the lateral sides 8 and at least a second internal wall 14 extends orthogonally to the first walls 9a, 10a of the lateral sides 8. For example, the internal walls 14 extend between the main faces of the heat sink 4 – that is, across the entire width of the heat sink 4.

[0159] Furthermore, between at least two heat sinks 4, the inclination of the internal walls 14 differs, such that the openings 13 of said two heat sinks 4 are not aligned with each other. Thus, when the heat sinks 4 are installed on the plate 2, the heat sinks 4 extend in alignment with each other along the Y-axis and parallel to each other, with a spacing along the Y-axis between two consecutive heat sinks 4. However, the internal walls 14 of the heat sinks 4 are not all aligned with each other (in a direction parallel to the Y-axis here) for at least two heat sinks 4, such that at least one internal wall 14 of one of the heat sinks 4 is aligned (in a direction parallel to the Y-axis here) with at least one opening 13 of the other heat sink.

[0160] The at least two heat sinks 4 concerned may be shaped such that an internal wall 14 of the first heat sink 4 is angularly offset from an internal wall 14 of the second heat sink. For example, at least one of the internal walls 14 of the first heat sink 4 and / or at least one of the internal walls 14 of the second heat sink 4 is inclined at an angle β to a plane comprising the Y and Z axes, angle β being between 5 and 35 degrees and for example between 10 and 30 degrees.

[0161] For example, the first heat sink 4 includes: a first internal wall 14a which extends from the second wall 9b of the left lateral flank 8 to the lower wall 5, a second internal wall 14b which extends from the second wall 10b of the right lateral flank 8 to the lower wall 5, a third internal wall 14c which extends from the lower wall 5 to the upper wall 7 at an equidistance between said walls, a fourth internal wall 15 which extends from the lateral flanks 8.

[0162] Thus, the first heat sink 4 has eight openings 13 distributed over two levels (the fourth internal wall 15 delimiting said two levels).

[0163] The fourth internal wall 15, for example, is parallel to the lower wall 5 and upper wall 7 (and therefore inclined here with respect to the lateral sides 8). The first three internal walls 14a, 14b, 14c are also parallel to the first walls 9a, 10a of the lateral sides 8 (and therefore inclined with respect to the upper wall 7 and lower wall 5).

[0164] For example, the second heat sink 4 is identical to the first heat sink 4 except that its first three walls 14 are inclined relative to the lower walls 5 and upper walls 7 with the same angle in absolute value relative to the lower walls 5 and upper walls 7 but with a different sign.

[0165] In operation, the heat emitted by the electronic equipment 100 is transmitted to the circuit board 2 (by conduction, by convection ...) which in turn transmits it to the heat sinks 4 (by conduction, by convection ...).

[0166] The heat sinks 4 then allow the heat associated with an airflow (forced or natural) circulating in the device 1 by passing through the openings 13 of the heat sinks 4. For example, if the device 1 is arranged vertically (the Y axis extending vertically and the two axes X and Z horizontally), hot air tends to rise, the airflow will start from one of the lateral edges of the plate 2 and go up along the plate 2 in a generally vertical direction to reach the other lateral edge.

[0167] Due to the angular offset between the openings 13, these create turbulence in the airflow, which cannot flow linearly, as the openings 13 force it to change its flow direction from one heat sink 4 to another. This increases the heat exchange between the device 1 and the airflow.

[0168] It is therefore understood that the openings 13 of at least two heat sinks 4 are not coaxial and force an airflow passing through one of the openings 13 to deviate from a purely linear trajectory.

[0169] As seen at the figure 10 Therefore, the airflow does not follow a linear direction due to the presence of obstacles in its path. Indeed, the internal walls 14 (the obstacles) of the heat sinks 4 are aligned with openings 13 of the other heat sinks 4, and the internal walls 14 are not all parallel to each other. Consequently, the airflow will have to divide and / or reorient itself and then recombine into several airflows as it passes through one, several, or all of the heat sinks 4. In particular, the openings 13 are not coaxial.

[0170] This causes turbulence in the airflow which promotes heat exchange between the heat sinks 4 and the airflow and thus promotes the removal of heat generated by the electronic equipment 100.

[0171] In particular, the internal walls 14 are offset at a certain angle relative to the airflow, which redirects it. By reversing the angle of inclination of the internal walls 14 from one heat sink 4 to another (preferably between each successive pair of heat sinks 4 of the device 1), the airflow zigzags along the device 1.

[0172] Device 1 thus allows the said heat to be effectively removed.

[0173] Advantageously, the fact that two successive heat sinks 4 are spaced apart (along the Y-axis) allows additional airflows to enter the device 1 via its sides and thus mix with the general airflow. These additional airflows arrive obliquely or perpendicularly to the general flow (subdivided here into several airflows by the presence of the internal walls 14).

[0174] This not only allows fresh air to be brought in but also amplifies turbulence.

[0175] The dissipation of heat generated by the electronic equipment 100 is thus further increased.

[0176] Preferably, the internal walls 14 of a heat sink 1 are inclined differently from the internal walls 14 of the immediately upstream and downstream heat sinks 1. In this case, each heat sink 1 has at least one opening 13 offset (angularly) from at least one opening 13 of the immediately upstream heat sink 4 and at least one opening 13 of the immediately downstream heat sink 4. Thus, each heat sink 4 has at least one internal wall 14 arranged in line with at least one opening 13 of the immediately upstream heat sink and at least one opening 13 of the immediately downstream heat sink.

[0177] This allows for an even greater increase in the turbulence generated in the airflow.

[0178] It is noted that the plate 2 allows to respond to mechanical constraints (fixing on the electronic equipment 100, port of the heat sinks 4, fixing or ports of other parts ...) as well as to thermal constraints by in particular making the thermal link between the electronic equipment 100 and the heat sinks 4.

[0179] It should be noted that the heat sinks 4 are intended to generate turbulence in the airflow. The thermal regulation device 1 according to the second embodiment includes an angular offset of the internal walls 14 (forming fins here) of the heat sinks 4 and therefore a corresponding offset of the openings 13.

[0180] Advantageously, it is also noted that all the heat sinks 4 do not need to be identical to each other to generate turbulence. Indeed, the device 1 can include at least one first group of identical heat sinks 4 and at least one second group of identical heat sinks 4, but different from the heat sinks 4 in the first group, to generate turbulence in the airflow through the device 1 when the heat sinks 4 are positioned on the platform 2. Preferably, the heat sinks 4 are then arranged so as to alternate, over at least one area of ​​the device 1, a heat sink 4 from the first group with successively a heat sink 4 from the second group (along the Y-axis). The device 1 can thus include between 2 and 6 groups of heat sinks 4 (identical heat sinks 4 within the same group but different between two groups) and, for example, between 3 and 4 groups of heat sinks.

[0181] Advantageously, all the heat sinks 4 can be identical before being assembled on the plate 2. Indeed, it is then sufficient to modify the relative orientation of the heat sinks 4 on the plate 2 to orient the internal walls 14 between two heat sinks 4 differently. For example, it is sufficient to arrange a first heat sink 4 and then arrange a second heat sink 4 with its reversed position relative to the first heat sink 4 to obtain an angular offset between the internal walls 14 of said two heat sinks 4.

[0182] Such a device 1 can advantageously be manufactured in multiple ways.

[0183] For example, plate 2 can be an extruded or injected plate.

[0184] Regardless of the manufacturing method of plate 2, the heat sinks 4 can be extruded or injection molded. It is also possible to have some of the heat sinks 4 extruded and some injection molded.

[0185] The assembly of the 4 heat sinks onto the plate 2 can also be done in multiple ways, for example by welding, by press fitting, by screwing, by clipping, by clamping, by gluing, by means of adhesive or glue, by clinching...

[0186] Advantageously, the heat sinks 4 and / or the plate 2 can be made from a variety of materials, for example from one or more metal alloys, and for example from at least one aluminum alloy and / or at least one copper alloy, and / or from at least one plastic. At least one of the heat sinks 4 can be made of the same material as the plate 2 or, conversely, be made of a different material.

[0187] Furthermore, such a device 1 can easily be mass-produced. Indeed, the heat sinks 4 are of a simple shape. Moreover, as mentioned above, not all the heat sinks 4 of a single device need to be different from each other. It is therefore possible to manufacture only a few models of heat sinks 4, which are then mass-produced. It is the alternating positioning of the different models of heat sinks 4 that will create offsets in the openings 13.

[0188] For example, at least two profiles with different geometries can be manufactured, and each profile can be cut to form a first group of 4 heat sinks and a second group of 4 heat sinks. Manufacturing the profiles is thus quick and easy. As already mentioned, it is even possible to manufacture a single profile and cut it into sections at an angle to its axial direction to form the different 4 heat sinks. The 4 heat sinks will then need to be arranged with different orientations relative to the plate 2.

[0189] A manufacturing process for such a device 1 will be described.

[0190] In the first step, the circuit board 2 is manufactured (by extrusion, by injection, etc.). Preferably, the circuit board 2 is manufactured so that it meets various constraints related to the associated electronic equipment (mechanical, thermal, radio, hardware constraints, etc.).

[0191] In a second step, among the components carried by the electronic equipment 100, which is or will be located opposite the board 2, we identify those that will generate the most heat and / or those that are most sensitive to heat. This allows us to identify the key areas of the board 2.

[0192] In a third step, the 4 heat sinks are manufactured (by extrusion, by injection ...) according to these key areas (positions and / or number and / or extent and / or number of calories to be evacuated).

[0193] In a fourth step, the four heat sinks are assembled on the plate 2 so as to position them preferably opposite the key areas. It is therefore understood that the characteristics of the key areas (dimensions, number, locations, number of calories to be dissipated, etc.) allow the heat sinks 4 to be characterized (for example, they allow their dimensions and thicknesses to be determined – along the Y-axis) and positioned.

[0194] Preferably, in addition to the 4 heat sinks arranged opposite the thermal interfaces, one or more other 4 heat sinks may be arranged on the plate 2 in order to further disrupt the airflow along the plate 2.

[0195] For example, if device 1 is arranged vertically (with the Y-axis extending vertically), and there is natural airflow, the hot air will tend to rise, so the air will naturally flow along the Y-axis from bottom to top. It is therefore preferable to position the internal walls 14 on this axis to impede its movement.

[0196] For example, with a forced airflow, it is preferable to place the internal walls 14 on the axis of circulation of the forced airflow.

[0197] Thus, embodiments have been described that allow turbulence to be generated within an airflow passing through the heat sinks 4.

[0198] It is therefore understandable that different solutions are possible within the scope of the invention. Indeed, the offset between the openings 13 can be achieved in several ways.

[0199] According to a first option, at least two heat sinks4 (identical or not) can be offset from each other along at least one X, Y, Z axis.

[0200] According to a second option (which can be combined with the first option), at least two heat sinks 4 can have different geometries. The aim is then to position an internal wall 14 of one of the heat sinks 4 opposite the opening 13 of the other heat sink 4.

[0201] According to a third option (which can be combined with the first and / or second option), at least two heat sinks 4 can be angularly offset from each other, meaning the two heat sinks 4 do not extend parallel to each other. The aim is then to direct the air from one heat sink 4 to another along a non-linear path.

[0202] Of course, the invention is not limited to the embodiments described but encompasses any variant falling within the scope of the invention as defined by the claims.

[0203] In particular, it is possible to combine the two embodiments and variants described above.

[0204] Thus, the heat sinks of the first embodiment may have several stages, as in the second embodiment. Parallel heat sinks may also be used, as in the first embodiment, but with at least one internal wall of one heat sink inclined relative to at least one internal wall of another heat sink, so as to force the flow to be redirected differently between the two heat sinks concerned, as in the second embodiment. The first walls of the lateral sides of the second embodiment may be orthogonal to the lower and upper walls, as in the first embodiment (only the internal walls will then have an angle of inclination with said lower and / or upper walls).

[0205] The heat sinks may have a different shape than that described and thus include a different number of openings and / or a different number of internal walls and / or a different number of stages than indicated.

[0206] The arrangement of the heat sinks (for example, the spacing between two successive heat sinks) and / or their number and / or their shape (for example, their width) may differ from what has been specified. For example, this will depend on the overall geometry of the device and / or the associated electronic equipment, and in particular on the dimensions of the arrangement of its components and thermal interfaces and / or the dimensions of the circuit board and / or the thermal power to be dissipated. The spacing between two successive heat sinks may not be uniform across a series of heat sinks belonging to the same device. At least one of the heat sinks may be a profile or a section of a profile.

[0207] Although each orifice is shaped to have an identical cross-section across the entire width of the heatsink, at least one orifice may have a cross-section that changes across the width of the heatsink. For example, at least one orifice may narrow between the two main faces of the heatsink.

[0208] Although here at least one heatsink has at least one leg, at least one heatsink may not have a leg.

[0209] Although here at least one heat sink has at least one top wall, at least one heat sink may not have a bottom wall.

Claims

1. Thermal regulation device comprising at least: - One plate (2), - At least two heat sinks (4) fitted on the plate, each heat sink comprising at least one opening (13), through which an airflow is intended to circulate, the two heat sinks being fitted on the plate, such that their openings are offset against one another and / or such that at least one wall outlining at least one of the openings is located in the alignment of the other opening, wherein the heat sinks are fitted on the plate, so as to extend following one another along an axis (Y), being characterized in that the device comprises between two and six groups of thermal heat sinks, the heat sinks being identical within one same group, but different between two groups, the heat sinks being arranged, so as to alternate on at least one zone of the device successively, along the axis (Y), a heat sink of each of the groups.

2. Device according to claim 1, wherein at least one of the heat sinks (4) has an orifice and at least one partition (14) passing through said orifice, so as to divide it into two openings (13).

3. Device according to claim 2, wherein the wall located in the alignment of the other opening is the partition (14).

4. Device according to one of claims 2 to 3, wherein the partition (14) has a thickness of between 1 and 3 millimetres.

5. Device according to one of claims 2 to 4, wherein the partition (14) extends inclined relative to at least one upper wall (7), a lower wall (5) or a side flank (8) of the associated heat sink.

6. Device according to one of the preceding claims, wherein each of the heat sinks (4) comprises a partition (14) extending inclined relative to at least one upper wall (7), a lower wall (5) or a side flank (8) of the associated dissipator.

7. Device according to one of the preceding claims, wherein the openings (13) are angularly offset against one another and / or are transversally offset against one another.

8. Device according to one of the preceding claims, wherein the heat sinks (4) are arranged parallel to one another.

9. Device according to one of the preceding claims, wherein the heat sinks (4) are offset from one another in a longitudinal direction of the plate.

10. Device according to one of the preceding claims, wherein the at least two heat sinks (4) have a different geometry.

11. Device according to one of the preceding claims, wherein the plate (2) and / or at least one of the heat sinks (4) is made of or based on aluminium alloy.

12. Device according to one of the preceding claims, wherein the plate (2) and / or at least one of the heat sinks (4) is an injected or extruded part.

13. Device according to one of the preceding claims, wherein the plate (2) and at least one of the heat sinks (4) are made of the same material.

14. Device according to one of the preceding claims, wherein at least one of the heat sinks (4) is provided with at least one tab by way of which it rests against the plate.

15. Piece of electronic equipment equipped with a thermal regulation device according to one of the preceding claims.

16. Piece of equipment according to claim 15, wherein the piece of electronic equipment is an electronic board.