Card-shaped data carrier comprising ceramic

Abstract

The present invention relates to a card-shaped data carrier (10), in particular a smart card, comprising an electronic chip module with at least one chip and a contact structure, and comprising a card body (20) with an arrangement region for receiving the chip module, the chip module being arranged in the arrangement region of the card body (20), and the card body (20) having at least one first plastics layer (21) and at least one ceramic layer (23), the first plastics layer (21) being formed from a brittle plastics material to control the breakage behaviour of the card-shaped data carrier (10).

Description

[0001] Card-shaped data carrier comprising ceramic

[0002] The present invention relates to a card-shaped data carrier, in particular a smart card, which comprises ceramic.

[0003] A variety of card-shaped data carriers, such as smart cards, chip cards, dual-interface cards, integrated circuit cards, or identification cards, are known from the prior art. Furthermore, it is known to use various components for contact-based and / or contactless data transmission for the production of card-shaped data carriers, such as a chip module with a chip and a contact structure, a card body on which the chip module is arranged, and / or other components, such as an antenna or a capacitor for contactless data transmission.

[0004] It is known that such data storage devices or cards are generally made of thermoplastic materials such as polyvinyl chloride (PVC) and polyethylene terephthalate (PET). The problem is that the surfaces of plastic data storage devices can easily be scratched by mechanical influences or damaged by chemical substances such as acids or alkalis. State-of-the-art data storage devices are very sensitive to high temperatures, as they can easily deform if exposed to excessively high temperatures.

[0005] It is also known to use ceramic or ceramic materials for card-shaped data storage devices. In particular, ceramic card foils can be used as cover foils or overlay foils. However, these outer ceramic foils are thin and can therefore easily break or crack. It has proven disadvantageous that ceramic exhibits undefined fracture behavior. Consequently, there is a risk for a user of a card-shaped data storage device to injure themselves on the ceramic fragments or cracks, as these can have sharp edges.

[0006] The object of the present invention is therefore to provide a card-shaped data carrier, in particular a smart card, with a ceramic material, in which safe use can be provided and the risk of injury to a user can be reduced.

[0007] This object is achieved by a card-shaped data carrier having the features of independent claim 1.

[0008] Embodiments and developments of the invention are specified in the dependent claims and disclosed with reference to the description and the figures.

[0009] According to one aspect of the invention, a card-shaped data carrier, in particular a smart card, is provided, comprising an electronic chip module with at least one chip and a contact structure and a card body with an arrangement region for receiving the chip module, wherein the chip module is arranged in the arrangement region of the card body, wherein the card body has at least a first plastic layer and at least one ceramic layer, wherein the first plastic layer is formed from a brittle plastic for adjusting a fracture behavior of the card-shaped data carrier. Within the scope of the application, the terms "first plastic layer" and "brittle plastic" can be used analogously. In other words, the first plastic layer can also be referred to as a brittle plastic layer or as a brittle plastic within the scope of the application.

[0010] Within the scope of the application, the chip module comprises at least one chip and a contact structure. Thus, a contact-based

[0011] Data transmission can be established between the smart card and a reader. In particular, the chip is preferably connected to contacts of the contact structure via wires. The number, size and position of the contacts can be specified by international standards so that the function of the smart card can be guaranteed in every reader. However, further components can be provided for the chip module, such as a capacitor or an antenna (as a coil) for capacitive or inductive contactless data transmission. A contactless smart card can communicate with a reader using electromagnetic waves, whereby the smart card can function in a similar way to a transmitting and receiving device. In particular, electromagnetic waves emitted by the reader generate an oscillating electromagnetic field, which is induced, for example, in the coil orAntenna of the chip module generates an oscillating electrical voltage, whereby the chip can be supplied with power. The oscillations of the voltage can be picked up as a signal and converted into data in the chip. This data can in turn be processed in the chip and converted into changes in the electromagnetic field, which in turn can be picked up by the reader and converted into data. Overall, therefore, the chip module can enable contact-based and / or contactless data transmission. Within the scope of the application, it is preferably provided that the arrangement region for receiving the chip module is formed by a recess or a module opening in the card body, in which the chip module is received. Preferably, the card body can be formed from several layers, wherein a recess is provided in the layers in order to receive the chip module therein.This has the advantage of a protected and space-saving arrangement of the chip module within the card body of the card-shaped data carrier.

[0012] The multiple layers of the card body comprise at least a first plastic layer and at least one ceramic layer. For example, two ceramic layers can be provided, which can in particular be provided as outer layers of the card body. This has the advantage that the ceramic layers offer protection against, for example, scratching of a surface of the card-shaped data carrier, since the ceramic layers are generally very hard. Furthermore, an outer ceramic layer protects the plastic layer from the influence of chemical substances, such as acids or alkalis, since the ceramic layer is insensitive to the influence of chemical substances. For example, the electronics can preferably be arranged in or on the plastic layer. A further advantage is that the ceramic layer generally serves as an acoustic authentication feature if the card-shaped data carrier falls onto a hard surface, for example.Furthermore, a plurality of plastic layers can preferably be provided, which are arranged in particular on the inside of the card body. In the context of the application, the ceramic layer comprises ceramic or a ceramic material. The invention has the advantage that the fracture behavior of the card body and thus also of the card-shaped data carrier can be defined or adjusted through the use of a brittle plastic layer. The interaction of the brittle plastic of the plastic layer with the hard material of the ceramic of the ceramic layer can result in a brittle fracture of the card body or of the card-shaped data carrier under external stress. In particular, brittle fracture refers to a sudden material failure. In other words, the card-shaped data carrier can break apart in a way that is visibly and obviously visible to the user.For example, the card-shaped data storage device can break into two halves due to brittle fracture. This has the advantage that the user can immediately recognize that the card-shaped data storage device has broken, and the user can immediately begin handling the card-shaped data storage device with appropriate care. In particular, brittle fracture can produce a clearly identifiable large crack or break in the card-shaped data storage device, thereby preventing the occurrence of numerous small, poorly visible, and sharp-edged cracks or breaks. Thus, the risk of injury to the user can be significantly reduced by adjusting the fracture behavior.

[0013] Preferably, it can be provided that the brittle plastic is formed by a plastic which has an elongation at break of at least 0.1% and at most 50%, in particular of at least 0.1% and at most 20%, preferably of 15%. In the context of the application, elongation at break refers to a linear expansion of the respective material, in particular of the plastic, in a percentage. In other words, elongation at break describes a deformability as a material property. Elongation at break can preferably be used to distinguish between brittle and elastic materials. Brittle materials preferably have a low elongation at break, whereas elastic materials can have a high elongation at break. In particular, brittle materials can only have a small linear expansion before a crack or break in the material occurs.This can result, in particular, from the fact that brittle materials typically exhibit great hardness, meaning they can only be deformed or stretched to a limited extent. Due to the low elongation at break, the described brittle fracture of the card-shaped data carrier can advantageously be achieved.

[0014] Preferably, the brittle plastic can be formed by a plastic having a tensile strength of at least 50 MPa, in particular 70 MPa. Within the scope of the application, the tensile strength (in particular also tear strength) can describe a maximum mechanical tensile stress that a material can withstand. In other words, the tensile strength can describe a type of resilience as a material property. Brittle plastics can advantageously have a high tensile strength. This results in particular from the fact that brittle materials typically have great hardness and thus also high resilience.

[0015] Advantageously, the brittle plastic can be formed by a plastic having a modulus of elasticity of at least 500 MPa. Within the scope of the application, the modulus of elasticity can be regarded as a type of characteristic value indicating how much a material can yield to deformation when subjected to an external force. In other words, the modulus of elasticity can describe a type of resistance to deformation. In particular, under the same load, an elastic material can yield more than a hard and brittle material. In other words, an elastic plastic can have a lower resistance to deformation than a brittle plastic. In other words, an elastic plastic therefore has a low modulus of elasticity, and a brittle plastic has a high modulus of elasticity.

[0016] In summary, the aforementioned material properties of elongation at break, tensile strength, and elastic modulus describe the brittle material properties of the plastic and can, overall, promote brittle fracture of the card-shaped data storage device. This advantageously reduces the risk of injury to the user of the card-shaped data storage device.

[0017] In a particularly preferred embodiment, the brittle plastic can be formed from polystyrene, a light-modified PVC plastic, or a highly crystalline plastic. For example, polystyrene can have a tensile strength of approximately 55 MPa, an elongation at break of approximately 3%, and a modulus of elasticity of approximately 3200 MPa. Other brittle plastics can generally be used for the first plastic layer. It is also conceivable to make a plastic brittle through high temperatures or the introduction of light or UV radiation. The chain length of the plastic molecules can play a particularly important role here. For example, during very hot extrusion, the chain length of the molecules can be reduced by splitting the chains. The shorter the chain length of the molecules, the more brittle the material can be.The chain length can also be reduced by breaking the chains through exposure to light or UV radiation. A mean molar mass distribution of no more than 20,000 g / mol is preferred for the brittle plastic. The molar mass distribution can preferably be analyzed using gel permeation chromatography (GPC).

[0018] It is also conceivable for the ceramic layer to be transparent. This has the advantage that designs or inscriptions arranged on or on the plastic layer are easily visible from the outside.

[0019] Preferably, the ceramic layer can be bonded to the first plastic layer by means of an adhesive. The advantage of bonding the plastic layer to the ceramic layer with an adhesive is that the adhesive is easy to process and, preferably, a permanent bond can be achieved. The ceramic layer can, for example, be applied individually to the plastic layer and bonded to it.

[0020] Alternatively or additionally, it can be provided that the card body has at least a second plastic layer, wherein the second plastic layer is formed from an elastic plastic.

[0021] For the purposes of this application, the terms "second plastic layer" and "elastic plastic" can be used analogously. In other words, the second plastic layer can also be referred to as an elastic plastic layer or an elastic plastic for the purposes of this application. The use of an elastic plastic has the advantage that, for example, ceramic fragments from the brittle fracture of the ceramic layer and the brittle plastic layer can be bonded to the elastic plastic layer. As described above, the ceramic layer and the brittle plastic layer could break into two halves due to brittle fracture, but these broken halves could remain attached to the elastic plastic layer. In particular, this can achieve the advantage that the broken layers adhere to the elastic plastic layer and do not scatter apart.This prevents, in particular, scattered ceramic fragments from falling off and injuring the user in the event of a card-shaped data carrier breaking. Consequently, the elastic plastic layer can also contribute to adjusting the fracture behavior of the card-shaped data carrier. In other words, a specific fracture behavior of the card-shaped data carrier can be realized.

[0022] Preferably, the elastic plastic is formed by a plastic having an elongation at break of at least 100%, preferably 500%. Elastic materials preferably have a high elongation at break. In particular, elastic materials can exhibit a very large linear expansion before a crack or break of the material occurs. Due to the high elongation at break, the described effect can advantageously be achieved: in the event of a brittle fracture, the broken ceramic layer and the broken brittle plastic layer can be bonded to the elastic plastic layer.

[0023] Advantageously, the elastic plastic can be formed by a plastic having a tensile strength of at most 50 MPa, in particular 20 MPa. In particular, elastic plastics can have a lower tensile strength than brittle plastics. Furthermore, it can preferably be provided that the elastic plastic is formed by a plastic having a modulus of elasticity of at most 200 MPa, in particular 100 MPa. Since an elastic material, in particular, can yield more than a hard and brittle material, an elastic plastic advantageously has a lower resistance to deformation and therefore a low modulus of elasticity.

[0024] Preferably, the elastic plastic is formed from a thermoplastic elastomer, in particular thermoplastic polyurethane or thermoplastic polyester. For example, thermoplastic polyurethane can have a tensile strength of approximately 45 MPa, an elongation at break of approximately 300%, and a modulus of elasticity of approximately 15 MPa. Other elastic plastics are generally conceivable for use in the second plastic layer. For example, vulcanized materials can also be used. Typically, elastic plastics can have a long chain length of the plastic molecules. The longer the chain length of the molecules, the more elastic the material can be. Preferably, an average molar mass distribution of at least 20,000 g / mol is provided for the elastic plastic.

[0025] In a particularly preferred embodiment, the card body is formed from a plurality of layers, the layer sequence comprising an outer ceramic layer, an adhesive, a first plastic layer, a second plastic layer, a further first plastic layer, a further adhesive, and a further outer ceramic layer. In other words, the second plastic layer with the elastic plastic can be provided as the inner or centrally arranged layer of the card body. For example, a first plastic layer with the brittle plastic is provided on each of the two opposite surfaces of the second plastic layer. In other words, the second plastic layer is arranged between two first plastic layers. A ceramic layer is arranged on the respective first plastic layer by means of the adhesive.Thus, the ceramic layers can form outer layers of the card body. The inner plastic layers serve to adjust the fracture behavior of the card body or the card-shaped data carrier. As described above, the first two plastic layers, with the brittle plastic, can particularly cause brittle fracture. The centrally arranged second plastic layer, with the elastic plastic, can ensure that the broken layers remain attached to the elastic plastic layer.

[0026] The present invention is described below by way of example in the context of embodiments with reference to the accompanying figures. Individual features of the embodiments can, of course, be freely combined with one another, where technically feasible, without departing from the scope of the present invention. Elements with the same function and mode of operation are provided with the same reference numerals in the figures. The figures schematically show:

[0027] Figure 1 is a perspective exploded view of a card-shaped data carrier according to an embodiment of the invention;

[0028] Figure 2 shows a cross-sectional view of the card-shaped data carrier according to Figure 1 with a defined fracture behavior; Figure 3 shows a perspective exploded view of a card-shaped

[0029] Data carrier according to a further embodiment of the invention; and

[0030] Figure 4 is a cross-sectional view of the card-shaped data carrier according to Figure 3 with a defined fracture behavior.

[0031] Figure 1 shows a perspective exploded view of a card-shaped data carrier 10 according to an embodiment of the invention. Card-shaped data carrier 10 is provided, for example, as a smart card.

[0032] By way of example, the card-shaped data carrier 10 comprises an electronic chip module (not shown) with at least one chip (not shown) and a contact structure (not shown). In particular, contact-based data transmission can be realized using the chip module. In particular, additional components for contactless data transmission can be provided.

[0033] Furthermore, the card-shaped data carrier 10 comprises a card body 20 with an arrangement region (not shown) for receiving the chip module, wherein the chip module is arranged in the arrangement region of the card body 20.

[0034] Furthermore, the card body 20 has a plurality of layers. For example, a first plastic layer 21 and two ceramic layers 23 are provided. The first plastic layer 21 is arranged internally or centrally in the card body 20. The two ceramic layers 23 are arranged externally on the card body 20. In other words, the first plastic layer 21 is arranged between the ceramic layers 23. The ceramic layers 23 are each connected to the first plastic layer 21 by means of an adhesive 24. Furthermore, the ceramic layers 23 are designed to be transparent, for example. Furthermore, the external ceramic layers 23 protect the first plastic layer 21 from the influence of chemical substances, such as acids or alkalis. For example, the chip module can therefore preferably be arranged in or on the first plastic layer 21.

[0035] By way of example, it is provided that the first plastic layer 21 is formed from a brittle plastic to adjust the fracture behavior of the card-shaped data carrier 10. The brittle plastic is preferably formed from polystyrene. For example, polystyrene can have a tensile strength of approximately 55 MPa, an elongation at break of approximately 3%, and a modulus of elasticity of approximately 3200 MPa.

[0036] The use of a first plastic layer 21 with a brittle plastic has the advantage that the fracture behavior of the card body 20 and thus also of the card-shaped data carrier 10 under external stress can be defined or adjusted. The interaction of the brittle plastic of the first plastic layer 21 with the hard ceramic material of the ceramic layers 23 can result in a brittle fracture of the card body 20 or of the card-shaped data carrier 10 under external stress. Such a brittle fracture is illustrated by way of example in Figure 2.

[0037] Figure 2 shows a cross-sectional view of the card-shaped data carrier 10 according to Figure 1 with a defined fracture behavior, or a brittle fracture. By way of example, the card-shaped data carrier 10 is visible and obviously broken apart for a user. In particular, the card-shaped data carrier 10 has clearly broken into two halves due to the brittle fracture. In other words, a complete crack has developed along a vertical direction through the card body 20. Adjusting the fracture behavior or enabling a brittle fracture of the card body 20 has the advantage that the user can immediately recognize that the card-shaped data carrier 10 has broken and the user can immediately begin correspondingly careful handling of the card-shaped data carrier 10. In particular, the brittle fracture can prevent the occurrence of a large number of small, poorly visible and sharp-edged cracks orBreakage points can be avoided. Thus, the risk of injury to the user can be significantly reduced by adjusting the breakage behavior.

[0038] Figure 3 shows a perspective exploded view of a card-shaped data carrier 10 according to another embodiment of the invention. Card-shaped data carrier 10 is provided, for example, as a smart card.

[0039] By way of example, the card-shaped data carrier 10 comprises an electronic chip module (not shown) with at least one chip (not shown) and a contact structure (not shown). In particular, contact-based data transmission can be realized using the chip module. In particular, additional components for contactless data transmission can be provided.

[0040] Furthermore, the card-shaped data carrier 10 comprises a card body 20 with an arrangement region (not shown) for receiving the chip module, wherein the chip module is arranged in the arrangement region of the card body 20. Furthermore, the card body 20 has a plurality of layers. For example, two first plastic layers 21, a second plastic layer 22, and two ceramic layers 23 are provided. The second plastic layer 22 is arranged internally or centrally in the card body 20. The two ceramic layers 23 are arranged externally on the card body 20. A first plastic layer 21 is arranged between the second plastic layer 22 and the respective outer ceramic layer 23. The ceramic layers 23 are each connected to the first plastic layers 21 by means of an adhesive 24.

[0041] In other words, the layer sequence of the card body 20 comprises an outer ceramic layer 23, an adhesive 24, a first plastic layer 21, a second plastic layer 22, a further first plastic layer 21, a further adhesive 24 and a further outer ceramic layer 23.

[0042] Furthermore, the ceramic layers 23 are transparent, for example. Furthermore, the outer ceramic layers 23 protect the first plastic layers 21 from the influence of chemical substances, such as acids or alkalis. Thus, for example, the chip module can preferably be arranged in or on one of the first plastic layers 21.

[0043] By way of example, it is provided that the first plastic layers 21 are each formed from a brittle plastic for adjusting the fracture behavior of the card-shaped data carrier 10. The brittle plastic is preferably formed from polystyrene. For example, polystyrene can have a tensile strength of approximately 55 MPa, an elongation at break of approximately 3%, and a modulus of elasticity of approximately 3200 MPa. Furthermore, it is provided that the second plastic layer 22 is formed from an elastic plastic. The elastic plastic is preferably formed from thermoplastic polyurethane. For example, thermoplastic polyurethane can have a tensile strength of approximately 45 MPa, an elongation at break of approximately 300%, and a modulus of elasticity of approximately 15 MPa.

[0044] The use of an elastic plastic for the second plastic layer 22 has the advantage that, for example, ceramic fragments from a brittle fracture of the ceramic layers 23 and the brittle plastic layers 21 caused by an external load can be bonded to the centrally arranged elastic plastic layer 22. As described in relation to Figure 1, the ceramic layers 23 and the brittle first plastic layers 21 could break into two halves due to a brittle fracture, but these broken halves could remain attached to the elastic plastic layer 22. This is illustrated by way of example in Figure 4. Figure 4 shows a cross-sectional view of the card-shaped data carrier 10 according to Figure 3 with a defined fracture behavior.

[0045] In particular, the broken layers 21, 23 can adhere to the elastic second plastic layer 22 and not scatter. This prevents scattered ceramic fragments from falling off and injuring the user in the event of a breakage of the card-shaped data carrier 10. Consequently, the elastic second plastic layer 22 can be used to adjust the fracture behavior of the card-shaped data carrier 10. Thus, the risk of injury to the user can be further reduced by adjusting the fracture behavior.

[0046] List of reference symbols

[0047] 10 card-shaped data carriers

[0048] 20 card bodies

[0049] 21 first plastic layer

[0050] 22 second plastic layer 23 ceramic layer

[0051] 24 Adhesive

Claims

Patent claims 1. Card-shaped data carrier (10), in particular a smart card, comprising an electronic chip module with at least one chip and a contact structure and a card body (20) with an arrangement area for receiving the chip module, wherein the chip module is arranged in the arrangement area of ​​the card body (20), wherein the card body (20) has at least a first plastic layer (21) and at least one ceramic layer (23), wherein the first plastic layer (21) is made of a brittle plastic to adjust the fracture behavior of the card-shaped data carrier (10).

2. Card-shaped data carrier (10) according to claim 1, characterized in that the brittle plastic is formed by a plastic which has an elongation at break of at least 0.1% and at most 50%, in particular of at least 0.1% and at most 20%, preferably of 15%.

3. Card-shaped data carrier (10) according to one of the preceding claims, characterized in that the brittle plastic is formed by a plastic which has a tensile strength of at least 50 MPa, in particular 70 MPa.

4. Card-shaped data carrier (10) according to one of the preceding claims, characterized in that the brittle plastic is formed by a plastic which has a modulus of elasticity of at least 500 MPa.

5. Card-shaped data carrier (10) according to one of the preceding claims, characterized in that the brittle plastic is formed by polystyrene or a light-modified PVC plastic or a highly crystalline plastic.

6. Card-shaped data carrier (10) according to one of the preceding claims, characterized in that the ceramic layer (23) is transparent.

7. Card-shaped data carrier (10) according to one of the preceding claims, characterized in that the ceramic layer (23) is bonded to the first plastic layer (21) by means of an adhesive (24).

8. Card-shaped data carrier (10) according to one of the preceding claims, characterized in that the card body (20) has at least one second plastic layer (22), wherein the second plastic layer (22) is made of an elastic plastic.

9. Card-shaped data carrier (10) according to claim 8, characterized in that the elastic plastic is formed by a plastic which has an elongation at break of at least 100%, preferably 500%.

10. Card-shaped data carrier (10) according to one of claims 8 or 9, characterized in that the elastic plastic is formed by a plastic which has a tensile strength of at most 50 MPa, in particular 20 MPa.

11. Card-shaped data carrier (10) according to one of claims 8 to 10, characterized in that the elastic plastic is formed by a plastic which has a modulus of elasticity of at most 200 MPa, in particular 100 MPa.

12. Card-shaped data carrier (10) according to one of claims 8 to 11, characterized in that the elastic plastic is formed by a thermoplastic elastomer, in particular thermoplastic polyurethane or thermoplastic polyester.

13. Card-shaped data carrier (10) according to one of claims 8 to 12, characterized in that the card body (20) is formed from several layers, wherein the layer sequence comprises an outer ceramic layer (23), an adhesive (24), a first plastic layer (21), a second plastic layer (22), a further first plastic layer (21), a further adhesive (24) and a further outer ceramic layer (23).

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