Support assembly and system

Abstract

The invention relates to a carrier assembly (24) for backlash-free positioning of a wafer (22), comprising a carrier (26) for the wafer (22), a tilting mechanism (40), and a positioning element (34). The carrier (26) has an opening (30) for receiving the wafer (22). The positioning element (34) has a positioning surface (36) for laterally positioning the wafer (22). The tilting mechanism (40) is configured to tilt the positioning element (34) between a release position and a positioning position in which the wafer (22) is positioned between an edge of the opening (30) and the positioning surface (36). Furthermore, the invention relates to a system (10) and a method for backlash-free positioning of a wafer or for removing a wafer from a carrier.

Description

[0001] The invention relates to a carrier assembly for the play-free positioning of a wafer. Furthermore, the invention relates to a system and a method for the play-free positioning of a wafer in a wafer carrier and a method for removing a wafer from a wafer carrier.

[0002] It is known from the prior art that wafers are positioned in a carrier for processing, for example, ion irradiation and / or measurement, so that the wafers are held in as defined a position as possible. This is particularly important in automated systems or process lines where the wafer passes through several stations consecutively, for example, a first measurement station, an irradiation station, and a second measurement station.

[0003] In the case of the carrier assemblies known from the prior art, it has been found that the processability of the wafers is limited because the carrier assemblies known from the prior art either partially cover the wafer, so that the wafer can only be processed on one side, or parts of the outer edge of the wafer are covered, whereby the surface available for processing is limited compared to the entire surface of the wafer.

[0004] In addition, the carrier assemblies known from the state of the art typically require manual unlocking, which means that their use in a fully automated process line is only possible to a limited extent.

[0005] Furthermore, in the carrier assemblies known from the prior art, the wafer is held or clamped within the carrier using complex mechanisms that require a correspondingly large amount of space. This reduces the efficiency of fully automated processing, as the number of wafers that can be processed simultaneously is limited.

[0006] The object of the invention is to provide a carrier assembly that enables fully automated processing of the wafer while maximizing processing efficiency.

[0007] The object is achieved according to the invention by a carrier assembly for the play-free positioning of a wafer. The carrier assembly comprises a carrier for the wafer, a tilting mechanism, and a positioning part. The carrier has an opening for receiving the wafer. The positioning part has a positioning surface for laterally positioning the wafer. The tilting mechanism is configured to tilt the positioning part between a release position and a positioning position in which the wafer is positioned between an edge of the opening and the positioning surface.

[0008] The basic idea of ​​the invention is to enable repeatable wafer positioning using the carrier assembly by positioning the wafer in the carrier using the positioning surface of the positioning part. This (exactly) defines the wafer's position within the carrier, ensuring repeatability of the positioning. In other words, it is ensured that all wafers inserted into the carrier assembly are positioned in the same way. Furthermore, the positioning part ensures that the wafer remains in its specified position, even if the carrier assembly is subject to (light) vibrations that can occur, for example, in a process line, i.e., in a (fully) automated system. In this respect, the wafer can be positioned play-free during measurement, transport, and processing in a vacuum chamber.

[0009] Since the positioning part is adjusted between its release position and its positioning position via the tilting mechanism, a space-saving and simple way to fix the wafer's position in the carrier is created. The tilting mechanism ensures that the carrier assembly is suitable for fully automated processing, as the tilting mechanism can be operated both manually and automatically, for example, via a trigger element that interacts with the tilting mechanism.

[0010] Furthermore, the tilting mechanism ensures that the support assembly is also suitable for (ultra-)high vacuum applications where other positioning mechanisms would fail, for example, positioning mechanisms where sliding elements slide against each other. In contrast, the tilting mechanism involves pivoting or tilting around an axis, i.e., a pivotable or tiltable bearing. This type of bearing exhibits significantly lower friction compared to a plain bearing.

[0011] Since the positioning part positions the wafer laterally by means of the positioning surface, it is also ensured that the surface of the wafer to be processed is not (partially) covered by the positioning part, as would be the case, for example, with a hold-down device that contacts a surface of the wafer to hold the wafer down.

[0012] Due to the tilting mechanism, a space-saving yet play-free positioning of the wafer in the carrier, maximum processing options for the surface(s) of the wafer as well as the possibility of automating the loading of the carrier with the wafer and the removal of the wafer from the carrier can be realized.

[0013] One aspect provides that the tilting mechanism has at least one actuating surface, via which the tilting mechanism can be actuated to tilt the positioning part between the positioning position and the release position. In the positioning position of the positioning part, the actuating surface is perpendicular to the positioning surface. The tilting mechanism thus ensures that the direction of force action changes by 90°, since the tilting mechanism is triggered from above or below by actuating the actuating surface, resulting in a lateral force on the wafer, which is applied to the wafer via the positioning surface of the positioning part. The reversal of direction is realized by tilting the positioning part using the tilting mechanism.

[0014] The actuation direction of the tilting mechanism, i.e. the direction in which the tilting mechanism is triggered, is therefore parallel to the loading and unloading direction of the wafer.

[0015] The tilting mechanism can have an actuating part that is mechanically connected to the positioning part, with the actuating surface formed on the actuating part. In this respect, at least two separately formed parts are present that meet different requirements. The positioning part, which is in direct contact with the wafer via its positioning surface, can be made of a different material than the actuating part, which is not in direct contact with the wafer. This allows for a more cost-effective carrier assembly.

[0016] In particular, the positioning part is made of an ion beam-resistant material, such as graphite or PTFE. The same applies to the carrier. In other words, the components that contact the wafer are made of the ion beam-resistant material. Such a material is also suitable for (ultra-)high vacuum applications.

[0017] In contrast, the actuating part can be made of a metal, such as aluminum, so that it is as light as possible yet stable, thereby reducing the overall weight of the support assembly.

[0018] The positioning part itself can also contain the actuating surface, so that instead of two separate parts, a single, integral component is provided that simultaneously performs the functions of both the positioning part and the actuating part. In this respect, this single-piece component would be intended for both lateral positioning of the wafer and for actuating the tilting mechanism.

[0019] Another aspect provides that the tilting mechanism has at least one bearing block that defines a pivot point for the actuating part. The bearing block can be made of a PTFE material, making it suitable for (ultra-)high vacuum applications. A locating pin can be arranged in the bearing block, which defines a pivot axis of the tilting mechanism. In this respect, the pivot point for the actuating part is predetermined by the bearing block or the locating pin inserted in the bearing block.

[0020] A further aspect provides that the carrier has a recess at the edge through which the tilting mechanism partially extends. This results in a compact design of the carrier assembly, as the carrier is reduced to a minimal material thickness due to the recess at the edge. The tilting mechanism runs partially parallel to the loading and unloading direction through the recess at the edge. In other words, the recess at the edge ensures that the tilting mechanism does not protrude laterally beyond an edge of the carrier. This ensures, among other things, that several carrier assemblies can be placed next to one another on a multiple carrier, thereby maximizing the number of carrier assemblies per multiple carrier. This in turn increases processing efficiency, as several wafers can be processed simultaneously.

[0021] Furthermore, the tilting mechanism can be positioned laterally spaced from the opening in a plan view of the opening such that a wafer held in the carrier is accessible from two opposite sides. These two sides correspond to the top and bottom of the wafer, so that both wafer surfaces intended for processing are accessible, in particular, completely accessible. "Completely accessible" here means that a maximum of 1 to 2 mm of a wafer surface is obscured, i.e., a corresponding edge of the bottom or top. Unlike the prior art, both sides of the carrier are thus (completely) accessible, allowing one side to be processed, for example, exposed to ion radiation, while cooling occurs simultaneously on the opposite side. For example, the bottom of the wafer is irradiated with ions, whereas the top of the wafer is cooled.A cooling device can be positioned closer to the side to be cooled, eliminating the need for complicated cooling, as is the case with the current technology.

[0022] Furthermore, a spring can be provided which interacts with the tilting mechanism in such a way that the positioning part is pretensioned in the positioning position. If the tilting mechanism is not actuated, the positioning part is in the positioning position in which an inserted wafer would be fixed in terms of its position. If no wafer is present in the carrier, loading is only possible if the tilting mechanism is actuated. In other words, insertion of the wafer or loading of the carrier can be prevented unless the tilting mechanism is actuated at the same time to move the positioning part from the positioning position to the release position. The spring can be supported on the carrier, in particular can be arranged between the carrier and the actuating part.

[0023] According to one embodiment, the positioning part is a clamping part having a clamping surface for laterally clamping the wafer. The tilting mechanism is configured to tilt the clamping part between the release position and a clamping position in which the wafer is clamped between an edge of the opening and the clamping surface. In particular, a clamping contour is formed on an inner side of the carrier, which is opposite the clamping surface. Using the clamping contour and the clamping surface, a three-point contact can be formed, via which the wafer is clamped in the carrier in a positionally accurate manner. The position of the wafer can be determined accordingly via a clamp.

[0024] In principle, the positioning or clamping surface can be adapted to the contour of the wafer, resulting in a flat contact area in the area of ​​the positioning or clamping surface. In other words, the positioning or clamping surface can be partially circular, provided the positioning or clamping part comes into lateral contact in the area of ​​a circular section of the wafer.

[0025] Alternatively, the positioning or clamping part can be used in the area of ​​a notch or flat of the wafer, whereby the positioning or clamping surface has a shape adapted to the notch or flat. If the positioning or clamping part is used in the area of ​​a notch or flat, it can simultaneously ensure anti-twist protection, since the wafer can only be inserted into the carrier in a specific position.

[0026] Unless the positioning or clamping part is located in the notch or flat area, precise angular alignment of the wafer during insertion into the carrier assembly is irrelevant. This can simplify the process.

[0027] A further aspect provides that at least one support for an edge of the wafer is provided at the edge of the opening. In particular, the at least one support is interrupted in a region in which the positioning part is arranged. The support can be provided entirely at the edge of the opening, except for the interruption in the region of the positioning part. The at least one support thus corresponds to an inwardly projecting collar on which the edge of the wafer can be placed. It can also be provided that several supports are provided that extend over segments of the edge of the opening, for example three segments or four segments. In any case, it is ensured that no segment is provided in the region of the positioning part that laterally contacts the edge of the wafer via its positioning surface in order to determine the position of the wafer in the carrier. The support can have a length

[0028] The length of at least one support is a maximum of 2 mm. In other words, the support extends a maximum of 2 mm toward the center of the opening. In particular, the length is 1 mm. This results in a maximum coverage of the wafer edge of up to 2 mm, namely the length of the support. If multiple segmented supports are provided, the total covered area can be reduced accordingly.

[0029] Furthermore, an adapter ring can be provided into which the carrier is inserted. The adapter ring can be made of a different material than the carrier, for example, a metal such as aluminum. This ensures that the outer surface of the carrier assembly is made of a more stable material or one that is better suited for handling. Furthermore, the adapter ring can be made of a cheaper material than the carrier, thereby reducing overall costs. The different material selection is possible in particular because the adapter ring itself does not come into contact with the wafer, meaning that the adapter ring must meet fewer requirements than the carrier, which is also exposed to corresponding conditions during wafer processing.

[0030] Furthermore, the invention provides a system with a gripping unit and a carrier assembly of the aforementioned type. The gripping unit is provided for loading the carrier assembly with the wafer or for removing the wafer from the carrier assembly. The gripping unit can be a manual gripping unit, for example, vacuum tweezers. In this case, the tilting mechanism can be triggered manually, for example, by an operator pressing the actuating surface. With the other hand, the operator can hold the vacuum tweezers, i.e. the manually operated gripping unit, in order to insert the wafer into the carrier of the carrier assembly or to remove the wafer from the carrier assembly.

[0031] Alternatively, the gripping unit can be an automated gripping unit, for example, in the form of a robot's end effector. In this case, the tilting mechanism can be automatically triggered when the automated gripping unit inserts the wafer into or removes it from the carrier assembly.

[0032] For example, the gripping unit could be a vacuum gripper, which uses negative pressure to hold the wafer in position relative to the gripping unit during handling, a Bernoulli gripper, also known as a flow gripper, or an electrostatic gripper. Other types of grippers that are also suitable can, of course, also be used.

[0033] One aspect provides that the gripping unit has a trigger element that is configured to actuate the tilting mechanism, wherein the gripping unit is movable at least along a loading and removal direction. The loading and removal direction is parallel to an actuation direction of the tilting mechanism of the carrier assembly. When the carrier is loaded with the wafer and when the wafer is removed from the carrier, the trigger element actuates the tilting mechanism in order to tilt the positioning part into the release position. This results in the automated triggering of the tilting mechanism, since the gripping unit has the trigger element that automatically actuates the tilting mechanism when the gripping unit is moved with respect to the carrier assembly, namely is moved along the loading or removal direction, such that the trigger element comes into contact with the tilting mechanism, in particular the actuation surface.

[0034] The release element can be pin-shaped and arranged laterally adjacent to a suction device of the gripping unit, by means of which the wafer is held. When the wafer is placed down along the loading direction, the release element actuates the tilting mechanism from a certain distance from the carrier, whereby the positioning part is tilted into the release position so that the gripping unit can insert the carrier. The negative pressure applied to the suction device is removed so that the wafer is released. The gripping unit is then moved to its starting position, whereby the release element releases the tilting mechanism again so that it is reset due to the spring preload. This causes the positioning part to move into the positioning position in which the positioning part positions the wafer laterally, i.e. fixes the position of the wafer within the carrier without any play.

[0035] The tilting mechanism is actuated in a similar way when removing the wafer from the carrier using the gripping unit. The gripping unit is moved along the removal direction to contact the wafer. The trigger element has previously actuated the tilting mechanism, tilting the positioning part into the release position, which allows the gripping unit to remove the wafer from the carrier. The gripping unit can then contact the wafer via the suction device and hold it in place using negative pressure to remove the wafer.

[0036] In particular, the trigger element is designed to be spring-loaded, which provides an additional stroke for the gripping unit. This ensures that the trigger element first actuates the tilting mechanism, in particular the suction device of the gripping unit, before the gripping unit even comes into contact with the wafer during removal. After the tilting mechanism has been triggered, the gripping unit is moved further in the direction of the wafer by means of the trigger element, so that the trigger element compresses. This ensures the additional stroke for the gripping unit. This occurs in a similar way during loading, since here too the trigger element compresses and thus ensures an additional stroke for the gripping unit, so that the gripping unit, in particular its suction device, can be moved further in the loading direction in order to place the wafer on the at least one support.The spring travel of the release element can be adjusted to ensure that the gripper unit does not damage the wafer during removal or insertion. For example, a progressive spring characteristic is provided, which prevents the gripper unit from moving too far in the loading direction. This provides additional safety in case the robot moves the gripper unit too far.

[0037] Furthermore, the trigger element has a greater spring strength than the tilting mechanism, so that it is ensured that when the trigger element is contacted, the tilting mechanism is actuated first, i.e. the spring of the tilting mechanism is compressed in order to tilt the positioning part into the release position, before the trigger element compresses or a spring assigned to the trigger element is compressed.

[0038] Furthermore, the invention relates to a method for positioning a wafer in a wafer carrier without play. The method comprises the following steps: Providing a carrier assembly with the carrier for the wafer, actuating a tilting mechanism of the carrier assembly to tilt a positioning part with a positioning surface for laterally positioning the wafer in the carrier from a positioning position into a release position, inserting the wafer into the carrier, and releasing the tilting mechanism of the carrier assembly so that the positioning part returns from the release position to the positioning position and the positioning surface rests laterally against the wafer in order to position it in the carrier.

[0039] The invention further relates to a method for removing a wafer from a wafer carrier. The method comprises the following steps: Providing a carrier assembly with the carrier for the wafer, wherein the wafer is positioned in the carrier, actuating a tilting mechanism of the carrier assembly to tilt a positioning part with a positioning surface for laterally positioning the wafer in the carrier from a positioning position in which the positioning surface rests laterally against the wafer, into a release position, removing the wafer from the carrier, and releasing the tilting mechanism of the carrier assembly so that the positioning part returns from the release position to the positioning position.

[0040] In both methods, the tilting mechanism can be actuated via the trigger element, which is part of the gripping unit, provided that an automated process is provided that includes an automated gripping unit. If manual loading or unloading is planned, the tilting mechanism can also be manually actuated by the operator's hand, thereby tilting the positioning part into the release position.

[0041] In both cases, it is ensured that the position of the wafer in the carrier is guaranteed by lateral positioning using the positioning part, in particular its positioning surface, since the tilting mechanism provides for lateral fixing of the wafer in the carrier. However, the tilting mechanism is actuated in a direction perpendicular to this. Typically, the carrier assembly is loaded from above, so that the wafer is inserted into the carrier assembly from above. In this case, it is also provided, among other things, that at least one support for the wafer is provided on the edge of the opening in the carrier, onto which the wafer can be placed during insertion. The precise positioning of the wafer within the carrier is then carried out by means of the positioning part, which positions the wafer laterally in the support plane spanned by the at least one support in such a way that its position is free of play.This determines the position of the wafer in the carrier accordingly.

[0042] As already explained above, the positioning part is designed in particular as a clamping part so that the wafer is clamped.

[0043] The tilting mechanism also ensures that both sides of the wafer—the bottom and top—are fully accessible during processing. This allows the bottom of the wafer to be treated, for example, by ion irradiation, while the wafer is simultaneously cooled via the top.

[0044] Furthermore, the actuating surface, in particular the entire actuating part, can be arranged above the support and / or the adapter ring when viewed from above. In other words, the opening is not covered by the actuating part. The actuating part also does not protrude laterally. This results in a compact design of the entire support assembly.

[0045] The wafer can comprise a coated or uncoated semiconductor substrate, glass and / or ceramic, or mixtures of the aforementioned materials.

[0046] Further advantages and features of the invention will become apparent from the following description and the drawings, to which reference is made. In the drawings: Figure 1 a schematic representation of a system according to the invention, Figure 2 a perspective view of a carrier assembly according to the invention, Figure 3an exploded view of the carrier assembly according to the invention Figure 2 , Figure 4 a side view of the carrier assembly according to the invention Figure 2 , Figure 5 a plan view of the carrier assembly according to the invention Figure 2 , Figure 6 a sectional view along the line AA of the Figure 5 , Figure 7 an enlarged view of the sectional view from Figure 6 , Figure 8 the section view Figure 7 for an alternative embodiment of the carrier assembly according to the invention, Figure 9 a representation of the system according to the invention during loading of the carrier assembly according to the invention at a first time, and Figure 10 the system according to the invention Figure 9 when loading the carrier assembly according to the invention at a second time.

[0047] In Figure 1 a system 10 is shown which is configured to process, for example, irradiate, several wafers simultaneously.

[0048] The system 10 comprises a loading station 12, an adjoining irradiation station 14, and a measuring station 16. The measuring station 16 can be followed by a removal station, which essentially corresponds to that of the loading station 12. Furthermore, the system 10 can also comprise additional measuring stations.

[0049] In the loading station 12, a robot 18 is provided which loads a multiple carrier 20 with a plurality of wafers 22 which are inserted into carrier assemblies 24, as will be explained in detail below.

[0050] The multiple carrier 20 can therefore comprise several carrier assemblies 24, for example, eight carrier assemblies 24, so that several wafers 22 can be irradiated simultaneously in the irradiation station 14. The more carrier assemblies 24 the individual multiple carrier 20 comprises, the greater the overall efficiency, since more wafers 22 can be treated simultaneously.

[0051] The system 10 therefore represents a process line that ensures that the wafers 22 can be processed in the desired manner. This is made possible by the carrier assembly 24 holding the corresponding wafer 22 in a precise position throughout the process line. It is therefore not necessary for the wafer 22 to be removed from the carrier assembly 24 and repositioned.

[0052] In addition, the carrier assembly 24 ensures repeatability because the wafer 22 is positioned within the carrier assembly 24 without play. This play-free positioning prevents any displacement or repositioning of the wafer 22 during transport through the multiple stations of the system 10, which would have a negative impact on its processing.

[0053] As explained above, this is ensured by the carrier assembly 24, which is located in the Figures 2 to 7according to a first embodiment is shown in detail, to which reference is made below.

[0054] The carrier assembly 24 comprises a carrier 26, which is received as an insert in an adapter ring 28. For this purpose, the adapter ring 28 can have a support surface 29 on which the carrier 26 rests.

[0055] The carrier 26 has an opening 30 through which the wafer 22 can be inserted into the carrier 26. At the edge of the opening 30, the carrier 26 also has at least one support 32 onto which the wafer 22 can be placed with an edge of its underside when the wafer 22 is inserted into the carrier 26. The at least one support 32 is therefore an inwardly projecting projection or collar onto which the wafer 22 can be placed. The support 32 can protrude up to 2 millimeters.

[0056] In addition, the carrier assembly 24 comprises a positioning part 34 which has a positioning surface 36 which is provided for laterally positioning the wafer 22 in the carrier 26.

[0057] The positioning part 34 is arranged in an inwardly facing recess 38 of the carrier 26, as can be seen, inter alia, from the Figures 3 , 5 and 7 emerges.

[0058] The positioning part 34 is operable with a tilting mechanism 40, whereby the positioning part 34 can be tilted between a release position and a positioning position in which the wafer 22 is positioned between an edge of the opening 30 and the positioning surface 36. In other words, in the positioning position, the position of the wafer 22 in the carrier assembly 24 or in the carrier 26 is fixed.

[0059] As can be seen from the figures, the support 32 is interrupted in the area of ​​the positioning part 34 so that the positioning part 34 can tilt and contact the wafer 22 laterally.

[0060] In the embodiment shown, the tilting mechanism 40 comprises an actuating surface 42 formed on the upper side of an actuating part 44, which is mechanically coupled to the positioning part 34. In this respect, the actuating part 44 and the positioning part 34 are two separate components that are connected to one another. The connection can be made directly or, as in the embodiment shown, by means of a spacer element 46.

[0061] In an alternative embodiment, it may also be provided that a one-piece component is provided on which both the positioning surface 36 and the actuating surface 42 are provided. This one-piece component would therefore jointly perform the functions of the positioning part 34, the actuating part 44, and the spacer element 46.

[0062] The tilting mechanism 40 also includes at least one bearing block 48, which defines a pivot point for the actuating part 44. The bearing block 48 has a receptacle 50 for a locating pin 52, which in turn engages with a receptacle of the actuating part 44, thereby creating a pivot axis S for the actuating part 44. The actuating part 44 can be pivoted or tilted about the pivot axis S.

[0063] In the embodiment shown, the tilting mechanism 40 comprises two bearing blocks 48 which are designed in the same way.

[0064] The at least one bearing block 48 is mechanically connected to the adapter ring 28 by means of screws 54 and optional springs 56.

[0065] In addition, the tilting mechanism 40 comprises at least one spring 58, for example a compression spring. The spring 58 is provided to preload the tilting mechanism 40 or the positioning part 34 into the positioning position.

[0066] For this purpose, the spring 58, in the embodiment shown, rests on the carrier 26 to press the associated end of the actuating part 44, thereby initiating a pivoting movement about the pivot axis, which forces the positioning part 34 into the positioning position. In the embodiment shown, the spring 58 is accommodated in a receptacle 60 in the carrier 26 together with an optional cylindrical pin 62.

[0067] From the Figure 7It is further apparent that the carrier 26 has a peripheral recess 64 through which the tilting mechanism 40 extends at least partially, in particular the spacer element 46.

[0068] The edge-side recess 64 is provided, among other things, on a collar 65 of the upper side of the carrier 26, so that the spacer element 46 can extend between the carrier 26 and the adapter ring 28, as can be seen from Figure 7 This creates a compact tilting mechanism 40 that allows multiple support assemblies 24 to be arranged side by side in the multiple support 20, thus ensuring maximum space efficiency.

[0069] In principle, the carrier 26 can rest on the adapter ring 28 via the collar 65, in particular the support surface 29.

[0070] Furthermore, this ensures that the tilting mechanism 40, in plan view of the opening 30 in the carrier 26, is provided at a distance from the opening 30 such that a wafer 22 accommodated in the carrier 26 is (fully) accessible from two opposite sides, as is clear from the figures.

[0071] The wafer 22 can therefore be irradiated from below and simultaneously cooled from above by inserting a cooling device into the carrier assembly 24.

[0072] The carrier 26 can have a contact surface 66 for the cooling device, so that the cooling device is arranged in a defined manner with respect to the wafer 22 accommodated in the carrier 26. This ensures that the cooling device does not directly contact the wafer 22, in particular its upper side, but maintains a defined distance therefrom.

[0073] In Figure 8An alternative embodiment is shown which differs with regard to the tilting mechanism 40 from that shown in the Figures 2 to 7 The embodiment shown in the figure differs. Specifically, the Figure 8 shown embodiment of the carrier assembly 24 with regard to the positioning of the spring 58 in that the latter is supported on the adapter ring 28 and acts on the spacer element 46 in such a way that the positioning part 34 is prestressed into the positioning position.

[0074] Analogous to the first embodiment, an actuating part 44 is again provided, which can be pivoted or tilted about the pivot axis S, which in the present case is defined by at least one knife edge 67, with which the actuating part 44 is supported on a component of the carrier assembly 24, for example the adapter ring 28.

[0075] In this respect, the same handling applies to the Figure 8 shown carrier assembly 24 than for the ones shown in the Figures 2 to 7 shown carrier assembly 24.

[0076] In the Figures 9 and 10 It is further shown that the system 10 comprises a gripping unit 68, which can be used, for example, as an end effector of the robot 18 in the Figure 1 shown system 10 can be provided.

[0077] The gripping unit 68 comprises, in addition to a suction device 70 with which the wafer 22 can be held, a trigger element 72 which is provided laterally spaced from the suction device 70, in particular on a flange 74.

[0078] The trigger element 72 is resilient and is provided for triggering or actuating the tilting mechanism 40, so that the trigger element 72 interacts with the actuating surface 42 when the wafer 22 is introduced into the carrier assembly 24, as shown in Figures 9 and 10 shown, or removed from the carrier assembly 24.

[0079] During loading, the gripping unit 68 is moved along a loading direction R parallel to an actuating direction B of the tilting mechanism 40 until the trigger element 72 contacts the actuating surface 42 and is adjusted against the spring preload of the spring 58, whereby the positioning part 34 is transferred from the positioning position into the release position.

[0080] The gripping unit 68 is moved further in the loading direction B, wherein the trigger element 72 is compressed, resulting in an additional stroke for the gripping unit 68, which ensures that the wafer 22 can be placed on the at least one support 32 at the edge of the opening 30.

[0081] Subsequently, the suction device 70 is released by reducing the existing negative pressure, so that the suction device 70 releases the wafer 22. The wafer now rests only on the support 32.

[0082] The gripping unit 68 is then moved to its home position, with the suction device 70 no longer contacting the wafer 22. The compression of the resilient trigger element 72 is reduced during the return to the home position. Starting at a defined travel distance, the trigger element 72 is no longer compressed, so that it detaches from the actuating surface 42 during further travel, so that the latter is also no longer contacted.

[0083] At the latest, this results in the tilting mechanism 40 being moved into its pre-tensioned position, in which the positioning part 34 is in its positioning position and the positioning surface 36 positions the wafer 22 laterally in order to determine the position of the wafer 22 in the carrier 26.

[0084] The tilting mechanism 40 is actuated or triggered in an analogous manner when a wafer 22 inserted in the carrier 26 is removed.

[0085] The gripping unit 68 is moved to contact the wafer 22 using the suction device 70. In doing so, the trigger element 72 first contacts the actuating surface 42, causing the positioning part 34 to tilt from the positioning position into the release position. The gripping unit 68 is moved further toward the wafer 22, causing the trigger element 72 to compress, allowing the gripping unit 68 an additional stroke. The additional stroke ensures that the suction device 70 of the gripping unit 68 contacts the wafer 22 in a defined manner.

[0086] Subsequently, a negative pressure is created at the suction device 70 to hold the wafer 22. The gripping unit 68 can then be moved along the removal direction E, which is parallel to the actuation direction B of the tilting mechanism 40, thereby removing the wafer 22 from the carrier 26.

[0087] First, the release element 72 is decompressed. Subsequently, the tilting mechanism 40, i.e., the positioning part 34, is moved into its positioning position by the spring 58. However, this only occurs when the gripping unit 68 and the wafer 22 located on its suction device 70 are outside the positioning surface 36.

[0088] The gripping unit 68 is moved further in the removal direction E so that the wafer 22 is removed.

[0089] In principle, the tilting mechanism 40 can be designed such that the positioning part 34 acts as a clamping part 76, so that the positioning surface 36 is a clamping surface 78, by means of which the wafer 22 is held in a clamping manner in the carrier 26.

[0090] In addition, a clamping contour 80 can be formed on an inner side of the carrier 26, in particular opposite the clamping surface 78, so that the wafer 22 is clamped between the clamping surface 78 and the clamping contour 80, as can be seen from Figure 5 becomes clear. A three-point clamping can be formed.

[0091] The tilting mechanism 40 can generally be designed symmetrically, so that two bearing blocks 48, two actuating surfaces 42 and at least two associated springs 58 are provided.

[0092] The actuating part 44 can be designed in a bow-shaped or boomerang-shaped manner, with the actuating surfaces 42 being assigned to the free ends of the actuating part 44. The positioning or clamping part 34, 76, on the other hand, is assigned to a center of the actuating part 44, which in turn results in the symmetry of the tilting mechanism 40.

[0093] As explained above, the carrier assembly 24, thanks to the tilting mechanism 40, provides a way to process both sides of the wafer 22 simultaneously without removing the wafer 22 from the carrier 26. Furthermore, the tilting mechanism 40 provides a space-saving way to determine the position of the wafer 22 in the carrier 26, so that multiple carrier assemblies 24 can be provided side by side in the multiple carrier 20, thereby increasing efficiency because a large number of wafers 22 can be processed simultaneously.

[0094] The tilting mechanism 40 also ensures that automation is possible, since the tilting mechanism 40 can be operated automatically, in particular automatically during the insertion or removal of the wafer 22. This is possible because the actuation direction B of the tilting mechanism 40 is parallel to the loading direction R or removal direction E. Despite this actuation direction B, the wafer 22 is positioned or clamped laterally, whereby a maximum area of ​​the wafer 22 can be processed, especially in comparison to systems that work with hold-down devices or the like.

Claims

1. A carrier assembly (24) for positioning a wafer (22) without play, comprising a carrier (26) for the wafer (22), a tilting mechanism (40) and a positioning part (34), wherein the carrier (26) has an opening (30) for receiving the wafer (22), wherein the positioning part (34) has a positioning surface (36) for laterally positioning the wafer (22), and wherein the tilting mechanism (40) is configured to tilt the positioning part (34) between a release position and a positioning position in which the wafer (22) is positioned between an edge of the opening (30) and the positioning surface (36).

2. Support assembly (24) according to claim 1, characterized in thatthe tilting mechanism (40) has at least one actuating surface (42) via which the tilting mechanism (40) can be actuated in order to tilt the positioning part (34) between the positioning position and the release position, wherein the actuating surface (42) is perpendicular to the positioning surface (36) in the positioning position of the positioning part (34).

3. Support assembly (24) according to claim 2, characterized in that the tilting mechanism (40) has an actuating part (44) which is mechanically connected to the positioning part (34), wherein the actuating surface (42) is formed on the actuating part (44).

4. Support assembly (24) according to claim 3, characterized in that the tilting mechanism (40) has at least one bearing block (48) which defines a pivot point for the actuating part (44).

5. Support assembly (24) according to one of the preceding claims, characterized in thatthe carrier (26) has an edge-side recess (64) through which the tilting mechanism (40) partially extends.

6. Support assembly (24) according to one of the preceding claims, characterized in that the tilting mechanism (40) is provided in a plan view of the opening (30) at a laterally spaced distance from the opening (30) such that a wafer (22) received in the carrier (26) is accessible from two opposite sides.

7. Support assembly (24) according to one of the preceding claims, characterized in that a spring (58) is provided which cooperates with the tilting mechanism (40) in such a way that the positioning part (34) is pretensioned into the positioning position.

8. Support assembly (24) according to one of the preceding claims, characterized in thatthe positioning part (34) is a clamping part (76) which has a clamping surface (78) for laterally clamping the wafer (22), wherein the tilting mechanism (40) is configured to tilt the clamping part (76) between the release position and a clamping position in which the wafer (22) is clamped between an edge of the opening (30) and the clamping surface (78), in particular wherein a clamping contour (80) is formed on an inner side of the carrier (26) which lies opposite the clamping surface (78).

9. Support assembly (24) according to one of the preceding claims, characterized in that at least one support (32) for an edge of the wafer (22) is provided on the edge of the opening (30), in particular wherein the at least one support (32) is interrupted in a region in which the positioning part (34) is arranged.

10. Support assembly (24) according to one of the preceding claims, characterized in that an adapter ring (28) is provided in which the carrier (26) is inserted.

11. System (10) with a gripping unit (68) and a carrier assembly (24) according to one of the preceding claims.

12. System (10) according to claim 11, characterized in that the gripping unit (68) has a trigger element (72) which is configured to actuate the tilting mechanism (40), wherein the gripping unit (68) is movable at least along a loading and removal direction (R, E), wherein the loading and removal direction (R, E) is parallel to an actuation direction (B) of the tilting mechanism 40 of the carrier assembly (24), and wherein the trigger element (72) actuates the tilting mechanism (40) when loading the carrier (26) with the wafer (22) and when removing the wafer (22) from the carrier (26) in order to tilt the positioning part (34) into the release position.

13. System (10) according to claim 11 or 12, characterized in that the trigger element (72) is resilient.

14. A method for the play-free positioning of a wafer (22) in a carrier (26) for the wafer (22), comprising the steps of: - providing a carrier assembly (24) with the carrier (26) for the wafer (22), - actuating a tilting mechanism (40) of the carrier assembly (24) in order to tilt a positioning part (34) with a positioning surface (36) for laterally positioning the wafer (22) in the carrier (26) from a positioning position into a release position, - introducing the wafer (22) into the carrier (26), and - releasing the tilting mechanism (40) of the carrier assembly (24) so ​​that the positioning part (34) returns from the release position into the positioning position and the positioning surface (36) bears laterally against the wafer (22) in order to position it in the carrier (26).

15. A method for removing a wafer (22) from a carrier (26) for the wafer (22), comprising the steps of: - providing a carrier assembly (24) with the carrier (26) for the wafer (22), wherein the wafer (22) is positioned in the carrier (26), - actuating a tilting mechanism (40) of the carrier assembly (24) in order to tilt a positioning part (34) with a positioning surface (36) for laterally positioning the wafer (22) in the carrier (26) from a positioning position in which the positioning surface (36) rests laterally on the wafer (22) into a release position, - removing the wafer (22) from the carrier (26), and - releasing the tilting mechanism (40) of the carrier assembly (24) so ​​that the positioning part (34) returns from the release position to the positioning position.

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