Technology for dissipating heat from an electrical circuit

Abstract

The invention describes a technology for dissipating heat from an electrical circuit. According to one aspect, a device (100) comprises a heat sink (110) and at least one heat transfer module (120). The heat sink (110) has a heat sink base (114) and a plurality of cooling fins (112), which extend from the heat sink base, for discharging heat. Each heat transfer module (120) is mechanically and thermally conductively connected or connectable to the heat sink (110) at a first end (122) by means of a press-fit (130) and / or a metal integral connection at a joining point of the heat sink (110). Each heat transfer module (120) has, at a second end (124) of the heat transfer module (120), the second end being at a distance from the first end (122), a contact area (144) which is designed to make contact with at least one heat discharge point (142) of the electrical circuit to absorb the heat from the electrical circuit.

Description

[0001] Technique for dissipating heat from an electrical circuit

[0002] The present invention relates to heat dissipation from electrical, for example, electronic, circuits. In particular, but not limited to, a device for dissipating heat, a kit of parts for one or more such devices, an assembly of various devices, and a method for manufacturing the device are disclosed.

[0003] Electrical circuits contain heat sources that must be dissipated at the heat dissipation point via heat sinks to ensure the long-term and reliable operation of the electrical circuit. The heat must usually be dissipated indirectly via a heat path with thermal contacts to a heat sink, since the most powerful heat sources, such as power transistors and processors, are spatially distributed throughout the electrical circuit. Therefore, the heat paths must be adapted to the specific electrical circuit.

[0004] To achieve this flexibility, conventional heat paths include so-called "heat spreaders", which have the function of individual heat conduction between the heat dissipation point of the electrical circuit and the heat sink.

[0005] In particular, the "heat spreaders" also serve as spacers (technically known as "spacers") between a printed circuit board of the electrical circuit and the heat sink for the installation height of other components of the electrical circuit.

[0006] However, the thermal and mechanical connection of conventional heat spreaders to the heat sink is associated with disadvantages. Heat spreaders are typically connected to the heat sink via a housing or screw connections. Such thermal contact points impair heat conduction. Even the use of a plastic and thermally conductive mass, technically known as a "thermal interface material" (TIM), at the contact points cannot raise the heat conduction efficiency to the level of a homogeneous (i.e., integral) casting.

[0007] The invention is therefore based on the object of specifying a technique for dissipating heat from an electrical circuit which makes it possible to use the same heat sinks for different electrical circuits and thereby achieve the same or comparable heat conduction efficiency as with a heat sink adapted to the respective electrical circuit.

[0008] The object is achieved by the features of each of the independent claims. Expedient embodiments and advantageous further developments of the invention are specified in the dependent claims.

[0009] Embodiments of the invention, which can be optionally combined with one another, are disclosed below with partial reference to the figures. In particular, features mentioned in the context of the device can also be implemented correspondingly in the method, for example, by a step of providing the corresponding feature or by a step of executing a function of the device. Furthermore, the device can comprise any feature mentioned in the context of the method and can be configured to execute any step mentioned in the context of the method.

[0010] A first aspect relates to a device for dissipating heat from an electrical circuit. The device comprises a heat sink. The heat sink has a heat sink base and a plurality of cooling fins extending from the heat sink base for dissipating heat. The device further comprises at least one heat transport module. The at least one heat transport module is or can be connected mechanically and thermally conductively to the heat sink at a first end of the heat transport module by means of a press fit and / or metallic bond at a joint of the heat sink. Furthermore, the at least one heat transport module has a contact surface at a second end of the heat transport module spaced from the first end, which contact surface is designed to contact at least one heat dissipation point of the electrical circuit for absorbing the heat of the electrical circuit.

[0011] The technology enables, starting from a (for example, generic) heat sink, a device adapted to the electrical circuit for dissipating heat. Embodiments of the device can absorb the heat of the electrical circuit via the at least one heat transport module at the second end, which is adapted to the at least one heat dissipation point of the electrical circuit. The at least one heat transport module and / or the heat sink, in particular its heat sink base, can also serve to distribute the heat (heat spreading). The electrical circuit can comprise electrically interconnected (for example, electronic) components. The components can be arranged in one or more modules or on one or more circuit carriers.The components may include linear components (e.g. resistors, capacitors or inductors) and non-linear components (e.g. transistors), including electromechanical components (e.g. relays or solenoid valves).

[0012] In each embodiment, the press fit and / or the metallic bond can enable a thermal (namely, heat-conducting) and mechanical connection to the heat sink. The thermally conductive connection can be integral due to the metallic bond, or after the press fit, it can be as effective as if the heat sink and heat transfer module were integral. This means that the device can be comparable to a device manufactured from a single block with regard to heat transfer. Likewise, production is modular for easy variation. For example, due to the press fit and / or the metallic bond, surfaces at the first end that are in contact with the heat sink can have a thermal resistance that essentially corresponds to an integral, one-piece component.

[0013] A press-fit profile (also: first press-fit profile) at the first end of the heat transfer module may include cantilevered surfaces and transverse surfaces. The cantilevered surfaces may be convex and / or longitudinal surfaces and / or extend in extension of the distance from the second end to the first end (i.e., a longitudinal direction of the heat transfer module).

[0014] The transverse surfaces may be surfaces adjacent to and / or between the projecting surfaces and / or extend transversely (e.g. perpendicularly) to the longitudinal direction.

[0015] The heat sink can have a press-fit profile (also: second press-fit profile) at the joint that is complementary to the first profile, for example a shape that is at least partially coordinated and / or corresponding for a press fit. For example, the second profile can have projecting surfaces and transverse surfaces that are complementary to the projecting surfaces and the transverse surfaces of the first profile. Due to the press fit, heat can be dissipated to the heat sink via both the projecting surfaces and the transverse surfaces. Alternatively or additionally, the metal-to-metal bond can eliminate the projecting surfaces and / or the transverse surfaces as interfaces between the heat transfer module and the heat sink.In each embodiment, the fundamental effect of the heat transfer resistance between the contact surfaces can be minimized, which is achieved by the metallic material bond (indicated, for example, by the press fit) or is at least essentially equivalent to a material bond due to the press fit.

[0016] The heat absorbed at the contact surface and / or dissipated at the cooling fins (more precisely: the amount of heat) may be a part (e.g. a fraction) of the heat generated by the electrical circuit (i.e. the amount of heat).

[0017] The cooling fins may comprise (for example thin-walled) fins or (at least some of them) may be designed as such.

[0018] The heat transfer module can be a heat distributor. This can be referred to in technical terms as a "heat spreader," "heat spreader module," "modular heat spreader," or "modular heat spreader-spacer combination." The at least one heat dissipation point can comprise at least one heat center (technically known as a "hot spot") of the electrical circuit.

[0019] The at least one heat dissipation point of the electrical circuit can comprise a heat dissipation point of an electronic component (for example, a power transistor, an integrated circuit, or a processor). Alternatively or additionally, the at least one heat dissipation point of the electrical circuit can comprise a heat collection point on a circuit carrier (for example, on a printed circuit board). The heat collection point can dissipate the heat of multiple components of the electrical circuit (for example, via copper surfaces or conductor tracks of the electrical circuit).

[0020] The press fit can be an interference fit (also known as compression or press fit). Alternatively or additionally, the press fit can be an interference fit, for example, joined in the state of an outer (concave) press-fit profile temporarily widened by thermal expansion. Alternatively or additionally, the press fit can be joined by re-pressing, for example, by re-pressing a metallic filler material that preferably matches the material of the heat transfer module and / or the heat sink.

[0021] The metallic bond can be a bond between metals (e.g., a first metal of the heat transfer module and the first metal or a second metal of the heat sink) or alloys. Alternatively or additionally, the metallic bond can be provided without the use of filler materials at the joint.

[0022] The second end can also be referred to as the warm end, and the first end as the cold or cool end. Alternatively or additionally, the first end can be referred to as the free end or joining end.

[0023] In each embodiment, the joint (for example, one of the at least one heat transfer module) can be arranged on the heat sink base or on one of the cooling fins.

[0024] The arrangement of at least one joint on the heat sink base can enable a compact combination of the electrical circuit and the device, for example by arranging components of the electrical circuit between the cooling fins (for example adjacent to the adjacent cooling fins or free-standing in the space between them).

[0025] Alternatively or additionally, the arrangement of at least one joint on one of the cooling fins can reduce the length of the heat path via the heat transfer module between the contact surface and the joint (for example, compared to a joint on the heat sink base). This can be advantageous, for example, if the heat dissipation point (for example, a heat source) of the electrical circuit is in the immediate vicinity of a cooling fin.

[0026] Alternatively or additionally, the cooling fin with joint can advantageously dissipate the heat to the environment without having to go through the heat sink base.

[0027] Alternatively or additionally, the arrangement of at least one joint on an outer side of one of the outer cooling fins of the heat sink can thermally connect a component (or multiple components) of the electrical circuit to the heat sink, for example, even if the component is arranged next to the heat sink, i.e., is not covered by the cooling surface or the heat sink base. This allows the electrical circuit (for example, a circuit carrier of the electrical circuit) to have a larger surface area than the heat sink (for example, than the heat sink base).

[0028] Through the modular combination of the heat sink with at least one heat transfer module, identical heat sinks can be adapted for different electrical circuits. The press fit and / or the metallic bond can achieve a mechanical and thermal connection between the heat transfer module and the heat sink that is identical to or comparable to an integral, one-piece device (for example, compared to a device manufactured by primary or forming processes, which was originally created from a single-piece base body). This state can be achieved through joining (i.e., the press fit and / or the metallic bond).

[0029] The joining (i.e. the press fit and / or the metallic bond) of the at least one heat transfer module to the heat sink enables a simple, cost-effective, individually positionable and robust thermal connection (e.g. the function of a thermal bridge) of the contacted heat dissipation point and / or creates installation space for components between the heat sink base and the circuit carrier (e.g. the function of a spacer), without significantly impairing the efficiency of the heat conduction in comparison with an individually adapted heat sink milled from a single piece.

[0030] The same or further embodiments of the device enable the assembly of components on the circuit carrier between the circuit carrier and the heat sink base (also known in technical terms as a "heat sink base") and / or thermal contacting even outside the heat sink base. The latter enables an efficient circuit diagram of the electrical circuit, for example, an efficient layout of the circuit carrier (e.g., the circuit board). The former embodiments can enable the assembly of components (also known as parts) below the heat sink (also known in technical terms as a "heat sink"), which are higher than the heat dissipation point (also known in technical terms as a "heat spot" or "hot spot") to be connected via the heat transport module. This means that the heat sink or its cooling base covers the component oriented toward the heat sink.Thus, the at least one joint can be advantageously used for installation positions below the heat sink on the heat sink base and / or (particularly advantageous in the second exemplary embodiment mentioned in the previous paragraph) can be formed on the cooling fins, for example, for a lateral or frontal contact direction. Thus, exemplary embodiments can enable a thermal connection of a heat dissipation point of the electrical circuit located laterally outside the heat sink to the heat sink.

[0031] Numerous geometric variations are possible for press-fit profiles. Examples of joining principles include press fitting (especially interference fitting) and / or the re-pressing of material during or after joining.

[0032] Thanks to the press fit and / or metal-to-metal bond, no thermal interface material (TIM) is required in the thermal contact path. This reduces the material costs of the device and eliminates application costs.

[0033] The press fit or the metallic bond can reduce the thermal resistance in the thermal path.

[0034] Due to the efficient heat dissipation, the device can contribute to a longer service life (e.g. functional life) of the components of the electrical circuit.

[0035] Embodiments of the device can eliminate sources of error during assembly, such as loose thermal contacts, due to the mechanically robust connection (for example, a connection whose mechanical load limit is determined by the heat transfer module itself and not by the joining).

[0036] Because the device can be mounted as an assembly, separate joining elements are eliminated, simplifying assembly, saving material, and resulting in lower application costs (e.g., TIM only on the contact surfaces of the second ends). Additional brackets in a housing for positioning loose spacers and loose heat spreaders can be eliminated, thus reducing the space required in the housing. Due to the press fit or metal-to-metal bond, embodiments of the device can be mechanically robust, simple, and individually positionable.

[0037] Assembly is less prone to errors. Joining contours (i.e., joining geometries and press-fit profiles) can be created during a preliminary primary forming and / or separation manufacturing process, thus requiring virtually no additional effort. Furthermore, these elements are permanently attached to the heat sink (unlike a screw connection, for example).

[0038] The press fit can be used as a joining technique to connect the functional combination of heat spreader and spacer with the heat sink in a mechanically reliable and thermally efficient manner in a compact size to form an assembly, in particular without the need for further additives for the connection.

[0039] The device may further comprise a housing in which the electrical circuit is arranged. The cooling fins of the heat sink may be exposed outside the housing. Alternatively or additionally, the at least one heat transfer module may be arranged at least partially or entirely within the housing.

[0040] The heat sink can form an outer wall of the housing. Alternatively or additionally, the heat transport module can transport the heat of the electrical circuit from an area of ​​the electrical circuit housing that is inaccessible to cooling or circulating air to the heat sink. For example, the at least one heat transport module can be devoid of cooling fins (e.g., fins) and / or can be optimized for heat transport from the heat source to the heat sink, thus quickly transporting the heat further and preferably being designed without cooling fins. Alternatively or additionally, the heat transport module can be an active or passive thermal bridge.

[0041] The press fit can have a metallic bond (at least in sections, in particular partially or selectively). The bond can be achieved by cold welding, extrusion, and / or friction during the press fit. The press fit between the heat transfer module and the heat sink can be joined by a transverse translational movement (transverse movement). For example, the transverse surfaces can flow or melt on the surface during the press fit due to shear forces and / or the transverse movement. Alternatively or additionally, the press fit between the heat transfer module and the heat sink can be joined by a longitudinal translational movement (longitudinal movement). For example, the longitudinal surfaces can flow or melt on the surface during the press fit due to shear forces and / or the longitudinal movement.In both cases, the metallic bond between the heat transfer module and the heat sink can be established at least in sections at the first end.

[0042] The metal-to-metal bond can be a welded joint between a metal of the heat transfer module and a metal of the heat sink. The metal of the heat transfer module and the metal of the heat sink can be the same. Alternatively or additionally, the metal-to-metal bond can be an alloy of the metal of the heat transfer module and the metal of the heat sink. For example, the metal-to-metal bond does not include a third component different from the metal of the heat transfer module and the metal of the heat sink. Advantageously, the joining can be carried out without any auxiliary material and / or without the supply of additional energy (see arc welding).

[0043] The metal-to-metal bond may comprise an arc weld. The metal-to-metal bond (i.e., the arc weld) may be created by electrode welding (i.e., arc welding).

[0044] The heat transfer module can be welded at the first end without form fit and / or flat on the (e.g. also flat) joint by arc welding.

[0045] Alternatively or additionally, a heating current can be applied between the heat sink and the heat transfer module during the pressing process, so that the first end of the heat transfer module flows into a recess (e.g., a die at the joint) of the heat sink by drop forging or extrusion. Heating (e.g., by melting) and / or drop forging or extrusion can eliminate any air pockets remaining in a conventional press fit.

[0046] The press fit can achieve the metallic bond by inductive heating of the first end. For example, an inductor (e.g., a water-cooled induction coil) can be placed around the heat transfer module (e.g., in the longitudinal direction) before, during, or after the press fit to inductively heat the first end of the heat transfer module.

[0047] Through this energy input—or through extrusion alone—macroscopic or microscopic air pockets between the heat transfer module and the heat sink can be melted. The thermally conductive connection between the heat transfer module and the heat sink can be seamless and homogeneous.

[0048] The joint can comprise two adjacent cooling fins. The press fit can comprise a frictional connection and / or a metallic bond between the heat transfer module and at least one of the cooling fins (or between the two adjacent cooling fins) of the heat sink. For example, the press fit can be achieved by an oversize of the heat transfer module at the first end compared to a distance between the adjacent cooling fins. The heat transfer module can be pressed between the two adjacent cooling fins. The pressing (pressing) can be carried out longitudinally or transversely.

[0049] Alternatively or additionally, a contoured cooling fin can increase the surface area of ​​the heat sink compared to a flat surface for heat exchange with the environment. This contour of the cooling fins can also serve as a press-fit profile (also known as a second press-fit profile) as a (potential) joint for the press fit.

[0050] Alternatively or additionally, the cooling fins can be a press-fit profile (i.e., the second profile of the press fit complementary to the first profile). Where no heat transfer module is connected (i.e., joined) to the heat sink by means of a press fit, the press-fit profile can increase the surface area of ​​the heat sink for heat exchange with the environment (i.e., act as cooling fins of the heat sink). Where a heat transfer module is connected (i.e., joined) to the heat sink by means of a press fit, the press-fit profile can enable the press fit with the heat transfer module.

[0051] The at least one heat transfer module can have a first press-fit profile at each end. The heat sink can have a second profile at the respective joint that is complementary to the first profile (for example, in sections). For example, the heat sink can have one or more additional joints with the second profile, thus enabling the creation of variants during production.

[0052] The one or more additional joining points may be unjoined. This means that the heat sink may have an excess of joining points (for example, during production before the press fit). During the manufacture of the device, the heat sink may have multiple joining points with the second profile, so that one of the at least one heat transfer module is connected to one of the multiple joining points, depending on the electrical circuit (for example, geometry, position, and / or number of the at least one heat dissipation point of the electrical circuit).

[0053] The first profile and the second profile can engage or flow seamlessly into each other in a press fit. The gap-free or gap-reduced connection enables an increase in heat transfer efficiency, for example, compared to conventional thermal bonding using TIM.

[0054] The joining partners of the press fit can engage with each other completely and without gaps or flow into each other (for example for the metal-to-metal bond).

[0055] For example, the shapes of the first profile and the second profile are designed to correspond to one another in such a way that the first profile is at least partially received in the second profile after joining. The second profile is in particular a recess in the heat sink, with the advantage that the surface for the arrangement is thus unaffected. Optionally, a volume (for example a material volume) of the first profile corresponds to a volume (for example a cavity volume) of the second profile or is slightly larger than the volume of the second profile in order to exclude the formation of air pockets at the connection between the heat sink and the heat transport module due to plastic deformation (for example extrusion) during the press fit. This can reduce thermal conduction resistance.

[0056] The second end can be opposite the first end in at least one of the at least one heat transport module. Alternatively or additionally, at least one heat transport module of the at least one heat transport module can extend from the second end along a longitudinal direction to the first end and / or be arranged transversely (preferably perpendicularly) to the surface of the first end. A further contact surface can be arranged between the first end and the second end laterally to the longitudinal direction (for example, parallel to the longitudinal direction). Alternatively or additionally, the at least one heat transport module can each have a plurality of contact surfaces for absorbing the heat.

[0057] For example, a first contact surface can be arranged at the second end opposite the first end in the longitudinal direction and / or transversely, in particular perpendicularly, to the longitudinal direction. Alternatively or additionally, a second contact surface can be offset laterally (i.e., laterally) relative to the longitudinal direction and / or parallel to the longitudinal direction.

[0058] The heat sink can be designed independently of the electrical circuit. Alternatively or additionally, the at least one heat transfer module can be connected to and / or shaped by the heat sink depending on the topography of the at least one heat dissipation point of the electrical circuit.

[0059] The (e.g., generic) heat sink can be adapted to the topography of the at least one heat dissipation point of the electrical circuit via the at least one heat transport module (e.g., in a modular design). The heat sink can thus be spaced apart from the electrical circuit despite the heat-conducting connection to prevent collision. Alternatively or additionally, the at least one heat transport module can contact distributed and / or differently aligned heat dissipation points for absorbing the heat of the electrical circuit due to a shape (e.g., at the second end) and / or a length (e.g., in the longitudinal direction) of the at least one heat transport module (e.g., on the circuit carrier). The device can comprise a plurality of heat transport modules.The heat transfer modules can each extend from the heat sink with different lengths between the first end and the second end (e.g., parallel to each other). The different lengths can correspond to a topography of the heat dissipation points of the electrical circuit (e.g., the heights of components of the electrical circuit on the circuit carrier). The different lengths can be complementary to a topography of the at least one heat dissipation point of the electrical circuit. Alternatively or additionally, the different lengths can correspond to the distances from the heat sink base to the respective heat dissipation surface.

[0060] Due to the shape and / or length of the heat transport modules, distributed and / or differently aligned heat dissipation points can be contacted or contactable to absorb the heat of the electrical circuit.

[0061] The heat sink may comprise aluminum or copper, or an alloy (e.g., with aluminum and copper). Alternatively or additionally, the at least one heat transfer module may comprise copper or aluminum, or an alloy (e.g., with aluminum and copper).

[0062] Due to copper's high thermal conductivity, different heat conduction paths to the heat sink can be thermally balanced. The low density of aluminum allows for a low overall weight of the device.

[0063] A component can be arranged on the circuit carrier (e.g., on the circuit board) between the circuit carrier (e.g., the circuit board) and the heat sink base and / or next to the at least one heat transfer module. This component is higher in the direction of the heat sink than the heat dissipation point contacted via the heat transfer module. For example, a component thermally connected via the heat transfer module can be smaller than the component arranged (i.e., mounted) between the heat sink base and the circuit carrier and / or next to the at least one heat transfer module on the circuit carrier.

[0064] In each embodiment, the circuit carrier (e.g., the printed circuit board) is preferably aligned parallel to the heat sink base when or after the heat sink is arranged thereon. The heat sink and / or the at least one heat transport module can be filled with a fluid. For example, the at least one heat transport module can comprise a heat pipe aligned parallel to the heat flow or a longitudinal direction of the heat transport module from the second end to the first end. For example, a boiling point of a working medium hermetically enclosed in the heat pipe can be adapted to the temperature at the first end, and a condensation point of the working medium can be adapted to the temperature at the second end of the heat transport module.

[0065] The heat pipe allows the overall thermal resistance of the combined heat transfer module and heat sink to be further reduced. For example, the overall thermal resistance can be lower than that of an integral, one-piece component with the corresponding combined shape of the heat transfer module and heat sink.

[0066] The working medium can be a refrigerant. Alternatively or additionally, to minimize thermal resistance, a material of the working medium and / or a pressure of the working medium can be selected such that the boiling point of the working medium at the second end is only slightly above and / or at the first end only slightly below the boiling point of the working medium.

[0067] As an embodiment of the heat pipe, the heat transport module can have a bore along the longitudinal direction at the first end, which bore is filled with the working medium and is sealed gas-tight by the press fit.

[0068] A second aspect of the technology relates to a system comprising an electrical circuit (for example, a circuit carrier with the electrical circuit) and a device for dissipating heat from the electrical circuit according to the first aspect. The contact surface (or contact surfaces) of the at least one heat transport module can contact the at least one heat dissipation point of the electrical circuit to absorb the heat from the electrical circuit.

[0069] In every aspect, the circuit carrier with the electrical circuit can be a so-called "System on a Module" (SOM board).

[0070] The system may have any feature mentioned in connection with the device aspect. For example, the at least one heat transport module may be adapted to a topography of the at least one heat dissipation point of the electrical circuit.

[0071] A third aspect of the technology relates to an ensemble of devices for dissipating heat from an electrical circuit according to the first aspect, wherein the devices of the ensemble have the same heat sink and differ in that the at least one heat transport module is mechanically and thermally conductively connected to the heat sink at different joining points of the heat sink and / or that the at least one heat transport module has different lengths between the first end and the second end.

[0072] Advantageously, the same heat sink can be used for different electrical circuits.

[0073] A fourth aspect of the technology relates to a kit of parts for a device for dissipating heat from an electrical circuit according to the first aspect or for an assembly according to the third aspect. The kit of parts comprises one or more identical heat sinks, each having a heat sink base and a plurality of cooling fins extending from the heat sink base for dissipating heat.Furthermore, the kit of parts comprises a plurality of heat transport modules, each of which can be mechanically and thermally conductively connected to the heat sink at a first end of the heat transport module by means of a press fit and / or metallic bond at a joint of the heat sink, and each of which has a contact surface at a second end of the heat transport module spaced from the first end, which contact surface is designed to contact at least one heat dissipation point of the electrical circuit for absorbing the heat of the electrical circuit, wherein the plurality of heat transport modules has different lengths between the first end and the second end.

[0074] Advantageously, the kit of parts can enable a modular construction of the device adapted to the electrical circuits.

[0075] A fifth aspect of the technology relates to a method for manufacturing a device for dissipating heat from an electrical circuit. The method comprises a step of providing a heat sink having a heat sink base and a plurality of cooling fins extending from the heat sink base for dissipating heat.

[0076] The method further comprises a step of press-joining and / or metal-to-metal joining of at least one heat transport module, each with a first end of the heat transport module at a joint of the heat sink for mechanical and heat-conducting connection to the heat sink.

[0077] The method further comprises a step of contacting the at least one heat transport module with a contact surface arranged at a second end of the heat transport module spaced from the first end at at least one heat dissipation point of the electrical circuit for absorbing the heat of the electrical circuit.

[0078] The press-fitting step involves creating a press fit. Alternatively or additionally, metal-to-metal joining involves creating a metallic bond. Metal-to-metal joining is preferably performed by cold welding without the additional introduction of process heat.

[0079] The heat sink may have a plurality of joining points. Joining (i.e., press joining and / or metal-to-metal joining) may include selecting the joining point from the plurality of joining points depending on (e.g., the topography) of the electrical circuit.

[0080] The method may further comprise a step of shortening, optionally milling, the at least one heat transfer module at the second end depending on the electrical circuit. For example, the shortening is performed after joining (i.e., after press joining and / or after metal-to-metal joining).

[0081] For example, a plurality of heat transfer modules (after joining the plurality of heat transfer modules to the heat sink) can be shortened in one process (e.g., in a milling process) depending on (e.g., the topography) of the electrical circuit.

[0082] One advantage of shortening is the precise alignment of the dimensions compared to pre-cutting, which allows for greater dimensional accuracy. Due to the mechanical connection of the heat transfer modules via the heat sink, which is already established during the process, the heat transfer modules can be precisely shortened according to the heat dissipation points of the electrical circuit (e.g., the topography).

[0083] Providing the heat sink may comprise extruding (e.g., extrusion) the heat sink, for example, including the heat sink base and the cooling fins and / or including the one or more joints (i.e., the second profile).

[0084] The method may further comprise providing (e.g., extruding, preferably extruding) the at least one heat transport module, for example, including the first profile at the first end for press fitting and / or including the contact surface at the second end, which is configured to contact a heat dissipation point of the electrical circuit for absorbing the heat of the electrical circuit.

[0085] The invention is explained in more detail below with reference to the attached drawings using preferred embodiments which can be optionally combined with one another.

[0086] They show:

[0087] Fig. 1 is a schematic sectional view of a conventional heat sink according to a reference example;

[0088] Fig. 2 is a schematic sectional view of a device for dissipating heat from an electrical circuit according to a first embodiment;

[0089] Fig. 3 is a schematic side view, viewed parallel to the cooling fins, of a device for dissipating heat from an electrical circuit according to a second embodiment;

[0090] Fig. 4 is a schematic sectional view, viewed perpendicular to the cooling fins, of the device for dissipating heat from an electrical circuit according to the second embodiment;

[0091] Fig. 5 is a schematic side view, viewed parallel to the cooling fins, of a device for dissipating heat from an electrical circuit according to a third embodiment; Fig. 6 is a schematic sectional view of a first example of a press fit that can be used in each embodiment;

[0092] Fig. 7 is a schematic sectional view of a third example of a press fit that can be used in each embodiment;

[0093] Fig. 8 is a schematic perspective view of a device for dissipating heat from an electrical circuit according to a fourth embodiment;

[0094] Fig. 9 is a schematic flow diagram of a manufacturing method of an embodiment of the device; and

[0095] Fig. 10 AC schematic representations of a fifth example of a press fit, which can be used in each embodiment, in different stages of a press joining by means of an embodiment of a manufacturing process according to the invention, which can be used on further embodiments of a manufacturing process according to the invention.

[0096] Herein, features shown or described in different embodiments are interchangeable with like reference numerals.

[0097] Fig. 1 shows a reference example. The thermal connection of a component 14 to a base 12 of a heat sink 11 determines the distance between the circuit board 13 and the base 12. This precludes the possibility of accommodating another component 14 with a greater height under the heat sink on the circuit board 13.

[0098] Fig. 2 shows a schematic sectional view of a first embodiment of the device, generally designated by reference numeral 100, for dissipating heat from an electrical (for example electronic) circuit.

[0099] The device 100 includes a heat sink 110 having a heat sink base 114 and a plurality of cooling fins 112 extending from the heat sink base for dissipating heat.

[0100] The device 100 further comprises at least one heat transport module 120. Each heat transport module 120 is mechanically and thermally conductively connected to the heat sink 110 at a first end 122 of the heat transport module 120 by means of a press fit 130 and / or metallic bond at a joint of the heat sink 110. Each heat transport module 120 has a contact surface 144 at a second end 124 of the heat transport module 120, spaced from the first end 122, which contact surface is designed to contact at least one heat dissipation point 142 of the electrical circuit for absorbing the heat of the electrical circuit.

[0101] Due to the press fit 130 and / or the metallic bond, a heat flow in the direction 126 can flow as efficiently as if the heat transport module 120 and the heat sink 110 were integrally formed (for example, a metal casting or milled from a workpiece).

[0102] In contrast to the direct thermal connection shown in Fig. 1, embodiments of the device 100 enable the combined function as a heat spreader and spacer, ie as a thermal distance bridging device, if the heat dissipation point 142 of the electrical circuit is flatter than other components on a circuit carrier 140 (for example a printed circuit board 140) of the electrical circuit below that of the heat sink.

[0103] Between the circuit board 140 and the heat sink base 114 of the heat sink 110 and / or next to the at least one heat transport module 120, a component 146 is arranged on the circuit board 140, which component is higher in the direction 126 towards the heat sink 110 than the heat dissipation point 142 or heat dissipation points 142 contacted via a heat transport module 120.

[0104] The modularity of the device 100, i.e. the use of a heat sink 110 for different electrical circuits with different heat dissipation points 142, exists due to the freedom of choice (for example with regard to the joining point and shape of the at least one heat transport module) when joining the heat sink 110 to the heat transport module 120 or the plurality of heat transport modules 120. This modularity is achieved without separate joining elements (such as screw and / or spring connections), which conventionally require additional assembly steps and increase the thermal resistance, since screwed or spring-loaded contact surfaces are only partially in contact at a molecular level for heat conduction. Fig. 3 shows a schematic side view (viewed parallel to the cooling fins 112) of a device 100 for dissipating heat from an electrical circuit according to a second exemplary embodiment.

[0105] The heat transfer modules 120 allow the electrical circuit to comprise two parallel circuit boards 140. For example, the heat transfer modules 120 enable the electrical circuit to have a spatial structure with multiple levels. An (upper) first circuit board 140 comprises components 148 that directly contact the heat sink base 114 in a conventional manner. A (lower) second circuit board 140 comprises components that are thermally coupled to the heat sink 110 as a heat dissipation point 142 via at least one heat transfer module 120.

[0106] Fig. 4 schematically shows a sectional view of the embodiment of Fig. 3 along section line AA. Optionally, the second circuit board 140 can include at least one component 146 arranged in the space created by the heat transfer modules 120. For example, the second circuit board 140 is larger than the first circuit board 140. The component 146 is arranged on the second circuit board 140 outside the first circuit board and extends beyond the plane of the first circuit board 140.

[0107] In the embodiments described above, the heat transport module 120 or the heat transport modules 120 are joined to the heat sink base 114 for thermal contact with the heat dissipation points 142 of components below the heat sink base 114 and / or between the cooling fins 112.

[0108] In a third embodiment of the device 100 shown schematically in Fig. 5, at least one heat transport module 120 is joined to an edge cooling fin 112 for thermally contacting heat dissipation points 142 (ie components) which are arranged laterally next to the heat sink 110 on the circuit board 140.

[0109] This lateral coupling of components to a cooling fin 112 can be combined with any of the previously described couplings of components to the heat sink base 114. Alternatively or additionally, as shown schematically in the context of the third embodiment in Fig. 5, several heat dissipation points 142 (e.g., several components) of the electrical circuit can be coupled to a heat transport module 120.

[0110] The first end 122 and the second end 124 are opposite each other in the longitudinal direction 126 of the heat transport module 120. In at least one heat transport module 120, a further contact surface 144 is arranged laterally to the longitudinal direction 126 (for example, parallel to the longitudinal direction 126).

[0111] Thus, a first contact surface 144 (for example, perpendicular to the longitudinal direction 126) can be arranged at the second end 124 of the heat transport module 120, which is opposite the first end 122 in the longitudinal direction 126. In addition, a second contact surface 144 (for example, parallel to the longitudinal direction) can be arranged laterally (i.e., laterally) offset from the longitudinal direction 126 on the heat transport module 120.

[0112] Figures 6 and 7 show schematic sectional views of examples of the press fit that can be used in each embodiment of the device 100. The left half of the image shows the state before joining, and the right half of the image shows the joined state of the heat sink 110 and the heat transfer module 120.

[0113] The first end of the heat transfer module 120 has a first press-fit profile. The joint of the heat sink 110 has a complementary second press-fit profile. While in the examples shown, the first profile is convex and the second profile is concave, the first and second profiles can also be interchanged in any embodiment.

[0114] Each example includes transverse surfaces at the first end of the heat transport module 120 that are perpendicular to the longitudinal direction (which is the vertical direction in the plane of illustration).

[0115] The first example of the first profile shown in Fig. 6 comprises V-shaped longitudinal surfaces. Joining can involve a transverse movement perpendicular to the longitudinal direction, in which the first profile is inserted laterally into the second profile and moved along the heat sink 110 to the desired joining point. Optionally, frictional heat generated during this process can heat or even melt the surfaces, thereby creating a metallic bond in sections.

[0116] Alternatively or additionally, in each exemplary embodiment and / or each profile shape, after the positive and / or frictional joining has already taken place, the first end on the heat transport module 120 and / or the joint on the heat sink 110 can be inductively heated. By tempering, i.e., heating to a tempering temperature (for example, of at least 500 degrees Celsius), creep (i.e., viscoelastic or plastic deformation) of the metallic heat transport module 120 at the first end and / or of the heat sink 110 at the joint can be induced or accelerated, so that the effective exchange surface for heat conduction at the molecular level is significantly increased or air inclusions are reduced or eliminated.

[0117] Alternatively or additionally, in each embodiment and / or each profile shape, after the positive and / or frictional joining has already taken place, the first end on the heat transfer module 120 and / or the joint on the heat sink 110 can be inductively melted for the metallic bond.

[0118] The second example of the first profile shown in Fig. 8 comprises rectangular profiles as longitudinal surfaces. Joining can involve a longitudinal movement in the longitudinal direction. The profiles can be secured against laterally offset joining (for example, by means of rectangular profiles of different widths and / or depths).

[0119] Fig. 8 shows a schematic perspective view of the device 100 according to a fourth exemplary embodiment, in which the cooling fins 112 also function as a press-fit profile (i.e., as the heat sink-side "second" profile of the press fit). This allows the joining location to be freely selected over a large area of ​​the heat sink 110 (for example, on the grid of the cooling fins 112).

[0120] Where no heat transfer module 120 is added, the cooling fins 112 continue to dissipate heat to the environment.

[0121] Fig. 9 shows a schematic flow diagram of a method 1100 for manufacturing a device (for example, an embodiment of the device 100 disclosed herein) for dissipating heat from an electrical circuit. In a step 1102, a heat sink 110 is provided, which includes a heat sink base 114 and a plurality of cooling fins 112 extending from the heat sink base for dissipating heat.

[0122] In a step 1104, a mechanical and thermally conductive connection with the heat sink 110 is established by press-fitting and / or metal-to-metal joining of at least one heat transport module 120, each with a first end 122 of the heat transport module 120 at a joint point of the heat sink 110.

[0123] In a step 1106, the at least one heat transport module 120 contacts at least one heat dissipation point 142 of the electrical circuit for absorbing the heat of the electrical circuit, using a contact surface 144 arranged at a second end 124 of the heat transport module 120 spaced from the first end 122.

[0124] The method may include any step described above in the context of device 100. For example, the metal-to-metal joining may include arc welding. Alternatively or in addition to press joining, the metal-to-metal joining may be achieved by inductive heating.

[0125] The heat sink may have a plurality of joining points. Joining (i.e., press joining and / or metal-to-metal joining) may involve selecting the joining point from the plurality of joining points adapted to the topography of the electrical circuit.

[0126] Preferably after the joining step 1104 and / or before the contacting step 1106, the method 1100 may further comprise a step of shortening, for example by milling, the at least one heat transport module 120. As a result, the contact surface 144 for thermal contact with the respective heat dissipation point 142 can be produced at the second end 124 of the respective heat transport module 120 in accordance with the position and / or orientation of the heat dissipation point 142.

[0127] For example, a plurality of heat transfer modules 120 can be milled in a single operation according to the topography of the electrical circuit after the plurality of heat transfer modules 120 have been joined. Due to the mechanical connection of the heat transfer modules 120 via the heat sink 110 already established during the process, the heat transfer modules 120 can be precisely adapted to the height profile of the heat dissipation points of the electrical circuit.

[0128] Providing 1102 the heat sink 110 may include extruding (e.g., extruding) the heat sink, for example, including the heat sink base 114 and the cooling fins 112 and / or including the one or more joints (ie, the second profile).

[0129] The method 1100 may further comprise providing (e.g., extruding, preferably extruding) the at least one heat transport module 120, for example, including the first profile at the first end 122 for press fitting and / or including the contact surface 144 at the second end 124, which is configured to contact a heat dissipation point 142 of the electrical circuit for absorbing the heat of the electrical circuit.

[0130] Fig. 10 AC show schematic representations of a further embodiment of a device according to the invention in a representation not true to scale, wherein different stages of a press joining are shown, on the basis of which a further embodiment of a manufacturing process is also illustrated.

[0131] Fig. 10 A shows a schematic representation of a first stage of a press-fitting of the heat sink base 114 of the heat sink 110 of a further embodiment of a device 10 according to the invention, which is shown in sections in a cross section, with the heat transport module 120. The reference numerals are partially entered representatively on a representation in the representations of Fig. 10 AC for better clarity.

[0132] In this first stage, the heat transfer module 120 is spaced apart from the heat sink base 114 and aligned with a joint 150 provided for the press fit 130 (illustrated with a reference numeral in Fig. 10 C).

[0133] Before being inserted into a joint 150 provided for it, the first free end 122 of the heat transfer module 120 is configured and formed such that, upon insertion into the joint 150, the first free end 122 undergoes an elastic-plastic, in particular plastic, deformation at least in sections to create the press fit 130. This ensures that the free end 122 essentially approximately assumes the cross-sectional shape 151 of the joint 150 and fills it with few gaps or without gaps for thermal contact, as illustrated in Fig. 10 B and Fig. 10 C. This makes it possible to create a press fit 130 with few or no cavities for thermal contact, whereby the thermal contact between the heat sink 110 and the heat transfer module 120 can be optimized or is optimized.

[0134] In this embodiment, the elastic-plastic or plastic deformation occurs in particular at the free end 122 of the heat transport module 120.

[0135] For this purpose, the free end 122, prior to its insertion into the joint 150, has a cross-section 152 with a cross-sectional contour 154, which in this exemplary embodiment has an arrangement of projections 156 and depressions 158 (each provided with a uniform reference numeral in Fig. 12 A / B) arranged next to one another in the longitudinal direction 126. Due to the cross-sectional representation, the representation is planar. However, in this exemplary embodiment, the projections 156 and depressions 158 also extend into the plane of the page, so that, for example, the respective depression 158 has a groove-like extension. The same applies to the respective projection 156 in the sense of a web-like extension.

[0136] These (156,158) are arranged adjacent to one another in the longitudinal direction 126 in such a way that during insertion, due to the aforementioned deformation, the projection 156 and the depression 158 adjacent to it in the longitudinal direction 126 approach one another during the aforementioned deformation and the projection 156 is reshaped, causing the depression 158 to be filled, as a result of which the cross section 152 of the free end 122 of the heat transport module 120 approximately matches the cross-sectional shape 151 of the joint 150, as can be seen from the illustrations in Fig. 10 B / C.

[0137] However, the invention is not limited to this. The projections 156 and depressions 158 can also be formed, or only, at the joint 150 of the heat sink 110, so that they can shape the cross-sectional shape 151 of the joint 150 of the heat sink 110 and / or the free end 122 of the heat transfer module 120. This provides, among other advantages, that the stresses in the components during insertion to create the desired press fit 130 do not lead to undesirable component weakening, e.g., due to stress cracking. Furthermore, the pressing forces can be reduced to a minimum.

[0138] Fig. 10 B shows a schematic representation of an intermediate stage in which the free end 122 of the heat transport module 120 is partially inserted into the joint 150 of the heat sink 110.

[0139] Fig. 10C shows a schematic representation of a final stage in which the free end 122 of the heat transport module 120 is inserted into the joint 150 to create the desired press fit 130. According to the invention, a plurality of joints 150 or free ends 122 of the heat transport module 120 can be provided for connecting the heat transport module 120 and the heat sink to one another. These joints can have different shapes and therefore do not have to follow a uniform shape. For example, the joints can have different depths. Furthermore, it is possible for the shapes to be reversed, so that bag extinguishers can also be formed in the free end 122 of the heat transport module 120. Furthermore, it is possible for the shapes to be designed alternately, so that a protrusion follows a recess. Furthermore, the protrusions and recesses can be arranged adjacent to one another in a sequence, e.g.at the free end 122 of the heat transport module 120 and correspondingly on the heat sink 110.

[0140] According to the invention, a heat transport module 120 or the heat sink 110 with its corresponding formations (in particular a free end 122 of the heat transport module 120 as well as the heat sink base 114 of the heat sink 110 or the heat sink as such) for a press fit or for a press fit / press fit can be produced by various manufacturing processes, in particular primary forming processes, for example extrusion or casting, as well as forming processes, such as, for example and in particular, extrusion.

[0141] Although the invention has been described with reference to exemplary embodiments, it will be apparent to those skilled in the art that various changes may be made and equivalents may be substituted. Furthermore, many modifications may be made to adapt the device or heat transfer module to a housing or electrical circuit in accordance with the teachings of the invention. Consequently, the invention is not limited to the disclosed embodiments, but includes all embodiments falling within the scope of the appended claims.

[0142] List of reference symbols

[0143] 10 Conventional device

[0144] 11 Heat sink of the conventional device

[0145] 12 Basis of the conventional device

[0146] 13 Circuit board of the conventional device

[0147] 14 Component on the circuit board of the conventional device

[0148] 15 Component that cannot be assembled in the case of the conventional device

[0149] 100 Device for cooling an electrical circuit

[0150] 110 heat sinks

[0151] 112 Cooling fins of the heat sink, for example fins

[0152] 114 Heatsink base of the heatsink

[0153] 120 Heat transport module, for example heat distributor or heat bridge

[0154] 122 First end of the heat transport module

[0155] 124 Second end of the heat transport module

[0156] 126 Longitudinal direction

[0157] 130 Press fit for thermal and mechanical connection between heat sink and heat transfer module

[0158] 140 Circuit carrier, e.g. printed circuit board, of the electrical circuit

[0159] 142 Heat dissipation point connected via heat transport module, for example component of the electrical circuit or heat collection point on the circuit carrier

[0160] 144 Contact surface for thermal contact, for example via thermal paste, also known in technical terms as "Thermal Interface Material" (TIM)

[0161] 146 Component arranged in space created by heat transport module

[0162] 148 Component directly connected to the heat sink

[0163] 150 joint at the heatsink base

[0164] 151 Cross-sectional shape of the joint

[0165] 152 Cross section of the first end of the heat transport module

[0166] 154 Cross-sectional contour of the first end of the heat transport module

[0167] 156 projection at the first end of the heat transport module

[0168] 158 Sink at the first end of the heat transport module

Claims

Patent claims 1. A device (100) for dissipating heat from an electrical circuit, comprising: a heat sink (110) having a heat sink base (114) and a plurality of cooling fins (112) extending from the heat sink base for dissipating heat; and at least one heat transport module (120), each of which is mechanically and thermally conductively connected to the heat sink (110) at a first end (122) of the heat transport module (120) by means of a press fit (130) and / or metallic bond at a joint of the heat sink (110), and each of which has a contact surface (144) at a second end (124) of the heat transport module (120) spaced from the first end (122), which contact surface is designed to contact at least one heat dissipation point (142) of the electrical circuit for absorbing the heat of the electrical circuit.

2. Device (100) according to claim 1, further comprising: a housing in which the electrical circuit is arranged, wherein the cooling fins (112) of the heat sink (110) are exposed outside the housing and / or the at least one heat transport module (120) is arranged partially or completely within the housing.

3. Device (100) according to claim 1 or 2, wherein the press fit has the metallic bond at least in sections; and / or wherein the metallic bond comprises an arc welded connection; and / or wherein the press fit has the metallic bond by means of inductive heating of the first end.

4. Device (100) according to one of claims 1 to 3, wherein the joint comprises one of the cooling fins (112) or two adjacent cooling fins (112), and / or wherein the press fit comprises a frictional connection and / or the metallic bond between the heat transport module (120) and at least one of the cooling fins (112), optionally between the two adjacent cooling fins (112), of the heat sink (110).

5. Device (100) according to one of claims 1 to 4, wherein the at least one heat transport module (120) has a first profile of the press fit (130) at the first end (122), and the heat sink (110) at the respective joint a second profile that is at least partially complementary to the first profile, optionally wherein the heat sink (110) has one or more further joining points with the second profile, and / or wherein the first profile and the second profile engage or flow into one another in the press fit, optionally engage or flow into one another without gaps.

6. Device (100) according to one of claims 1 to 5, wherein the second end (124) is opposite the first end (122) in at least one of the at least one heat transport module (120), and / or wherein at least one heat transport module (120) of the at least one heat transport module (120) extends from the second end (124) along a longitudinal direction (126) to the first end (122) and one or more further contact surfaces (144) for absorbing the heat is or are arranged between the first end (122) and the second end (124) laterally to the longitudinal direction (126), optionally parallel to the longitudinal direction (126), and / or wherein the at least one heat transport module (120) each has a plurality of contact surfaces (144) for absorbing the heat.

7. Device (100) according to one of claims 1 to 6, wherein the heat sink (110) is formed independently of the electrical circuit, and / or wherein the at least one heat transport module (120) is connected and / or shaped to the heat sink (110) depending on a topography of the at least one heat dissipation point (142) of the electrical circuit.

8. Device (100) according to one of claims 1 to 7, wherein the device (100) comprises a plurality of heat transport modules (120), each extending from the heat sink (110) with different lengths between the first end (122) and the second end (124), optionally parallel to each other, preferably wherein the different lengths are complementary to a topography of the at least one heat dissipation point (142) of the electrical circuit and / or the different lengths correspond to the distances from the heat sink base to the respective heat dissipation surface.

9. Device (100) according to one of claims 1 to 8, wherein the heat sink (110) comprises aluminum, copper and / or an alloy at least in sections, and / or wherein the at least one heat transport module (120) comprises copper, aluminum and / or an alloy at least in sections.

10. Device (100) according to one of claims 1 to 9, wherein between the electrical circuit and the heat sink base (114) of the heat sink (110) and / or next to the at least one heat transport module (120) a component (146) is arranged on a circuit carrier (140), optionally on a printed circuit board (140), which component is higher in the direction (126) of the heat sink (110) than the heat dissipation point (142) contacted via the heat transport module (120).

11. Device (100) according to one of claims 1 to 10, wherein the at least one heat transport module (120) comprises a heat pipe aligned parallel to the heat flow or a longitudinal direction (126) of the heat transport module (120) from the second end (124) to the first end (122) with fluid accommodated therein, optionally wherein a boiling point of a working medium hermetically enclosed in the heat pipe is adapted to the temperature at the first end (122) and a condensation point of the working medium is adapted to the temperature at the second end (124) of the heat transport module.

12. A system comprising: an electrical circuit, optionally a circuit carrier with the electrical circuit; and a device (100) for dissipating heat from the electrical circuit according to one of claims 1 to 11, wherein the contact surface (144) of the at least one heat transport module (120) contacts the at least one heat dissipation point (142) of the electrical circuit for absorbing the heat of the electrical circuit, optionally wherein the at least one heat transport module (120) is adapted to a topography of the at least one heat dissipation point (142) of the electrical circuit.

13. Ensemble of devices (100) for dissipating heat from an electrical circuit according to one of claims 1 to 11, wherein the devices (100) of the ensemble have the same heat sink (110) and differ in that the at least one heat transport module (120) is mechanically and thermally conductively connected to the heat sink (110) at different joining points of the heat sink (110) and / or that the at least one heat transport module (120) has different lengths between the first end (122) and the second end (124).

14. A kit of parts for a device (100) for dissipating heat from an electrical circuit, comprising: one or more identical heat sinks (110), each having a heat sink base (114) and a plurality of cooling fins (112) extending from the heat sink base for dissipating heat;and a plurality of heat transport modules (120), each of which can be mechanically and thermally conductively connected to the heat sink (110) at a first end (122) of the heat transport module (120) by means of a press fit (130) and / or metallic bond at a joint of the heat sink (110), and each of which has a contact surface (144) at a second end (124) of the heat transport module (120) spaced from the first end (122), which contact surface is designed to contact at least one heat dissipation point (142) of the electrical circuit for absorbing the heat of the electrical circuit, wherein the plurality of heat transport modules (120) has different lengths between the first end (122) and the second end (124); 15. A method (1100) for manufacturing a device (100) for dissipating heat from an electrical circuit, comprising: Providing (1102) a heat sink (110) having a heat sink base (114) and a plurality of cooling fins (112) extending from the heat sink base for dissipating heat; Press-joining (1104) and / or metal-to-metal joining of at least one heat transport module (120) to a first end (122) of the heat transport module (120) at a joining point of the heat sink (110) for mechanical and heat-conducting connection to the heat sink (110); and contacting (1106) the at least one heat transport module (120) to a contact surface (144) arranged at a second end (124) of the heat transport module (120) spaced from the first end (122) at at least one heat dissipation point (142) of the electrical circuit for absorbing the heat of the electrical circuit, optionally further comprising: Shortening, optionally milling, the at least one heat transport module (120) at the second end (124) depending on the electrical circuit.

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