Cooler through which fluid can flow for cooling power electronics

EP4581671A1Pending Publication Date: 2025-07-09ROBERT BOSCH GMBH
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Patent Information

Application Number
EP2023741008
Authority / Receiving Office
EP · EP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-08-31
Filing Date
2023-07-07
Publication Date
2025-07-09

AI Technical Summary

Technical Problem

Power electronics, particularly those with power semiconductors, generate high heat due to electrical currents and switching losses, requiring efficient cooling solutions with minimal thermal resistance to prevent failure, but existing coolers face challenges in balancing pressure resistance and heat transfer efficiency.

Method used

A fluid-flowable cooler design comprising a first and second metal part connected by a brazing layer, with a reinforcing part external to the cooling channel to enhance pressure resistance without increasing material thickness, allowing for thinner metal parts and improved flexibility in material selection, while maintaining high cooling performance and minimizing pressure loss.

Benefits of technology

The cooler effectively manages internal pressure and maintains high cooling performance by using a reinforcing part to support the metal structure externally, allowing for thinner components and efficient heat transfer, thus preventing overheating in power electronics.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to a cooler (1) through which fluid can flow for cooling power electronics (200), the cooler comprising a first metal part (11), a second metal part (12), a cooling structure (14) and a reinforcing part (13). The first metal part (11) and the second metal part (12) are connected to one another and define a cooling channel (10) between them, through which cooling channel a fluid can flow. The first metal part (11) has a receiving region (110) for receiving the power electronics (200) to be cooled. The cooling structure (14) is arranged in the cooling channel (10), and is connected to the first metal part (11) and the second metal part (12). The reinforcing part (13) is secured on the first metal part (11). The invention furthermore relates to a power electronics arrangement (1000) having a cooler (1) of this type and power electronics (200).
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Description

[0001] Description

[0002] Title Fluid-flow cooler for cooling power electronics

[0003] State of the art

[0004] The present invention relates to a fluid-flow cooler for cooling power electronics. Furthermore, the invention relates to a power electronics arrangement comprising power electronics and such a fluid-flow cooler. The power electronics can, in particular, comprise at least one power semiconductor.

[0005] Power semiconductors carry high electrical currents. Combined with switching losses, the resulting conduction losses cause high heat dissipation, which must be dissipated within a very small area. The maximum permissible semiconductor temperature is critical to failure, which is why minimizing the thermal resistance between the semiconductor and the coolant is of key importance. For efficient cooling, the power substrates are applied to fluid-permeable coolers. These coolers are made of aluminum, AlSiC, or copper alloys. Pins or fins are arranged inside the cooler to increase the heat-transfer surface and intensify heat transfer.To achieve low thermal resistance between a power substrate, in particular an AMB / DBC power substrate (AMB: active metal braze; DBG: direct copper bonding), and the cooler, the power substrate is joined to the cooler using a soft soldering process, or optionally a sintering process. For this purpose, these coolers are optionally surface-coated with materials suitable for a soft soldering process or a sintering process. Aluminum coolers, also known as AlSiC or copper coolers, which consist of several components joined in particular using a brazing process, are common in automotive engineering. Disclosure of the invention.

[0006] The fluid-flow cooler according to the invention for cooling power electronics has the advantage that the requirements for a pressure loss in a cooling channel of the cooler, a resistance of the cooler to an internal pressure in the cooling channel built up by a fluid flowing through the cooling channel, and a cooling performance of the cooler can be met. This is achieved by a fluid-flow cooler for cooling power electronics, which comprises a first metal part, a second metal part, a cooling structure, and a reinforcement part. The first metal part and the second metal part are connected to one another and define a cooling channel between them through which a fluid can flow. The first metal part has a receiving area for receiving the power electronics to be cooled. The cooling structure is arranged in the cooling channel and connected to the first metal part and the second metal part.The reinforcement part is fastened to the first metal part. The reinforcement part advantageously serves to reinforce the arrangement of the first metal part and the second metal part against the internal pressure prevailing during operation of the cooler. Because the reinforcement part is an outer part, there is no need for complex inserts or intermediate parts that would be connected to the first metal part and the second metal part and thus hold the first metal part and the second metal part together when pressure is applied, e.g. via tie rods. An outer part is understood in particular to be a part that is not arranged in the cooling channel. This makes it possible to avoid a higher pressure loss in the cooling channel, which would otherwise be caused by the aforementioned additional support geometry in the cooling channel.It should be noted here that the cooling structure, due to its connection to the first metal part and the second metal part, serves / acts as a support structure element, in particular as an inner support structure element. Furthermore, the present invention can ensure or increase the resistance of the cooler to internal pressure in the cooling channel without having to select a sufficiently high thickness (material thickness) for the individual metal parts. Since a thermal resistance of the first metal part and / or the second metal part depends directly on a corresponding thickness of the first metal part and / or the second metal part, the provision of the reinforcement part allows the first metal part and / or the second metal part to be formed with the smallest possible thickness. Thus, a high cooling performance of the cooler can be maintained.In addition, greater flexibility is ensured when selecting a suitable material for the first metal part and / or the second metal part with regard to strength. In particular, materials can be selected for the first metal part and / or the second metal part that have sufficient strength and are also suitable for a brazing process if the cooler is to be manufactured using a brazing process. The reinforcing part (reinforcing element) can also be referred to in the context of the present invention as an external support structure element for internal pressure support of the cooler. The reinforcing part can preferably be made of metal. In the context of the present invention, a metal part is advantageously to be understood as a part that is made of at least one metal or a metal alloy.It should also be noted that, due to its arrangement on the first metal part, the reinforcement part does not serve to define the cooling channel. It is possible for the cooler to comprise a plurality of reinforcement parts.

[0007] The subclaims show preferred developments of the invention.

[0008] Advantageously, the cooling channel is circumferentially enclosed exclusively by the first metal part and the second metal part. The cooling channel is advantageously formed by the first metal part and the second metal part as a circumferentially closed cooling channel. The first metal part and the second metal part are advantageously directly connected to one another. A direct connection means, in particular, that there is only one connecting material between the first metal part and the second metal part, by means of which the two metal parts are connected to one another. The connecting material is preferably a brazing layer.

[0009] The first metal part, the second metal part, and the reinforcement part advantageously form a housing. The cooling channel corresponds in particular to an interior space of the housing, which is defined by the first metal part and the second metal part. Preferably, an inlet and an outlet for the fluid used as a coolant are arranged directly on the housing.

[0010] Advantageously, the first metal part is arranged between the reinforcement part and the second metal part. Therefore, within the scope of the present invention, the first metal part can also be referred to as a metallic intermediate part. Advantageously, the first metal part and the second metal part are arranged one on top of the other. The reinforcement part is advantageously attached to an outer surface of the first metal part.

[0011] The cooler preferably comprises a longitudinal direction, a width direction (transverse direction), and a thickness direction (height direction). The longitudinal direction preferably corresponds to a longitudinal direction of the reinforcement member. The width direction preferably corresponds to a width direction of the reinforcement member. The thickness direction preferably corresponds to a thickness direction of the reinforcement member. The cooler further preferably comprises a first end and a second end in the longitudinal direction, as well as a first edge and a second edge in the width direction.

[0012] Preferably, the reinforcement part is arranged on the first metal part at least partially outside an overlap region between the first metal part and the cooling structure and / or between the second metal part and the cooling structure. This means, in particular, that at least a region of the reinforcement part is arranged outside the overlap region. The overlap region between the first metal part and the cooling structure and / or between the second metal part and the cooling structure is a region in which the first metal part and the cooling structure and / or the second metal part and the cooling structure overlap. In other words, the reinforcement part is preferably applied at least partially to a region of the first metal part in which the cooler is not supported by the cooling structure.The reinforcement part thus increases the resistance to the prevailing internal pressure in the weaker areas of the cooler, while the flow inside the cooling channel is not affected by the reinforcement part. Particularly in the area of ​​the applied power electronics, i.e., the mounting area, relatively thin material thicknesses can be used for the first metal part, since the cooling channel in this area is supported at the top and bottom by the inserted cooling structure. This enables minimal heat transfer resistance between the power electronics and the fluid used as a coolant.

[0013] According to an advantageous embodiment of the invention, the reinforcement part can be arranged on the first metal part exclusively outside the overlap region. This means, in particular, that the reinforcement part does not overlap or cover the cooling structure. In other words, the reinforcement part does not overlap the overlap region. In particular, the reinforcement part can be arranged at a distance from the capping region or the cooling structure.

[0014] According to an alternative advantageous embodiment of the invention, the reinforcement part can be arranged partially outside the overlap region. The reinforcement part overlaps the cooling structure or the overlap region. It should be understood that the overlap of the reinforcement part with the cooling structure or the overlap region is advantageously a partial overlap. This means, in particular, that at least one region of the reinforcement part is arranged outside the overlap region and at least one region of the reinforcement part overlaps the cooling structure or the overlap region. The reinforcement part can be arranged substantially outside the overlap region.

[0015] Preferably, at least one region of the reinforcement part on the first metal part can be arranged exclusively outside the overlap region and / or at least one region of the reinforcement part can overlap with the cooling structure. Thus, for example, a region of the reinforcement part that extends longitudinally from one end of the cooler to the receiving region can overlap with the cooling structure or cover the cooling structure, while a region of the reinforcement part that extends widthwise from one edge of the cooler to the receiving region can be arranged exclusively outside the overlap region, or vice versa.It is also conceivable that both the region of the reinforcing part which extends in the longitudinal direction from one end of the cooler to the receiving region and the region of the reinforcing part which extends in the width direction from one edge of the cooler to the receiving region overlap with the cooling structure or cover the cooling structure.

[0016] In an overlapping arrangement of the reinforcement part with the cooling structure, the degree of overlap between a region of the reinforcement part and the cooling structure in the direction of extension of the region is preferably a maximum of ten times, particularly preferably a maximum of five times, the thickness of the first metal part. The cooler, in particular the housing of the cooler, preferably comprises a recess. The receiving region of the first metal part is preferably arranged at the location of the recess. The recess preferably defines the receiving region.

[0017] The recess can preferably be formed in the reinforcement part. In other words, the reinforcement part can preferably have the recess. The recess can preferably be defined by an inner wall of the reinforcement part. The recess preferably surrounds the receiving area at least partially, in particular completely, in the circumferential direction. According to a particularly advantageous embodiment of the invention, the recess is closed circumferentially / in the circumferential direction.

[0018] Alternatively, the recess may preferably be formed between two reinforcing parts.

[0019] A thickness of the reinforcing part is preferably greater than or equal to a thickness of the first metal part, in particular of the receiving region of the first metal part.

[0020] Furthermore, a sum of a thickness of the reinforcing part and a thickness of the first metal part, in particular of the receiving region of the first metal part, is preferably greater than or equal to a thickness of the second metal part.

[0021] According to an advantageous embodiment of the invention, the reinforcement part extends longitudinally from one end of the cooler (only) to the receiving area. Preferably, the cooler can comprise two reinforcement parts, wherein one reinforcement part extends longitudinally from a first end of the cooler (only) to the receiving area, and the other reinforcement part extends longitudinally from a second end of the cooler (only) to the receiving area.

[0022] According to an alternative embodiment of the invention, the reinforcement part is continuous in the longitudinal direction. Within the scope of the invention, a continuous reinforcement part means, in particular, that the reinforcement part is at least partially continuous. In other words, at least one region of the reinforcement part is continuous. This means, in particular, that the at least one region of the reinforcement part extends in the longitudinal direction from a first end of the radiator to a second end of the radiator. In this embodiment of the radiator, the reinforcement part can preferably have a first end region, at least one edge region, and a second end region.Preferably, the first end region can extend in the longitudinal direction from a first end of the cooler (only) to the receiving region and the second end region can extend in the longitudinal direction from a second end of the cooler (only) to the receiving region, wherein the at least one edge region extends in the width direction from an edge of the cooler (only) to the receiving region. The at least one edge region is preferably arranged between the first end region and the second end region. Preferably, the at least one edge region connects the first end region and the second end region to one another. A part of the first end region, the at least one edge region and a part of the second end region can correspond to the aforementioned region of the reinforcing part, which extends in the longitudinal direction from the first end of the cooler to the second end of the cooler and is thus continuous. Particularly preferably, the reinforcing part comprises two edge regions.

[0023] Preferably, the reinforcement part can be provided at the inlet and / or outlet of the cooler.

[0024] Preferably, the reinforcement part is arranged on the first metal part at at least one connection point, in particular at a plurality of connection points, particularly preferably at each connection point, between the first metal part and the second metal part. Thus, the cooler is reinforced at the at least one connection point between the first metal part and the second metal part by means of the reinforcement part.

[0025] The cooler is preferably configured such that it can withstand a relative internal pressure of greater than or equal to 2 bar in the cooling channel. Furthermore, the cooler can preferably be configured such that it can withstand a maximum relative internal pressure of 2.5 bar. This means, in particular, that the cooler is constructed such that it can withstand the internal pressure over its lifetime without, or at least without significant, deformation. The relative internal pressure refers to a pressure relative to the ambient pressure or atmospheric pressure. The reinforcement part is preferably plate-shaped / as a plate, in particular as an oval-shaped plate.

[0026] Preferably, the first metal part is plate-shaped, wherein the second metal part has a plate-shaped region and a region which is trapezoidal in section.

[0027] In particular, the second metal part can be formed as a deep-drawn part. However, it is also possible for the first metal part to have a plate-shaped region and a trapezoidal section, and for the second metal part to be plate-shaped.

[0028] The first metal part and / or the second metal part is / are preferably formed as sheet(s).

[0029] The cooling structure may preferably comprise a cooling fin structure and / or a pin structure (cooling pin structure). It is also conceivable that the cooling structure alternatively or additionally also comprises a cooling structure element or a plurality of

[0030] Cooling structure elements that have / have a different shape than a cooling fin or a pin. It is particularly possible for the cooling structure to have a plurality of cooling structure elements of different shapes. For example, it is possible for the cooling structure to have a cooling fin and a pin, or a plurality of cooling fins and a plurality of pins. Within the scope of the present invention, a cooling fin and a pin can each be referred to in particular as a cooling structure element.

[0031] In the context of the present invention, the cooling structure is preferably understood as a surface-enlarging, flow-guiding and heat transfer-increasing structure.

[0032] The cooling fin structure can preferably comprise (only) one cooling fin or a plurality of cooling fins, which are preferably arranged one behind the other in a flow direction. The flow direction corresponds in particular to a main flow direction of the fluid used as coolant, which flows through through-openings formed by the cooling fin(s). The main flow direction is in particular the direction in which the fluid mainly flows, that is, the direction in which a velocity component of the fluid is greater than a velocity component of the fluid in a direction perpendicular to the main flow direction. The main flow direction can preferably correspond to a direction of introduction of the fluid into the cooler through which fluid can flow. The main flow direction is preferably parallel to the longitudinal direction of the cooler.

[0033] The cooling fin structure can also be referred to as a turbulator. Preferably, a cooling fin is formed from a wave profile that repeats periodically in a repeating direction. The pin structure can preferably comprise (only) one or a plurality of pins, which are preferably arranged in the flow direction and / or in a direction perpendicular to the flow direction.

[0034] The cooling structure can preferably be formed at least partially, in particular completely, from a material and / or coated with a material having a thermal conductivity coefficient greater than 200 W / (m K). Advantageously, the cooling structure can be formed at least partially, in particular completely, from aluminum or coated with aluminum. In particular, these embodiments relate to the cooling structure element(s) of the cooling structure.

[0035] The entire cooler, that is to say the first metal part, the second metal part, the reinforcement part and the cooling structure, can preferably be made of and / or coated with the same material, preferably aluminum or e.g. copper or stainless steel.

[0036] In the context of the present invention, the fluid which can flow through the cooler can also be referred to as cooling fluid.

[0037] Furthermore, the present invention relates to a power electronics assembly comprising a previously described fluid-flow cooler and power electronics. The power electronics are arranged, in particular fixed, on the receiving area of ​​the first metal part.

[0038] Preferably, the power electronics may comprise one power electronics module or several power electronics modules.

[0039] Within the scope of the invention, a power electronics component can also be referred to as a power module. A power electronics component preferably comprises a carrier plate and / or conductor tracks and / or one or more power semiconductors.

[0040] The power electronics component(s) is / are preferably joined to the fluid-flowable cooler or the receiving area of ​​the first metal part by means of a layer produced by a soft soldering process or a sintering process, which can thus be referred to as a soft solder layer or sintered layer.

[0041] Advantageously, the power electronics are arranged only on the receiving area of ​​the first metal part. This means, in particular, that the power electronics are not arranged on the amplification part.

[0042] The power electronics are preferably advantageously arranged in the previously described recess of the housing.

[0043] As already described above, according to an advantageous embodiment of the invention, the recess can be formed in the reinforcement part. This means that the recess is formed in the reinforcement part. The power electronics preferably protrude beyond an outer surface of the reinforcement part in the thickness direction. The power electronics can preferably be arranged at a distance from the inner wall of the reinforcement part. Alternatively, the power electronics can preferably contact the inner wall of the reinforcement part. Thus, the power electronics can be pre-centered for connecting it to the first metal part. Furthermore, part of the heat generated by the power electronics can be dissipated via the contact of the power electronics with the inner wall of the reinforcement part.

[0044] Short description of the drawings

[0045] In the following, exemplary embodiments of the invention are described in detail with reference to the accompanying drawings, wherein identical or functionally identical components are provided with the same reference numerals. In the drawing:

[0046] Figure 1 is a schematic simplified perspective sectional view of a power electronics arrangement according to the invention with a power electronics unit and a fluid-flow-through cooler according to a first embodiment of the invention,

[0047] Figure 2 is a schematic simplified perspective sectional view of the power electronics arrangement according to the invention from Figure 1,

[0048] Figure 3 is a schematic simplified sectional view of the power electronics arrangement according to the invention from Figure 1, and

[0049] Figure 4 is a schematic simplified perspective view of a power electronics arrangement according to the invention with power electronics and a fluid-flow-through cooler according to a second embodiment of the invention.

[0050] Embodiments of the invention

[0051] A power electronics arrangement 1000 according to the invention, comprising power electronics 200 and a fluid-flow cooler 1 for cooling power electronics 200 according to a first exemplary embodiment of the invention, is described below with reference to Figures 1 to 3. Figure 1 shows the power electronics arrangement 1000 in perspective. Figure 2 shows a perspective section of the power electronics arrangement 1000 along line B-B (in the width direction 502) in Figure 1, with a part of the cooler 1 additionally shown on an enlarged scale in Figure 2. Figure 3 shows a section of the power electronics arrangement 1000 along line AA (in the longitudinal direction 501) in Figure 1.

[0052] As can be seen from Figures 1 to 3, the fluid-flow cooler 1 comprises a first metal part 11, a second metal part 12, a cooling structure 14 and a reinforcement part 13.

[0053] The first metal part 11 and the second metal part 12 are directly connected to one another and define a cooling channel 10 between them, through which a fluid used as a coolant can flow and in which the cooling structure 14 is arranged. As can be seen in particular from Figure 3, the cooling channel 10 is enclosed in the circumferential direction exclusively by the first metal part 11 and the second metal part 12. The cooling channel 10 is formed by the first metal part 11 and the second metal part 12 as a cooling channel closed in the circumferential direction. To connect the first metal part 11 to the second metal part 12, brazing alloy can advantageously be used, so that in the assembled state of the cooler 1, a brazing alloy layer is arranged between the two metal parts 11, 12. Both the first metal part 11 and the second metal part 11 can preferably

[0054] Aluminum parts. Other materials are conceivable for the first metal part 11 and / or the second metal part 12.

[0055] In particular, both metal parts 101, 102 are formed as sheets. Regarding the shape of the metal parts 11, 12, the first metal part 11 is plate-shaped, in particular as an oval-shaped plate, while the second metal part 12 has a plate-shaped region and a region with a trapezoidal cross-section (Figures 2 and 3). The second metal part 12 can advantageously be produced by a deep-drawing process. However, it is also possible for the first metal part 11 and the second metal part 12 to have other shapes.

[0056] The metal parts 11, 12 and the reinforcement part 13 advantageously form a housing 15, on which an inlet 151 and an outlet 152 for the fluid used as coolant are arranged. The inlet 151 and the outlet 152, each of which is designed in particular as a nozzle and can thus also be referred to as a coolant nozzle, are arranged on the second metal part 12 in this exemplary embodiment.

[0057] The first metal part has a receiving area 110 for accommodating the power electronics 200 to be cooled. In this exemplary embodiment, the power electronics 200 comprises three power electronics assemblies 210, which can also be referred to as power modules and are arranged one behind the other in the longitudinal direction 501. Each of the power electronics assemblies 210 can preferably have a carrier plate, conductor tracks, and power semiconductors.

[0058] The power electronics components 210 are preferably each joined to the fluid-flow cooler 100, in particular to the receiving area 110 of the first metal part 11, by means of a layer produced by a soft soldering process or a sintering process, which is thus referred to accordingly as a soft solder layer or sintered layer. As already described above, the cooling structure 14 is arranged in the cooling channel 10 and serves as a surface-enlarging structure that guides the flow of the fluid used as coolant and increases heat transfer. In particular, the cooling structure 14 according to Figure 3 comprises or is a cooling fin structure. For this purpose, the cooling fin structure can have at least one cooling fin 140 that extends in the direction of the length of the cooling channel 10 or a flow direction 504 of the fluid.As can also be seen from Figure 3, the cooling fin 140 is preferably formed from a wave profile that repeats periodically in a repeating direction. Through-openings 141 are formed through the cooling fin 140, through which the fluid can flow.

[0059] The cooling structure 14 is preferably formed from and / or coated with a material having a thermal conductivity coefficient greater than 200 W / (m K). Advantageously, the cooling fin 10 can be made of aluminum or coated with aluminum. It is also possible to use other thermally conductive materials for the cooling structure 14 and / or its layer.

[0060] The cooling structure 14 is connected to the first metal part 11 and the second metal part 12. As with the connection between the first metal part 11 and the second metal part 12, brazing alloy can be used to connect the cooling structure 14 to the first metal part 11 and the second metal part 12. By connecting the cooling structure 14 to the first metal part 11 and the second metal part 12, the cooler 1 is supported in the region of the cooling channel 10 against the internal pressure prevailing therein.

[0061] In order to increase the resistance of the cooler 1 even in areas where the cooling structure 10 cannot serve as a supporting structure element, and thus to reinforce the structure of the cooler 10 in these areas, the aforementioned reinforcing part 13 is fastened, in particular soldered, to the first metal part 11.

[0062] The connection of the first metal part 11 to the second metal part 12 and / or the connection of the cooling structure 14 to the metal parts 11, 12 and / or the connection of the reinforcement part 13 to the first metal part 11 can advantageously be carried out in the same manufacturing step, in particular by means of a brazing alloy. The reinforcement part 13 is arranged on the first metal part 11 partially outside an overlap region 16 between the first metal part 11 and the cooling structure 14 and / or the second metal part 12 and the cooling structure 14. In particular, the reinforcement part 13 is arranged on the first metal part 11 mainly outside the overlap region 16. The arrangement or structure of the reinforcement part 13 is explained in more detail below.

[0063] Looking at Figures 1 to 3, it can be seen that the reinforcing part 13 in this exemplary embodiment comprises a recess 130 that is closed in the circumferential direction. However, it is also possible for the recess 130 to be open in the circumferential direction. The recess 130, which can also be regarded as a recess in the housing 15, is defined in particular by an inner wall 135 of the reinforcing part 13 and is provided at the location of the receiving area 110. In particular, the recess 130 completely surrounds the receiving area 110 in the circumferential direction. In the finished power electronics arrangement 1000, the power electronics modules 210 are arranged in the recess 130. In particular, the power electronics modules 210 can protrude beyond an outer surface 136 of the reinforcing part 13 in the thickness direction 503.Figures 1 to 3 further show that the power electronics modules 210 are positioned on the receiving area 110 at a distance from the inner wall 135. However, contacting the power electronics modules 210 with the inner wall 135 is also conceivable.

[0064] The reinforcement part 13 has a first end region 131, a second end region 132, a first edge region 133, and a second edge region 134. The first edge region 133 is arranged between the first end region 131 and the second end region 133 and connects them to one another. Accordingly, the second edge region 134 is arranged between the first end region 131 and the second end region 133 and connects them to one another. Therefore, in this exemplary embodiment, the first edge region 133 can also be referred to as the first central region, and the second edge region 134 can also be referred to as the second central region.

[0065] As can be seen from Figure 2 and in particular from the enlarged part of the cooler 1 shown therein, the first end region 131 advantageously extends in the longitudinal direction 501 from a first end 17 of the cooler 1 (only) to the receiving region 110 of the first metal part 11 and overlaps with the cooling structure 14. This means that the first end region 131 is partially arranged outside the overlap region 16. In particular, the first end region 131 is mainly arranged outside the overlap region 16. The second end region 132 advantageously extends in the longitudinal direction 501 from a second end 18 of the cooler 1 (only) to the receiving region 110 of the first metal part 11 and overlaps with the cooling structure 14. This means that the second end region 132 is partially arranged outside the overlap region 16. In particular, the second end region 132 is arranged mainly outside the overlap region 16.

[0066] In this embodiment of the cooler 1, the reinforcement part 13, the first metal part 11, and the cooling structure 14 overlap. In particular, the first end region 131, the first metal part 11, and the cooling structure 14 overlap, as do the second end region 132, the first metal part 11, and the cooling structure 14. As can be seen from Figure 2, a dimension 604 of the overlap between the first end region 131 of the reinforcement part 13 and the cooling structure 14 in the longitudinal direction 501 is a maximum of ten times, particularly preferably a maximum of five times, a thickness 601 of the first metal part 11. The same preferably applies to a dimension of the overlap between the second end region 132 and the cooling structure 14 in the longitudinal direction 501.

[0067] Figure 3 further shows that the first edge region 133 extends in the width direction 502 from a first edge 19 of the cooler 1 (only) to the receiving region 110 and is arranged exclusively outside the overlap region 16. This means that the first edge region 133 does not overlap with the cooling structure 14. Correspondingly, the second edge region 134 extends in the width direction 502 from a second edge 20 of the cooler 1 (only) to the receiving region 110 and is arranged exclusively outside the overlap region 16. This means that the second edge region 134 does not overlap with the cooling structure 14. However, it is also possible for the first edge region 133 and / or the second edge region 134 to overlap with the cooling structure 14.

[0068] A first part of the first end region 131, the first edge region 133, and a first part of the second end region 132 form a first region of the reinforcing part 13, which is continuous in the longitudinal direction 501. In other words, a first part of the first end region 131, the first edge region 133, and a first part of the second end region 132 form a first region of the reinforcing part 13, which extends from the first end 17 to the second end 18 of the cooler 1. Correspondingly, a second part of the first end region 131, the second edge region 134, and a second part of the second end region 132 form a second region of the reinforcing part 13, which is continuous in the longitudinal direction 501.In other words, a second part of the first end region 131, the second edge region 134, and a second part of the second end region 132 form a second region of the reinforcing part 13, which extends from the first end 17 to the second end 18 of the cooler 1. Overall, the reinforcing part 13 can be described as continuous.

[0069] As can also be seen in particular from Figure 3, a thickness 603 of the reinforcement part 13 is greater than the thickness 601 of the first metal part 11. Furthermore, a thickness 602 of the second metal part 12 is also greater than the thickness 601 of the first metal part 11. Furthermore, a sum of the thickness 603 of the reinforcement part 13 and the thickness 601 of the first metal part 11 is preferably equal to the thickness 602 of the second metal part 12. However, it is also possible for the sum of the thickness 603 of the reinforcement part 13 and the thickness 601 of the first metal part 11 to be greater than the thickness 602 of the second metal part 12. Advantageously, the first metal part 11 has the same thickness 601 everywhere. This means that the receiving area 110 also has the thickness 601. Accordingly, the thickness 602 of the second metal part 12 and the thickness 603 of the reinforcing part 13 are each constant.The fact that the thickness 601 of the first metal part 11, in particular its receiving region 110, is selected relative to the thickness 602 of the second metal part 12 and the thickness 603 of the reinforcing part 13 in such a way enables a minimal heat transfer resistance between the power electronics 200 and the fluid used as coolant, without impairing the resistance of the cooler 1 to an internal pressure in the cooling channel 10.

[0070] By arranging the power electronics 200 on the fluid-flow cooler 1 and the cooling structure 14 in the cooling channel 111, heat generated during operation of the power electronics 200 can be efficiently transferred from the power electronics 200 first to the first metal part 11 and from there to the fluid flowing through the cooling structure 14, and then dissipated. In particular, the cooling structure 14 causes a turbulent flow of the fluid, which can achieve increased cooling efficiency of the cooler 1.

[0071] The cooler structure according to the present invention is reinforced by the reinforcement member 13 against the internal pressure in the cooling channel 10. In particular, the reinforcement member 13 is arranged on the first metal part 11 at connection points between the first metal part 11 and the second metal part 12. Such connection points 21 can be seen in Figures 2 and 3. Despite the reinforcement of the cooler 1, the reinforcement member 13 does not increase the pressure loss already caused by the cooling structure 14, thus not affecting the cooling performance of the cooler 1.

[0072] Figure 4 shows a perspective view of a power electronics arrangement 1000 with a power electronics 200 and a fluid-flow cooler 1 for cooling the power electronics 200 according to a second embodiment of the invention.

[0073] The power electronics arrangement 1000 according to the second embodiment differs from that according to the first embodiment in the structure of the fluid-flow cooler 1.

[0074] As can be seen from Figure 4, the fluid-flow-through cooler 1 according to the second exemplary embodiment comprises two reinforcement parts 13, wherein one reinforcement part 13 is preferably provided at the inlet 151 and the other reinforcement part 13 is preferably provided at the outlet 152. In particular, one reinforcement part 13, in this case the reinforcement part 13 arranged at the inlet 151, extends in the longitudinal direction 501 from the first end 17 of the cooler 1 (only) to the receiving area 110, wherein the other reinforcement part 13, in this case the reinforcement part 13 arranged at the outlet 152, extends in the longitudinal direction 101 from the second end 18 of the cooler 1 (only) to the receiving area 110. The two reinforcement parts 13 are preferably of identical design. The recess 130 of the housing 15 is arranged between the two reinforcement parts 13.

[0075] Accordingly, the receiving area 110 is positioned between the two reinforcing parts 13.

[0076] Each of the reinforcement parts 13 overlaps with the cooling structure 14 or the overlap region 16 between the first metal part 11 and the cooling structure 14 and / or between the second metal part 12 and the cooling structure 14. This means that, similar to the reinforcement part 13 of the cooler 1 according to the first embodiment, each of the reinforcement parts 13 of the cooler 1 according to the second embodiment is partially arranged outside the overlap region 16. In particular, each of the reinforcement parts 13 is mainly arranged outside the overlap region 16. The reinforcement part 13 arranged at the inlet 151 corresponds to the first end region 131 of the reinforcement part 13 of the cooler 1 according to the first embodiment, and the reinforcement part 13 arranged at the outlet 152 corresponds to the second end region 132 of the reinforcement part 13 of the cooler 1 according to the first embodiment.

[0077] However, it is also possible for at least one of the reinforcement parts 13, in particular both reinforcement parts 13, to be arranged exclusively outside the overlap region 16. In other words, it is possible for at least one of the reinforcement parts 13, in particular both reinforcement parts 13, to extend (only) from the corresponding end 17, 18 of the cooler 1 to the overlap region 16.

Claims

Claims 1 . Fluid-flow cooler (1) for cooling power electronics (200), comprising: . a first metal part (11) and a second metal part (12) which are connected to one another and define a cooling channel (10) between them through which a fluid can flow, wherein the first metal part (11) has a receiving area (110) for receiving the power electronics (200) to be cooled, . a cooling structure (14) arranged in the cooling channel (10) and connected to the first metal part (11) and the second metal part (12), and . a reinforcing part (13) which is attached to the first metal part (11).

2. Fluid-flow cooler (1) according to claim 1, wherein the cooling channel (10) is enclosed in the circumferential direction exclusively by the first metal part (11) and the second metal part (12).

3. Fluid-flow cooler (1) according to one of the preceding claims, wherein the first metal part (11) is arranged between the reinforcing part (13) and the second metal part (12).

4. Fluid-flow cooler (1) according to one of the preceding claims, wherein the reinforcing part (13) is arranged on the first metal part (11) at least partially outside an overlap region (16) between the first metal part (11) and the cooling structure (14) and / or between the second metal part (12) and the cooling structure (14).

5. Fluid-flow cooler (1) according to claim 4, wherein the reinforcing part (13) is arranged on the first metal part (11) exclusively outside the overlap region (16), or wherein the reinforcement part (13) is arranged partially outside the overlap region (16) and overlaps with the cooling structure (14). The fluid-flow cooler (1) according to one of the preceding claims, wherein the reinforcement part (13) comprises a recess (130), wherein the receiving region of the first metal part (11) is arranged at the location of the recess (130) and / or wherein the recess (130) at least partially, in particular completely, surrounds the receiving region (110) in the circumferential direction. A fluid-flow cooler (1) according to one of the preceding claims, wherein a thickness (603) of the reinforcing part (13) is greater than or equal to a thickness (601) of the first metal part (11), in particular of the receiving region (110), and / or wherein a sum of a thickness (603) of the reinforcing part (13) and a thickness (601) of the first metal part (11), in particular of the receiving region (110), is greater than or equal to a thickness (602) of the second metal part (12).A fluid-flow cooler (1) according to one of the preceding claims, wherein the reinforcement part (13) extends in the longitudinal direction (501) from one end (17, 18) of the cooler (1) only as far as the receiving area (110) or wherein the reinforcement part (13) is continuous in the longitudinal direction (501). A fluid-flow cooler (1) according to one of the preceding claims, wherein the reinforcement part (13) is arranged on the first metal part (11) at at least one connection point between the first metal part (11) and the second metal part (12). A fluid-flow cooler (1) according to one of the preceding claims, wherein the reinforcement part (13) is plate-shaped. A power electronics arrangement (1000) comprising power electronics (200) and a fluid-flow cooler (1) according to one of the preceding claims, wherein the power electronics (200) is arranged on the receiving area (110) of the first metal part (11). Power electronics arrangement (1000) according to claim 11, wherein the power electronics (200) is arranged only on the receiving area (110) of the first metal part (11).