Cooling component for dissipating heat
Patent Information
- Application Number
- EP2024728219
- Authority / Receiving Office
- EP · EP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-05-24
- Filing Date
- 2024-05-23
- Publication Date
- 2025-12-24
AI Technical Summary
Cooling components used for high-performance chips and power electronic components face inefficiencies due to uneven heating of the cooling medium as it flows through parallel channels, leading to reduced cooling performance towards the end of the component, where heat input varies across different chips in a matrix arrangement.
Incorporating deflection elements that redirect the cooling medium laterally between parallel flow channels, allowing for temperature equalization by mixing heated and cooler medium streams, and utilizing secondary flow channels to reduce flow resistance and prevent particle clogging, thereby enhancing cooling performance across the component.
The solution effectively counters the issue of uneven heating by redistributing the cooling medium's temperature and reducing flow resistance, resulting in consistent and improved cooling performance throughout the component, even in areas with varying heat input.
Smart Images
Figure EP2024064162_28112024_PF_FP_ABST
Abstract
Description
[0001] May 23, 2024 700 PA 23039 WO Cooling component for dissipating heat The invention relates to a cooling component for dissipating heat from objects to be cooled, with an inlet via which cooling medium can be supplied to the cooling component, with parallel-connected flow channels through which cooling medium supplied via the inlet can flow, and with an outlet via which the cooling medium can be discharged from the cooling component, in particular after absorbing heat from an object to be cooled. Such cooling components through which cooling medium flows or can be flowed through are used, for example, for power electronics components, such as power electronics semiconductor modules or high-performance chips. They must be particularly efficient and powerful and generally have a metallic heat sink, i.e. a heat sink made of metal or a metal alloy (optionally coated) with a preferably flat orA flat heat absorption side formed by a cooling surface, which, when the cooling component is in use, is arranged as close as possible - if necessary by directly contacting it or by means of an intermediate layer of thermally conductive material, in particular thermal paste - to a (for example also flat) heat dissipation side of the object to be cooled in order to optimize heat transfer. The heat sink then absorbs the waste heat from the object to be cooled, which in turn is subsequently dissipated by the cooling medium. The cooling medium flows inside the cooling component through the flow channels of the cooling component. When cooling several high-performance chips arranged in a matrix, these are often arranged on the cooling surface of the cooling component in such a way that the cooling medium is directed parallel in the flow direction along several rows of successively arranged chips.The cooling medium heats up, so that the cooling performance decreases in the flow direction without countermeasures. In addition, the cooling medium often heats up to different degrees due to the different heat input of the matrix-like arrangement of the chips transverse to the flow direction. For example, the cooling performance is less pronounced further out in the cooling component than further in, so that, without countermeasures, the further cooling performance further inside the cooling component is significantly weaker than further out. May 23, 2024 700 PA 23039 WO The object of the present invention is to further develop a cooling component of the type mentioned above, in particular in such a way that such effects can be counteracted as needed by appropriate design of the cooling component. This object is achieved by a cooling component having the features of claim 1.A cooling component according to the invention is accordingly characterized in that the cooling component has at least one deflection element arranged downstream of the parallel flow channels, to which cooling medium is guided, which flows in a main flow direction through at least one of these parallel flow channels, and from which the cooling medium is deflected laterally so that it continues to flow downstream of the deflection element laterally offset from the aforementioned main flow direction.By using one or more of such deflection elements, it is therefore advantageously possible, for example, to specifically deflect cooling medium located in one of the parallel flow channels and less heated by one or more objects to be cooled into an area of the cooling component in which a particularly strong heat input from other objects to be cooled is to be expected later on, or in which, independently of this, particularly strong cooling is to be achieved. If, for example, the cooling component has several cooling zones connected in series, each with parallel flow channels that are aligned with one another across the cooling zones, without such a deflection element the cooling medium flowing further out in the first cooling zone and possibly less heated would also flow further out in the second cooling zone and possiblyagain be heated to a lesser extent than the cooling medium flowing further inward. Furthermore, it can be provided that cooling medium flowing through at least one further one of the parallel flow channels is guided in the cooling component in such a way that it is mixed with the cooling medium deflected laterally by the deflection element. In other words, more or less strongly heated cooling medium flowing through the flow channel that guides the cooling medium to the deflection element could then be mixed with correspondingly less strongly or more strongly heated cooling medium from another flow channel in order to specifically change the temperature of the cooling medium. It can be provided that the cooling medium flowing through the further parallel flow channel is also guided to the or another deflection element and is then deflected laterally by the latter in such a way that mixing can take place.For example, the deflection element can deflect the cooling medium through the two flow channels in such a way that it flows toward each other. Furthermore, it can be provided that the flow channel through which the cooling medium flows, which is guided to the deflection element, and / or the further flow channel is a heat sink flow channel of a heat sink structure forming part of a preferably metallic heat sink of the cooling component, with a plurality of heat sink flow channels, in particular a heat sink structure whose heat sink flow channels are delimited by adjacent, in particular equally spaced, fins or pins.Furthermore, it can be provided that the flow channel through which the cooling medium flows, which is guided to the deflection element, and / or the further flow channel is a secondary flow channel which is connected in parallel to a heat sink structure having a plurality of heat sink flow channels, which heat sink structure forms part of a heat sink of the cooling component. In particular, a heat sink structure whose heat sink flow channels are delimited by adjacent fins or pins, which are in particular spaced at equal intervals. This can be a secondary flow channel which serves to reduce the flow resistance of the heat sink structure compared to such a heat sink structure without such a secondary flow channel and / or to pass through particles which may be contained in the cooling medium and which do not fit through these heat sink flow channels.It can further be provided that the deflection element of the cooling medium has a deflection wall which preferably runs obliquely to the aforementioned main flow direction of the cooling medium, onto which the cooling medium impinges and through which the cooling medium is deflected laterally. May 23, 2024 700 PA 23039 WO It can further be provided that the parallel-connected secondary flow channel runs in a plane which is arranged parallel and at a distance from the plane in which the heat sink flow channels of the heat sink structure run. It can further be provided that the deflection element is designed and arranged such that cooling medium flowing through the secondary flow channel is guided to the deflection element and is deflected laterally by the latter, preferably laterally further inwards. This is achieved in particular by a first deflection wall of the secondary flow channel which runs obliquely to the main flow direction in the secondary flow channel.In addition, the deflection element can be designed and arranged such that cooling medium flowing through the heat sink flow channel is guided to the deflection element and deflected laterally by it, preferably further outwards. This is achieved in particular by a second deflection wall of the same running obliquely to the main flow direction in the heat sink flow channel. Furthermore, it can be provided that the deflection element has a partition wall with two opposite sides which separates the cooling medium flowing out of the secondary flow channel from the cooling medium flowing out of the heat sink flow channel, in that the partition wall is designed and positioned such that the cooling medium exiting the secondary flow channel is guided along one side of the partition wall and the cooling medium flowing out of the heat sink flow channel is guided along the opposite, other side of the partition wall.Furthermore, it can be provided that the deflection element is a component separate from the heat sink and its heat sink structure. Furthermore, it can be provided that the cooling component has several cooling zones connected in series and / or in parallel, so that the cooling medium supplied via the inlet flows through them one after the other or in parallel, and each of which has a heat sink structure with a plurality of heat sink flow channels, in particular a heat sink 23.May 2024 700 PA 23039 WO structure, the heat sink flow channels of which are delimited by adjacent, in particular equally spaced, fins or pins, and which each have a secondary flow channel connected parallel to the heat sink flow channels, in particular for reducing the flow resistance of the respective cooling zone compared to such a cooling zone without such a secondary flow channel and / or for passing through particles possibly contained in the cooling medium that do not fit through these heat sink flow channels. It can further be provided that the deflection element is arranged between two successive, series-connected cooling zones.The deflection element can also be arranged between two successive, series-connected groups of several cooling zones connected in parallel, wherein the deflection element deflects cooling medium, which is supplied to the deflection element from a structural flow channel of a cooling zone arranged further inward of the upstream group of cooling zones connected in parallel, laterally to a structural flow channel of a cooling zone arranged further outward of the downstream group of cooling zones connected in parallel. Alternatively or additionally, it can be provided that the deflection element deflects cooling medium, which is supplied to the deflection element from a secondary flow channel of a cooling zone arranged further outward of the upstream group of cooling zones connected in parallel, laterally to a secondary flow channel of a cooling zone arranged further inward of the downstream group of cooling zones connected in parallel.In this context, it can also be provided that the deflection element deflects cooling medium, which is supplied to the deflection element from a structural flow channel of the upstream cooling zone of the series-connected cooling zones, laterally to the secondary flow channel of the downstream cooling zone, and / or that the deflection element deflects cooling medium, which is supplied to the deflection element from a secondary flow channel of the upstream cooling zone of the series-connected cooling zones, laterally to a structural flow channel of the downstream cooling zone. May 23, 2024 700 PA 23039 WO As far as the metallic heat sink is concerned, this can be a component made of (possibly coated) metal or a (possiblycoated) metal alloy or be formed by such a material, which on one side has the heat sink structure as a single piece, which faces away from a particularly flat cooling surface of the cooling component, against which an object to be cooled can be brought into contact in order to absorb heat from it. As far as the cooling surface of the cooling component is concerned, this can be formed by an (outer) side of the heat sink or by an (outer) side of a further, preferably metallic, particularly plate-shaped cooling component body that is thermally conductively connected to the heat sink. Further features of the present invention emerge from the appended patent claims, the following description of preferred embodiments and the attached drawings. Therein shows: Fig. 1: a cooling component according to the invention in an oblique view from above, Fig. 2: the cooling component according to the invention from Fig. 1 in a first exploded view, Fig.1 in a first longitudinal section, Fig. 6: the cooling component according to the invention from Fig. 1 in a view from above with an (upper) housing part omitted, Fig. 7: a detail of the cooling component according to the invention from Fig. 1 in an enlarged view, namely a deflection element of the cooling component that can be seen in Figs. 2 and 3 in an oblique view from above, Fig. 8: the cooling component from Fig. 7 in an oblique view from below. The cooling component 10 shown in the figures, on the underside 13 of which objects to be cooled (not shown) can be arranged in order to dissipate heat from these to the cooling component 10, is in the present case part of a higher-level cooling device which is otherwise not shown in detail.The cooling device and its cooling component 10 can, for example, be used to cool multiple power electronics units, such as power electronics semiconductor modules or high-performance chips. Such power electronics components are used, among other things, in connection with batteries or accumulators in electric vehicles. It goes without saying, however, that the type of components to be cooled is not important. The higher-level cooling device can, among other things, have or be filled with a cooling medium that is pumped through the cooling component 10 by means of a pump, so that it flows through the cooling component 10 and, on its way through the cooling component 10, absorbs and dissipates heat from the object to be cooled. For this purpose, the pump can be connected to an inlet 11 and an outlet 12 of the cooling component 10 by means of medium lines, for example hoses. The cooling medium will generally be a cooling liquid.However, it is also within the scope of the invention to use a gaseous medium as the cooling medium. The cooling component 10 comprises a heat sink 14 made of metal or a metal alloy. In the present case, the heat sink 14 is connected - for example in a materially bonded manner or made of the same material - to a large number of heat sink structures or rib structures (the reference number 15 in the drawings indicates the location where these are arranged) not explicitly shown here, with individual thin-walled (material) ribs as well as narrow flow channels delimited by these ribs, designed as heat sink flow channels, through which the cooling medium flows during operation of the cooling device, specifically from the direction of the inlet 11 in the direction of the outlet 12. In other words, the heat sink 14 comprises the aforementioned heat sink structures; they are, for example, milled into them or formed in some other way.In the transverse direction of the cooling component 10, the individual heat sink structures are separated from one another by partition walls 18. At the top, the heat sink 14 is covered and sealed in a fluid-tight manner by a housing part 17, for example made of metal. In the present case, the underside of the heat sink 14 also forms the lower or heat absorption side 13 of the cooling component 10, against which the components to be cooled are applied during cooling operation. However, the heat sink 14 could also be thermally conductively connected, for example on its lower side, to another, for example plate-shaped, metallic cooling component body (directly or by means of a thermal paste), so that this additional cooling component body or its underside would then form the heat absorption side 13 of the cooling component 10.This would be particularly useful in order to be able to manufacture, for example, the heat sink 14 from a first (metallic) material with somewhat lower thermal conductivity, such as aluminum, which has certain manufacturing advantages, and the further cooling component body that comes into contact with the objects to be cooled from a second (metallic) material that is more thermally conductive than aluminum, such as copper. In the present case, each heat sink structure is moreover part of an individual, associated cooling zone 16 a, 16 b, 16 c or 16 d, through which the cooling medium flows. May 23, 2024 700 PA 23039 WO As further indicated in the drawings, the heat sink 14 in the present case comprises, in the flow direction orIn the longitudinal direction of the cooling component 10, three essentially similar segments A, B and C, each with four cooling zones 16 a - 16 d, are arranged one behind the other in relation to the medium flow resulting from the inlet 11 to the outlet 12, or are connected in series. In other words, different cooling zones 16 a - 16 d are connected in direct series in terms of flow across segments, so that the medium flow flows through them one after the other. With respect to each segment A, B and C, the respective cooling zones 16 a - 16 d of a segment A, B or C are also connected in parallel, i.e., cooling medium flows through them in parallel. The individual fins (not shown) of the heat sink structures (not shown) of the cooling zones 16 a - 16 d are typically very thin, and the heat sink flow channels delimited by them are very narrow. However, very narrow heat sink flow channels generate a high pressure loss.This leads to an unfavorably high flow resistance, particularly in view of the series connection of the individual cooling zones 16a-16d in the cooling component 10. The cooling component 10, namely in this case each cooling zone 16a-16d thereof, therefore each comprises a further flow channel extending parallel and spaced from the heat sink flow channels of the respective cooling zone 16a-16d, designed as a secondary flow channel 19, which is also connected in parallel to the respective heat sink flow channels of the respective cooling zone 16a-16d and whose purpose, among other things, is to reduce the flow resistance of the respective cooling zone 16a-16d. As can be seen in particular in Fig. 4, these secondary flow channels 19, which also extend parallel to the main flow direction within the heat sink flow channels, in the present case each run above the respective heat sink structure ortheir heat sink flow channels. The secondary flow channels 19 border on an open (lower) side thereof, respectively, on free ends of the fins of the corresponding heat sink structure, as well as on the corresponding open bottom sides of the heat sink flow channels, opposite sides of the heat sink flow channels of this heat sink structure, in this case with a fluid-conducting connection to the heat sink flow channels. Each secondary flow channel 19 of the cooling zones 16a-16d covers, transversely to the main flow direction in the secondary flow channel 19, several heat sink flow channels of the heat sink structure of the respective cooling zone 16a-16d, in this case at least 80% of the respective total number of heat sink flow channels of the respective cooling zone 16a-16d.The secondary flow channels 19 and ultimately also the heat sink flow channels that are connected to them in a fluid-conducting manner (via the open longitudinal sides) are delimited at the top and laterally by corresponding walls of the housing part 17 that border the outside environment. It has been shown that the secondary flow channels 19 connected parallel to the heat sink flow channels of the respective cooling zone 16 a - 16 d can significantly reduce the flow resistance of the respective cooling zone 16 a - 16 d compared to a cooling zone 16 a - 16 d without such a secondary flow channel 19. This is particularly the case when, as is the case here, the cross section of the respective secondary flow channel 19 is significantly larger than the cross section of each individual heat sink flow channel of the respective heat sink structure of the respective cooling zone 16 a - 16 d orat best, even larger than the sum of the cross-sections of the individual heat sink flow channels. If, for example, several high-performance chips, arranged approximately in a matrix-like manner, are to be cooled simultaneously with the cooling component 10, it is conceivable to arrange them distributed below the segments AC on the cooling surface of the cooling component 10 formed by the underside 13 May 23, 2024 700 PA 23039 WO so that the cooling medium within the cooling component 10 is guided successively along the chips in the flow direction. For example, in the first segment A, a chip to be cooled could be assigned to each of the cooling zones 16 a - 16 d, in the second segment B, a chip could also be assigned to each cooling zone 16 a - 16 d, etc.With such an arrangement, the heat input by the chips in the cooling zones arranged further inside, here 16 b and 16 c, is generally greater than in the cooling zones arranged further outside, here 16 a and 16 d, which, without countermeasures, would result in the cooling medium heating to different degrees (less hot further out than further inside), which in turn would significantly reduce the cooling performance from segment to segment in the cooling zones 16 b and 16 c arranged further inside. The invention therefore provides for counteracting this effect. For this purpose, deflection elements 20 are positioned between or in the free spaces of the segments A and B or B and C, which are spatially spaced from one another in the present case. These deflection elements 20 divert the cooling medium from the cooling zones 16 a - 16 d of the respective preceding segment A orB can specifically divert the cooling medium flowing laterally (either horizontally or vertically) and thus influence the cooling medium temperature and thus the cooling performance in the cooling zones 16 a - 16 d of the respective subsequent segment B or C. In the present case, the deflection elements 20 can, for example, specifically divert the correspondingly cooler cooling medium flowing from the outer secondary flow channels 19 of the cooling zones 16 a and 16 d of segment A or B further inwards, so that it then flows further inwards in the subsequent segments B or C (then in the cooling zones 16 b and 16 c) and there contributes to the stronger cooling performance. The more heated cooling medium flowing below the secondary flow channels 19 in the heat sink flow channels of the inner and middle cooling zones 16 b and 16 c of the segments A and B, on the other hand, is directed laterally outwards by the deflection elements 20, so that in the following segments B and C it then flows into the outer cooling zones 16 a and 16 d 23.May 2024 700 PA 23039 WO flows. For this purpose, the deflection elements 20 in the present case each have, on the one hand, a horizontal partition wall 23 which essentially separates the cooling medium that is guided from the (arranged further up) secondary flow channels 19 to the deflection elements 20 from the cooling medium that is guided in the (arranged further down) heat sink flow channels. Furthermore, the deflection elements 20 each have, in the region or at the level of the respective secondary flow channels 19, two vertical deflection walls 22a and 22b, each running obliquely to the flows in the secondary flow channels 19 and directed obliquely towards one another, onto which the cooling medium from the secondary flow channels 19 of the outer cooling zones 16a and 16d strikes and through which the cooling medium is deflected laterally (horizontally) further inwards in the manner described. In addition, the deflection elements 20 in the area orAt the level of the respective heat sink flow channels, there are two vertical deflection walls 21a and 21b, each extending obliquely to the flows in the heat sink flow channels and directed obliquely toward one another. The cooling medium from the heat sink flow channels of the inner cooling zones 16b and 16c impinges on these deflection walls and through which the cooling medium is deflected laterally (horizontally) further outwards in the manner described. In the present case, the deflection elements 20 are also designed as removable, separate components; however, they could also be integrally connected to the heat sink 14 or formed by it, or made of the same material. It is also understood that the deflection elements 20 could also be designed in such a way that, alternatively or additionally, a vertical mixing of cooling medium can take place, namely a mixing of cooling medium originating from the secondary flow channels 19 with cooling medium originating from the heat sink flow channels.Such vertical mixing also increases the efficiency of the cooling component 10. This is because the secondary flow channel 19 is spaced further from the heat absorption side or underside 13 of the heat sink 14 or the cooling component 10 than the heat sink flow channels of the respective heat sink structure, so that the cooling medium in the heat sink flow channels is heated significantly more by the waste heat of the object to be cooled than the cooling medium in the secondary flow channel 19. The aforementioned mixing then ensures that the cooling medium in the secondary flow channel 19 also participates effectively in the cooling. In addition to reducing flow resistance, the secondary flow channels 19 can also serve another purpose. This is because they can prevent particles contained in the cooling fluid from clogging the heat sink flow channels, which are very narrow due to their size.This is because they can then flow along the significantly larger secondary flow channel 19 and thus be guided out of the cooling component 10. In order to ensure that the particles are also guided to the secondary flow channel 19, guide elements (not shown) can be provided with which they can be guided to the respective secondary flow channel 19. These can, for example, be flanks of the heat sink structures of the individual cooling zones 16a - 16d, which each have such a flank at their respective upstream end, inclined or obliquely running relative to the main flow direction in their heat sink flow channels.An inclined flank designed in this way can then ensure that dirt particles or other material particles in the cooling medium, which would otherwise clog the heat sink flow channels, are deflected in the direction of the secondary flow channel 19 when the cooling medium hits the inclined flank and can then flow through it without any problems. The inclined flank of the heat sink structure could be formed by correspondingly inclined narrow sides of the individual ribs of the heat sink structure. As already indicated, the secondary flow channels must then be correspondingly large 23 May 2024 700 PA 23039 WO so that the particles that do not fit through the heat sink flow channels can flow through them (together with the cooling medium). These can (only) be particles with a size ≥ 0.3 mm, for example. 2 be, in particular ≥ 0.3 mm 2 and ≤ 1.2 mm 2. All described features of the embodiments of the present invention explained above with reference to the drawings are to be understood as examples only and do not represent a limitation of the subject matter of the invention.
[0002] 23 May 2024 700 PA 23039 WO 15 List of reference symbols AC Segments 10 Cooling component 11 Inlet 12 Outlet 13 Underside of cooling component 14 Heat sink 15 Position of heat sink structures 16 ad Cooling zones 17 Housing part 18 Partition walls for heat sink structures 19 Secondary flow channels 20 Deflection elements 21 a Deflection wall for heat sink structure flow 21 b Deflection wall for heat sink structure flow 22 a Deflection wall for secondary flow 22 b Deflection wall for secondary flow 23 Partition wall Deflection element
Claims
May 23, 2024 700 PA 23039 WO 1 Patent claims 1. Cooling component for dissipating heat from objects to be cooled, with an inlet (11) via which cooling medium can be supplied to the cooling component (10), with parallel-connected flow channels through which cooling medium supplied via the inlet (11) can flow, and with an outlet (12) via which the cooling medium can be discharged from the cooling component (10), in particular after absorbing heat from an object to be cooled, characterized in that the cooling component (10) has at least one deflection element (20) arranged downstream of the parallel-connected flow channels, to which cooling medium, which flows in a main flow direction through at least one of these parallel-connected flow channels, is guided and by which the cooling medium is deflected laterally, so that downstream of the deflection element (20) it is laterally offset from the aforementioned Main flow direction continues. 2.Cooling component according to claim 1, characterized in that cooling medium flowing through at least one further of the parallel-connected flow channels is guided in the cooling component (10) such that it is mixed with the cooling medium laterally deflected by the deflection element (20), in particular by also being guided to the or a further deflection element (20) and being laterally deflected by the latter such that mixing can occur. 3.Cooling component according to claim 1 or 2, characterized in that the flow channel through which the cooling medium flows, which is guided to the deflection element (20), and / or the further flow channel is a heat sink flow channel of a heat sink structure forming a component of a preferably metallic heat sink (14) of the cooling component (10) and having a plurality of heat sink flow channels, in particular a heat sink structure whose heat sink flow channels are delimited by adjacent, in particular equally spaced, ribs or pins.
4. Cooling component according to claim 1, 2 or 3, characterized in that the flow channel through which the cooling medium flows, which is guided to the deflection element (20), and / or the further flow channel is a secondary flow channel (19) which is parallel. May 23, 2024 700 PA 23039 WO 2 is connected to a heat sink structure forming part of a heat sink (14) of the cooling component (10) with a plurality of heat sink flow channels, in particular a heat sink structure whose heat sink flow channels are delimited by adjacent, in particular equally spaced ribs or pins, in particular such a secondary flow channel (19) for reducing the flow resistance of the heat sink structure compared to such a heat sink structure without such a secondary flow channel (19) and / or for passing through particles possibly contained in the cooling medium which do not fit through these heat sink flow channels. 5.Cooling component according to one or more of the preceding claims, characterized in that the deflection element (20) of the cooling medium has a deflection wall, preferably extending obliquely to the aforementioned main flow direction of the cooling medium, onto which the cooling medium impinges and through which the cooling medium is deflected laterally.
6. Cooling component according to one or more of the preceding claims, characterized in that the parallel-connected secondary flow channel (19) runs in a plane that is arranged parallel and spaced from the plane in which the cooling body flow channels of the cooling body structure run. 7.Cooling component according to one or more of the preceding claims, characterized in that the deflection element (20) is designed and arranged such that cooling medium flowing through the secondary flow channel (19) is guided to the deflection element (20) and is deflected laterally by the latter, preferably laterally further inwards, in particular by a first deflection wall thereof running obliquely to the main flow direction in the secondary flow channel (19), and that cooling medium flowing through the heat sink flow channel is guided to the deflection element (20) and is deflected laterally by the latter, preferably laterally further outwards, in particular by a second deflection wall thereof running obliquely to the main flow direction in the heat sink flow channel. May 23, 2024 700 PA 23039 WO 3 8. Cooling component according to claims 6 and 7, characterized in that the deflection element (20) has a partition with two opposite sides, which separates the cooling medium flowing out of the secondary flow channel (19) from the cooling medium flowing out of the heat sink flow channel, in that the partition is designed and positioned such that the cooling medium exiting the secondary flow channel (19) is guided along one side of the partition and the cooling medium flowing out of the heat sink flow channel is guided along the opposite, other side of the partition.
9. Cooling component according to one or more of the preceding claims, characterized in that the deflection element (20) is a component separate from the heat sink (14) and its heat sink structure. 10.Cooling component according to one or more of the preceding claims, characterized in that the cooling component (10) has a plurality of cooling zones connected in series and / or in parallel, so that they are cooled one after the other or in series by the cooling medium supplied via the inlet (11).are flowed through in parallel, wherein each cooling zone has a heat sink structure with a plurality of heat sink flow channels, in particular a heat sink structure whose heat sink flow channels are delimited by adjacent, in particular equally spaced, fins or pins, and wherein the cooling zones each have a secondary flow channel (19) connected parallel to the heat sink flow channels, in particular for reducing the flow resistance of the respective cooling zone compared to such a cooling zone without such a secondary flow channel (19) and / or for passing through particles possibly contained in the cooling medium that do not fit through these heat sink flow channels.
11. Cooling component according to claim 10, characterized in that the deflection element (20) is arranged between two successive, series-connected cooling zones. 12.Cooling component according to claim 11, characterized in that the deflection element (20) is arranged between two successive groups of several cooling zones connected in parallel, which are connected in series, and in that cooling medium which is supplied to the deflection element (20) from a cooling body flow channel of a cooling zone arranged further inside. May 23, 2024 700 PA 23039 WO 4 ne of the upstream group of parallel-connected cooling zones is deflected laterally to a structural flow channel of a further outwardly arranged cooling zone of the downstream group of parallel-connected cooling zones, and / or that by the deflection element (20) cooling medium which is supplied to it from a secondary flow channel (19) of a further outwardly arranged cooling zone of the upstream group of parallel-connected cooling zones is deflected laterally to a secondary flow channel (19) of a further inwardly arranged cooling zone of the downstream group of parallel-connected cooling zones. 13.Cooling component according to claim 11 or 12, characterized in that cooling medium, which is supplied to the deflection element (20) from a structural flow channel of the upstream cooling zone of the series-connected cooling zones, is deflected laterally to the secondary flow channel (19) of the downstream cooling zone by the deflection element (20), and / or that cooling medium, which is supplied to the deflection element (20) from a secondary flow channel (19) of the upstream cooling zone of the series-connected cooling zones, is deflected laterally to a structural flow channel of the downstream cooling zone by the deflection element (20).
14. Cooling component according to one or more of the preceding claims, characterized in that the metallic heat sink (14) is a component made of (optionally coated) metal or a (optionallycoated) metal alloy or is formed by such a metal alloy which has the heat sink structure in one piece on one side, which faces away from a particularly flat cooling surface of the cooling component (10), against which an object to be cooled can be brought into contact in order to absorb heat from it.
15. Cooling component according to one or more of the preceding claims, characterized in that the cooling surface of the cooling component (10) is formed by an (outer) side of the heat sink (14) or by an (outer) side of a further, preferably metallic, particularly plate-shaped cooling component body which is heat-conductingly connected to the heat sink (14).