Cooling device and method for producing such a cooling device

Abstract

The invention relates to a cooling device (1) for cooling an assembly of electrical or electrical components (4, 4'), in particular laser diodes, having a main body (2), wherein the main body (2) has a component region (BB) with a first connection region (A1) on an outer side, on which connection region a first component (4) can be mounted, and a second connection region (A2), on which a second component (4) can be mounted, wherein the first connection region (A1) and the second connection region (A2) are offset in height relative to one another in an offset direction (V), wherein the main body (2) has a cooling duct system, wherein the cooling duct system comprises a first cooling portion (41) for cooling the first connection region (A1) and a second cooling portion (42) for cooling the second connection region (A2), wherein the first cooling portion (41) and the second cooling portion (42) are designed in such a way that a first cooling effect of the first cooling portion (41) on the first connection region (A1) and a second cooling effect of the second cooling portion (42) on the second connection region (A2) deviate from a mean value of the first cooling effect and the second cooling effect by less than 15%, preferably less than 10% and particularly preferably less than 5% of the mean value of the first cooling effect and the second cooling effect.

Description

[0001] Cooling device and method for producing such a cooling device

[0002] The present invention relates to a cooling device and a method for producing such a cooling device.

[0003] Cooling elements for cooling electrical or electronic components, especially semiconductors such as laser diodes, are well known in the art. During operation, the electrical or electronic components generate heat, which is dissipated by the cooling element, thus ensuring the continued functionality of the electrical or electronic components. This is particularly true for laser diodes, where temperature differences of just a few °C can significantly impair performance and / or service life. In particular, temperature changes can lead to unwanted wavelength fluctuations in the emitted light.

[0004] To cool the components, the cooling elements, which are usually connected to the components, typically have a cooling fluid channel system through which a cooling fluid is channeled during operation to absorb and dissipate heat emanating from the electrical or electronic component. A fin structure is preferably used here, in which several web-like elements protrude into the cooling fluid channel system to provide the largest possible contact area with the cooling fluid, thereby improving the heat transfer from the walls that define the cooling fluid channel system to the cooling fluid. Accordingly, it is desirable to combine as many of these web-like elements as possible in the smallest possible space to ensure optimal cooling performance at the transition between the fin structure and the fluid.

[0005] There is also increasing interest in devices in which electrical components are arranged three-dimensionally. The ability to arrange electrical or electronic components three-dimensionally or at different heights from one another offers advantages for assembly, for example, with regard to the alignment of the electronic or electrical components and the electrical connections. Furthermore, in the case of laser diodes or laser diode bars, a height-shifted arrangement makes it possible to optimally align or arrange the light sources for possible downstream optics, such as lenses.

[0006] For the three-dimensional arrangement of the electrical or electronic components, a base body is preferably provided, which has a corresponding surface profile, for example, a stepped profile, in one component area. A cooling device is then connected to the cooling side of the base body opposite the component area. The cooling side of the base body is essentially flat, i.e., it is free of any profiling, in order to connect the typically rectangular and standardized cooling element to the cooling side.

[0007] It has been shown that such an arrangement leads to inhomogeneous cooling distribution for the individual electrical components. This is undesirable simply because it leads to laser diodes of the same type emitting light at different wavelengths. This can, for example, lead to an unwanted spectral broadening of the light emitted by the laser array. The overall effect of the electrical components—namely, the collective emission of light from the array—is thus negatively impacted.

[0008] Therefore, the present invention has for its object to provide a device which, despite a three-dimensional, i.e. a height-offset, arrangement of the components relative to one another, does not decisively and significantly impair the overall effect of the electrical or electronic components.

[0009] The present invention solves the problem with the cooling device according to claim 1 and with a method according to claim 10. Further embodiments can be found in the description, the dependent claims and the figures.

[0010] According to a first aspect of the present invention, a cooling device is provided for cooling an arrangement of electrical or electronic components, in particular laser diodes, wherein the cooling device comprises a base body, wherein the base body has on an outer side a component region with a first connection region, to which a first electrical component can be or is mounted, and a second connection region, to which a second electrical component can be or is mounted, wherein the first connection region and the second connection region are vertically offset from one another along an offset direction, wherein the base body has a cooling channel system, wherein the cooling channel system comprises a first cooling section for cooling the first connection region and a second cooling section for cooling the second connection region, wherein the first cooling section and the second cooling section are designed such thatthat a first cooling effect of the first cooling section on the first connection region and a second cooling effect of the second cooling section on the second connection region deviate from an average value of the first cooling effect and the second cooling effect by less than 15%, preferably less than 10% and particularly preferably less than 5% of the average value of the first cooling effect and the second cooling effect.

[0011] Compared to the cooling devices known from the prior art, it is provided that the cooling system, in particular in the form of the cooling channel system, is integrated into the base body and, in particular, by corresponding cooling sections of the cooling channel system, it is ensured that the connection areas, in particular the first connection area and the second connection area, are cooled in a comparable manner, i.e. to the same extent. As a result, the first connection area and the second connection area experience a similar cooling effect, which has a positive impact on the overall performance of the system comprising several electronic or electrical components, since different and undesired functional modes of the individual electrical or electronic components do not occur due to an inhomogeneous cooling profile along the base body, in particular within the component area.In the case of a laser diode, for example, it can be avoided that a wavelength of individual laser diodes or laser diode bars is spectrally shifted due to temperature fluctuations and thus influences the spectral composition of the emitted light of the entire device.

[0012] In this case, the person skilled in the art understands an integrated cooling channel system to be, in particular, a cooling channel system in which a cooling channel fluid is passed through the base body. It is preferably provided that the cooling channel system is designed such that it follows a surface profile in the component region. The surface profile is preferably determined by the arrangement of the first connection region and the second connection region. The base body serves, in particular, as a carrier for the electrical components. The base body has, for example, fastening sections via which the base body can in turn be mounted to another component. In particular, the cooling channel system is designed as a closed cooling system and / or has a microchannel system or is designed as a microchannel system.

[0013] The respective connection regions, which are vertically offset from one another along the offset direction, can be flat and preferably run essentially perpendicular or obliquely to the offset direction. For example, the component region has a stepped profile. However, it is also conceivable for any three-dimensional surface profile to be realized in the component region by the first connection region and the second connection region. The offset direction preferably runs perpendicular to a main extension plane of the cooling device or parallel to a stacking direction along which individual layers of metal and / or ceramic are stacked one above the other to form the base body. The height offset of the first and second connection regions preferably specifies a surface profiling.In particular, it is provided that the first connection surface and the second connection surface are also arranged laterally offset from one another.

[0014] The cooling channel system is particularly designed such that, through the appropriate dimensioning of a cooling section, in particular its cross-section, and / or its placement and / or its orientation, it is specifically ensured that a cooling effect of the first cooling section on the first connection region and a second cooling effect of the second cooling section on the second connection region are essentially the same. This advantageously achieves a homogeneous cooling performance across the entire base body, in particular in the component area. This homogenization has a beneficial effect on the overall performance of the device, particularly when electrical or electronic components, for example laser diodes, are mounted on the device.The cooling effect can be determined, for example, based on a temperature, for example measured with a temperature sensor, in the respective first and / or second connection area, such that the measured temperature in the first receiving area and in the second receiving area, in particular while a cooling medium is being passed through the cooling system, is essentially identical, i.e. a first temperature and a second temperature do not deviate by more than 15%, preferably not more than 10%, and particularly preferably not more than 5% from an average value of the first and second temperatures. In other words: the temperature in the first connection area and in the second connection area during operation of the cooling device can be used as a benchmark or measured variable for the first and second cooling effects.

[0015] According to a first embodiment, it is provided that a first distance is formed along the offset direction between the first cooling section and the first connection region and a second distance is formed along the offset direction between the second cooling section and the second connection region, wherein the first distance and the second distance deviate from the mean value of the first and second distance by less than 15%, preferably less than 10% and particularly preferably less than 5% of an average value of the first and second distances. In other words: the cooling system is designed such that the cooling sections bring the cooling medium as close as possible to the respective connection region, i.e. to the first and second connection region, in order to ensure the most homogeneous cooling effect possible for the first and second connection region. For this purpose, the cooling fluid must follow a corresponding surface profile in the component region.

[0016] Preferably, it is provided that a measured height offset between the first connection region and the second connection region along the offset direction assumes a value that is at least 0.1 mm and preferably lies between 0.5 mm and 15 mm, and particularly preferably between 2 mm and 10 mm. It has been shown that it is possible to compensate even for height offsets that are greater than 0.1 mm or lie between 0.5 mm and 15 mm by appropriately designing the cooling channel system, in particular the first cooling section and the second cooling section.

[0017] It is preferably provided that the component region of the base body has an ensemble of connection regions, wherein the ensemble comprises the first connection region and the second connection region. Preferably, further connection regions of the ensemble are arranged between the first connection region and the second connection region. It is preferably provided that the cooling effects of the cooling sections on the connection regions of the further connection regions in the ensemble deviate less from an average value of the cooling effects of the respective connection regions, than 15%, in particular 10%, particularly preferably 5% of the average value of the cooling effects. Here, the temperatures can equally be used as a benchmark for the respective cooling effect.

[0018] Preferably, the connection areas are arranged in a stepped manner relative to one another. For example, the individual connection areas are vertically offset at the same distance from one another. A stepped arrangement, for example, allows for the simplest possible assembly and easy access to the electrical connections, which also simplifies the electrical connection.

[0019] It is preferably provided that the supply section and / or the discharge section of the first cooling channel deviates from the supply section and / or the discharge section of the second cooling channel with regard to a length measured in the direction of flow. This particularly preferably applies to a set of first cooling channels and a set of second cooling channels. In particular, it is provided that the first set of first cooling channels has separate, i.e. spatially separated, supply sections and / or discharge sections. This differs in particular from cooling channels in which a common cooling channel section carries the cooling medium to the deflection region or away from it. Instead, a micro-channel system with the respective cooling channels is implemented.

[0020] In particular, it is provided that the cooling channel system has a first cooling channel and a second cooling channel separate from the first cooling channel. By means of the first cooling channels and the second cooling channels, an individual cooling effect can be set which is adapted to the first connection area and the second connection area. In particular, it is provided that further cooling channels or at least one further cooling channel is assigned to the further connection areas. For example, it is conceivable that the cooling channels follow the height offset of the first connection area and the second connection area by adjusting their length. If the description refers to cooling channels or connection areas, the properties, characteristics and advantages described therein apply to the first cooling channel, the second cooling channel and the further cooling channels orto the first connection area, the second connection area and the further connection areas and vice versa. It is preferably provided that the first cooling section is provided by a deflection area of ​​a first cooling channel and / or the second cooling section is provided by a deflection area of ​​a second cooling area. It is preferably provided that the first cooling channel and / or the second cooling channel have a substantially U-shaped course. In this case, it is provided that the course of the first cooling channel and / or the second cooling channel and / or the cooling channels each have a feed section and a discharge section. The feed section guides the cooling medium from an inlet opening of the cooling channel to the deflection area and the discharge section guides the cooling medium from the deflection area to the outlet opening of the first cooling channel or the cooling channels.The cooling channels each have their own inlet and outlet openings, which are separated or spaced apart from the inlet and outlet openings of the individual cooling channels. The deflection region is arranged such that its distance from the connection region is smaller than the distance between the supply section and the discharge section and the connection region. In particular, it is provided that, by appropriately dimensioning the length of the supply section and the discharge section, the individual cooling channels, in particular the deflection region, are brought as close as possible to the connection region, i.e., the first and second connection regions.In other words, a length of the supply section and / or the discharge section of the first cooling channel measured in the offset direction is greater, preferably at least 3 times greater, preferably at least 5 times greater, and particularly preferably at least 8 times greater, than a length of the supply section and / or the discharge section of the second cooling channel measured in the offset direction. Furthermore, the cooling channels each have their own inlet and outlet openings.

[0021] It is preferably provided that a cross-section changes within the cooling channel, wherein the cross-section is measured perpendicular to the respective flow direction in the cooling section or cooling channel. Furthermore, it is preferably provided that the deflection region which provides the cooling section has a curved and / or stepped profile, in particular adapted to an outer contour of the component region of the base body, in order to dissipate heat as homogeneously and effectively as possible, in particular taking into account the fact that isotropic thermal radiation emanates from the component, which leads to heat spreading below the component. It is therefore advantageous if cooling takes place below the connection region in an area which is larger than the connection region itself, so that it is advantageous to dimension the deflection region larger than the length of the connection region in the same direction.It is also conceivable for the supply section and / or the discharge section to have a stepped and / or curved shape, viewed in the flow direction, in particular in a direction parallel to the offset direction. It is also conceivable for the supply section, the deflection region, and / or the discharge section to have a helical, spiral, or meandering shape, in particular along the general flow direction in the supply section, deflection region, and / or discharge section.

[0022] It is also conceivable for the supply section to taper in the flow direction, i.e., toward the connection region, and / or for the discharge section to widen in the flow direction, i.e., leading away from the connection region. It is also conceivable for the inlet openings and / or outlet openings of the cooling channels for the different connection regions to be offset in height. In other words, the inlet opening and / or outlet opening of the first cooling channel is offset in height from the inlet opening and / or outlet opening of the second cooling channel. Alternatively or additionally, it is conceivable for the inlet openings and / or outlet openings of different connection regions to be arranged substantially at the same height relative to the offset direction.

[0023] Furthermore, it is preferably provided that the deflection area has a larger cross-section than the cross-section in the supply section and / or the discharge section. This ensures the most optimal flow possible, even if the individual cross-sections of the cooling channels are comparatively small.

[0024] Preferably, the first cooling channel and the second cooling channel are connected to a common supply device with a distribution structure. In other words, the first cooling channel and the second cooling channel are each supplied with the cooling fluid by a common supply device, with the cooling fluid being fed into the inlet openings of the individual cooling channels.

[0025] In particular, it is provided that at least one supply channel and one discharge channel are provided as the supply structure, wherein the supply channel supplies the inlet openings of the individual cooling channels and the discharge channel of the supply system is connected to the outlet opening of the cooling channels in order to be able to discharge the cooling medium emerging from the cooling channels. In particular, it is provided that the cooling medium is diverted from the supply channel of the supply device into the discharge channel of the supply device via the cooling channel(s). The supply channel and discharge channel are preferably connected to one another exclusively via the cooling channels. This ensures that the cooling fluid is guided via the cooling channels.

[0026] In particular, this ensures that no used cooling medium is recirculated to another cooling channel. Instead, all cooling channels, or preferably a majority of all cooling channels, are connected to the same supply channel of the distribution device. The cooling fluid is guided via the cooling channels to the vicinity of the respective connection areas to ensure a targeted and individual cooling effect there. The cooling fluid is guided through the cooling channels, following the offset direction, to the respective connection area and then returned to exit the cooling device again via the discharge channel.

[0027] In particular, it is provided that the cooling fluid flows along a flow direction within the supply channel and / or the discharge channel, wherein a flow direction in the deflection region of the cooling channel runs obliquely to the flow direction in the supply channel and / or discharge channel, in particular forming an angle between 0° and 90° to the flow direction in the supply channel and / or discharge channel. In particular, it is provided that the flow direction in the supply channel runs parallel to the discharge channel, wherein the flow directions in the supply channel and discharge channel run essentially parallel to one another but are laterally offset from one another. The lateral offset of the flow direction occurs via the deflection through the individual cooling channels.

[0028] Preferably, the base body is composed of a plurality of layers with at least one recess or recesses. In particular, the position and alignment of the individual recesses relative to one another in the stacked structure of the individual layers determines the course of the respective cooling channels in the cooling channel system, i.e. within the base body. This also makes it possible to incorporate complex cooling channels into the cooling device, which channels are in particular designed or dimensioned to achieve a cooling effect in the first connection area that is comparable to the cooling effect in the second connection area. Furthermore, it is conceivable for the individual layers to be dimensioned to different sizes, in particular in a direction perpendicular to the offset direction, in order to ensure a three-dimensional structure of the base body, in particular in its component area.In particular, this is to be understood as a surface profiling which results in connection areas, ie a first connection area and a second connection area, being arranged offset in height from one another along the offset direction.

[0029] Preferably, it is provided that a first set of first cooling channels is assigned to the first connection region, wherein the cooling channels of the set of first cooling channels are offset from one another in a direction perpendicular to the flow direction. This makes it possible to ensure the most extensive cooling effect possible below the respective connection region despite comparatively narrow cooling channels. At the same time, sufficient material is ensured below the connection region, whereby the mechanical stability is present, which is necessary, for example, for connecting the electrical components to the respective connection region. It is conceivable that the courses of the cooling channels are essentially identical or at least similar. Furthermore, it is conceivable that the courses, ieThe geometric arrangement of the supply section and the outlet section, as well as the deflection region, is essentially identical, and / or the length of the supply sections and the discharge sections is adapted to achieve the same distance between the cooling section or deflection region and the respective connection region. In particular, it is provided that the cooling channels of the set of cooling channels for the respective connection region are arranged offset from one another along a direction that runs parallel to the flow direction in the supply channel and / or discharge channel of the supply device.

[0030] Another object of the present invention is a method for producing a cooling device according to the invention, comprising:

[0031] Providing a plurality of layers with one or more recesses, stacking the layers and

[0032] Connecting the layers in a bonding process to form the base body with the cooling channel system.

[0033] All of the properties and advantages described for the cooling device can be applied analogously to the process and vice versa. The individual layers extend essentially along a main extension plane and are stacked one on top of the other in a direction perpendicular to the main extension plane and then connected to one another. In particular, dimensioning the individual layers in the main extension plane influences the surface profiling in the component area, in particular the position of the first connection area and / or the second connection area. The recesses determine the course of the cooling channels or the cooling channel system. The individual layer is preferably provided as a form-etched part. The recesses of the individual layers can have different geometric shapes and / or be arranged laterally offset from one another when stacked for connection.For example, the recesses can be round, elliptical, polygonal, rectangular, or semicircular. The individual layers are preferably offset from one another in such a way that a helical or spiral-shaped partial path is created in the cooling channel.

[0034] The individual layers can be made of metal and / or a ceramic material. Possible materials for a metal layer include copper, aluminum, molybdenum, tungsten, nickel, and / or their alloys, such as CuZr, AlSi, or AlMgSi, as well as laminates such as CuW, CuMo, CuAl and / or AlCu, or MMC (metal matrix composite), such as CuW, CuM, or AlSiC. Preferably, a ceramic layer comprises Al2O3, SiSn^AlN, an HPSX ceramic (i.e., a ceramic with an Al2O3 matrix containing an x-percent ZrO2 content, for example, Al2O3 with 9% ZrO2 = HPS9 or Al2O3 with 25% ZrO2 = HPS25), SiC, BeO, MgO, high-density MgO (>90% of the theoretical density), and TSZ (tetragonally stabilized zirconium oxide) as the ceramic material. It is also conceivable that the ceramic layer is used as a composite orHybrid ceramic is formed in which, in order to combine various desired properties, several ceramic layers, each differing in terms of their material composition, are arranged one above the other and combined to form an insulating element.

[0035] Further advantages and features will become apparent from the following description of preferred embodiments of the subject matter according to the invention with reference to the accompanying figures. Individual features of the individual embodiments can be combined with one another within the scope of the invention.

[0036] They show:

[0037] Fig.1 : schematic representation of a three-dimensional arrangement of electrical components,

[0038] Fig. 2: Detailed view of a cooling channel in sectional view (top) and perspective view (bottom), Fig. 3 schematic representation of a cooling channel system for a cooling device according to an exemplary embodiment of the present invention

[0039] Fig. 4a and 4b schematic representation of a cooling channel for a cooling device according to another exemplary embodiment of the present invention and

[0040] Fig. 5a and 5b schematic representation of further basic body shapes

[0041] Figure 1 shows an arrangement, in particular a three-dimensional arrangement of a large number of electrical or electronic components 4. In particular, the embodiment in Figure 1 shows an arrangement of a plurality of laser diodes, each of which is connected to a base body 2, preferably a metallic base body 2, via an adapter element 7, preferably an insulating adapter element 7. To configure the three-dimensional arrangement, the base body 2 has a component region BB with a surface profile on an outer side. In particular, the surface profile in Figure 1 is essentially stepped. In Figure 1, an adapter element 7 and an electrical component 4, 4' are assigned to each individual step. In particular, the component region BB thus has a first connection region A1, to which a first electrical orelectronic component 4 can be or is mounted and a second connection region A2, to which a second electrical or electronic component 4' can be or is mounted. In particular, it is provided that the first connection region A1 and the second connection region A2 are offset in height from one another along an offset direction V. In particular, the embodiment of Figure 1 shows an ensemble of connection regions A1, A2, A3, wherein the first connection region A1 and the second connection region A2 are part of the ensemble of connection regions A1, A2, A3. In particular, further connection regions A3 of the ensemble are arranged between the first connection region A1 and the second connection region A2.

[0042] In the exemplary embodiment shown in Figure 1, the height offset between the adjacent connection regions A1, A2, A3 is essentially the same. It is also conceivable for the height offset to vary. Preferably, the adapter element 7 and in particular the laser diode are arranged at a respective edge of a step. Such an arrangement of the ensemble of laser diodes or adapter elements 7 proves to be particularly advantageous because it simplifies the assembly of the individual laser diodes, for example with regard to their electrical connection. Furthermore, the laser diode can be aligned to the respective edge of the steps, for example using a suitable means.

[0043] The base body 2 preferably has a cooling side KS opposite the component area BB. This cooling side KS is preferably flat and serves, for example, to connect to a heat sink or to another component or to delimit a cooling channel that is integrated into the base body 2. Since the laser diodes generate heat during operation, they must be cooled. However, with the procedures customary in the prior art, it is not possible to ensure that the respective laser diodes operate at the same operating temperature. Consequently, a wavelength shift of the emitted light can occur due to temperature modulation. The arrangement of laser diodes, which is intended in particular to serve jointly as a light source, cannot ensure that a spectral broadening of the emitted light occurs in the community of all laser diodes.In order to avoid a negative impairment of the functioning of the overall system due to the three-dimensional arrangement of the electronic components, it is provided that a first cooling effect of a first cooling section 41 on the first connection area A1 and a second cooling effect of a second cooling section 42 on the second connection area A2 deviate from each other or from an average value of the first cooling effect and the second cooling effect by less than 15%, preferably less than 10% and particularly preferably less than 5% of the average value of the first cooling effect and the second cooling effect.

[0044] In other words: the cooling effect on the first connection region A1 and the cooling effect on the second connection region A2 are essentially identical. The first cooling section 41 and the second cooling section 42 are part of a cooling channel system that is integrated into the base body 2. The first cooling section 41 is preferably part of a first cooling channel 61 and the second cooling section 42 is part of a second cooling channel 62, wherein the first cooling channel 61 and the second cooling channel 62 are separate from one another. It is conceivable that, through appropriate dimensioning of the cooling channels 61, 62 and / or placement within the base body 2, a cooling effect in the first connection region A1 essentially corresponds to that generated by the second cooling section 42 in the second connection region A2.

[0045] In the embodiments with an ensemble of connection areas A1, A2, A3, it is preferably provided that a respective cooling effect of the cooling section 41, 42, 43 on the associated connection area A1, A2, A3 does not deviate from the mean value of the cooling effects at the respective connection areas by more than 15%, preferably less than 10% and particularly preferably less than 5% of the mean value of all cooling effects on the associated connection areas A1, A2, A3.

[0046] This applies in particular to at least 60% of all connection areas A1, A2, A3, preferably to at least 80% of all connection areas A1, A2, A3 and particularly preferably to at least 90% of all connection areas A1, A2, A3.

[0047] A corresponding cooling effect can be determined, for example, by measuring and preferably creating a temperature profile across the respective connection regions A1, A2, A3. In other words: the cooling device 1 is designed such that, when a cooling fluid passes through the cooling channel system, a temperature at the first connection region A1 substantially corresponds to the temperature in the second connection region A2, preferably even when a first electrical component 4 is operated at the first connection region A1 and a second electrical component 4' is operated at the second connection region A2, in particular when used in an application-oriented manner. The first electrical component 4 and the second electrical component 4' can be identical in construction or have different functions.

[0048] It is thus advantageously possible to ensure a homogeneous cooling effect on the electrical components 4, 4', which results in the individual electrical components 4, 4' being able to operate at the same temperature. In the case of laser diodes, this ensures that unwanted spectral fluctuations do not occur, which has a positive overall effect on the performance of the entire system in that the entire system emits light in the narrowest possible spectral band.

[0049] Figure 2 shows a detailed view of the first cooling section 41 for cooling the first connection region A1. The upper view illustrates a sectional view, and the lower view a perspective view. In particular, it is provided that the cooling effect in the first connection region A1 is generated by a first cooling channel 61. The first cooling channel 41 has a substantially U-shaped profile. In particular, the first cooling channel 61 comprises a supply section 31 and a discharge section 32, which are connected to one another via a deflection region 33. The deflection region 33 is closest to the first connection region A1.In particular, the arrangement of the deflection region 33 and the feed section 31 and the discharge section 33 is such that the cooling fluid is guided via the feed section 31 to the diverting section 33 and thus in the direction of the first connection region A1, and from the diverting section 33 via the discharge section 33 is guided away from the first connection region A1 again. This advantageously makes it possible to bring the first cooling channel 61, in particular its deflection region 33, as close as possible to the first connection region A1 with pinpoint accuracy and in a small dimension. In the exemplary embodiment in Figure 2, it is provided that the deflection region 33 extends below the first connection region A1, viewed in the offset direction. In this case, it is preferably provided that the deflection region 33 itself has a stepped, oblique, curved and / or slightly vertically offset course, in particular in order to correspond to an external profile orSurface profile in component area BB.

[0050] Preferably, it is provided that the deflection region 33 is larger than the first connection region A1 in order to have the most efficient cooling effect, in particular in order to be able to dissipate heat quantities carried away from the component isotropically and thus spreadingly via the first cooling channels 61. In particular, it is provided that in the flow direction St, the deflection region 33 runs below the first connection region A1, in particular below the adapter element 7, in particular such that a total length of the deflection region 33, viewed in the flow direction St, is greater than 1.5 times, preferably more than 2 times, and particularly preferably more than 2.5 times a longitudinal extent of the first connection region A1, in particular of the adapter element 7, along the same direction, in particular along the flow direction St in the deflection region 33.Furthermore, it is conceivable, and particularly illustrated in Figure 2 at the top, that the first cooling channel 61 changes its cross-section along the flow direction St, which follows the essentially U-shaped course in the first cooling channel. By appropriately modifying the cross-section, which is measured in particular perpendicular to the flow direction St, it is advantageously possible to influence the flow velocities and thus adjust the cooling effect as needed. It is also conceivable that the cooling fluid in the supply section 31 and / or the discharge section 32 is guided in a spiral or helical manner, at least in sections.

[0051] In Figure 2 (bottom), it can also be seen that a set of first cooling channels 61 is provided for the first connection region A1, wherein the first cooling channels 61 are preferably substantially identical in construction, i.e., have the same course in a plane that runs parallel to the offset direction V. In a direction that runs perpendicular to the plane defined by the course of the cooling channel, a plurality of first cooling channels 61 are preferably arranged adjacent to one another, wherein they are preferably arranged equidistantly or at varying distances from one another or next to one another along the defined direction. As a result, the respective comparatively thin first cooling channels 61 can be used to individually adjust the cooling effect for the first connection region A1 over as wide an area as possible. In the exemplary embodiment shown in Figure 2, there are three first cooling channels 61 arranged adjacent to one another.

[0052] The cooling fluid is preferably introduced into the supply section 31 via an inlet opening, and the cooling fluid exits the discharge section 32 of the first cooling channel 61, which provides the first cooling section 41, via an outlet opening. This applies in particular to the first cooling channels 61, i.e., the first cooling channels 61 have separate and distinct inlet openings and outlet openings, which are arranged in particular adjacent to one another.

[0053] The above statements regarding the first cooling channel 61 and the first connection region A1 can be transferred in particular to the second cooling channel 62 and the second connection region A2 or to the further connection regions 63 and the further cooling channels 63, in particular with regard to the course of the first cooling channel 61 and the second cooling channel 62 with supply section 31 and discharge section 32 and deflection region 33.

[0054] Figure 3 shows a schematic representation of the cooling sections 41, 42, 43 for the connection areas A1, A2, A3 in an ensemble of connection areas A1, A2, A3 for an ensemble of electrical components 4, 4', which are arranged along the stepped course. In particular, it is provided that the inlet openings of the cooling channels 61, 62, 62, in particular of the first cooling channel 61 and the second cooling channel 62, are supplied with the cooling fluid from a common supply device 50. In the embodiment shown in Figure 3, a distribution system or a distribution structure is provided for the supply device 50, which has a feed channel 51 that supplies the cooling channels 61, 62, 63 of the connection areas A1, A2, A3 with the cooling fluid.In particular, it is provided that the supply channel 51 of the supply device 50 supplies the respective inlet openings of the first cooling channels 61 in the first set of first cooling channels 61. Furthermore, it is provided that the cooling channels 61, 62, 63 of the respective sets of cooling channels 61, 62, 63 for the respective connection region A1 are supplied by the supply channel 51. In the supply channel 51, the cooling fluid flows along a flow direction St, which preferably runs essentially perpendicular to a flow direction St in the deflection region 33 of the first cooling channel 61. It is preferably provided that an angle is formed between the flow direction St in the deflection region 33 and the flow direction St in the supply channel 51, which angle lies between 0° and 90° and is preferably greater than 45° and particularly preferably greater than 80°.The cooling fluid leaves the respective cooling channels 61, 62, 63 for the respective connection area A1, A2, A3 via the outlet opening to open into a common discharge channel 52, which discharges the used cooling medium from the cooling channels 61, 62, 63. The discharge channel 52 of the distribution device 50 runs parallel to the supply channel 51 in Figure 3. Preferably, the flow directions St in the supply channel 51 and discharge channel 52 are arranged parallel and laterally offset from one another, in particular offset along a direction that runs perpendicular to the flow direction St. The distribution device is preferably part of the cooling device, in particular integrated into the base body. Alternatively, it is conceivable for the distribution device to be connectable to the cooling device, in particular to be mountable in an interchangeable manner. For example, the distribution device in this case is made of a plastic, in particular as an injection-molded part.

[0055] It is conceivable that the supply channel 51 and / or the discharge channel 52 form a cavity which has a stepped profile on its inner side, which corresponds to the stepped profile of the component region BB of the base body 2, in order to keep the size or length of the supply section 31 and the discharge section 32 of the respective cooling channel 61, 62, 63 as short as possible and identical for all cooling channels 61, 62, 63. Alternatively, it is conceivable that the length of the supply sections 31 and / or the discharge sections 32 measured along the offset direction V varies with each step in order to guide the cooling fluid to the respective connection region A1, A2, A3.In particular, it is provided that the deflection region 33 of the first cooling channel 61 is arranged at a first distance d1 from the first connection region A1 and the deflection region 33 of the second cooling channel 62 is arranged at a second distance d2 from the second connection region A2, measured along the offset direction V. It is preferably provided that the first distance d1 and the second distance d2 deviate from an average value of the first distance d1 and the second distance d2 by less than 15%, preferably 10% and particularly preferably 5% of the average value of the first distance d1 and the second distance d2 a. In the case of an ensemble of connection regions A1, A2, A3, it is preferably provided that this generalizes to the distances of the connection regions A1, A2 A3 and the cooling channels 61, 62, 63 in the ensemble of the connection regions A1, A2, A3.

[0056] Figures 4a and 4b show sectional views through the base body 2. In particular, Figure 4a shows a cooling fluid flow within the layered base body 2 of the cooling device. Figure 4b shows the corresponding sectional view, which reveals that the cooling device 1 is formed from a plurality of layers 71, wherein the individual layers 71 have recesses and are preferably dimensioned to different sizes, in particular for different stages. By stacking the individual layers 71 on top of one another, in particular the individual layers 71 with different sized surfaces, a geometry of the component region BB is defined, and the recesses define a flow of the cooling channels 61, 62, 63 within the base body 2. For this purpose, the recesses within the individual layers 71 are arranged differently.The stacked individual layers 71, which are stacked one above the other along a stacking direction, are then preferably bonded together using a DCB or AMB process. The stacking direction preferably runs parallel to the offset direction V. The individual layers 71 can be ceramic layers and / or metal layers. Cover layers are preferably also provided. This allows for the creation of a closed cooling channel system.

[0057] In the exemplary embodiment shown in Figure 4a, it is provided that both the supply channel 51 and the discharge channel 52 each supply cooling channels 61, 62, 63, which have different lengths of the supply section 31 and the discharge section 32 depending on the connection area A1, A2, A3, in particular a height position of the connection area A1, A2, A3. The lengths of the supply section 31 and the discharge section 32 are dimensioned along a direction running parallel to the offset direction V. The supply channel 51 and the discharge channel 52 each have a supply connection, via which the cooling fluid can be connected from the outside to the cooling device 1 or in order to be able to introduce and / or discharge the cooling fluid into the cooling devices 1. Figures 5a and 5b show further base bodies 2 which have different component area geometries.These can, for example, be gradients on the outside of component area BB that are stepped (see Figure 5a) or ramp-shaped (see Figure 5b). By appropriately aligning the deflection area 33, it is conceivable that the most homogeneous cooling performance possible can be ensured for the respective connection area A1, A2, and A3.

[0058] List of reference symbols:

[0059] 1 cooling device

[0060] 2 basic bodies

[0061] 4 first electrical or electronic component

[0062] 4' second electrical or electronic component

[0063] 7 Adapter element

[0064] 31 Feed section

[0065] 32 diversion section

[0066] 33 Deflection area

[0067] 41 first cooling section

[0068] 42 second cooling section

[0069] 43 additional cooling section

[0070] 50 supply facility

[0071] 51 feed channel

[0072] 52 discharge channel

[0073] 61 first cooling channel

[0074] 62 second cooling channel

[0075] 63 additional cooling channel

[0076] 71 layer with recess

[0077] 72 further layer with recess d1 first distance d2 second distance

[0078] St Flow direction

[0079] V Offset direction

[0080] HSE main extension level

[0081] A1 first connection area A2 second connection area

[0082] A3 additional connection area

[0083] BB component area

[0084] KS cooling side

Claims

Claims 1. A cooling device (1) for cooling an arrangement of electrical or electronic components (4, 4'), in particular laser diodes, wherein the cooling device (1) comprises a base body (2), wherein the base body (2) has, on an outer side, a component region (BB) with a first connection region (A1), to which a first component (4) can be mounted, and with a second connection region (A2), to which a second component (4') can be mounted, wherein the first connection region (A1) and the second connection region (A2) are offset in height from one another along an offset direction (V), wherein the base body (2) has a cooling channel system, wherein the cooling channel system comprises a first cooling section (41) for cooling the first connection region (A1) and a second cooling section (42) for cooling the second connection region (A2), wherein the first cooling section (41) and the second cooling section (42) are designed such thatthat a first cooling effect of the first cooling section (41) on the first connection region (A1) and a second cooling effect of the second cooling section (42) on the second connection region (A2) deviate from an average value of the first cooling effect and the second cooling effect by less than 15%, preferably less than 10% and particularly preferably less than 5% of the average value of the first cooling effect and the second cooling effect.

2. Cooling device (1) according to claim 1, wherein a first distance (d1) is formed along the offset direction (V) between the first cooling section (41) and the first connection region (A2) and a second distance (d2) is formed along the offset direction (V) between the second cooling section (42) and the second connection region (A2), wherein the first distance (d1) and the second distance (d2) deviate from an average value of the first distance (d1) and the second distance (d2) by less than 15%, preferably less than 10% and particularly preferably less than 5% of the average value of the first distance (d1) and the second distance (d2).

3. Cooling device (1) according to one of the preceding claims, wherein a height offset measured along the offset direction (V) between the first connection surface (A1) and the second connection surface (A2) assumes a value which is at least 0.1 mm and preferably lies between 0.5 mm and 15 mm, and particularly preferably between 2 mm and 10 mm 4. Cooling device (1) according to one of the preceding claims, wherein the component region (BB) has an ensemble of connection regions (A1, A2, A3), wherein the ensemble comprises the first connection region (A1) and the second connection region (A2) and further connection regions (A3), wherein the ensemble of connection regions (A1, A2, A3) is preferably arranged in a step-like manner.

5. Cooling device (1) according to one of the preceding claims, wherein the cooling channel system comprises a first cooling channel (61) and a cooling channel (61) has a separate second cooling channel (62).

6. Cooling device (1) according to claim 5, wherein the first cooling section (41) is formed by a deflection region (33) of a first cooling channel (61) and / or the second cooling section (42) is formed by a deflection region (33) of a second cooling channel (62) is provided.

7. Cooling device (1) according to claim 6, wherein the deflection region (33) has a curved and / or a stepped course.

8. Cooling device (1) according to claim 6 or 7, wherein the deflection region (33) has a curved and / or a stepped course.

9. Cooling device (1) according to one of the claims, the course of the first cooling channel (61) and / or the second cooling channel (62) has a supply section (31) and a discharge section (32).

10. Cooling device (1) according to claim 9, wherein the supply section (31) and / or the discharge section (32) of the first cooling channel (61) deviates from the supply section (31) and / or the discharge section (32) of the second cooling channel (62) with respect to a length measured in the flow direction.

11. Cooling device (1) according to one of claims 5 to 8, wherein the first cooling channel (61) and the second cooling channel (62) are connected to a common supply device (50) with a distribution system.

12. Cooling device (1) according to one of the preceding claims, wherein the cooling channel system is designed as a closed cooling system.

13. Cooling device (1) according to one of the preceding claims, wherein the first connection region (A1) is assigned a first set of first cooling channels (61), wherein the first cooling channels (61) of the set of first cooling channels (61) are preferably offset from one another in a direction perpendicular to the flow direction (St) and / or wherein the second connection region (A2) is assigned a second set of second cooling channels (62), wherein the second cooling channels (61) of the set of second cooling channels (61) are preferably offset from one another in a direction perpendicular to the flow direction (St).

14. Cooling device (1) according to one of the preceding claims, wherein the base body (2) is composed of a plurality of layers (71) with one or more recesses.

15. A method for producing a cooling device (1) according to one of the preceding claims, comprising: Providing a plurality of layers (71) with one or more recesses, Stacking the layers (71) and Connecting the layers (71) in a bonding process to form the base body (2) with the cooling channel system.

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