Plant and method for processing slabs

Abstract

A method for processing slabs (T) comprising: - advancing a slab (T) along an advancement direction (A); - delivering an amount of a product for treating the surface (S) of the slab (T), preferably in a fluid state; - polishing the surface (S) of the slab (T) by means of a tool (20) during the advancement of the slab; - detecting a temperature value of the surface (S) of the slab (T) during the polishing processing thereof and after / during the delivery of the treatment product; - controlling at least one operating parameter of the tool and / or the treatment product so that the detected temperature value remains within a reference range, comprised between a minimum and a maximum value, wherein the reference range is pre-set based on the type and / or composition of the treatment product delivered; - detecting at least one map or image or matrix of at least one parameter indicative of the morphology and / or processing quality of the surface of the slab following the processing performed by the tool; and - changing the reference range if a processing defect attributable to the processing and / or the treatment product is identified in the map or image or matrix detected.

Description

TECHNICAL FIELD

[0001] The present invention relates to the field of processing ceramic slabs, such as ceramic material slabs, porcelain stoneware slabs, natural stone slabs and the like.

[0002] In particular, the invention relates to a method for controlling a plant for processing slabs and the relative plant.PRIOR ART

[0003] Plants are known for the processing of ceramic slabs (slabs of ceramic material, porcelain stoneware, natural stone slabs and the like), for example for the finishing thereof, which generally comprise at least one conveyor adapted to provide a support plane for the slabs, which is movable along a predetermined advancement direction, and one or more tools each of which is adapted to intercept the slab, by means of a respective working head placed under pressure in contact with a surface of the slab itself, so as to operate the needed processing.

[0004] These plants generally end with a polishing machine, which is configured to deliver a treatment product (for example a so-called "wax") which, spread by the mechanical friction action of the tools (provided with appropriate pads), solidifying by thermal effect adheres permanently to the surface of the slabs, helping to raise their shine (i.e. the gloss degree) and, at the same time, occluding any open porosities and protecting the ceramic slabs themselves from physical chemical attacks.

[0005] These treatment products each have a predetermined temperature range declared by the manufacturer within which it is necessary to bring the treatment product (due to the aforesaid friction) in order for it to solidify / polymerize optimally.

[0006] If the temperature reached during processing is not sufficient, in fact, the treatment product does not solidify properly, if instead the temperature exceeds a maximum value then the treatment product may solidify before time and / or may vary its colouration (for example it yellows) making the treatment ineffective and / or unsatisfactory.

[0007] A need felt in the sector is to allow an increasingly accurate control of the processing, so as to be able to compensate for any processing variables and alterations with respect to the expected behaviour of the treatment product that may occur for various reasons during processing.

[0008] An object of the present invention is to satisfy these (other) needs of the prior art, within the framework of a simple, rational and low cost solution.DISCLOSURE OF THE INVENTION

[0009] This object is achieved by the features of the invention set out in the independent claims. The dependent claims outline preferred and / or particularly advantageous aspects of the invention.

[0010] The invention, in particular, makes available a method for processing slabs comprising: advancing a slab along an advancement direction; delivering an amount of a product for treating the surface of the slab, preferably in a fluid state; polishing said surface of the slab by means of a tool, during the advancement of the slab and after / during the delivery of the treatment product; detecting a temperature value of the surface of the slab during the polishing thereof; controlling that the detected temperature value remains within a reference range, comprised between a minimum and a maximum value, wherein the reference range is pre-set based on the type and / or composition of the treatment product delivered (i.e. more precisely controlling at least one operating parameter of the tool and / or the treatment product so that the detected temperature value remains within a reference range, comprised between a minimum and a maximum value, wherein the reference range is pre-set based on the type and / or composition of the treatment product delivered); detecting / deriving at least one map or image or matrix of at least one parameter indicative of the morphology and / or processing quality of the surface of the slab following the polishing performed by the tool; and changing the reference range if a processing defect attributable to the polishing and / or the treatment product is identified in the map or image or matrix detected.

[0011] Thanks to this solution, it is possible to allow an increasingly accurate control of the processing, so as to be able to compensate for any processing variables and alterations with respect to the expected behaviour of the treatment product that may occur for various reasons during processing.

[0012] In fact, it has been observed that, if the proper reference range of the treatment product is not correct or, for various reasons (environmental and / or plant conditions and / or the tools used), the treatment product solidifies / cures within thermal ranges different from those indicated by the manufacturer, the treatment product solidifies in patches on the surface of the slab leaving stains / patches in relief on it.

[0013] Varying / adjusting the reference range if such a defect is found, allows to prevent / limit the formation and / or repetition of such defects on the batch of slabs being processed, increasing the overall efficiency of the plant and / or the method.

[0014] Advantageously, the aforesaid step of controlling may comprise: comparing the detected temperature value with the reference range (for example the one that is updated / modified if necessary); and adjusting at least one operating parameter of the tool and / or the treatment product, if said detected temperature value is outside the reference range.

[0015] In particular, the method makes it possible to adjust the operation of the processing tool both when the temperature detected is too high, so as to prevent damage to the tool itself and therefore the manufacture of slabs that do not correspond to the required quality standards, and when the temperature is too low, an indication of ineffective processing that would also lead to the manufacture of slabs that are not correctly processed and therefore to be discarded.

[0016] Another aspect of the invention envisages that performing said processing may provide for: arranging the tool in movement, preferably in rotation and / or roto-translation, in contact with the surface of the slab on which the treatment product was delivered, at a given working pressure value.

[0017] Thanks to this solution, the method allows to obtain a surface finish of the slab in a controlled manner.

[0018] In particular, such surface finishing processing allows to obtain a polishing effect (gloss) of the surface of the slab, for example an upper or visible surface thereof, and a protection of the same from stains and in general from chemical attack.

[0019] Yet another aspect of the invention envisages that operating said adjustment may provides for at least one of the following steps: varying the amount of product delivered on the surface of the slab (for example within an operating range between a minimum threshold value and a maximum threshold value); and / or varying the working pressure value of the head of the tool (for example within an operating range comprised between a lower threshold value and an upper threshold value).

[0020] Thanks to this solution, the method allows to operate the adjustment alternatively or in combination of several processing parameters of the tool, so as to allow a versatile adjustment of the processing which is performed based on the detected temperature.

[0021] In particular, the method may provide for varying either between the amount of product delivered and the working pressure value if the detected temperature value is greater than the maximum value, and the difference between the detected value and the maximum value is less than or equal to a predetermined value, or it may provide for varying both the amount of product delivered and the working pressure value if the detected temperature value is greater than the maximum value and the difference between the detected value and the maximum value is greater than said predetermined value. Similarly, the method may provide for varying either between the amount of product delivered and the working pressure value if the detected temperature value is less than the minimum value, and the difference between the detected value and the minimum value is less than or equal to a predetermined value, or it may provide for varying both the amount of product delivered and the working pressure value if the detected temperature value is less than the minimum value, and the difference between the detected value and the minimum value is greater than said predetermined value.

[0022] A further aspect of the invention envisages that the method may further provide for waiting for a predetermined period of time between an adjustment operation and a subsequent adjustment operation.

[0023] Thanks to this solution, the method allows the temperature of the processed surface to be adjusted once the adjustment operation has been performed before possibly making a subsequent adjustment where the temperature is still outside the reference range. Still, a further aspect of the invention envisages that operating said adjustment may provide to vary the value of the working pressure within the operating range if the amount of product delivered is equal to the maximum threshold value.

[0024] Thanks to this solution, the method allows to operate first exclusively by adjusting the amount of product delivered, and only later to operate an adjustment of the working pressure if the detected temperature continues to be outside the reference range, so as to act retroactively with a single adjustment operation at a time.

[0025] Another aspect of the invention envisages that operating said adjustment may provide to vary the amount of product delivered on the surface of the slab within the operating range if the working pressure value of the head of the tool is equal to the upper threshold value. Thanks to this solution, the method allows to operate first exclusively by adjusting the value of the working pressure, and only later to operate a variation in the amount of product delivered, so as to try where possible to minimize the amount of product delivered (avoiding waste) and therefore the processing costs.

[0026] Advantageously, the method may comprise analysing the detected map or image or matrix to identify any processing defects, wherein each processing defect is a localised defect on one or more areas of the analysed map or image or matrix, preferably traceable to a localised machine in relief and / or with a polishing degree below a predetermined reference polish value (wherein a crystallization of the treatment product is observed on the upper surface of the slab).

[0027] Furthermore, by changing the reference range, it may be intended to decrease said maximum value of the reference range.

[0028] For the same purposes as set out above, the invention further makes available a plant for processing slabs comprising: a conveyor provided with a support plane movable along an advancement direction, wherein said support plane is configured to support at least one slab; a delivery device configured to deliver a given amount of a treatment product, preferably in a fluid state, onto the surface of the slab; at least one tool adapted to polish a surface of the slab during the advancement of the slab along the advancement direction; at least one sensor device configured to detect a surface of the slab; at least one detection device configured to detect at least one map or image or matrix of at least one parameter indicative of the morphology and / or processing quality of the surface of the slab following the polishing performed by the tool; and an electronic control apparatus configured to perform the method described above.

[0029] Thanks to this solution, the invention allows to operate the processing of slabs, at the same time monitoring the correct operation of the plant so as to correct the ongoing processing in order to avoid both damage to the tool and the manufacture of slabs that do not comply with the required quality standards and therefore to be discarded. Another aspect of the invention provides that the tool can comprise a head provided with polishing pads and adapted to stay in contact with the surface of the slab, the head being rotatable around an axis of rotation and / or revolution orthogonal to the support plane and / or movable in translation along a direction orthogonal to the support plane and orthogonal to the advancement direction.

[0030] For example, the delivery device may be arranged near / at the tool.

[0031] For example, the tool can be movable along a direction towards / away from the support surface which is substantially orthogonal to the support plane, by means of an actuator operated by a pressure regulating device.

[0032] Yet another aspect of the invention provides that the temperature detecting device may comprise a laser pyrometer.

[0033] Thanks to this solution, the plant is provided with a non-contact temperature detector, which is also particularly effective and robust.

[0034] A further aspect of the invention provides that the plant may further comprise a protection apparatus of the temperature detecting device.

[0035] Thanks to this solution, the temperature detecting device is protected from dust or waxes that are usually created during slab processing and that could otherwise alter or completely compromise the operation thereof.

[0036] Advantageously, the detection device may comprise at least one of a scanner and a glossmeter, and is configured to map the entire surface of the slab advancing along the advancement direction and generate a map or image or matrix of at least one parameter indicative of the morphology and / or the degree of polishing of the slab surface.BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Further features and advantages of the invention will be more apparent after reading the following description provided by way of a non-limiting example, with the aid of the figures illustrated in the accompanying drawings. Figure 1 is a schematic front view from above of a plant according to the invention. Figure 2 is a schematic sectional view along the trace II-II of Figure 1. Figure 3 is a schematic sectional view along the trace III-III of Figure 1. Figure 4 is a view of a block diagram of the plant. DETAILED DESCRIPTION

[0038] With particular reference to these figures, a plant for processing slabs T, such as slabs T of ceramic material, tiles (for example in porcelain stoneware), slabs T of natural stone and the like, globally indicated with the letter, has been indicated globally with 10. Preferably, the plant 10 is configured to perform a surface finishing process in a continuous manner, such as for example polishing, of said slabs T.

[0039] In particular, such surface finishing processing (polishing) can be aimed at obtaining the polishing of the slab T and at the same time the protection thereof from stains and chemical agents in general, for example by applying a treatment product (also called wax) to be evenly spread on a surface (previously ground and / or mechanically lapped).

[0040] Each slab T has substantially a shape of a parallelepiped with a reduced height (thickness) and a substantially quadrangular base (in plan), for example rectangular or square, i.e. has two opposite major surfaces of which a lower surface and an upper surface S or visible surfaces, and four connecting flanks between the upper surface and the lower surface of which two first flanks are opposite and substantially parallel and two second flanks adjacent to the first flanks and opposite to each other and substantially parallel. The plant 10 comprises at least one polishing machine 100, which is configured to polish (by applying a treatment product, as will be better described below) a surface, for example the upper surface S, of the slab T.

[0041] For example, the plant 10 - as known to the person skilled in the art - comprises one or more grinding and / or lapping machines, for example placed upstream of the polishing machine with respect to an advancement direction of the slabs T along the production line of the plant 10, which are adapted to grind and / or lap, with appropriate abrasive tools, the surface, for example the upper surface S, of the slab T intended to be then polished by the polishing machine 100.

[0042] For example, between the grinding and / or lapping machine(s) and the polishing machine 100 there may be a (chemical) pickling machine, configured to pickle (for example with alcoholic substances) the upper surface S, of the slab T intended to be then polished by the polishing machine 100.

[0043] The plant 10, in particular the polishing machine 100, first of all comprises a conveyor 15, which is provided with a support frame and a support plane, for example substantially horizontal, on which one or more slabs T can be placed.

[0044] For example, the support frame can be defined by two lateral flanks, parallel and mutually opposite, between which the support plane can be interposed.

[0045] The conveyor 15 further comprises an actuation group (not illustrated) configured to move the support plane, and thus advance the one or more slabs T arranged thereon, along an advancement direction A parallel to the support plane, for example substantially horizontal, and parallel to the lateral flanks of the support frame.

[0046] For example, the conveyor 15 may be a tape or belt conveyor 15 or, alternatively, a roller conveyor 15 or other.

[0047] The actuation group may comprise one or more electric motors adapted to rotate the rollers or pulleys around which said tape or belt is wound.

[0048] The slabs T are therefore arranged with their lower (or laying) surface restingly and in contact with the support plane itself and the opposite (or visible) upper surface S turned upwards and, for example, with the first flanks parallel to the advancement direction A. The plant 10, in particular the polishing machine 100, further comprises at least one tool 20, preferably a plurality of tools, for example arranged in succession to each other along the advancement direction A, each of which is adapted to carry out a polishing processing of a surface of the slab T, for example a surface finishing (polishing) processing of the upper (or visible) surface S of the slab T.

[0049] For example, the plant 10, in particular the polishing machine 100, comprises a plurality of tools 20 which are fixed to a longitudinal beam 25, (having a longitudinal axis) parallel to the advancement direction A, which keeps the various tools 20 suspended on the support plane, superimposed in plan on the support plane at a non-zero distance from it, at an adjustable height, for example manually or automatically, as a function of the thickness of the slab T to be processed.

[0050] The longitudinal beam 25 is moreover movably associated with the support frame, for example moved in oscillation / swinging horizontal translation in a direction of horizontal oscillation orthogonal to the advancement direction A by at least one suitable motor, for example at variable speed and / or adjustable as a function of the desired surface finish on the slab T.

[0051] Each tool 20 is adapted to come into contact with said surface of the slab T (for example said upper surface S) during the advancement thereof along the advancement direction A so as to perform the needed polishing processing.

[0052] For example, each tool 20 is adapted to come into contact with the upper (visible) surface S of the slab T so as to perform a surface finishing operation.

[0053] Each tool 20 comprises a linear actuator provided with a body associated with the support frame, i.e. rigidly fixed to the longitudinal beam 25, and with a stem movable along a direction transverse, for example orthogonal, to the support plane.

[0054] At an end of the movable stem distal from the body of the linear actuator, a working head is connected, for example a polishing head, which is placed in rotation around a transverse axis, for example substantially orthogonal, to the support plane by means of a respective movement unit known per se and not described in detail.

[0055] The working head is provided with a plurality of pads, for example made of (non-abrasive) fabric, configured to polish (by friction) the upper surface S of the slab T advancing along the advancement direction A.

[0056] The movable stem of the linear actuator, moving along said direction orthogonal to the support plane, moves the working head towards / away from the support plane of the conveyor 15, so as to bring it into contact with the slab T advancing along the advancement direction A and under pressure on the upper surface S thereof for performing said surface finish.

[0057] Each tool 20 is also provided with a pressure regulating device 30, in itself known to the person skilled in the art and therefore not described in detail, which, by operating the linear actuator, allows to adjust a working pressure value of the working head of the tool 20 on the slab T resting on the support plane.

[0058] In other words, the pressure regulator, by varying the working pressure, varies the thrust (along said direction orthogonal to the support plane in the direction towards it) that the linear actuator imprints, by means of the stem of the linear actuator, on the working head towards the support plane and therefore against the surface of the slab T to be processed (finished) (for example the upper surface S).

[0059] More precisely, by increasing the working pressure value there is a greater thrust, by decreasing the working pressure value there is a lesser thrust.

[0060] The plant 10, in particular the polishing machine 100, and / or one or more of the tools 20 (preferably each tool 20) further comprises a delivery device 35 of a treatment product, which is configured to deliver a predetermined amount of said treatment product, for example in the fluid state (at room temperature), on the surface to be processed of the slabs T resting on the support plane and being processed under the working head.

[0061] For example, said treatment product is a chemical product in the fluid state, preferably liquid, which - once spread, solidified and polished is irreversibly anchored to the upper surface S of the slab T and generates a gloss (polishing) effect on the processed surface of the slab T, for example said upper (visible) surface S, also acting as protection thereof from stains and from attack by chemical agents in general.

[0062] The treatment product delivered on the upper surface S of the slab T is applied thereon (spread evenly), so as to form a thin film / layer that covers the entire upper surface S of the slab T (for example evenly or to fill any morphological defects thereof), for example due to the mechanical (non-abrasive) rubbing of the tools 20 on the upper surface S of the slab T in the relative motion between them and the slab T.

[0063] Each delivery device 35 comprises a pumping unit connected to a tank of said treatment product and configured to withdraw said predetermined amount of treatment product.

[0064] The pumping unit is also configured to introduce said amount of treatment product into an inflow channel that ends in a delivery mouth, which is placed near the working head (for example within the space surrounded by the pads thereof), which defines a nozzle from which the direct treatment product exits (for example orthogonally) on the surface to be processed of the slab T.

[0065] The delivery mouth is for example placed in a central position, preferably coaxial, with respect to the axis of rotation of the working head.

[0066] The rise in the temperature of the treatment product, caused by the friction caused by the tools 20 on the upper surface S of the slab T, when applying the treatment product on the upper surface thereof, causes - for example by polymerisation of the treatment product the solidification of the treatment product itself, for example of the film of treatment product that covers the entire upper surface S of the slab T, thereby the solidified treatment product adhering in an irremovable and permanent manner to the upper surface S of the slab T which it completely covers.

[0067] At the same time, the polishing effect of the treatment product thus spread by means of the tools 20 (and solidified and / or polished in situ) brings the upper surface S of the slab T from gloss / polish values lower than 70 GLOSS (before the aforesaid processing of application of the treatment product by means of the tools 20) to gloss / polish values higher than 95 GLOSS, for example comprised between 95 GLOSS and 100 GLOSS, (after the aforesaid processing of application of the treatment product by means of the tools 20). The plant 10, in particular the polishing machine 100, still comprises at least one sensor device P, for example associated with one of the tools 20 or in any case arranged above the support plane on which the slabs T transit, which is configured to detect (values of) a temperature of the upper surface S of the slab T during the processing phase carried out by one or more of the tools 20.

[0068] In practice, the sensor device P is configured to detect (and measure) the temperature of the upper surface S of the slab T, which temperature (is greater than the room temperature e) rises due to the rubbing (friction) between (the pads of) the tools 20 and the upper surface S of the slab T (with interposition of the aforesaid treatment product). Preferably, the plant 10, in particular the polishing machine 100, comprises a plurality of sensor devices P each of which is associated with a respective tool 20 of the plurality of tools 20, for example at least one detector device P for each tool 20.

[0069] Each sensor device P is configured to detect a respective temperature of the upper surface S of the slab T during processing operated by the respective tool 20 (i.e. raised by the rubbing of the respective tool 20 thereon).

[0070] Each sensor device P is preferably configured to detect the temperature of the surface of the slab T without contact (with it), i.e. remaining arranged at a non-zero distance from it. For example, each sensor device P may be configured to detect the temperature of the upper surface S of the slab T by remaining arranged at a distance (along a direction substantially orthogonal to the upper surface S itself) therefrom up to 1200 mm or even higher.

[0071] Still, each sensor device P may be configured to detect a temperature in a thermal range comprised between -30 °C and 1000 °C.

[0072] Preferably, each sensor device P comprises (or consists of) a laser pyrometer, preferably arranged so that the emitted laser beam strikes substantially orthogonally to the support plane (i.e. to the upper surface S of the slab T).

[0073] Each sensor device P is, for example, arranged at / near a respective tool 20, superimposed on the movable support plane and facing it (at a non-zero distance from the support plane).

[0074] For example, each sensor device P may be fixed to the longitudinal crossbar (and movable therewith) at / near a respective tool 20.

[0075] Furthermore, each sensor device P is preferably arranged at a distance from the support plane, with respect to a direction orthogonal to the support plane itself, of less than or equal to 500 mm.

[0076] The plant 10 also comprises a protection apparatus 40 of the sensor device P, configured to obviate the possibility that processing scraps (such as dusts or splashes of treatment product), which are normally generated during the processing of the slab T, may bother / disrupt the sensor device P and alternate and / or compromise its correct operation. For example, the plant 10, in particular the polishing machine 100, comprises a plurality of protection apparatuses (one for each sensor device P) each of which is associated with a respective sensor device P of the plurality of sensor devices P.

[0077] Each protection apparatus 40 may comprise a casing, selectively associable with the sensor device P, for example by means of screwing means, adapted to at least partially accommodate the sensor device P.

[0078] More precisely, the protection apparatus 40 is adapted to accommodate at least the portion of the detector device P facing the support plane.

[0079] Each protection apparatus 40 can have, for example, a through cavity that allows the sensor device P to face the upper surface S of the slab T to be processed in order to detect its temperature, for example in order to allow the laser beam emitted by the sensor device P to hit on the support plane, or on the upper surface S (being processed) of the slab T resting thereon.

[0080] Each protection apparatus 40 then comprises pneumatic means associated with the casing and configured to introduce into it a flow of compressed air, preferably a continuous flow, which, introduced into the casing and exiting through the through cavity, allows to avoid the deposition of processing scraps on the sensor device P, for example at a lens of the pyrometer through which the laser beam is emitted.

[0081] The plant 10 further comprises a detection device 50 configured to detect at least one map (or image) or matrix of at least one parameter indicative of the morphology and / or processing quality of the surface of the slab following the processing performed by the tool.

[0082] The detection device 50 is, for example, arranged downstream of the polishing machine 100 in the advancement direction of the slabs T in the advancement direction A.

[0083] The detection device 50 is, for example, a device for detecting polishing defects on a slab in movement (i.e. substantially a scanner), for example such as the one as described in Italian Patent Application No. 102022000019575 which is intended herein incorporated by reference, and / or a device for measuring a parameter indicative of a polishing degree of a slab in movement (i.e. substantially a glossmeter), for example such as the one as described in Italian Patent Application No. 102021000028331 which is intended hereby incorporated by reference.

[0084] For example, the detection device 50, of the type of a device for detecting polishing defects, is configured to detect an image (or map) of the entire upper surface S of the slab T that transits below it (along the advancement direction A), with a detection apparatus arranged at a predetermined (fixed) distance from the upper surface S of the slab T in transit on the support plane (i.e. at a height with respect to the support plane 21 variable as a function of the thickness of the slabs T in transit on it).

[0085] In practice, the detection apparatus of said detection device 50 is configured to detect an image or map of the entire (illuminated) surface L1 of the slab T, both in width and in length, while the slab T transits below it during the relative motion between slab T (in motion on the support plane) and detection apparatus 40.

[0086] The detection device 50 is for example equipped with a processor module, such as for example a microprocessor or a processor, and a memory module, which is preferably configured to detect polishing defects on any (and each) upper surface S of the slab T in transit on the support plane (and scanned by the detection apparatus), for example in the image or map obtained by scanning the entire upper surface S of the slab T.

[0087] In particular, the (electronic) processor module for each slab T, is configured to receive / acquire, from the detection apparatus, as input, an image or map of the (entire) upper surface S; and analyse (each) image or map received, for example with an appropriate image and / or map analysis software.

[0088] In practice, the processor module is configured to identify (at least) a processing defect (attributable to the processing and / or the treatment product on the upper surface S of the slab T), for example a defect chosen from the group comprising or consisting of scratches, gouges, grooves, holes, depressions (or reliefs), shadows or the like, in the detected image or map.

[0089] For example, the processing defect is represented in the image or map detected by means of one or more pixels or areas having a colour parameter (e.g. colour or intensity or other) different from the background (prevailing colour).

[0090] As to the detected processing defect, the processor module may be configured to determine / calculate / measure shape, dimensions (e.g. one or more of the dimensions of length, width, area or other) and intensity (which is a parameter indicative of the depth / height of the detected defect) and / or position (on a virtual XY Cartesian system of the image and, therefore, of the surface L1 of the slab T).

[0091] Still, the identifying step may comprise a step of discriminating / recognizing a surface defect, as defined above, of the upper surface S between a defect of the upper surface of the slab T (such as scratches or holes or the like) from a defect of the treatment product (such as depressions, yellowings, reliefs having shapes and dimensions typical of stains or halos deposited on the upper surface S of the slab T).

[0092] For example, to discriminate / recognize the defects present in the image and / or map acquired, the processor module can be programmed by means of an artificial intelligence algorithm (for example machine learning, i.e. a machine learning algorithm) previously trained in an appropriate manner.

[0093] For example, the detection device 50, of the type of a device for measuring a parameter indicative of a polishing degree of a slab in movement, is configured to determine the (Gloss, preferably Gloss 60) values of the parameter indicative of the polishing degree of the upper surface S of the slab T for the entire dimension of the upper surface S of the slab T.

[0094] In particular, the detection device 50 (with its own measuring apparatus, of the type of one or more glossmeters), for each slab T, is configured to receive, from the measuring apparatus, as input the measurement values (of the intensity I of the reflected light beam and the reference values of intensity I of the emitted light beam) and provide as output an image / map or heat map (two-dimensional or three-dimensional), in which the (Gloss, preferably Gloss 60) values of the parameter indicative of the polishing degree of the upper surface S of the slab T for the entire dimension thereof are reported.

[0095] Each value range (Gloss, preferably Gloss 60) of the parameter indicative of the polishing degree in the image / map can be associated with a relative reference colour.

[0096] The detection device 50 is for example equipped with a processor module, such as for example a microprocessor or a processor, and a memory module, which is preferably configured to detect polishing defects on any (and each) upper surface S of the slab T in transit on the support plane (and scanned by the detection apparatus), for example in the image / map obtained by scanning the entire upper surface S of the slab T.

[0097] In particular, the (electronic) processor module for each slab T, is configured to receive / acquire, from the detection apparatus, as input, an image or map of the (entire) upper surface S; and analyse (each) received image / map, for example with an appropriate image and / or map analysis software.

[0098] In practice, the processor module is configured to identify (at least) a processing defect (attributable to the processing and / or the treatment product on the upper surface S of the slab T), for example a defect chosen from the group comprising or consisting of scratches, gouges, grooves, holes, depressions (or reliefs), shadows or the like, in the detected image or map defined in the map as an area with a (much) lower degree of localised polishing (Gloss) (compared to the average of the other parts).

[0099] For example, the processing defect is represented in the image or map detected by means of one or more pixels or areas having a colour parameter (e.g. colour or intensity or other) different from the background (prevailing colour).

[0100] As to the detected processing defect, the processor module may be configured to determine / calculate / measure shape, dimensions (e.g. one or more of the dimensions of length, width, area or other) and intensity (which is a parameter indicative of the depth / height of the detected defect) and / or position (on a virtual XY Cartesian system of the image and, therefore, of the surface L1 of the slab T).

[0101] Still, the identifying step may comprise a step of discriminating / recognizing a surface defect, as defined above, of the upper surface S between a defect of the upper surface of the slab T (such as scratches or holes or the like) from a defect of the treatment product (such as depressions, yellowings, reliefs having shapes and dimensions typical of stains or halos deposited on the upper surface S of the slab T).

[0102] For example, to discriminate / recognize the defects present in the image and / or map acquired, the processor module can be programmed by means of an artificial intelligence algorithm (for example machine learning, i.e. a machine learning algorithm) previously trained in an appropriate manner.

[0103] The plant 10 further comprises a (electronic) control apparatus 60 configured to command and control the (automatic or semi-automatic) operation of the plant 10.

[0104] The control apparatus 60 comprises first of all an electronic control unit (of the type of a suitably programmed processor), provided with a memory unit, which is operationally connected to the plant 10 and configured to control the operation of the plant 10 itself as will be shown below.

[0105] In particular, the electronic control unit of the control apparatus 60 is operationally connected to the actuation group of the conveyor 15, to each sensor device P, to each tool 20, i.e. to each linear actuator, to each delivery device 35, to each working head movement assembly and to each pressure regulating device 30 of each tool 20 (and to any other actuator and / or motor and / or sensor possibly connected to the tool 20), to the at least one motor that moves the longitudinal beam 25, to each protection apparatus 40 (or to the pneumatic means thereof), as well as to any other actuator and / or motor and / or sensor possibly present.

[0106] Furthermore, the electronic control unit of the control apparatus 60 is operationally connected to the detection device 50 (i.e. to its processor module).

[0107] A (initial) temperature range can be stored / set in the control apparatus 60, which is comprised between a minimum value and a maximum value, based on the type and / or composition of the treatment product to be used for processing.

[0108] For example, the initial (or theoretical) temperature range is the one that is indicated for the determined treatment product by the relevant manufacturer (within which the solidification / polymerization of the treatment product is theoretically optimal).

[0109] In addition, a predetermined amount of treatment product to be used for the specific processing can be stored / set in the control apparatus 60.

[0110] At this point, the control apparatus 60 can command and / or control the operation of the plant 10 (i.e. of the polishing machine 100), to perform said processing on the upper surface S of the slab T.

[0111] In particular, by commanding and / or controlling the advancement of the slabs T on the support plane, along the advancement direction A, the movement of the tools 20 (placed in rubbing contact on the upper surface S of the slab T) and the delivery of the predetermined amount of a treatment product on the surface S of the slab T are simultaneously commanded.

[0112] During processing, the electronic control unit of the control apparatus is configured to detect / measure (for each tool 20) a temperature value (by means of the respective sensor device P), i.e. the current temperature of the upper surface S of the slab T (being processed).

[0113] Further, the electronic control unit of the control apparatus 60 is configured to control that the detected temperature value remains within the reference range (initially set).

[0114] In particular, the electronic control unit of the control apparatus 60 compares the detected temperature value with the reference range (extremes included) and, if the detected temperature value is outside the reference range, i.e. lower than the minimum value or greater than the maximum value, then the electronic control unit of the control apparatus 60 is configured to operate an adjustment of at least one operating parameter of the tool 20 and / or of the treatment product.

[0115] In particular, the electronic control unit can be configured to, alternatively or in combination, vary (increase or decrease by a predetermined and pre-set or pre-settable amount in the memory unit, by operating / stopping the delivery of the delivery device 35), starting from the initial (or previously set) amount, the amount of product delivered onto the surface (being processed, for example the upper surface S) of the slab L within an operating range comprised between a minimum threshold value and a maximum threshold value (pre-set or pre-settable in the memory unit) and / or to vary (by a predetermined and pre-set or pre-settable increase or decrease in the memory unit) the working pressure value of the head of the tool 20 (by means of the pressure regulating device 30 that operates the linear actuator), starting from an initial (or previously set) predetermined and pre-set or pre-settable pressure value in the memory unit of the electronic control unit, within an operating range comprised between a lower threshold value and an upper threshold value (predetermined and pre-set or pre-settable in the memory unit).

[0116] More in detail, when a slab T to be processed arrives at a tool 20, the electronic control unit is configured to operate the tool 20 through the pressure regulating device 30 so as to bring the head of the tool 20 into abutment on the surface to be processed of the slab at the initial (or set) working pressure value.

[0117] At the same time, the electronic control unit is configured to operate the delivery device 35 which will begin to deliver the treatment product until said initial (or set) amount is reached.

[0118] If during the processing of the surface of the slab L the electronic control unit detects by means of the sensor device P a temperature value of the upper surface S of the slab L lower than the minimum value, then it can be configured to stop the delivery device 35 to terminate (in advance) the delivery of the treatment product, so as to overall deliver onto the upper surface S of the slab L an amount of treatment product lower than the initial (or previously set) amount.

[0119] Alternatively or in combination, if during the processing of the upper surface S of the slab T, the electronic control unit detects by means of the sensor device P a temperature value of the upper surface S of the slab T lower than the minimum value, then it can be configured to increase the working pressure value (of the head) of the tool 20 (by means of the pressure regulating device 30) so as to operate the same at a pressure value greater than the initial (or previously set) pressure value.

[0120] On the contrary, if during the processing of the upper surface S of the slab L the electronic control unit detects, by means of the sensor device P, a temperature value of the upper surface S of the slab L higher than the maximum value, then it can be configured to activate the delivery device 35 by prolonging the delivery (or in any case increasing the delivery) of the treatment product so as to overall deliver onto the upper surface of the slab T an amount of treatment product higher than the initial (or previously set) amount. Alternatively or in combination, if during the processing of the slab surface, the electronic control unit detects by means of the sensor device P a temperature value of the upper surface S of the slab L higher than the maximum value, then it can be configured to decrease the working pressure value (by means of the pressure regulator device 30) of the tool 20 so as to operate the same at a working pressure value lower than the initial (or previously set) pressure value.

[0121] For example, whenever the detected temperature value is outside the reference range, i.e. lower than the minimum value or greater than the maximum value, the electronic control unit can be configured to operate a predetermined and pre-set adjustment operation in the memory unit, (alternatively) choosing between the variation of the amount of treatment product delivered and the variation of the working pressure (of the head) of the tool 20.

[0122] That is, the electronic control unit can be configured (programmed) to operate only the variation of the amount of treatment product, whenever the detected temperature value is outside the reference range.

[0123] Or, the electronic control unit may be configured (programmed) to operate only the variation of the working pressure (of the head) of the tool 20 whenever the detected temperature value is outside the reference range.

[0124] Yet, the electronic control unit, if the detected value is lower than the minimum value, can be configured to calculate the difference (possibly in modulus) between the detected temperature value and the minimum value.

[0125] The electronic control unit can also be configured to compare said difference between the detected temperature value and the minimum value with a first reference amount (predetermined and pre-set or pre-settable in the memory unit of the electronic control unit).

[0126] For example, said first reference amount may be less than or equal to 30 °C, preferably equal to 10 °C.

[0127] The electronic control unit can therefore be configured to alternatively vary the amount of product delivered or the working pressure value, if the difference between the detected temperature value is equal to or less than said first reference amount (predetermined and pre-set or pre-settable in the memory unit of the electronic control unit).

[0128] In particular, if the detected temperature value is less than the minimum value, and the difference (possibly in modulus) between the detected temperature value and the minimum value is equal to or less than said first reference amount, the electronic control unit may be configured to alternatively decrease (by a predetermined and pre-set or pre-settable amount in the memory unit) the amount of treatment product delivered or increase (by a predetermined and pre-set or pre-settable increase in the memory unit) the working pressure value (of the head) of the tool 20.

[0129] Otherwise, the electronic control unit 45 may be configured to vary both the amount of product delivered and the working pressure value if the detected temperature value is less than the minimum value and the difference between the detected temperature value and the minimum value is greater than said first reference amount.

[0130] In particular, if the detected temperature value is less than the minimum value, and the difference (possibly in modulus) between the detected temperature value and the minimum value is greater than said first reference amount, the electronic control unit can be configured to simultaneously decrease (by a predetermined and pre-set or pre-settable amount in the memory unit) the amount of treatment product delivered and increase (by a predetermined and pre-set or pre-settable increase in the memory unit) the working pressure value of the head of the tool 20.

[0131] Similarly, the electronic control unit, if the detected value is greater than the maximum value, can be configured to calculate the difference (possibly in modulus) between the detected temperature value and the maximum value.

[0132] The electronic control unit may further be configured to compare said difference between the detected temperature value and the maximum value with a second reference amount (predetermined and pre-set or pre-settable in the memory unit of the electronic control unit).

[0133] For example, said second reference amount may be less than or equal to 30 °C, preferably it is equal to 10 °C.

[0134] The electronic control unit 45 can then be configured to alternately vary one of the amount of product delivered and the working pressure value if said difference between the detected temperature value and the maximum value is equal to or less than the second reference amount (predetermined and pre-set or pre-settable in the memory unit of the electronic control unit)

[0135] In particular, if the detected temperature value is greater than the maximum value and the difference (possibly in modulus) between the detected temperature value and the maximum value is less than or equal to said second reference amount, the electronic control unit may be configured to alternatively increase (by a predetermined and pre-set or pre-settable amount in the memory unit) the amount of treatment product delivered or decrease (by a predetermined and pre-set or pre-settable decrease in the memory unit) the working pressure value of the head of the tool 20.

[0136] Otherwise, if the detected temperature value is greater than the maximum value, and the difference between the detected temperature value and the maximum value is greater than said second reference amount, the electronic control unit may be configured to vary both the amount of treatment product delivered and the working pressure value.

[0137] In particular, if the detected temperature value is higher than the maximum value, and the difference (possibly in modulus) between the detected temperature value and the maximum value is greater than said second reference amount, the electronic control unit can be configured to simultaneously increase (by a predetermined and pre-set or pre-settable amount in the memory unit) the amount of treatment product delivered and decrease (by a predetermined and pre-set or pre-settable decrease in the memory unit) the working pressure value of the head of the tool 20.

[0138] Alternatively, it is possible to provide that the electronic control unit can be configured to repeat (each time the temperature value is outside the reference range) a same adjustment operation between the variation in the amount of treatment product and the variation in the working pressure value of the head of the tool 20 and, once the respective maximum threshold value or upper threshold value has been reached, to continue to adjust the operation of the tool 20 (each time the temperature value is outside the reference range) by operating the variation of the other between the amount of product delivered and the working pressure value of the head of the tool 20.

[0139] For example, it is possible to provide that the electronic control unit can be configured to vary (increase) the working pressure value of the head of the tool 20 within the operating range if, i.e. only from the moment when, the detected temperature value is lower than the minimum value and the amount of product delivered is equal to the minimum threshold value.

[0140] Or, it is possible to provide that the electronic control unit can be configured to vary (decrease) the working pressure value of the head of the tool 20 within the operating range if, i.e. only from the moment when, the detected temperature value is greater than the maximum value and the amount of product delivered is equal to the maximum threshold value.

[0141] Still, it is possible to provide that the electronic control unit can be configured to vary (decrease) the amount of product delivered on the surface of the slab T within the operating range if, i.e. only from the moment when, the detected temperature value is lower than the minimum value and the working pressure value of the working head of the tool 20 is equal to the upper threshold value.

[0142] Or, it is possible to provide that the electronic control unit can be configured to vary (increase) the amount of product delivered on the surface of the slab T within the operating range if, i.e. only from the moment when, the detected temperature value is greater than the maximum value and the working pressure value of the head of the tool 20 is equal to the lower threshold value.

[0143] The electronic control unit may be further configured to wait for a predetermined period of time between an adjustment operation and a subsequent adjustment operation.

[0144] In fact, once a first adjustment has been operated, the temperature value will not vary instantly but it will take a certain latency time before it can vary and possibly fall within the reference range.

[0145] The electronic control unit may, again, be configured to save (write) in the memory unit (e.g. in a database) each adjustment operation carried out.

[0146] In particular, the electronic control unit can be configured to save (write) in the memory unit, whenever the detected temperature value is outside the reference range, said detected temperature value.

[0147] The electronic control unit can also be configured to save (write) in the memory unit, the amount of treatment product delivered and the working pressure value of the head of the tool 20 corresponding to said detected temperature value outside the reference range (associating them with it, for example in an organized database saved in the memory unit).

[0148] The electronic control unit (whenever the detected temperature value is outside the reference range), can also be configured to save (write) in the memory unit the adjustment operation that has been carried out, i.e. if the amount of treatment product delivered (of the predetermined and pre-set or pre-settable amount in the memory unit) has been varied and / or if the working pressure of the head of the tool 20 has been varied (by the predetermined and pre-set or pre-settable increase or decrease in the memory unit). When the electronic control unit detects a temperature value outside the reference range, by means of the detector device P, it can also be configured to compare said detected temperature value with the temperature values outside the reference range previously detected and saved in the memory unit.

[0149] If the electronic control unit detects a match, then it may be configured to repeat the same adjustment operation that was carried out when that temperature value outside the reference range was detected the previous time.

[0150] The electronic control unit can also be configured to, each time it operates an adjustment operation, calculate the value of the variation of the temperature value that has been obtained following said adjustment operation, for example as a difference (possibly in modulus) between the temperature value detected after a predetermined period of time (pre-set or pre-settable in the memory unit) from the moment when said adjustment operation was operated and the temperature value outside the range that led to the execution of said adjustment operation.

[0151] The electronic control unit can then be configured to write (save) in the memory unit the value of the variation of the detected temperature value that has been obtained following said adjustment operation.

[0152] The electronic control unit may, again, be configured to compare said value of the variation of the temperature value obtained with a reference variation value (predetermined and pre-set or pre-settable in the memory unit of the electronic control unit).

[0153] In the event that, upon detection of a temperature value outside the reference range, the adjustment operation consists of an alternative variation of one of the amount of treatment product delivered and the pressure value of the tool 20, if the variation of the temperature value is lower than said reference variation value, the electronic control unit can be configured to, when it again detects said temperature value outside the reference range, operate the other between the variation of the amount of treatment product delivered and the variation of the pressure value of the tool 20 or to operate both the variation of the amount of treatment product delivered and the variation of the pressure value of the tool. In other words, the electronic control unit may be configured to check a match between a detected reference value outside the range and the detected values outside the range previously detected and saved in the memory unit.

[0154] If it detects a match, the electronic control unit can be configured to check which adjustment operation has been carried out.

[0155] If the adjustment operation carried out consisted of an alternative variation of one of the amount of treatment product delivered and the pressure value of the tool 20, then the electronic control unit may be configured to compare the value of the variation of the detected temperature value obtained following such adjustment operation with the reference variation value.

[0156] If the value of the variation is less than such a reference variation value, then the electronic control unit may be configured to operate the other between the variation of the amount of treatment product delivered and the variation of the pressure value of the tool 20 or to operate both the variation of the amount of treatment product delivered and the variation of the pressure value of the tool 20.

[0157] Particularly, the electronic control unit of the control apparatus 60 is configured to detect (through the detection device 50) the map or image or matrix of the parameter indicative of the morphology and / or processing quality of the slab surface following the processing operated by the tool.

[0158] If a processing defect attributable to the processing and / or the treatment product is identified in the map or image or matrix detected, as described above, then the electronic control unit of the control apparatus 60 is configured to modify the reference range (of the temperature) that had previously been set, i.e. modify / vary the minimum value and / or the maximum value of the reference range (on which to carry out the above-described control).

[0159] In practice, the electronic control unit defines a new reference range (to override the one previously set) for the given treatment product (to correct, by operating a retroactive control, the processing defect found in subsequent processing with the same treatment product).

[0160] Preferably, the electronic control unit of the control apparatus 60 provides to decrease, for example by a predefined range or value (for example by a few degrees °C), the maximum value of the reference range, actually decreasing the maximum temperature to which the treatment product is subjected during processing, to avoid that this may be excessive and thus reduce the risk of (premature and massive) solidification / polymerization of the treatment product.

[0161] For example, the electronic control unit may be configured to store such a new reference range (to be uniquely combined with the treatment product in use).

[0162] The electronic control unit can also be operationally connected to an interface 70 of the control apparatus, and configured to emit signals perceptible by an operator, such as visual signals (for example by means of a screen) and / or auditory signals or other.

[0163] For example, the interface 70 could comprise or consist of a PC with monitor or be of the type of a mobile device provided to an operator in charge of the plant 10.

[0164] In particular, the electronic control unit can be configured to generate an alarm signal (transmitted and emitted) by means of the interface 70, when at the same time the detected temperature value is outside the reference range, the amount of treatment product is equal to the minimum threshold value or the maximum threshold value, and the pressure value of the tool 20 is equal to the lower threshold value or the upper threshold value. More precisely, the electronic control unit can be configured to generate said alarm signal (transmitted and emitted) by means of the interface 70, when at the same time the detected temperature value is lower than the minimum value, the amount of treatment product is equal to the minimum threshold value and the pressure value of the tool 20 is equal to the upper threshold value.

[0165] Furthermore, the electronic control unit can be configured to generate said alarm signal (transmitted and emitted) by means of the interface 70, when at the same time the detected temperature value is higher than the maximum value, the amount of treatment product is equal to the maximum threshold value and the pressure value of the tool 20 is equal to the lower threshold value.

[0166] For example, said alarm signal may be an electrical signal transmitted by the electronic control unit to the interface 70 and switched therefrom into an audio or video or audio / video signal.

[0167] Still, via the interface 70, the electronic control unit can be configured to receive, as a work start input (i.e. as an initial setting), a plurality of operating parameters of the plant 10.

[0168] For example, via the interface 70, the electronic control unit can receive as input the standard pressure value of the head of the tool 20 and / or the standard amount of treatment product to be delivered and / or the amount by which the amount of treatment product delivered must be varied in an adjustment operation and / or the increase / decrease by which the working pressure of the head must be varied in an adjustment operation and / or the first reference amount and / or the second reference amount and / or the minimum value and the maximum value that define the reference range and / or the minimum threshold value and the maximum threshold value and / or the lower threshold value and the upper threshold value and / or the reference variation value and / or possibly said single predetermined adjustment operation to be performed between the variation of the amount of treatment product delivered and the variation of the working pressure of the head of the tool 20 and / or any other operating parameter of the plant 10.

[0169] Furthermore, it is possible to provide that via the interface 70 the electronic control unit makes available information relating to the modified (i.e. updated) reference range. Downstream of the tools 20, along the advancement direction A, the plant 10 and / or the polishing machine 100 may further comprise an apparatus for washing slabs T.

[0170] The invention thus conceived is susceptible to many modifications and variants, all falling within the same inventive concept.

[0171] Moreover, all details can be replaced by other technically equivalent elements.

[0172] In practice, the materials used, as well as the contingent shapes and sizes, can be whatever according to the requirements without for this reason departing from the scope of protection of the following claims.

Claims

1. A method for processing slabs (T) comprising: - advancing a slab (T) along an advancement direction (A); - delivering an amount of a product for treating the surface (S) of the slab (T), preferably in a fluid state; - polishing said surface (S) of the slab (T) by means of a tool (20), during the advancement of the slab and after / during the delivery of the treatment product; - detecting a temperature value of the surface (S) of the slab (T) during the polishing thereof; - controlling at least one operating parameter of the tool and / or the treatment product so that the detected temperature value remains within a reference range, comprised between a minimum and a maximum value, wherein the reference range is pre-set based on the type and / or composition of the treatment product delivered; - detecting at least one map or image or matrix of at least one parameter indicative of the morphology and / or processing quality of the surface of the slab following the polishing performed by the tool; and - changing the reference range if a processing defect attributable to the polishing and / or the treatment product is identified in the map or image or matrix detected.

2. The method according to claim 1, wherein controlling comprises: - comparing the detected temperature value with the reference range; and - adjusting said at least one operating parameter of the tool (20) and / or the treatment product, if said detected temperature value is outside the reference range.

3. The method according to claim 1, wherein said polishing involves: - arranging the tool (20) in movement, preferably in rotation and / or roto-translation, in contact with the surface (S) of the slab (T) on which the treatment product was delivered, at a given working pressure value.

4. The method according to claim 2, wherein operating said adjustment involves at least one of the following steps: - varying the amount of product delivered onto the surface (S) of the slab (T); and / or - varying the working pressure value of the head of the tool (20).

5. The method according to claim 1, further comprising analysing the detected map or image or matrix to identify any processing defects, wherein each processing defect is a localised defect on one or more areas of the analysed map or image or matrix, preferably traceable to a localised machine in relief and / or with a polishing degree below a predetermined reference polish value.

6. The method according to claim 1 or 5, wherein changing the reference range comprises decreasing said maximum value of the reference range.

7. A plant (10) for processing slabs (T) which comprises: - a conveyor (15) provided with a support plane movable along an advancement direction (A), wherein said support plane is configured to support at least one slab (T); - a delivery device (35) configured to deliver a given amount of a treatment product, preferably in a fluid state, onto the surface (S) of the slab (T); - at least one tool (20) adapted to polish said surface (S) of the slab (T) during the advancement of the slab (T) along the advancement direction (A) and after / during the delivery of the treatment product; - at least one sensor device (P) configured to detect a surface temperature (S) of the slab (T); - at least one detection device (50) configured to detect at least one map or image or matrix of at least one parameter indicative of the morphology and / or processing quality of the surface of the slab following the polishing performed by the tool; and - an electronic control apparatus (60) configured to perform the method according to any one of the preceding claims.

8. The plant (10) according to claim 7, wherein the tool (20) comprises a head provided with polishing pads and adapted to stay in contact with the surface (S) of the slab (T), the head being rotatable around an axis of rotation and / or revolution orthogonal to the support plane and / or movable in translation along a direction orthogonal to the support plane and orthogonal to the advancement direction.

9. The plant according to claim 7, wherein the delivery device (35) is arranged near / at the tool (20).

10. The plant according to claim 7, the tool (20) is movable along a direction towards / away from the support surface which is substantially orthogonal to the support surface, by means of an actuator operated by a pressure regulating device (30).

11. The plant (10) according to claim 7, wherein the sensor device (P) comprises a laser pyrometer.

12. The plant according to claim 7, wherein the detection device (60) comprises at least one of a scanner and a glossmeter and is configured to map the entire surface of the slab advancing along the advancement direction and generate a map or image or matrix of at least one parameter indicative of the morphology and / or degree of polishing of the slab surface.

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