Liquid cooling system for portable electronic devices

Abstract

A liquid cooling system for portable electronic devices, characterized in that it comprises at least a liquid reservoir (1) connected to a closed circuit, a pump (2) to circulate the liquid through the circuit, and a radiator (3), the circuit being connected to a copper block (4) configured for heat exchange with at least one heat-generating component of a portable electronic device.

Description

Liquid cooling system for portable electronic devices OBJECT OF THE INVENTION The invention, as the title of this specification indicates, is a liquid cooling system for portable electronic devices. It is an innovation that offers advantages previously unknown within current techniques. TECHNICAL SECTOR The present invention falls within the electricity sector in the subclass of electrical techniques not provided for elsewhere, especially in modifications to facilitate cooling, ventilation or heating. STATE OF THE ART The present invention arises from observing that modern laptops often face overheating problems during operation, which can affect their performance and reduce the lifespan of their electronic components. In everyday situations, such as prolonged use for intensive processing tasks or in environments with limited ventilation, conventional cooling systems are not always sufficient to dissipate the heat generated by processors and other critical elements. This not only causes an increase in internal temperature, but can also lead to unexpected shutdowns, decreased performance, and long-term damage to the hardware. Consequently, this invention provides a liquid cooling system for portable electronic devices that allows for efficient temperature control, ensuring proper heat dissipation and improving the reliability and safety of the laptop during prolonged use. Currently, there is no known liquid cooling system for portable electronic devices that has structural and constitutive technical characteristics equal or similar to those described in this descriptive report, as claimed. DESCRIPTION OF THE INVENTION The object of the present invention is the creation of a liquid cooling system for portable electronic devices that provides a notable innovation within its field of application in the current state of the art, the characterizing details that make it possible being conveniently included in the final claims that accompany this description. The present invention relates to a liquid cooling system for portable electronic devices comprising a liquid reservoir connected to a closed circuit, a pump for circulating the liquid through the circuit, and a radiator. The circuit runs through a copper block configured for heat exchange with at least one heat-generating component of a portable electronic device, to which it is connected directly or via a conductive material, such as a heat-resistant element. Generally, in the direction of liquid flow driven by the pump, the circuit first passes through the copper block and then the radiator. This invention solves the problem of overheating in laptops by means of a liquid cooling system that ensures efficient heat dissipation, keeping the internal temperature within safe ranges and preventing device failures or slowdowns during use. This innovation provides practical benefits by improving the reliability and performance of portable electronic devices, allowing for extended use without risk of heat damage, optimizing the user experience, and increasing the durability of the equipment. It is envisaged that the liquid reservoir may have sufficient capacity to store the coolant, for example distilled water, necessary to maintain continuous circulation through the closed circuit, allowing for an adequate volume to facilitate thermal regulation according to the intensity of use of the portable electronic device. It is also proposed that the booster pump can be submerged or external to the liquid tank and adapted to be powered by the electronic device, pumping the liquid from the tank to the copper block and subsequently to the radiator, thus ensuring effective circulation that optimizes heat transfer. In addition, the radiator may preferably include fans designed to increase the convective dissipation of heat from the liquid, helping to maintain the internal temperature within safe levels and improving the overall efficiency of the cooling system. On the other hand, the copper block can be configured as a plate with an internal compartment that is placed in direct contact with the heat-generating component of the portable electronic device, absorbing the heat and transferring it to the coolant, thus providing a more efficient and localized heat exchange. Similarly, the conduits that form the circuit may include one or more copper tubes or tubes made of a flexible, watertight material, arranged in such a way as to increase the surface area for heat exchange, thus optimizing the efficiency of heat dissipation. For example, ducts can also consist of pipes or hoses made of heat-resistant materials such as silicone, PVC or equivalent material (elastic and heat-resistant), offering flexibility and durability against thermal and mechanical variations of the system. Additionally, the pipes can include anti-drip valves that are attached to the connections, allowing for additional control over the flow of liquid and contributing to the safety of the closed circuit. In addition, thermal fixing elements may include cold or paste solder, thermal glue, double-sided adhesive thermal tape, thermal paste, clamps or clamping hooks, ensuring proper fixing and heat transfer between the optional system components. It is also envisaged that the liquid reservoir may incorporate a fan intended to cool the contained liquid, providing an additional boost to the circulation of the coolant and improving the thermal efficiency of the circuit. Likewise, the closed circuit can have at least two implementation versions: a modular configuration, in which the liquid reservoir, booster pump, radiator, copper block, and conduits are separate components, and an integrated configuration, in which these components are grouped into a single module, allowing adaptations according to the design and available space of the portable electronic device. Furthermore, the closed circuit, including the liquid reservoir, booster pump, radiator, and copper block, can have adjustable sizes that allow it to be adapted to different dimensions of portable electronic devices, facilitating its implementation in equipment of various formats. Connectively, the closed circuit can be configured with shapes and dimensions compatible with traditional laptop heatsinks, allowing for direct installation without prior adaptation and simplifying its integration into existing designs. On the other hand, the closed circuit can allow operation without the integration of the booster pump, when using a coolant that does not expand or generate gas when heated, maintaining circulation and heat dissipation efficiently. Finally, the closed circuit can be fully integrated and constructed entirely of copper, and incorporate a filling port and access cap that allow refilling or inspection of the coolant without disassembling the system, thus offering a compact, efficient and easy-to-maintain solution for the thermal management of portable electronic devices. To use the modular liquid cooling system, the user must place the portable electronic device on a stable surface and ensure that the closed loop is correctly installed and connected. Once activated, the system automatically regulates liquid circulation and heat dissipation, maintaining the device's internal temperature within safe levels during operation. EXPLANATION OF THE FIGURES To complete the description being made and in order to help in the better understanding of the characteristics of the invention, this descriptive report is accompanied, as an integral part thereof, by some figures in which, for illustrative and non-limiting purposes, the following has been represented. Figure 1 shows an implementation version in which the components of the liquid cooling system for portable electronic devices are presented as separate elements. Figure 2 illustrates an implementation version in which the components of the liquid cooling system for portable electronic devices are grouped into a single module. Figure 3 presents another implementation version in which the components of the liquid cooling system for portable electronic devices are grouped into a single module, with a different internal arrangement. PREFERRED EMBODIMENT OF THE INVENTION. The liquid cooling system for portable electronic devices comprises at least a liquid reservoir (1), a booster pump (2) and a radiator (3), connected by a copper block (4) configured for heat exchange with at least one heat-generating component of a portable electronic device, with conduits (5) and thermal fixing elements, forming a closed circuit that prevents overheating in portable devices such as laptops, tablets or smartphones. In a preferred embodiment, the liquid reservoir (1) has sufficient capacity to store the coolant required to maintain continuous circulation through the closed circuit. Preferably, the pump (2), submerged or external to the liquid reservoir (1), is adapted to be powered by the electronic device itself, pumping the liquid from the liquid reservoir (1) to the copper block (4) and subsequently to the radiator (3). For this purpose, it may have a cable with a USB connector of the appropriate standard. In the figures, the radiator (3) comprises two fans intended for the dissipation of heat from the liquid. Typically, the copper block (4) is configured as a plate with an internal compartment, which is placed in direct contact with the heat-generating component of the portable electronic device, such as the CPU or GPU, absorbing the heat and transferring it to the coolant. Generally, the conduits (5) include one or more copper tubes that connect the copper block (4) to the liquid reservoir (1) and the radiator (3), arranged in such a way as to increase the heat exchange surface, optimizing the efficiency of heat dissipation. Alternatively, the conduits (5) consist of pipes or hoses made of heat-resistant materials such as silicone, PVC or equivalent material. In another preferred embodiment, the conduits (5) include anti-drip valves that are coupled to the conduit connections (5). Generally, thermal fixing elements comprise cold or paste solder, thermal glue, double-sided adhesive thermal tape, thermal paste, clamps or clamping hooks. Preferably, the liquid reservoir (1) incorporates a fan intended to cool the contained liquid. The invention is presented in at least two implementation versions, one of modular configuration, in which the liquid reservoir (1), the booster pump (2), the radiator (3), the copper block (4) and the ducts (5) are found as separate components, and another of integrated configuration, in which said components are grouped into a single, pre-built module. Generally, the closed circuit, including the liquid reservoir (1), the booster pump (2), the radiator (3), the ducts (5) and the copper block (4), can be defined in any dimension, allowing its adaptation to different dimensions of portable electronic devices. Preferably, the closed circuit is configured with shapes and dimensions compatible with traditional laptop heat sinks, allowing for direct installation without prior adaptation. In another preferred embodiment, the closed circuit allows operation without the integration of the booster pump (2), when using a coolant that does not expand or generate gas when heated, maintaining circulation and heat dissipation. Preferably, the closed circuit is fully integrated and constructed entirely of copper, and incorporates a filling port and access cap that allow refilling or inspection of the coolant in the liquid reservoir (1) without disassembly of the system. Having sufficiently described the nature of the present invention, as well as the manner of putting it into practice, it is not considered necessary to make its explanation more extensive so that any expert in the field may understand its scope and the advantages that derive from it, it being noted that, within its essentiality, it may be put into practice in other modes of embodiment that differ in detail from the one indicated as an example, and which will also achieve the protection sought provided that its fundamental principle is not altered, changed or modified.

Claims

1. A liquid cooling system for portable electronic devices, characterized in that it comprises at least a liquid reservoir (1) connected to a closed circuit, a pump (2) to circulate the liquid through the circuit, and a radiator (3), the circuit being connected to a copper block (4) configured for heat exchange with at least one heat-generating component of a portable electronic device.

2. A liquid cooling system for portable electronic devices according to claim 1, characterized in that the pump (2) is powered by the electronic device.

3. A liquid cooling system for portable electronic devices according to claim 1, characterized in that the radiator (3) comprises fans for dissipating heat from the liquid. 4.A liquid cooling system for portable electronic devices, according to claim 1, characterized in that the circuit is formed by conduits (5) that include one or more copper tubes.

5. A liquid cooling system for portable electronic devices, according to claim 1, characterized in that the circuit is formed by conduits (5) consisting of pipes or hoses made of silicone, PVC, or equivalent material.

6. A liquid cooling system for portable electronic devices, according to claim 1, characterized in that the conduits (5) include anti-drip valves.

7. A liquid cooling system for portable electronic devices, according to claim 1, characterized in that the copper block (4) is attached to the heat-generating component by means of thermal fasteners. 8.A liquid cooling system for portable electronic devices, according to claim 1, characterized in that the thermal fixing elements comprise cold solder or paste, thermal glue, double-sided adhesive thermal tape, thermal paste, clips, or clamping hooks.

9. A liquid cooling system for portable electronic devices, according to claim 1, characterized in that the liquid reservoir (1) incorporates a fan.

10. A liquid cooling system for portable electronic devices, according to claim 1, characterized in that the closed circuit is made entirely of copper.

11. A liquid cooling system for portable electronic devices, according to claim 1, characterized in that it incorporates a filling port and a coolant access cap.