Integrated substrate processing apparatus and method
FI20255303A1Undetermined Publication Date: 2026-08-15PICOSUN OY
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Patent Information
- Application Number
- FI2025005303
- Authority / Receiving Office
- FI · FI
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-14
- Filing Date
- 2025-04-01
- Publication Date
- 2026-08-15
Abstract
An integrated substrate processing apparatus (100) comprises substrate modules integrated, under vacuum, via a wafer handling module (150). The substrate modules comprise a first substrate processing module (110) provided with a remote plasma generator (115), configured to process one substrate (101) at a time in a plasma-enhanced process, and a second substrate processing module (120) capable of processing a batch of substrates (101) in a thermal mode for thin film deposition
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