Light Emitting Module

Abstract

A light-emitting module comprises a semiconductor light-emitting element; a printed circuit board (24) on which a lighting control circuit configured to switch the semiconductor light-emitting element on and off is provided; and a metal element plate (18) on which the semiconductor light-emitting element is mounted. The printed circuit board is a resin substrate in which a wiring portion (26) connecting the semiconductor light-emitting element and the lighting control circuit is provided. Selected figure: Figure 5

Description

Title of the invention: Light-emitting module Context of the invention

[0001] The present invention relates to a light emission module. Description of related art

[0002] There is a light source module comprising a control unit mounted in a heat sink including radiating fins, the control unit comprising a light-emitting diode and a drive circuit for controlling the lighting of the light-emitting diode (see the publication of Japanese patent application submitted for public inspection 2016-139514). In this light source module, an electrical power supply fixture with busbars embedded within it is mounted on the heat sink. The busbars electrically connect the control unit and the light-emitting diode. Summary of the invention

[0003] However, the above-mentioned power supply fitting is formed by insert molding, allowing for the insertion of numerous busbars, and comprises many components. Therefore, manufacturing the power supply fitting is not straightforward. Consequently, there remains room for further cost improvements.

[0004] The present invention proposes a new light emission module which allows cost reduction with a simplified configuration.

[0005] A light-emitting module according to a first aspect of the present invention comprises a semiconductor light-emitting element; a printed circuit board on which a lighting control circuit configured to switch the semiconductor light-emitting element on and off is provided; and a metal element plate on which the semiconductor light-emitting element is mounted. The printed circuit board is a resin substrate in which a wiring portion connecting the semiconductor light-emitting element and the lighting control circuit is provided.

[0006] According to the first aspect, the lighting control circuit and the semiconductor light-emitting element can be connected with a simple configuration.

[0007] In the light-emitting module according to the first aspect, the printed circuit board can be a multilayer substrate, and the wiring can be provided inside the multilayer substrate. The resin substrate is, for example, a substrate Made of epoxy glass with a copper foil pattern formed as a wiring component on both the surface and interior of the substrate. Therefore, compared to components with significant thickness and high material and manufacturing costs, such as a power supply connector with busbars integrated within it, the printed circuit board allows for cost reduction.

[0008] In the light-emitting module according to the first aspect, the printed circuit board can be mounted on the element's metal plate, and the wiring can be provided between the lighting control circuit and the element's metal plate. The lighting control circuit can be mounted on a surface of the printed circuit board.

[0009] In the light-emitting module according to the first aspect, the semiconductor light-emitting element can be arranged in an opening provided in the printed circuit board. Therefore, the semiconductor light-emitting element can be directly mounted on the element's metal plate.

[0010] In the light-emitting module according to the first aspect, the semiconductor light-emitting element can be connected to the wiring section via a metallic wire such as a gold wire, an aluminum wire, or an aluminum ribbon. Therefore, the reliability of the connection between an electrode of the semiconductor light-emitting element and the wiring section can be improved. Also, the use of metallic wire allows for a reduction in the electrode surface area.

[0011] The light-emitting module according to the first aspect may further comprise a circuit board that is different from the element board. The printed circuit board may be mounted to extend over the element board and the circuit board, and the element board and the circuit board may be thermally separated from each other. Consequently, it is possible to determine the shape and size of the element board by taking into account the heat generated by the semiconductor light-emitting element and to determine the shape and size of the circuit board by taking into account the heat generated by the lighting control circuit. This improves the degree of flexibility in the adjustments.

[0012] In the light-emitting module according to the first aspect, the element metal plate may be a simple plate element, a cut-out portion into which the circuit metal plate is inserted may be provided in an external peripheral portion of the element metal plate, and the element metal plate and the circuit metal plate inserted into the cut-out portion may together form a rectangular shape. Therefore, the entirety of the two plates forms a simple shape, thus increasing the degree of arrangement flexibility.

[0013] In the light-emitting module according to the first aspect, the element's metal plate can have a thickness of 1 mm to 2 mm. Therefore, the light-emitting module can be refined.

[0014] It should be noted that any combination of the above components and a method, apparatus, system and the like which are obtained by converting the expression of the present invention, are also effective as aspects of the present invention.

[0015] According to the first aspect of the present invention, it is possible to propose the new light emission module which allows a cost reduction.

[0016] A light-emitting module according to a second aspect of the present invention comprises a semiconductor light-emitting element; a metal element plate on which the semiconductor light-emitting element is mounted; a wiring board mounted on the metal element plate; and a printed circuit board on which a lighting control circuit is provided, configured to control the illumination of the semiconductor light-emitting element. An opening for mounting the semiconductor light-emitting element on the metal element plate is provided in the wiring board. In the opening, a portion of the wiring provided inside the wiring board is exposed. The opening has sufficient depth to surround a connecting element joining the semiconductor light-emitting element and the exposed portion of the wiring.

[0017] According to the second aspect, the lighting control circuit and the semiconductor light-emitting element can be connected with a simple configuration. Also, since the opening has sufficient depth to surround the connecting element, the connecting element is less likely to come into contact with other components.

[0018] In the light-emitting module according to the second aspect, the connecting element can be a metallic wire such as a gold wire, an aluminum wire, or an aluminum ribbon, and the opening portion can be configured so that the metallic wire does not protrude from any surface of the wiring board. Therefore, it is possible to avoid a situation in which the metallic wire comes into contact with other components with which it should not be in contact. Thus, the metallic wire does not need to be coated, for example, with an insulating protective resin.

[0019] In the light-emitting module according to the second aspect, the wiring board can be a resin substrate formed integrally with the metal element plate and the wiring made of metal, the opening part can be a recessed part that receives the semiconductor light-emitting element and the wiring part can be exposed from a side wall of the recessed part. By Consequently, the metal wire is connected to the wiring section without protruding from the surface of the wiring board.

[0020] In the light emission module according to the second aspect, the printed circuit board may be a multilayer substrate comprising a resin which is any one of a phenol resin, an epoxy resin and a polyimide resin, and the wiring provided inside the resin, and the wiring board may comprise an industrial plastic and the wiring provided inside the industrial plastic.

[0021] In the light-emitting module according to the second aspect, the wiring board and the printed circuit board can be contained on a single common substrate. Consequently, the number of substrates is reduced, thereby reducing assembly costs and labor hours.

[0022] The light-emitting module according to the second aspect may further comprise a circuit board that is different from the element board. The printed circuit board may be mounted to extend over the element board and the circuit board, and the element board and the circuit board may be thermally separated from each other. Consequently, it is possible to determine the shape and size of the element board by taking into account the heat generated by the semiconductor light-emitting element and to determine the shape and size of the circuit board by taking into account the heat generated by the lighting control circuit. This improves the degree of flexibility in the adjustments.

[0023] In the light-emitting module according to the second aspect, the element metal plate may be a single plate element, a cut-out portion into which the circuit metal plate is inserted may be provided in the outer peripheral portion of the element metal plate, and the element metal plate and the circuit metal plate inserted into the cut-out portion may together form a rectangular shape. Therefore, the entirety of the two plates forms a simple shape, thus increasing the degree of arrangement flexibility.

[0024] In the light-emitting module according to the second aspect, the element's metal plate can have a thickness of 1 mm to 2 mm. Therefore, the light-emitting module can be refined.

[0025] The light-emitting module according to the second aspect may further comprise a plurality of aperture portions which are provided to be spaced apart from one another, and the semiconductor light-emitting element may be disposed in each of the aperture portions. Consequently, it is possible to provide a plurality of light sources which differ with respect to light distribution within a single light-emitting module.

[0026] It should be noted that any combination of the above components and a method, apparatus, system and the like which can be obtained by converting the expression of the present invention, are also effective as aspects of the present invention.

[0027] According to the second aspect of the present invention, it is possible to provide a new light emission module which allows a cost reduction. Brief description of the drawings

[0028] The characteristics, advantages, and technical and industrial significance of exemplary embodiments of the invention are described below with reference to the accompanying drawings, in which the same symbols designate the same elements, and in which:

[0029] [Fig-1] Fig. 1 is a front view of a vehicle lamp according to a first method of implementation;

[0030] [Fig.2] The [Fig.2] is an exploded perspective view of the vehicle lamp according to the first embodiment;

[0031] [Fig.3] The [Fig.3] is a cross-sectional view of the vehicle lamp taken on line III-III on the [Fig.1];

[0032] [Fig.4] The [Fig.4] is a schematic view to describe a process for manufacturing the vehicle lamp according to the first embodiment;

[0033] [Fig.5] The [Fig.5] is a perspective view of a light emission module according to the first embodiment, as seen from above;

[0034] [Fig.6] The [Fig.6] is a rear view of the light emission module according to the first embodiment;

[0035] [Fig.7] The [Fig.7] is an enlarged view of the vicinity of an opening part of the light-emitting module illustrated in the [Fig.5];

[0036] [Fig.8] The [Fig.8] is a schematic view of a section comprising an opening part of the light emission module according to the first embodiment;

[0037] [Fig.9] The [Fig.9] is a perspective view of the light emission module according to a second embodiment, as seen from above;

[0038] [Fig. 10] The [Fig. 10] is a rear view of the light emission module according to the second embodiment;

[0039] [Fig. 11] The [Fig. 11] is an enlarged view of the vicinity of a part of the opening of the light-emitting module illustrated in the [Fig.9];

[0040] [Fig. 12A] Fig. 12A is an enlarged view of the proximity of a connection point between a wiring board and a printed circuit board in the light-emitting module according to the second embodiment, and

[0041] [Fig. 12B] The [Fig. 12B] is also an enlarged view of the proximity of the connection part between the wiring board and the printed circuit board in the light emission module according to the second embodiment;

[0042] [Fig. 13A] Fig. 13A is a front view of a vehicle lamp according to a third embodiment, and

[0043] [Fig.13B] Fig.13B is a perspective view of the vehicle lamp according to the third embodiment; and

[0044] [Fig. 14] The [Fig. 14] is an exploded perspective view of the vehicle lamp according to the third embodiment. Detailed description of the implementation methods

[0045] Embodiments of the present invention are described in more detail below with reference to the drawings. In the drawing descriptions, the same components are designated with the same symbol, and their redundant descriptions are omitted as appropriate. Also, the configurations described below are merely examples and do not in any way limit the scope of the present invention. First method of implementation Vehicle lamp

[0046] Figure 1 is a front view of a vehicle lamp according to a first embodiment. Figure 2 is an exploded perspective view of the vehicle lamp according to the first embodiment. Figure 3 is a cross-sectional view of the vehicle lamp taken along line III-III in Figure 1.

[0047] A vehicle lamp 10 comprises a light-emitting module 12, a lens 14, and a support 16. The light-emitting module 12 comprises a metal plate 18 formed, for example, of aluminum or copper, and three semiconductor light-emitting elements (light-emitting diodes 20) mounted on the metal plate 18, which are separate light sources. Each of the semiconductor light-emitting elements may be a laser element or an EL element. The lens 14 comprises three optical control regions RI to R3. In each of the optical control regions RI to R3, an optical path is controlled such that the light L emitted by the light-emitting diode 20 enters the optical control region, travels through the interior of the optical control region, and exits forward through the optical control region.The support 16 supports the lens 14 in a state in which the lens 14 is positioned relative to the support 16. Also, the metal plate 18 is fixed to the support 16 via three screws 19 in a state in which the metal plate 18 is positioned relative to the support 16.

[0048] In this way, in the vehicle lamp 10 according to the present embodiment, the metal plate 18 and the lens 14 are positioned relative to the same component, namely the support 16. This improves the accuracy of positioning the metal plate 18 and the lens 14. In other words, the accuracy of positioning the metal plate 18 and the lens 14 relative to each other is improved. This makes it possible to form a desired light distribution pattern projected towards the front of the vehicle with good accuracy.

[0049] The lens 14 does not project forward from an opening portion 16a of the support 16. The entire lens 14 is provided on the side of the metal plate 18 relative to the opening portion 16a (that is to say, the entire lens 14 is provided closer to the metal plate 18 than is the opening portion 16a). In other words, the entire lens 14 is located in a region between the support 16 and the metal plate 18. Each of the optical control regions RI to R3 of the lens 14 comprises a central part 14a which refracts the light L from the light-emitting diode 20 in question and allows the light L to exit forward and an outer edge part 14b at the periphery of the central part 14a, the outer edge part 14b reflecting the incoming light L from the light-emitting diode 20 in question using an internal surface and allows the light L to exit forward.Therefore, although lens 14 does not have a shape protruding from the support like a convex lens, lens 14 can form a desired light distribution pattern, thus allowing the reduction in thickness in a front-to-rear vehicle direction of vehicle lamp 10.

[0050] The positioning of the components in the vehicle lamp 10 according to this embodiment is then described. The support 16 includes a flange portion 16b to surround the opening portion 16a. The lens 14 is fixed to a positioning portion 16c provided on the inner side of the flange portion 16b. Consequently, the lens 14 can be assembled onto the support 16 from the rear side of the support 16 and positioned.

[0051] Also, positioning holes 18a into which positioning protrusions 16e provided at an end surface of the rear side 16d of the support 16 are inserted, are formed in the metal plate 18. Thanks to the protrusions 16e which are installed in the positioning holes 18a, the metal plate 18 is positioned relative to the support 16.

[0052] Here, the metal plate 18 is a metal plate having a thickness of 1 mm to 2 mm, and a surface of the metal plate 18 is blackened, for example by anodizing or painting, thus improving the heat emissivity of the metal plate 18. Thus, i) a surface 18c, which is on the side opposite a mounting surface 18b on which the light-emitting diodes 20 are mounted, is exposed Externally, (ii) the heat emissivity of the metal plate 18 is improved, and (iii) the plurality of light-emitting diodes 20 are arranged in a dispersed manner at intervals. The combination, for example, of the features (i), (ii), and (iii) above allows the light-emitting module 12 to achieve the desired heat dissipation performance without requiring a heat sink to mount the metal plate 18. Consequently, the thickness of the vehicle lamp 10 in the front-to-rear direction of the vehicle can be reduced.

[0053] Figure 4 is a diagram describing a method for manufacturing the vehicle lamp according to the first embodiment. It should be noted that Figure 4 is an exploded view of the vehicle lamp, as viewed from a side.

[0054] As illustrated in [Fig.4], the manufacturing process according to the present embodiment includes a preparation step to prepare a tubular support 16 comprising an aperture portion 16a from which the light from the light-emitting diodes 20 emerges; a lens positioning step to position a front end surface 14c of a lens 14 on a positioning portion 16c formed on the inner side (substrate side) of the aperture portion 16a in order to surround the aperture portion 16a; and a substrate positioning step to position a metal plate 18 on which the light-emitting diodes 20 are mounted, on fixing portions (projections 16e at the level of an end surface of the rear side 16d) on the side opposite the aperture portion 16a of the support 16.

[0055] In the lens positioning step and the substrate positioning step, the lens 14 and the metal plate 18 can be assembled to the support 16 from the same side. Also, in a state in which the front end surface 14c is brought against the positioning portion 16c of the support 16, the lens 14 is welded and fixed to the support 16 by applying a laser to the region of the abutment from the rear of the lens 14. Also, in a state in which the metal plate 18 is brought against the rear end surface 16d of the support 16 and the protrusions 16e are inserted into the positioning holes 18a, the metal plate 18 is welded and fixed to the support 16 by applying a laser to the protrusions 16e projecting from the rear side of the metal plate 18, from the rear.Alternatively, after positioning by inserting the protrusions 16e into the positioning holes 18a, the metal plate 18 is fixed to the support 16 by securing it with screws, using other holes provided for fixing.

[0056] According to this embodiment, the lens positioning step and the substrate positioning step can be carried out by welding using a laser emitted from the same side. This reduces the need to change the orientation of a laser welding device or to rotate components such as the lens and the substrate. at the time of manufacture. Also, since the welded portion of the lens 14, which is welded to the support 16, is positioned on the inner (rear) side of the flange portion 16b, the welded portion cannot be seen when the vehicle lamp 10 is viewed from the front, thus improving its appearance. Furthermore, the light passing through the welded portion is blocked by the flange portion 16b. This reduces uncontrolled light loss, such as outward glare. Alternatively, by means of fastening, for example with screws, the assembly work can be carried out from the same side, thereby improving work efficiency and preventing the occurrence of defects due to assembly errors. Light Emitting Module

[0057] Next, an example of the light-emitting module is described. [Fig. 5] is a perspective view of the light-emitting module according to the first embodiment, as viewed from above. [Fig. 6] is a rear view of the light-emitting module according to the first embodiment. [Fig. 7] is a close-up view of an opening portion of the light-emitting module illustrated in [Fig. 5]. [Fig. 8] is a schematic diagram of a section including an opening portion of the light-emitting module according to the first embodiment.

[0058] The light-emitting module 12 comprises a printed circuit board 24 provided with three LEDs 20, a lighting control circuit 22 that switches the LEDs 20 on and off, and a connector 23 to which an external connector is attached, and a metal plate 18, which is a metal element plate on which the LEDs 20 are mounted. The printed circuit board 24 is a multilayer resin substrate, and a wiring section 26 is provided within the multilayer resin substrate. The wiring section 26 connects the LEDs 20 and the lighting control circuit 22. Therefore, as illustrated in [Fig. 8], the lighting control circuit 22 and the LEDs 20 can be connected in a simple configuration.Here, the lighting control circuit 22 includes passive elements needed to drive the light-emitting diodes 20 (e.g., a resistor, an inductor and a capacitor) and active elements (e.g., a transistor, an integrated circuit, a diode and an operational amplifier).

[0059] The printed circuit board 24 according to this embodiment is a multilayer substrate comprising the wiring portion 26 provided both inside the multilayer substrate and on a surface layer of the multilayer substrate. The printed circuit board 24 is, for example, an epoxy glass substrate with a copper foil pattern formed as a wiring portion on a surface and inside the substrate. made of epoxy glass. Therefore, compared to components with significant thickness and high material and manufacturing costs, such as a power supply connector with busbars integrated within it, the printed circuit board 24 offers a cost reduction. It should be noted that the printed circuit board can be coated with either a phenolic resin or a polyimide resin. Also, the wiring section 26 exposed in the openings 24b has undergone metallic surface treatment (e.g., nickel plating or gold plating). Consequently, the adhesion of metallic wires 28, such as gold wires, aluminum wires, or aluminum ribbons, is improved. Additionally, a surface layer on the back side of the printed circuit board 24 consists of an insulating material alone. This back-side surface layer is in contact with the metal plate 18.Therefore, when the printed circuit board 24 is connected to the electrically conductive metal plate 18, it is possible to use not only an electrically insulating adhesive with good heat dissipation performance, but also an electrically conductive adhesive.

[0060] As illustrated in [Fig. 8], at least a portion of the printed circuit board 24 is mounted on the metal plate 18, and the wiring section 26 is formed between the lighting control circuit 22 and the metal plate 18 in a thickness direction of the board. The lighting control circuit 22 is mounted on a surface 24a of the printed circuit board 24. Consequently, the heat generated by the components (e.g., the printed circuit board) used in the lighting control circuit 22 travels not only in the thickness direction but also horizontally via the wiring section 26 of the printed circuit board 24, thus improving heat dissipation performance.

[0061] Also, the light-emitting diodes 20 are arranged in the respective aperture portions 24b formed in the printed circuit board 24. Therefore, the light-emitting diodes 20 can be directly mounted on the metal plate 18. The plurality of aperture portions 24b are provided so as to be spaced apart from each other, and one light-emitting diode 20 is arranged in each aperture portion 24b. Then, the different optical control regions RI to R3 of the lens 14 are provided for the respective light-emitting diodes 20. Therefore, it is possible to provide a plurality of light sources that differ with respect to light distribution in a single light-emitting module.

[0062] The light-emitting diodes 20 are connected to the wiring section 26 via the metal wires 28. Therefore, the reliability of the connection between the electrodes 20a of the light-emitting diodes 20 and the wiring section 26 can be improved. Also, the use of the metal wires 28 allows for a reduction in the surface area of ​​the electrodes 20a. Also, the surface area of ​​each of the electrodes 20a according to this embodiment is less than the surface area of ​​each of the light-emitting surfaces of the light-emitting diodes 20. In this way, when the light-emitting surfaces of the light-emitting diodes 20 are oriented towards the front of the vehicle, when the vehicle lamp 10 is viewed from the front, the thin metal wires 28 and the small electrodes 20a are barely visible.

[0063] As illustrated in [Fig. 6], the light-emitting module 12 further comprises a circuit board 30, which is distinct from the circuit board 18. The printed circuit board 24 is mounted to extend over the circuit board 18 and the circuit board 30, and the circuit board 18 and the circuit board 30 are thermally separated from each other. Consequently, it is possible to determine the shape and size of the circuit board 18, which is an elemental circuit board, taking into account the heat generated by the light-emitting diodes 20, and to determine the shape and size of the circuit board 30 taking into account the heat generated by the lighting control circuit 22. This enhances the degree of flexibility in the adjustments.

[0064] The metal plate 18 is a single plate element and comprises a rectangular cutout portion 18e provided within an external peripheral portion 18d. The circuit metal plate 30 is inserted into the cutout portion 18e. The metal plate 18 and the circuit metal plate 30 inserted into the cutout portion 18e together form a rectangular shape. Consequently, the entire assembly of the two metal plates forms a simple rectangular shape, thus reducing interference with other elements and eliminating conflicts over space sharing. This increases the degree of arrangement flexibility.

[0065] Each of the metal plate 18 and the circuit metal plate 30 is a metal plate, for example, made of aluminum or copper, the metal plate having a thickness of 1 mm to 2 mm. Therefore, the light-emitting module 12 can be refined. Also, as illustrated in [Fig. 5], the lighting control circuit 22 includes elements that generate a relatively large amount of heat, so the printed circuit board is positioned at a distance from a central LED 20A, which has a relatively low heat dissipation performance among the three LEDs 20. This reduces the influence that the heat generated by the lighting control circuit 22 has on the LED 20A.Also, as illustrated in Figures 2 and 3, there is some empty space in the region enclosed by the lens 14, the metal plate 18, and the support 16, and thus, the components forming the lighting control circuit 22 are placed in this empty space. Therefore, it... It is possible to reduce an increase in the thickness of the vehicle lamp 10 in the front-to-rear direction of the vehicle due to the lighting control circuit 22. Second embodiment

[0066] Figure 9 is a perspective view of a light-emitting module according to a second embodiment. Figure 10 is a rear view of the light-emitting module according to the second embodiment. Figure 11 is an enlarged view of a close-up of an opening portion of the light-emitting module illustrated in Figure 9. Figures 12A and 12B are enlarged views of a close-up of a connection portion between a wiring board and a printed circuit board in the light-emitting module according to the second embodiment.

[0067] A light-emitting module 32 comprises three light-emitting diodes 20, a metal plate 18 which is a metal element plate on which the light-emitting diodes 20 are mounted, a wiring board 34 disposed on the metal plate 18, and a printed circuit board 36 on which a lighting control circuit (not shown) controls the illumination of the light-emitting diodes 20. In the wiring board 34, openings 34a are provided for mounting the light-emitting diodes 20 on the metal plate 18. In each opening 34a, the wiring sections 38a (busbars) 38 inside the wiring board 34 are exposed, and each opening 34a has sufficient depth to surround the metal wires 28 which are connecting elements linking the light-emitting diode 20 and the exposed sections. 38a of the 38 wiring.

[0068] Consequently, the lighting control circuit and the light-emitting diodes 20 can be connected with a simple configuration. Furthermore, since the opening portions 34a have a depth D (see [Fig. 8]) sufficient to surround the metal wires 28 in question, the metal wires 28 are less likely to come into contact with the other components.

[0069] The opening portions 34a are each configured so that the metal wires 28 do not protrude from any surface of the wiring board 34. Consequently, it is possible to avoid a situation in which the metal wires 28 come into contact with other components with which the metal wires 28 should not be in contact, and the metal wires 28 do not need to be covered, for example, with an insulating protective resin. For this reason, the light-emitting module 32 helps to reduce the cost.

[0070] The wiring board 34 is a resin substrate bonded to the metal plate 18 and the metal busbars. The openings 34a are recessed areas that house the respective LEDs 20, and the busbar sections are exposed from the side walls. recessed sections. Consequently, the metal wires 28 are connected to the busbar sections without protruding from the surface of the wiring board 34. Although the wiring board 34 includes an outer cover or enclosure formed with an industrial plastic and the busbars provided inside the outer cover or enclosure, the wiring board of the present invention is not limited to this example and may be a multilayer resin substrate with an embedded copper foil pattern as a wiring section. A circuit metal plate, different from the metal plate 18, may also be provided.

[0071] As illustrated in [Fig. 12A], with respect to the connection between the wiring board 34 and the printed circuit board 36, the end portions of the busbars included in the wiring 38, and the end portions of the copper foil patterns included in a wiring portion 40 of the printed circuit board 36, are connected via connecting metal wires 42. Alternatively, as illustrated in [Fig. 12B], the end portions of the wiring 38 can be formed to extend over the wiring portion 40 of the printed circuit board 36, and the wiring 38 can be treated to exert stress on the wiring portion 40 using its elastic properties. The wiring board 34 and the printed circuit board 36 can be contained within a single common substrate. Consequently, the number of substrates is reduced.This reduces costs for components such as the connecting wires linking the substrates, and reduces the labor required for assembly. Third embodiment.

[0072] Figure 13A is a front view of a vehicle lamp according to a third embodiment, and Figure 13B is a perspective view of the vehicle lamp according to the third embodiment. Figure 14 is an exploded perspective view of the vehicle lamp according to the third embodiment. It should be noted that components similar to the components of the vehicle lamp 10 according to the first embodiment are designated with symbols identical to those of the components of the first embodiment, and the description of such components is therefore omitted.

[0073] A vehicle lamp 110 comprises a light-emitting module 112, a lens 114, and a support 116. The light-emitting module 112 comprises a metal plate 118 formed, for example, of aluminum or copper, and three semiconductor light-emitting elements (light-emitting diodes 20) mounted on the metal plate 118, the semiconductor light-emitting elements being separate light sources. The three light-emitting diodes 20 are arranged in respective positions corresponding to the corners of a triangle (an equilateral triangle or an isosceles triangle).

[0074] The lens 114 comprises three optical control regions R4 to R6. In each of the optical control regions R4 to R6, an optical path is controlled such that the light L emitted by the light-emitting diode 20 in question enters the optical control region, travels through the interior of the optical control region, and exits towards the front of the optical control region. The optical control regions R4 to R6 are arranged to form a triangle in front of the three light-emitting diodes 20.

[0075] Although the present invention has been described with reference to the above embodiments, the present invention is not limited to the above embodiments, and the present invention includes embodiments obtained by appropriately combining or substituting components of the embodiments. Also, the combinations or the order of the processing steps of the embodiments can be appropriately modified based on the knowledge of those skilled in the art, and modifications, such as various design changes, can be made to the embodiments. Such modified embodiments may also be included within the scope of the present invention.

Claims

Demands

1. Light emitting module characterized in that it comprises: a semiconductor light emitting element; a printed circuit board (24) on which a lighting control circuit (22) configured to perform the control of switching the semiconductor light emitting element on and off is provided;and a metal element plate (18) on which the semiconductor light-emitting element is mounted, in which the printed circuit board (24) is a resin substrate in which a wiring portion (26) connecting the semiconductor light-emitting element and the lighting control circuit is provided, characterized in that it further comprises: a metal circuit plate (30) which is different from the metal element plate (18), the printed circuit board (24) being mounted so as to extend over the metal element plate (18) and the metal circuit plate (30), the metal element plate (18) and the metal circuit plate (30) being thermally separated from each other, the lighting control circuit (22) being mounted on a surface (24a) of a portion of the printed circuit board (24) mounted on the metal circuit plate (30).

2. Light emission module according to claim 1, characterized in that the printed circuit board (24) is a multilayer substrate, and the wiring part (26) is provided inside the multilayer substrate.

3. Light emission module according to claim 2, characterized in that: the printed circuit board (24) is mounted on the element metal plate (18); and the wiring portion (26) is provided between the lighting control circuit and the element metal plate (18).

4. Light emission module according to any one of claims 1 to 3, characterized in that the semiconductor light emission element is disposed in an opening provided in the printed circuit board (24).

5. Light-emitting module according to claim 4, characterized in that the semiconductor light-emitting element is connected to the wiring part (26) via a metallic wire.

6. Light emission module according to claim 5, characterized in that: the element metal plate (18) is a single plate element; a cut-out portion into which the circuit metal plate (30) is inserted is provided in an external peripheral portion of the element metal plate (18); and the element metal plate (18) and the circuit metal plate (30) inserted into the cut-out portion together form a rectangular shape.

7. Light emission module according to any one of claims 1 to 6, characterized in that the element metal plate (18) has a thickness of 1 mm to 2 mm.

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