PROCESS FOR METALLIZING A THERMOELECTRIC ELEMENT

Abstract

Method for manufacturing a thermoelectric structure comprising the following steps: a) providing a substrate (100), covered by a metal layer (300), b) forming a thermoelectric element (200), on the metal layer (300), by additive manufacturing, preferably by SLS or FLLP, whereby a thermoelectric structure is obtained comprising the substrate (100) successively covered by the metal layer (300) and by the thermoelectric element (200). c) optionally removing the substrate (100), whereby a thermoelectric structure is obtained comprising the metal layer (300) and the thermoelectric element (200). Figure for abstract: 1C

Description

Title of the invention: METHOD FOR METALLIZING A THERMOELECTRIC ELEMENT Technical field

[0001] The present invention relates to the general field of thermoelectric modules.

[0002] The invention relates to a method for manufacturing thermoelectric structures.

[0003] The invention also relates to a thermoelectric structure obtained by such a method.

[0004] The invention also relates to thermoelectric devices comprising two thermoelectric structures thus obtained, one being of a first type of conductivity and the other being of a second type of conductivity.

[0005] The invention finds applications in numerous industrial fields, and in particular for applications requiring thermoelectric generators, where a thermal gradient is available (e.g. transport, industries, etc.), radioisotope thermoelectric generator applications, Peltier applications or even thermal sensor applications.

[0006] The invention is particularly interesting since it makes it possible to form thermoelectric structures / devices having low resistivities. STATE OF THE PRIOR ART

[0007] Generally, thermoelectric (TE) modules comprise a set of first pads made of a thermoelectric material of a first conductivity type and a set of second pads made of a piezoelectric material of a second conductivity type. For example, the first material is an N-type material (i.e., with N-type conductivity) and the second material is a P-type material (i.e., with P-type conductivity).

[0008] The pads are electrically connected in series and thermally in parallel. The pads are connected to each other by metallic elements. Thermoelectric junctions are also called NP junctions. The pads are held by ceramic substrates arranged on either side of the sets of pads.

[0009] The electrical performances of a TE device in generator mode are given by:

[0010] - an internal electrical resistance Rint defined according to (1):

[0011] Rint = N x pnp x L / A + R c + ^met (1)

[0012] with N the number of np junctions, pnp the electrical resistivity of the NP materials, L the length of a line or thickness of a pad, A the section of a line or pad, Rc the total resistance of the contacts and Rmet the total resistance of the metal junctions

[0013] - a useful electrical power Pu defined according to (2):

[0014] Pu = Voc2 / 4Rint

[0015] with Voc the voltage generated by the TE module

[0016] Thus, to have high power, it is necessary to have low internal electrical resistance, and therefore reduce the contribution of the total resistance of the contacts Rc and the total resistance of the metal junctions Rmet.

[0017] Conventionally, the manufacture of TE modules is generally carried out from the following steps: manufacture of TE materials (sintering), shaping of the pads, metallization of the pads, assembly with the substrates.

[0018] The metal connections are made directly on the substrates, for example by the so-called direct copper technique (or DBC for 'Direct Bonding Copper'), then brazing and pressing with the pads.

[0019] However, this manufacturing process is relatively complex and greatly limits the geometry and modularity of the manufactured thermoelectric device.

[0020] There are also substrate-free TE modules, also called "skeleton modules". These modules therefore have no thermal loss due to the substrates. However, they cannot be in contact with electrically conductive surfaces.

[0021] It is also possible to use TE pads made from several TE materials. These so-called segmented pads make it possible to accommodate a greater temperature difference at the ends of the module because the materials used are generally optimized for different temperature ranges. Statement of the invention

[0022] An aim of the present invention is to propose a method for manufacturing thermoelectric structures, which is simple to implement and makes it possible to manufacture thermoelectric structures having good electrical properties (in particular, low contact resistance) and / or good thermal properties.

[0023] For this, the present invention proposes a method of manufacturing a thermoelectric structure comprising the following steps:

[0024] a) providing a substrate, covered completely or locally, by a metallic layer,

[0025] b) forming a thermoelectric element in a thermoelectric material, on the metal layer, by additive manufacturing, preferably by SLS or FLLP, whereby a thermoelectric structure is obtained comprising the substrate successively covered by the metal layer and by the thermoelectric element.

[0026] The invention is fundamentally distinguished from the prior art by the implementation of a step during which the functionalization (metallization) of the ther element thermoelectric (for example a thermoelectric pad) is produced during the additive manufacturing process.

[0027] This leads not only to a significant reduction in the number of steps and therefore to a simplification of the process compared to the processes of the prior art, but also to a considerable saving of time and a reduction in costs.

[0028] The metallization obtained has good mechanical strength and good electrical and / or thermal conduction properties.

[0029] Preferably, the additive manufacturing technique is a powder bed laser fusion technique (FLLP or PBF for “Powder Bed Fusion” in English terminology) or a Selective Laser Sintering technique (FLS or SLS for “Selective Laser Sintering”).

[0030] Advantageously, the method comprises a subsequent step c) during which the substrate is removed, whereby a thermoelectric structure comprising the metal layer and the thermoelectric element is obtained.

[0031] Advantageously, the thermoelectric element is a part having the shape of a comb delimiting a base and a plurality of branches, substantially parallel to each other, extending substantially orthogonally from the base, the plurality of branches having a first end and a second end, the first end being connected to the base, and the second end of the plurality of branches being in contact with the metal layer.

[0032] Advantageously, the thermoelectric element is a pad, having a base and a height.

[0033] According to this advantageous variant, the metal layer may have the same surface area as the surface area of ​​the base of the pad. Still according to this advantageous variant, the metal layer may have a surface area greater than the surface area of ​​the base of the pad.

[0034] Advantageously, during step a), the metal layer locally covers the substrate so as to form a plurality of islands and a thermoelectric element or several thermoelectric elements are deposited on each island during step b).

[0035] Advantageously, the thermoelectric material is Si, SiGe, Bi2Te3, Half-Heusler, Skutterudites.

[0036] Advantageously, the substrate is 316L steel, aluminum, titanium, a CuZr alloy, a ceramic or graphite.

[0037] Advantageously, the metal layer is made of a material chosen from Al, Ti, Cu, Au and Ni.

[0038] The process has many advantages:

[0039] - it has a low number of steps,

[0040] - it is simple and economical,

[0041] - it allows great modularity of shape and design of the thermo- device electric manufactured,

[0042] - the plots can have complex shapes.

[0043] The invention also relates to a thermoelectric structure, obtained by such a method, successively comprising:

[0044] - possibly a substrate,

[0045] - a metallic layer, for example made of Al, Ti, Cu, Au or Ni,

[0046] - one or more thermoelectric elements, preferably pads, arranged on the metal layer.

[0047] The invention also relates to a thermoelectric device comprising two thermoelectric structures, as defined above, each structure comprising:

[0048] - optionally, a substrate,

[0049] - a metallic layer, for example made of Al, Ti, Cu, Au or Ni,

[0050] - one or more thermoelectric elements, preferably pads,

[0051] the thermoelectric element(s) of one of the thermoelectric structures being of a first type of conductivity and the thermoelectric element(s) of the other of the thermoelectric structures being of a second type of conductivity, opposite to the first type of conductivity.

[0052] Other characteristics and advantages of the invention will emerge from the additional description which follows.

[0053] It goes without saying that this additional description is given only as an illustration of the subject of the invention and must in no case be interpreted as a limitation of this subject. Brief description of the drawings

[0054] The present invention will be better understood on reading the description of exemplary embodiments given purely for informational purposes and in no way limiting, with reference to the appended drawings in which:

[0055] [Fig.lA]

[0056] [Fig.lB]

[0057] [Fig.lC] represent, schematically and in section, the different stages of a method of manufacturing a thermoelectric structure according to a first embodiment of the invention.

[0058] [Fig.2A]

[0059] [Fig.2B]

[0060] [Fig.2C]

[0061] [Fig.2D] represent, schematically and in section, the different stages of a method of manufacturing a thermoelectric device according to a second mode of carrying out the invention.

[0062] [Fig.3A]

[0063] [Fig.3B]

[0064] [Fig.3C]

[0065] [Fig.3D]

[0066] [Fig.3E] represent, schematically and in section, the different stages of a method of manufacturing a thermoelectric device according to a third embodiment of the invention.

[0067] [Fig.4A]

[0068] [Fig.4B]

[0069] [Fig.4C]

[0070] [Fig.4D] represent, schematically and in section, the different stages of a method of manufacturing a thermoelectric device according to a fourth embodiment of the invention.

[0071] [Fig.5A]

[0072] [Fig.5B]

[0073] [Fig.5C] represent, schematically and in section, the different stages of a method of manufacturing a thermoelectric structure according to a fifth embodiment of the invention.

[0074] [Fig.6A]

[0075] [Fig.6B]

[0076] [Fig.6C]

[0077] [Fig.6D] represent, schematically and in section, the different stages of a method of manufacturing a thermoelectric structure according to a sixth embodiment of the invention.

[0078] The different parts represented in the figures are not necessarily on a uniform scale, in order to make the figures more readable.

[0079] The different possibilities (variants and embodiments) must be understood as not being mutually exclusive and can be combined with each other.

[0080] Furthermore, in the following description, terms that depend on the orientation, such as "above", "below", etc. of a structure apply with the assumption that the structure is oriented as illustrated in the figures.

[0081] DETAILED DESCRIPTION OF PARTICULAR EMBODIMENTS

[0082] Although this is in no way limiting, the invention is particularly interesting for applications requiring thermoelectric generators (TEG or GTE for “ThermoElectric Generator”), where a thermal gradient is available (e.g. transport, industries, etc.), applications of radioisotope thermoelectric generators (RTG or GTR for “Radioisotope ThermoElectric Generators”) in particularly for SiGe, Peltier applications or even thermal sensor applications.

[0083] As shown in Figures 1A to 1C, 2A to 2B, 3A to 3C, 4A to 4B, 5A to 5C, 6A to 6D, the method of manufacturing a thermoelectric structure comprises the following steps:

[0084] a) providing a substrate 100, covered completely or locally, by a metal layer 300,

[0085] b) forming a thermoelectric element 200 in a thermoelectric material, on the metal layer 300, by additive manufacturing, preferably by SLS or FLLP, whereby a thermoelectric structure is obtained comprising the substrate 100 covered successively by the metal layer 300 and by the thermoelectric element (200),

[0086] c) optionally, removing the substrate 100, whereby a thermoelectric structure comprising the metal layer 300 and the thermoelectric element (200) is obtained.

[0087] The substrate 100 provided in step a) may be a tray or an over-tray. In additive manufacturing machines, the over-trays are fixed directly onto the trays, and make it possible, not only to obtain thinner thicknesses (between 200 μm and a few millimeters), but also to increase the nature of the usable materials. The over-tray is, advantageously, made of ceramic.

[0088] The substrate 100 is, for example, made of a metal (for example Al, Ti, Cu, Au or Ni), a metal alloy, a semiconductor material, ceramic or graphite. For example, it is made of 316L steel, Aluminum, Titanium, CuZr, ceramic or graphite.

[0089] The substrate 100 may have a thickness ranging from a few hundred micrometers to a few centimeters, and preferably from a few hundred micrometers to a few millimeters.

[0090] The substrate 100 provided in step a) is covered by a metal layer 300 (also called a bonding layer) made of a third material.

[0091] The bonding layer 300 can be deposited, for example, by Physical Vapor Deposition (or PVD for “Physical Vapor Deposition” in English), evaporation, sputtering.

[0092] The bonding layer 300 may locally cover (FIGS. 1A, 2A, 3A, 4A, 6A) or completely ([Fig. 5A]) the substrate 100. For example, the metal bonding layer 300 forms islands on the surface of the substrate 100.

[0093] To obtain a metal layer 300 locally covering the substrate 100, it is possible to carry out a localized deposition of this layer. Alternatively, it is possible to carry out a full-plate deposition of a continuous layer followed by a step during which a part of the continuous layer is removed, for example by etching, to form the islets.

[0094] The metal bonding layer 300 is made of a material different from that of the substrate 100.

[0095] The bonding layer 300 is, for example, made of metal or a metal alloy. Preferably, the metal is chosen from Al, Ti, Cu, Au and Ni. Several layers can be superimposed, for example, it can be a bilayer or a trilayer. A trilayer formed of a copper layer, a nickel layer and a gold layer can be chosen. By way of illustration and not limitation, it is possible to choose a trilayer formed of Cu (for example 200nm) + Ni (for example 5pm) + Au (for example 10nm).

[0096] After the formation of the bonding layer 300, an annealing step can be carried out.

[0097] During step b), the thermoelectric element 200 is formed on the metal bonding layer 300. It is in direct contact with this bonding layer 300.

[0098] The thermoelectric element 200 is made of a second material. The second material is preferably chosen from Si, SiGe, MnSi Bi2Te3, Half-Heusler, Skutterudites. Skutterudites are mineral species composed of cobalt and nickel arsenide of formula (Co, Ni)As3 x with traces of S, Bi, Cu, Pb, Zn, Ag, Fe and Ni.

[0099] The thermoelectric element 200 may have N-type conductivity to promote the movement of electrons (i.e. the material that composes it has a strictly negative Seebeck coefficient) or P-type conductivity to promote the movement of holes (i.e. the material that composes it has a strictly positive Seebeck coefficient).

[0100] For example, the N-type doped thermoelectric material is a phosphorus-doped silicon-germanium (SiGe) alloy or N-type doped polysilicon. The N-type dopant may be phosphorus or arsenic.

[0101] For example, the P-type material is a silicon-germanium (SiGe) alloy doped with boron or P-type doped polysilicon. The P-type dopant is preferably boron.

[0102] The dopant is advantageously integrated directly into the base powder.

[0103] One thermoelectric element 200 ([Fig.lB], 2B, 3B, 6B) or several thermoelectric elements 200, 201 may be formed on each island ([Fig.4B]).

[0104] The thermoelectric element 200 deposited in step b) is obtained by additive manufacturing. The method consists of depositing the material in several successive passes on the bonding layer 300. At the end of the successive depositions, the thermoelectric element is obtained. The substrate may be a plate or an over-plate.

[0105] The additive manufacturing technique is preferably a powder bed laser fusion technique (FLLP or PBF for “Powder Bed Fusion” in English terminology). Saxon) or a Selective Laser Sintering technique (“SLS” which is the acronym for “Selective Laser Sintering”) according to Anglo-Saxon terminology.

[0106] FLLP processes involve melting certain regions of a powder bed, for example using a laser beam.

[0107] In the SLS process, the powders are sintered. The powder materials do not pass into the liquid phase.

[0108] However, other additive manufacturing techniques can be considered, such as “Cold Spray”, “Electron Beam Melting”, etc.

[0109] The thermoelectric element 200 deposited in step b) can take several forms.

[0110] According to a first advantageous variant embodiment, the thermoelectric element 200 is a comb-shaped part ([Fig.5B]).

[0111] The part has the shape of a comb delimiting a base and a plurality of branches, substantially parallel to each other, extending substantially orthogonally from the base. The plurality of branches has a first end and a second end. The first end is connected to the base, and the second end is in contact with the metal attachment layer 300.

[0112] By “substantially orthogonal” is meant “orthogonal” or “orthogonal to within plus or minus 10° tolerance”.

[0113] By “substantially parallel” is meant “parallel” or “parallel to within plus or minus 10° tolerance”.

[0114] According to another embodiment, the thermoelectric element 200 is a pad (FIGS. 1B, 2B, 3B, 4B, 6A). The pad has a base having a surface area and a height.

[0115] The metal layer 300 may have the same surface area as the surface area of ​​the base of the pad or of the second end of the branches of the comb.

[0116] The metal layer 300 may have a surface area greater than the surface area of ​​the base of the pad. Very advantageously, during step b), several pads 200, 201 are deposited on the metal layer 300 ([Fig.4B]).

[0117] At the end of step b), a thermoelectric structure is obtained comprising a substrate 100, a continuous or discontinuous bonding layer 300, for example, in the form of islands, on which one or more thermoelectric elements 200 are formed.

[0118] After step b), thermal annealing can be carried out.

[0119] Advantageously, between step b) and step c), the method comprises an additional step during which an intermediate metallization layer 400 ([Fig.6B]) is deposited on the thermoelectric element 200, followed by an additional thermoelectric element 500 made of a fourth material ([Fig.6C]). The fourth material is different from the second material.

[0120] During step c), the substrate 100 is removed.

[0121] The substrate 100 can be removed by laser cutting, water jet, wire saw, etc.

[0122] At the end of step c), a thermoelectric structure is obtained comprising a metal attachment layer 300 on which one or more thermoelectric elements 200 are formed.

[0123] Thus, at the end of step b) or step c), a first thermoelectric structure is obtained.

[0124] Advantageously, the manufacturing method previously described is implemented to manufacture a second thermoelectric structure (Figures 2C, 3D and 4C).

[0125] The second structure successively comprises a substrate 110, a metal layer 310 and one or more thermoelectric elements 210, 211 (FIGS. 2C, 4C). The thermoelectric material of the second structure has a different doping than that of the first structure. The substrate 110 can be removed to have a thermoelectric structure comprising a metal layer 310 and one or more thermoelectric elements 210, 211 ([Fig. 3D]).

[0126] The two structures obtained are advantageously assembled and electrically connected to form a thermoelectric device (Figures 2D, 3E and 4D).

[0127] It is possible to connect the devices in series and / or in parallel. It is advantageous to combine series connections and parallel connections in order to optimize the electrical output performance of the fabricated thermoelectric device.

[0128] The materials of the metal layers 300, 310 of the two structures may be identical or different. The materials of the substrates 100, 110 used may be identical or different.

[0129] The invention is particularly interesting for manufacturing conventional thermoelectric modules, DBC substrates, so-called skeleton thermoelectric modules or even segmented thermoelectric pads.

[0130] The thermoelectric device obtained can operate in Seebeck mode (i.e. the thermoelectric device is then a generator of electrical energy) or in Peltier mode (i.e. the thermoelectric device is then a generator of thermal energy).

[0131] We will now describe in more detail different embodiments with reference to the attached figures.

[0132] According to a first embodiment shown in Figures 1A to 1C, the method comprises the following steps:

[0133] a) providing a substrate 100 made of a first material, locally covered by a metal layer 300 forming islands made of a third material,

[0134] b) depositing a thermoelectric pad 200 made of a second material on each island of the metal layer 300, by additive manufacturing, preferably by SLS or FLLP, the surface of the base of the pads being advantageously the same size as the surface of the islands,

[0135] c) removing the substrate 100, whereby a thermoelectric structure is obtained comprising thermoelectric pads 200 covered by a metal layer 300.

[0136] This first embodiment is advantageous because it allows the pads to be simply metallized by depositing a metal layer 300 on the plate of the additive manufacturing machine.

[0137] According to a second embodiment shown in Figures 2A to 2D, the method comprises the following steps:

[0138] a) providing a substrate 100 made of a first material, locally covered by a metal layer 300 forming islands made of a third material,

[0139] b) depositing a thermoelectric pad 200 made of a second material on each island of the metal layer 300, by additive manufacturing, preferably by SLS or FLLP, the surface area of ​​the base of the pads being advantageously less than the surface area of ​​the islands, whereby a first thermoelectric structure is obtained comprising a substrate 100 covered locally by a metal layer 300 forming islands, a thermoelectric pad 200 being arranged on each island,

[0140] d) repeating steps a) and b) to form a second thermoelectric structure comprising a substrate 110 locally covered by a metal layer 310 forming islands, each island being covered by a thermoelectric pad 210, the thermoelectric material of the thermoelectric pads of the second structure having a conductivity opposite to that of the second material of the first structure ([Fig.2C]),

[0141] e) assembling and electrically connecting the first thermoelectric structure and the second thermoelectric structure ([Fig.2D]).

[0142] This second embodiment is advantageous because it also allows skeleton modules to be produced.

[0143] According to a third embodiment, shown in Figures 3A to 3E, the method comprises the following steps:

[0144] a) providing a substrate 100 made of a first material, locally covered by a metal layer 300 forming islands made of a third material,

[0145] b) depositing a thermoelectric pad 200 made of a second material on each island of the metal layer 300, by additive manufacturing, preferably by SLS or FLLP, the surface area of ​​the base of the pads being advantageously less than the surface area of ​​the islands,

[0146] c) removing the substrate 100, whereby a first thermoelectric structure is obtained comprising thermoelectric pads 200 covered by a metal layer 300,

[0147] d) repeating steps a) to c) to form a second thermoelectric structure ( [Fig.3D]),

[0148] e) assembling and electrically connecting the first thermoelectric structure and the second thermoelectric structure ([Fig.3E]).

[0149] More particularly, step d) thus comprises the following steps:

[0150] - providing a substrate 110 made of a material which may be identical or different from that of the substrate 100 of the first structure, the substrate 110 being covered locally by a metal layer 310 forming islands,

[0151] - depositing a thermoelectric pad 210 made of a fourth material on each island of the metal layer 310, by additive manufacturing, preferably by SLS or FLLP, the surface area of ​​the base of the pads being advantageously less than the surface area of ​​the islands, the pads made of thermoelectric material of the second structure being a material of conductivity opposite to the conductivity of the thermoelectric material of the first thermoelectric structure,

[0152] - removing the substrate 110, whereby a thermoelectric structure is obtained comprising thermoelectric pads 210, 211 covered by a metal layer 310.

[0153] According to this third embodiment, skeleton modules can thus be formed ([Fig.3E]).

[0154] According to a fourth embodiment, shown in Figures 4A to 4D, the method comprises the following steps:

[0155] a) providing a substrate 100 made of a first material, locally covered by a metal layer 300 made of a third material, forming islands,

[0156] b) depositing several thermoelectric pads 200, 201, made of a second material on each island of the metal bonding layer 300, by additive manufacturing, preferably by SLS or FLLP, whereby a structure is obtained comprising a substrate 100 made of a first material covered by a metal layer 300 forming islands, on which several thermoelectric pads 200, 201 are arranged.

[0157] The same method is implemented to manufacture an additional structure comprising a substrate 110, locally covered by a metal layer 310 forming islands on which several thermoelectric pads 210, 211 are formed by additive manufacturing ([Fig.4C]). The thermoelectric pads 210, 211 of the second structure have a conductivity opposite to the conductivity of the pads 200, 210 of the first structure. The substrates 100, 110 of the two structures are, advantageously, ceramic over-plates, having for example a thickness between 200 μm and a few millimeters (for example 3 millimeters).

[0158] The two structures are then assembled ([Fig.4D]).

[0159] This fourth embodiment is particularly interesting because it allows series / parallel connections to be combined and thus optimize the electrical output performance. Indeed, it is possible to electrically connect the different thermoelectric pads in any way. Usually, all the pads are electrically connected in series. But this can lead to obtaining high output voltages (of several volts), which is incompatible with associated electronics ("power management unit") for which the voltages are generally a few volts. This embodiment makes it possible to connect certain pads in parallel while reducing the output voltage, and while maintaining the power generated.

[0160] According to a fifth embodiment shown in Figures 5A to 5C, the method comprises the following steps:

[0161] a) providing a substrate 100 made of a first material, covered by a layer 300 metal hook in a third material,

[0162] b) forming a comb-shaped thermoelectric part 200, made of a second material on the metal bonding layer 300, by additive manufacturing, preferably by SLS or FLLP,

[0163] c) removing the substrate 100 and cutting the metal bonding layer 300 to the size of the second end of the branches, whereby a comb 200 is obtained having branches metallized by a metal layer 300.

[0164] The same process is used to manufacture another comb made of a material with the opposite conductivity to the first comb. The two combs are then assembled.

[0165] According to a sixth embodiment shown in Figures 6A to 6D, the method comprises the following steps:

[0166] a) providing a substrate 100 made of a first material, locally covered by a metal layer 300, so as to form metal islands,

[0167] b) depositing a thermoelectric pad 200 made of a second material on each metal island covering the substrate 100, by additive manufacturing, preferably by SLS or FLLP, then a metallization layer 400 and another thermoelectric element 500 made of another thermoelectric material,

[0168] c) removing the substrate 100, whereby a thermoelectric structure is obtained comprising a metal layer 300 covered by a first thermoelectric pad 200, a metallization layer 400 then a second thermoelectric pad 500.

[0169] This embodiment is particularly advantageous for manufacturing segmented thermoelectric pads.

Claims

Claims

1. A method of manufacturing a thermoelectric structure comprising the following steps: a) providing a substrate (100), completely or locally covered, by a metal layer (300), b) forming a thermoelectric element (200) in a thermoelectric material, on the metal layer (300), by additive manufacturing, preferably by selective laser sintering or by laser powder bed fusion, characterized in that it comprises a subsequent step c) during which the substrate (100) is removed, whereby a thermoelectric structure comprising the metal layer (300) and the thermoelectric element (200) is obtained.

2. Method according to claim 1, characterized in that the thermoelectric element (200) is a pad, having a base and a height.

3. Method according to claim 1 or 2, characterized in that the metal layer (300) has the same surface as the surface of the base of the pad.

4. Method according to claim 1 or 2, characterized in that the metal layer (300) has a surface area greater than the surface area of ​​the base of the pad.

5. Method according to any one of claims 1 to 4, characterized in that, during step a), the metal layer (300) locally covers the substrate (100) so as to form a plurality of islands and in that one or more thermoelectric elements (200) are deposited on each island during step b).

6. Method according to claim 1, characterized in that the thermoelectric element (200) is a part having the shape of a comb delimiting a base and a plurality of branches, substantially parallel to each other, extending substantially orthogonally from the base, the plurality of branches having a first end and a second end, the first end being connected to the base, and the second end of the plurality of branches being in contact with the metal layer (300).

7. Method according to any one of the preceding claims, characterized in that the thermoelectric material is chosen from Si, SiGe, Bi2Te3, Half-Heusler and Skutterudites.

8. A method according to any one of the preceding claims, characterized in that the substrate (100) is 316L steel, aluminum, titanium, a CuZr alloy, a ceramic or graphite.

9. Method according to any one of the preceding claims, characterized in that the metal layer (300) is made of a material chosen from Al, Ti, Cu, Au and Ni.

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