Cooling system for at least one electronic device

Abstract

The invention relates to a cooling system (1) for at least one electronic device, in particular at least one computer server, said system comprising a tank (3) for receiving a heat transfer fluid, said tank (3) comprising a bottom (5) and a wall (7), an injection line (11) comprising a plurality of first openings (12) for injecting the heat transfer fluid at a first temperature into the tank (3), said injection line (11) extending over a first level (h1), a discharge line (13) and a pump (20) for circulating the heat transfer fluid in the tank (3), from the injection line (11) to the discharge line (13). The injection lines (11) and discharge lines (13) and the pump (20) are configured so as to allow a homogeneous distribution of the heat transfer fluid in the tank (3). Figure for the abstract: Fig. 1

Description

Title of the invention: Cooling system for at least one electronic device Technical field

[0001] The present invention relates to a cooling system for at least one electronic device, in particular at least one computer server. The present invention also relates to an assembly comprising such a cooling system and at least one electronic device. Previous Art

[0002] Computer servers experience an increase in temperature during operation. It is important to cool them to avoid a decrease in their performance, an increase in energy consumption or their damage. For this purpose, the servers can be placed in a tank and immersed in a dielectric fluid.

[0003] Document WO2017091862 describes a system for cooling electronic devices by immersion in a fluid contained in a tank. However, such a cooling system has drawbacks. In particular, the cooling of the electronic devices is not homogeneous but varies depending on the location of the electronic device in the tank.

[0004] The invention aims to overcome, at least in part, the aforementioned drawbacks of the prior art. More particularly, the invention aims to provide a simple, efficient, and compact cooling system. Summary of the invention

[0005] An object of the invention is therefore a cooling system for at least one electronic device, said system comprising: - a tank intended to receive a heat transfer fluid, said tank comprising a bottom and a wall; - an injection pipe comprising a plurality of first openings for injecting the heat transfer fluid at a first temperature into the tank, said injection pipe extending over a first level; - a discharge pipe comprising a plurality of second openings for discharging the heat transfer fluid at a second temperature from the tank, the second temperature being higher than the first temperature, said discharge pipe extending over a second level, said first level being proximal to the bottom of the tank and said second level being distal to the bottom of the tank; - a pump for circulating the heat transfer fluid in the pipe tank injection to the discharge line; the injection and discharge pipes and the pump being configured so as to allow a homogeneous distribution of the heat transfer fluid in the tank.

[0006] The sum of the diameters of the first openings may be equal, to within plus or minus 10%, to the diameter of the section of the injection pipe.

[0007] The sum of the diameters of the second openings may be equal, to within plus or minus 10%, to the diameter of the section of the discharge pipe.

[0008] The wall of the tank may comprise a layer of thermal insulation interposed between two layers of stainless steel.

[0009] The bottom of the tank may comprise a layer of thermal insulation interposed between two layers of stainless steel.

[0010] The thermal insulation layer may comprise at least one polymer, for example polystyrene.

[0011] The discharge pipe may comprise a first branch and a second branch, said first branch and said second branch being parallel to each other.

[0012] The tank can be closed with a watertight cover.

[0013] Said system may comprise a heat exchanger intended to receive the heat transfer fluid transmitted by the discharge pipe, said heat exchanger being capable of allowing energy recovery.

[0014] The heat exchanger may be a plate exchanger.

[0015] Said system may comprise a thermal energy management device to optimize the cooling of the electronic device and the recovery of energy.

[0016] The invention also relates to an assembly comprising a cooling system defined above, and at least two electronic devices arranged in a tank of said cooling system, said electronic devices being spaced apart by a gap, one of the first openings of an injection pipe of the cooling system opening into the gap so as to inject a heat transfer fluid directly into said gap.

[0017] [Fig.l] represents an embodiment of a cooling system.

[0018] [Fig.2] is a plan view showing one embodiment of a cooling system.

[0019] [Fig. 3] represents an embodiment of an injection pipe of a cooling system of the type of that of figures 1 and 2.

[0020] [Fig. 4] represents an embodiment of an evacuation pipe of a cooling system of the type of that of figures 1 and 2.

[0021] [Fig. 5] is a plan view showing one embodiment of a discharge pipe of a cooling system of the type shown in Figures 1 and 2.

[0022] [Fig.6] schematically represents an injection pipe of a system of cooling of the type shown in Figures 1 and 2.

[0023] [Fig. 7] is a plan view showing one embodiment of an assembly comprising a cooling system of the type shown in Figures 1 and 2 and several electronic devices. Description of figures

[0024] The applicant has demonstrated that the inhomogeneity of cooling of electronic devices in a tank of a cooling system usually used by immersion in a heat transfer fluid may be due to the fact that the heat transfer fluid is static or immobile in the tank. The invention proposes a cooling system aimed at improving the phenomenon of “natural” convection inside the tank.

[0025] Furthermore, the cooling systems usually used to cool electronic devices do not allow the energy generated by the electronic devices to be recovered in the form of heat. The thermal energy is dissipated without being able to be used.

[0026] The invention provides a cooling system for at least one electronic device, in particular at least one computer server, comprising a means for circulating a heat transfer fluid in a tank. Such a circulation means is intended, in particular, to improve heat transfer between the at least one electronic device and the heat transfer fluid without degrading the performance of the at least one electronic device, in particular the at least one computer server. Indeed, given the sensitivity of the electronic components in computer servers, it is not feasible to create high agitation in the tank. Such a cooling system also makes it possible to recover the thermal energy generated by the at least one electronic device.

[0027] A cooling system 1 for at least one electronic device is described below with reference to FIGS. 1 and 2.

[0028] The electronic device may be a computer server.

[0029] The cooling system 1 comprises a tank 3 intended to receive a heat transfer fluid. The heat transfer fluid is a dielectric fluid.

[0030] The heat transfer fluid is, for example, a dielectric oil, in particular mineral or synthetic. Advantageously, the heat transfer fluid may be biodegradable or biosourced.

[0031] The tank 3 comprises a bottom 5 and a wall 7. The wall 7 extends from the periphery of the bottom 5, in particular perpendicularly or substantially perpendicularly to the bottom 5.

[0032] An orthogonal reference frame X, Y, Z is defined. The bottom 5 can extend parallel or substantially parallel to the plane X, Y, in particular horizontally or substantially horizontally. The wall 7 may extend perpendicularly or substantially perpendicularly to the plane X, Y, in particular vertically or substantially vertically.

[0033] The tank 3 may be parallelepiped in shape.

[0034] The wall 7 may comprise a first longitudinal portion 7a and a second longitudinal portion 7b. The first longitudinal portion 7a may extend parallel or substantially parallel to the plane X, Z. The second longitudinal portion 7b may extend parallel or substantially parallel to the plane X, Z. The first and second longitudinal portions 7a, 7b may be parallel or substantially parallel to each other.

[0035] The wall 7 may include a first lateral portion 7c and a second lateral portion 7d. The first lateral portion 7c may extend parallel or substantially parallel to the Y, Z plane. The second longitudinal portion 7d may extend parallel or substantially parallel to the Y, Z plane. The first and second lateral portions 7c, 7d may be parallel or substantially parallel to each other.

[0036] The cooling system 1 includes an injection line 11. The injection line 11 defines a channel for the flow of a heat transfer fluid. The injection line 11 includes at least one first opening 12. The injection line 11 may include a plurality of first openings 12. At least one first opening 12 is intended for injecting a heat transfer fluid into the tank 3. A heat transfer fluid can be injected at a first temperature into the tank 3 via the injection line 11.

[0037] The injection pipe 11 extends over a first level hl, the first level hl being in particular perpendicular or substantially perpendicular to the axis Z.

[0038] The injection pipe 11 extends at least partially inside the tank 3. The injection pipe 11 can pass through the first lateral portion 7c of the wall 7 of the tank 3 at the location of an orifice 16.

[0039] The injection line 11 can extend inside the tank 3 in the direction X.

[0040] The cooling system 1 includes a drain line 13. The drain line 13 defines a channel for the flow of a heat transfer fluid. The drain line 13 includes at least one second opening 14. The drain line 13 may include a plurality of second openings 14. At least one second opening 14 is intended to discharge heat transfer fluid from the tank 3. Heat transfer fluid may be discharged at a second temperature from the tank 3 via the drain line 13, the second temperature being higher than the first temperature.

[0041] The discharge pipe 13 extends at least partially inside the tank 3. The discharge pipe 13 can pass through the first lateral portion 7c of the wall 7 of the tank 3 at the location of a first orifice 19a and / or a second orifice 19b.

[0042] The discharge pipe 13 extends over a second level h2, the second level h2 being in particular perpendicular or substantially perpendicular to the axis Z.

[0043] Said first level h1 is proximal to the bottom 5 of the tank 3. Said second level h2 is distal to the bottom 5 of the tank 3.

[0044] The discharge pipe 13 may comprise a first branch 13a and a second branch 13b, the first branch 13a and the second branch 13b being in particular parallel or substantially parallel to each other. The first branch 13a and / or the second branch 13b may extend over said second level h2.

[0045] The first branch 13a and / or the second branch 13b of the discharge pipe 13 comprises said at least one second opening 14. The first branch 13a and the second branch 13b are intended to be arranged inside the tank 3. The first branch 13a and the second branch 13b are intended to discharge heat transfer fluid from the tank 3 by recovering it via the at least one second opening 14. The first branch 13a of the discharge pipe 13 may comprise at least one second opening 14a. The first branch 13a of the discharge pipe 13 may comprise a plurality of second openings 14a. The second branch 13b of the discharge pipe 13 may comprise at least one second opening 14b. The second branch 13b of the discharge pipe 13 may comprise a plurality of second openings 14b.

[0046] The first branch 13a of the discharge pipe 13 can pass through the first lateral portion 7c of the wall 7 of the tank 3 at the location of the first orifice 19a. The second branch 13b of the discharge pipe 13 can pass through the first lateral portion 7c of the wall 7 of the tank 3 at the location of the second orifice 19b.

[0047] The first branch 13a of the discharge pipe 13 can extend inside the tank 3 in the direction X. The second branch 13b of the discharge pipe 13 can extend inside the tank 3 in the direction X.

[0048] The cooling system 1 comprises a pump 20, or circulator, for circulating the heat transfer fluid in the tank 3, from the injection pipe 11 to the discharge pipe 13.

[0049] The pump 20 is arranged in particular outside the tank 3. The pump 20 can be located opposite the first side wall 7c of the tank 3. The pump 20 is for example fixed to the first side wall 7c of the tank 3. The pump 20 can be in contact with the first side wall 7c of the tank 3.

[0050] The injection pipe 11, the discharge pipe 13 and the pump 20 form a fluid circuit 30.

[0051] The injection pipe 11, the discharge pipe 13 and the pump 20 can be configured so as to allow a homogeneous distribution of the heat transfer fluid in the tank 3.

[0052] The cooling system 1 may further include a heat exchanger 22 intended to receive the heat transfer fluid transmitted by the discharge pipe 13. Said heat exchanger 22 may be suitable for allowing energy recovery.

[0053] The fluid circuit 30 may further comprise said heat exchanger 22. The heat exchanger 22 is for example arranged along the fluid circuit 30 between the pump 20 and the injection pipe 11.

[0054] The heat exchanger 22 is for example a plate exchanger. This results in a reduced size of a cooling system 1 and high efficiency for energy recovery.

[0055] The heat exchanger 22 is, for example, single-phase.

[0056] The heat exchanger 22 is in particular arranged outside the tank 3. The heat exchanger 22 may be located opposite the first side wall 7c of the tank 3. The heat exchanger 22 is for example fixed to the first side wall 7c of the tank 3. The heat exchanger 22 may be in contact with the first side wall 7c of the tank 3.

[0057] The wall 7 of the tank 3 may comprise a layer of thermal insulation interposed between two layers of stainless steel. The layer of thermal insulation may comprise at least one polymer, in particular an elastomer. The layer of thermal insulation is for example made of polystyrene. Such a layer of thermal insulation is intended to minimize the evacuation of heat from the tank 3 through the wall 7. Such a layer of thermal insulation is intended to insulate the tank 3 to limit heat losses to the outside of the tank 3. Such a wall 7 comprising a layer of thermal insulation interposed between two layers of stainless steel may be called a double wall.

[0058] The bottom 5 of the tank 3 may comprise a layer of thermal insulation interposed between two layers of stainless steel. The layer of thermal insulation may comprise at least one polymer, in particular an elastomer. The layer of thermal insulation is for example made of polystyrene. Such a layer of thermal insulation is intended to minimize the evacuation of heat from the tank 3 through the bottom 5. Such a layer of thermal insulation is intended to insulate the tank 3 to limit heat losses to the outside of the tank 3.

[0059] The tank 3 can be closed by a cover 9, or hood, in particular watertight or having seals.

[0060] The cooling system 1 may further comprise a thermal energy management device for optimizing the cooling of said at least one electronic device and the energy recovery.

[0061] An advantage of a cooling system of the type described above is linked to the fact that it has a reduced size, the means for circulating the heat transfer fluid and dielectric being in particular located at least partly inside the tank 3, without reducing or by negligible reduction of the volume available inside the tank 3 to receive at least one electronic device 50 compared to a cooling system of the type of those usually used not comprising means for circulating the heat transfer fluid.

[0062] An injection line 11 of a cooling system 1 such as that described above is described in more detail below with reference to FIGS. 3 and 6.

[0063] The injection pipe 11 may comprise a first part 11a and a second part 11b.

[0064] The first part 11a comprises said at least one first opening 12. The first part 11a is intended to be arranged inside the tank 3. The first part 11a is intended to carry out the injection of the heat transfer fluid into the tank 3 via the at least one first opening 12.

[0065] A plurality of first openings 12 can be regularly spaced along the first part 1 of the injection line 11.

[0066] The first part 11a of the injection pipe 11 may be of straight elongated shape, in particular cylindrical, for example of circular section. The first openings 12 may extend on the surface of the first part 11a of the injection pipe 11 along a straight line parallel or substantially parallel to the main direction of elongation of the injection pipe 11.

[0067] The at least one first opening 12 is for example formed by drilling into the wall of the injection pipe 11.

[0068] The first openings 12 may be of identical or substantially identical shapes. The first openings 12 may be of identical or substantially identical dimensions.

[0069] The at least one first opening 12 may be circular in shape.

[0070] By diameter of the section of the injection pipe 11 is meant the diameter DI 1 of the section of the first part 11a of the injection pipe 11. D12 is the diameter of the at least one first opening 12.

[0071] L11 is the length of the first part 11a of the injection pipe 11, that is to say the dimension of the first part 11a of the injection pipe 11 along the main direction of elongation of the injection pipe 11. Dl1 is the distance between two successive openings 12.

[0072] The length L11 of the first part 11a of the injection pipe 11, the distance dl1 between two successive first openings 12 and the number of first openings 12 may be chosen in particular as a function of the dimensions of the tank 3 and as a function of the planned arrangement of at least one electronic device 50 in the tank 3.

[0073] The first part 11a of the injection pipe 11 comprises a first end 11a and a second end 112a. Heat transfer fluid is intended to circulate in the first part 11a of the injection pipe 11 from the first end 11a and towards the second end 112a.

[0074] The second part 11b of the injection pipe 11 is intended to connect the injection pipe 11 to the portion of the fluid circuit 30 located outside the tank 3.

[0075] The first end 11 of the first part 1 of the injection line 11 is intended to be connected to the pump 20, possibly with interposition of the heat exchanger 22.

[0076] The second part 11b of the injection pipe 11 may comprise a first portion 111b and a second portion 112b. The first portion 111b of the second part 11b of the injection pipe 11 may be straight, in particular cylindrical, for example of circular section. The first portion 111b of the second part 11b of the injection pipe 11 may be perpendicular or substantially to the first part 11a of the injection pipe 11. The second portion 112b of the second part 11b of the injection pipe 11 may be curved, for example in the form of an elbow, in particular cylindrical, for example of circular section. The second portion 112b may extend from the first end 11a of the first part 11a to the first portion 111b of the second part 11b of the injection pipe 11.

[0077] The injection pipe 11 may further comprise a fluid connector 11e located at the end of the injection pipe 11 intended to be located outside the tank 3. The fluid connector 11e of the injection pipe 11 is in particular intended to be connected to the pump 20, possibly with the interposition of the heat exchanger 22.

[0078] The injection pipe 11 may be at least partly in the form of a single mechanical part. This results in a method of facilitating the assembly of a cooling system 1.

[0079] A drain pipe 13 of a cooling system 1 such as that described above is described in more detail below with reference to Figures 4 and 5.

[0080] The evacuation conduit 13 may include a first part, including in particular the first branch 13a and / or the second branch 13b, and a second part 13c.

[0081] The first part 13a, 13b of the discharge pipe 13 comprises said at least one second opening 14. The first part 13a, 13b of the discharge pipe 13 is intended to be arranged inside the tank 3. The first part 13a, 13b of the discharge pipe 13 is intended to recover heat transfer fluid via the at least one second opening 14 and to discharge it from the tank 3.

[0082] A plurality of second openings 14a may be regularly spaced along the first branch 13a of the discharge conduit 13. A plurality of second openings 14b may be regularly spaced along the second branch 13b of the discharge conduit 13.

[0083] The first branch 13a of the discharge pipe 13 may be of straight elongated shape, in particular cylindrical, for example of circular section. The second openings 14a may extend on the surface of the first branch 13a of the discharge pipe 13 along a straight line parallel or substantially parallel to the main direction of elongation of the first branch 13a of the discharge pipe 13.

[0084] The second branch 13b of the discharge pipe 13 may be of straight elongated shape, in particular cylindrical, for example of circular section. The second openings 14b may extend on the surface of the second branch 13b of the discharge pipe 13 along a straight line parallel or substantially parallel to the main direction of elongation of the second branch 13b of the discharge pipe 13.

[0085] The at least one second opening 14, 14a, 14b is for example formed by drilling into the wall of the discharge pipe 13.

[0086] The second openings 14, 14a, 14b may be of identical or substantially identical shapes. The second openings 14, 14a, 14b may be of identical or substantially identical dimensions.

[0087] The at least one second opening 14, 14a, 14b may be circular in shape.

[0088] L13a is the length of the first branch 13a of the evacuation pipe. 13, that is to say the dimension of the first branch 13a of the discharge pipe 13 along the main direction of elongation of the first branch 13a of the discharge pipe 13. The distance between two successive second openings 14a is called dl3a.

[0089] L 13b is the length of the second branch 13b of the discharge pipe 13, that is to say the dimension of the second branch 13b of the discharge pipe 13 along the main direction of elongation of the second branch 13b of the discharge pipe 13. Dl3b is the distance between two successive second openings 14b.

[0090] The first branch 13a of the discharge pipe 13 comprises a first end 131a and a second end 132a. Heat transfer fluid is intended to circulate in the first branch 13a of the discharge pipe 13 from the first end 131a to the second end 132a.

[0091] The second branch 13b of the discharge pipe 13 comprises a first end 131b and a second end 132b. Heat transfer fluid is intended to circulate in the second branch 13b of the discharge pipe 13 from the first end 131b to the second end 132b.

[0092] The second part 13c of the discharge pipe 13 is intended to connect the discharge pipe 13 to the portion of the fluid circuit 30 located outside the tank 3.

[0093] The second end 132a of the first branch 13a and / or the second end 132b of the second branch 13b of the discharge pipe 13 is intended to be connected to the pump 20.

[0094] The second part 13c of the discharge pipe 13 may comprise a first portion 131c and a second portion 132c. The first portion 131c of the second part 13c of the discharge pipe 13 may be straight, in particular cylindrical, for example of circular section. The first portion 131c of the second part 13c of the discharge pipe 13 may be perpendicular or substantially to the first part of the discharge pipe 13, in particular to the first branch 13a and / or to the second branch 13b. The second portion 132c of the second part 13c of the discharge pipe 13 may be curved, for example in the form of an elbow, in particular cylindrical, for example of circular section. The second portion 132c can extend from the second end 132b of the second branch 13b to the first portion 131c of the second part 13c of the drain pipe 13.

[0095] The first branch 13a is in particular connected to a first end 17 of the second part 13c of the evacuation pipe 13. The second branch 13b is in particular connected to a second end 18 of the second part 13c of the evacuation pipe 13.

[0096] The second part 13c of the discharge pipe 13 may be intended to be located outside the tank 3. The second part 13c of the discharge pipe 13 may be located opposite the first side wall 7c of the tank 3, for example in contact with the first side wall 7c of the tank 3.

[0097] The evacuation pipe 13 may further comprise a fluid connector 13d, for example located at the first end 17 of the second part 13c of the evacuation pipe 13 and at the second end 132a of the first branch 13a.

[0098] According to one embodiment, the fluidic connector 13d could be located at the second end 18 of the second part 13c of the discharge pipe 13 and at the second end 132b of the second branch 13b. In this case, the second portion 132c may extend from the second end 132a of the first branch 13a to the first portion 131c of the second part 13c of the discharge pipe 13.

[0099] According to one variant, the fluidic connector 13d could be arranged at any other location of the second part 13c of the discharge line 13 intended to be located outside the tank 3, for example in the middle of the second part 13c of the discharge line 13 along the main direction of elongation of the second part 13c.

[0100] The discharge pipe 13 is for example at least partly in the form of a single mechanical part. This results in a method of easier assembly of a cooling system 1.

[0101] An example of dimensioning and operation of an injection pipe 11 such as that described above is described below with reference to [Fig. 6]. Only two first openings 12 are shown in [Fig. 6]. The following description applies to an injection pipe 11 comprising any number of first openings 12.

[0102] Heat transfer fluid arriving in the injection pipe 11 is represented by an arrow 40. A flow of the heat transfer fluid 44 in the injection pipe 11 is represented by arrows 4L. An injection of the heat transfer fluid 44 into the tank 3 through the at least one first opening 12 is represented by an arrow 42 for each first opening 12.

[0103] The injection pipe 11 may be configured so as to inject the heat transfer fluid 44 homogeneously along the injection pipe 11 through the different first openings 12. The injection pipe 11 may be configured so that the flow rate of the heat transfer fluid leaving the injection pipe 11 through the at least one first opening 12 is equal or substantially equal for all the first openings 12, regardless of the number of first openings 12 of the injection pipe 11 and regardless of the position of the at least one first opening 12 along the injection pipe 11.

[0104] To determine a geometry and dimensions of an injection pipe 11 making it possible to obtain an equitable distribution of the flow rate exiting through a plurality of first openings 12 of the injection pipe 11, the applicant carried out a calculation of pressure losses, in particular in the case where the first openings 12 are identical or substantially identical.

[0105] Heat transfer fluid entering the injection pipe 11 through the first end 111a under the effect of the pump 20 has a pressure higher than the pressure inside the tank 3. To pass inside the tank 3, the heat transfer fluid can pass through any first opening 12. To obtain an equitable distribution of the flow rate exiting through a plurality of first openings 12 of the pipe injection 11, the heat transfer fluid must undergo an identical or substantially identical pressure drop regardless of the first opening 12.

[0106] The flow rate Q of the heat transfer fluid entering the injection pipe 11 is equal to the sum of the flow rates (2; of the heat transfer fluid leaving the injection pipe 11 through each first opening 12: 101071 Q =

[0108] i being an integer from 1 to n, n being the number of first openings 12.

[0109] The flow rate Q. is the flow rate of the heat transfer fluid leaving the injection pipe 11 through the first opening 12 at position i along the injection pipe 11. The position i of the first opening 12 increases along the injection pipe 11, with position 1 corresponding to the first opening 12 closest to the first end 11a and position n corresponding to the first opening 12 furthest from the first end 11a.

[0110] In the case of the first two openings 12, one objective is to have Q} - Q^.

[0111] In the case of n first openings 12, an objective is to have Q; - Qi — Qn whatever the position i of the first opening 12.

[0112] The further the first opening 12 is from the first end 11a along the injection pipe 11, the more the flow rate Q. of the heat transfer fluid passing through this first opening 12 is likely to decrease.

[0113] During its passage in the injection pipe 11, the heat transfer fluid undergoes singular pressure losses, for example during the exit through the at least one first opening 12 or during a deviation in particular at the location of the elbow 112b, and pressure losses by friction against the wall of the injection pipe 11, during the flow in the injection pipe 11. In the case where the first openings 12 are identical, the heat transfer fluid undergoes the same singular pressure losses regardless of the first opening 12. On the other hand, depending on the position i of the first opening 12 along the injection pipe 11, the pressure losses by friction undergone by the heat transfer fluid are different. The pressure losses depend on the speed of the heat transfer fluid and therefore on the flow rate of the heat transfer fluid.

[0114] In order that the flow rate of the heat transfer fluid exiting the injection line 11 through at least one first opening 12 is equal or substantially equal for all first openings 12, regardless of the number of first openings 12 of the injection line 11 and regardless of the position i of at least one first opening 12 along the injection line 11, the injection line 11 can be configured so that the pressure losses due to friction are negligible compared to the singular pressure losses.

[0115] The sum of the diameters D12 of the first openings 12 may be equal or significant possibly equal to the diameter DI 1 of the section of the injection pipe 11.

[0116] The sum of the diameters D12 of the first openings 12 may be equal to the diameter DI 1 of the section of the injection pipe 11, to within plus or minus 10%.

[0117] By way of example, the length L11 of the first part 11a of the injection pipe 11 may be of the order of 1.3 meters. The injection pipe 11 may comprise seventeen first openings 12. The distance d11 between two successive first openings 12 may be of the order of 75 millimeters. The diameter DU of the section of the injection pipe 11 may be of the order of 38 millimeters. The diameter D12 of the at least one first opening 12 may be of the order of 2.2 millimeters.

[0118] The material of the first part 1 of the injection line 11 may be chosen so as to minimize pressure losses due to friction.

[0119] The discharge pipe 13 may be configured so as to recover the heat transfer fluid homogeneously along the discharge pipe 13 through the different second openings 14. The discharge pipe 13 may be configured so that the flow rate of the heat transfer fluid entering the discharge pipe 13 through the at least one second opening 14 is equal or substantially equal for all the second openings 14, regardless of the number of second openings 14 of the discharge pipe 13 and regardless of the position of the at least one second opening 14 along the discharge pipe 13.

[0120] To determine a geometry and dimensions of an evacuation pipe 13 making it possible to obtain an equitable distribution of the flow entering through a plurality of first openings 14 in the evacuation pipe 13, the applicant carried out a calculation of pressure losses, in particular in the case where the second openings 14 are identical or substantially identical.

[0121] In the case where the discharge pipe 13 comprises a single branch, the sum of the diameters of the second openings 14 may be equal or substantially equal to the diameter of the section of the discharge pipe 13. The sum of the diameters of the second openings 14 may be equal to the diameter of the section of the discharge pipe 13, to within plus or minus 10%.

[0122] The sum of the diameters of the second openings 14a may be equal or substantially equal to the diameter of the section of the first branch 13a of the discharge pipe 13. The sum of the diameters of the second openings 14b may be equal or substantially equal to the diameter of the section of the second branch 13b of the discharge pipe 13.

[0123] By way of example, the length L13a of the first branch 13a of the discharge pipe 13 may be of the order of 1.323 meters. The first branch 13a of the discharge pipe 13 may comprise sixteen second openings 14a. The distance dl3a between two successive second openings 14a may be of the order of 80 mil meters. The diameter of the section of the first branch 13a of the discharge pipe 13 may be of the order of 25 millimeters. The diameter of the at least one second opening 14a may be of the order of 1.6 millimeters.

[0124] By way of example, the length L 13b of the second branch 13b of the discharge pipe 13 may be of the order of 1.3 meters. The second branch 13b of the discharge pipe 13 may comprise sixteen second openings 14b. The distance dl3b between two successive second openings 14b may be of the order of 80 millimeters. The diameter of the section of the second branch 13b of the discharge pipe 13 may be of the order of 25 millimeters. The diameter of the at least one second opening 14b may be of the order of 1.6 millimeters.

[0125] The material of the first branch 13a of the discharge pipe 13 may be chosen so as to minimize pressure losses due to friction. The material of the second branch 13b of the discharge pipe 13 may be chosen so as to minimize pressure losses due to friction.

[0126] An assembly 100 comprising a cooling system 1 such as that described above and at least one electronic device 50, in particular at least one computer server, is described below with reference to [Fig.7].

[0127] The at least one electronic device 50 is for example a computer server.

[0128] The at least one electronic device 50 is for example of parallel shape. piped.

[0129] The at least one electronic device 50 comprises for example a first longitudinal face 50a, a second longitudinal face 50b, a first lateral face 50c, a second lateral face 50d, an upper face 50e and a lower face. The first longitudinal face 50a is in particular opposite the second longitudinal face 50b. The first lateral face 50c is in particular opposite the second lateral face 50d. The upper face 50e is in particular opposite the lower face. The at least one electronic device 50 can be arranged inside a tank 3 of the cooling system 1 so that the first and second longitudinal faces 50a, 50b are parallel or substantially parallel to the plane Y, Z. The at least one electronic device 50 can be arranged inside the tank 3 so that the first and second lateral faces 50c, 50d are parallel or substantially parallel to the plane X, Z.The at least one electronic device 50 can be arranged inside the tank 3 so that the lower face is opposite the bottom 5 of the tank 3.

[0130] The at least one electronic device 50 can be arranged inside the tank 3 so as to be immersed at least partially in heat transfer fluid.

[0131] The assembly 100 may comprise at least two electronic devices 50 arranged in the tank 3 and spaced apart by a spacing E. Said at least two dis electronic positives 50 may be arranged so that the second longitudinal face 50b of one of said at least two electronic devices 50 is opposite the first longitudinal face 50a of the other of said at least two electronic devices 50.

[0132] Said at least two electronic devices 50 may be arranged in the tank 3 so that one of the first openings 12 of the injection pipe 11 opens into the gap E so as to inject heat transfer fluid directly into said gap. As a result, heat transfer fluid is in direct contact with the casing or housing of the electronic devices 50, or even the electronic components themselves in the event of partial or total removal of the casing, which allows them to be cooled directly. This results in a high efficiency of such an assembly 100 for cooling the at least one electronic device 50 and for energy recovery.

[0133] By the expression “one of the first openings 12 of the injection pipe 11 opens into the spacing E”, it is meant that one of the first openings 12 of the injection pipe 11 is aligned with the spacing E.

[0134] The assembly 100 may comprise a plurality of electronic devices 50 arranged in the tank 3, two successive electronic devices 50 being able to be separated by a spacing E, in particular such that the second longitudinal face 50b of one of the electronic devices 50 is opposite the first longitudinal face 50a of another of the electronic devices 50 or such that the first longitudinal face 50a of one of the electronic devices 50 is opposite the first longitudinal face 50a of another of the electronic devices 50. The spacing E between two successive electronic devices 50 may be equal or substantially equal for the plurality of electronic devices 50. According to one embodiment, the spacing E between two successive electronic devices 50 may vary for the different electronic devices 50.

[0135] The electronic devices 50 may be arranged in the tank 3 so that the plurality of first openings 12 of the injection pipe 11 open into the spaces E between two successive electronic devices 50 so as to inject heat transfer fluid directly into the spaces E between two successive electronic devices 50. As a result, heat transfer fluid is in direct contact with the casing or the housing of the electronic devices 50, or even the electronic components themselves in the event of partial or total removal of the casing, which makes it possible to cool them directly. This results in a high efficiency of such an assembly 100 for cooling the at least one electronic device 50 and for energy recovery.

[0136] An advantage of an assembly 100 comprising a cooling system 1 such that which is described above lies in a high cooling efficiency.

[0137] An operation of an assembly 100 comprising a cooling system 1 of the type described above is described below.

[0138] The direction of circulation of the heat transfer fluid in the fluid circuit 30 is represented by an arrow 32.

[0139] Heat transfer fluid is injected at a first temperature into the tank 3 via the injection line 11 and by means of the pump 20. Heat transfer fluid flows inside the injection line 11 away from the pump 20 and enters inside the tank 3 through the at least one first opening 12. The temperature of the heat transfer fluid increases under the effect of the heat released by the at least one electronic device 50. Heat transfer fluid enters inside the discharge line 13 through the at least one second opening 14 and flows inside the discharge line 13 towards the pump 20. Heat transfer fluid is discharged at a second temperature out of the tank 3, the second temperature being higher than the first temperature, via the discharge line 13 and by means of the pump 20.

[0140] The heat transfer fluid recovered by and exiting the drain line 13 can pass through a heat exchanger 22 located outside the tank 3. The thermal energy generated during the operation of at least one electronic device 50 can thus be recovered, particularly for reuse. The recoverable thermal power can be managed according to the electrical power consumed by the at least one electronic device 50, in particular by computer servers.

[0141] An advantage of an assembly 100 of the type described above lies in the fact that it allows almost total recovery of the electrical power introduced into the assembly 100, in particular in the case where the thermal losses to the outside of the tank 3 are limited thanks to the wall 7 of the tank 3 and possibly to the bottom 5 of the tank 3 comprising a layer of thermal insulation, in particular polystyrene, interposed between two layers of stainless steel.

[0142] A thermal management method using a cooling system 1 of the type described above is described below.

[0143] In one step, at least one electronic device 50, in particular at least one computer server, may be arranged inside a tank 3 of said cooling system 1.

[0144] In one step, at least part of the thermal energy generated by the cooling of at least one electronic device 50 can be recovered via a heat exchanger 22 of said cooling system 1. As a result, the recovered energy can be reused as heat or converted back into cold.

[0145] Although the invention has been described above in the case of a discharge pipe 13 comprising a first branch 13a and a second branch 13b, the discharge line 13 could comprise a single branch or more than two branches. Although the invention has been described above in the case of an injection line 11 comprising a single branch, the injection line 11 could comprise several branches.

Claims

Claims

1. Cooling system (1) for at least one electronic device (50), said system comprising: - a tank (3) intended to receive a heat transfer fluid, said tank (3) comprising a bottom (5) and a wall (7); - an injection pipe (11) comprising a plurality of first openings (12) for injecting the heat transfer fluid at a first temperature into the tank (3), said injection pipe (11) extending over a first level (hl); - a discharge pipe (13) comprising a plurality of second openings (14) for discharging the heat transfer fluid at a second temperature out of the tank (3), the second temperature being higher than the first temperature, said discharge pipe (13) extending over a second level (h2), said first level (hl) being proximal to the bottom (5) of the tank and said second level (h2) being distal to the bottom (5) of the tank (3);- a pump (20) for circulating the heat transfer fluid in the tank (3), from the injection line (11) to the discharge line (13); the injection (11) and discharge (13) lines and the pump (20) being configured so as to allow a homogeneous distribution of the heat transfer fluid in the tank (3).;

2. System according to claim 1, in which: - the sum of the diameters of the first openings (12) is equal, to within plus or minus 10%, to the diameter of the section of the injection pipe (11); and / or - the sum of the diameters of the second openings (14) is equal, to within plus or minus 10%, to the diameter of the section of the discharge pipe (13).

3. 3. System according to any one of claims 1 or 2, in which the wall (7) of the tank (3) and / or the bottom (5) of the tank (3) comprises a layer of thermal insulation interposed between two layers of stainless steel.

4. A system according to claim 3, wherein the thermal insulating layer comprises at least one polymer, for example polystyrene.

5. A system according to any one of claims 1 to 4, wherein the discharge conduit (13) comprises a first branch (13a) and a second branch (13b), said first branch (13a) and said second branch (13b) being parallel to each other.

6. System according to any one of claims 1 to 5, in which the tank (3) is closed by a sealed cover (9).

7. System according to any one of claims 1 to 6, said system comprising a heat exchanger (22) intended to receive the heat transfer fluid transmitted by the discharge pipe (13), said heat exchanger (22) being capable of allowing energy recovery.

8. The system of claim 7, wherein the heat exchanger (22) is a plate exchanger.

9. A system according to any one of claims 7 or 8, said system comprising a thermal energy management device for optimizing the cooling of the electronic device (50) and the energy recovery.

10. An assembly (100) comprising a cooling system (1) according to any one of claims 1 to 9, and at least two electronic devices (50) arranged in a tank (3) of said cooling system (1), said electronic devices (50) being spaced apart by a spacing (E), one of the first openings (12) of an injection pipe (11) of the cooling system (1) opening into the spacing (E) so as to inject a heat transfer fluid directly into said spacing (E).

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