Method of assembling an integrated circuit in the vertical direction and component integrating a vertical integrated circuit

Abstract

The invention relates to a method for manufacturing a component (CMP) encapsulating an integrated circuit (IC), comprising steps consisting of: fixing an integrated circuit on a support (SB) and connecting connection pads (CC) of the integrated circuit to connection pads (CP) of the support; forming a first set of aligned conductive pads (CP), extending perpendicular to the support, each of the pads being electrically connected to a respective connection pad of the connection pads of the integrated circuit; encapsulating the integrated circuit and the pads in a resin layer formed on the support; and cutting the support and the resin layer along a cutting plane passing through each of the pads, so as to form a lateral cutting face in which each of the pads has an exposed face, the exposed faces of the pads forming lateral connection pads of the component. Figure 4

Description

Title of the invention: Method for assembling an integrated circuit in the vertical direction and component integrating a vertical integrated circuit Technical field

[0001] The present invention relates to the field of packaging integrated circuits. State of the art

[0002] Integrated circuits are generally placed in protective packages to facilitate their handling and assembly on printed circuit boards, while ensuring their function with mechanical and environmental protection. Such a package generally comprises a support on which the integrated circuit is fixed, and a layer of resin deposited on the support and encapsulating the integrated circuit. The support comprises connection elements of the package, connected to connection pads of the integrated circuit by conductive tracks or wires, the whole being embedded in a resin. There are a very large number of different types of packages. Depending on the type of package, the connection elements of the package can be distributed along edges of the package or on the lower surface of the latter, and can be in the form of tabs, balls or connection pads to be soldered.

[0003] Some integrated circuits, including sensors such as magnetic sensors, gyroscopes, and accelerometers, have a single, well-defined sensing axis. These sensors must be capable of being attached and connected to a printed circuit board via the package, allowing the sensor's sensing axis to be oriented in one of three non-coplanar or perpendicular directions.

[0004] It turns out that the vertical positioning of an integrated circuit in a package raises many difficulties in terms of manufacturing, cost, compactness, performance and heat dissipation.

[0005] It is therefore desirable to develop a manufacturing method for assembling an integrated circuit in a vertical position on a substrate such as a printed circuit board, which does not have these drawbacks. Summary

[0006] Embodiments relate to a method of manufacturing a component encapsulating an integrated circuit, comprising steps of: attaching an integrated circuit to a support and connecting connection pads of the integrated circuit to connection pads of the support; forming a first set of aligned conductive pads, extending perpendicular to the support, each of the pads being electrically connected to a respective connection pad of the circuit connection pads integrated; encapsulating the integrated circuit and the pads in a resin layer formed on the support; and cutting the support and the resin layer along a cutting plane passing through each of the pads, so as to form a lateral cutting face in which each of the pads has an exposed face, the exposed faces of the pads forming lateral connection pads of the component for fixing the lateral cutting face of the component against a printed circuit board by connecting the lateral connection pads to connection pads formed on the printed circuit board.

[0007] Thanks to these arrangements, it is possible to easily manufacture a component in which an integrated circuit is arranged perpendicular to a fixing and connection face of the component. Indeed, such a component can thus be obtained without having to provide additional manufacturing steps. Furthermore, such a so-called "vertical" position is particularly useful in particular for orienting a sensor having a detection direction. Such a vertical position is also particularly advantageous in terms of surface area occupied on a printed circuit board where the component is connected. This arrangement of the component can also be advantageous in terms of heat dissipation.

[0008] According to one embodiment, the pads of the first set of pads are vias formed through the support.

[0009] The formation of vias only uses common techniques and such vias are present in many types of integrated circuit supports. As a result, the formation of lateral connection pads does not involve additional manufacturing steps.

[0010] According to one embodiment, the pads of the first set of pads extend through the resin layer to connection pads formed on the support and each connected respectively to one of the connection pads of the integrated circuit.

[0011] Thus, the surface area of ​​each of the lateral connection pads depends on the height and the width or diameter of the pads. This surface area can therefore be adapted according to requirements, knowing that the thickness of the resin layer and therefore of the component depends on the height of the pads and that the maximum number of lateral connection pads or pads depends on the width of the latter.

[0012] According to one embodiment, the support is made of a conductive material.

[0013] The manufacturing process is thus compatible with an entirely metal support.

[0014] According to one embodiment, the pads of the first set of pads are located at- above vias formed through the support, the cutting plane passing through the vias.

[0015] Thus, the surface of the connection pads can be extended into the thickness of the support.

[0016] According to one embodiment, the pads of the first set of pads are formed by making holes through the resin layer and the support, and by filling the holes with a conductive material.

[0017] Thus, the resin layer can be used as a mold to form the pads.

[0018] According to one embodiment, the pads of the first set of pads extend from a first face of the support, the method comprising steps consisting of: forming a second set of conductive pads aligned and extending from a second face of the support opposite the first face, each of the pads of the second set of pads being electrically connected to a respective connection pad of the connection pads of the integrated circuit; and encapsulating the pads of the second set of pads in a resin layer formed on the second face of the support.

[0019] The number of lateral connection pads of the component can thus be multiplied by two.

[0020] According to one embodiment, the pads of the first and second sets of pads are formed by making holes through the resin layer to the support, and filling the holes with a conductive material.

[0021] Thus, the resin layer can be used as a mold to form the pads.

[0022] According to one embodiment, the method comprises a finishing step comprising operations of polishing the cutting face and depositing a conductive protective layer on the lateral connection pads.

[0023] It is thus possible to obtain lateral connection pads having the required qualities, as good as connection pads formed on the upper or lower face of a conventional component.

[0024] According to one embodiment, the connection pads of the integrated circuit are connected by wires to the connection pads of the support, the wires being embedded in the resin layer, or the connection pads of the integrated circuit are soldered to the connection pads of the support.

[0025] The method according to the invention applies equally well to techniques for connecting integrated circuits by wires or by connection pads and conductive tracks formed in the support.

[0026] According to one embodiment, a plurality of integrated circuits are fixed in rows and columns on the support, the connection pads of each of the integrated circuits being connected to respective connection pads of the support, the step of cutting the support separating the integrated circuits from each other and forming separate components.

[0027] Embodiments may also relate to an electronic component comprising: an integrated circuit, and a support, the component being obtained by the method defined previously.

[0028] According to one embodiment, the support is formed in a metal plate or in a plate comprising several layers comprising at least one layer in which conductive tracks are formed and a layer of a dielectric. Brief description of the figures

[0029] The present invention will be better understood with the aid of the following description of exemplary embodiments with reference to the appended figures, in which identical reference signs correspond to structurally and / or functionally identical or similar elements.

[0030] [Fig-1] Figures 1A and 1B are schematic top and front views of a integrated circuit fixed on a support, at a first stage of manufacturing a component encapsulating the integrated circuit, according to a first embodiment,

[0031] [Fig.2] Figures 2A and 2B are schematic top and front views of the integrated circuit fixed on the support, at a second stage of manufacturing of the component encapsulating the integrated circuit, according to the first embodiment,

[0032] [Fig.3] Figures 3A and 3B are schematic top and front views of the integrated circuit fixed on the support, at a third stage of manufacturing of the component encapsulating the integrated circuit, according to the first embodiment,

[0033] [Fig.4] Figures 4A and 4B are schematic front and side views, respectively, of the component of Figure 3A mounted on a printed circuit board, according to one embodiment,

[0034] [Fig.5] Figures 5A and 5B are schematic front and side views of an integrated circuit fixed on a support, at a first stage of manufacturing a component encapsulating the integrated circuit, according to a second embodiment,

[0035] [Fig.6] Figures 6A and 6B are schematic front and side views of the integrated circuit fixed on the support, at a second stage of manufacturing of the component encapsulating the integrated circuit, according to the second embodiment,

[0036] [Fig.7] Figures 7A and 7B are schematic front and side views of the integrated circuit fixed on the support, at a third stage of manufacturing of the component encapsulating the integrated circuit, according to the second embodiment,

[0037] [Fig.8] Figures 8A and 8B are schematic front and side views of the integrated circuit fixed on the support, at a fourth stage of manufacturing the component encapsulating the integrated circuit, according to the second embodiment,

[0038] [Fig.9] Figures 9A and 9B are schematic side and front views respectively, of the component of Figure 8A mounted on a printed circuit board, according to one embodiment,

[0039] [Fig. 10] Figures 10A and 10B are schematic front and side views of the integrated circuit fixed on the support, at the third stage of manufacturing of the component en- encapsulating the integrated circuit, according to a third embodiment,

[0040] [Fig. 11] Figures 11A and 11B are schematic front and side views of the integrated circuit fixed on the support, at a fourth stage of manufacturing the component encapsulating the integrated circuit, according to the third embodiment,

[0041] [Fig. 12] Figure 12 is a schematic top view of a printed circuit board to be cut supporting a plurality of copies of the integrated circuit, according to one embodiment,

[0042] [Fig. 13] Figure 13 is a schematic top view of a printed circuit board to be cut supporting a plurality of copies of the integrated circuit, according to another embodiment,

[0043] [Fig. 14] Figures 14A and 14B are schematic front and side views of an integrated circuit fixed on a support, at a first stage of manufacturing a component encapsulating the integrated circuit, according to a fourth embodiment,

[0044] [Fig. 15] Figures 15A and 15B are schematic front and side views of the integrated circuit fixed on the support, at a second stage of manufacturing of the component encapsulating the integrated circuit, according to the fourth embodiment,

[0045] [Fig. 16] Figures 16A and 16B are schematic front and side views of the integrated circuit fixed on the support, at a third stage of manufacturing of the component encapsulating the integrated circuit, according to the fourth embodiment,

[0046] [Fig. 17] Figures 17A and 17B are schematic front and side views of the integrated circuit fixed on the support, at a fourth stage of manufacturing the component encapsulating the integrated circuit, according to the fourth embodiment,

[0047] [Fig. 18] Figures 18A and 18B are schematic front and side views of the integrated circuit fixed on a support, at a first stage of manufacturing a component encapsulating the integrated circuit, according to a fifth embodiment,

[0048] [Fig. 19] Figures 19A and 19B are schematic front and side views of the integrated circuit fixed on the support, at a second stage of manufacturing of the component encapsulating the integrated circuit, according to the fifth embodiment,

[0049] [Fig.20] Figures 20A and 20B are schematic front and side views of the integrated circuit fixed on the support, at a third stage of manufacturing of the component encapsulating the integrated circuit, according to the fifth embodiment,

[0050] [Fig.21] Figures 21A and 21B are schematic front and side views of the integrated circuit fixed on the support, at a fourth stage of manufacturing the component encapsulating the integrated circuit, according to the fifth embodiment. Detailed description

[0051] Figures 1A and 1B represent an integrated circuit CI and a support SB, at a first stage of manufacturing a component in which the integrated circuit is encapsulated, according to a first embodiment. The SB support is a laminated substrate which may comprise one or more layers of conductive tracks separated by dielectric layers, for example of the organic type. The different layers of conductive tracks are connected to each other by vertical conductive elements called "vias". The integrated circuit CI itself may comprise, for example, a semiconductor substrate, several layers of conductive tracks separated by dielectric layers and CC connection pads formed on an upper face. The integrated circuit CI may also already be encapsulated in a package, for example of the WLP ("Wafer-level packaging") type and provided with connection pads, for example of the LGA ("Land Grid Array") or BGA ("Bail Grid Array") type.

[0052] During the first manufacturing step, the integrated circuit CI is assembled by being turned over using the "flip chip" technique so as to place the CC connection pads opposite CP connection pads formed on the SB support. The CC connection pads are then soldered onto the CP connection pads, for example using solder paste. Each of the CP connection pads of the support is connected by a CT conductive track to a respective metallized hole or MV via, formed in the SB support. The MV vias are aligned.

[0053] The circuit CI can also be arranged on the support SB without being turned over, that is to say, with the face of the circuit comprising the connection pads CC facing upwards, the connection pads CC being connected to the connection pads CP of the support SB by wires (by the "wire bonding" technique).

[0054] Figures 2A and 2B show the integrated circuit CI fixed on the support SB, at a second stage of manufacturing the component. During the second stage, the upper face of the support SB is entirely covered with a layer of resin IL encapsulating the integrated circuit CI and covering the entire upper face of the support SB.

[0055] Figures 3A and 3B represent the integrated circuit CI fixed on the support SB, at a third step of manufacturing the component. During the third step, the support SB and the resin layer IL are cut along a cutting plane CL perpendicular to the upper face of the support (figure 2A). The cutting plane CL passes through all the vias MV (for example through the center of each of the vias). Thus, following the cutting operation, each of the vias MV has an exposed face forming a lateral connection pad of the component. The cutting operation can be followed by a finishing step comprising operations of polishing the exposed faces of the vias, and of depositing on this face a protective layer (anticorrosion, anti-oxidation), for example by an ENEPIG process ("Electroless Nickel Electroless Palladium Immersion Gold").

[0056] The steps previously described up to encapsulation in the resin can be carried out collectively for a large number of integrated circuits arranged on the SB support, the components thus produced being then individualized, by cutting operations in particular following the SL cutting line.

[0057] Figure 4 shows the CMP component of Figure 3A mounted on a printed circuit board BD, according to one embodiment. The printed circuit board BD comprises CPB connection pads to which are soldered, for example using an SL solder paste, the MV vias cut, polished and protected by a finish (conductive protective layer?) forming lateral connection pads of the CMP component.

[0058] Figures 5A and 5B show an integrated circuit Cil fixed on a support SB1, at a first stage of manufacturing a component encapsulating the integrated circuit, according to a second embodiment. The support SB1 of the "leadframe" type, is in the form of a metal plate (for example made of copper alloy), with recesses delimiting a support element of the integrated circuit Cil, conductive tracks and SCP connection pads, formed by chemical etching or stamping. Thus, a Leadframe plate can form a matrix of several rows and columns of integrated circuit supports to form, after molding and cutting, several tens or even several hundreds of packages. At the manufacturing stage illustrated by Figures 5A, 5B, the integrated circuit Cil is placed on the support SB1, the face supporting the CC connection pads of the integrated circuit being turned upwards.The DC connection pads of the circuit are each connected to an SCP connection pad of the SB1 support, by a CW conductive wire soldered to each end.

[0059] Figures 6A and 6B show the integrated circuit Cil fixed on the support SB1, at a second step of manufacturing the component, according to the second embodiment. At this step, conductive pads CPR, for example made of copper, are formed on the connection pads SCP. The conductive pads CPR can be deposited on the support SB1 before the assembly of the integrated circuit CIL. The conductive pads CPR can have a height greater than that of the integrated circuit Cil above the support SB1.

[0060] The conductive pads can for example be made by depositing on the support SB1 a conductive bonding layer for example by spraying ("sputtering"), then a layer of photosensitive resin which is exposed to ultraviolet light, then developed so as to form holes at the locations of the pads to be made. The holes can then be filled with copper for example by electrochemical deposition. Finally, the photosensitive resin and bonding layers are completely removed, leaving copper pads. These operations can be repeated several times to increase the height of the pads, if necessary.

[0061] Figures 7A and 7B represent the integrated circuit C11 fixed on the support SB1, at a third stage of manufacturing of the component encapsulating the integrated circuit, according to the second embodiment. At this stage, the integrated circuit Cil, the conductive wires CW, and the pads CPR are embedded in a layer of resin IL1 deposited on the support SB1 and the support elements SBC. The layer of resin IL1 has a thickness greater than the height of the pads CPR on the support SB 1.

[0062] Figures 8A and 8B show the integrated circuit Cil fixed on the support SB1, at a fourth step of manufacturing the component encapsulating the integrated circuit, according to the second embodiment. During the fourth step, the support SB1 and the resin layer IL1 are cut along a cutting plane CL for example perpendicular to the upper face of the support (figure 7A). The cutting plane CL passes through all the pads CPR, for example through the center of each of the pads. Thus, each of the pads CPR has an exposed lateral face forming a lateral connection pad of the component.

[0063] Figure 9 shows the component CMP1 of Figure 8A mounted on a printed circuit board BD, according to one embodiment. The printed circuit board BD comprises connection pads CPB to which the cut CPR pads are soldered using a soldering material SL, forming lateral connection pads of the component CMP1.

[0064] Figures 10A, 10B, 11A, and 11B illustrate alternative steps to the second embodiment.

[0065] Figures 10A and 10B show the integrated circuit Cil fixed on the support SB1, at a third step of manufacturing the component encapsulating the integrated circuit, according to the third embodiment. During this step, the integrated circuit Cil, the conductive wires CW, and the connection pads CP are embedded in the resin layer IL1 deposited on the support SB1 and the connection pads SCP. Then, holes are formed through the resin layers IL1, and the connection pads SCP. The holes thus produced are then filled with a conductive material to form CRI pads. These holes thus form molds for producing the pads. The CRI pads can thus be formed at the same locations as the CPR pads.

[0066] In a following step illustrated by figures 11A and 11B, the support elements SBC, the resin layer IL1 and the CRI pads are cut as previously, following the cutting plane CL (figure 11A) which passes through all the CRI pads, for example through the center of each of the pads.

[0067] Figures 12 and 13 illustrate methods for collectively manufacturing components integrating an integrated circuit such as CIL. Figures 12 and 13 represent a metal plate forming the support SB1 on which integrated circuits Cil are arranged aligned in rows and columns, with a view to collectively manufacturing the components CMP1. The SCP connection pads formed on the plate SB1 and the CPR (or CRI) pads formed on the CP connection pads are aligned in columns between two pairs of columns of Cil integrated circuits. CPR (or CRI) pads are formed on the SCP connection pads. The assembly is covered with the IL1 resin layer. Figures 12 and 13 also show the CL cutting planes of the SB1 plate to separate the components each encapsulating one of the CIL integrated circuits. The CL cutting planes extend between each row and each column of CIL integrated circuits. The CL cutting planes between the columns of Cil integrated circuits pass through the SCP connection pads and the CPR (or CRI) pads.

[0068] In the example of figure 12, each of the SCP connection pads formed on the plate SB1 is connected to a CC connection pad of an integrated circuit CIL

[0069] In the example of Figure 13, a column of integrated circuits Cil is rotated 180°, and each column of integrated circuits Cil thus shares with another adjacent column of integrated circuits Cil a column of SCP connection pads and CPR pads. Every other cutting line CL, passing between the columns of integrated circuits Cil, separates a column of SCP connection pads and CPR pads in two. Thus, each CPR pad is cut to form a lateral connection pad for two adjacent components in Figure 13.

[0070] Figures 14A and 14B represent an integrated circuit CI2 fixed on a support SB, at a first step of manufacturing a component encapsulating the integrated circuit, according to a fourth embodiment. The support SB is a laminated substrate which may comprise one or more planes of conductive tracks, separated by dielectric layers. The integrated circuit CI2 is assembled in the reversed position using the "flip chip" technique so as to place the connection pads CC of the circuit CI2 opposite the support SB on connection pads CP formed on the support SB on which they are soldered. Each of the connection pads CP of the support is connected by a conductive track CT to a metallized hole or via MV formed in the support SB. The vias MV are substantially aligned, so as to be able to be cut simultaneously by a cutting plane oriented along their respective longitudinal axes.

[0071] Figures 15A and 15B represent the integrated circuit Cil fixed on the support SB, at a second step of manufacturing the component encapsulating the integrated circuit, according to the fourth embodiment. During this step, conductive pads CPR, for example made of copper, are formed on the vias MV.

[0072] Figures 16A and 16B show the integrated circuit CI2 fixed on the support SB, at a third step of manufacturing the component encapsulating the integrated circuit, according to the fourth embodiment. During this step, the upper face of the support SB is entirely covered with a layer of resin IL2 encapsulating the integrated circuit CI and the pads CPR.

[0073] Figures 17A and 17B represent the integrated circuit CI2 fixed on the support SB, at a fourth stage of manufacturing of the component encapsulating the integrated circuit, according to the fourth embodiment. During this step, the support SB, the resin layer IL2 and the CPR pads are cut along a cutting plane CL, for example perpendicular to the upper face of the support (figure 16A). The cutting plane CL passes through all the MV vias and the CPR pads, for example through the center of each of the vias and the pads. Thus, following the cutting operation, each of the MV vias and the CPR pads has an exposed face forming a lateral connection pad of the component. In this way, the exposed surface of each of the vias is extended to the exposed surface of one of the CPR pads to form a connection pad of the component. Compared to the first embodiment (figures 1 to 3), the connection pads thus produced have a larger surface, making it possible to make better quality connections of the component thus obtained.However, the formation of the MV vias may be omitted, knowing that the lateral cutting area of ​​each of the CPR pads may be larger than the lateral cutting area of ​​each of the MV vias of the first embodiment.

[0074] According to an alternative embodiment, the CPR pads are formed after the deposition of the IL2 resin layer by making holes in the IL2 resin layer, up to the MV vias or passing through the thickness of the SB support through the MV vias. The holes are then filled with a conductive material, thus forming the CPR pads.

[0075] The method according to the fourth embodiment (figures 14 to 17) can use the same integrated circuit and the same support as in the first embodiment.

[0076] Figures 18A and 18B show the integrated circuit CI2 fixed on the support SB2, at a first step of manufacturing a component encapsulating the integrated circuit, according to a fifth embodiment. The integrated circuit CI2 is assembled in the reversed position using the "flip chip" technique so as to place the CC connection pads of the circuit CI2 opposite the upper face of the support SB2 on CP connection pads formed on the support SB2 on which they are soldered. Some of the CP connection pads of the support SB2 are connected to CPI connection pads by respective CTI conductive tracks. The other CP connection pads are connected by a metallized hole or via MV formed in the support SB2 to a respective CT2 conductive track formed on a lower face of the support.The CPI, CP2 connection pads are substantially aligned, so that they can be cut simultaneously by a cutting plane oriented along their respective longitudinal axes.

[0077] Figures 19A and 19B represent the integrated circuit CI2 fixed on the support SB2, at a second step of manufacturing the component encapsulating the integrated circuit, according to the fifth embodiment. During this step, conductive pads CPR1, CPR2, for example made of copper, are formed on each of the upper and lower faces of the support SB2 on the connection pads CPI, CP2.

[0078] Figures 20A and 20B show the integrated circuit CI2 fixed on the support SB2, at a third step of manufacturing the component encapsulating the integrated circuit, according to the fifth embodiment. During this step, the upper and lower faces of the support SB2 are entirely covered with layers of resin IL2, IL2 encapsulating the integrated circuit CI and the pads CRI, CR2.

[0079] Figures 21A and 21B represent the integrated circuit CI2 fixed on the support SB2, at a fourth step of manufacturing the component encapsulating the integrated circuit, according to the fifth embodiment. During this step, the support SB2, the resin layer IL2 and the pads CRI, CR2 are cut along a cutting plane CL for example perpendicular to the upper face of the support (figure 20A). The cutting plane CL passes through all the pads CRI, C2, for example through the center of each of the vias and the pads. Thus, following the cutting operation, each of the pads CRI, C2 has an exposed face forming a lateral connection pad of the component. In this way, the number of lateral connection pads of the component can be multiplied by two.

[0080] According to an alternative embodiment, the pads CRI, CR2 are formed after the deposition of the resin layers IL2, IL3 by making holes in the resin layers IL2, IL3, up to the connection pads CPI, CP2. The holes are then filled with a conductive material, thus forming the pads CRI, CR2.

[0081] The method according to the fifth embodiment (figures 18 to 21) can use the same integrated circuit and the same support as in the first embodiment.

[0082] It should be noted that in the second to fourth embodiments (figures 5 to 17), the pads can be formed only on the face of the support opposite that where the integrated circuit is arranged.

[0083] It will be clear to those skilled in the art that the present invention is susceptible to various variant embodiments and various applications. In particular, the invention is not limited to the embodiment of the pads previously described, knowing that there are several ways of producing pads on a substrate. It should also be noted that the pads are not necessarily formed above vias, but simply on a conductive pad formed on the support.

[0084] Furthermore, the finishing step applied to the lateral connection pads can be omitted in certain applications, and depending on the support cutting technique used artwork.

Claims

Claims

1. 1. A method of manufacturing a component (CMP, CMP1) encapsulating an integrated circuit (CI, CI1, CI2), comprising steps of: fixing an integrated circuit on a support (SB, SB1, SB2) and connecting connection pads (CC) of the integrated circuit to connection pads (CP, SCP) of the support; forming a first set of aligned conductive pads (MV, CPR, CRI, CR2), extending perpendicular to the support, each of the pads being electrically connected to a respective connection pad of the connection pads of the integrated circuit; encapsulating the integrated circuit and the pads in a resin layer (IL, IL1, IL2) formed on the support;and cutting the support and the resin layer along a cutting plane (CL) passing through each of the pads, so as to form a lateral cutting face in which each of the pads has an exposed face, the exposed faces of the pads forming lateral connection pads of the component for fixing the lateral cutting face of the component against a printed circuit board (BD) by connecting the lateral connection pads to connection pads (CPB) formed on the printed circuit board.;

2. 2. Method according to claim 1, in which the pads of the first set of pads are vias (MV) formed through the support (SB).

3. 3. Method according to claim 1, in which the pads of the first set of pads (CPR, CRI, CR2) extend through the resin layer (IL1, IL2, IL3) to connection pads (SCP, CPI, CP2) formed on the support (SB, SB1, SB2) and each connected respectively to one of the connection pads (CC) of the integrated circuit (Cil, CI2).

4. 4. Method according to claim 3, in which the support (SB1) is made of a conductive material.

5. 5. Method according to claim 3, in which the pads of the first set of pads (CPR, CRI) are located above vias (MV) formed through the support (SB), the cutting plane (CL) passing through the vias.

6. 6. Method according to claim 3 or 5, in which the pads of the first set of pads (CPR, CRI) are formed by making holes through the resin layer (IL1, IL2) and the support (SB, SB1), and filling the holes with a conductive material.

7. 7. The method of claim 3, wherein the pads of the first set of pads (CRI) extend from a first face of the support (SB2), the method comprising steps of: forming a second set of conductive pads (CR2) aligned and extending from a second face of the support opposite the first face, each of the pads of the second set of pads being electrically connected to a respective connection pad (CC) of the connection pads of the integrated circuit (CI2); and encapsulating the pads of the second set of pads in a resin layer (IL3) formed on the second face of the support.

8. 8. The method of claim 7, wherein the pads of the first and second sets of pads (CR1, CR2) are formed by making holes through the resin layer (IL1, IL2, IL3) to the support (SB2), and filling the holes with a conductive material.

9. 9. Method according to one of claims 1 to 8, comprising a finishing step comprising operations of polishing the cutting face and depositing a conductive protective layer on the lateral connection pads.

10. 10. Method according to one of claims 1 to 9, in which the connection pads (CC) of the integrated circuit (CI, CI1) are connected by wires (CW) to the connection pads of the support (SB, SB1), the wires being embedded in the resin layer (IL1), or the connection pads (CC) of the integrated circuit (CI, CI2) are soldered to the connection pads (CP) of the support (SB, SB2).

11. 11. Method according to one of claims 1 to 10, in which a plurality of integrated circuits (CI, CI1, CI2) are fixed in rows and columns on the support (SB, SB1, SB2), the connection pads (CC) of each of the integrated circuits being connected to respective connection pads (CP, SCP) of the support, the step of cutting the support separating the integrated circuits from each other and forming separate components.

12. 12. Electronic component comprising: an integrated circuit (CI, CI1, CI2), and a support (SB, SB1, SB2), the component being obtained by the method according to one of claims 1 to 11.

13. 13. An electronic component according to claim 12, wherein the support is formed in a metal plate (SB1) or in a plate (SB, SB2) comprising several layers comprising at least one layer in which conductive tracks (CT) are formed and a layer of a dielectric.

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