Heat dissipation component attached to housing, assembly, process and associated computer program product

Abstract

Heat dissipation component mounted on a housing, assembly, method, and associated computer product / program. The present invention relates to a component (14) adapted for mounting on a housing (12), more particularly a housing containing at least one electronic circuit (20). The component (14) comprises at least one heat dissipation portion (26). This heat dissipation portion (26) comprises structures (32), the structures (32) being arranged so as to extend beyond the housing (12) when the component (14) is mounted on the housing (12). The structures (32) have a lattice shape, more particularly a triangulated system, or minimal triply periodic surfaces, or minimal doubly periodic surfaces. The invention further relates to an associated assembly, method, and computer product / program. Figure for the abstract: Fig 1

Description

Title of the invention: Heat dissipation component attached to housing, assembly, method and associated computer program product

[0001] The present invention relates to a heat dissipation part attached to a housing, more particularly a housing containing at least one electronic circuit.

[0002] The invention further relates to an assembly, a manufacturing process and associated instructions.

[0003] A housing, such as an electronic housing, contains components that can generate heat, which must be dissipated to avoid overheating.

[0004] The housing is, for example, provided with fins on an outer surface of a wall of the housing, the fins being of the same material as the wall of the housing.

[0005] The fins form a convection part with the outside to dissipate said heat.

[0006] The housing is then designed with the mechanical constraints related to its role as a housing, including resistance, lightness, etc., but also with the constraints related to heat dissipation: compromises are thus made between these different functions to design the housing, for example in terms of the material used.

[0007] Furthermore, each enclosure is designed for a specific use. In particular, when the enclosure includes a printed circuit board with specific components, the enclosure is sized and manufactured for that printed circuit board, and would not be suitable for another printed circuit board.

[0008] Thus, it may be necessary to provide package references for each printed circuit board reference (or other package contents) under consideration. This leads to complex management of the various components and a risk of damaging them.

[0009] Finally, in the event of a change of printed circuit board or component in a system, it is potentially necessary to change the housing.

[0010] The aim of the invention is therefore to propose a solution to overcome all of these problems

[0011] To this end, the invention relates to a part adapted to be mounted on a housing, more particularly a housing containing at least one electronic circuit, the part comprising at least one heat dissipation portion, said heat dissipation portion comprising structures, the structures being arranged so as to extend outside the housing when the part is mounted on the housing, the structures having a lattice shape, more particularly a triangulated system or triply periodic minimal surfaces or doubly periodic minimal surfaces.

[0012] Such a part is intended to be attached to the housing. It can therefore be specifically designed for heat dissipation, and the housing for its function as a housing, particularly in terms of materials. Furthermore, it is possible to have a housing compatible with different electronic circuits or other contents, the part being adapted to said container. This allows for easier management of the different components. Moreover, if the electronic circuit is changed, it is not necessary to change the entire housing, but possibly just the attached part.

[0013] Finally, lattice-shaped structures, and in particular triple-periodic minimum surfaces or doubly periodic minimum surfaces, are particularly advantageous for promoting convection, and therefore heat dissipation, and also contribute to providing mechanical resistance.

[0014] According to other advantageous aspects of the invention, the part comprises one or more of the following features, taken individually or in all technically possible combinations:

[0015] - the part is produced by additive manufacturing;

[0016] - it comprises at least one conductive portion, said conductive portion being adapted to extend into contact with at least one component arranged in an internal volume of the housing;

[0017] - the structures have a Kelvin cell shape;

[0018] - the part is made of metal, more particularly of copper or aluminum or steel.

[0019] The invention also relates to an assembly comprising a housing, more particularly a housing containing at least one electronic circuit, and at least one part as defined above, the at least one part being mounted on the housing, the at least one portion of heat dissipation being arranged outside the housing.

[0020] According to other advantageous aspects of the invention, the assembly comprises one or more of the following features, taken individually or in all technically possible combinations:

[0021] - the part comprises at least one conductive portion, the housing delimiting a internal volume, the assembly comprising at least one component arranged in the internal volume, at least one conductive portion being in contact with at least one component;

[0022] - the housing comprises at least one wall having at least one opening through, each conductive portion passing through at least one wall at the level of at least one through opening;

[0023] - the housing comprises at least one wall having at least one opening through, at least one piece covering at least one through opening.

[0024] The invention also relates to a method for manufacturing a part as defined above, the manufacturing method comprising an additive manufacturing step of said part.

[0025] The invention also relates to a computer program product comprising software instructions which, when executed by an assembly comprising a computer and an additive manufacturing device, implement a manufacturing process for the part as defined above.

[0026] The invention will become clearer upon reading the following description, given solely by way of non-limiting example, and made with reference to the drawings in which:

[0027] [Fig-1] [Fig. 1] is a cross-sectional view of an assembly according to a first embodiment of the invention, and

[0028] [Fig.2] [Fig.2] is a cross-sectional view of an assembly according to a second mode of realization of the invention.

[0029] An example of an assembly according to a first embodiment of the invention is schematically represented in [Fig.1].

[0030] The assembly 10 includes a case 12 and at least one part 14.

[0031] The housing 12 delimits an internal volume 16.

[0032] The assembly 10 comprises at least one component 18 arranged in the internal volume 16.

[0033] At least one component 18, hereafter referred to as the hot component, produces heat during operation.

[0034] The assembly 10 here comprises an electronic circuit 20 on which is mounted at least one component 18.

[0035] The electronic circuit 20 is arranged in the internal volume 16 of the housing 12.

[0036] More specifically, the electronic circuit 20 is fixed to the housing 12 in the internal volume 16.

[0037] The housing 12 includes at least one wall 22, on which the part 14 is intended to be mounted.

[0038] The wall 22 is, for example, flat.

[0039] The wall 22 here forms a face of the housing.

[0040] The casing is, for example, a rectangular parallelepiped.

[0041] Here, the or each piece 14 is mounted on a wall 22.

[0042] In a particular embodiment, the part or one of the parts 14 is arranged on two adjacent walls, the room following the contour of these walls.

[0043] In a particular embodiment, the part 14 surrounds, for example, the housing 12.

[0044] At least one wall 22 has, for example, at least one through opening 24.

[0045] The through opening 24 connects the internal volume 16 to the outside of the housing 12.

[0046] In the example shown in [Fig.1], at least one wall 22 has a single through opening 24 per piece 14, here a single through opening 24.

[0047] The housing 12 is, for example, made of polymer.

[0048] Alternatively, the case is, for example, made of titanium.

[0049] The housing 12 is, for example, made in several parts made separately and assembled together.

[0050] Alternatively, the housing 12 came from material, also called monobloc.

[0051] The one or each piece 14 came from material.

[0052] The part or each part 14 is made of a thermally conductive material.

[0053] Part 14 is here made of metal, more particularly of copper or aluminum or of steel, in particular stainless steel.

[0054] The part or each part 14 comprises at least one heat dissipation portion 26, here a single heat dissipation portion 26.

[0055] The part or each part 14 further comprises here at least one conductive portion 28.

[0056] The part or each part 14 further comprises, for example, an interface 30 between the less a heat dissipation portion 26 and at least a conductive portion 28.

[0057] In the example shown, the part or each part 14 comprises a single heat dissipation portion 26, at least one, preferably a plurality of, conductive portions 28 and an interface 30.

[0058] Part 14 or the set of parts 14 comprises or together comprise a conductive portion per hot component 18.

[0059] At least one heat dissipation portion 26 extends opposite at least one conductive portion 28.

[0060] More particularly, at least one heat dissipation portion 26 protrudes from one side of the interface and at least one conductive portion 28 protrudes from the opposite side of the interface 30.

[0061] The interface 30 is, for example, substantially flat.

[0062] The interface 30 is, for example, a plate.

[0063] The interface 30 serves, for example, to improve the sealing between the part 14 and the housing 12, for example by the placement of a gasket arranged between the interface 30 and the housing.

[0064] In this embodiment, the interface 30 also serves, for example, to close the housing 12, so as to prevent any introduction of foreign bodies into the housing, particularly through the openings delimited between the structures described below.

[0065] The interface 30 serves, for example, additionally for mounting the part 14 on the housing 12, for example by screwing by providing holes in the interface, by gluing, by welding, etc.

[0066] The heat dissipation portion 26 comprises structures 32, more particularly is made up of structures.

[0067] The structures 32 are arranged so as to extend out of the housing 12 when the part 14 is mounted on the housing 12.

[0068] The structures 32 have a lattice shape, for example of a triangulated system or of triply periodic minimal surfaces or of doubly periodic minimal surfaces.

[0069] A lattice is here defined as a structure composed of nodes and material links between these nodes.

[0070] A triply periodic minimal surface has zero mean curvature at every point, which locally minimizes faire, and extends periodically in three independent directions without self-intersections.

[0071] A doubly periodic minimal surface has zero mean curvature at every point, which locally minimizes faire, and extends periodically in two independent directions without self-intersections.

[0072] Such structures are particularly advantageous for promoting convection with a limited amount of material, and thus heat dissipation.

[0073] Advantageously, such structures offer good mechanical resistance, and thus contribute to the integrity of the whole.

[0074] Preferably, the structures have a Kelvin cell shape.

[0075] Such structures offer a particularly interesting ratio of heat dissipation to the mass of material used.

[0076] The structures 32 extend in projection from a so-called external face of the interface 30.

[0077] The structures 32 extend, for example, over at least 50% of the outer face of interface 30.

[0078] The structures 32 form an assembly extending in projection, here from the external face of the interface, of a constant dimension measured tangentially to the external face.

[0079] At least one conductive portion 28 extends in projection opposite the structures 32.

[0080] More particularly, at least one conductive portion 28 extends outward from an internal face of the interface 30.

[0081] The inner face of the interface 30 is arranged opposite to the outer face of the interface 30, here according to the thickness of the interface 30.

[0082] The at least one conductive portion 28 is adapted to extend into contact with at least one component arranged in an internal volume of the housing when the part is mounted on the housing, more particularly into contact with at least one hot component.

[0083] Here, each conductive portion 28 is adapted to extend into contact with a respective component, here called hot.

[0084] The location of the conductive portion(s) 28 is adapted to each arrangement of the components 18, here according to each printed circuit board 20.

[0085] Each conductive portion serves as a thermal drain, promoting the evacuation of thermal heat from the component to at least one heat dissipation portion and thus to the outside.

[0086] More specifically, each conducting portion 28 extends between a proximal end 34 and a distal end 36.

[0087] The proximal end 34 is connected to the rest of the part 14.

[0088] Here, the proximal end 34 is connected to the interface 30, more particularly to the inner face of the interface 30.

[0089] The distal end 36 is intended to extend into contact with at least one component.

[0090] In the example shown, each conducting portion 28 extends, between the proximal end and the distal end, along a principal direction.

[0091] The principal direction is, for example, tangent to the interface.

[0092] This facilitates the mounting of part 14 on housing 12 by facilitating the insertion of the conductive portion(s) 28 through the through opening.

[0093] Alternatively, each conductive portion 28 has any shape adapted to connect the respective component to the rest of the part 14.

[0094] A conductive portion 28 is thus likely to include bends, in particular to access components which would not extend in relation to a through opening.

[0095] At least one part 14 is mounted on the housing 12.

[0096] At least one portion of heat dissipation 26 is arranged outside the housing 12.

[0097] The conductive portion or portions 28 is in contact with at least one component 18.

[0098] At least one part 14 covers at least one through opening 24.

[0099] In the example shown in [Fig.1], part 14 covers one or the through opening.

[0100] Here, the set of conductive portions 28 of the part 14 passes through the same through opening 24, here the single through opening 24.

[0101] This embodiment is particularly advantageous with regard to the possibility of using the same housing for several different types of electronic circuits, by adapting only the part corresponding to the desired electronic circuit.

[0102] A second example of an embodiment of an assembly 110 according to the invention is shown in [Fig.2].

[0103] This second embodiment will only be described by the aspects by which it differs from the first embodiment.

[0104] Identical or similar elements are numbered with the same reference as in the first embodiment, incremented by 100.

[0105] The housing 112, more particularly at least one wall 122, here comprises a plurality of through openings 124.

[0106] More particularly, the housing 112 here includes a through opening 124 per conductive portion 128.

[0107] The through openings 124 are arranged on at least one wall 122 in a pattern similar to the arrangement of the proximal ends 134 of the conductive portions 128 on the part(s) 114.

[0108] Part 114 or the set of parts covers all the through openings 124.

[0109] Here, part 114 covers all of the through openings 124.

[0110] In the case of multiple parts, each part covers, more specifically, the through openings corresponding to these conductive portions.

[0111] Each conductive portion 128 passes through at least one wall at the level of a respective through opening among the through openings 124.

[0112] Each conductive portion 128 fills the respective through opening, within one clearance.

[0113] The internal volume 116 of the housing 112 is then, for example, not in direct contact with at least one portion of heat dissipation 126, and, furthermore here, with the interface 130.

[0114] In the embodiment shown, part 114 has an interface 130 as described above.

[0115] Alternatively, part 114 does not include an interface 130, the at least one conductive portion 128 extending directly from the at least one heat dissipation portion 126.

[0116] In an embodiment not shown, the housing includes several through openings, but fewer than the part includes conductive portions, at least one or two conductive portions passing, for example, through the same opening.

[0117] Such an embodiment corresponds to a hybrid between the first embodiment and the second embodiment.

[0118] In the examples shown, a single part 14, 114 is mounted on the housing 12, 112, but the assembly is likely to include a plurality of parts mounted on the housing.

[0119] Each part includes, for example, at least one conductive portion adapted to be in contact with a part of the components arranged in the internal volume, the conductive portions of the different parts being in contact with different components.

[0120] Where appropriate, one or more parts are, for example, mounted opposite a through opening common to the part, as in the example shown in [Fig.1], and / or one or more parts are, for example, mounted opposite a plurality of through openings, one through opening per conductive portion, as in the example shown in [Fig.2].

[0121] In a particular embodiment, the part did not come from a material, i.e., monobloc.

[0122] The conductive part(s) are, for example, secured to the rest of the part, for example by screwing, more particularly in the interface.

[0123] In a particular embodiment, the part does not include conductive parts promoting thermal conduction between hot components and at least a portion of heat dissipation.

[0124] Heat is transmitted by the fluid, here air, present in the internal volume of the casing.

[0125] The housing includes, for example, at least one through opening, the part extending opposite the at least one through opening.

[0126] The presence of the through opening allows a direct exchange of heat between the part and the fluid in the internal volume of the housing.

[0127] Additionally or alternatively, the housing is, for example, made of a thermally conductive material, for example metal.

[0128] The housing then promotes exchanges between the part and the fluid in the internal volume of the housing.

[0129] In an embodiment not shown, the part replaces one face of the housing.

[0130] More particularly, the housing is devoid of a wall on one face, the part being adapted to be mounted on the housing so as to cover said face.

[0131] When the part is mounted on the housing, the part closes the internal volume of the housing.

[0132] The invention further relates to a method for manufacturing a part as described previously.

[0133] The manufacturing process includes an additive manufacturing step of said part.

[0134] The invention further relates to a computer program product comprising software instructions which, when executed by an assembly comprising a computer and an additive manufacturing device, implement a manufacturing process for the part as described above.

[0135] The calculator is an electronic circuit designed to manipulate and / or transform data represented by electronic or physical quantities in registers of the calculator and / or memories into other similar data corresponding to physical data in register memories or other types of display devices, transmission devices or storage devices.

[0136] The computer is capable of sending a control signal to the additive manufacturing device.

[0137] As specific examples, the calculator is implemented in the form of a a programmable logic component, such as an FPGA (Field Programmable Gate Array), or an integrated circuit, such as an ASIC (Application Specifies Integrated Circuit).

[0138] Alternatively, when the method is implemented in the form of one or more software programs, i.e., in the form of a computer program, also called a computer program product, it is further capable of being stored on a computer-readable medium, not shown. The computer-readable medium is, for example, a medium capable of storing electronic instructions and being connected to a bus of a computer system. By way of example, the readable medium is an optical disc, a magneto-optical disc, ROM, RAM, any type of non-volatile memory (e.g., FLASH or NVRAM), or a magnetic card. A computer program comprising software instructions is then stored on the readable medium.

[0139] In addition, this further relates to a method of manufacturing an assembly as described above.

[0140] The manufacturing process comprises the following steps: - manufacturing by additive manufacturing of at least one part, - manufacturing of the casing, and - mounting at least one part onto the housing.

[0141] The housing is, for example, manufactured by injection, machining or additive manufacturing.

Claims

Demands

1. Part (14; 114) adapted for mounting on a housing (12; 112), more particularly a housing containing at least one electronic circuit (20), the part (14; 114) comprising at least one heat dissipation portion (26; 126), said heat dissipation portion (26; 126) comprising structures (32; 132), the structures (32; 132) being arranged so as to extend outside the housing (12; 112) when the part (14; 114) is mounted on the housing (12; 112), the structures (32; 132) having a lattice shape, more particularly a triangulated system or triply periodic minimal surfaces or doubly periodic minimal surfaces.

2. Part according to claim 1, wherein the part is produced by additive manufacturing.

3. Part according to claim 1 or 2, comprises at least one conductive portion (28; 128), said conductive portion (28; 128) being adapted to extend into contact with at least one component (18) arranged in an internal volume (16; 116) of the housing (12; 112).

4. Part according to any one of claims 1 to 3, wherein the structures (32; 132) have a Kelvin cell shape.

5. Part according to any one of claims 1 to 4, wherein the part (14; 114) is made of metal, more particularly of copper or aluminum or steel.

6. Assembly (10; 110) comprises a housing (12; 112), more particularly a housing containing at least one electronic circuit, and at least one part (14; 114) according to any one of claims 1 to 5, the at least one part (14; 114) being mounted on the housing (12; 112), the at least one heat dissipation portion (26; 126) being arranged outside the housing (12; 112).

7. Assembly according to claim 6, wherein the part (14; 114) comprises at least one conductive portion (28; 128), the housing (12; 112) delimiting an internal volume (16; 116), the assembly (10; 110) comprising at least one component (18) arranged in the internal volume (16; 116), the at least one conductive portion (28; 128) being in contact with the at least one component (18).

8. Assembly according to claim 7, wherein the housing (12; 112) comprises at least one wall (22; 122) having at least one through opening (24; 124), each conductive portion (28; 128) passing through at least one wall (22; 122) at the level of one of the at least one through opening (24; 124).

9. Assembly according to any one of claims 6 to 8, wherein the housing (12; 112) comprises at least one wall (22; 122) having at least one through opening (24; 124), at least one piece (14; 114) covering at least one through opening (24; 124).

10. Method of manufacturing a part (14; 114) according to any one of claims 1 to 5, comprising an additive manufacturing step of said part (14; 114).

11. Computer program product comprising software instructions which, when executed by an assembly comprising a computer and an additive manufacturing device, implement a manufacturing process for the part (14; 114) according to claim 10.

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