Modular heat pump system

Abstract

The present invention relates to a heat pump device (10) comprising a refrigeration circuit (100) configured to receive a refrigerant and a compressor (11) configured to circulate the refrigerant within the refrigeration circuit. Specifically, the heat pump device comprises a first set of interfaces (15) configured to connect an evaporator (101) to the refrigeration circuit, a second set of interfaces (16) configured to connect a condenser (102) to the refrigeration circuit, a pressure sensor (17) arranged on a first portion (100a) of the refrigeration circuit upstream of the second set of interfaces according to the direction of refrigerant flow within the circuit, and a control unit (12) configured to control the compressor's power output based on a first pressure measured by the pressure sensor. (See Figure 1 for abbreviations.)

Description

Title of the invention: Modular heat pump device technical field

[0001] The present invention relates to heat pump devices and systems incorporating a heat pump. The present invention also relates to heating and / or cooling devices for residential or commercial premises. More particularly, the present invention relates to heat pump installations operating with a refrigerant. Technological background

[0002] Heat pumps have become popular and efficient solutions for heating and cooling buildings, particularly, but not exclusively, residential buildings. They operate by exploiting the temperature differences between the interior and exterior environments of a building, extracting heat from the outside environment, such as the air or the ground, to heat the interior of the building in winter, and / or removing heat from the interior of the building to the outside environment in summer to cool the interior of the building. This technology offers numerous advantages, including high energy efficiency and a reduced environmental footprint compared to traditional heating and cooling systems.

[0003] However, with evolving environmental standards and growing concerns about greenhouse gases, the refrigerants used in heat pumps are subject to regular changes. Refrigerants used in older generations of heat pumps, such as hydrofluorocarbons (HFCs) or hydrochlorofluorocarbons (HCFCs), are gradually being replaced by more environmentally friendly alternatives, such as hydrocarbons (HC) or refrigerants with a low global warming potential (GWP).

[0004] These refrigerant changes pose particular challenges for owners of systems equipped with older generation heat pumps. The compatibility of new refrigerants with older systems may be limited, sometimes necessitating a complete upgrade or replacement of the system. Furthermore, the maintenance and repair of older heat pumps can become more complex and expensive, as spare parts and technical support for obsolete models may become scarce. To limit the costs and environmental impact of replacing an entire system, it is preferable to replace only the heat pump when a compatible replacement exists. This is because replacing underfloor heating or a geothermal collector, in which a fluid circulates, for example, is not always feasible. refrigerant, is particularly impactful, especially because their replacement generates significant degradation of their environment, for example the need to redo a screed and floor covering following a change of underfloor heating, or to call in a landscaper following a change of geothermal sensor.

[0005] It is therefore essential for property owners and managers to take these challenges into account when installing and maintaining heat pumps. Summary of the present invention

[0006] The present invention addresses at least one of the technological background problems described above by designing a heat pump device that can replace an old heat pump using a refrigerant fluid, the heat pump device being advantageously adaptable to different installations and scalable, thus allowing a long-term installation solution to be offered and of which, when installed in place of the old heat pump on an old installation, only defective parts of this installation are replaced.

[0007] To this end, the invention relates firstly to a heat pump device comprising: - a refrigeration circuit configured to receive a refrigerant, - a compressor configured to move the refrigerant in the refrigeration circuit and to increase the pressure of the refrigerant downstream of the compressor, and - an expansion valve, The heat pump system is characterized in that it comprises: - a first set of interfaces configured to connect an evaporator to the refrigeration circuit, - a second set of interfaces configured to connect a condenser to the refrigeration circuit, - a pressure sensor arranged on a first portion of the refrigeration circuit upstream of the second set of interfaces according to a direction of refrigerant flow in the refrigeration circuit, and - a control unit configured to control the compressor's power supply based on a first pressure measured by the pressure sensor.

[0008] Considering scalable solutions that are compatible with future environmental regulations helps ensure the long-term sustainability and performance of residential heating and air conditioning systems. Such a device can be installed on a system through which the refrigerant flows, the refrigerant replacing, for example, an old refrigerant that is no longer usable. Thus, only the heat pump unit is replaced while retaining an existing condenser and evaporator.

[0009] The pressure sensor associated with the control unit allows the compressor to be controlled in order to adapt the operation of the heat pump to the entire installation. The control unit thus modulates the power delivered to the compressor to avoid on / off operation, thereby reducing the number of start and stop cycles. The heat pump is therefore more versatile, durable, and requires less power, notably by limiting compressor restart phases.

[0010] According to one embodiment, the first set of interfaces includes a first output interface allowing the passage of the refrigerant from the refrigeration circuit to the evaporator and a first input interface allowing the passage of the refrigerant from the evaporator to the refrigeration circuit, and the second set of interfaces includes a second output interface allowing the passage of the refrigerant from the refrigeration circuit to the condenser and a second input interface allowing the passage of the refrigerant from the condenser to the refrigeration circuit.

[0011] These input and output interfaces facilitate the connection of parts of the evaporator and condenser circuits that are not part of the heat pump unit. Providing these interfaces eliminates the need for an installer to modify or adapt existing parts, thus ensuring, for example, a lasting seal.

[0012] According to an advantageous embodiment, the heat pump device comprises: - a first valve configured to open or close the first output interface, - a second valve configured to open or close the first input interface, - a third valve configured to open or close the second output interface, and - a fourth valve configured to open or close the second inlet interface.

[0013] These valves allow each circuit to be isolated, namely the refrigeration circuit, the evaporator circuit, and the condenser circuit. This makes it easier to perform maintenance on the isolated circuits. Purging and / or refilling one of the circuits is faster and requires less refrigerant compared to replacing the refrigerant in the entire system. Maintenance operations on the heat pump system are therefore less environmentally impactful.

[0014] According to one embodiment, the regulator is an electronic regulator, the regulator being controlled by the control unit as a function of a second pressure at the outlet of the regulator.

[0015] Controlling the opening or closing of the expansion valve then allows the operation of the installation to be optimized by managing the pressure in a way that is appropriate to the size of the evaporator and ensuring maximum efficiency of the heat pump device.

[0016] According to an advantageous embodiment, the compressor is a spiral-orbital type compressor.

[0017] This type of compressor is suitable for this type of heat pump device because it is capable of operating even when the refrigerant is partially condensed, i.e. in liquid phase.

[0018] According to one embodiment, the heat pump device includes a tank connected to the refrigeration circuit, such a tank making it possible to compensate for an overload of refrigerant.

[0019] According to one embodiment, the heat pump device includes a desiccant filter connected to the refrigeration circuit and configured to remove at least one contaminant from the refrigerant, in particular a "non-condensable" such as air, water, oil or corrosion debris.

[0020] According to one embodiment, the refrigerant is of the Hydrofluoro-Olefins type, such a refrigerant having a low GWP (global warming potential), allowing it to work at a lower pressure than a refrigerant of type R22 or R410a and allowing it to achieve a COP (coefficient of energy performance) between 4 and 5.

[0021] The invention also relates to a system comprising a heat pump device having at least one of the characteristics described above and at least one module, the module comprising: - a heat exchanger configured to cooperate with the evaporator or condenser, - a hydraulic circuit configured to receive a heat transfer fluid, and - a circulator configured to move the heat transfer fluid in the hydraulic circuit.

[0022] Adding a module allows the heat pump unit to be used with a fluid other than the one circulating in the refrigeration circuit. It is then possible to use the heat pump unit with a refrigerant and, via the heat exchangers, to cool and / or heat a heat transfer fluid, for example, a heat transfer liquid circulating in a hydraulic circuit separate from the refrigeration circuit. Thus, the same heat pump unit is adapted to operate with one or more circuits and with evaporator and condenser circuits of variable size and / or variable capacity.

[0023] According to one embodiment, at least one module includes a thermometer configured to measure a temperature of the heat transfer fluid in the hydraulic circuit, the circulator being controlled by the control unit according to the measured temperature.

[0024] The system is then able to regulate the circulation of the heat transfer fluid according to the result of a heat exchange between the refrigerant and the heat transfer fluid.

[0025] The invention also relates to a method for controlling a heat pump device or a system having at least one of the characteristics described above, characterized in that it is implemented by a control unit and comprises the following steps: - receipt of initial data representative of an initial pressure of a refrigerant fluid in an initial portion of a refrigeration circuit; - first comparison of the first pressure to a first threshold pressure; - control of a compressor's supply power based on the result of the first comparison.

[0026] Since the power delivered to the compressor is a function of the first pressure, the compressor only uses the energy necessary for the proper functioning of the heat pump device and avoids untimely stops and restarts.

[0027] According to one embodiment, the process further comprises the following steps: - receiving second data representative of a second refrigerant pressure in a second portion of the refrigeration circuit; - second comparison of the second pressure to a second threshold pressure; - control of a regulator based on a result of the second comparison.

[0028] According to one embodiment, the process further comprises the following steps: - receiving third data representative of a temperature of a heat transfer fluid in a hydraulic circuit; - third comparison of the temperature to a threshold temperature; - control of a circulator associated with the hydraulic circuit based on a result of the third comparison.

[0029] Each of the elements composing the heat pump device or system is thus controlled by the control unit which centralizes the data from the different sensors and controls each of the actuators in order to coordinate them and optimize the operation of the device or system.

[0030] The invention also relates to a computer program which includes instructions adapted for carrying out the steps of the process described above, in particular when the computer program is executed by at least one processor.

[0031] Such a computer program may use any programming language, and be in the form of source code, object code, or an intermediate code between source code and object code, such as in a partially compiled form, or in any other desirable form.

[0032] The invention also relates to a computer-readable recording medium on which is recorded a computer program comprising instructions for carrying out the steps of the process described above.

[0033] On the one hand, the recording medium can be any entity or device capable of storing the program. For example, the medium can include a storage means, such as a ROM, a CD-ROM or a microelectronic circuit-type ROM, or a magnetic recording means or a hard disk drive.

[0034] On the other hand, this recording medium can also be a transmissible medium such as an electrical or optical signal, such a signal being able to be transmitted via an electrical or optical cable, by conventional or radio frequency, by self-directing laser beam, or by other means. The computer program according to the invention can, in particular, be downloaded from an Internet-type network.

[0035] Alternatively, the recording medium may be an integrated circuit in which the computer program is incorporated, the integrated circuit being adapted to execute or to be used in the execution of the process in question. Brief description of the figures

[0036] Other features and advantages of the present invention will become apparent from the description below, with reference to the attached Figures 1 to 15, which illustrate various embodiments without being limiting in any way and on which:

[0037] [Fig-1] illustrates a diagram of a heat pump device according to a first particular embodiment of the present invention;

[0038] [Fig.2] illustrates a diagram of the heat pump device of [Fig.1] equipped with additional elements, according to a particular embodiment of the present invention;

[0039] [Fig.3] illustrates a diagram of the heat pump device of [Fig.1] equipped with other additional elements, according to a particular embodiment of the present invention;

[0040] [Fig.4] illustrates a diagram of a system comprising the heat pump device of [Fig.3] and a first module, according to a particular embodiment of the present invention;

[0041] [Fig.5] illustrates a diagram of a system comprising the heat pump device of [Fig.3] and a second module, according to a particular embodiment of the present invention;

[0042] [Fig.6] illustrates a diagram of a system comprising the heat pump device of [Fig.3], the first module and the second module, according to a particular embodiment of the present invention;

[0043] [Fig.7] schematically illustrates a first perspective view of a heat pump device, according to a particular embodiment of the present invention;

[0044] [Fig.8] schematically illustrates a second perspective view of the heat pump device of [Fig.7], according to a particular embodiment of the present invention;

[0045] [Fig.9] schematically illustrates a perspective view of an envelope of the heat pump device of [Fig.7], according to a particular embodiment of the present invention;

[0046] [Fig. 10] schematically illustrates a perspective view of envelopes of a system comprising the heat pump device of [Fig.7] and a module, according to a particular embodiment of the present invention;

[0047] [Fig.11] schematically illustrates a perspective view of the system of [Fig.10], according to a particular embodiment of the present invention;

[0048] [Fig. 12] illustrates a flowchart of the different stages of a process for controlling a heat pump device, according to a first particular embodiment of the present invention;

[0049] [Fig. 13] illustrates a flowchart of the different stages of a process for controlling a heat pump device, according to a second particular embodiment of the present invention;

[0050] [Fig. 14] illustrates a flowchart of the different stages of a method for controlling a system comprising a heat pump device and a module, according to a particular embodiment of the present invention; and

[0051] [Fig. 15] illustrates a flowchart of the different stages of a second method of controlling a system comprising a heat pump device, according to a particular embodiment of the present invention. Description of examples of achievements

[0052] A heat pump device, a system comprising such a heat pump device and a method for controlling such a heat pump device or system will now be described with reference to Figures 1 to 15.

[0053] The terms "first," "second" (or "firsts," "seconds"), etc., are used in this document by arbitrary convention to allow for the identification and distinction of different elements (such as operations, means, etc.) implemented in the embodiments described below. Such elements may be distinct or correspond to a single element, depending on the embodiment.

[0054] According to a particular embodiment, this heat pump device is designed to extract heat from an evaporator, for example from a geothermal circuit, and transfer it to a condenser, for example a heated floor. For this purpose, such a device comprises: - a refrigeration circuit configured to receive a refrigerant, - a compressor configured to move the refrigerant in the refrigeration circuit, the heat pump device being characterized in that it comprises: - a first set of interfaces configured to connect an evaporator to the refrigeration circuit, - a second set of interfaces configured to connect a condenser to the refrigeration circuit, - a pressure sensor arranged on a first portion of the refrigeration circuit upstream of the second set of interfaces according to a direction of refrigerant flow in the refrigeration circuit, and - a control unit configured to control the compressor's supply power based on a first pressure measured by said pressure sensor.

[0055] Fig. 1 illustrates a diagram of a heat pump device according to a first particular embodiment of the present invention.

[0056] Such a heat pump device 10 comprises a refrigeration circuit 100, through which a refrigerant flows. The refrigerant corresponds, for example, to a Hydrofluoro-Olefins (HFO) type refrigerant, known as R454C or by the trade name "Opteon XL20®". This refrigerant consists of 21.5% R32 (HFC type) and 78.5% R1234yf (HFO). This refrigerant is classified A2L, and therefore has the advantages of being only slightly flammable and of low toxicity. In addition, this fluid has a GWP (global warming potential) of 148, and is therefore environmentally friendly. However, other refrigerants can be used such as R22 which is based on hydrochlorofluorocarbon (HCFC) or R410A.

[0057] The refrigeration circuit comprises several sections of pipe, for example made of copper, which are of varying diameters and connected to each other, for example by means of brazed fittings, the brazing being a strong brazing with, in particular, alloys silver in order to withstand high pressures. Indeed, for optimal operation, the refrigerant reaches a pressure of 13 bars in some places for a refrigerant of type R454C, and can reach significantly higher pressures for other fluids, for example 14 bars for R22 or even 23 bars for R410A.

[0058] The refrigeration circuit 100 has a compressor 11, which circulates the refrigerant in the refrigeration circuit 100 when the circuit is closed and increases the pressure of the refrigerant downstream of the compressor 11. The compressor 11 is, for example, a spiral-orbital compressor, also known as a scroll compressor. Such a compressor is preferred to a piston or screw compressor. Indeed, the spiral-orbital compressor offers many advantages, such as: • high energy efficiency because it has fewer internal losses than other types of compressors and can maintain high efficiency over a wide range of operating conditions; • quiet operation thanks to the absence of moving parts hitting against each other and reducing vibrations; • high durability and reliability, their design involving few moving parts, thus reducing wear on internal elements and increasing their lifespan; • reduced maintenance thanks to a simple design and a low number of moving parts; • robust operation, such a compressor being for example capable of operating with part of the refrigerant gas present in liquid form; and • a small footprint.

[0059] The compressor 11 is notably controlled by a control unit 12, the control unit 12 being configured to control the electrical power delivered to or absorbed by the compressor 11. According to a particular embodiment, the control unit 12 is connected to the compressor 11 via a variable frequency drive (VFD) (not shown), also called an "inverter". The VFD regulates the power delivered to the compressor 11, notably as a function of a pressure measured by a pressure sensor 17, called the high-pressure sensor 17, positioned on the refrigeration circuit 100 downstream of the compressor 11 according to the direction of refrigerant flow. The measured pressure, referred to here as the measured high pressure, is, for example, compared to a target high pressure, and the power delivered to the compressor 11 depends on the result of this comparison.Thus, when the measured high pressure is lower than the target high pressure, the compressor 11 gradually starts up and accelerates until the measured high pressure reaches the target high pressure. When the measured high pressure approaches the target high pressure, the compressor 11 operates more slowly. Therefore, the compressor 11 does not operate. in all or nothing or in a binary way. The management of its operation is then more precise and allows optimization of the operation of the heat pump device 10.

[0060] The refrigeration circuit 100 also includes a first set of interfaces 15 configured to connect an evaporator 101 to the refrigeration circuit 100 and a second set of interfaces 16 configured to connect a condenser 102 to the refrigeration circuit 100.

[0061] According to this particular embodiment, the evaporator 101 and the condenser 102 are not part of the heat pump device 10. Indeed, the evaporator 101 is, for example, an existing geothermal collector, the heat pump device 10 replacing another, outdated heat pump device. However, the evaporator is connected to the refrigeration circuit 100 of the heat pump device 10 and is traversed by the same refrigerant as that present in the refrigeration circuit 100. Similarly, the condenser is, for example, a circuit through a heated floor connected to the refrigeration circuit 100 and is also traversed by the refrigerant present in the refrigeration circuit 100.Thus, this heat pump device 10 allows the replacement of another outdated heat pump device and is able to retain the evaporator 101 and condenser 102 if the latter are in good condition, i.e., for example, when they do not have any leaks.

[0062] Depending on the installation in which the heat pump device 10 is installed, the compressor 11, controlled by the control unit 12 via the variable frequency drive, adapts. Indeed, by controlling the power it receives, it is possible to use this same heat pump device 10 for different installations with varying lengths, cross-sections, and / or circuits forming the evaporator 101 and condenser 102. Controlling the compressor 11 thus ensures adaptability and therefore versatility of the heat pump device 10 of the present invention.

[0063] Furthermore, if the configurations of the evaporator 101 and / or the condenser 102 are modified during use, for example when a zone is activated or deactivated on a condenser heating circuit, then the heat pump device 10 adapts, the power delivered to the compressor being respectively reduced or increased in order to adapt to this change in configuration.

[0064] The interface assemblies 15, 16 are, for example, fittings with sockets made in copper tubing. In one particular embodiment, these sockets have a diameter of 1 / 2" and / or 5 / 8". Other diameters are of course possible, the diameters depending on the refrigerant flow rates passing through them and the state of the refrigerant passing through each fitting.

[0065] The heat pump device 10 also includes an expansion valve 14, located upstream of the evaporator 101. The purpose of this component is to ensure that the evaporator 101 is properly filled with refrigerant. The refrigerant enters the expansion valve in a liquid state, where its pressure and therefore its temperature drop. It then reaches a lower pressure, ideal for entering the evaporator 101.

[0066] The refrigeration circuit 100 is thus divided into three portions: • a first portion 100a, located between the compressor 11 and the second set of interfaces 16, i.e. downstream of the compressor 11 and upstream of the condenser 102, the high-pressure sensor 17 being positioned on this first portion 100a, • a second portion 100b, situated between the second set of interfaces 16 and the first set of interfaces 15, the second portion 100b connecting the condenser 102 to the evaporator 101, and • a third portion 100c included between the first set of interfaces 15 and the compressor 11.

[0067] According to this arrangement, the compressor 11 sends the refrigerant into the condenser 102 via the first portion 100a, the refrigerant then exits the condenser and goes to the evaporator via the second portion 100b, and then returns to the compressor 11 via the third portion 100c after passing through the evaporator 101.

[0068] Figure 2 illustrates a diagram of the heat pump device 10 of Figure 1 equipped with additional elements, according to a particular embodiment of the present invention. According to this particular embodiment, the first set of interfaces 15 comprises a first outlet interface 151 allowing the passage of the refrigerant from the refrigeration circuit 100 to the evaporator 101 and a first inlet interface 152 allowing the passage of the refrigerant from the evaporator 101 to the refrigeration circuit 100. Similarly, the second set of interfaces 16 comprises a second outlet interface 161 allowing the passage of the refrigerant from the refrigeration circuit 100 to the condenser 102 and a second inlet interface 162 allowing the passage of the refrigerant from the condenser 102 to the refrigeration circuit 100.

[0069] According to this particular embodiment, the heat pump device 10 comprises: - a first valve V1 configured to open or close the first output interface 151, - a second valve V2 configured to open or close the first inlet interface 152, - a third valve V3 configured to open or close the second output interface 161, and - a fourth valve V4 configured to open or close the second inlet interface 162.

[0070] The placement of valves VI, V2, V3, V4 on the sections leading to the interface elements 15, 16 allows the evaporator 101 and condenser 102 to be disconnected or isolated from the sections of the refrigeration circuit 100a, 100b, 100c. This greatly facilitates maintenance operations. Indeed, when replacing a component of the heat pump device 10, for example, the compressor 11, a sensor 17, and / or other components such as those shown below in relation to Figures 3 to 11, the time required for the maintenance operation is reduced, particularly because only the refrigeration circuit 100 or a section of the refrigeration circuit 100a, 100b, 100c is opened. Thus, the time required to evacuate the portion emptied of its refrigerant and then the time required to refill it are greatly reduced.For example, the time required for evacuation is reduced from one or more days, depending on the size of the entire installation, to one hour. Furthermore, the quantities of refrigerant to be recovered and then recharged are also limited. Therefore, adding V1, V2, V3, and V4 valves at the interfaces facilitates maintenance, reduces its cost, and limits the amount of refrigerant handled.

[0071] Figure 3 illustrates a diagram of the heat pump device 10 of Figure 1 equipped with additional elements, according to a particular embodiment of the present invention. Obviously, the additional elements shown opposite Figure 2 can be combined with the additional elements shown opposite Figure 3, as well as with the elements shown opposite the following figures.

[0072] The second portion 100b of the refrigeration circuit comprises various additional elements. Thus, depending on the direction of refrigerant flow, from the second inlet interface 162 towards the first outlet interface 151, the second portion 100b successively comprises the elements shown below.

[0073] The heat pump device 10 comprises, according to this particular embodiment, a reservoir 18 configured to store any excess refrigerant in the refrigeration circuit 100, the evaporator 101, and the condenser 102. Its capacity is determined so as to allow the heat pump device 10 to operate with excess refrigerant. The reservoir 18 has, for example, a capacity of between 4.5 and 6 liters.

[0074] The heat pump device 10 comprises, according to this particular embodiment, a desiccant filter 13, also called a desiccant bottle, which prevents moisture, mold and solid pollutants from entering the refrigeration circuit. 100 during its lifetime. Its role is notably to secure the condensation process of the fluid at the condenser outlet and to ensure the return of the oil to the compressor 11. This element, however, requires regular replacement to avoid serious breakdowns and the costly replacement of other components of the heat pump system 10.

[0075] An oil recovery unit 22 is also arranged upstream of the condenser 102, in order to avoid any downstream pollution of the refrigeration circuit.

[0076] The heat pump device 10 also includes the expansion valve 14. According to this particular embodiment, the expansion valve 14 is electronic and is controlled by the control unit 12, in particular based on a pressure measured in the third portion 100c, this pressure being hereafter referred to as the measured low pressure and being measured by a transducer-type low-pressure sensor 17' connected to the control unit 12. The measurement of this low pressure allows the heat pump device 10 to adapt to the dimensions of the evaporator 101 by controlling the opening of the expansion valve 14.

[0077] Upstream of the compressor 11, in the third section 100c, a liquid slug arrestor 19 is arranged according to this particular embodiment. The liquid slug arrestor prevents the compressor 11 from ingesting liquid. Indeed, even though a spiral-orbital compressor is capable of operating with a certain percentage of liquid ingested, it is preferable to avoid any presence of liquid in order to optimize the operation of the heat pump device 10.

[0078] To ensure the safety of the heat pump device 10, it also includes pressure switches. Thus, a high-pressure switch 20 is arranged on the first section 100a between the compressor 11 and the high-pressure sensor 17, and a low-pressure switch 21 is arranged on the third section 100c between the low-pressure sensor 17' and the liquid slug protection device 19. The pressure switches are designed to cut off the power supply to the compressor 11 when threshold values ​​are exceeded.

[0079] These various additional elements make it possible to make the heat pump device 10 more robust and / or to make it suitable for many installations of varying dimensions, in particular those with evaporators 101 and condensers 102 that are very different from each other.

[0080] Figure 4 illustrates a diagram of a system 99 comprising a heat pump device, for example a heat pump device of Figures 1 to 3 and a first module 200, according to a particular embodiment of the present invention.

[0081] The first module 200 comprises: - a first heat exchanger 200a configured to cooperate with the evaporator 101, - a first 200 bar hydraulic circuit configured to receive a heat transfer fluid, and - a first circulator 200c configured to move the heat transfer fluid in the first hydraulic circuit 200b.

[0082] Such a system 99 corresponds, for example, to an installation in which the evaporator 101 is not a geothermal collector, the geothermal collector being separate and flowing through another type of heat transfer fluid rather than the refrigerant, for example, glycol water. Thus, the refrigerant does not draw heat directly from the ground through an underground circuit, for example, but rather draws heat from the heat transfer fluid through the first heat exchanger 200a. Such a heat exchanger is, for example, a plate heat exchanger. The refrigerant is then the cold fluid, while the heat transfer fluid is the hot fluid.

[0083] The evaporator 101 circuit is then very short, and the control of the power delivered to the compressor 11 and optionally the control of the expansion valve 14 make it possible to adapt the operation of the heat pump device 10 to this configuration which is very different from a configuration in which the evaporator 101 is, for example, a geothermal collector.

[0084] According to the example illustrated in [Fig.4], the first module 200 includes a first thermometer 200d, commonly called a probe or temperature probe, configured to measure a temperature of the heat transfer fluid in the first hydraulic circuit 200b, the circulator 200c being controlled by the control unit 12 as a function of the temperature of the heat transfer fluid in the first hydraulic circuit measured by the first thermometer.

[0085] This type of system is used, for example, to equip a dwelling with underfloor heating using refrigerant and a geothermal collector using heat transfer fluid. It is also possible to initially install only the heat pump unit 10, provided the dwelling includes a geothermal collector using refrigerant. If, some time after installation, the geothermal collector using refrigerant becomes defective, for example, due to a leak, then it is possible to retain the existing installation with the heat pump unit 10 already installed and to add the first module 200 to make the system 99 compatible with a hot water geothermal collector, for example, or with an air-to-water collector, as in another example.

[0086] Figure 5 illustrates a diagram of a system 99 comprising a heat pump device, for example a heat pump device of Figures 1 to 3 and a second module 300, according to a particular embodiment of the present invention.

[0087] The second module 300 comprises: - a second heat exchanger 300a configured to cooperate with evaporator 101, - a second 300 bar hydraulic circuit configured to receive a heat transfer fluid, and - a second 300c circulator configured to move the heat transfer fluid in the second hydraulic circuit 300b.

[0088] Such a system 99 corresponds, for example, to an installation in which the condenser 102 is not part of a radiant floor heating system, the radiant floor heating system consisting of a separate hydraulic circuit and flowing through a different type of heat transfer fluid rather than the refrigerant, for example, glycol water. Thus, the refrigerant delivers heat not directly through the radiant floor heating system, for example, but rather to the heat transfer fluid via the second heat exchanger 300a. Such a heat exchanger is, as before, for example, a plate heat exchanger. The refrigerant is then the hot fluid, while the heat transfer fluid is the cold fluid.

[0089] The condenser circuit 102 is then very short, and the control of the power delivered to the compressor 11 makes it possible to adapt the operation of the heat pump device 10 to this configuration which is very different from a configuration in which the condenser 102 is, for example, a floor heating circuit.

[0090] According to the example illustrated in [Fig.5], the second module 300 includes a second thermometer 300d configured to measure a temperature of the heat transfer fluid in the second hydraulic circuit 300b, the circulator 300c being controlled by the control unit 12 as a function of the temperature of the heat transfer fluid in the second hydraulic circuit measured by the second thermometer.

[0091] This type of system is used, for example, to equip a dwelling with a geothermal collector circulating the refrigerant and equipped with a hot water heating system. It is also possible to initially install only the heat pump unit 10, provided the dwelling has underfloor heating circulating the refrigerant. If, some time after installation, the underfloor heating system becomes defective, for example due to a leak, then it is possible to retain the existing installation with the heat pump unit 10 already installed and to add the second module 300 to make the system 99 compatible with a hot water heating system, for example.

[0092] Figure 6 illustrates a diagram of a system comprising a heat pump device, for example the heat pump device 10 of one of Figures 1 to 3, a first module, for example module 200 of Figure 4, and a second module. for example the second module 300 of [Fig.5], according to a particular embodiment of the present invention.

[0093] The system 99 includes the heat pump device 10 to which two modules 200, 300 are attached, in order to make it compatible with external hydraulic circuits through which heat transfer fluids flow.

[0094] According to a particular embodiment, only the heat pump device 10 is installed initially, then the modules 200, 300 are installed successively after failure of an original evaporator and condenser or following modifications to the installations allowing to capture the calories and / or to release them.

[0095] Figures 7 and 8 schematically illustrate perspective views of a heat pump device, for example a heat pump device 10 shown in one of Figures 1 to 3, according to a particular embodiment of the present invention.

[0096] These perspective views illustrate an example of the arrangement of the elements presented previously, such as: • the compressor 11, • the control unit 12, • the desiccant filter 13, • the expansion valve 14, • the first output and input 151, 152 of the first set of interfaces configured to be connected to the evaporator 101, • the second output and input 161, 162 of the second set of interfaces configured to be connected to the condenser 102, • the VI, V2, V3, V4 valves associated with each of the inputs or outputs of the interface sets, • tank 18, • the anti-liquid splatter 19, • the different sections 100a, 100b, 100c of the refrigeration circuit

[0097] According to this particular embodiment, the heat pump device 1 further includes a control module 12' enabling the heat pump device 10 to be switched on, i.e. to supply power to the control unit 12 and the various sensors and actuators connected to it.

[0098] The heat pump device 10 also includes a support 120a receiving the various elements directly or indirectly via the attachment of certain elements to a plate 120b on which are arranged, for example, the control module 12', the control unit 12, an electrical box E and its stop coil E', also called a choke coil, the plate separating these elements through which a low voltage electric current of the various elements related to the refrigeration circuit or refrigeration circuit.

[0099] The arrangement of the various elements on the base 120a makes it possible to obtain a monobloc heat pump device 10 whose general shape fits into a parallelepiped volume, facilitating the transport and installation of the heat pump device 10, for example by allowing its transport in a crate and its installation on a shelf.

[0100] Each component is arranged in such a way as to make maintenance as easy as possible, allowing each component to be easily identified and accessed for replacement without having to dismantle the surrounding components. This includes the accessibility of valves VI, V2, V3, V4, and the connectors for connecting sensors or actuators.

[0101] Figure 9 schematically illustrates a perspective view of an enclosure of the heat pump device of Figure 7, according to a particular embodiment of the present invention. Indeed, the parallelepiped shape of the heat pump device 10 allows it to be integrated into an enclosure 10e, for example, a cubic one.

[0102] This enclosure 10e thus protects all the components inside, preventing any unintentional contact with electrical components or any potential damage to the refrigeration circuit components. Indeed, despite the robust design of the refrigeration circuit, any damage to it could impair its proper functioning. Furthermore, the high pressures require a perfectly sealed circuit, which is only guaranteed if it is not subjected to any impact.

[0103] The casing 10e is for example made of coated aluminium sheets, sufficiently resistant to protect the internal elements of the heat pump device 10. Some of the walls lOf are for example removable so as to allow easy access for any control or maintenance intervention.

[0104] According to a particular embodiment, openings 10g are made in surfaces of the envelope 10e so as to allow ventilation of the heat pump device 10 and cutouts or breakable elements lOh are provided to allow the passage of refrigerant lines or electrical cables through the walls of the envelope 10e.

[0105] Fig. 10 schematically illustrates a perspective view of envelopes of a system comprising a heat pump device, for example envelope 10e of Fig. 9 and a module, for example one of the modules 200, 300 shown opposite Figures 4 to 5, according to a particular embodiment of the present invention.

[0106] The module 200, 300 includes an envelope 200e, 300e covering it, its role being similar to that of the envelope 10e with respect to the heat pump device 10. Thus, the whole system 99 is protected.

[0107] The envelope 200e, 300e has, according to this particular embodiment, the same depth and height as the envelope 10e of the heat pump device 10, thus allowing a simple relative arrangement, the envelopes being simply juxtaposed.

[0108] Note that it is possible to juxtapose a heat pump device 10 and two modules 200, 300, the heat pump device 10 being for example placed between the two modules 200, 300.

[0109] Figure 11 schematically illustrates a perspective view of a system, for example, system 99 of Figure 10, without envelopes 10e, 200e, and 300e, according to a particular embodiment of the present invention. Figure 11 then presents an example of the relative arrangement of the various elements of a system 99 as shown opposite Figures 4 and 5.

[0110] According to a particular embodiment, the first module 200 and / or the second module 300 includes a set of interfaces consisting of an output interface 201, 301 and an input interface 202, 302 for connection to an auxiliary hydraulic circuit, i.e. to a hydraulic circuit external to the module 200, 300. The output and input interfaces 201, 301, 202, 302 then have standardized fittings, for example free nuts.

[0111] According to a particular embodiment, the first module 200 and / or the second module 300 includes an expansion vessel 200e, 300e, allowing to compensate for a lack of heat transfer fluid or to compensate for an expansion of the hydraulic circuit through which the heat transfer fluid flows.

[0112] Fig. 12 illustrates a flowchart of the different stages of a process for controlling a heat pump device, for example a heat pump device as shown opposite Figures 1 to 11, according to a first particular embodiment of the present invention.

[0113] Such a method 5 for controlling a heat pump device 10 is implemented by a processor or by the control unit 12 and comprises the following steps.

[0114] In a step 51, initial data are received, for example from the previously described high-pressure sensor 17. This data represents an initial pressure reading of a refrigerant fluid in the first portion 100a of the refrigeration circuit 100.

[0115] In a step 52, the first pressure is compared to a first threshold pressure, for example the pressure previously presented as the high target pressure.

[0116] In a step 53, a supply power of the compressor 11 is controlled according to a result of the comparison of the first pressure to the first threshold pressure or high target pressure.

[0117] According to a particular embodiment illustrated in [Fig. 13], process 5 further comprises the following steps.

[0118] In a step 54, second data are received, for example from the low pressure sensor 17'. This second data is representative of a second refrigerant pressure in the second portion 100b of the refrigeration circuit 100.

[0119] In a step 55, the second pressure is compared to a second threshold pressure, for example the pressure previously presented as the target low pressure.

[0120] In a step 56, the regulator 14 is controlled according to a result of the comparison of the second pressure to the second threshold pressure or low target pressure.

[0121] According to one variant, the compressor 11 is also controlled according to the second pressure, it is stopped for example when the second pressure is less than a safety pressure, the safety pressure being less than the second threshold pressure.

[0122] Fig. 14 illustrates a flowchart of the different stages of a process for controlling a system comprising a heat pump device and a module, according to a particular embodiment of the present invention.

[0123] The process 5 comprises steps 51 to 56 previously presented and in addition the following steps.

[0124] In a step 57, third data are received, for example from the thermometer 200d, 300d arranged on a hydraulic circuit 200b, 300b. The third data are then representative of a temperature of heat transfer fluid flowing through the hydraulic circuit 200b, 300b.

[0125] In a step 58, the measured temperature is compared to a threshold temperature.

[0126] In step 59, a circulator 200c, 300c associated with the hydraulic circuit 200b, 300b is controlled based on a result of comparing the measured temperature to the threshold temperature.

[0127] Note that in the presence of two modules 200, 300, i.e. when another module 200, 300 is added to system 99, steps 57, 58 and 59 are duplicated for the other module.

[0128] Fig. 15 illustrates a flowchart of the different steps of a second method of controlling a system comprising a heat pump device, for example a heat pump device as shown opposite Figures 1 to 11, according to a first particular embodiment of the present invention.

[0129] Such a method 5' for controlling a heat pump device 10 is implemented by a processor or by the control unit 12 and includes in particular a partial combination of steps of the method 5 previously described.

[0130] Thus, the process 5' includes steps 51, 54 and 57 relating to the reception of data from sensors.

[0131] In a step 50, the received data are arranged in a map taking into account a plurality of input data and allowing the orders relating to the different actuators to be determined according to a set of measured values.

[0132] In a step 53', a supply power of the compressor 11 is controlled according to the arrangement of the data received in the mapping.

[0133] In a step 56', the regulator 14 is controlled according to the arrangement of the data received in the mapping.

[0134] In a step 59', a circulator 200c, 300c associated with the hydraulic circuit 200b, 300b is controlled according to the arrangement of the data received in the mapping.

[0135] Such mapping then makes it possible to control each actuator as best as possible in order to optimize the operation of the heat pump device 10 according to parameters adapted to the installation including the heat pump device 10.

[0136] It should be noted that this detailed description relates to a particular embodiment of the present invention, without being in any way limiting to the object of the invention.

Claims

Demands

1. A heat pump device (10) comprising: - a refrigeration circuit (100) configured to receive a refrigerant, - a compressor (11) configured to move the refrigerant in the refrigeration circuit (100) and to increase the pressure of the refrigerant downstream of the compressor (11), and - an expansion valve (14), the heat pump device (10) being characterized in that it comprises: - a first set of interfaces (15) configured to connect an evaporator (101) to the refrigeration circuit (100), - a second set of interfaces (16) configured to connect a condenser (102) to the refrigeration circuit (100), - a pressure sensor (17) arranged on a first portion (100a) of the refrigeration circuit (100) upstream of the second set of interfaces (16) according to a direction of refrigerant flow in the circuit refrigerated (100),and - a control unit (12) configured to control the compressor (11) power supply as a function of a first pressure measured by said pressure sensor (17).

2. Heat pump device (10) according to claim 1, wherein: - the first set of interfaces (15) comprises a first outlet interface (151) allowing the passage of the refrigerant from the refrigeration circuit (100) to the evaporator (101) and a first inlet interface (152) allowing the passage of the refrigerant from the evaporator (101) to the refrigeration circuit (100), and - the second set of interfaces (16) comprises a second outlet interface (161) allowing the passage of the refrigerant from the refrigeration circuit (100) to the condenser (102) and a second inlet interface (162) allowing the passage of the refrigerant from the condenser (102) to the refrigeration circuit (100).

3. Heat pump device (10) according to claim 2, comprising: - a first valve (V1) configured to open or close the first output interface (151), - a second valve (V2) configured to open or close the first input interface (152), - a third valve (V3) configured to open or close the second output interface (161), and - a fourth valve (V4) configured to open or close the second input interface (162).

4. Heat pump device (10) according to any one of claims 1 to 3, wherein the expansion valve (14) is an electronic expansion valve, the expansion valve (14) being controlled by the control unit (12) as a function of a second pressure at the outlet of the expansion valve (14).

5. Heat pump device (10) according to any one of claims 1 to 4, wherein the compressor (11) is a spiral-orbital type compressor.

6. Heat pump device (10) according to any one of claims 1 to 5, which includes a tank (18) connected to the refrigeration circuit (100).

7. Heat pump device (10) according to any one of claims 1 to 6, which includes a desiccant filter (13) connected to the refrigeration circuit (100) and configured to remove at least one pollutant from the refrigerant.

8. Heat pump device (10) according to any one of claims 1 to 7, wherein the refrigerant is of the Hydrofluoro-Olefins type (R454C, trade name Opteon XL20).

9. System (99) comprising the heat pump device (10) according to any one of claims 1 to 8 and at least one module (200, 300), said at least one module (200, 300) comprising: - a heat exchanger (200a, 300a) configured to cooperate with the evaporator (101) or the condenser (102), - a hydraulic circuit (200b, 300b) configured to receive a heat transfer fluid, and - a circulator (200c, 300c) configured to move the heat transfer fluid in the hydraulic circuit (200b, 300b).

10. System (99) according to claim 9, wherein said at least one module (200, 300) comprises a thermometer (200d, 300d) configured to measure a temperature of the heat transfer fluid in the circuit hydraulic (200b, 300b), the circulator (200c, 300c) being controlled by the control unit (12) according to said temperature.

11. Method (5) for controlling a heat pump device (10) according to any one of claims 1 to 10 or a system (99) according to any one of claims 9 to 10, characterized in that it is implemented by a control unit (12) and comprises the following steps: - receiving (51) first data representative of a first pressure of a refrigerant fluid in a first portion (100a) of a refrigeration circuit (100); - first comparison (52) of said first pressure to a first threshold pressure (target HP); - checking (53) a supply power of a compressor (11) as a function of a result of said first comparison.

12. Method (5) according to claim 11, further comprising the following steps: - receiving (54) second data representing a second refrigerant pressure in a second portion (100b) of the refrigeration circuit (100); - second comparison (55) of said second pressure to a second threshold pressure; - control (56) of an expansion valve (14) as a function of a result of said second comparison (safety function for compressor if lower than the minimum pressure).

13. Method (5) according to claim 11 or 12, further comprising the following steps: - receiving (57) third data representative of a temperature of a heat transfer fluid in a hydraulic circuit (200b, 300b); - third comparison (58) of said temperature to a threshold temperature; - control (59) of a circulator (200c, 300c) associated with the hydraulic circuit (200b, 300b) according to a result of said third comparison.

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