Method for manufacturing an electronic circuit for a chip-enabled document.

Abstract

The invention relates to a method for manufacturing an electronic circuit (100) for a chip document, comprising a dielectric support (400), the electronic circuit (100) comprising a main circuit (110) and a secondary circuit (120), the main circuit (110) being an open circuit comprising a plurality of electrical tracks (111), the secondary circuit (120) being prefabricated and intended to be electrically connected to the main circuit (110) when assembled therewith.It is essentially characterized by steps consisting of creating the main circuit (110) by: • Heat-bonding a conductive film (500) to the dielectric support (400), • Cutting the heat-bonded conductive film (500) according to the contours of a predetermined solid shape into which the tracks of the main circuit (110) are inserted, • Peeling off the unbonded conductive film (500) according to a shape complementary to the predetermined solid shape, so that only the conductive film (500) corresponding to the predetermined solid shape remains fixed to the support. Figure from the abstract: Fig. 1.

Description

Title of the invention: Method for manufacturing an electronic circuit for a chip-enabled document.

[0001] The present invention relates to the field of manufacturing a 100 resonant electronic circuit, for a chipped document.

[0002] The smart document can be a smart card, indiscriminately intended for banking, identity or security purposes, for example a debit or credit card, an access badge, a driver's license, a subscription card, etc. The smart document can also be an RFID tag.

[0003] For the sake of brevity, only the case of a smart card incorporating a communication antenna will be described here. Those skilled in the art will readily apply this complex teaching to other, simpler cases.

[0004] The "contactless" function of smart cards requires the presence of a large antenna, called "ID1", allowing efficient inductive coupling with a radio frequency (RF) reader.

[0005] This ID1 antenna is necessary, regardless of the connection method between this ID1 antenna and a secure element (SE) of the smart card: whether by inductive coupling, which requires a circuit with a concentrator and a capacitor, by direct electrical contact (galvanic), or by capacitive coupling.

[0006] To date, the following three main technologies exist for producing an ID1 antenna: a. Aluminum-based antennas, b. Antennas made of sheathed and embedded copper wire, c. Antennas printed with conductive metallic ink, in silver or copper.

[0007] The present invention relates only to aluminum-based antennas.

[0008] It is known to produce aluminum-based antennas on PET, for example by chemical etching.

[0009] However, this technique poses problems, particularly in terms of manufacturing (layout by anglicism), ecology and ghosting effects.

[0010] The present invention aims to enable clever manufacturing of an electronic circuit 100 by allowing economies of scale.

[0011] To this end, according to a first of its objects, the invention relates to a method for manufacturing an electronic circuit 100 for a chip-enabled document, the chip-enabled document comprising a dielectric support 400, the electronic circuit 100 comprising a main circuit 110 and a secondary circuit 120, the main circuit 110 being a open preferably circuit comprising a plurality of electrical tracks 111, the secondary circuit 120 being prefabricated and intended to be electrically connected to the main circuit 110 when assembled to it.

[0012] It is essentially characterized in that the method comprises steps consisting of constructing the main circuit 110 by: a. Heat-bond a conductive film 500 to the dielectric support 400, b. Cut the 500 heat-sealed conductive film according to the contours of a predetermined solid shape into which the tracks of the main circuit 110 are inserted, c. Peel the unfixed conductive film 500, according to a shape complementary to the predetermined solid shape, so as to leave fixed on the support only the conductive film 500 corresponding to the predetermined solid shape.

[0013] The secondary circuit 120 is intended to be electrically connected to the main circuit 110 when assembled to it. By "electrically connected" we mean electrically connected, for example by galvanic connection or electrically coupled, for example by capacitive or inductive coupling.

[0014] It can be foreseen that the step of cutting the contours of the predetermined solid shape of the conductive film 500 is implemented by at least one of the following steps: a. by pressing a mechanical cutting tool 300 onto the conductive film 500, said cutting tool being rotating or flat and comprising a set of blades forming a cutting impression of the predetermined solid shape; said cutting and heat sealing 20 being able to be simultaneous; b. by laser cutting 30 of the 500 conductive film.

[0015] A further step can be provided for realizing the electrical tracks 111 of the main circuit 110 in the predetermined solid form by at least one of the following steps: a. by pressing a mechanical cutting tool 300 onto the conductive film 500, said cutting tool being rotating or flat and comprising a set of blades forming a cutting impression of the electrical tracks 111 in the predetermined solid shape; the pressing for the production of the electrical tracks 111 being able to be simultaneous with the cutting of the contours of the predetermined solid shape; b. by laser cutting 30 of the 500 conductive film.

[0016] It can be foreseen that said laser cutting step 30 of the electrical tracks 111 is implemented according to one of the following sequences: i. After the heat-sealing step 20 and before the peeling step 50, ii. After the heat-sealing step 20 and after the peeling step 50, the heat-sealing step 20 may be prior to or simultaneous with the predetermined solid shape cutting step.

[0017] A further step can be provided consisting of pre-cutting a set of at least one recess in the predetermined solid shape, prior to the heat-sealing step 20,

[0018] said pre-cutting of at least one recess being implemented by at least one of the following steps: i. by pressing a mechanical pre-cutting tool onto the conductive film 500, said pre-cutting tool being rotating or flat and comprising a set of blades forming a pre-cutting imprint of at least one recess; ii. by laser cutting 30; said pre-cutting step being prior to or simultaneous with the step of cutting the contours of the solid shape.

[0019] A further step can be envisaged consisting of arranging the electrical tracks 111 of the main circuit 110 on the support so as to perform all or part of at least one of the following: a. A communication antenna enabling radio frequency communication with a reader, b. Interconnection traces between two electronic components or two modules, c. an electrical resistance, d. a capacitor, e. A site plan, f. A graphical representation, g. Electromagnetic shielding, h. An inductive antenna allowing power or communication with an electronic component 130 assembled later.

[0020] An additional step of assembling the main circuit 110 and the secondary circuit 120 can be provided, by one of the following steps: i. Place the secondary circuit 120 onto the main circuit 110, in particular in the form of a patch and ii. Attach at least one semiconductor component comprising the secondary circuit 120 to the main circuit 110. then by a step consisting of joining the main circuit 110 and the secondary circuit 120, in particular by gluing or crimping 140,

[0021] the process preferably further comprising a step of laminating the assembled electronic circuit 100.

[0022] According to another of its objects, the invention relates to an electronic circuit 100 for a chip-bearing document, comprising a dielectric support 400, the electronic circuit 100 comprising a main circuit 110 and a secondary circuit 120, the main circuit 110 being an open circuit comprising a plurality of electrical tracks 111, the secondary circuit 120 being electrically connected to the main circuit 110 and assembled to it in particular by gluing or crimping 140,

[0023] The electronic circuit 100 being capable of being manufactured by the process according to the invention,

[0024] wherein the main circuit 110 comprises: a. a conductive film 500 cut and deposited on the dielectric support 400 according to a predetermined solid shape, fixed on the dielectric support 400 by hot pressing, the electrical tracks 111 of the main circuit 110 being arranged in the predetermined solid shape; and in which the secondary circuit 120 is at least one of: a. a patch placed on the main circuit 110, said patch being able to have a single or double-sided aluminium / PET / aluminium structure, b. a semiconductor component placed on the main circuit 110.

[0025] The carryover is known by the anglicism "flip-chip".

[0026] According to another of its objects, the invention relates to a chip document comprising the electronic circuit 100 of the invention.

[0027] It can be foreseen that the smart document, in particular a smart card, further comprises at least one electronic device among: a. A DCVD screen, b. A secure element, c. A microcontroller, d. A biometric sensor, e. A concentrator with or without a capacitor f. A passive electronic component 130, in particular a resistor, or a capacitor; the electronic circuit 100 being electrically connected to said electronic device.

[0028] Thanks to the present invention, it is possible to manufacture separately a main circuit 110, indistinguishably primary circuit; and a secondary circuit 120, and then to assemble them to form an electronic circuit 100, in particular a resonant circuit.

[0029] For example, as explained later, the main circuit 110 may be all or part of a communication antenna enabling radio frequency communication with a reader. This type of circuit is called "low resolution" and can be manufactured simply, by processes other than chemical, which notably allows economies of scale.

[0030] The secondary circuit 120 is said to be "high resolution". It is more complex to manufacture and can be made in patch form.

[0031] Other features and advantages of the present invention will become more apparent from the following description given by way of illustrative and non-limiting example and made with reference to the accompanying figures.

[0032] [Fig-1] illustrates an embodiment of the process according to the invention,

[0033] [Fig.2] illustrates an embodiment of the process according to the invention,

[0034] [Fig.3] illustrates an embodiment of the process according to the invention,

[0035] [Fig.4] illustrates 3 embodiments of a secondary circuit 120 according to the invention,

[0036] [Fig.5] illustrates an embodiment of assembling an electronic circuit 100 according to the invention,

[0037] [Fig.6] illustrates six embodiments of an electronic circuit 100 according to the invention,

[0038] [Fig.7] illustrates an embodiment of the process according to the invention,

[0039] [Fig.8] illustrates an embodiment of the process according to the invention,

[0040] [Fig.9] illustrates an embodiment of the process according to the invention,

[0041] [Fig. 10] illustrates two mechanical cutting tools,

[0042] [Fig. 11] illustrates four main circuits according to the invention,

[0043] [Fig. 12] illustrates an embodiment of an assembly of a main circuit 110 and a secondary circuit 120 according to the invention,

[0044] [Fig. 13] illustrates an embodiment of an assembly of a main circuit 110 and a secondary circuit 120 according to the invention,

[0045] [Fig. 14] illustrates an embodiment of an assembly of a main circuit 110 and a secondary circuit 120 according to the invention,

[0046] [Fig. 15] illustrates an embodiment of an assembly of a main circuit 110 and a secondary circuit 120 according to the invention

[0047] [Fig. 16] illustrates an embodiment of an assembly of a main circuit 110 and a secondary circuit 120 according to the invention,

[0048] [Fig. 17] illustrates an embodiment of an electronic circuit 100 according to the invention,

[0049] [Fig. 18] illustrates a heated press 600 according to the invention. Detailed description

[0050] For the purposes of the present invention, a smart document is a smart card, an RFID tag, or a passport. The smart card may be a bank card or an identity card, state (identity card, driver's license, etc.) or private (subscription card, transport ticket, etc.).

[0051] Figure 17 illustrates an embodiment of an electronic circuit 100 according to The invention, for example a resonant circuit. It comprises a main circuit 110 assembled to a secondary circuit 120. In [Fig. 17], each arrow of the secondary circuit 120 points to a respective electrical track 111.

[0052] The main circuit 110 is an open circuit comprising a plurality of electrical tracks 111. It is said to be "low resolution" and can be manufactured simply and in mass, typically from a sheet of conductive material, in particular a metal, for example from a layer or film of copper and in particular a layer or film of aluminum.

[0053] In particular, the main circuit 110 is all or part of: a. a communication antenna, specifically known as "ID1", well known to those skilled in the art in the field of smart cards, b. Interconnection traces between two electronic components or between two modules, c. an electrical resistance, d. a capacitor, e. a site plan, f. a graphic representation drawn by the electrical tracks 111, g. electromagnetic shielding, h. an inductive antenna enabling power supply or communication with an electronic component 130 assembled later.

[0054] For example, [Fig. 11] illustrates several forms of the main circuit 110, in this case by looking at [Fig. 11] from top to bottom: as an antenna, as a resistor, as a capacitor, and as interconnecting traces. In [Fig. 11], the electrical traces 111 of the main circuit 110 are shown in gray.

[0055] Several embodiments of a main circuit 110 are possible, and illustrated in the figures described below.

[0056] According to the invention, it is provided that: a. a heat-bonding step 20 of a conductive film 500 onto a dielectric support 400; b. a cutting, or even pre-cutting, step of the 500 conductive film, and c. a 50 peeling step of the 500 non-heat-bonded conductive film.

[0057] The dielectric support 400, or indistinctly substrate, is presented for example in the form of a coil.

[0058] The conductive film 500 is presented for example in the form of a reel.

[0059] The heat-sealing 20 is typically achieved by depositing adhesive 520 onto the dielectric support 400 in a shape corresponding to the predetermined solid form. The conductive film 500 is deposited onto the dielectric support 400, including, when not directly onto, the adhesive 520.

[0060] The step of cutting the conductive film 500 essentially consists of cutting the conductive film 500 according to the contours of a predetermined solid shape into which the tracks of the main circuit 110 are inserted.

[0061] The pre-cutting step of the conductive film 500 essentially consists of pre-cutting a set of at least one recess inside the predetermined solid shape of the conductive film 500, prior to the heat-sealing step 20.

[0062] The peeling step 50 of the conductive film 500 essentially consists of removing the non-heat-bonded conductive film 500 so as to leave fixed on the dielectric support 400 only the conductive film 500 corresponding to the predetermined solid shape.

[0063] The predetermined solid shape of the heat-sealed conductive film 500 is obtained, for example, by pressing a mechanical cutting tool 300 onto the conductive film 500. The mechanical cutting tool 300 comprises a set of cutting blades 310 that form a cutting impression of the predetermined solid shape. The mechanical cutting tool 300 can be rotary or flat.

[0064] An example of a rotating mechanical cutting tool 300 is shown on the left side of [Fig. 10], and an example of a flat mechanical cutting tool 300 is shown on the right side of [Fig. 10], each tool comprising a set of cutting blades 310.

[0065] The cutting blades 310 form a cutting imprint of at least one of the following: a. the contours of a predetermined solid shape into which the tracks of the main circuit 110 are inserted; b. electrical tracks 111 in the predetermined full form; c. the set of at least one recess.

[0066] On [Fig. 10] (left and right), the inner cutting blades 310 form a cutting imprint of a recess and the outer cutting blades 310 form a cutting imprint of the contour of the predetermined solid shape.

[0067] The predetermined solid shape of the heat-bonded conductive film 500 can also be obtained by laser cutting 30 of the contours, alternatively or in combination with mechanical cutting 40 of the heat-bonded conductive film 500. Similarly, the assembly of at least one recess can also be obtained by laser cutting 30.

[0068] The electrical tracks 111, for example illustrated in [Fig.1 1], can also be obtained by laser cutting 30 ([Fig.2], [Fig.3]) or by cutting blades 310 ( [Fig.1]).

[0069] The pressing of a mechanical cutting tool 300 can be simultaneous with the cutting, whether it is the cutting of the contours of the predetermined solid shape or of the whole of at least one recess.

[0070] The heat sealing 20 and the cutting can be simultaneous, for example as illustrated in [Fig.18], thanks to a heated press 600 applied to the mechanical cutting tool 300; the dielectric support 400 being deposited on a support called "anvil 610".

[0071] In one embodiment, see [Fig. 1], the mechanical cutting tool 300 is rotating. The predetermined solid shape into which the tracks of the main circuit 110 are inserted is an open shape, in this case C-shaped. In this embodiment, the cutting tool comprises cutting blades 310 for cutting the contours of the predetermined solid shape, including a central recess, and cutting blades 310 for cutting electrical tracks 111 of the main circuit 110, thus allowing simultaneous cutting of the contours of the predetermined solid shape and the electrical tracks 111 of the main circuit 110, and in this case also a recess. In this case, the mechanical cutting 40 of the contours of the predetermined shape, the mechanical cutting 41 of a recess, and the mechanical cutting 42 of the electrical tracks of the main circuit occur substantially simultaneously.Next, the conductive film 500 is peeled off after the contours of the predetermined solid shape have been cut, including a central recess in this case, and the electrical tracks 111 of the main circuit 110 have been cut.

[0072] In one embodiment, see [Fig. 2], the mechanical cutting tool 300 is rotating. The predetermined solid shape into which the tracks of the main circuit 110 are inserted is identical to [Fig. 1], that is, an open shape, in this case C-shaped. In this embodiment, the cutting tool comprises only cutting blades 310 for cutting the contours of the predetermined solid shape, including a central recess. The electrical tracks 111 of the main circuit 110 are cut by a laser 200. The conductive film 500 is peeled off after the contours of the predetermined solid shape, including a central recess, and before the electrical tracks 111 of the main circuit 110 are cut.

[0073] Another view of the embodiment of [Fig. 2] is illustrated in [Fig. 7]. In [Fig. 7], the adhesive imprint 520 for the heat-sealing 20 and the superimposition of a conductive film 500 onto the dielectric support 400 are shown. In this case, The conductive film 500 and the dielectric support 400 are unwound from a respective reel (not shown).

[0074] In one embodiment, see [Fig. 3], the mechanical cutting tool 300 is rotating. The predetermined solid shape into which the tracks of the main circuit 110 are inserted is a closed shape, in this case an O shape. In this embodiment, the cutting tool comprises only cutting blades 310 for cutting the contours of the predetermined solid shape, in this case including a central recess. The electrical tracks 111 of the main circuit 110 are cut by a laser 200. The conductive film 500 is peeled off after the contours of the predetermined solid shape, including a central recess, and before the laser cutting 30 of the electrical tracks 111 of the main circuit 110.

[0075] An alternative to the embodiment of [Fig. 3] is illustrated in [Fig. 8]. In [Fig. 8], the adhesive imprint 520 for heat-sealing 20 and the superimposition of a conductive film 500 onto the dielectric support 400 are shown. In this embodiment, the conductive film 500 and the dielectric support 400 are unwound from their respective reels (not shown). In this embodiment, a recess is pre-cut in the conductive film 500 before heat-sealing 20. In this embodiment, the conductive film 500 is peeled off after the contours of the predetermined solid shape have been cut, and after the electrical traces 111 of the main circuit 110 have been laser-cut 30.

[0076] An alternative to the embodiment of [Fig. 8] is illustrated in [Fig. 9]. In [Fig. 9], the adhesive imprint 520 for heat-sealing 20 and the superimposition of a conductive film 500 onto the dielectric support 400 are shown. In this embodiment, the conductive film 500 and the dielectric support 400 are unwound from their respective reels (not shown). In this embodiment, a recess is pre-cut in the conductive film 500 before heat-sealing 20. In this embodiment, the conductive film 500 is peeled off after the contours of the predetermined solid shape have been cut, and before the laser cutting 30 of the electrical traces 111 of the main circuit 110.

[0077] In an embodiment not shown, and based on the combination of [Fig. 1] and [Fig. 3], the mechanical cutting tool 300 is rotary or flat. The predetermined solid shape into which the tracks of the main circuit 110 are inserted is a closed shape, in this case O-shaped. In this embodiment, the cutting tool includes cutting blades 310 for cutting the contours of the predetermined solid shape, including a central recess, and cutting blades 310 for cutting a portion of the electrical tracks 111 of the circuit main 110. The remaining electrical tracks 111 of the main circuit 110 are then cut by laser 200.

[0078] The sequence of steps of the main circuit 110 can therefore vary according to the embodiments.

[0079] As illustrated in [Fig. 6], at least the following six variants are possible, illustrated line by line in [Fig. 6]. In [Fig. 6], the possible mechanical cutting 42 of the electrical tracks of the main circuit is not shown.

[0080] On [Fig.6], the laser cutting 30 essentially concerns the cutting of the electrical tracks 111. These variants are not limiting, in fact the cutting of the electrical tracks 111 can be carried out by laser 200 or by mechanical tool, as well as for the cutting of the contours and as well as for the cutting of the recess.

[0081] In all variants of [Fig.6], the first step is that of unwinding 10 of the conductive film 500 and the dielectric support 400.

[0082] In a first embodiment, first line from the top of [Fig. 6], after unwinding 10 and heat-sealing 20 of the predetermined shape of the conductive film 500, a laser cutter 30 cuts at least the contours of the predetermined solid shape, similar to the mechanical cutting tool illustrated in [Fig. 2] or [Fig. 3]. Preferably, the laser cutter 30 also cuts the electrical traces 111. The conductive film 500 can then be peeled off and the conductive film 500 and the dielectric support 400 rewound.

[0083] In a second embodiment, second line from the top of [Fig. 6], after unwinding 10, heat-sealing 20 and cutting of the contours of the predetermined shape of the conductive film 500 take place simultaneously, in this case including a central cutout. The conductive film 500 can then be peeled off and a laser cutter 30 can be used to cut the electrical tracks 111 in the predetermined heat-sealed shape. The conductive film 500 and the dielectric support 400 can then be rewound.

[0084] In a third variant, third line from the top of [Fig. 6], after unwinding 10, the predetermined shape of the conductive film 500 is heat-sealed. Next, the contours, and in this case simultaneously a central recess, of the predetermined shape of the conductive film 500 are mechanically cut. The conductive film 500 can then be peeled off and a laser cutter 30 can be used to cut the electrical tracks 111 within the predetermined heat-sealed shape. The conductive film 500 and the dielectric support 400 can then be rewound.

[0085] In a fourth variant, fourth line from the top of [Fig. 6], after unwinding 10, a recess is mechanically pre-cut in the conductive film 500. Next, the predetermined shape of the conductive film 500 is heat-sealed, and then a laser cutter 30 is applied, which allows Cut out the electrical tracks 111 in the predetermined heat-sealed shape. Then peel off the conductive film 500, and rewind the conductive film 500 and the dielectric support 400.

[0086] In a fifth variant, fifth line from the top of [Fig. 6], after unwinding 10, a recess is mechanically pre-cut in the conductive film 500. Then, the predetermined shape of the conductive film 500 is simultaneously heat-sealed and its contours are mechanically cut. Next, the conductive film 500 is peeled off, and a laser cutter 30 is used to cut the electrical tracks 111 in the predetermined heat-sealed shape. Finally, the conductive film 500 and the dielectric support 400 are rewound.

[0087] In a sixth variant, the last line from the top of [Fig. 6], after unwinding 10, a recess is mechanically pre-cut in the conductive film 500. Next, the predetermined shape of the conductive film 500 is heat-sealed, and its contours are then mechanically cut. The conductive film 500 is then peeled off, and a laser cutter 30 is used to cut the electrical tracks 111 in the predetermined heat-sealed shape. Finally, the conductive film 500 and the dielectric support 400 are rewound.

[0088] The secondary circuit 120 is said to be "high resolution" because it is more complex.

[0089] The secondary circuit 120 of [Fig. 17] is illustrated, for example, in [Fig. 4], of From left to right, according to the assembly sequence. The left side of [Fig. 4] shows the high-resolution secondary circuit 120. The central side of [Fig. 4] shows the secondary circuit 120 with an electronic component 130 placed on it, for example, a DCVD screen, a security element, a biometric sensor, or a concentrator (possibly with a capacitor). The right side of [Fig. 4] shows the secondary circuit 120 ready to be assembled to the main circuit 110 with a crimp 140.

[0090] The assembly of the main circuit 110 and the secondary circuit 120 can be carried out in several ways.

[0091] Assembly

[0092] The assembly of the main circuit 110 and the secondary circuit 120 can be carried out in several ways.

[0093] For example, as illustrated in [Fig. 5], the secondary circuit 120 is manufactured in series and is in the form of labels or patches. Each label can be individually detached from its backing and assembled to the main circuit 110, for example by gluing, for example using an electrically conductive adhesive 520, or by crimping 140 (“crimp” by anglicism), the 140 crimp also being illustrated on the [Fig. 17].

[0094] Similarly, the main circuit 110 is advantageously manufactured in series and can also be in the form of individual labels.

[0095] In [Fig. 5], the main circuit 110 is open; and the secondary circuit 120 includes an electronic component 130. In this example, assembling the secondary circuit 120 onto the main circuit 110 allows the latter to be closed.

[0096] Other assembly embodiments are illustrated in figures 12 to 16.

[0097] In [Fig. 12], part A illustrates the docking of a double 120 secondary circuit face on a main circuit 110. Part B illustrates the assembly of the secondary circuit 120 and the main circuit 110. Part C illustrates a lamination by a laminate 700 of the electronic circuit 100 resulting from the assembly.

[0098] In [Fig. 13], part A illustrates the docking of a simple 120 secondary circuit face free of electronic component 130 on a main circuit 110. Part B illustrates the assembly of the secondary circuit 120 and the main circuit 110. Part C illustrates a lamination by a laminate 700 of the electronic circuit 100 resulting from the assembly.

[0099] In [Fig. 14], part A illustrates the docking of a simple 120 secondary circuit face with an electronic component 130 on a main circuit 110. Part B illustrates the assembly of the secondary circuit 120 and the main circuit 110. Part C illustrates a lamination by a laminate 700 of the electronic circuit 100 resulting from the assembly.

[0100] In [Fig. 15], part A illustrates the docking of a simple 120 secondary circuit film without substrate on a main circuit 110. Part B illustrates the assembly of the secondary circuit 120 and the main circuit 110. Part C illustrates a lamination by a laminate 700 of the electronic circuit 100 resulting from the assembly.

[0101] In [Fig. 16], part A illustrates the docking of a secondary circuit 120 under electronic component shape 130 on a main circuit 110. Part B illustrates the assembly of the secondary circuit 120 and the main circuit 110. Part C illustrates a lamination by a laminate 700 of the electronic circuit 100 resulting from the assembly.

[0102] Nomenclature

[0103] 10 unwinding of the conductive film 500 and the dielectric support 400

[0104] 11 rewinding of the conductive film 500 and the dielectric support 400

[0105] 20 heat-bonding of the conductive film 500 to the dielectric support 400

[0106] 30 laser cutting

[0107] 40 Mechanical cutting of the contours of the predetermined shape

[0108] 41 mechanical cutting of a recess

[0109]

[0110] [YES]

[0112]

[0113]

[0114]

[0115]

[0116]

[0117]

[0118]

[0119]

[0120]

[0121]

[0122]

[0123]

[0124]

[0125] 50 peeling of the conductive film 500 100 electronic circuit 110 main circuit 111 electrical trace of the main circuit 110 120 secondary circuit 130 electronic component 140 crimping 200 laser 300 mechanical cutting tool 310 cutting blades 400 dielectric support 500 conductive film 510 hollowing 520 glue 600 heated press 610 anvil 700 laminate

Claims

Demands

1. A method for manufacturing an electronic circuit (100) for a chip-enabled document, the chip-enabled document comprising a dielectric support (400), the electronic circuit (100) comprising a main circuit (110) and a secondary circuit (120), the main circuit (110) being preferably an open circuit comprising a plurality of electrical tracks (111), the secondary circuit (120) being prefabricated and intended to be electrically connected to the main circuit (110) when assembled therewith, characterized in that the method comprises steps of producing the main circuit (110) by: • Heat-bonding a conductive film (500) to the dielectric support (400), • Cutting the heat-bonded conductive film (500) according to the contours of a predetermined solid shape into which the tracks of the main circuit (110) are inserted, • Peeling the unbonded conductive film (500) into a shape complementary to the predetermined solid shape,so that only the conductive film (500) corresponding to the predetermined solid shape remains fixed to the support.

2. A method according to claim 1, wherein the step of cutting the contours of the predetermined solid shape of the conductive film (500) is carried out by at least one of the following steps: • by pressing a mechanical cutting tool (40) onto the conductive film (500), said cutting tool being rotating or flat and comprising a set of blades forming a cutting impression of the predetermined solid shape; said cutting and the heat sealing (20) being able to be simultaneous; • by laser cutting (30) of the conductive film (500).

3. A method according to any one of the preceding claims, further comprising a step of forming the electrical tracks (111) of the main circuit (110) in the predetermined solid form by at least one of the following steps: • by pressing a mechanical cutting tool (300) onto the conductive film (500), said cutting tool being at rotation or flat and comprising a set of blades forming a cutting impression of the electrical tracks (111) in the predetermined solid shape; said pressing for the production of the electrical tracks (111) being able to be simultaneous with the cutting of the contours of the predetermined solid shape; • by laser cutting (30) of the conductive film (500).

4. A method according to claim 3, wherein said laser cutting step (30) of the electrical tracks (111) is carried out in one of the following sequences: i. After the heat-sealing step (20) and before the peeling step (50), ii. After the heat-sealing step (20) and after the peeling step (50), the heat-sealing step (20) being able to be prior to or simultaneous with the predetermined solid shape cutting step.

5. A method according to any one of the preceding claims, further comprising a step of pre-cutting a set of at least one recess (510) in the predetermined solid shape, prior to the heat-sealing step (20), said pre-cutting of at least one recess (510) being carried out by at least one of the following steps: i. by pressing a mechanical pre-cutting tool onto the conductive film (500), said pre-cutting tool being rotating or flat and comprising a set of blades forming a pre-cutting imprint of at least one recess (510); ii. by laser cutting (30); said pre-cutting step being prior to or simultaneous with the step of cutting the contours of the solid shape.

6. A method according to any one of the preceding claims, further comprising a step of arranging the electrical traces (111) of the main circuit (110) on the support so as to realize all or part of at least one of the following: • A communication antenna enabling radio frequency communication with a reader, • Interconnection tracks between two electronic components or between two modules, • an electrical resistor, • a capacitor, • A ground plane, • A graphical representation, • Electromagnetic shielding, • An inductive antenna allowing power supply or communication with a subsequently assembled electronic component (130).

7. A method according to any one of the preceding claims, further comprising a step of assembling the main circuit (110) and the secondary circuit (120), by one of the steps of: i. Depositing the secondary circuit (120) onto the main circuit (110), in particular in the form of a patch and ii. Transferring onto the main circuit (110) at least one semiconductor component comprising the secondary circuit (120), then by a step of joining the main circuit (110) and the secondary circuit (120), in particular by gluing or crimping (140), the method preferably further comprising a step of laminating (700) the assembled electronic circuit (100).

8. Electronic circuit (100) for a chip-bearing document, comprising a dielectric support (400), the electronic circuit (100) comprising a main circuit (110) and a secondary circuit (120), the main circuit (110) being an open circuit comprising a plurality of electrical traces (111), the secondary circuit (120) being electrically connected to the main circuit (110) and assembled thereto, in particular by bonding or crimping (140), the electronic circuit (100) being capable of being manufactured by the method according to any one of the preceding claims, wherein the main circuit (110) comprises: a conductive film (500) cut and deposited on the dielectric support (400) according to a predetermined solid shape, fixed on the dielectric support (400) by hot pressing, the electrical tracks (111) of the main circuit (110) being arranged in the predetermined solid shape; and in which the secondary circuit (120) is at least one of: • a patch placed on the main circuit (110), said patch being able to have a single or double-sided aluminium / PET / aluminium structure, • a semiconductor component placed on the main circuit (110).

9. Chip-on-chip document comprising the electronic circuit (100) according to claim 8.

10. A smart document according to claim 9, in particular a smart card, further comprising at least one electronic device from: • A DCVD screen, • A secure element, • A microcontroller, • A biometric sensor, • A concentrator with or without a capacitor • A passive electronic component (130), in particular a resistor, or a capacitor; the electronic circuit (100) being electrically connected to said electronic device.