Cooling device for an electronic device

Abstract

The invention relates to a cooling device (1) for cooling an electronic device (2) and comprising: - two heat pipe assemblies; - a heat collector plate (11) intended to receive a rear face of the electronic device (2) and fixed and thermally coupled to at least one evaporation zone (8) of each of the two heat pipe assemblies; - at least one first heat exchanger (6) extending between the two heat pipe assemblies, said first heat exchanger (6) being fixed and thermally coupled to a first condensation zone (9) of each of the two heat pipe assemblies. Figure to be published with the abstract: Fig. 1

Description

Title of the invention: Cooling device for an electronic device

[0001] The invention relates to a cooling device for an electronic device, such as a mobile phone, for example for a motor vehicle.

[0002] When an electronic device, such as a mobile phone, is connected to a vehicle port, excessive battery heating can occur. This is particularly common when a phone is connected to the vehicle's system to use infotainment applications such as CarPlay® or Android Auto®, for example. This heating can cause charging to automatically stop to protect the battery, which can be inconvenient for the user. Furthermore, recurring heating can lead to premature degradation of battery performance and lifespan, thus compromising its long-term efficiency. It is therefore crucial to develop a device to cool the electronic device.

[0003] Document CN209683587 discloses a vehicle phone holder system with a heat dissipation function. This holder system includes a support structure for holding the phone, with upper, lateral, and lower barriers. The support structure has a slot for inserting an inverted U-shaped heat dissipation structure. This heat dissipation structure consists of a heat pipe and heat-dissipating fins that use air from a vent of the vehicle's air conditioning and ventilation system to dissipate the heat generated by the phone.

[0004] Such a cooling device is not entirely satisfactory. Indeed, this device uses a support bracket to fix the phone, supplemented by a heat pipe and a fin system to increase the heat exchange surface area, making the device particularly complex to manufacture and expensive.

[0005] Moreover, it almost completely obstructs the ventilation opening, thus reducing the efficiency of the air conditioning and ventilation system.

[0006] Furthermore, the inverted U-shaped heat dissipation structure does not maximize the efficiency of the phase change in the heat pipe, which affects the heat dissipation performance.

[0007] Also, a problem which arises and which the present invention aims to solve is to propose a cooling device for an electronic device intended for a motor vehicle which is both simple and capable of efficiently cooling the device.

[0008] In order to solve this problem, and according to a first object, a cooling device is proposed for cooling an electronic device, the cooling device comprising: - two sets of heat pipes extending parallel to each other, each set of heat pipes comprising at least one heat pipe; - a heat collector plate which is intended to receive a rear face of the electronic device, the heat collector plate extending transversely between the two heat pipe assemblies and being fixed and thermally coupled to at least one evaporation zone of both of the two heat pipe assemblies; - at least one first heat exchanger extending transversely between the two heat pipe assemblies, said first heat exchanger being fixed and thermally coupled to a first condensation zone of both of the two heat pipe assemblies.

[0009] Thus, the heat pipe assemblies fulfill a dual function: in addition to their role in heat dissipation, they form stringers which provide a structural function by serving as a mechanical link between the support collector plate and the heat exchanger, which simplifies the structure of the cooling device.

[0010] Furthermore, since the cooling device is not intended to be fixed to an air vent in a position in which it would obstruct it, but is simply intended to be placed on a support, it does not disrupt the flow and efficiency of the vehicle's air conditioning and ventilation system.

[0011] According to embodiments, such a cooling device may include one or more of the following characteristics.

[0012] According to one embodiment, the first heat exchanger is a finned exchanger, for example made of aluminum.

[0013] According to one embodiment, each heat pipe assembly comprises a first deflection zone between the evaporation zone and the first condensation zone, the first deflection zone being configured to elevate said first condensation zone relative to the evaporation zone. Thus, with the first condensation zone positioned above the evaporation zone, the fluid in its liquid state flows down by gravity from the first condensation zone to the evaporation zone, thereby optimizing the efficiency of the heat pipe assemblies.

[0014] According to one embodiment, the heat pipe can be designed with a sintered interior (copper foam), which allows it to operate in a horizontal position. The fluid moves by capillary action and returns to the heat source, thus ensuring operation similar to that of a conventional heat pipe.

[0015] According to one embodiment, the evaporation zone and the first condensation zone each extend horizontally. The cooling device thus has a small dimension in the vertical direction.

[0016] According to one embodiment, the cooling device comprises a second heat exchanger extending transversely between the two sets of heat pipes, said second heat exchanger being fixed and thermally coupled to a second condensation zone on each of the two sets of heat pipes, the first and second heat exchangers being positioned respectively on either side of the heat collector plate. This further optimizes the cooling efficiency of the electronic device.

[0017] According to one embodiment, the second heat exchanger is a finned heat exchanger, for example made of aluminum. Such a heat exchanger exhibits excellent performance.

[0018] According to one embodiment, the cooling device is intended to be placed flat on a support, the first heat exchanger and the second heat exchanger being configured to at least partially support said cooling device. This ensures the stability of the cooling device when placed on a flat support.

[0019] According to one embodiment, the heat exchangers have lower surfaces that are aligned in the same plane with the heat collection plate. This further improves the stability of the support and, where applicable, increases the efficiency of induction charging.

[0020] According to one embodiment, each heat pipe assembly includes a second diversion zone between the evaporation zone and the second condensation zone, said second diversion zone being configured to elevate said second condensation zone relative to the evaporation zone. The fluid in the liquid state thus descends by gravity from the second condensation zone to the evaporation zone, thereby optimizing the efficiency of the heat pipe.

[0021] According to one embodiment, the evaporation zone and the second condensation zone each extend horizontally.

[0022] According to one embodiment, the two heat pipe assemblies, the first heat exchanger, and the second heat exchanger form a frame surrounding a space intended to house the electronic device. Thus, the two heat pipe assemblies and the two heat exchangers respectively form longitudinal members and cross members defining the space housing the electronic device, thereby further simplifying the structure of the cooling system.

[0023] According to one embodiment, each heatpipe assembly consists of a single heatpipe.

[0024] According to another embodiment, each heatpipe assembly consists of two heatpipes mounted end to end and joined together by the heat collector plate.

[0025] According to one embodiment, the heat collector plate is made of a metal or a metal alloy, which promotes the conduction of heat from the electronic device to the heat pipe assemblies.

[0026] According to one embodiment, the metal or metal alloy is non-magnetic. This allows the electronic device to be recharged by induction while it is being cooled by the cooling device.

[0027] According to one embodiment, the non-magnetic metal or metal alloy is chosen from non-magnetic aluminum, brass and stainless steels.

[0028] In one embodiment, the heat collector plate has two crimping tabs that are crimped onto each of the two heat pipe assemblies. In another embodiment, the first heat exchanger has two crimping tabs that are crimped onto each of the two heat pipe assemblies. In another embodiment, the second heat exchanger has two crimping tabs that are crimped onto each of the two heat pipe assemblies. Such arrangements further simplify the structure and manufacture of the cooling device.

[0029] According to one embodiment, the cooling device is symmetrical with respect to a longitudinal axis of symmetry parallel to the heat pipe assemblies.

[0030] According to one embodiment, the cooling device is symmetrical with respect to a transverse axis of symmetry perpendicular to the heat pipe assemblies.

[0031] According to a second object, an assembly is also proposed comprising a cooling device of the aforementioned type and an electronic device comprising a rear face resting against the heat collector plate, between the two heat pipe assemblies.

[0032] Other features and advantages of the invention will become apparent from the following description of particular embodiments of the invention, given by way of example but not limitation, with reference to the accompanying drawings in which:

[0033] [Fig-1] is a perspective view of a cooling device according to a first embodiment and of the electronic device that it is intended to cool.

[0034] [Fig.2] is a perspective view of the cooling device according to the first embodiment and of the electronic device it is intended to cool, the cooling device being illustrated placed on an induction charging device.

[0035] [Fig.3] is a partial, exploded view of the cooling device according to the first embodiment, representing the heat pipes and the heat collector plate of said cooling device.

[0036] [Fig.4] is a partial, exploded view of the cooling device according to the first embodiment, representing the heat pipes, the heat collector plate and the heat exchangers of said cooling device.

[0037] [Fig. 5] is a partial, exploded view, similar to that of [Fig. 3], of a device cooling according to a second embodiment.

[0038] The orientations expressed in the description are given with reference to an orthonormal coordinate system xyz, shown in the figures, in which x represents the longitudinal direction of the cooling device, y the transverse direction, and z the vertical direction oriented upwards in the usual position of the cooling device, i.e. when it is placed flat on a flat support.

[0039] In relation to figures 1 to 4, a cooling device 1 is described for cooling an electronic device 2, shown in figures 1 and 2.

[0040] The electronic device 2 is here a mobile phone. However, the cooling device 1 according to the invention is not exclusively designed for this type of device. It can also be used to support other electronic devices, such as a tablet, a GPS system, or other similar devices.

[0041] The cooling device 1 is in particular intended to be placed flat, i.e. with its lower surface in direct and stable contact, on a support 3, such as an induction charging device, shown in [Fig.2], equipping a console of a motor vehicle.

[0042] The cooling device 1 comprises two heatpipe assemblies. In the first embodiment of Figures 1 to 4, each heatpipe assembly comprises a single heatpipe 4, 5. Each heatpipe 4, 5 is intended to absorb heat from the electronic device 2 and to transfer it, here to at least one heat exchanger 6, 7 - and more precisely two in the embodiment shown - which will itself transfer it to the ambient air.

[0043] A heat pipe 4, 5, also referred to as a "heat pipe" in English, is an element designed to transport heat through the phenomenon of heat transfer by phase transition of a fluid. A heat pipe 4, 5 comprises a sealed tube containing a fluid in a liquid-vapor equilibrium state, such as water or alcohol, for example. Each heat pipe 4, 5 has an evaporation zone 8 designed to receive heat from a hot point, here a heat collector plate 11 that collects the heat emitted from the electronic device 2, and one or more condensation zones 9, 10, each designed to transfer heat to a cold point, here a heat exchanger 6, 7. In the evaporation zones 8, the fluid is in a liquid state The contents of the airtight tubes vaporize, absorbing thermal energy from the electronic device 2. In the condensation zones 9 and 10, the vapor circulating in the airtight tube from one of the evaporation zones 8 condenses and returns to a liquid state, releasing thermal energy. The liquid fluid then returns to the evaporation zone 8.

[0044] The evaporation zones 8 of the heat pipes 4, 5 are those thermally coupled to the heat collector plate 11. The heat collector plate 11 is intended to accommodate the rear face of the electronic device 2. It thus allows the heat from the electronic device 2 to be collected and conducted to the evaporation zones 8 of the heat pipes 4, 5. The condensation zones 9, 10 are those thermally coupled to each of the two heat exchangers 6, 7.

[0045] The two heat pipes 4, 5 extend parallel to each other along the longitudinal direction x. The heat collector plate 11 is fixed and thermally coupled to the heat pipes 4, 5 in a central area thereof, while the heat exchangers 6, 7 are respectively fixed and thermally coupled to one and the other of the two end areas of each of the two heat pipes 4, 5. In other words, the central area of ​​each heat pipe 4, 5 forms one of the evaporation areas 8, while the two end areas of each of the heat pipes 4, 5 each form one of the condensation areas 9, 10.

[0046] In the embodiment shown, the evaporation zone 8 and the condensation zones 9, 10 extend horizontally, parallel to each other. Furthermore, each heat pipe 4, 5 has two deflection zones 12, 17, each positioned between the evaporation zone 8 and one of the two condensation zones 9, 10. The deflection zones 12 are configured to elevate the condensation zones 9, 10 relative to the evaporation zone 8. This arrangement facilitates the return of the liquid, by gravity, from the condensation zones 9, 10 to the evaporation zone 8.

[0047] The heat collector plate 11 extends transversely from one to the other of the heat pipes 4, 5. The heat collector plate 11 has along each of its two lateral edges a crimping tab 13, 14 which allows the heat collector plate 11 to be crimped to the heat pipes 4, 5. Each crimping tab 13, 14 consists of a curved area inside which one of the heat pipes 4, 5 is positioned, said curved area being crimped onto said heat pipe 4, 5.

[0048] To promote heat conduction from the electronic device 2 to the heat pipes 4, 5, the heat collector plate 11 is advantageously made of metal or a metal alloy. Preferably, to allow the electronic device 2 to recharge via an induction charging device when placed in the cooling device 1, the heat collector plate 11 is made in a metal or metal alloy that is non-magnetic. Such a non-magnetic metal or metal alloy is notably chosen from non-magnetic aluminum, brass, and stainless steels.

[0049] The heat exchangers 6, 7 extend transversely from one to the other of the heat pipes 4, 5. Each heat exchanger 6, 7 is fixed and thermally coupled to the heat pipes 4, 5 by crimping tabs 15, 16. The crimping tabs 15, 16 have a curved area inside which the heat pipe 4, 5 is positioned and which is crimped onto the heat pipe 4, 5.

[0050] The heat exchangers 6, 7 are, for example, finned heat exchangers, that is to say, comprising a plurality of metal fins or plates increasing their contact surface with the ambient air and thus offering improved thermal performance. Heat is thus transferred from the end zones of the heat pipes 4, 5 to the heat exchanger 6, 7 by conduction and then transferred from the fins of the heat exchanger 6, 7 to the ambient air circulating around the fins.

[0051] Fin heat exchangers are, for example, made of aluminum. They can notably be made by extrusion.

[0052] As illustrated for example in [Fig.2], the two heat pipes 4, 5 and the two heat exchangers 6, 7 form a frame surrounding the space intended to accommodate the electronic device 2 while the heat collector plate 11 closes this space at least partially from below.

[0053] To ensure the stability of the cooling device 1, the lower surfaces of the heat exchangers 6 and 7 form at least partially the base of this device. In other words, the cooling device 1 rests at least partially on the two heat exchangers 6 and 7. Ideally, the lower surfaces of the heat exchangers 6 and 7 are aligned with the heat collector plate 11, so that the cooling device 1 is also supported by this heat collector plate 11.

[0054] Furthermore, according to a preferred embodiment, the cooling device is symmetrical with respect to a first axis of symmetry, parallel to the longitudinal axis x, and with respect to a second axis of symmetry, parallel to the transverse axis y. This further improves the stability of the cooling device 1.

[0055] Figure 5 is a partial illustration of a cooling device according to a second embodiment. This second embodiment differs from the first described above with reference to Figures 1 to 4 only in that each heatpipe assembly comprises two heatpipes 40, 41; 50, 51 instead of one. The heatpipes 40, 41; 50, 51 are positioned end-to-end, in pairs. Furthermore, each of the four heatpipes 40, 41; 50, 51 has an evaporation zone 8 formed by one of its ends, which is fixed and thermally coupled to the heat collector plate 11. For this To do this, the two heat pipes 40, 41 and 50, 51 of each pair are positioned end-to-end inside one of the crimping tabs 13, 14 of the heat collector plate 11, said crimping tab 13, 14 being crimped onto the two heat pipes 40, 41 and 50, 51 of the pair, which allows them to be joined together. Here, each heat pipe therefore has only one hot point and one cold point.

[0056] Although the invention has been described in connection with several particular embodiments, it is clearly evident that it is by no means limited to them and that it includes all technical equivalents of the means described as well as their combinations if these fall within the scope of the invention, as defined by the claims.

[0057] The use of the verb "comprise", "comprendre" or "include" and its conjugated forms does not exclude the presence of other elements or other steps than those stated in a claim.

[0058] In the claims, any reference sign in parentheses shall not be interpreted as a limitation of the claim.

Claims

Demands

1. Cooling device (1) for cooling an electronic device (2), the cooling device (1) comprising: - two sets of heat pipes extending parallel to each other, each set of heat pipes comprising at least one heat pipe (4, 5, 40, 41, 50, 51); - a heat collector plate (11) intended to receive a rear face of the electronic device (2), the heat collector plate (11) extending transversely between the two sets of heat pipes and being fixed and thermally coupled to at least one evaporation zone (8) of each of the two sets of heat pipes; - at least one first heat exchanger (6) extending transversely between the two sets of heat pipes, said first heat exchanger (6) being fixed and thermally coupled to a first condensation zone (9) of each of the two sets of heat pipes.

2. Cooling device (1) according to claim 1, wherein each heat pipe assembly comprises a first deflection zone (12) between the evaporation zone (8) and the first condensation zone (9), the first deflection zone (12) being configured to elevate said first condensation zone (9) relative to the evaporation zone (8).

3. Cooling device (1) according to claim 1 or 2, comprising a second heat exchanger (7) extending in the transverse direction between the two heat pipe assemblies, said second heat exchanger (7) being fixed and thermally coupled to a second condensation zone (10) of either of the two heat pipe assemblies, the first heat exchanger (6) and the second heat exchanger (7) being respectively positioned on either side of the heat collector plate (11).

4. Cooling device (1) according to claim 3, wherein the cooling device (1) is intended to be arranged flat on a support and wherein the first heat exchanger (6) and the second heat exchanger (7) are configured to at least partially support said cooling device (1).

5. Cooling device (1) according to claim 3, wherein each heat pipe assembly comprises a second deflection zone (17) between the evaporation zone (8) and the second condensation zone (10), said second deflection zone (17) being configured to elevate said second condensation zone (10) relative to the evaporation zone (8).

6. Cooling device (1) according to claim 2, wherein the two heat pipe assemblies, the first heat exchanger (6) and the second heat exchanger (7) form a frame surrounding a space intended to receive the electronic device (2).

7. Cooling device (1) according to any one of claims 1 to 6, wherein each heatpipe assembly consists of a single heatpipe (4, 5) or of two heatpipes (40, 41, 50, 51) mounted end-to-end and joined together by the heat collector plate (11).

8. Cooling device (1) according to any one of claims 1 to 7, wherein the heat-collecting plate (11) is made of a metal or metal alloy that is non-magnetic.

9. Cooling device (1) according to any one of claims 1 to 8, wherein the heat collector plate (11) has two crimping tabs (13, 14) which are respectively crimped onto each of the two heat pipe assemblies and wherein the first heat exchanger (6) has two crimping tabs (15, 16) which are respectively crimped onto each of the two heat pipe assemblies.

10. Assembly comprising a cooling device (1) according to any one of claims 1 to 9 and an electronic device (2) comprising a rear face resting against the heat collector plate (11), between the two heat pipe assemblies.

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