A cover assembly for a heat sink of an electronic module

Abstract

A cover plate assembly 10 suitable for a heatsink for an vehicle electronic module 6 (ECU) provides plurality of valves 3 that open and close to control ventilation to openings 7 adjacent the heatsink

Description

TECHNICAL FIELD 5 Present invention relates in general relates to a field of automobiles. Particularly, although not exclusively, the present invention relates to ventilation devices for ventilating electronic modules in the automobiles. Further embodiments of the present disclosure disclose a cover assembly for a heat sink of an electronic module of the vehicle. 10 BACKGROUND 15 20 Vehicles, such as passenger vehicles and commercial vehicles are typically operated and controlled by human drivers. Although such vehicles are operated or controlled by human drivers, most of the functionalities are taken care by electronic modules such as control modules and the like. With advancement in safety and technology in vehicles, use of electronic components has also increased. Such electronic components may function efficiently to control various operations of the vehicles. An integrated circuit chip is widely used in an electrical appliance such as a central processing unit. When the electrical appliance operates, the chip generates energy in the form of heat. If the chip is unable to transfer enough heat to ambient air, the elevated operating temperature may result in damage of the chip or the breakdown of the whole appliance. 25 In order to remove most heat generated from the chip, especially a CPU (central processing unit), an additional heat sink is usually attached on and spreads over the top surface thereof. The heat sink is made of a highly thermal conductive material and has a larger surface area than the attached CPU for improving heat transfer. In addition, the heat sink is frequently constructed with spaced fins in order to provide 30 extra surface area of heat transfer. Furthermore, heat from the heat sink should be quickly dissipated to ensure that the electronic components do not heat up and lead to failures. At present, there are various systems provided with ventilation devices. The 35 ventilation device in general allows flow of fluid such as air into the system in order to cool electrical or electronic components of said system. This cooling prevents malfunctions caused by to excessive temperature in these components. Such type of ventilation devices can be placed in a central processing unit or in an electronic module. 5 Conventional, the ventilation device has a motor powered with electrical energy. This motor converts the electrical energy into mechanical energy. The ventilation device has a fan formed by a shaft with blades fixed to a hub of the shaft. The motor actuates the rotation of the fan and such rotation of the fan causes the blades to be 10 put into motion, forcing the passage of air from outside the central processing unit or electronic module into the central processing unit or electronic module in order to cool the electronic and electrical components. However, these ventilation devices have drawbacks. Indeed, the air sucked in or drawn in by the blades contains I w / floating particles such as dust. Over the time, the floating particles collect on the C\1 15 electrical and electronic components, on the blades of the ventilation device and in every nook and corner of the central processing unit or electronic module. This causes loss of efficiency of the ventilation device which no longer cools the components of the central processing unit or electronic module efficiently. The components of the central processing unit or of the electronic module are the then 20 constantly subjected to excess of temperature. Also, particles which gets accumulated inside the electronic module form a layer of particles which acts as a heat insulator and prevents the components from cooling down. This layer may also be deposited on an electrical conductor and prompt 25 short-circuits. The accumulation of particles causes disturbance in the working of the central processing unit or the electronic module which therefore becomes highly sensitive to dust, heat, cold and problems of electrical power supply. The central processing unit or the electronic module thus proves to be more fragile and less reliable. Consequently, malfunctions may occur in an untimely way, giving rise to 30 chaotic functioning. Furthermore, malfunctions in the ventilation device may occur because of the accumulation of solid particles on the fan, the blades, and the motor. Indeed, the solid particles interfere with the contacts of the motor and get mixed with the grease injected by the rotation, hampering the efficient operation of the rotation of the fan. With current ventilation devices, these faults are not detected. When the ventilation device no longer carries out the component-cooling function, 5 there is a great risk that the components of the central processing unit or the electronic module might get overheated or might even melt down. It is therefore important to control, firstly, the cleanliness of the ventilation device because an excess of floating particles reduces the airflow and, secondly, the efficient operation of the blades of the fan. Therefore, the ventilation techniques presented do not 10 make it possible to reduce the number of maintenance operations on the central processing unit or the electronic module or to reduce the accumulation of floating particles in the central processing unit or the electronic module. There may be a need for improved ways of ventilation of the electronic modules for Cyj 15 efficient thermal management and the present disclosure has been devised in the light of the above considerations. The information disclosed in this background of the disclosure section is only for enhancement of understanding of the general background of the invention and 20 should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art. SUMMARY OF THE INVENTION 25 One or more shortcomings of the conventional system or device are overcome, and additional advantages are provided through the provision of the assembly and system as claimed in the present disclosure. Additional features and advantages are realized through the techniques of the 30 present disclosure. Other embodiments and aspects of the disclosure are described in detail herein and are considered a part of the claimed disclosure. In one non-limiting embodiment of the disclosure, a cover assembly for a heat sink of an electronic module is disclosed. The cover assembly includes a cover plate 35 defined with a plurality of valves. Each of the plurality of valves is structured to translate between an open condition and a closed condition relative to expansion and contraction of the cover plate. The assembly further includes at least one actuator which is structured to cause expansion and contraction of the cover plate. The at least one actuator is a shape memory alloy member, wherein either ends of 5 the SMA member is fixedly connectable to an electronic module in front of a heat sink. The SMA member is anchored to protuberance extending from the cover plate and wherein the SMA member cause expansion and contraction of the cover plate in response to temperature of the electronic module. Advantageously, the SMA member is operable to change its state between an open condition to reveal the 10 plurality of valves and a closed condition to conceal the plurality of valves in response to temperature change of electronic module in operation, thus achieving on demand ventilation of electronic modules. LQ In an embodiment of the disclosure, each of the plurality of valves in the open C\l 15 condition is configured to allow passage of air through the heat sink of the electronic CQ module. In an embodiment of the disclosure, each of the plurality of valves in the cover plate correspond to apertures defined in the heat sink of the electronic module. 20 In an embodiment of the disclosure, either ends of the SMA member is anchored to projections extending from a proximal surface of the electronic module. In an embodiment of the disclosure, the cover plate is an elastomeric plate. The 25 cover plate is defined with a kirigami structure. The kirigami structure is a bistable kirigam i structure. In an embodiment of the disclosure, the SMA member causes expansion and contraction of the cover plate to translate the plurality of valves between the open 30 condition and the closed condition in response to heating and cooling of the SMA member. The SMA member is structured to receive heat from electronic module. The SMA member is at least one of a wire and a spring made of nickel and titanium. The SMA member is a heating coil, wherein the heating coil is inductively heated by supplying pulses of electrical current. The pulse of electrical current is controlled by a control module associated with the cover assembly. The control module controls the pulses of electrical current in response to temperature of electronic module. In an embodiment of the disclosure, the protuberance is defined in the major surface 5 of the cover plate facing away from a surface of the electronic module. It is to be understood that the aspects and embodiments of the disclosure described above may be used in any combination with each other. Several of the aspects and embodiments may be combined to form a further embodiment of the disclosure. 10 The foregoing summary is illustrative only and is not intended to be in any way limiting. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features will become apparent by reference to the drawings and the following detailed description. LO is C\J BRIEF DESCRIPTION OF THE ACCOMPANYING FIGURES ¢2¾ Novel features and characteristics of the disclosure are set forth in the appended claims. The disclosure itself, however, as well as a preferred mode of use, further 20 objectives, and advantages thereof, will best be understood by reference to the following detailed description of an illustrative embodiment when read in conjunction with the accompanying figures. One or more embodiments are now described, by way of example only, with reference to the accompanying figures wherein like reference numerals represent like elements and in which: 25 Fig. 1 shows a perspective view of an electronic module with a cover assembly, according to an embodiment of the present disclosure. Fig. 2 shows a perspective view of the electronic module of FIG.1 with cover 30 assembly attached to the electronic module, according to an embodiment of the present disclosure. Fig. 3 shows a perspective view of the electronic module of FIG.1 with cover assembly attached to the electronic module, according to another embodiment of 35 the present disclosure. Fig. 4 shows an exemplary schematic view of a cover plate under expanded state. FIG.5 shows an exemplary schematic view of the cover plate in contracted state. 5 The figure depicts embodiments of the disclosure for purposes of illustration only. One skilled in the art will readily recognize from the following description that alternative embodiments of the method for controlling the temperature of the vehicle cabin without departing from the principles of the disclosure described herein. 10 DETAILED DESCRIPTION The foregoing has broadly outlined the features and technical advantages of the present disclosure in order that the description of the disclosure that follows may be 15 better understood. Additional features and advantages of the disclosure will be described hereinafter which form the subject of the disclosure. It should be appreciated by those skilled in the art that the conception and specific embodiments disclosed may be readily utilized as a basis for modifying or designing other systems for carrying out the same purposes of the present disclosure. It should also be 20 realized by those skilled in the art that such equivalent constructions do not depart from the spirit and scope of the disclosure. The novel features which are believed to be characteristic of the disclosure, as to its organization, together with further objects and advantages will be better understood from the following description when considered in connection with the accompanying figures. It is to be expressly 25 understood, however, that each of the figures is provided for the purpose of illustration and description only and is not intended as a definition of the limits of the present disclosure. In the present document, the word "exemplary" is used herein to mean "serving as 30 an example, instance, or illustration." Any embodiment or implementation of the present subject matter described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. While the disclosure is susceptible to various modifications and alternative forms, 35 specific embodiments thereof have been shown by way of example in the drawings and will be described below. It should be understood, however that it is not intended to limit the disclosure to the particular form disclosed, but on the contrary, the disclosure is to cover all modifications, equivalents, and alternatives falling within the scope of the disclosure. 5 The terms “comprises.... a”, “comprising”, or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a system that comprises a list of components does not include only those components but may include other components not expressly listed or inherent to such mechanism. In other words, one 10 or more elements in the system or steps of method proceeded by “comprises... a” does not, without more constraints, preclude the existence of other elements or additional elements in the device. It is to be noted that a person skilled in the art would be motivated from the present Cyj 15 disclosure and modify various features of device, without departing from the scope of the disclosure. Therefore, such modifications are considered to be part of the ¢2¾ disclosure. Accordingly, drawings show only those specific details that are pertinent to understand the embodiments of the present disclosure, so as not to obscure the disclosure with details that will be readily apparent to those of ordinary skilled in the 20 art having benefit of the description herein. Also, the device and system of the present disclosure may be employed in any kind of vehicles including commercial vehicles, passenger vehicles, and the like. However, complete vehicle is not illustrated in the drawings of the disclosure for the purpose of simplicity. The following detailed description is merely exemplary in nature and is not intended to 25 limit application and uses. Furthermore, there is no intention to be bound by any theory presented in the preceding background or summary or the following detailed description. It is to be understood that the disclosure may assume various alternative orientations and step sequences, except where expressly specified to the contrary. It is also to be understood that the specific devices or components 30 illustrated in the attached drawings and described in the following specification are simply exemplary embodiments of the inventive concepts defined in the appended claims. Hence, specific dimensions or other physical characteristics relating to the embodiments that may be disclosed are not to be considered as limiting, unless the claims expressly state otherwise. Hereinafter, preferred embodiments of the present disclosure will be described 5 referring to the accompanying drawings. While some specific terms of “proximal,” “distal,” “front end” or “rear end” and other terms containing these specific terms and directed to a specific direction will be used, the purpose of usage of these terms or words is merely to facilitate understanding of the present invention referring to the drawings. Accordingly, it should be noted that the meanings of these terms or words 10 should not improperly limit the technical scope of the present invention. Fig. 1 illustrates an exemplary perspective view of an electronic module and a cover plate for the electronic module. In the corresponding figures, the electronic module is depicted by reference numeral 6 and the cover plate is depicted by reference Cyj 15 numeral 10. In an embodiment, the electronic module (6) may be a central processing unit [CPU] or any other system for which it is necessary to provide a ¢2¾ ventilation unit or heat sink in order to cool components. Also, the provision of such ventilation unit or heat sink may also aid in restricting dust and other foreign particles to get accumulated in the electronic module (6). The term heat sink here refers to a 20 component that increases the heat flow away from a hot device in this case the electronic module (6). Further, the term ventilation unit refers to a portion of a device that aids in efficient dissipation of heat from hot devices. Generally, during operational condition, the electronic module (6) may get heated due to continuous operations and in such situations, it may be necessary to cool such components 25 while avoiding accumulation of foreign particles. Conventionally, there exits ventilation devices that are used for the cooling of the components. However, conventional ventilation devices have myriad drawbacks including complexity, bulky, increase noise levels in a vehicle cabin and the like. To that effect, the conventional device is significantly costly as they have a greater number of working 30 components. The present disclosure elucidates about a cover assembly which may be used for efficient ventilation of the electronic module (6). The cover assembly may be depicted by reference alphabet “C” and hereinafter the cover assembly may also be referred to as assembly (C). The cover assembly (C) may be less complex and uses lesser number of parts as compared to the conventional devices. Also, the assembly (C) may have advantages including but not limiting to avoiding damage that may be caused to the electronic module (6) due to condensation and migration on electronic components [not shown], restricting accumulation of dust particles and 5 the like. Here, the term “migration” or “electrochemical migration (ECM)” is the growth of conductive metal filaments on a printed circuit board (PCB) through an electrolyte solution under a DC voltage bias. ECM may cause a reduction in surface insulation resistance (SIR) between adjacent conductors and lead to intermittent or catastrophic circuit failures. The cover assembly (C) may be elucidated with 10 reference to FIG(s) 2 and 3 in conjunction to FIG.1. The cover assembly (C) or the assembly (C) may be provided adjacent to a heat sink [as shown in FIG.2] that is defined within or attached to the electronic module LQ (6). In an embodiment, the assembly (C) may include a cover plate (10). The cover C\l 15 plate (10) [best shown in FIG. 1 ] may be shaped similar to the shape of the electronic CQ module (6). In an embodiment, one of a major surface of the cover plate (10) may be juxtaposed to a surface of the heat sink (7a) at proximal end of the electronic module (6). In another embodiment, the cover plate (10) may be positioned on the heat sink 1 end of the electronic module (6). The heat sink end of the electronic module (6) may 20 be defined with apertures (7) [best shown in FIG.1] to allow of flow of fluid such as air for cooling the electronic module (6) when the temperature of the electronic module (6) is more than threshold temperature. For example, if the threshold temperature / operating temperature of the electronic module (6) may be around 80 to 90 degree Celsius and the temperature exceeds the threshold temperature, the 25 heat sink (7a) may remove excess heat to maintain the temperature of the electronic module (6). The threshold temperature range described above is only for exemplary purpose and the actual operating range may vary based on type of the electronic modules and functionality of the same. The cover plate (10) may be an elastomeric plate but not limiting to the same. In an embodiment, the cover plate (10) may be 30 defined with a kirigami structure. The kirigami structure defined on the cover plate (10) may be a bistable kirigami structure but not limiting to the same. The term “kirigami” refers to a technique of cutting and folding objects such as the cover plate (10) according to the present disclosure into functional objects or designs. In the present disclosure, the kirigami structure defined on the cover plate (10) may define a plurality of valves (3). Each of the plurality of valves (3) in the cover plate (10) may correspond to the apertures (7) defined on the heat sink end of the electronic module (6). Each of the plurality of valves (3) may be structured to selectively 5 translate between an open condition and a closed condition upon causing expansion or contraction of the cover plate (10). Configuration of the plurality of valves (3) are such that when the cover plate (10) expands it opens the plurality of valves (3) and when the cover plate (10) contracts it closes each of the plurality of valves (3). In the open position, each of the plurality of valves (3) may be configured 10 to provide ventilation to the heat sink (7a) of the electronic module (6) for efficient thermal management. The expansion and contraction of the cover plate (10) may be caused in response to temperature of the electronic module (6), and the process of translating the cover plate (10) between the expanded and contracted position may I w / be performed by at least one actuator (1) which may be elucidated in further C\J 15 embodiments of the present disclosure. The cover plate (10) may be further defined with protuberances (2) [shown in FIG. 1 ] on at least one of the major surfaces of the cover plate (10). The term 1 “protuberance”, “protrusions” used in the present disclosure refers to a projection or 20 a protrusion projecting from a surface of an object. The “protuberance” may be an external member secured to the object or may be defined internal to the object. In an embodiment, the protuberance (2) may be defined on one of the major surfaces that may be facing away from the heat sink end of the electronic module (6). In an embodiment, the protuberances (2) may be defined on one end of the cover plate 25 (10). In some embodiments, the protuberance (2) may be defined on two opposing ends of the cover plate (10). In an embodiment, the protuberances (2) may be defined at a substantially central portion of the cover plate (10) two opposing ends of the cover plate (10). Each of the protuberances (2) may extend perpendicularly from the major surface of the cover plate (10). In some embodiments, the protuberances 30 (2) may be defined integrally with the cover plate (10) or may be coupled to the major surface of the cover plate (10) by known joining methods including but not limiting to mechanical joining, bonding, and thermal joining. In an embodiment, the protuberances (2) which is externally adhered to the cover plate (10) include rivets, round headed pins and the like. The protuberance (2) defined on the cover plate (10) may be structured to accommodate the at least one actuator (1) that is configured to cause expansion and contraction of the cover plate (10). The at least one actuator (1) and its operation may be elucidated hereinafter. 5 The cover assembly (C) includes the at least one actuator (1). As shown in FIG(s) 2 and 3, the at least one actuator (1) may be anchored to the protuberance (2) defined on the cover plate (10). The at least one actuator (1) may be actuated or triggered to impart lateral force [i.e., side wise force as indicated by arrow in FIG.4 and 5] on 10 either ends of the cover plate (10) to cause expansion and contraction of the cover plate (10). The at least one actuator (1) may be a shape-memory alloy (SMA) member. In an embodiment, more than one SMA member may be used to cause expansion and contraction of the cover plate (10). Hereinafter, functioning of the at LQ least one actuator (1) may be elucidated with the help of the SMA member. The C\l 15 shape-memory alloy member may also be referred to as memory metal or memory CQ alloy. The term “shape memory alloy [SMA]” here refers to an alloy that can be deformed when cold but returns to its preformed shape when heated. The SMA member may be at least one of a wire and a spring. The SMA member may be made 1 of material such as Nitinol i.e., alloy of nickel and titanium but not limiting to the 20 same. Similar material having SMA features may also be used as the SMA member in the present disclosure and forms a part of the present disclosure. In an embodiment, either ends of the SMA member may be anchored to protrusions (5) defined on the surface the electronic module (6) on the heat sink end. In an embodiment, either ends of the SMA member may be fixedly connected to the 25 protrusions (5) on surface of the electronic module (6). The protrusions (5) [shown in FIG. 1 ] described above may be defined on the ends of electronic module (6) on the heat sink end. In an embodiment, the SMA member / the at least one actuator (1) may be communicatively coupled to a control module (T) associated with the cover assembly (C). The control module (T) may be configured to activate the SMA 30 member / the at least one actuator (1) to cause expansion and contraction of the cover plate (10), thereby translating each of the plurality of valves (3) selectively to the open condition and the closed condition. In operation, the at least one actuator (1) or the SMA member may cause expansion and contraction of the cover plate (10) in response to heat dissipated by the heat sink (7a) of the electronic module (6). The SMA member may be depicted by referral numeral “1a” in the corresponding figures. The SMA member (1a) may originally be 5 in the deformed state i.e., when cold [as shown in FIG.2 and 4] and may return to the preformed state upon heating. The SMA member (1a) may be heated to cause expansion of the cover plate (10) to translate each of the plurality of valves (3) to the open condition. In other words, as the SMA member (1a) is anchored to the protuberance (2) on the cover plate (10), it pulls the cover plate (10) laterally [i.e., 10 sidewise as shown in FIG-4]. Pulling the cover plate (10) may cause the expansion of the cover plate (10), thereby translating each of the plurality of valves (3) to the open condition. In the open condition, the each of the plurality of valves (3) may be structured to ventilate the heat sink (7a) of the electronic module (6). As shown in I ■4 ■* FIG.4 which illustrates an exemplary schematic view of a kirigami plate in expanded (XI 15 condition. Force on the kirigami plate for causing expansion is depicted by arrows on either ends of the plate. The force for causing the expansion of the plate may be provided by the SMA member (1a). The SMA member (1a) may be heated until it reaches to a pre-formed shape. In an embodiment, the SMA member (1a) may be heated by various heating means including at least one of radiation heating, 20 convection heating, induction heating and the like. For example, the SMA member (1a) may be structured to receive heat from the electronic module (6) i.e., the SMA member (1 a) may be heated by conduction. The heat emitted from the heat sink (7a) of the electronic module (6) may be absorbed by the SMA member (1a), thereby regaining pre-formed shape. In another exemplary embodiment, the SMA member 25 (1a) may be inductively heated by supplying pulses of electrical current through the SMA member (1a). Supplying the pulses of electrical current may heat the SMA member (1a), heating the SMA member (1a) may return the SMA member (1a) to preformed shape. In an embodiment, the control module (T) may be configured to trigger the power supply module [not shown] to supply pulses of electrical current to 30 the SMA member (1a). The control module (T) may be programmed to trigger the power supply module at preset time. In an embodiment, the control module (T) may control the supply of pulses of electrical current (6) in response to the temperature of the electronic module (6). The temperature of the electronic module (6) may be determined by one or more temperature sensors [not shown]. The one or more temperature sensors may determine the temperature of the electronic module (6) and send a signal corresponding to the temperature to the control module (T). 5 Based on the temperature signal received by the control module (T) from the one or more sensors, the control module (T) may control the supply of pulses of electrical current by triggering the power supply module. Triggering the power supply module [not shown] supplies electrical pulses to the SMA member (1a), thereby heating the SMA member (1a). Upon heating the SMA member (1a), the SMA member (1a) 10 returns to its preformed shape gradually, thus pulling the cover plate (10) causing it to expand. When the cover plate (10) expands, the plurality of valves (3) gradually translates from the closed condition to the open condition. As described in previous embodiments, in the open condition, the plurality of valves (3) allow the flow of fluid I w / such as air onto and through the heat sink (7a) of the electronic module (6). C\1 15 Thereby, providing efficient thermal management of the electronic module (6). Once the SMA member (1a) cools down, the SMA member (1a) begins to deform causing contraction [as indicated by arrows in FIG.5] of the cover plate (10). Contraction of the cover plate (10) causes the plurality of valves (3) to translate to closed position from the open position. In closed position, the plurality of valves (3) blocks the 20 access to the apertures (7) of the heat sink (7a) and ensures that dust and other foreign particles do not get accumulated in the electronic module (6). In some embodiments, restoring force of the expanded cover plate (10) may also aid in contraction of the cover plate (10) and may cause the plurality of valves (3) to translate to the closed position. 25 In another embodiment, one or more SMA members (1a and 1b) may be used for causing expansion and contraction of the cover plate (10). For instance, two SMA members (1a and 1b) may be used in the cover assembly (C) [as shown in FIG.3], The two SMA members (1a and 1 b) may be selectively tiggered to cause expansion 30 and contraction of the SMA member (1a and 1b). The two SMA members (1a and 1 b) may be anchored to the protuberance (2) and the protrusions (5). One of the two SMA members i.e., SMA member (1a) may be configured to cause expansion of the cover plate (10) as explained in the previous embodiment of the present disclosure. Likewise, the SMA member (1 b) may be triggered to cause contraction of the cover plate (10). The SMA member (1b) may be communicatively coupled to the control module (T). The control module (T) may be configured to trigger the power supply module [not shown] to supply electrical pulse to the SMA member (1b) in response 5 to the temperature of the electronic module (6). Supplying electrical pulse through the SMA member (1b) may heat the SMA member (1b). Upon heating the SMA member (1b), the SMA member (1b) returns to its preformed shape gradually, thus pulling the cover plate (10) laterally inward causing it to contract. Contraction of the cover plate (10) causes the plurality of valves (3) to translate from the open position 10 to the closed position. In an embodiment of the disclosure, the control module (T) may be a centralized control unit, or a dedicated control unit associated with the electronic module (6). LQ The control module (T) may be comprised of a processing unit. The processing unit C\l 15 may comprise at least one data processor for executing program components for CQ executing user- or system-generated requests. The processing unit may be a specialized processing unit such as integrated system (bus) controllers, memory management control units, floating point units, graphics processing units, digital 1 signal processing units, etc. The processing unit may include a microprocessor, 20 such as AMD Athlon, Duron or Opteron, ARM’s application, embedded or secure processors, IBM PowerPC, Intel’s Core, Itanium, Xeon, Celeron, or other line of processors, etc. The processing unit may be implemented using a mainframe, distributed processor, multi-core, parallel, grid, or other architectures. Some embodiments may utilize embedded technologies like application-specific 25 integrated circuits (ASICs), digital signal processors (DSPs), Field Programmable Gate Arrays (FPGAs), etc. In some embodiments, the processing unit may be disposed in communication with one or more memory devices (e.g., RAM, ROM etc.) via a storage interface. The 30 storage interface may connect to memory devices including, without limitation, memory drives, removable disc drives, etc., employing connection protocols such as serial advanced technology attachment (SATA), integrated drive electronics (IDE), IEEE-1394, universal serial bus (USB), fibre channel, small computing system interface (SCSI), etc. The memory drives may further include a drum, magnetic disc drive, magneto-optical drive, optical drive, redundant array of independent discs (RAID), solid-state memory devices, solid-state drives, etc 5 In an embodiment, the cover assembly (C) of the present disclosure may uses lesser number of parts as compared to the conventional devices. Also, the assembly (C) provides may avoid damage that may be caused to the electronic module (6) due condensation and migration on electronic components. Further, the cover assembly (C) may efficiently restrict accumulation of dust particles and the like in the 10 electronic module (6). Equivalents With respect to the use of substantially any plural and / or singular terms herein, LQ 15 those having skill in the art can translate from the plural to the singular and / or from C\l the singular to the plural as is appropriate to the context and / or application. The CQ various singular / plural permutations may be expressly set forth herein for sake of clarity. 20 It will be understood by those within the art that, in general, terms used herein, are generally intended as "open" terms (e.g., the term "including" should be interpreted as "including but not limited to," the term "having" should be interpreted as "having at least," the term "includes" should be interpreted as "includes but is not limited to," etc.). It will be further understood by those within the art that if a specific number of 25 an introduced claim recitation is intended, such an intent will be explicitly recited in the claim, and in the absence of such recitation no such intent is present. For example, as an aid to understanding the description may contain usage of the introductory phrases "at least one" and "one or more" to introduce claim recitations. However, the use of such phrases should not be construed to imply that 30 the introduction of a claim recitation by the indefinite articles "a" or "an" limits any particular claim containing such introduced claim recitation to inventions containing only one such recitation, even when the same claim includes the introductory phrases "one or more" or "at least one" and indefinite articles such as "a" or "an" (e.g., "a" and / or "an" should typically be interpreted to mean "at least one" or "one or more"); the same holds true for the use of definite articles used to introduce claim recitations. In addition, even if a specific number of an introduced claim recitation is explicitly recited, those skilled in the art will recognize that such recitation should typically be interpreted to mean at least the recited number (e.g., the bare recitation 5 of "two recitations," without other modifiers, typically means at least two recitations, or two or more recitations). Furthermore, in those instances where a convention analogous to "at least one of A, B, and C, etc." is used, in general such a construction is intended in the sense one having skill in the art would understand the convention (e.g., "a system having at least one of A, B, and C" would include but not 10 be limited to systems that have A alone, B alone, C alone, A and B together, A and C together, B and C together, and / or A, B, and C together, etc.). In those instances where a convention analogous to "at least one of A, B, or C, etc." is used, in general such a construction is intended in the sense one having skill in the art would I w / understand the convention (e.g., "a system having at least one of A, B, or C" would C\1 15 include but not be limited to systems that have A alone, B alone, C alone, A and B together, A and C together, B and C together, and / or A, B, and C together, etc.). It will be further understood by those within the art that virtually any disjunctive word and / or phrase presenting two or more alternative terms, whether in the description, or drawings, should be understood to contemplate the possibilities of including one 20 of the terms, either of the terms, or both terms. For example, the phrase "A or B" will be understood to include the possibilities of "A" or "B" or "A and B." While various aspects and embodiments have been disclosed herein, other aspects and embodiments will be apparent to those skilled in the art. The various aspects 25 and embodiments disclosed herein are for purposes of illustration and are not intended to be limiting, with the true scope and spirit being indicated in the description. Referral Numerals: 17 03 25 Description Reference number Base plate 10 SMA actuator 1 First SMA actuator 1a Second SMA actuator 1b Protuberance on the base plate 2 Plurality of valves 3 Protrusions 5 Electronic module 6 Apertures 7 Heat sink 7 a Cover assembly C Control module T

Claims

1. A cover assembly (C) for a heat sink (7a) of an electronic module (6), the assembly (C) comprising:5 • a cover plate (10) defined with a plurality of valves (3), each of theplurality of valves (3) is structured to translate between an open condition and a closed condition relative to expansion and contraction of the cover plate (10);• at least one actuator (1) structured to cause expansion and10 contraction of the cover plate (10),o the at least one actuator is a shape-memory alloy [SMA] member (1a and 1b),LQ whereinCM any one of the ends of the shape-memory alloy [SMA] member (1a and 1 b)QQ 15 is fixedly connectable to an electronic module (6) in front of a heat sink (7a), and is anchored to protuberance (2) extending from the cover plate (10);wherein1 the shape-memory alloy [SMA] member (1a and 1b) causes expansionand contraction of the cover plate (10) in response to temperature of the 20 electronic module (6);andwherein the cover plate (10) is defined with a kirigami structure.

2. The assembly (C) as claimed in claim 1, wherein each of the plurality of valves 25 (3) in the open condition is configured to allow passage of air through the heatsink (7a) of the electronic module (6).

3. The assembly (C) as claimed in claim 1, wherein each of the plurality of valves (3) in the cover plate (10) correspond to apertures (7) defined in the heat sink 30 (7a) of the electronic module (6).

4. The assembly (C) as claimed in claim 1, wherein either ends of the shape-memory alloy member is anchored to projections (P) extending from a proximal surface of the electronic module (6).5 5. The assembly (C) as claimed in claim 1, wherein the cover plate (10) is anelastomeric plate.

6. The assembly (C) as claimed in claim 1, wherein the kirigami structure is a10 bistable kirigami structure.

7. The assembly (C) as claimed in claim 1, wherein the SMA member (1a and 1 b)causes expansion and contraction of the cover plate (10) to selectively translatethe plurality of valves (3) between the open condition and the closed condition in response to heating and cooling of the SMA member (1a and 1b).

8. The assembly (C) as claimed in claim 7, wherein the SMA member (1a and 1 b) is structured to receive heat from the electronic module (6).20 9. The assembly (C) as claimed in claim 1, wherein the SMA member is at leastone of a wire and a spring made of nickel and titanium.

10. The assembly (C) as claimed in claim 8 and 9, wherein the SMA member is inductively heated by supplying pulses of electrical current.11 .The assembly (C) as claimed in claim 10, wherein the pulse of electrical current is controlled by a control module (T) associated with the cover assembly (C).

12. The assembly (C) as claimed in claim 11, wherein the control module (T)30 controls electrical pulses in response to temperature of the electronic module (6).

13. The assembly (C) as claimed in claim 1, wherein the protuberance (2) is defined on a major surface of the cover plate (10) facing away from a surface of the 35 electronic module (6).

14. An electronic module in a vehicle comprising a cover assembly (C) as claimed in claim 1.LDCM

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