Electronic device

Abstract

An electronic device D includes a housing l (e.g. one-piece) with an opening 101. An integrated module may be inserted into the opening during assembly along a first direction S1 and disposed inside housing. Integrated module includes bracket 21, antenna module (fig 4, 22), and circuit board 23. Antenna module is on the bracket (fig 4, R1). Circuit board is disposed on the bracket along second direction (fig 4, S2). Antenna module is on one side of the circuit board and may have two perpendicular antenna elements (e.g. dual frequency) 221, 222 on first and second substrates (fig 7; 2210, 2220). May be third and fourth antenna elements (e.g. single frequency) 223, 224 and substrates (fig 7; 2230, 2240). Bracket may include antenna element holder (fig 5, 211) with cantilevered buckle structure (fig 5, 212) for clamping, foolproof structure (fig 5; 213) for snapping, and groove (fig 5, 214). A heat dissipating element (fig 4, 24) may be on the bracket, surface coated with black printed layer (fig 4, 25) overlapping holes (fig 4, 210) in the bracket. Holes in the housing and a base may provide a heat convection channel.

Description

CROSS-REFERENCE TO RELATED PATENT APPLICATION

[0001] This application claims the benefit of priority to Taiwan Patent Application No. 113103231, filed on January 29, 2024. The entire content of the above identified application is incorporated herein by reference.

[0002] Some references, which may include patents, patent applications and various publications, may be cited and discussed in the description of this disclosure. The citation and / or discussion of such references is provided merely to clarify the description of the present disclosure and is not an admission that any such reference is “prior ait” to the disclosure described herein. All references cited and discussed in this specification are incorporated herein by reference in their entireties and to the same extent as if each reference was individually incorporated by reference. I7TI7T H 017 TTTI7 DlCri OQTTO17 Jr IJlLJLjJLf v / JP 1 JHLJlL UlclV_ / LjvjoU

[0003] The present disclosure relates to an electronic device, and more particularly to an electronic device that integrates multiple components through a fixed bracket. BACKGROUND OF THE DISCLOSURE

[0004] Currently, a housing of an electronic device can be a detachable housing or a one-piece housing. The detachable housing refers to a housing that can be disassembled into two or more shells, which facilitates electronic components to be installed therein and assembled into one body. The one-piece housing refers to a housing that cannot be disassembled into multiple shells. In addition, the detachable housing has assembly seams on the surface, which negatively affects the aesthetic appearance of the electronic device. The one-piece housing is favored by users in terms of appearance, but is not conducive to mounting of internal components, such as antennas or circuit boards, into the housing of the electronic device.

[0005] Therefore, how to meet the requirements for the aesthetic appearance of the electronic device and easy assembly of its internal components through an improvement in structural design has become an important issue to be addressed in the related art. SUMMARY OF THE DISCLOSURE

[0006] In response to the above-referenced technical inadequacies, the present disclosure provides an electronic device that integrates multiple components through a fixed bracket, which can meet the requirements for an aesthetic appearance of the electronic device and easy assembly of its components.

[0007] In order to solve the above-mentioned problems, one of the technical aspects adopted by the present disclosure is to provide an electronic device which includes a housing and an integrated module. The housing has an opening. The integrated module is inserted into the opening along a first direction and disposed inside the housing. The integrated module includes a fixed bracket, an antenna module, and a circuit board. The fixed bracket includes an antenna clearance region and an accommodating region. The antenna clearance region is located on one side of the accommodating region. The antenna module is disposed on the fixed bracket and located on the antenna clearance region. The circuit board is disposed on the fixed bracket along a second direction and disposed at the accommodating region. The second direction is different from the first direction.

[0008] Therefore, in the electronic device provided by the present disclosure, components such as the antenna module, the circuit board, and the heat dissipation element are assembled into the fixed bracket, such that the components inside the electronic device can form a modular structure, and are inserted into the housing through the opening, thereby reducing the difficulty and complexity of assembling internal components of the electronic device. Moreover, the housing of the electronic device does not need to be disassembled into more parts, and thus there are no assembly seams on the surface thereon, and an overall appearance of the electronic device is more aesthetic.

[0009] These and other aspects of the present disclosure will become apparent from the following description of the embodiment taken in conjunction with the following drawings and their captions, although variations and modifications therein may be affected without departing from the spirit and scope of the novel concepts of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The described embodiments may be better understood by reference to the following description and the accompanying drawings, in which:

[0011] FIG. 1 is a schematic perspective view of an electronic device according to the present disclosure;

[0012] FIG. 2 a schematic exploded view of the electronic device according to the present disclosure;

[0013] FIG. 3 is a schematic cross-sectional view taken along line II-II of FIG. 1;

[0014] FIG. 4 is a partial schematic exploded view of an integrated module according to the present disclosure;

[0015] FIG. 5 is a partial schematic enlarged view of a fixed bracket according to the present disclosure;

[0016] FIG. 6 is another partial schematic enlarged view of the fixed bracket according to the present disclosure;

[0017] FIG. 7 is a schematic view of relative positions between an antenna module and a circuit board according to the present disclosure;

[0018] FIG. 8 is a schematic view of a first antenna element of the antenna module according to the present disclosure; and

[0019] FIG. 9 is another schematic view of the first antenna element of the antenna module according to the present disclosure. DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

[0020] The present disclosure is more particularly described in the following examples that are intended as illustrative only since numerous modifications and variations therein will be apparent to those skilled in the art. Like numbers in the drawings indicate like components throughout the views. As used in the description herein and throughout the claims that follow, unless the context clearly dictates otherwise, the meaning of “a,” “an” and “the” includes plural reference, and the meaning of “in” includes “in” and “on.” Titles or subtitles can be used herein for the convenience of a reader, which shall have no influence on the scope of the present disclosure.

[0021] The terms used herein generally have their ordinary meanings in the art. In the case of conflict, the present document, including any definitions given herein, will prevail. The same thing can be expressed in more than one way. Alternative language and synonyms can be used for any term(s) discussed herein, and no special significance is to be placed upon whether a term is elaborated or discussed herein. A recital of one or more synonyms does not exclude the use of other synonyms. The use of examples anywhere in this specification including examples of any terms is illustrative only, and in no way limits the scope and meaning of the present disclosure or of any exemplified term. Likewise, the present disclosure is not limited to various embodiments given herein. Numbering terms such as “first,” “second” or “third” can be used to describe various components, signals or the like, which are for distinguishing one component / signal from another one only, and are not intended to, nor should be construed to impose any substantive limitations on the components, signals or the like. [Embodiment]

[0022] Referring to FIG. I to FIG. 3, FIG. I is a schematic perspective view of an electronic device according to the present disclosure, FIG. 2 a schematic exploded view of the electronic device according to the present disclosure, and FIG. 3 is a schematic cross-sectional view taken along line II-II of FIG. 1. The present disclosure provides an electronic device D, which includes a housing 1 and an integrated module 2. The housing 1 forms a narrow and elongated shape. The housing 1 is a one-piece structure and has an opening 101. The integrated module 2 includes a fixed bracket 21, an integrated module 22, and a circuit board 23. The antenna module 22 and the circuit board 23 are disposed on the fixed bracket 21. The integrated module 2 is inserted into the opening 101 along a first direction SI and disposed inside the housing 1. As shown in FIG. 3, when the integrated module 2 is located in the housing 1, the antenna module 22 is farther away from the opening 101 than the circuit boar d 23. The housing in the related art is designed to be disassembled, but the housing 1 of the present disclosure is a one-piece structure and cannot be disassembled into more parts. Therefore, there are no assembly seams on the surface of the housing 1, thus providing an aesthetic overall appearance.

[0023] The electronic device D further includes a base 3. The base 3 can be a cover, and the base 3 is disposed in the opening 101 and covers the integrated module 2. For example, when the electronic device D is placed on a desktop (not shown in the figures), the base 3 is placed facing downward on the desktop. In addition, the circuit board 23 may be provided with a plurality of electronic components El. The electronic component El can be a chip. However, the type of the electronic component El is not limited in the present disclosure. In addition, when the integrated module 2 is installed inside the housing 1, the antenna module 22 is arranged at a position that is as high as possible relative to other components such as the circuit board 23. For example, when the electronic device D is placed on the desktop, which is made of metal, the antenna module 22 can be placed at a high position further away from the desktop to prevent the radiation efficiency of the antenna from being affected by metal objects (i.e. the desktop). In addition, the signal receiving performance of the antenna can be improved by arranging the antenna module 22 at a relatively high position.

[0024] In existing electronic devices, all parts are installed inside the housing one by one. However, in the electronic device provided by the present disclosure, the components such as the antenna module 22 and the circuit board 23 are assembled into the fixed bracket 21, such that the components inside the electronic device can form a modular structure, and are inserted into the housing through the opening 101, thereby reducing the difficulty and complexity of assembling internal components of the electronic device.

[0025] Reference is made to FIG. 4, which is a partial schematic exploded view of an integrated module according to the present disclosure. The fixed bracket 21 includes an antenna clearance region RI and an accommodating region R2, and the antenna clearance region RI is located on one side of the accommodating region R2. The antenna module 22 is located on the antenna clearance region RI. The circuit board 23 is disposed on the fixed bracket 21 along a second direction S2 and disposed at the accommodating region R2. The first direction SI is different from the second direction S2. For example, the second direction S2 is a negative Y-axis direction (as shown in FIG. 4), and the first direction SI is a positive Z-axis direction (as shown in FIG. 2). Furthermore, the antenna clearance region RI and the accommodating region R2 do not overlap with each other. Therefore, an orthogonal projection of the antenna module 22 projected onto the fixed bracket 21 does not overlap with an orthogonal projection of the circuit board 23 projected onto the fixed bracket 21 along the second direction S2, thereby reducing the effect of the electronic component El of the circuit board 23 on the antenna module 22; that is, the noise interference to the antenna module 22 can be reduced, and the signal receiving performance can be improved.

[0026] As shown in FIG. 4, the integrated module 2 further includes a heat dissipation element 24, and the heat dissipation element 24 is located between the circuit board 23 and the fixed bracket 21. A surface of the heat dissipation element 24 facing the fixed bracket 21 (i.e., the surface facing away from the circuit board 23) is coated with a black printed layer 25 by anodizing or spray painting. The fixed bracket 21 has a plurality of opening holes 210. An orthogonal projection of the black printed layer 25 projected onto the fixed bracket 21 overlaps with the plurality of opening holes 210. Through the design of the black printed layer 25 and the plurality of opening holes 210, the heat radiation efficiency can be strengthened, and the heat dissipation performance can be improved.

[0027] When the integrated module 2 is installed inside the housing 1, the circuit board 23 and an inner surface of the housing 1 have a gap therebetween since the circuit board 23 is disposed on the fixed bracket 21; therefore, the heat generated by the circuit board 23 cannot be dissipated by contacting the housing 1. Through the heat dissipation element 24 with the black printed layer 25 being arranged between the circuit board 23 and the fixed bracket 21, the heat is conducted to one side of the fixed bracket 21 through the plurality of openings 210 by means of thermal radiation.

[0028] Referring to FIGS. 3 and 4, the housing 1 further has a plurality of first heat dissipating holes 102 that are opposite to the opening 101, and the base 3 has a plurality of second heat dissipating holes 30. The plurality of first heat dissipating holes 102 and the plurality of second heat dissipating holes 30 jointly form a heat convection channel. Therefore, the heat generated by the circuit board 23 is conducted to one side of the fixed bracket 21 through the heat dissipation element 24 and the plurality of openings 210 of the fixed bracket 21, and can be further dissipated to the outside of the housing 1 through the thermal convection channel formed by the plurality of first heat dissipation holes 102 and the plurality of second heat dissipation holes 30 respectively located on the upper and lower sides of the circuit board 23.

[0029] Referring to FIG. 5 and FIG. 6, FIG. 5 and FIG. 6 are different partial schematic enlarged views of a fixed bracket according to the present disclosure. The fixed bracket 21 includes a plurality of holders 211 in the antenna accommodating region RI, respectively corresponding to the plurality of antenna elements in the antenna module 22. A quantity of the antenna elements is not limited in the present disclosure. In the embodiment of the present disclosure, the antenna module includes a first antenna element 221, a second antenna element 222, a third antenna element 223, and a fourth antenna element 224 that are disposed on the plurality of holders 211. Each of the holders 211 includes at least one cantilevered buckle structure 212 and a first foolproof structure 213.

[0030] As shown in FIG. 5, the first antenna element 221, the second antenna element 222, the third antenna element 223, and the fourth antenna element 224 are arranged in a sequence along the positive X-axis direction. One of the holders 211 for fixing the first antenna element 221 includes two cantilevered buckle structures 212 and a first foolproof structure 213. When the first antenna element 221 is fastened to the holder 211 along a positive Y-axis direction, the two cantilevered buckle structures 212 are clamped on the left and right sides 221L and 221R of the first antenna element 221, respectively.

[0031] Moreover, each of the first antenna element 221, the second antenna element 222, the third antenna element 223, and the fourth antenna element 224 includes a second foolproof structure 225 corresponding to the first foolproof structure 213. For example, the first foolproof structure 213 is a convex structure, and the second foolproof structure 225 is a concave structure. When the first antenna element 221 is fastened to the holder 211, the first foolproof structure 213 on the holder 211 is snapped into the second foolproof structure 225 of the first antenna element 221. Similarly, the second antenna element 222, the third antenna element 223, the fourth antenna element 224, and the holders 211 for fixing the second antenna element 222 to the fourth antenna element 224 all include the same structure as the first antenna element 221 and the holder 211 for fixing the first antenna element 221, and the similarities will not be reiterated herein.

[0032] As shown in FIG. 5, other holders 211 for fixing the second antenna element 222 and the third antenna element 223 each further includes at least one sliding groove structure 214. Each of the second antenna element 222 and the third antenna element 223 is inserted into the at least one sliding groove structure 214 along the positive Y-axis direction and fixed to the holder 211 through the at least one cantilevered buckle structure 212 and the first foolproof structure 213.

[0033] As shown in FIG. 6, each of the first antenna element 221, the second antenna element 222, the third antenna element 223, and the fourth antenna element 224 can be electrically connected to the circuit board 23 through two conductive wires W. The conductive wires W can be fixed by being clamped in a plurality of wire trays 226 while extending to the circuit board 23, so as to achieve the function of organization and storage, and to prevent the conductive wires W from being strewn or intertwined with each other, or being squeezed and damaged by other components.

[0034] In the present disclosure, the first antenna element 221, the second antenna element 222, the third antenna element 223, and the fourth antenna element 224 are all orthogonally polarized dipole antennas. For example, the first antenna element 221 and the second antenna element 222 are dual frequency antennas, which can be excited to generate operating frequency bands covering 2.4 GHz and 5 GHz. The third antenna element 223 and the fourth antenna element 224 are single frequency antennas, which can be excited to generate operating frequency bands covering 6 GHz.

[0035] Each of the antenna elements includes a substrate and two dipole antennas. Referring to FIG. 8 and FIG. 9, FIG. 8 and FIG. 9 are schematic views of a first antenna element of the antenna module according to the present disclosure. The first antenna element 221 is taken as an example for illustration. The first antenna element 221 includes a first substrate 2210, and a first dipole antenna 2211 and a second dipole antenna 2212 that are flatly attached to upper and lower sides of the first substrate 2210, respectively. It should be noted that the first dipole antenna 2211 and the second dipole antenna 2212 in FIGS. 8 and 9 are only used to illustrate relative positions rather than specific shapes. As shown in FIG. 8, the first dipole antenna 2211 includes a feeding portion 2211A (a portion with a positive sign "+" in FIG. 8) and a grounding portion 221 IB (a portion with a negative sign in FIG. 8) that are separated from each other. Similarly, the second dipole antenna 2212 includes a feeding portion 2212A (a portion with a positive symbol “+” in FIG. 8) and a grounding portion 2212B (a portion with a negative symbol in FIG. 8) that are separated from each other. The first dipole antenna 2211 and the second dipole antenna 2212 are arranged orthogonally, that is, projection areas of the first dipole antenna 2211 and the second dipole antenna 2212 projected onto a same plane are perpendicular to each other. As shown in FIGS. 6, 8 and 9, when the first antenna element 221 is disposed on the holder 211 of the fixed bracket 21, one end of the wire W is connected to the first dipole antenna 2211 and another end of the wire W is connected to the circuit board 23. One end of another wire W is connected to the second dipole antenna 2212 and another end of the other wire W is connected to the circuit board 23. Similarly, the second antenna element 222, the third antenna element 223 and the fourth antenna element 224 also have the same structure as the first antenna element 221, and the similarities there-between will not be reiterated herein.

[0036] Reference is made to FIG. 7, which is a schematic view of relative positions between an antenna module and a circuit board according to the present disclosure. The arrangement of the first antenna element 221, the second antenna element 222, the third antenna element 223, and the fourth antenna element 224 can be clearly illustrated through the relationship of the relative positions between the antenna module 22 and the circuit board 23. The first substrate 2210 of the first antenna element 221 is perpendicular to the second substrate 2220 of the second antenna element 222, and the third substrate 2230 of the third antenna element 223 is perpendicular to the fourth substrate 2240 of the fourth antenna element 224. Since the dipole antenna of each of the antenna elements is flatly attached to the respective substrate thereof, the arrangement of the substrates represents the arrangement of the dipole antennas. In other words, the first antenna element 221 and the second antenna element 222 are perpendicular to each other, and the third antenna element 223 and the fourth antenna element 224 are perpendicular to each other. Through the way that the antenna elements are placed, the isolation between two dual frequency antennas and between two single frequency antennas can be further improved.

[0037] The circuit board 23 has a first surface 231 and a second surface 232 that are opposite to each other. The first surface 231 is used to accommodate at least one electronic component El and a USB interface E2. The first antenna element 221 and the fourth antenna element 224 are parallel to the second surface 232, and the second antenna element 222 and the third antenna element 223 are perpendicular to the second surface 232. If the X-axis direction and the Y-axis direction in FIG. 7 represent a horizontal direction and a vertical direction respectively, the first antenna element 221 and the fourth antenna element 224 are placed horizontally, and the second antenna element 222 and the third antenna element 223 are placed vertically. The dual frequency antennas (i.e., the first antenna element 221 and the second antenna element 222) are taken as an example for illustration. The first dipole antenna 2211 and the second dipole antenna 2212 of the first antenna element 221 can respectively generate orthogonally polarized radiation patterns. Through the configuration of the first dipole antenna 2211 and the second dipole antenna 2212 being arranged orthogonally to each other, the two orthogonally polarized radiation patterns can complement the weak fields (i.e., a weak part in the radiation power) of each other. Similarly, the two radiation patterns in the vertical direction generated by the two dipole antennas of the second antenna element 222 can also complement the weak fields of each other.

[0038] In the X-axis direction, two dual frequency antennas (i.e., the first antenna element 221 and the second antenna element 222) are respectively arranged at the front-most and rear-most sides of the electronic device. Referring to FIG. 2, the rear-most side is a side where the USB interface E2 is located. Therefore, the isolation between the first antenna element 221 and the second antenna element 222 can be improved. In addition, the two single frequency antennas (i.e., the third antenna element 223 and the fourth antenna element 224) can generate high frequencies, so the two single frequency antennas can be arranged between the two dual frequency antennas while maintaining the isolation therebetween.

[0039] Furthermore, one of the dual frequency antennas (i.e., the first antenna element 221) and one of the single frequency antennas (the fourth antenna element 224) that are arranged parallel to the circuit board 23 are located on one side close to the back (i.e., the second surface 232) of the circuit board 23. As shown in FIG. 4, the first antenna element 221 and the fourth antenna element 224 are located on one side of the circuit board 23 facing the heat dissipation element 24.

[0040] Since the electronic component El is disposed at the front side (i.e., the first surface 231) of the circuit board 23 in FIG. 2, the antenna elements are easily interfered with by the electronic component El if they are near the front of the circuit board 23. Therefore, the first antenna element 221 and the fourth antenna element 224 can be disposed at the back of the circuit board 23 to be away from the electronic component El on the front of the circuit board 23, thereby reducing the noise interference and improving the signal receiving performance of the antenna module 22. [Beneficial Effects of the Embodiments]

[0041] In the electronic device D provided by the present disclosure, components such as the antenna module 22, the circuit board 23, and the heat dissipation element 24 are assembled into the fixed bracket 21, such that the components inside the electronic device D can form a modular structure, and are inserted into the housing 1 through the opening 101, thereby reducing the difficulty and complexity of assembling internal components of the electronic device D. Moreover, the housing 1 of the electronic device D does not need to be disassembled into more parts, and thus there are no assembly seams on the surface thereon, and the overall appearance of the electronic device is more aesthetic.

[0042] In addition, when the integrated module 2 is installed inside the housing 1, the antenna module 22 is arranged at a position that is as high as possible relative to other components such as the circuit board 23, such that the radiation efficiency of the antenna can be prevented from being affected by metal objects (i.e. the desktop). The signal receiving performance of the antenna can be improved by arranging the antenna module 22 at a relatively high position. Moreover, an orthogonal projection of the antenna module 22 projected onto the fixed bracket 21 does not overlap with an orthogonal projection of the circuit board 23 projected onto the fixed bracket 21 along the second direction S2, thereby reducing the effect of the electi onic component E1 of the circuit board 23 on the antenna module 22; that is, the noise interference to the antenna module 22 can be reduced, and the signal receiving performance can be improved.

[0043] The foregoing description of the exemplary embodiments of the disclosure has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching.

[0044] The embodiments were chosen and described in order to explain the principles of the disclosure and their practical application so as to enable others skilled in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those skilled in the art to which the present disclosure pertains without departing from its spirit and scope.

Claims

What is claimed is:

1. An electronic device (D), comprising:a housing (1) having an opening (101); andan integrated module (2) inserted into the opening (101) along a first direction (SI) and disposed inside the housing (101), wherein the integrated module (2) includes:a fixed bracket (21) including an antenna clearance region (RI) and an accommodating region (R2), the antenna clearance region (RI) being located on one side of the accommodating region (R2);an antenna module (22) disposed on the fixed bracket (21) and located on the antenna clearance region (RI); anda circuit board (23) disposed on the fixed bracket (21) along a second direction (S2) and disposed at the accommodating region (R2), wherein the second direction (S2) is different from the first direction (SI).

2. The electronic device (D) according to claim 1, wherein an orthogonal projection of the antenna module (22) projected onto the fixed bracket (21) does not overlap with an orthogonal projection of the circuit board (23) projected onto the fixed bracket (21).

3. The electronic device (D) according to claim 1, wherein the antenna module (22) is farther away from the opening (101) than the circuit board (23).

4. The electronic device (D) according to claim 1, wherein the antenna module(22) includes a first antenna element (221) and a second antenna element (222), the first antenna element (221) includes a first substrate (2210), the second antenna element (222) includes a second substrate (2220), and the first substrate (2210) is perpendicular to the second substrate (2220).

5. The electronic device (D) according to claim 4, wherein each of the first antenna element (221) and the second antenna element (222) is a dual frequency antenna.

6. The electronic device (D) according to claim 4, wherein the antenna module (22) further includes a third antenna element (223) and a fourth antenna element (224), the third antenna element (223) and the fourth antenna element (224) are located between the first antenna element (221) and the second antenna element (222), the third antenna element (223) includes a third substrate (2230), the fourth antenna element (224) includes a fourth substrate (2240), and the third substrate (2230) is perpendicular to the fourth substrate (2240).

7. The electronic device (D) according to claim 6, wherein each of the third antenna element (223) and the fourth antenna element (224) is a single frequency antenna.

8. The electronic device (D) according to claim 6, wherein the circuit board (23) has a first surface (231) and a second surface (232) that are opposite to each other, the first surface (231) is used for accommodating at least one electronic component (El), and the first antenna element (221) and the fourth antenna element (224) are parallel to the second surface (232).

9. The electronic device (D) according to claim 4, wherein the fixed bracket (21) includes a holder (211) in the antenna accommodating region (RI), the first antenna element (221) is disposed on the holder (211), the holder (211) includes at least one cantilevered buckle structure (212) and a first foolproof structure (213), the at least one cantilevered buckle structure (212) engages at least one side of the first antenna element (221), the first antenna element (221) includes a second foolproof structure (225), and the second foolproof structure (225) engages the first foolproof structure (213).

10. The electronic device (D) according to claim 9, wherein the fixed bracket (21) includes another holder (211) in the antenna accommodating region (RI), the another holder (211) includes at least one sliding groove structure (214), and the second antenna element (222) is inserted into the at least one sliding groove structure (214).

11. The electronic device (D) according to claim 6, wherein the integrated module (2) further includes a heat dissipation element (24), the heat dissipation element (24) is disposed on the fixed bracket (21), and the heat dissipation element (24) is located between the circuit board (23) and the fixed bracket (21).

12. The electronic device (D) according to claim 11, wherein the first antenna element (221) and the fourth antenna element (224) are located on one side of the circuit board (23) facing the heat dissipation element (24).

13. The electronic device (D) according to claim 11, wherein a surface of the heatdissipation element (24) facing the fixed bracket (21) is coated with a black printed layer (25).

14. The electronic device (D) according to claim 13, wherein the fixed bracket (21) has a plurality of opening holes (210), and an orthogonal projection of the black printed layer (25) projected onto the fixed bracket (21) overlaps with the plurality of opening holes (210).

15. The electronic device (D) according to claim 1, further including a base (3) disposed in the opening (101) of the housing (1), wherein the housing (1) further has a plurality of first heat dissipating holes (102) that are opposite to the opening (101), the base (3) has a plurality of second heat dissipating holes (30), and the plurality of first heat dissipating holes (102) and the plurality of second heat dissipating holes (30) jointly form a heat convection channel.Application No: GB2415861.0Examiner: Mr Matthew CharltonClaims searched: AllDate of search: 1 April 2025Patents Act 1977: Search Report under Section 17Documents considered to be relevant:Category Relevant to claims Identity of document and passage or figure of particular relevance X 1-7 US2016 / 0064807 Al (REED) see fig 4, paragraph 36, 38, 58 X 1-4 US6239765 Bl (JOHNSON) see fig 1 X 1-3 JP2004064211A (FUJITSU LTD) see fig 1-2 v A 1-3 US2022 / 0283613 Al (HUNG) see fig 2 and paragraph 29-30 X 1 KR102008258 Bl (HYUNDAI AUTRON CO LTD) see fig 2 &4, paragraph 28Categories:X Document indicating lack of novelty or inventive step A Document indicating technological background and / or state of the art. Y Document indicating lack of inventive step if p Document published on or after the declared priority date but combined with one or more other documents of same category. before the filing date of this invention. & Member of the same patent family E Patent document published on or after, but with priority date earlier than, the filing date of this application.Field of Search:Search of GB, EP. WO &US patent documents classified in the following areas of the UKCX :Worldwide search of patent documents classified in the following areas of the IPC____________G06F; HO IL; HO IQ; H01R; H05K__________________________________The following online and other databases have been used in the preparation of this search reportSEARCH-PATENTInternational Classification:Subclass Subgroup Valid From H01Q 0001 / 22 01 / 01 / 2006 H01Q 0001 / 42 01 / 01 / 2006 H05K 0005 / 02 01 / 01 / 2006 H05K 0007 / 14 01 / 01 / 2006 H05K 0007 / 12 01 / 01 / 2006 H05K 0007 / 20 01 / 01 / 2006

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