Dual-contact chipcard module and chipcard with a dual-contact chipcard module

Abstract

A dual contact chipcard module comprises an RFID transmission antenna coil having conductive traces 60, and an ISO contact set 81 having ISO contact terminals 70. The module further comprises a module

Description

DE19632115C1 discloses a combination chip module for the transmission of electrical signals or data with or without contact to an external read-write station, with an insulated substrate on which an integrated semiconductor circuit is arranged. The circuits connected via connecting terminals to one or more couplers of an interface circuit. This interface circuit enables contactless bidirectional data communication between the chip module and the external read-write station. Additionally, the circuits are connected to electrically conducting contact surfaces provided on one side of the substrate, enabling bidirectional data communication with contact between the chip module and the external read-write station. The couplers are formed on the side of the substrate facing the contact surfaces. This application addresses the problem of improving the manufacturing process and functionality of dual-contact chipcard modules. This and other objects are solved by the subject matter of the independent claims. Further improvements are given by the dependent claims. The application provides solutions for enhancing the electrical connectivity and structural integrity of the module by incorporating conductive antenna traces, ISO contact pads, and a conductive material in the via hole. Additionally, the application addresses the need for encapsulation material to protect the chip and bond wires, ensuring reliable performance of the module. Embodiments of the invention are associated with various advantages and / or technical effects. The method of manufacturing a dual-contact chipcard module with an RFID transmission antenna coil involves several steps. This module comprises a number of conductive antenna traces and ISO contact pads. The process includes the following First, a module substrate with an antenna side and a contact side is provided. Next, a bonding side conductive foil layer is provided and attached to the bonding side of an insulating substrate layer. This attachment may optionally involve laminating the foil layer, and an adhesive may be used during this process. Following this, a pre-determined pattern of conductive traces and contact pads is created in the bonding side conductive foil layer. This pattern may optionally be etched into the foil layer. A via hole is then created in the bonding side conductive foil layer and the insulating substrate layer. This step may optionally involve creating one or more via holes. Afterward, a contact side conductive foil layer is provided and attached to the contact side of the insulating substrate layer. This step may optionally include laminating the foil layer using adhesive. The next step involves etching a pre-determined pattern of conductive traces and contact pads into the contact side conductive foil layer. This etching process may optionally remove parts of the bonding side conductive foil layer and the adhesive beneath those parts. Additionally, this step may involve etching six or eight ISO contact pads into the contact side copper foil layer. Optionally, a Ni / Au plating may be applied onto both the contact side conductive foil layer and the bonding side conductive foil layer. Conductive material is then provided in the via hole to electrically connect a section of the conductive traces with a section of the contact side conductive foil layer. Further steps in the method include mounting a chip on the antenna side of the module substrate, which may optionally involve the use of adhesive. A first pre-determined contact pad of the chip, which may optionally be referred to as a first antenna chip pad, is connected with an antenna contact pad surface area, optionally referred to as a second antenna contact pad, on the bonding side conductive foil layer by providing a first antenna bonding wire. A second pre-determined contact pad of the chip, which may optionally be referred to as a second antenna chip pad, is connected with a bonding side surface of the ISO contact pads by providing a bond wire through the bonding hole. This step may optionally involve connecting the second antenna chip pad with a contact pad area on the contact side conductive foil layer by providing a second bond wire. The method ultimately provides a dual-contact chipcard module in which the conductive material in the via hole electrically connects a section of the conductive traces with one of the ISO standard contact pads C6, C4, or C8. Additionally, the first pre-determined contact pad of the chip, optionally referred to as a first antenna chip pad, is connected with a bonding side surface of the same ISO standard contact pads C6, C4, or C8. The dual-contact chipcard module includes an RFID transmission antenna coil that comprises a number of conductive antenna traces and an ISO contact set with several ISO contact pads. The module comprises the following elements A module substrate is provided, which has an antenna side and a contact side. A bonding side conductive foil layer is attached to the bonding side of an insulating substrate layer. Optionally, adhesive may be placed between these layers. Conductive traces and contact pads are provided within the bonding side conductive foil layer. A via hole is created in both the bonding side conductive foil layer and the insulating substrate layer. This may optionally include one or more via holes. A contact side conductive foil layer is attached to the contact side of the insulating substrate layer. Optionally, adhesive may be placed between these layers. Conductive traces and contact pads are then provided within the contact side conductive foil layer. The etching process may optionally remove parts of the bonding side conductive foil layer and the adhesive beneath those parts. Additionally, a Ni / Au plating may optionally be applied to both the contact side conductive foil layer and the bonding side conductive foil layer. Conductive material is placed within the via hole to electrically connect a section of the conductive traces to a section of the contact side conductive foil layer. The module may further include a chip placed on the antenna side of the module substrate, with adhesive optionally placed between them. A first pre-determined contact pad of the chip, which may optionally be referred to as a first antenna chip pad, is connected to an antenna contact pad surface area, optionally referred to as a second antenna contact pad, on the bonding side conductive foil layer by a first antenna bonding wire. A second pre-determined contact pad of the chip, which may optionally be referred to as a second antenna chip pad, is connected to a bonding side surface of the ISO contact pads by a bond wire within the bonding hole. Optionally, this bond wire may electrically connect the second antenna chip pad to a contact pad area on the contact side conductive foil layer. The conductive material in the via hole ensures an electrical connection between a section of the conductive traces and one of the ISO standard contact pads C6, C4, or C8. Furthermore, the second pre-determined contact pad of the chip, which may optionally be referred to as a second antenna chip pad, is connected to a bonding side surface of the same ISO standard contact pads C6, C4, or C8. In a development, the method further provides a number of conductive antenna traces and with a number of ISO contact pads. The inclusion of conductive antenna traces and ISO contact pads enhances the functionality of the chipcard module by enabling dual-interface capabilities, allowing for both contact and contactless communication. The method offers the advantage of improved bonding strength by utilizing a conductive material, such as conductive glue, which is cured after filling the via hole. The manufacturing process of the dual-contact chipcard module provides increased protection and durability through the encapsulation step, which covers the chip and bond wires with encapsulation material. The module offers the advantage of efficient electrical connection between conductive traces and ISO standard contact pads through the use of a conductive material in the via hole. The invention provides a simplified and reliable connection of the second pre-determined contact pad of the chip to the bonding side surface of the ISO standard contact pads. By using one of those unused ISO contacts 06, 04, or 08 for providing an electric loop between pre-determined antenna chip pads, a simple and durable loop antenna can be provided. In a development, the method further comprises a conductive material in one of the via holes, comprising conductive glue, and there is a step of curing the conductive glue after filling the via hole. Utilizing conductive glue as the conductive material for via hole filling provides a cost-effective solution compared to traditional metal plating or soldering techniques, potentially reducing manufacturing costs. The curing step of the conductive glue ensures a robust and durable electrical connection within the via hole, enhancing the mechanical stability and longevity of the chipcard module. In a method of manufacturing a dual-contact chipcard module with an encapsulating step of providing encapsulation material over the chip and the bond wires at the antenna side of the module substrate, the encapsulation of the chip and bond wires on the antenna side of the module substrate protects the delicate components from environmental factors such as moisture and dust, thereby improving the durability and reliability of the module. Encapsulation can also provide mechanical support to the bond wires and chip, reducing the risk of damage due to physical stress or handling, which is critical for maintaining the integrity of the electrical connections. In a development, the module further comprises a conductive material in the via hole electrically connecting a section of the conductive traces and one of the ISO standard contact pads C6, C4 or C8, and wherein the second pre-determined contact pad of the chip is connected above a bonding side surface of the same ISO standard contact pads 06, 04 or 08. The conductive material in the via hole creates a direct electrical connection between the conductive traces and specific ISO standard contact pads, which can simplify the module design by reducing the number of required interconnects. By connecting the second pre-determined contact pad of the chip above the bonding side surface of the same ISO standard contact pads, the design allows for a more compact module layout, potentially enabling the creation of thinner chipcard modules. In the present invention, the term “number of conductive antenna traces” refers to a plurality of conductive antenna traces and the term “a number of ISO contact pads” refers to a plurality of ISO contact pads. The term “conductive material comprising conductive glue” refers to a material which is capable of providing an electrically conductive connection. The term “dual-contact chipcard module” refers to a card module that provides a contactless data connection and a contact pads data connection. The term “encapsulating step” refers to a step of providing encapsulation material over the chip and the bond wires at the antenna side of the module substrate. The term “bond wires” is used herein to refer to electrically conductive wires that are connected at the antenna side of the module substrate. The term "antenna side" is used herein to refer to the side of the module that directly receives signals from an external RFID transmission antenna, which is usually but not always the same side as the "bonding side" of the module substrate. The term "contact side" is used herein to refer to a side of the module substrate that carries the ISO contact pads of the module. A "LA first antenna chip pad" designates a first pre-determined contact pad of the chip, which is usually connected with the antenna contact pad surface area above the bonding side conductive foil layer by providing a first antenna bonding wire. The label “LA” can be seen in Fig. 1. A "LB second antenna chip pad" designates a pad of the chip which is connected to the antenna coil, via the ISO contact pad and the conductive material in the via hole. The label “LB” can be seen in Fig. 1. An "insulating substrate layer" designates a layer of insulating material which is used to provide a substrate for the module. An "adhesive" designates a material that is used to bond two surfaces together. The term "bonding side conductive foil layer" is used herein to refer to a layer that is provided at the bonding side of the module. A "Ni layer" designates a layer of nickel. An "Au layer" designates a layer of gold,. A "contact side Cu layer" or "contact side conductive foil layer" designates a conductive foil layer that is provided at the contact side of the module. A "bonding hole" designates a hole in the bonding side conductive foil layer and the insulating substrate layer. The term "via hole" refers to a hole in the bonding side conductive foil layer and the insulating substrate layer that allows to connect a section of the conductive traces and the contact side conductive foil layer by filling the via hole with conductive material. A "conductive paste" designates conductive material, such as conductive glue. The term "conductive material" is used herein to refer to a material which can be electrically conductive. The term "chip" is used herein to refer both to a single chip and to a plurality of chips. A "first antenna bonding wire" designates a wire that is used to connect a first predetermined contact pad of the chip with an antenna contact pad surface area at the bonding side of the binding side conductive foil layer. A "second antenna bonding wire" designates a wire that is used to connect a second pre-determined contact pad of the chip with the upper side or bonding side surface of one of the ISO contact pads C4, C6, or C8. A "first antenna chip pad" and a "second antenna chip pad" designate those contact pads of the chip that provide a wireless data connection via a loop antenna that is connected to these chip pads- A "first antenna end" designates the end of the antenna coil that is connected to the first pre-determined contact pad of the chip and a "second antenna contact pad" designates the contact pads C6, C4 or C8 that is connected to the second predetermined contact pad of the chip. An "upper via end" designates the end of the via hole that is located above the bonding side surface of the ISO standard contact pads C6, C4 or C8. A "bridge" designates a section or an area that electrically connects a "lower bridge bonding contact area", an area of one of the ISO standard contact pads 06, 04 or C8 where the second bonding wire is provided, and the area of that same ISO standard contact pads C6, C4 or C8 near the lower via end, where the conductive material is provided. The term "conductive traces" is used herein to refer to the antenna traces and also to the contact pads, while the term "conductive antenna traces" is used herein to refer to conductive traces that form the module antenna at the bonding side of the module. An "ISO contact pad" designates contact pads according to the ISO 7816 standard. The term "encapsulation material" is used herein to refer to a material that can be provided over the chip and the bond wires at the antenna side of the module substrate. One example is Glob tops that are usually epoxies that are dispensed to cover a chip, for example in chip-on-board (COB) applications. Fig. 1 shows that on the contact side of the insulating substrate, a contact side Cu foil layer is laminated using adhesive. Similar to the bonding side, a pre-determined pattern of conductive traces and contact pads is etched into the contact side Cu foil layer. The outlines of the contact pads are provided with thin lines in Fig. 2, although they cannot be seen from the top side of the chipcard module because they are hidden behind the other components and elements of the chipcard module. Whenever the application mentions a conductive foil, this may be provided in the form of a Cu (Copper) foil or an Ag (Silver) foil or an Al (Aluminum) foil. In the following, the term “Cu foil” is used to explain this by way of using one possible synonym of matrials that can be used interchangeably. The outer surfaces of both the contact side Cu foil layer and the bonding side Cu foil layer are plated with Ni / Au. The figures further depict the chip on the antenna side of the module substrate, using adhesive. The chip contact pads are connected to the contact side surfaces of the ISO contact pads through bond wires passing through the via holes, as can be seen in Fig. 2. Additionally, a first antenna chip pad is connected to an antenna contact pad 51 the bonding side Cu foil layer using a bond wire, while a second antenna chip pad is connected to an antenna contact pad surface on the contact side Cu foil layer, by way of a bond wire passing through the via hole, thereby forming a bridge for a loop antenna- The closed-loop antenna of the device in Fig. 1 and 2 comprises a first antenna chip pad LA, a first bonding wire 40, antenna conductive traces going counterclock-wise in circular direction, a first antenna end pad, an upper via end, a conductive paste, a lower via end, a bridge, a lower bridge bonding contact area, a second antenna bonding wire, and a second antenna chip pad LB. Fig. 2 shows a top view of the chipcard module of Fig. 1. As one can see in Fig. 2, a pre-determined pattern of conductive traces forming the closed-loop antenna and contact pads 51 for contacting one end of the antenna loop is etched into the bonding side Cu foil layer. The figure also shows the presence of one via hole and six bonding holes in the bonding side Cu foil layer, the insulating substrate, and the adhesive. The via hole is filled with conductive material. Figures 1 and 2 illustrate the result of the following measures: - Laminating a bonding side Cu foil layer to the bonding side of an insulating substrate layer, using an adhesive, - Etching a pre-determined pattern of conductive antenna traces, a first antenna end and a second antenna contact pad into the bonding side Cu foil layer, - Providing at least one via hole and a bonding hole in the bonding side Cu foil layer, insulating substrate 10, and adhesive, - Laminating a contact side Cu foil layer to the contact side of the insulating substrate, using adhesive, - etching six or 8 ISO contact pads into contact side Cu foil layer, - Providing a Ni / Au plating onto the contact side Cu foil layer and the bonding side Cu foil layer, - Filling the via hole with conductive material, thereby contacting the first antenna end with a first section of the contact side surface of the contact side Cu foil layer, and especially with one of the ISO contact pads, - Mounting a chip onto the antenna side of the module substrate, using an adhesive, - Contacting a first pre-determined chip contact pad with a second section of the contact side surface of the contact side Cu foil layer, and especially with the same one of the ISO contact pads, by providing a bond wire through the bonding hole, - Connecting a pre-determined chip contact pad with a first antenna contact pad on the bonding side Cu foil layer, by providing a bond wire, - Connecting a second antenna chip contact pad with an antenna contact pad surface on the contact side Cu foil layer by providing a bond wire into the via hole, - contacting one or more chip contact pads with further sections of the contact side surface of the contact side Cu foil layer, and especially with one of the ISO contact pads, by providing bond wires into further via holes. The above order of the measures does not necessarily mean that this is a preferred order of steps, other sequences also work. Providing a Ni / Au plating and / or adhesive is optional, other methods can be applied to achieve the same function. While Fig. 2 shows a bridge area in the ISO contact pad C6 that is structured with gaps between conductive traces, the Fig. 3 shows the same ISO contact pad C6 without that structure, providing the same bridge function. Fig. 4 shows an example of the external connecting terminals of the card chip. The eight external connecting terminals shown in Fig. 4 conform to ISO / IEC7816-2. ISO / IEC 7816-2 pinout: Pin # Name Description Pin #1 VCC +5 V or 3.3 V DC Pin #2 Reset Card Reset (Optional) Pin #3 CLOCK Card Clock Pin #4 AS Application Specific Pin #5 GND Ground Pin #6 VPP +21 V DC [Programming], or NC Pin #7 I / O In / out [Data] Pin #8 AS Application Specific While the figures 1 to 7 do not show an encapsulating step that follows in a further step, the encapsulation material covering the bond wires with the corresponding via holes, and the chip is seen in Fig. 8. In the coordinate system in the figures, “y” is pointing into the card, the “x” represents the feather of the arrow. The dot represents the point of the arrow. The “x” is often the longer side directed from the Ground pad to the rest of the contact set. The “z” is directed from the Ground pad to outside of the set. For locating the Ground pad, this one is often provided integral with the center pad or contacted with it, and it is often as large as possible. After one turns the contact set such that one looks on the face of it and such that it is on the top right of the contact set, then the contact pad C6 is the one immediately under the Ground contact pad. Providing one or more via holes and one or more, preferably five bonding holes in the bonding side conductive foil layer, in the insulating substrate, and in the adhesive can be provided by punching through from the contact side to the bonding side. Conductive material can be provided in the form of conductive paste, solder, Ag, carbon, etc., for example by using a dispensing system from the bonding side. The present disclosure is illustrated by way of example and not limited in the accompanying figures in which like reference numerals indicate similar elements. Embodiments of the application will now be described with reference to the attached drawings Figure 1 shows a cross-section through a chipcard module according to the application, Figure 2 shows a top view of the chipcard module of Fig. 1, Figure 3 shows a top view of a further chipcard module according to the disclosure, and; Figure 4 shows external connecting terminals of a further chipcard module according to the disclosure, Figure 5 shows external connecting terminals of a further chipcard module according to the disclosure, Figure 6 shows external connecting terminals of a further chipcard module according to the disclosure, Figure 7 shows external connecting terminals of a further chipcard module according to the disclosure, Figure 8 shows external connecting terminals of a further chipcard module according to the disclosure, Figure 9 shows external connecting terminals of a further chipcard module according to the disclosure, Figure 10 shows 16 examples of external connecting terminals of further chipcard modules according to the disclosure. Fig. 1 shows a cross-section through a chipcard module according to the application. The depicted Fig. 1 is a detailed cross-sectional view of a dual-contact chipcard module, where one can see the arrangement and connection of the different components. At the bottom, there is a module substrate 1 characterized by an antenna side 2 and a contact side 4, visible on the right and left sides of the image, respectively. The figure is oriented by coordinate axes, where the z-axis points out of the page, the y-axis points upwards, and the X-axis extends horizontally to the right, indicating the depth and layering of the module. The module substrate 1 comprises an insulating substrate layer 10 sandwiched between two conductive foil layers the bonding side conductive foil layer 12. Above the insulating substrate layer 10, there is provided an adhesive 11 layers that attaches the conductive foil layer 12 to the insulating substrate 10. The figure 1 shows out a via hole 21 filled with conductive material 25, creating an electrical connection between the conductive traces 60 on the bonding side 3 and the contact side conductive foil layer 15. The chip 31, located at the antenna side 2 of the module substrate 1, is attached by a chip adhesive 30. Two bonding wires are shown, the first antenna bonding wire 40 extends upwards from the first antenna chip pad 42, while the second antenna bonding wire 41 is is provided at the second antenna chip pad 43, creating electrical connections from the chip 31 to their respective contact pads. At the contact side 4, there are provided ISO contact pads 70 which are connected to the internal circuitry and would interface with an external reader or device that is not shown here. An encapsulation material 80, which would cover the chip 31 and bond wires, is there but it is not illustrated in Fig. 1. Furthermore, the RFID antenna and its connections are not explicitly shown in Fig. 1 but they are part of the conductive traces 60 at the antenna side 2. Elements such as the first antenna end 50, second antenna end 51, upper via end 55, lower via end 56, bridge 57, and lower bridge bonding contact area 58 are also labeled, helping to understand the assembly and routing of electrical connectivity within the chipcard module. The first antenna end 50 is the terminal end of the antenna coil located on the bonding side conductive foil layer 12. This end connects to the first predetermined contact pad of the chip 31 through the antenna structure and through the first antenna bonding wire 40. The connection provided by the first antenna end 50 enables the transmission of signals within the module by linking the antenna and the chip. The second antenna end 51 is another terminal end of the antenna coil, which connects to the second pre-determined contact pad 43 of the chip 31, through the antenna structure and through the second antenna bonding wire 41 which passes through the bonding hole 20. The second antenna end 51 completes the antenna loop, facilitating RFID transmission. The upper via end 55 is located at the upper end of the via hole 21, where the conductive material 25 begins to fill the hole. This end is situated above the bonding side surface of the ISO standard contact pads 70 and serves as the entry point for the conductive material, which forms an electrical connection between the bonding side conductive foil layer 12 and the contact side conductive foil layer 15. The lower via end 56 is found at the lower end of the via hole 21, where the conductive material 25 forms an electrical connection with the contact side conductive foil layer 15. The lower via end 56 provides electrical connectivity from the bonding side 3 to the contact side 4 through the via hole 21. The bridge 57 is a section that creates an electrical connection between the lower bridge bonding contact area 58 and another area on the same ISO standard contact pad 70. The bridge 57 plays a role in conducting electrical signals between the first antenna chip pad 42 and the second antenna chip pad 43 of the chip 31, supporting the operation of the antenna. The lower bridge bonding contact area 58 is a contact point on the ISO standard contact pad 70 that provides the bridge 57, contributing to the proper functioning of the antenna and the chip 31. Fig. 2 shows a top view of the chipcard module of Fig. 1 that depicts the bottom view of a chipcard module 1. As one can see here, the antenna side 2 or bonding side 3 of the module 1 comprises various conductive antenna traces 60 forming part of an RFID antenna coil around the module substrate 1. The chip 31 is centrally mounted on the module with bonding wires 40 and 41 connecting to one antenna contact pad 51 and one ISO contact pad 70. The antenna side 2 comprises a primary antenna end 50 and a secondary end 51, both of which are connected to individual contact pads on the chip 31. The via hole 21, filled with conductive material 25, provides electrical connectivity between the bonding side conductive foil layer 12 and the contact side conductive foil layer 15 through the insulating substrate layer 10. This via hole 21 links the conductive antenna traces 60 to a specific ISO standard contact pad C4. Additionally, there is a bonding hole 20, which is used for connecting the bonding wire 40 to that ISO contact pad C4. The other ISO contact pads 70 themselves are labeled according to their standard designations, such as C1 / VCC, C2 / RST, C3 / CLK, C5 / GND, and C7 / IO. The conductive traces 60 are laid out to form the RFID antenna, and both the traces 60 and contact pads 70 are integral to the dual-contact functionality of the chipcard module 1. Fig. 3 shows a top view of a further chipcard module according to the disclosure. The chipcard module of Fig. 3 is in large parts identical to the chipcard module of Fig. 2, except for the shape of the Pin #6 ISO contact pad VPP / NC / Not Connected 76. Fig. 1 shows the cross-section view of the line A-A in Fig. 3. The module substrate 1, which is the base of the chipcard module, is visible from the antenna side 2. Conductive antenna traces 60 form an RFID transmission loop antenna patterned on the bonding side conductive foil layer 12 of the insulating substrate layer 10. Conductive material 25 fills via hole 21 providing electrical connection through the insulating substrate layer 10 to the contact side conductive foil layer 15. This connection is shown with reference to Pin #6 ISO contact pad VPP / NC / Not Connected 76, which is one of the ISO contact pads 70. The chip 31 is mounted at the antenna side 2 and connected to the RF antenna and the contact pads. The first antenna bonding wire 40 connects a first predetermined contact pad of the chip 31 with an antenna contact pad surface area above the bonding side conductive foil layer 12. The view also includes a ground indication GND and a coordinate system, showing the orientation of the x, y, and z-axes. Fig. 3 also shows the paths for the first antenna bonding wire 40 and the second antenna bonding wire 41, highlighting their connection points to the chip 31 and conductive traces 60. Fig. 4 shows external connecting terminals of a further chipcard module according to the disclosure, illustrating the layout of the ISO contact pads 70 in a standard configuration on a contact side 4 of a chipcard module substrate 1, which is part of the overall dual-contact chipcard module design. The ISO contact set 81 comprises several distinct pads labeled for their respective purposes. Pin #1 72 labeled as "VCC" indicates the power supply voltage contact. Pin #2 72 labeled as "RST" is for reset. Pin #3 73 labeled as "CLK" is the clock input. Pin #4 74 and Pin #8 78 are labeled as "AS", indicating application-specific use. Pin #5 75 labeled as "GND" is the ground contact. Pin #6 76 labeled as "VPP" is typically for programming voltage and is not connected to anything in some applications so that it can be used as a bridge 57 in the modules of the disclosure. Alternatively, Pin #4 74 and Pin #8 78 can be used as a bridge 57 in the modules of the disclosure. Pin #7 is labeled as "I / O" is the input / output contact. A large center pad 79 is not connected to anything and serves as a mechanical re-inforcement element of the module. The layout is enclosed within the boundaries of the module substrate 1, and spacing between the contact pads is consistent with ISO standards for chipcard modules. The figure is annotated with "Top View" and includes a coordinate system indicating the orientation with axes labeled x, y, and z. Fig. 5 shows external connecting terminals of a further chipcard module according to the disclosure. The ISO contact set 81 of Fig. 5 is in large parts identical to the the ISO contact set 81 of Fig. 5, except that the GND contact pad 75 is integral with the center pad 79. Pin #6 labeled as "VPP" is typically for programming voltage and is not connected to anything in some applications so that it can be used as a bridge 57 in the modules of the disclosure. Alternatively, Pin #4 74 and Pin #8 78 can be used as a bridge 57 in the modules of the disclosure. The orientation of the diagram is indicated by the "Top View" label and the axes designation, meaning that one is looking down at the contact side 4 of the card module substrate 1. Fig. 6 shows external connecting terminals of a further chipcard module according to the disclosure, The figure illustrates a series of eight ISO contact pads 70 arranged in two columns on a module substrate 1. Each pad is assigned a label indicating its function "C1 VCC" for power supply, "C2 RST" for reset, "C3 CLK" for clock, "C4 RFU" reserved for future use, "GND C5" for ground, "VPP C6" for programming voltage or not connected, "I / O C7" for input / output communication, and "RFU C8" also reserved for future use. The layout is symmetric with a central area 79 potentially for the chip 31 or antenna placement. The contact pads are part of the external interface of a smart card, allowing it to connect to a card reader. The GND contact pad 75 is integral with the center pad 79. Pin #6 labeled as "VPP" is typically for programming voltage and is not connected to anything in some applications so that it can be used as a bridge 57 in the modules of the disclosure. Alternatively, Pin #4 74 and Pin #8 78 can be used as a bridge 57 in the modules of the disclosure. The figure also includes a coordinate system indicating the x, y, and z-axes, which suggests that the view is from above the contact side 4 of the chipcard module, looking directly down onto the contact pads. Fig. 7 shows external connecting terminals of four further chipcard modules according to the disclosure that are arranged as a transport tape. The components include the module substrates 1 which underlie all the visible elements but are not directly labeled in this view. One can see the ISO contact pads 70 that are labeled with numbers corresponding to their function as per ISO standards, such as 71 for the Pin #1 VCC contact pad and 72 for the Pin #2 Reset contact pad, and so on. The image marks the individual ISO contact pads 70 with their respective reference numerals, including 71, 72, 73, 74 and 78, 75, 76, and 77. The conductive material 25 that would fill the via hole 21 is not visible in this view but is there for linking the conductive traces 60 with the contact pads. The directional axes are shown to provide orientation to the viewer. The bonding side 3, chip adhesive 30, and chip 31, as well as the bonding wires and encapsulation material 80, are not seen in this top view but are part of the encapsulated modules. Pin #6 76 is typically for programming voltage and is not connected to anything in some applications so that it can be used as a bridge 57 in the modules of the disclosure. Fig. 8 shows the bottom view of the chipcard modules of Fig. 7. Each module includes a module substrate 1, though not labeled in this view, which forms the base for the various elements depicted. The conductive antenna traces 60 are shown as spiraling patterns around the periphery of each module and are part of the RFID transmission antenna coil. At the center of each trace arrangement is a chip 31 mounted at the antenna side 2 of the module substrate 1. The encapsulation material 80 is visible as a transparent or translucent dome-shaped covering over the chips, serving to protect the chips and associated components from environmental factors. The conductive material 25 is filled in the via holes to provide electrical connections between the conductive traces 60 and the contact side conductive foil layer 15 —not marked here but is part of the structure that would be on the opposite side of the substrate. These connections provide the functionality of the chip 31 and its ability to communicate with other devices. The first antenna end 50, which corresponds to one end of the conductive traces 60, and the second antenna end 51 can be seen at opposite ends of the conductive trace loops. These serve as the start and termination points of the antenna coil. Fig. 9 shows external connecting terminals of a further chipcard module according to the disclosure. The figure presents a top view of the ISO contact set 81 of a dual-contact chipcard module. The ISO contact set 81 comprises several ISO contact pads 70 labeled as follows Pin #1 ISO contact pad VCC 71, Pin #2 ISO contact pad Reset 72, Pin #3 ISO contact pad CLOCK 73, Pin #5 ISO contact pad GND / Ground 75, Pin #6 ISO contact pad VPP / NC / Not Connected 76, Pin #7 ISO contact pad I / O, In / out 77. The GND contact pad 75 is integral with the center pad 79. Pin #6 labeled as "VPP" is typically for programming voltage and is not connected to anything in some applications so that it can be used as a bridge 57 in the modules of the disclosure. These pads are situated in a standard layout for chipcards, where they are positioned to interface with external card readers. The axes are shown to indicate the orientation of the top view relative to the chipcard module. The figure provides a visual representation of the ISO contact pad 70 configuration, which ensures proper electrical contact between the chipcard and card readers or other interface devices. Fig. 10 shows external connecting terminals of 16 further chipcard modules according to the disclosure. Fig. 10 provides a top view of different configurations of conductive antenna traces 60 and the array of ISO contact pads 70 for the dualcontact chipcard module. Each of the depicted modules showcases a unique arrangement of these elements, illustrating the versatility in the design and how various chip 31 configurations can be accommodated without altering the fundamental structure. The contact pads are discernible within each illustration and are designated by the number 76, referring to "Pin #6 ISO contact pad VPP / NC / Not Connected 76" in the provided list of reference numerals. Each variant still maintains compatibility with ISO standards, as the contact positions are consistent with the requirements for contact-based chipcard communication. The different designs align with the scope of the disclosure by demonstrating possible variations in module structuring while preserving the electrical functionality required for dual-contact interoperability. Pin #6 labeled as "VPP" is typically for programming voltage and is not connected to anything in some applications so that it can be used as a bridge 57 in the modules of the disclosure. Reference Numbers 1 module substrate 2 antenna side 3 bonding side 4 contact side 5 LA first antenna chip pad 6 LB second antenna chip pad 10 insulating substrate layer 11 adhesive 12 bonding side Cu foil 12 bonding side conductive foil layer 12 side conductive foil layer 13 Ni layer 14 Au layer 15 contact side Cu layer 15 contact side conductive foil layer 15 side conductive foil layer 20 bonding holes 20 bonding hole 21 via hole 25 conductive paste 25 conductive material 30 chip adhesive 31 chip 40 first antenna bonding wire 41 second antenna bonding wire 42 first antenna chip pad 43 second antenna chip pad 50 first antenna end 51 second antenna contact pad 51 second antenna end 55 upper via end 56 lower via end 57 bridge 58 lower bridge bonding contact area 60 conductive traces 60 conductive antenna traces 60 traces 70 ISO contact pads 70 ISO contact pad 71 Pin #1 ISO contact pad VCC 72 Pin #2 ISO contact pad Reset 73 Pin #3 ISO contact pad CLOCK 74 Pin #4 ISO contact pad AS / Application Specific 75 Pin #5 ISO contact pad GND / Ground 76 Pin #6 ISO contact pad VPP / NC / Not Connected 77 Pin #7 ISO contact pad I / O, In / out 78 Pin #8 ISO contact pad AS / Application Specific 80 encapsulation material 80 providing encapsulation material 81 ISO contact set

Claims

1. Method of manufacturing a dual-contact chipcard module with an RFID transmission antenna coil comprising a number of conductive antenna traces (60) and with a number of ISO contact pads (70), comprising- providing a module substrate (1) with an antenna side (2) and a contact side (4),- providing a bonding side conductive foil layer (12) to a bonding side (3) of an insulating substrate layer (10),- providing a pre-determined pattern of conductive traces (60) and contact pads in the bonding side conductive foil layer (12),- providing a via hole (21) in the bonding side conductive foil layer (12) and the insulating substrate layer (10),- providing a contact side conductive foil layer (15) to a contact side (4) of the insulating substrate layer (10),- etching a pre-determined pattern of conductive traces (60) and contact pads into the contact side conductive foil layer (15),- providing conductive material (25) in the via hole (21), electrically connecting a section of the conductive traces (60) and a section of the contact side conductive foil layer (15),further comprising- mounting a chip (31) above [on] the antenna side (2) of the module substrate (1),- connecting a first pre-determined contact pad of the chip (31) with an antenna contact pad surface area above the bonding side conductive foil layer (12) by providing a first antenna bonding wire (40),- contacting a second pre-determined contact pad of the chip (31) above a bonding side (3) surface of the ISO contact pads (70), by providing a bond wire through the bonding hole (20), andwherein the method provides the dual-contact chipcard module such that the conductive material (25) in the via hole (21) electrically connects a section of the conductive traces (60) and one of the ISO standard contact pads C6, C4 or C8, and wherein the first pre-determined contact pad of the chip (31) is connected above a bonding side (3) surface of the same ISO standard contact pads C6, 04 or 08.

2. Method of manufacturing a dual-contact chipcard module according to claim 1, wherein the conductive material (25) comprises conductive glue and wherein there is a step of curing the conductive glue after filling the via hole (21).

3. Method of manufacturing a dual-contact chipcard module according to claim 1 or claim 2, with an encapsulating step of providing encapsulation material (80) over the chip (31) and the bond wires at the antenna side (2) of the module substrate (1).

4. Dual-contact chipcard module with an RFID transmission antenna coil that comprises a number of conductive antenna traces (60) and with an ISO contact set (81) with a number of ISO contact pads (70),with- a module substrate (1) with an antenna side (2) and a contact side (4),- a bonding side conductive foil layer (12) at a bonding side (3) of an insulating substrate layer (10),- conductive traces (60) and contact pads provided in the bonding side conductive foil layer (12),- a via hole (21) in the bonding side conductive foil layer (12) and in the insulating substrate layer (10),- a contact side conductive foil layer (15) at a contact side (4) of the insulating substrate layer (10),- conductive traces (60) and contact pads in the contact side conductive foil layer (15),- conductive material (25) in the via hole (21), electrically connecting a section of the conductive traces (60) and a section of the contact side conductive foil layer (15),further comprising- a chip (31) above the antenna side (2) of the module substrate (1),- a first pre-determined contact pad of the chip (31) [a first antenna chip pad(42)] being connected with an antenna contact pad surface area above the bonding 5 side conductive foil layer (12) by a first antenna bonding wire (40),- a second pre-determined contact pad of the chip (31) above a bonding side (3)surface of the ISO contact pads (70), with a bond wire in the bonding hole (20), andwherein the conductive material (25) in the via hole (21) electrically connects asection of the conductive traces (60) and one of the ISO standard contact pads C6, 10 04 or 08, and wherein the second pre-determined contact pad of the chip (31) isconnected above a bonding side (3) surface of the same ISO standard contact pads 06, 04 or C8.24

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