Thermal connector for cooling electronic devices using a vapor chamber

Abstract

Cooling system 19 comprising: a thermal connector 1 cooperating with a heat transfer element 2 to extract heat from a heat generating device 3. The thermal connector 1 comprises: a main body 4 includ

Description

TECHNICAL FIELD The present invention relates to a thermal connector for cooperation with a heat transfer element to extract heat from a heat generating device and relates to a heat transfer element for cooperation with a thermal connector to extract heat from a heat generating device. Also, the present invention relates to a cooling apparatus comprising said thermal connector and said heat transfer element. Furthermore, the present invention relates to a cooling system comprising the thermal connector and the heat transfer element, or said cooling apparatus, and at least a heat generating device. BACKGROUND In the last decades, the use of computing devices is constantly increased, these being basically employed in any fields of technology, such as urban farms and video analytics applications. The performance of these devices and the amount of data to be processed increases despite a continuous request in reducing the dimensions. The computing devices can be for example data center, edge Al, high performance computing, motor drive, edge Al computing comprising micro controller units (MCUs), graphic process units (GPUs) and Neural Process Units (NPUs). One issue related to these devices is the production of heat. As a matter of fact, MCUs, GPUs, and NPUs generate a large amount of heat while computing a large amount of data. Existing heat management strategies comprise the dissipation of heat over a larger surface area. This heat dissipation usually occurs within the device enclosure and using heat pipes or vapor chambers to accelerate heat conduction so that heat is distributed faster to the rest of the device. In addition, heat sinks and fans can be employed to remove heat from the heat pipe and vapor chamber. Other forms of cooling systems employ liquid coolant means, for example flowing through channel structures in cold plates. However, liquid cooling can be challenging due to the risk of liquid spillage. To prevent this problem, dedicated liquid hoses and liquid connectors designed for carrying high pressure liquid can be used. This sensibly increases the system and maintenance costs. Examples of the present disclosure seek to address or at least alleviate the above problems. SUMMARY In a first aspect, there is provided a thermal connector for cooperation with a heat transfer element to extract heat from a heat generating device, the thermal connector comprising: a main body including a support portion, and at least a heat dissipating module in contact with the support portion for transferring heat outside the main body, wherein the main body comprises a recess region extending along the heat dissipating module for receiving the heat transfer element. In a second aspect, there is provided a heat transfer element for cooperation with a thermal connector to extract heat from a heat generating device, the heat transfer element comprising: a vapor chamber extending longitudinally from a first portion to a second portion and containing a coolant circulating between the first portion and the second portion for heat transfer, wherein the first portion is configured to be attached to the heat generating device and the second portion is configured to be inserted into the thermal connector. In a third aspect, there is provided a cooling apparatus for removing heat from a heat generating device comprising: a thermal connector according to the first aspect; and a heat transfer element according to the second aspect, wherein the second portion of the heat transfer element is insertable into the recess region of the thermal connector to determine a contact between the heat dissipating module of the thermal connector and the vapor chamber of the heat transfer element to transfer heat from the vapor chamber of the heat transfer element to the heat dissipating module of the thermal connector. In a fourth aspect, there is provided a cooling system comprising: a thermal connector according to the first aspect and a heat transfer element according to the second aspect, or a cooling apparatus according to the third aspect; and at least a heat generating device attached to the heat transfer element, the heat generating device being attached to the vapor chamber of the heat transfer element at the first portion, wherein the vapor chamber comes into contact with the heat dissipating module of the thermal connector, once the second portion of the vapor chamber is inserted into the recess region of the thermal connector. Other aspects and features are defined in the appended claims. Examples of the disclosure may provide a thermal connector and a heat dissipating device which cooperate with each other for cooling high-computing electronics and transferring heat away from said electronics, that is efficient and cost effective, thereby reducing the risk of liquid spillage and the number of specialized liquid connectors. BRIEF DESCRIPTION OF DRAWINGS Examples of the disclosure will now be described by way of example only with reference to the accompanying drawings, in which like references refer to like parts, and in which: Figure 1A is a schematic representation of the thermal connector according to an example; Figure 1B is a schematic representation of the thermal connector including a clod plate according to an example; Figure 1C is a schematic representation of the thermal connector including a heat sink according to an example; Figure 1D is a schematic representation of the thermal connector including a heat pipe according to an example; Figure 2 is a schematic representation of the thermal connector with multiple heat dissipating modules according to another example; Figure 3A is a schematic representation (lateral view) of the heat transfer element according to an example; Figure 3B is a schematic representation (top view) of the heat transfer element according to an example; Figure 4A is a schematic representation of the cooling apparatus in an uncoupled configuration according to an example; Figure 4B is a schematic representation of the cooling apparatus in a coupled configuration according to an example; Figure 5A is a schematic representation of the system in an uncoupled configuration according to an example; Figure 5B is a schematic representation of the system in a coupled configuration according to an example; and Figure 6 is a schematic representation of the thermal connector with multiple heat dissipating modules coupled with a plurality of heat transfer elements according to an example. DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS A thermal connector, a heat transfer element, a cooling apparatus and a cooling system for extracting heat from a heat generating device 3 are disclosed. In the following description, a number of specific details are presented in order to provide a thorough understanding of the examples of the disclosure. It will be apparent however to a person skilled in the art that these specific details need not be employed in order to practice the examples of the disclosure. Conversely, specific details known to the person skilled in the art are omitted for the purposes of clarity in presenting the examples. Figure 1A schematically illustrates a thermal connector 1 used to extract heat from electronic devices like high power computing devices which generate large amount of heat during the computing processes. It is noted that the thermal connector 1 is part of a cooling apparatus 18 and / or cooling system 19 and is configured to cooperate with a heat transfer element 2 that is also part of said cooling apparatus 18 and / or cooling system 19. The thermal connector 1 comprises a main body 4 representing a frame structure or a case for housing the components of the thermal connector 1. The main body 4 includes a support portion 5 used to support a heat dissipating module 6 that is in contact with the support portion 5. For example, the heat dissipating module 6 is directly attached to the support portion 5. In one example, the heat dissipating module 6 is attached in a removable way to the support portion 5. In this way, it is possible to detach the heat dissipating module 6 from the main body 4 of the thermal connector 1, i.e. from the main body 4 of the thermal connector 1, in case of maintenance or replacement actions. As already mentioned, the thermal connector 1 is configured to cooperate with a separate component, i.e. a heat transfer element 2. For this purpose, the main body 4 of the thermal connector 1 is provided with a recess region 9 that serves for receiving at least a part of the heat transfer element 2. The recess region 9 extends along the heat dissipating module 6 so that heat can be transferred from the heat transfer element 2 to the heat dissipating module 6 and then outside the main body 4 of the thermal connector 1. The arrows depicted in figure 1A indicates heat received from the recess region 9 (through a heat transfer element 2 not shown in the figure) and directed outside the main body 4 through the heat dissipating module 4. The heat dissipating module 6 can comprise any element configured to extract heat coming from a heat generating device 3 through a heat transfer element 2. The transfer of heat can occur by contact between the heat dissipating module 6 and the heat transfer element 2 and the conduction outside the thermal connector 1 can occur using a coolant fluid (liquid, vapor, air, etc.). As shown in figure 1B, the heat dissipating module 6 can comprise a cold plate 61 having at least an internal channel connected to an inlet port 7 and to an outlet port 8 for the passage of a cooling liquid, the inlet port 7 being configured for the entrance and the outlet port 8 being configured for the exit of said cooling liquid. The cold plate 61 can comprise a structure made of a high thermal conductivity material, such as aluminum or copper. Heat is absorbed by the cold plate 61 from the heat transfer element 2 due to a surface contact between the plate 61 and the element 2. The heat conducted in the cold plate 61 is then transferred to the cooling liquid, e.g. water or specific coolant liquids, flowing through internal channels of the cold plate 61. Due to this heat absorption, the cooling fluid exiting the cold plate 61 at the outlet port 8 has a temperature higher than the cooling fluid entering the cold plate 61 at the inlet port 7, thereby carrying heat away from the cold plate 61 and therefore from the thermal connector 1. The heated cooling liquid is then cooled down by for example a heat exchanger before it is recirculated back into the cold plate 61. By using a cold plate 61, and in particular a liquid cold plate, it is possible to improve the heat extraction efficiency without the risk of liquid spillage at the heat generating device 3 (i.e. at the electronics on a printed circuit board). As a matter of fact, the thermal connector 1 with the cold plate 61 is located away from the heat generating device 3 so that any possible liquid leakage would not compromise the performance of the electronics. According to another example (figure 1C), the heat dissipating module 6 can comprise a forced convention heat sink 62 coupled to a fan apparatus 63. In this case, air is forced over the heat sink 62 by the fan apparatus 63 to carry away the heat. The fan apparatus 63 is located externally to the thermal connector 1. In this way, it is possible to extract heat in a cost effective way by completely eliminating any risk of liquid spillage. In a further example (figure 1D), the heat dissipating module 6 can comprise at least a heat pipe 64 comprising a coolant fluid. The heat pipe 64 can have a hollow tubelike structure made of thermally conductive material comprising the coolant fluid (e.g. water, alcohol or other refrigerant fluids). In this way, it is possible to efficiently transfer heat without the requirement of any external power source. Also, the flexibility in shape of the heat pipes 64 allows the application of this configuration in a variety of thermal connectors 1 with different form factors. Figure 2 illustrates a possible configuration of the thermal connector 1. According to this configuration, the thermal connector 1 comprises a plurality of heat dissipating modules 6 and a plurality of corresponding recess regions 9 arranged in parallel along the main body 4, wherein each recess region 9 is configured to receive a single heat transfer element 2. It is noted that the heat dissipating modules 6 can be all of the same type as illustrated in figures 1B-1D or a combination of different types. The figure shows an arrangement of six stacked heat dissipating modules 6 each attached to a corresponding support portion 5 of the main body 4 and each being coupled to a corresponding recess region 9. However, the thermal connector 1 can comprise any number of heat dissipating modules 6 higher than two. The recess regions 9 represent several stacked slots used to insert a corresponding heat transfer element 2. Based on the requirements and necessities, the heat transfer elements 2 can be inserted in all the available recess regions 9 or in only a limited number of them. The arrows in the figure show the direction of the heat extracted by each heat dissipating module 6 outside the thermal connector 1. In an example, the thermal connector 1 can be coupled to a cooling distribution unit 10 to distribute a cooled fluid (liquid or air) to the heat dissipating modules 6 ensuring an adequate cooling of these modules. The heat transfer element 2 is schematically shown in the figures 3A and 3B. This element 2 comprises a vapor chamber 11 as a hollow structure having an elongated shape with a first portion 12 and a second portion 13. To transfer heat along the vapor chamber 11, for example between the first portion 12 and the second portion 13, a coolant 14 is present inside the chamber 11. The coolant is a liquid substance (e.g. water, special fluid, or any other substance with low boiling point). By locating the heat transfer element 2 close to a heat source (e.g. a heat generating device 3), the coolant is turned into vapor and travels into cooler areas of the chamber where it condenses back into liquid. The liquid then returns to the heat source and the cycle starts again. The heat generating device 3 is located at the first portion 12 of the vapor chamber 11 so that vapor is generated at the first portion 12 and is directed to the second portion 13. Accordingly, the first portion 12 is configured to be attached to and detached from, a heat generating device 3, such as a semiconductor chipset. For example, the second portion 12 can comprise attachment means, such as slots and / or pins, to provide a secure attachment with one or more heat generating devices 3. Since the second portion 13 is configured to be inserted into the thermal connector 1 and to get into contact with a heat dissipating module 6 as described above, the vapor condenses back into liquid at the second portion 13 and returns as liquid coolant in the first portion 12. As shown in the figure, two heat generating devices 3 (such as high power chip elements) placed on a substrate 21 (e.g. a printed circuit board) can be attached to the vapor chamber 11 at the first portion 12. The vapor chamber 11 can be attached, in a removable way, to the heat generating device(s) 3 for example by means of fastening means (e.g. screws or pins) and a thermal paste. Although the figure illustrates the attachment of the vapor chamber 11 to two distinct heat generating devices 3, the chamber 11 can be attached to a single device or to a number of devices higher than two. Figure 3B is a top view of the heat transfer element 2 of figure 3A. It is noted that the vapor chamber 11 has an almost rectangular shape and defines two regions. A first region corresponding to the first portion 12 where heat is collected and a second region corresponding to the second portion 13 where heat is transferred. The second portion 13 represents a protrusion of the vapor chamber 11 extending away from the heat generating devices 3 so that a temperature gradient is present between the first portion 12 and the second portion 13 when at least a heat generating device 3 is attached to the first portion 12. In one example, the vapor chamber 11 comprises a coolant reservoir 15 located at the first portion 12. The coolant reservoir 15 defines a space where the liquid coolant 14 is collected and located. In particular, the coolant reservoir 15 can be an elevated section of the vapor chamber 11. Specifically, the coolant reservoir 15 can represent a separate region of the vapor chamber 11. In this way, the thermal capacity of the vapor chamber is increased. According to an example, the coolant reservoir 15 is separated from the vapor chamber 11 by means of a permeable partition 17. The presence of such a partition 17 serves to separate the region where the coolant 14 is in the liquid phase from the region where the coolant 14 is in the vapor phase. Since the coolant reservoir 15 is located at the bottom of the vapor chamber 11, the liquid coolant 14 will return to the reservoir 15 once condensed by gravity. To further facilitate the return of condensed coolant drops into the coolant reservoir 15, the bottom surface of the second portion 13 of the vapor chamber 11 can be provided with a slight slope towards the coolant reservoir 15 (not shown in the figure). In one example, the heat transfer element 2 comprises reinforcing structures 16 located inside the vapor chamber 11, wherein said plurality of reinforcing structures 16 is arranged only in the second portion 13 of the vapor chamber 11. Differently from standard vapor chambers that comprise support structures homogeneously distributed inside the chamber to prevent imploding forces to damage the chamber structure, the reinforcing structures 16 are only limited in the space defined by the second portion 13 of the vapor chamber 1 land serve to contrast a normal (top-down) pressure exerted on outer surfaces of the vapor chamber 11 when the heat transfer element 2 is coupled to the thermal connector 1, i.e. when the second portion 13 of the vapor chamber 11 is inserted into the recess region 9 of the main body 4. In particular, each reinforcing structure 16 has a pillarlike structure extending from one internal surface to the opposite internal surface of the vapor chamber 11. The presence of the reinforcing structures 16 in the second portion 13 of the vapor chamber 11 increases the capability of transferring heat from the heat transfer element 2 to the thermal connector 1, i.e. to the heat dissipating module 6 of the thermal connector 1. As a matter of fact, by inserting the second portion 13 of the vapor chamber 11 into the recess region 9 of the thermal connector 1, a compression force is exerted by the internal walls of the recess region 9 (and by the bottom surface of the heat dissipating module 6) to the external walls of the second portion 13. This compression could cause a deformation of the second portion 13, thereby causing a reduced (not optimal) contact surface between the vapor chamber 11 and the heat dissipating module 6. The reinforcing structures 16 have a dimension that fits within lower an upper internal surfaces of the vapor chamber 11, i.e. of the second portion 13 of the vapor chamber 11. Also, the dimension of these structures 16 is such that to allow vapor and condensates to pass in-between the structures 16. Advantageously, the reinforcing structures 16 are made of a material having strong mechanical properties and at the same time providing a good heat conduction. For example, the reinforcing structures 16 can be made of copper, aluminum, titanium or a combination thereof. Figures 4A and 4B illustrate how the thermal connector 1 cooperates with the heat transfer element 2. It is noted that the vapor chamber 11 of the heat transfer element 2 is not attached to any heat generating device 3. In an uncoupled configuration (figure 4A), the vapor chamber 11 is separated from the thermal connector 1. In a coupled configuration (figure 4B), the second portion 13 of the vapor chamber 11 is inserted into the recess region 9 of the man body 4 thermal connector 1, thereby forming a cooling apparatus 18. From the figure it is clear that in the coupled configuration the heat dissipating module 6 of the thermal connector 1 comes into contact with the vapor chamber 11 of the heat transfer element 2. In this way, heat can be conducted from the vapor chamber 11 of heat transfer element 2 to the heat dissipating module 6 of the thermal connector 1 in the recess region 9 of the thermal connector 1. In addition, figure 4B shows how the reinforcing structures 16 contrast the top-down forces (represented with undulated arrows) exerted on the second portion 13 of the vapor chamber 11 in the recess region 9. Figures 5A and 5B illustrate the uncoupling and coupling configuration between the thermal connector 1 and the heat transfer element 2. In this case, the heat transfer element 2 is attached to two heat generating devices 3. In a coupled configuration (figure 5B), the second portion 13 of the vapor chamber 11 is inserted into the recess region 9 of the man body 4 of the thermal connector 1, thereby forming a cooling system 19. The heat generated by the two devices 3 is transferred to the vapor chamber 11 due to the fact that the first portion 12 of the vapor chamber 11, i.e. the coolant reservoir 15, is attached to both heat generating devices 3. As described above, the liquid coolant 14 present in the coolant reservoir 15 starts to evaporate and is conducted to the cooler regions of the vapor chamber 11, i.e. from the first portion 12 to the second portion 13. The heated coolant in the second portion 13 of the vapor chamber 11 transfers heat to the heat dissipating module 6 and condensates. The heat dissipating module 6 - that can be for example a cold plate 61 or a heat sink 62 - finally conducts heat outside the main body 4 of the thermal connector 1. The heat conduction is schematically represented in figure 5B by the arrows. In examples, the heat generating device 3 is at least one of: - data center server; - edge Al device; - industrial computer; - high performance computing device; - motor drive; - central processing unit; - graphics processing unit; and / or - a programmable logic controller. Figure 6 illustrates the combination of a plurality of heat transfer elements 2 with a thermal connector 1 comprising a plurality of heat dissipating modules 6 and recess regions 9 (as shown in figure 2). It is noted that the heat transfer elements 2 are each attached to the heat generating devices 9 so that the combination of the thermal connector 1 with the heat dissipating elements 2 forms a cooling system 19 as shown in figure 5B. It is however conceivable that the heat transfer elements 2 are not attached to the heat generating devices 9 so that the combination of the thermal connector 1 with the heat dissipating elements 2 forms a cooling apparatus 18 as shown in figure 4B. The second portion 13 of each heat transfer element 2 is insertable into a corresponding recess region 9 of the thermal connector 1. Basically, the thermal connector 1 acts as a multi-socket structure, wherein one or more heat transfer elements 2 are plugged into the recess regions 9. The thermal connector 1 of figure 6 comprises six recess regions 9, i.e. six slots, for accommodating six heat transfer elements 2. However, it is not necessary that all recess regions 9 are coupled with the heat transfer elements 2. Based on the requirements and necessities, a reduced number of heat transfer elements 2 can be coupled to the thermal connector 1. As shown in figure 6, four heat transfer elements 2 are coupled to the thermal connector 1, wherein three heat transfer elements 2 are completely inserted into the corresponding recess regions 9 and one heat transfer element 2 is going to be inserted to (or extracted from) the recess region 9. Accordingly, two recess regions 9 of the thermal connector 1 (e.g. the upper two slots) remain unused. The thermal connector 1 has therefore a modular function. Especially when more than one heat dissipating modules 6 are present, it is possible to increase or reduce the number of utilized heat dissipating modules 6, based on the situation. The cooling system 19 can comprise a plurality of heat generating devices 3 each attached to the first portion 12 of the vapor chamber 11. As shown in the figure, the heat transfer element 2 can be attached, e.g. fixed with fastening means, to a single heat generating device 3, to two, to three or to even four heat generating devices 3. The attached heat generating devices 3 to the vapor chamber 1 of a single heat transfer element 2 can be of any number. However, thermal efficiency considerations are necessary to avoid that a higher number of attached heat generating devices 3 would prevent a correct heat extraction through the heat transfer element 2. In one example, the thermal connector 1 (of the cooling apparatus 18, and / or of the cooling system 19) comprises a coupling module system 20 configured to connect one or more heat dissipating modules 6 of the thermal connector 1 to a single cooling unit 22. The coupling module system 20 acts as a thermal interface to collect the heat coming from the several heat dissipating modules 6 to a cooling unit 22, for example a chilled water supplier by a refrigeration system, a chilled water supplier by a cooling water tower, or a heat sink with forced air convection. The above described configurations are extremely useful in case of using a liquid cooling system, when the heat dissipating device 6 is for example a cold plate 61. As a matter of fact, liquid cooling is usually carried out by providing a coolant to heat generating devices 3 (for example server elements) through a cooling distribution unit (CDU). The CDU receives the coolant (e.g. water) that is pumped to the devices 3 (e.g. a servers rank). The coolant circulates through different paths close to the servers and is returned to the CDU. At the CDU, a heat exchanger is used to cool the liquid again. Usually, for each device to be cooled (e.g. each server), two fluid connectors are present for the inlet and the outlet of the coolant, thereby increasing the manufacturing costs and the risk of liquid spillage at the device region each time the device is assembled to, and disassembled from, the rack. With the present arrangement, on the other hand, no fluid connectors are necessary at the device region since the cooling occurs through the vapor chamber 11 of the heat transfer element 2. Furthermore, multiple devices (e.g. semiconductor chipset) can be simultaneously cooled by the same vapor chamber 11. Also, the thermal connector 1 is so configured that even in case of multiple heat dissipating modules 6 (e.g. multiple cold plates 61) only two fluid connectors are basically necessary for the attachment to, and detachment from, the CDU or to the external cooling system since the cold plates 61 can remain attached to the thermal connector 1 and then to the entire cooling apparatus 18 and cooling system 19. Accordingly, in case of cooling a plurality of heat generating devices 3, the number of fluid connectors can be drastically reduced. With this thermal connector 1 cooperating with the heat transfer element 2 to form a cooling apparatus 18 and / or a cooling system 19, it is possible to optimize heat extraction from a plurality of heat generating devices 3 by attaching more than one heat generating device 3 to the same vapor chamber 11 as well as by coupling several heat transfer elements 2 to the same thermal connector 1. Also, the use of a vapor chamber 11 to transfer heat away from the heat generating device 2 allows the removal of a high quantity of heat and at the same time avoid the risk of liquid spillage at the devices region. In addition, even if using a liquid cooling, the configuration of the thermal connector 1 allows a strong reduction of the number of employed fluid connectors, thereby providing a sensible minimization of manufacturing costs, a reduction in the structural complexity and a lower risk of liquid spillage. Although a variety of techniques and examples of such techniques have been described herein, these are provided by way of example only and many variations and modifications on such examples will be apparent to the skilled person and fall within the spirit and scope of the present invention, which is defined by the appended claims and their equivalents. Reference signs 1 Thermal connector 2 Heat transfer element 3 Heat generating device 4 Main body 5 Support portion 6 Heat dissipating module 7 Inlet port 8 Outlet port 9 Recess region 10 Cooling Distribution Unit 11 Vapor chamber 12 First portion 13 Second portion 14 Coolant 15 Coolant reservoir 16 Reinforcing structures 17 Permeable partition 18 Cooling apparatus 19 Cooling system 20 Coupling system 21 Print circuit board 22 Cooling unit 61 Cold plate 62 Heat sink 63 Fan 64 Heat pipe

Claims

1. Thermal connector (1) for cooperation with a heat transfer element (2) to extract heat from a heat generating device (3), the thermal connector (1) comprising: a main body (4) including a support portion (5) andat least a heat dissipating module (6) in contact with the support portion (5) for transferring heat outside the main body (4), wherein the main body (4) comprises a recess region (9) extending along the heat dissipating module (6) for receiving the heat transfer element (2).

2. Thermal connector (1) according to claim 1, wherein the heat dissipating module (6) comprises a cold plate (61) having at least an internal channel connected to an inlet port (7) and to an outlet port (8) for the passage of a cooling liquid, the inlet port (7) being configured for the entrance and the outlet port (8) being configured for the exit of said cooling liquid.

3. Thermal connector (1) according to claim 1, wherein the heat dissipating module (6) comprises a forced convention heat sink (62) coupled to a fan apparatus (63).

4. Thermal connector (1) according to claim 1, wherein the heat dissipating module (6) comprises at least a heat pipe (64) comprising a coolant fluid.

5. Thermal connector (1) according to any one of claims 1 to 4, wherein the heat dissipating module (6) is attached in a removable way to the support portion (5).

6. Thermal connector (1) according to any one of claims 1 to 5, comprising a plurality of heat dissipating modules (6) and a plurality of corresponding recess regions (9) arranged in parallel along the main body (4), wherein each recess region (9) is configured to receive a single heat transfer element (2).

7. Thermal connector (1) according to any one of claims 1 to 6, further comprising a coupling module system (20) configured to connect one or more heat dissipating modules (6) to a single cooling module (22).

8. Heat transfer element (2) for cooperation with a thermal connector (1) to extract heat from a heat generating device (3), the heat transfer element (2) comprising: a vapor chamber (11) extending longitudinally from a first portion (12) to a second portion (13) and containing a coolant (14) circulating between the first portion (12) and the second portion (13) for heat transfer, wherein the first portion (12) is configured to be attached to the heat generating device (3) and the second portion (13) is configured to be inserted into the thermal connector (1).

9. Heat transfer element (2) according to claim 8, further comprising a coolant reservoir (15) located at the first portion (12).

10. Heat transfer element (2) according to claim 9, wherein the coolant reservoir (15) is an elevated section of the vapor chamber (11).

11. Heat transfer element (2) according to any one of claims 9 to 10, wherein the coolant reservoir (15) is separated from the vapor chamber (11) by means of a permeable partition (17).

12. Heat transfer element (2) according to any one of claims 8 to 11, further comprising reinforcing structures (16) located inside the vapor chamber (11), wherein said plurality of reinforcing structures (16) is arranged only in the second portion (13) of the vapor chamber (11).

13. Heat transfer element (2) according to claim 12, wherein each reinforcing structure (16) has a pillar-like structure extending from one internal surface to the opposite internal surface of the vapor chamber (11).

14. Heat transfer element (2) according to any one of claims 8 to 13, wherein the first portion (12) comprises attachment means to provide a secure attachment with one or more heat generating devices (3).

15. Cooling apparatus (18) for removing heat from a heat generating device (3) comprising:a thermal connector (1) according to any one of claims 1 to 7; anda heat transfer element (2) according to any one of claim 8 to 14, wherein the second portion (13) of the heat transfer element (2) is insertable into the recess region (9) of the thermal connector (1) to determine a contact between the heat dissipating module (6) of the thermal connector (1) and the vapor chamber (11) of the heat transfer element (2) to transfer heat from the vapor chamber (11) of the heat transfer element (2) to the heat dissipating module (6) of the thermal connector (1).

16. Cooling system (19) comprising:a thermal connector (1) according to any one of claims 1 to 7 and a heat transfer element (2) according to any one of claim 8 to 14, or a cooling apparatus (18) according to claim 14; andat least a heat generating device (3) attached to the heat transfer element (2), the heat generating device (3) being attached to the vapor chamber (11) of the heat transfer element (2) at the first portion (12),wherein the vapor chamber (11) comes into contact with the heat dissipating module (6) of the thermal connector (1), once the second portion (13) of the vapor chamber (11) is inserted into the recess region (9) of the thermal connector (1).

17. Cooling system (19) according to claim 16, comprising a plurality of heat generating devices (3) each attached to the first portion (12) of the vapor chamber (11).

Images