Reflow soldering oven

Abstract

A reflow soldering oven has a vacuum chamber 402, with first conveyor 410 outside the vacuum chamber 402, and second conveyor 412 inside the vacuum chamber 402. The vacuum chamber 402 has a door between first and second conveyors 410, 412. The first and second conveyors 410, 412 may become misaligned due to heat. A conveyor alignment mechanism 434, linked to a door opening mechanism, may align the first and second conveyors 410, 412 when the door opens. The conveyor alignment mechanism 434 may align first and second conveyors 410, 412 by coupling them together; and release the conveyors 410, 412 when the door is shut. Further conveyors 414, 416, 418, 420 and conveyor alignment mechanisms 436, 438, 440 may be present, e.g., on exit doors. The reflow soldering oven may be for soldering electronic circuit boards. Figure 4A